2004-2013 Microchip Technology Inc. DS21915C-page 1
MCP73853/55
Features
• Linear Charge Management Controllers
- Integrated Pass Transistor
- Integrated Current Sense
- Reverse Blocking Protection
• High-Accuracy Preset Voltage Regulation: + 0.5%
• Two Selectable Voltage Regulation Options:
- 4.1V, 4.2V
• Programmable Charge Current
• USB Compatible Charge Current Settings
• Programmable Safety Charge Timers
• Preconditioning of Deeply Depleted Cells
• Automatic End-of-Charge Control
• Optional Continuous Cell Temperature Monitoring
MCP73853
• Charge Status Output for Direct LED Drive
• Fault Output for Direct LED Drive
MCP73853
• Automatic Power-Down
• Thermal Regulation
• Temperature Range: -40°C to +85°C
• Packaging:
- 16-Lead, 4x4 mm QFN (MCP73853)
- 10-Lead, 3x3 mm DFN (MCP73855)
Applications
• Lithium-Ion/Lithium-Polymer Battery Chargers
• Personal Data Assistants (PDAs)
• Cellular Telephones
• Hand-Held Instruments
• Cradle Chargers
• Digital Cameras
• MP3 Players
• Bluetooth Headsets
• USB Chargers
Description
The MCP7385X devices are highly-advanced, linear
charge management controllers, for use in space-
limited, cost-sensitive applications. The MCP73853
combines high-accuracy constant-voltage, constant-
current regulation, cell preconditioning, cell temperature
monitoring, advanced safety timers, automatic charge
termination, internal current sensing, reverse blocking
protection and charge status and fault indication in a
space-saving 16-lead, 4x4 QFN package.
The MCP73855 employs all the features of the
MCP73853, with the exception of the cell temperature
monitor and one status output. The MCP73855 is
offered in a space-saving 10-lead, 3x3 DFN package.
The MCP73853 and MCP73855 are designed
specifically for USB applications, adhering to all the
specifications governing the USB power bus.
The MCP7385X devices provide two selectable
voltage regulation options (4.1V or 4.2V) for use with
either coke or graphite anodes.
These devices have complete and fully-functional,
charge management solutions, operating with an input
voltage range of 4.5V to 5.5V. These are fully specified
over the ambient temperature range of -40°C to +85°C.
Package Types
2
MCP73853
4x4 QFN*
VDD2
VSS1
VSET VBAT3
VBAT2
PROG
VBAT1
THREF
THERM
TIMER
VSS3
STAT1
STAT2
EN
VSS2
VDD1 EP
16
1
15 14 13
3
4
12
11
10
9
5678
17
MCP73855
3x3 DFN*
VDD1
VSET
VSS1
VBAT2
VBAT1
1
2
3
4
10
9
8
7VSS2
ENSTAT1
EP
11
56
PROG TIMER
*Exposed Pad (EP) is at VSS potential.
USB Compatible Li-Ion/Li-Polymer
Charge Management Controllers
MCP73853/55
DS21915C-page 2 2004-2013 Microchip Technology Inc.
Typical Application
Functional Block Diagram
EN
STAT1
VSET
VDD1
VSS
TIMER
PROG
VBAT1
VBAT2
+
–
Single
Lithium-Ion
Cell
3
2
MCP73855
5
6
4, 7
9
8
10
1
5V
4.7 µF
400 mA Lithium-Ion Battery Charger
4.7 µF
0.1 µF
+
–
Charge
Termination
Comparator
Voltage Control
Amplifier
+
–
UVLO
COMPARATOR
VUVLO
+
-
Temperature
Comparators
+
-
Bias and
Reference
Generator
VUVLO
VREF(1.2V)
Power-On
Delay
+
–
+
–
VREF
VREF
Oscillator
IREG/12
Constant-voltage/
Recharge Comp.
Precondition
Control
Charge_OK
Precon.
VDD
Charge Current
Control Amplifier
+
–
VREF
VREF
+
–
Precondition
Comp.
