Data Sheet April 2008 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Features n n n n Applications Flex load - Power trading between V01 and V02 Wide output voltage adjustment range - V02 adjustment range +5%/-55% High efficiency - 89% typical for AF Low Output Voltage - supports migration to future IC supply voltages n Cost efficient open frame design n Surface mount or through hole n Low Profile - 8.5mm maximum n Two tightly regulated outputs n Remote On/Off n Output overcurrent protection n Distributed power architectures n Output overvoltage protection n Wireless Networks n Overtemperature protection n Access and Optical Network Equipment n n Enterprise Networks n Latest generation IC's (DSP, FPGA, ASIC) and Microprocessor powered applications. n n Options n Positive Remote On/Off logic n Basic Insulation (-B) n SeqFET - external sequencing FET drive supply (-F) n n Meets the voltage isolation requirements for ETSI 300-132-2 and complies with, and is approved per EN60950 Basic Insulation (-B option) Wide operating temperature range UL* 60950 Recognised, CSA C22.2 No. 60950-00 Certified, and E N60950 (VDE 0805):2001-12 Licensed CE Mark meets 73/23/EEC and 93/68/EEC directives Available in 4 Output voltage variants: AF FG FY GY VO1 5.0V 3.3V 3.3V 2.5V VO2 3.3V 2.5V 1.8V 1.8V Description The JHW050 Dual Series comprises a family of low profile, open frame modules with an industry standard, half-brick footprint. The modules have a maximum power rating of 50W, with a typical efficiency up to 89%, and cover the 36Vdc to 75Vdc voltage range. The circuit architecture provides for power to be traded between the two independently regulated outputs, whilst still maintaining a high efficiency. * UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. This product is intended for integration into end-user equipment. All the required procedures for CE marking of end-user equipment should be followed. (The CE mark is placed on selected products.) JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Data Sheet April 2008 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Input Voltage Continuous Transient (100ms) Operating Ambient Temperature (see Thermal Considerations section) Storage Temperature I/O Isolation Voltage Symbol Min Max Unit VI VI, trans TA -0.5 -0.5 -40 80 100 85 Vdc Vdc C Tstg -- -55 -- 125 1500 C Vdc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Operating Input Voltage Maximum Input Current (VI = 0V to 75V, IO = IO,max) Inrush Transient Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 12H source impedance; see Figure 12) Input Ripple Rejection (100--120Hz) EMC, EN55022 Symbol Min Typ Max Unit VI,min VI,nom VI,max II,max 36 54 75 Vdc -- -- 2.0 Adc -- -- -- -- -- -- 1.0 20 A 2s mApk-pk -- 60 -- -- See EMC Considerations section dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a normal-blow fuse with a maximum rating of 5A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information. 2 Lineage Power Data Sheet April 2008 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Electrical Specifications (continued) Parameter Output Symbol Min Typ Max Unit Output Voltage Set-point (VI = VI,nom, IO = IO,max, Tref = 25 C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range Independent for each output. Selected by external resistor All All All All VO1,set VO2,set VO1 VO2 -1.6 -1.6 -4.0 -4.0 -- -- -- -- +1.6 +1.6 +4.0 +4.0 %VO1,nom %VO2,nom %VO1,nom %VO2,nom All AF FG FY GY VO1 VO2 VO2 VO2 VO2 -5.0 1.50 1.50 1.00 1.00 -- 3.30 2.50 1.80 1.80 +5.0 3.47 2.63 1.89 1.89 %VO1,nom Vdc Vdc Vdc Vdc All All All -- -- -- -- -- -- 0.05 0.05 0.30 0.20 0.20 1.00 % % % VO3.3V VO<3.3V VO3.3V VO<3.3V -- -- -- -- -- -- -- -- -- -- -- -- 