Charge Control,
Charge Timers,
and
Status Logic Drv Stat 2
Drv Stat 1
Charge_OK
IREG/12
VDD1
THERM
EN
TIMER
STAT1
STAT2
VBAT3
VSS1
PROG
VSET
THREF
VBAT1
90
110 k
10 k
10 k
100 k
50 k
50 k
G = 0.001
11 k
3k
600 k
149 k
1.58 k
VDD2 VBAT2
300 k
10.3 k
4k
Direction
Control
k
VSS2
VSS3
MCP73853 ONLY MCP73853 ONLY
2004-2013 Microchip Technology Inc. DS21915C-page 3
MCP73853/55
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
VDD1,2 .............................................................................6.5V
All Inputs and Outputs w.r.t. VSS ..............-0.3 to (VDD + 0.3)V
Maximum Junction Temperature, TJ............ Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5k in Series with 100pF) 4 kV
Machine Model (200pF, No Series Resistance) ..........400V
*Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
Supply Input
Supply Voltage VDD 4.5 — 5.5 V
Supply Current ISS — 0.28 4 µA Disabled
— 0.83 4 mA Operating
UVLO Start Threshold VSTART 4.25 4.45 4.65 V VDD Low-to-High
UVLO Stop Threshold VSTOP 4.20 4.40 4.55 V VDD High-to-Low
Voltage Regulation (Constant-Voltage Mode)
Regulated Output Voltage VREG 4.079 4.1 4.121 V VSET = VSS
4.179 4.2 4.221 V VSET = VDD
VDD = [VREG(Typ) + 1V],
IOUT =10mA, T
A = -5°C to +55°C
Line Regulation VBAT/
VBAT)| /VDD
— 0.020 0.25 %/V VDD = [VREG(Typ) + 1V] to 5.5V
IOUT = 10 mA
Load Regulation VBAT/VBAT| — 0.022 0.25 % IOUT = 10 mA to 150 mA
VDD = [VREG(Typ) + 1V]
Supply Ripple Attenuation PSRR —50—dBI
OUT = 10 mA, 10 Hz to 1 kHz
—26—dBI
OUT = 10 mA, 10 Hz to 10 kHz
—24—dBI
OUT = 10 mA, 10 Hz to 1 MHz
Output Reverse-Leakage
Current
IDISCHARGE —0.24 1µA
VDD < VBAT = VREG(Typ)
Current Regulation (Fast Charge Constant-Current Mode)
Fast Charge Current
Regulation
IREG 70 85 100 mA PROG = OPEN
325 400 475 mA PROG = VSS
TA = -5°C to +55°C
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current
Regulation
IPREG 5 9 15 mA PROG = OPEN
25 40 75 mA PROG = VSS
TA = -5°C to +55°C
Precondition Threshold
Voltage
VPTH 2.70 2.80 2.90 V VSET = VSS
2.75 2.85 2.95 V VSET = VDD
VBAT Low-to-High
MCP73853/55
DS21915C-page 4 2004-2013 Microchip Technology Inc.
Charge Termination
Charge Termination Current ITERM 3.7 6.5 9.3 mA PROG = OPEN
18 32 46 mA PROG = VSS
TA = -5°C to +55°C
Automatic Recharge
Recharge Threshold Voltage VRTH VREG –
300mV
VREG –
200mV
VREG –
100mV
VV
BAT High-to-Low
Thermistor Reference - MCP73853
Thermistor Reference
Output Voltage
VTHREF 2.475 2.55 2.625 V TA = 25°C, VDD = VREG(Typ) + 1V,
ITHREF = 0 mA
Thermistor Reference
Source Current
ITHREF 200 — — µA
Thermistor Reference Line
Regulation
VTHREF/
VTHREF)|/VDD
— 0.05 0.25 %/V VDD = [VREG (Typ) + 1V] to 5.5V
Thermistor Reference Load
Regulation
VTHREF/
VTHREF|
0.02 0.10 % ITHREF = 0 mA to 0.20 mA
Thermistor Comparator - MCP73853
Upper Trip Threshold VT1 1.18 1.25 1.32 V
Upper Trip Point Hysteresis VT1HYS —-50—mV
Lower Trip Threshold VT2 0.59 0.62 0.66 V
Lower Trip Point Hysteresis VT2HYS —80—mV
Input Bias Current IBIAS —— 2A
Status Indicator – STAT1, STAT2
Sink Current ISINK 4812mA
Low Output Voltage VOL —200400mVI
SINK = 1 mA
Input Leakage Current ILK —0.01 1 AI
SINK = 0 mA, VSTAT1,2 = 5.5V
Enable Input
Input High Voltage Level VIH 1.4 — — V
Input Low Voltage Level VIL ——0.8V
Input Leakage Current ILK —0.01 1 AV
ENABLE = 5.5V
Thermal Shutdown
Die Temperature TSD —155—°C
Die Temperature Hysteresis TSDHYS —10—°C
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
2004-2013 Microchip Technology Inc. DS21915C-page 5
MCP73853/55
TEMPERATURE SPECIFICATIONS
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
UVLO Start Delay tSTART —— 5 msV
DD Low-to-High
Current Regulation
Transition Time Out of
Preconditioning
tDELAY —— 1 msV
BAT < VPTH to VBAT > VPTH
Current Rise Time Out of
Preconditioning
tRISE —— 1 msI
OUT Rising to 90% of IREG
Fast Charge Safety Timer
Period
tFAST 1.1 1.5 1.9 Hours CTIMER = 0.1 µF
Preconditioning Current Regulation
Preconditioning Charge
Safety Timer Period
tPRECON 45 60 75 Minutes CTIMER = 0.1 µF
Charge Termination
Elapsed Time Termination
Period
tTERM 2.2 3 3.8 Hours CTIMER = 0.1 µF
Status Indicators
Status Output Turn-off tOFF ——200µsI
SINK = 1 mA to 0 mA
Status Output Turn-on tON ——200µsI
SINK = 0 mA to 1 mA
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typ) + 0.3V] to 5.5.
Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 — +85 °C
Operating Temperature Range TJ-40 — +125 °C
Storage Temperature Range TA-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 16-L, 4mm x 4mm QFN JA —37—°C/W
4-Layer JC51-7
Standard Board,
Natural Convection
Thermal Resistance, 10-L, 3mm x 3mm DFN JA —51—°C/W
4-Layer JC51-7
Standard Board,
Natural Convection
MCP73853/55
DS21915C-page 6 2004-2013 Microchip Technology Inc.
NOTES:
2004-2013 Microchip Technology Inc. DS21915C-page 7
MCP73853/55
2.0 TYPICAL PERFORMANCE CURVES
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
FIGURE 2-1: Battery Regulation Voltage
(VBAT) vs. Charge Current (IOUT).
FIGURE 2-2: Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
FIGURE 2-3: Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
FIGURE 2-4: Supply Current (ISS) vs.
Charge Current (IOUT).
FIGURE 2-5: Supply Current (ISS) vs.
Supply Voltage (VDD).
FIGURE 2-6: Supply Current (ISS) vs.
Supply Voltage (VDD).
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
4.150
4.170
4.190
4.210
4.230
4.250
0 50 100 150 200 250 300 350 400
IOUT (mA)
VBAT (V)
VSET = VDD
VDD
= 5.2 V
4.150
4.170
4.190
4.210
4.230
4.250
4.5 4.7 4.9 5.1 5.3 5.5
VDD (V)
VBAT (V)
VSET = V
DD
IOUT
= 375 mA
4.150
4.170
4.190
4.210
4.230
4.250
4.54.74.95.15.35.5
VDD (V)
VBAT (V)
VSET = V
DD
IOUT
= 10 mA
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
0 50 100 150 200 250 300 350 400
IOUT (mA)
ISS (mA)
VSET = VDD
VDD
= 5.2 V
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
4.5 4.7 4.9 5.1 5.3 5.5
VDD (V)
ISS (mA)
VSET = VDD
IOUT
= 375 mA
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
4.5 4.7 4.9 5.1 5.3 5.5
VDD (V)
ISS (mA)
VSET = VDD
IOUT = 10 mA
MCP73853/55
DS21915C-page 8 2004-2013 Microchip Technology Inc.
FIGURE 2-7: Output Leakage Current
(IDISCHARGE) vs. Battery Voltage (VBAT).
FIGURE 2-8: Thermistor Reference
Voltage (VTHREF) vs. Supply Voltage (VDD).
FIGURE 2-9: Thermistor Reference
Voltage (VTHREF) vs. Thermistor Bias Current
(ITHREF).
FIGURE 2-10: Supply Current (ISS) vs.
Ambient Temperature (TA).
FIGURE 2-11: Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
FIGURE 2-12: Thermistor Reference
Voltage (VTHREF) vs. Ambient Temperature (TA).