35 25 100 75 mVrms mVrms mVpk-pk mVpk-pk All All AF CO -- IO1 IO2 IO1 IO2 0 10 0.0 0.0 0.0 0.0 -- -- -- -- -- -- 470# -- 8.0 8.0 12.0 12.0 F m Adc Adc Adc Adc Output Regulation Line (VI = VI,min to VI,max) Load (IO = IO,min to IO,max) Temperature (Tref = TA,min to TA,max) Output Ripple and Noise on nominal output (VI = VI,nom and IO = IO,min to IO,max) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Capacitance (Electrolytic, Tantalum and Ceramic) E.S.R. Output Current NOTE: The maximum combined output current must not exceed 12A for the AF and 16A for FG, FY, GY Output Current Limit Inception (VO90% VO,nom, with 4A on the other output) Average Output Short-Circuit Current (VO250mV) Efficiency VI = VI,nom, TA = 25 C IO1 = IO2 = 6A for AF IO1 = IO2 = 8A for FG, FY and GY VO1 and VO2 set to nominal Switching Frequency # FG,FY, GY AF FG,FY, GY IO, cli -- 11 14 Adc IO, cli -- 15 18 Adc All IO, s/c -- 15 -- % IO,max AF FG FY GY All fsw -- -- -- -- -- 89.0 88.0 87.0 84.0 200 -- -- -- -- -- % % % % kHz The value of additional external output capacitance is not limited to this value. However, it is recommended, in order to avoid possible issues, consult your Lineage Power technical representative if higher values wish to be used. Lineage Power 3 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Data Sheet April 2008 Electrical Specifications (continued) Parameter Output Symbol Min Typ Max Unit Dynamic Response VO1 (IO/t = 1A/s, VI = 54V, IO2 = 2A, Tref = 25 C) IO1 = 4A - 6A - 4A or 4A - 2A - 4A for AF AF Vpk ts Vpk ts -- -- -- -- 120 100 180 100 -- -- -- -- mV s mV s Vpk ts Vpk ts -- -- -- -- 120 100 180 100 -- -- -- -- mV s mV s IO1 = 6A - 9A - 6A or 6A - 3A - 6A for FG,FY and GY Dynamic Response VO2 (IO/t = 1A/s, VI = 54V, IO1 = 2A, Tref = 25 C) IO2 = 4A - 6A - 4A or 4A - 2A - 4A for AF IO2 = 6A - 9A - 6A or 6A - 3A - 6A for FG,FY and GY FG, FY, GY AF FG, FY, GY Isolation Specifications Parameter Isolation Capacitance Isolation Resistance Symbol Min Typ Max Unit Ciso Riso -- 10 330 -- -- -- pF M General Specifications Parameter Calculated MTBF (IO = 80% of IO,max, TA = 20 C) Weight 4 Min Typ Max Unit -- 3,000,000 38 (1.34) -- Hours g (oz.) Lineage Power Data Sheet April 2008 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Remote On/Off interface Logic Low At Ion/off = 1.0mA At Von/off = 0.0V Logic High At Ion/off = 0.0A At Von/off = 15V Turn-on Time From application of Input Supply VI = 54V From application of Remote On/Off Switch Rise Time (IO1 = IO2 = 8A for FG, FY & GY, IO1 = IO2 = 6A for AF) (VO1 and VO2>90% of steady state; see Figure 1) Output Overvoltage Protection (See Feature Description) Overtemperature Protection SeqFET Output Voltage (Open Circuit) Output Impedance Lineage Power Output Symbol Min Typ Max Unit All All Von/off Ion/off 0.0 -- -- -- 0.8 1.0 V mA All All Von/off Ion/off -- -- -- -- 15 50 V A All All All -- -- -- -- -- -- 140 30 25 -- -- -- ms ms ms AF FG & FY GY VO1 VO1 VO1 Tref -- -- -- -- 6.0 4.2 3.5 120 6.5 4.6 3.8 -- V V V C AF FG & FY GY All -- -- -- -- 10.0 10.0 8.0 -- 11.4 11.4 9.4 1.0 12.8 12.8 10.7 -- V V V k 5 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Data Sheet April 2008 Characteristic Curves - AF OUTPUT VOLTAGE, VO (V) (1 V/div) The following figures provide typical characteristics for the JHW050AF. The figures are identical for either positive or negative Remote On/Off logic. OUTPUT VOLTAGE, VO (V) (200 mV/div) REMOTE ON/OFF VON/OFF (V) OUTPUT VOLTAGE, VO (V) (200 mV/div) OUTPUT CURRENT, IO (A) (5 A/div) TIME, t (5 ms/div) TIME, t (50 s/div) 1-0853 Figure 1. Typical Start-Up Using Remote On/Off. 1-0856 Figure 4. Typical VO2 Transient Response at 54 VIN, Nominal Output Voltages, IO2 = 6A to 4A to 6A, and IO1 = 4A 90 VO1 = 5 V EFFICIENCY, (%) OUTPUT VOLTAGE, VO (V) (20 mV/div) 88 VO2 = 3.3 V 86 84 VI = 36 V VI = 54 V VI = 75 V 82 80 78 76 2 4 TIME, t (2 s/div) 6 8 OUTPUT CURRENT, IO (A) 10 12 1-0854 Figure 2. Typical Output Ripple and Noise. 