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
2.02.42.83.23.64.04.4
VBAT (V)
IDISCHARGE (mA)
VSET = VDD
VDD = VSS
+25°C
-40°C
+85°C
2.525
2.535
2.545
2.555
2.565
2.575
4.54.74.95.15.35.5
VDD (V)
VTHREF (V)
MCP73853
VSET = VDD
ITHREF = 100 µA
2.525
2.535
2.545
2.555
2.565
2.575
0 25 50 75 100 125 150 175 200
ITHREF (µA)
VTHREF (V)
MCP73853
VSET = VDD
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
TA (°C)
ISS (mA)
VSET = VDD
IOUT = 10 mA
4.150
4.170
4.190
4.210
4.230
4.250
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
TA (°C)
VBAT (V)
VSET = VDD
IOUT = 10 mA
2.525
2.535
2.545
2.555
2.565
2.575
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
TA (°C)
VTHREF (V)
MCP73853
VSET = V
DD
ITHREF
= 100 µA
2004-2013 Microchip Technology Inc. DS21915C-page 9
MCP73853/55
FIGURE 2-13: Line Transient Response.
FIGURE 2-14: Load Transient Response.
FIGURE 2-15: Power Supply Ripple
Rejection.
FIGURE 2-16: Line Transient Response.
FIGURE 2-17: Load Transient Response.
FIGURE 2-18: Power Supply Ripple
Rejection.
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA, and TA= +25°C.
-70
-60
-50
-40
-30
-20
-10
0
0.01 0.1 1 10 100 1000
Frequency (kHz)
Attenuation (dB)
MCP73853
VDD = 5.2 V
VAC = 100 mVp-p
IOUT = 10 mA
COUT = 10 F, Ceramic
-80
-70
-60
-50
-40
-30
-20
-10
0
0.01 0.1 1 10 100 1000
Frequency (kHz)
Attenuation (dB)
MCP73853
VDD = 5.2 V
VAC = 100 mVp-p
IOUT = 100 mA
COUT = 10 F, X7R, Ceramic
MCP73853/55
DS21915C-page 10 2004-2013 Microchip Technology Inc.
FIGURE 2-19: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-20: Charge Current (IOUT) vs.
Ambient Temperature (TA).
0
100
200
300
400
500
OPEN 4.8K 1.6K 536 0
RPROG ()
IOUT (mA)
VSET = VDD
250
255
260
265
270
275
280
285
290
295
300
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
TA (°C)
IOUT (mA)
VSET = VDD
RPROG = 1.6 k
2004-2013 Microchip Technology Inc. DS21915C-page 11
MCP73853/55
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Voltage Regulation Selection
(VSET)
Connect to VSS for 4.1V regulation voltage. Connect to
VDD for 4.2V regulation voltage.
3.2 Battery Management Input Supply
(VDD1, VDD2)
A supply voltage of [VREG(Typ) + 0.3V] to 5.5V is
recommended. Bypass to VSS with a minimum of
4.7 µF.
3.3 Battery Management 0V Reference
(VSS1, VSS2, VSS3)
Connect to negative terminal of battery.
3.4 Current Regulation Set (PROG)
Preconditioning, fast and termination currents are
scaled by placing a resistor from PROG to VSS.
3.5 Cell Temperature Sensor Bias
(THREF)
THREF is a voltage reference to bias external
thermistor for continuous cell temperature monitoring
and pre-qualification.
3.6 Cell Temperature Sensor Input
(THERM)
Input for an external thermistor for continuous cell-
temperature monitoring and prequalification. Connect
to THREF/3 to disable temperature sensing.
3.7 Timer Set (TIMER)
All safety timers are scaled by CTIMER/0.1 µF.
3.8 Battery Charge Control Output
(VBAT1, VBAT2)
Connect to positive terminal of battery. Drain terminal
of internal P-channel MOSFET pass transistor. Bypass
to VSS with a minimum of 4.7 µF to ensure loop stability
when the battery is disconnected.
3.9 Battery Voltage Sense (VBAT3)
Voltage sense input. Connect to positive terminal of
battery. A precision internal resistor divider regulates
the final voltage on this pin to VREG
.
3.10 Logic Enable (EN)
Input to force charge termination, initiate charge, clear
faults or disable automatic recharge.