1-0857 Figure 5. Converter Efficiency vs. Total Output Current IO1 = IO2 90 OUTPUT VOLTAGE, VO (V) (200 mV/div) EFFICIENCY (%) 89.5 OUTPUT VOLTAGE, VO (V) (200 mV/div) 89 88.5 88 87.5 OUTPUT CURRENT, IO (A) (5 A/div) 87 TIME, t (50 s/div) -40 -30 -20 -10 0 10 20 30 40 50 AMBIENT TEMPERATURE (C) 60 70 80 1-0855 Figure 3. Typical VO1 Transient Response at 54VIN, Nominal Output Voltages, IO1 = 6A to 4A to 6A, and IO2 = 4A. 6 90 1-0858 Figure 6. Converter Efficiency vs. Ambient Temperature 54 VIN, IO1 = IO2 = 6A Lineage Power Data Sheet April 2008 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Characteristic Curves - FG & FY OUTPUT VOLTAGE, VO (V) (1 V/div) The following figures provide typical characteristics for the JHW050FG & FY. The figures are identical for either positive or negative Remote On/Off logic. OUTPUT VOLTAGE, VO (V) (200 mV/div) REMOTE ON/OFF VON/OFF (V) OUTPUT VOLTAGE, VO (V) (200 mV/div) OUTPUT CURRENT, IO (A) (5 A/div) TIME, t (5 ms/div) TIME, t (50 s/div) 1-0859 Figure 7. Typical Start-up Using Remote On/Off JHW050FG 1-0862 Figure 10.Typical VO2 Transient Response at 54VIN, Nominal Output Voltages, IO2 = 6A to 3A, to 6A and IO1 = 3A JHW050FG. 90 88 EFFICIENCY, (%) OUTPUT VOLTAGE, VO (V) (20 mV/div) VO1 = 3.3 V VO2 = 2.5 V 86 84 VI = 36 V VI = 54 V VI = 75 V 82 80 78 76 TIME, t (2 s/div) 2 4 6 8 10 12 OUTPUT CURRENT, IO (A) 14 16 1-0860 Figure 8. Typical Output Ripple and Noise JHW050FG 1-0863 Figure 11.Converter Efficiency vs. Total Output Current IO1 = IO2 JHW050FG OUTPUT VOLTAGE, VO (V) (200 mV/div) OUTPUT VOLTAGE, VO (V) (200 mV/div) OUTPUT CURRENT, IO (A) (5 A/div) TIME, t (50 s/div) 1-0861 Figure 9. Typical VO1 Transient Response at 54VIN, Nominal Output Voltages, IO1 = 6A to 3A, to 6 A and IO2 = 3A JHW050FG. Lineage Power 7 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Test Configurations Data Sheet April 2008 Design Considerations Input Source Impedance CURRENT PROBE TO OSCILLOSCOPE LTEST VI(+) BATTERY 12H CS 220F E.S.R.<0.1 @ 20C 100kHz 33F Safety Considerations VI(-) Note: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12 H. Capacitor CS offsets possible battery impedance. measure current as shown above. Figure 12.Input Reflected Ripple Current Test Setup COPPER STRIPS VO1(+) RLOAD1 SCOPE VO1(-) 1F 10F VO2(+) 1F 10F The power module should be connected to a low acimpedance source. A highly inductive sourceimpedance can affect the stability of the power module. For the test configuration in Figure 12, a 33F electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL60950, CSA C22.2 No. 60950-00, and EN 60950 (VDE 0805): 2001-12. If the input source in non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75 Vdc), for the modules's output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: n RLOAD2 SCOPE n VO2(-) Note: Use a 1F ceramic capacitor and a 10F aluminium or tantalum capacitor. The scope measurement should be made using a BNC socket. Position the load 50mm to 75mm (2" to 3") from the moudle. Figure 13.Output Ripple and Noise Test Setup CONTACT AND DISTRIBUTION LOSSES CONTACT AND DISTRIBUTION LOSSES VI(+) VO1(+) RLOAD1 VO1 VO2(+) VO2 RLOAD2 VO2(-) All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 14.Output Voltage and Efficiency Test Setup Efficiency 8 The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system, as reauired by the safety agencies, on the combination of supply source and subject module to verify that under a single fault, hazardous voltages do not appear at the module's output. Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. VI Note: n One VI pin and one VO pin are to be grounded, or both the input and output pins are to be kept floating. Note: VO1(-) VI(-) n the input source is to be provided with reinforced insulation from any hazardous voltages, including the ac mains. V O1 I O1 + V O2 I O2 = ------------------------------------------VI II For input voltages exceeding -60 Vdc but less than or equal to -75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. (-B option only) The input to these units is to be provided with a maximum 5A normal-blow fuse in the ungrounded lead. Lineage Power Data Sheet April 2008 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W If not using the remote on/off feature: Feature Descriptions For negative logic, short the ON/OFF pin to VI(-). Flexible Power Trading IO1 (A) The full rated output current can be drawn from either output within the limits shown in Figure 15. 16 14 12 10 8 6 4 2 0 0 For positive logic, leave the ON/OFF pin open. Output Overvoltage Protection The main output voltage is limited by an internal clamp. This provides protection from excessive overvoltage. If an accurate overvoltage limit is required this should be implemented externally via the remote On/Off function. AF FG, FY, GY Figure 17 shows a basic circuit for a 5V output unit with positive remote On/Off logic. In an overvoltage condition the unit will shut down and then restart. 2 4 6 8 10 12 14 16 IO2 (A) VI(+) VO(+) 1-0864 15k Figure 15.Current Sharing Between Outputs Overcurrent Protection 100R ON/OFF To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The average output current during hiccup is 15% IO,max. Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic turns the module off during a logic high and on during a logic low. Negative logic, device code suffix "1", is the factory-preferred configuration. VI(+) TL431 10k VI(-) VO(-) Figure 17.Overvoltage Circuit Overtemperature Protection To provide protection in a fault condition, the unit is equipped with a thermal shutdown circuit. the unit will shutdown if the overtemperature threshold is exceeded, it will then wait for the unit to cool before attempting to restart. The unit will typically enter thermal shutdown when the temperatures measured at the thermal reference points (see Figures 20 and 21) reach 120 C. SeqFET Drive Supply - Optional (-F) VO1(+) Ion/off ON/OFF VO1(-) VO2(+) Von/off VO2(-) VI(-) The SeqFET function provides a DC voltage above the main output suitable for driving an external FET in series with VO1 and/or VO2. This allows for flexibility in sequencing turn-on and turn-off of the module outputs. FET Figure 16.Remote On/Off Implementation VO1(+) To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VI(-) terminal (see Figure 16). Logic low is 0V Von/off 0.8V. The maximum Ion/off during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current. During a logic high, the maximum Von/off generated by the module is 15V, and the maximum allowable leakage current at Von/off = 15V is 50A. Lineage Power SeqFET ON/OFF VO1(-) Figure 18.SeqFET Application Note: SeqFET pin 8 is an optional pin. Standard modules will not have this pin fitted. 