3.11 Fault Status Output (STAT2)
Current-limited, open-drain drive for direct connection
to an LED for charge status indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
3.12 Charge Status Output (STAT1)
Current-limited, open-drain drive for direct connection
to a LED for charge status indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
MCP73853 MCP73855 Sym Description
12V
SET Voltage Regulation Selection
23V
DD1 Battery Management Input Supply
3—V
DD2 Battery Management Input Supply
44V
SS1 Battery Management 0V Reference
5 5 PROG Current Regulation Set
6 — THREF Cell Temperature Sensor Bias
7 — THERM Cell Temperature Sensor Input
86TIMERTimer Set
9—V
SS3 Battery Management 0V Reference
10 8 VBAT1 Battery Charge Control Output
11 9 VBAT2 Battery Charge Control Output
12 — VBAT3 Battery Voltage Sense
13 7 VSS2 Battery Management 0V Reference
14 10 EN Logic Enable
15 — STAT2 Fault Status Output
16 1 STAT1 Charge Status Output
17 11 EP Exposed Pad, VSS Potential
MCP73853/55
DS21915C-page 12 2004-2013 Microchip Technology Inc.
NOTES:
2004-2013 Microchip Technology Inc. DS21915C-page 13
MCP73853/55
4.0 DEVICE OVERVIEW
The MCP7385X devices are highly-advanced, linear
charge management controllers. For more information,
refer to the “Functional Block Diagram” on page 2.
Figure 4-2 depicts the operational flow algorithm from
charge initiation to completion and automatic recharge.
4.1 Charge Qualification and
Preconditioning
Upon insertion of a battery or application of an external
supply, the MCP7385X devices automatically perform a
series of safety checks to qualify the charge. The input
source voltage must be above the Undervoltage Lock-
out (UVLO) threshold, the enable pin must be above the
logic high level, and the cell temperature monitor must
be within the upper and lower thresholds (MCP73853
only). The qualification parameters are continuously
monitored, with any deviation beyond the limits automat-
ically suspending or terminating the charge cycle. The
input voltage must deviate below the UVLO stop
threshold for at least one clock period to be considered
valid.
Once the qualification parameters have been met, the
MCP7385X devices initiate a charge cycle. The charge
status output is pulled low throughout the charge cycle
(see Tabl e 5 -1 and Table 5-2 for charge status out-
puts). If the battery voltage is below the preconditioning
threshold (VPTH), the MCP7385X devices precondition
the battery with a trickle charge. The preconditioning
current is set to approximately 10% of the fast charge
regulation current. The preconditioning trickle charge
safely replenishes deeply depleted cells and minimizes
heat dissipation during the initial charge cycle. If the
battery voltage has not exceeded the preconditioning
threshold before the preconditioning timer has expired,
a fault is indicated and the charge cycle is terminated.
4.2 Constant Current Regulation –
Fast Charge
Preconditioning ends and fast charging begins when
the battery voltage exceeds the preconditioning thresh-
old. Fast charge regulates to a constant current (IREG),
which is set via an external resistor connected to the
PROG pin. Fast charge continues until either the
battery voltage reaches the regulation voltage (VREG)
or the fast charge timer expires; in which case, a fault
is indicated and the charge cycle is terminated.
4.3 Constant Voltage Regulation
When the battery voltage reaches the regulation volt-
age (VREG), constant voltage regulation begins. The
MCP7385X devices monitor the battery voltage at the
VBAT pin. This input is tied directly to the positive termi-
nal of the battery. The MCP7385X devices select the
voltage regulation value based on the state of VSET
.
With VSET tied to VSS, the MCP7385X devices regulate
to 4.1V or with VSET tied to VDD, the MCP7385X
devices regulate to 4.2V.
4.4 Charge Cycle Completion and
Automatic Recharge
The MCP7385X devices monitor the charging current
during the Constant-voltage Regulation mode. The
charge cycle is considered complete when either the
charge current has diminished below approximately
7% of the regulation current (IREG) or the elapsed timer
has expired.
Assuming all the qualification parameters are met, the
MCP7385X devices automatically begin a new charge
cycle when the battery voltage falls below the recharge
threshold (VRTH).
4.5 Thermal Regulation
The MCP7385X devices limit the charge current based
on the die temperature. Thermal regulation optimizes
the charge cycle time while maintaining device reliabil-
ity. If thermal regulation is entered, the timer is automat-
ically slowed down to ensure that a charge cycle does
not terminate prematurely. Figure 4-1 depicts the
thermal regulation.