9 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Data Sheet April 2008 Feature Descriptions (continued) VO2 Set-Point Adjustment (Trim) Output Voltage Set-Point Adjustment (Trim) Due to internal component values within each JHW050 variant, the VO2 trim laws are different for each type. Care should be taken to ensure that the correct law as shown below is being used. Trimming allows the output voltage set point to be increased or decreased, this accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the COM pin (see Figure 19). To maintain set point accuracy, the trim resistor tolerance should be 0.1%. VI(+) VO(+) Rtrim-up ON/OFF LOAD VOTRIM Rtrim-down VI(-) VO(-) Figure 19.Circuit Configuration to Trim Output Voltage VO1 Set-Point Adjustment (Trim) The Trim equations shown below can be used for all module variants VO1. % is the desired % change in VO1. VO1 refers to the nominal output voltage for the output being trimmed. Vref = 2.5 for JHW050AF, and 1.225 for all others. 511 V O1 _R trim_down : = ---------- - 10.22 K % 5.11 V O1 ( 100 + % ) 511 V O1 _R trim_up : = ------------------------------------------------------------ - ---------- - 10.22 K V ref % % Example: For JHW050AF, to trim up to 5.25 V, % = 5, nominal VO1 = 5.0, use Vref = 2.5. JHW050AF VO2 Trim The following equations apply only to the JHW050AF VO2. 511 V o2 _R trim_down : = ---------- - 6.11 K % 5.11 V O2 ( 100 + % ) 511 V O2 _R trim_up : = ------------------------------------------------------------ - ---------- - 6.11 K V ref % % JHW050FG VO2 Trim the following equations apply only to the JHW050FG VO2. 40.87 V O2 ( 100 - % ) + 2026 V O2 _R trim_down : = ------------------------------------------------------------------------------------ K 929.5 - 3.715 V O2 ( 100 - % ) 62.85 V O2 ( 100 + % ) + 2955 V O2 _R trim_up : = ------------------------------------------------------------------------------------ - 1 K 3.715 V O2 ( 100 + % ) - 929.5 JHW050FY VO2 Trim The following equations apply only to the JHW050FY VO2. 51.91 V O2 ( 100 - % ) + 2904 V O2 _R trim_down : = ------------------------------------------------------------------------------------ K 849.6 - 4.719 V O2 ( 100 - % ) 52.81 VO2 ( 100 + % ) - 3753 V O2 _R trim_up : = ------------------------------------------------------------------------------------ - 1 K 4.719 V O2 ( 100 + % ) - 849.6 If not using the trim feature, leave each TRIM pin unconnected. Hence Rtrim_up = 102.2 K. The table below shows trim resistance values to adjust VO2 down to a range of popular nominal voltages. AF - Nom VO2 = 3.3V FG - Nom VO2 = 2.5V FY - Nom VO2 = 1.8V VO2 Trim VO2 Trim VO2 Trim 2.50 14.97k 2.00 54.69k 1.5 75.42k 2.00 6.86k 1.80 35.98k 1.40 53.84k 1.80 5.13k 1.50 21.91k 1.20 32.24k 1.50 3.26k -- -- 1.00 21.43k 10 Lineage Power Data Sheet April 2008 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Thermal Considerations The power module can operate in a variety of thermal environments, however, sufficient cooling should be provided to help ensure reliable operation. Considerations include Ambient temperature, airflow, module power dissipation, and need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on measurements taken in a wind tunnel using the test setup shown in Figure 22. Note: Proper cooling can be verified by measuring the temperature at the top center of the case of the two Tref components Q9 and Q2. For reliable operation neither temperature measured should exceed 110 C. 1-0867 Figure 22.Thermal Test Setup 14 TOTAL OUTPUT CURRENT Note that the orientation of the module with respect to the airflow affects thermal performance. Two orientations are shown below in Figure 20 and 21. 12 10 8 6 3.0 m/s (600 ft./min.) 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) 2 NATURAL CONVECTION 4 0 0 10 20 30 40 50 60 70 AMBIENT TEMPERATURE C 80 90 100 1-0868 Figure 23.JHW050AF Typical Maximum total Output Current vs. Local Ambient Temperature and Air Velocity; Worst case orientation 1-0865 Figure 20.Worst Orientation (Top View) TOTAL OUTPUT CURRENT 18 16 14 12 10 8 3.0 m/s (600 ft./min.) 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) NATURAL CONVECTION 6 4 2 0 0 10 20 30 40 50 60 70 80 90 100 AMBIENT TEMPERATURE C 1-0869 1-0866 Figure 21.Best Orientation (Top View) Lineage Power Figure 24.JHW050FG &FY typical Maximum total Output Current vs. Local Ambient Temperature and Air Velocity; Worst case orientation 11 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Data Sheet April 2008 EMC Considerations The Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. 1-0872 1-0870 Note: Inductor L1 must not be > 1 uH to ensure stability C1, C2 should be low impedance type, ESR < 0.7 Figure 25.Suggested Configuration for EN55022 Class B Figure 27. Suggested Primary to Secondary Power Planes The following recommendations should ensure reliable operation of the power module: n n 1-0871 Figure 26.Typical EMC signature using Figure 25 filter. For further information on designing for EMC compliance, please refer to the FLTR100V10 data sheet (FDS01-043EPS). Layout Considerations Though the external filter components are important in achieving a good EMC result, equally important is the PCB layout and system grounding configuration. n Due to the limited component clearance avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module. If this is not possible, any vias should be situated away from the three main magnetic components, as shown above. These components are the highest on the power module bottom side and hence provide the least clearance to the system card. Two planes should be provided beneath the power module to minimize radiated emissions. The `Input Plane' should be sized to cover the primary-side circuits of the power module, and it should be connected to either of the input power pins e.g. VI(+). The `Output Plane' should be sized to cover the secondary-side circuits and it should be connected to either of the output power pins e.g. 0V. Proper separation, in accordance with safety agency standards should be provided between these two planes. the spacing distance of 2mm shown above preserves the maximum Basic Insulation classification of these power modules. Under no circumstances should unconnected or `Floating `copper areas be placed underneath the power module as these can transmit noise signals, which could reduce module stability. Avoid routing sensitive data signals beneath the power module. If this is not possible, these signal traces should be shielded by use of ground planes. For additional layout guidelines, please refer to the FLTR100V10 data sheet (FDS01-043EPS). n The JHW050 power module is low profile in order to be used in fine pitch system card architectures. As such, component clearance between the bottom of the power module and the mounting board is limited. 12 Lineage Power Data Sheet April 2008 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Mechanical Details Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) x.xx mm 0.25 mm (x.xxx in. 0.010 in.) Top View 57.4 (2.26) 4.57 (0.18) 48.26 (1.90) 11 1 60.5 (2.38) 10 35.56 (1.40) 2 9 15.24 C (0.60) L 5.08 (0.20) 10.16 (0.40) 25.4 (1.00) 8 7 3 40.64 (1.60) 6 4 5 1-0873 Side View 1-0874 Bottom View 2.92 (0.11) 3.18 (0.13) 3.18 (0.13) 50.93 (2.01) 54.61 (2.15) 54.36 (2.14) 2.34 (0.09) CONDUCTIVE SPACER IN 4 POSITIONS NOT FITTED ON -S VERSION. Lineage Power 51.05 (2.01) 2.79 (0.11) 13 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Data Sheet April 2008 Recommended Footprint Details Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) x.xx mm 0.25 mm (x.xxx in. 0.010 in.) 57.4 (2.26) Pin 1 2 3 4 5 6 7 8 9 10 11 Function Vin+ ON/OFF N/C VinVo2+ Vo2Vo2Trim STANDARD = NO PIN OPTIONAL = SeqFet Vo1+ Vo1Vo1Trim 48.26 (1.90) 4.57 (0.18) KEEP