FIGURE 4-1: Typical Maximum Charge
Current vs. Junction Temperature.
4.6 Thermal Shutdown
The MCP7385X devices suspend charge if the die
temperature exceeds 155°C. Charging resumes when
the die temperature has cooled by approximately 10°C.
The thermal shutdown is a secondary safety feature in
the event that there is a failure within the thermal
regulation circuitry.
MCP73853/55
DS21915C-page 14 2004-2013 Microchip Technology Inc.
FIGURE 4-2: Operational Flow Algorithm.
Preconditioning Mode
Charge Current = IPREG
Reset Safety Timer
Yes
Initialize
No
Yes
VBAT > VPTH STAT1 = On
VBAT > VPTH
Yes
VDD < VUVLO
No
No
Safety Timer
Yes Temperature OK
No
STAT1 = Off
Safety Timer Suspended
Charge Current = 0
Fault
Charge Current = 0
Reset Safety Timer
or EN Low
No
STAT1 = Off
Constant-current
Charge Current = IREG
Reset Safety Timer
VBAT = VREG
No
No
Safety Timer
Yes Temperature OK
Constant-voltage Mode
Output Voltage = VREG
IOUT < ITERM
Yes
VBAT < VRTH
Elapsed Timer
Charge Termination
Charge Current = 0
Reset Safety Timer
No
STAT1 = Flashing
Yes
Yes
Temperature OK
No
STAT1 = Flashing
Safety Timer Suspended
Charge Current = 0
Yes
Yes
VDD < VUVLO
or EN Low
No
Yes
Yes
Temperature OK
No
STAT1 = Off
Charge Current = 0
Yes
No
STAT1 = Off
VDD > VUVLO
Mode
Expired
Expired
No
STAT1 = Off
Safety Timer Suspended
Charge Current = 0
EN High
Expired
Note 1: The qualification parameters are continuously
monitored throughout the charge cycle. For more
details on this, refer to Section 4.1 “Charge
Qualification and Preconditioning”.
Note 2: The charge current will be scaled based on the
die temperature during thermal regulation. For
more details, refer to Section 4.5 “Thermal
Regulation”.
NOTE 1
NOTE 1
STAT2 = OnSTAT2 = Flashing
STAT2 = Off
STAT2 = Flashing
STAT2 = Off
NOTE 2
STAT2 = Flashing
STAT2 = Off
2004-2013 Microchip Technology Inc. DS21915C-page 15
MCP73853/55
5.0 DETAILED DESCRIPTION
5.1 Analog Circuitry
5.1.1 BATTERY MANAGEMENT INPUT
SUPPLY (VDD1, VDD2)
The VDD pin is the input supply pin for the MCP7385X
devices. The MCP7385X devices automatically enter a
power-down mode if the voltage on the VDD input falls
below the UVLO voltage (VSTOP). This feature prevents
draining the battery pack when the VDD supply is not
present.
5.1.2 PROG INPUT
Fast charge current regulation can be scaled by placing
a programming resistor (RPROG) from the PROG input
to VSS. Connecting the PROG input to VSS allows a
maximum fast charge current of 400 mA, typically. The
minimum fast charge current is 85 mA (Typ) and is set
by letting the PROG input float. Equation 5-1 calculates
the value for RPROG
.
EQUATION 5-1:
The preconditioning trickle charge current and the
charge termination current are scaled to approximately
10% and 7% of IREG
, respectively.
5.1.3 CELL TEMPERATURE SENSOR
BIAS (THREF)
A 2.55V voltage reference is provided to bias an
external thermistor for continuous cell temperature
monitoring and prequalification. A ratiometric window
comparison is performed at threshold levels of
VTHREF/2 and VTHREF/4.
5.1.4 CELL TEMPERATURE SENSOR
INPUT (THERM)
The MCP73853 continuously monitors temperature by
comparing the voltage between the THERM input and
VSS with the upper and lower temperature thresholds.
A negative or positive temperature coefficient, NTC or
PTC thermistor, and an external voltage divider
typically develop this voltage. The temperature-
sensing circuit has its own reference, to which it
performs a ratiometric comparison. Therefore, it is
immune to fluctuations in the supply input (VDD). The
temperature-sensing circuit is removed from the
system when VDD is not applied, eliminating additional
discharge of the battery pack.