OUT AREA FOR PICK AND PLACE CRADLE (2 POSITIONS) 11 1 10 35.56 (1.40) 60.5 (2.38) 2 9 CL 15.24 (0.60) 8 25.4 10.16 (1.00) (0.40) 40.64 (1.60) 14.0 (0.55) 7 3 10.0 (0.39) 5.08 (0.20) 6 4 5 IN 11 POSITIONS PAD o 3.2 mm HOLE o 1.0 mm 3.0 (0.12) 3.0 (0.12) 1-0876 Top View - Component Side Surface Mount Footprint JHW050XX-S 57.4 (2.26) Pin 1 2 3 4 5 6 7 8 9 10 11 Function Vin+ ON/OFF NO PIN VinVo2+ Vo2Vo2Trim STANDARD = NO PIN OPTIONAL = SeqFet Vo1+ Vo1Vo1Trim 51.05 (2.01) 4.57 (0.18) CONDUCTIVE SPACER IN 4 POSITIONS 48.26 (1.90) 11 1 54.61 (2.15) 7.62 (0.30) 10 2 60.5 (2.38) 10.16 (0.40) 25.4 (1.00) 9 35.56 (1.40) 54.36 (2.14) 8 C L 7 6 40.64 (1.60) 5.08 (0.20) 4 5 IN 10 POSITIONS PAD o 4.0 mm HOLE o 1.5 mm 2.92 (0.11) 50.93 (2.01) 3.18 (0.13) 3.2 (0.13) 2.7 (0.11) 3.18 (0.13) 1-0877 Top View - Component Side Through Hole Footprint JHW050XX > 0.00 2.30 (0.09) > 0.00 8.5 (0.33) MAX 8.5 (0.33) MAX 2.29 (0.09) 1-0888 Surface Mount Assembly X-Section 14 Through Hole Assembly X-Section Lineage Power Data Sheet April 2008 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Surface Mount Information Pick and Place Packaging Details All JHW050-S power modules come assembled with a clip-on, removable "Cradle" which has a large flat surface in its center to serve as a pick and place point for automated vacuum equipment. The surface mount version, JHW050XX-S power modules are supplied as standard in the plastic tray shown in Figure 28. The tray has external dimensions of 234mm (W) x 334mm (L) x 21.5mm (H). The tray is designed to allow the use of either vacuum pick up or mechanical grippers to automatically place the power module. Figure 29.Removable Pick and Place Cradle The cradle is molded out of high temperature plastic, which is able to withstand the reflow process. Once soldered onto the end-board assembly the cradle should simply be removed by compressing the two edge clips. The cradle material is electrically insulative. Hence, standard-handling methods for ESD prevention, such as specified in JEDEC JESD625-A, should be followed while removing the cradle. Figure 28.Surface Mount Packaging Tray Tray Specification The module weight has been kept to a minimum be using open frame construction. Even so, these modules have a large mass when compared with conventional smt components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. Max surface resistivity 1012/sq The power module can also be automatically handled using odd form placement equipment such as mechanical grippers. the parallel edges of the modules PCB offer suitable gripping points. Colour Clear Pick and Place Cradle Specification Capacity per tray 12 power modules Material QuestraTM EA 535 Stacking pitch 12.98mm (0.511") Vicat softening point 260 C Min order quantity 48 pcs (1box of 4 full trays) Dielectric const IEC250 3.2 Material Antistatic coated PVC Max temperature 65 C Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules. Lineage Power Volume resistivity 1.3x1018 Colour Black Recycling designation 7, sPS 15 JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Data Sheet April 2008 Reflow Soldering Information 240 The JHW050 Family of power modules is available for either trough hole or Surface Mount (SMT) soldering. These power modules are large mass, low thermal resistance devices and typically heat up slower than other SMT components. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assemble. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. It is recommended that the reflow profile be characterized for the module on each application board assembly. The power modules Ball connections are plated with tin/lead (Sn/Pb) solder to prevent corrosion and ensure good solderability. Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliable soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules Ball connector temperatures. Peak Temp 235C 200 Cooling zone 1-4 Cs-1 Heat zone max 4 Cs 100 50 Preheat zone max 4 Cs-1 0 REFLOW TIME (S) 1-0894 16 220 215 210 205 200 0 10 20 30 TIME (S) 40 50 60 1-0894 Figure 31.Time Limit Curve Above 205 C Reflow Lead Free Soldering Standard JHW050-S power modules are designed to be used in a conventional Tin/Lead (Sn/Pd) solder process where peak reflow temperatures are limited to less than 235 C. Users who wish to assemble these modules in a Lead Free solder process which, it is expected, will require the use of higher peak reflow temperatures should contact your local Lineage Power technical representative for more information. Solder Ball and Cleanliness Requirements Post Solder Cleaning and Drying Considerations Tlim above 205 C Figure 30.Recommended Reflow Profile 225 The cleanliness designator of the open frame power module is C00 (per J specification). 150 Soak zone 30-240s 230 The open frame (no case or potting) power module will meet the solder ball requirements per J-STD-001B. These requirements state that solder balls must neither be loose nor violate the power module minimum electrical spacing. 300 250 235 Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power's Board Mounted Power Modules: Soldering and Cleaning Application Note (AP01-56EPS) Lineage Power JHW050 Dual Positive Output-Series Power Modules: dc-dc Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W Data Sheet April 2008 Ordering Information Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Product codes# JHW050AF1 JHW050FG1 JHW050FY1 JHW050GY1 JHW050AF1-S JHW050FG1-S JHW050FY1-S JHW050GY1-S JHW050AF JHW050FG JHW050FY JHW050GY JHW050AF-S JHW050FG-S JHW050FY-S JHW050GY-S Input Voltage 48V (36V-75V) 48V (36V-75V) Output Voltage(s) Output Current 5.0V & 3.3V 3.3V & 2.5V 3.3V & 1.8V 2.5V & 1.8V 5.0V & 3.3V 3.3V & 2.5V 3.3V & 1.8V 2.5V & 1.8V 5.0V & 3.3V 3.3V & 2.5V 3.3V & 1.8V 2.5V & 1.8V 12A (total) 16A (total) 16A (total) 16A (total) 12A (total) 16A (total) 16A (total) 16A (total) 12A (total) 16A (total) 16A (total) 16A (total) 5.0V & 3.3V 3.3V & 2.5V 3.3V & 1.8V 2.5V & 1.8V 12A (total) 16A (total) 16A (total) 16A (total) Mounting Remote On/Off Logic Through Hole (Pinned) Negative Surface Mount Through Hole (Pinned) Positive Surface Mount Comcode 108968785 108968249 108966367 TBD 108966375 TBD 108968660 TBD 108961566 108959354 108959362 108963968 108965724 108969031 108965732 TBD Optional features can be ordered using the suffixes shown below. The suffixes follow the last letter of the device code and are placed in descending alphanumerical order. Option Suffix Negative Remote On/Off Logic Surface Mountable SeqFET Supply - pin8 fitted Tested for Basic Insulation 1 -S -F -B A sia-Pacific Head qu art ers T el: +65 6 41 6 4283 World W ide Headq u ar ters Lin eag e Po wer Co rp oratio n 30 00 Sk yline D riv e, Mes quite, T X 75149, U SA +1-800-526-7819 (Outs id e U .S.A .: +1- 97 2-2 84 -2626) www.line ag ep ower.co m e-m ail: tech sup port1@ lin ea gep ower.co m Eu ro pe, M id dle-East an d Afr ic a He ad qu arter s T el: +49 8 9 6089 286 Ind ia Head qu arters T el: +91 8 0 28411633 Lineage Power reserves the right to make changes to the produc t(s) or information contained herein without notice. No liability is ass umed as a res ult of their use or applic ation. No rights under any patent acc ompany the sale of any s uc h pr oduct(s ) or information. (c) 2008 Lineage Power Corpor ation, (Mesquite, Texas ) All International Rights Res er ved. April 2008 FDS02-044EPS (Replaces FDS02-043EPS)