Figure 6-1 depicts a typical application circuit with
connection of the THERM input. The resistor values of
RT1 and RT2 are calculated with the following
equations:
For NTC thermistors:
For PTC thermistors:
Applying a voltage equal to VTHREF/3 to the THERM
input disables temperature monitoring.
5.1.5 TIMER SET INPUT (TIMER)
The TIMER input programs the period of the safety tim-
ers by placing a timing capacitor (CTIMER) between the
TIMER input pin and VSS. Three safety timers are
programmed via the timing capacitor:
The preconditioning safety timer period:
The fast charge safety timer period:
And, the elapsed time termination period:
The preconditioning timer starts after qualification and
resets when the charge cycle transitions to the
constant-current, fast charge phase. The fast charge
timer and the elapsed timer start after the MCP7385X
devices transition from preconditioning. The fast
charge timer resets when the charge cycle transitions
to the Constant-voltage mode. The elapsed timer
expires and terminates the charge if the sensed current
does not diminish below the termination threshold.
During thermal regulation, the timer is slowed down
proportional to the charge current.
RPROG
13.32 33.3 IREG
–
14.1 IREG
1.2–
------------------------------------------------
=
Where:
IREG is the desired fast charge current in
amps
RPROG is in kilohms.
RT1
2RCOLD RHOT
RCOLD RHOT
–
----------------------------------------------
=
RT2
2RCOLD RHOT
RCOLD 3RHOT
–
----------------------------------------------
=
RT1
2RCOLD RHOT
RHOT RCOLD
–
----------------------------------------------
=
RT2
2RCOLD RHOT
RHOT 3RCOLD
–
----------------------------------------------
=
Where:
RCOLD and RHOT are the thermistor
resistance values at the temperature window
of interest.
tPRECON
CTIMER
0.1
F
-------------------1.0Hours=
tFAST
CTIMER
0.1
F
-------------------1.5Hours=
tTERM
CTIMER
0.1
F
-------------------3.0Hours=
MCP73853/55
DS21915C-page 16 2004-2013 Microchip Technology Inc.
5.1.6 BATTERY VOLTAGE SENSE (VBAT3)
The MCP73853 monitors the battery voltage at the
VBAT3 pin. This input is tied directly to the positive
terminal of the battery pack.
5.1.7 BATTERY CHARGE CONTROL
OUTPUT (VBAT1, VBAT2)
The battery charge control output is the drain terminal of
an internal P-channel MOSFET. The MCP7385X
devices provide constant-current and constant-voltage
regulation to the battery pack by controlling this
MOSFET in the linear region. The battery charge
control output should be connected to the positive
terminal of the battery pack.
5.2 Digital Circuitry
5.2.1 CHARGE STATUS OUTPUTS
(STAT1, STAT2)
Two status outputs provide information on the state of
charge for the MCP73853. One status output provides
information on the state of charge for the MCP73855.
The current-limited, open-drain outputs can be used to
illuminate external LEDs. Optionally, a pull-up resistor
can be used on the output for communication with a
host microcontroller. Table 5-1 and Ta b le 5 - 2 summa-
rize the state of the status outputs during a charge
cycle for the MCP73853 and MCP73855, respectively.
The flashing rate (1 Hz) is based on a timer capacitor
(CTIMER) of 0.1 µF. The rate varies based on the value
of the timer capacitor.
5.2.1.1 MCP73853 Only
STAT1 is on whenever the input voltage is above the
under voltage lockout, the device is enabled, and all
conditions are normal.
During a fault condition, the STAT1 status output is off
and the STAT2 status output flashes. To recover from a
fault condition, the input voltage must be removed and
then reapplied, or the enable input, EN, must be deas-
serted to a logic low, then asserted to a logic high.
When the voltage on the THERM input is outside the
preset window, the charge cycle will either not start or
be suspended. However, the charge cycle is not termi-
nated, with recovery being automatic. The charge cycle
resumes (or starts) once the THERM input is valid and
all other qualification parameters are met.
5.2.2 VSET INPUT
The VSET input selects the regulated output voltage of
the MCP7385X devices. With VSET tied to V
SS, the
MCP7385X devices regulate to 4.1V. With VSET tied to
VDD, the MCP7385X devices regulate to 4.2V.
5.2.3 LOGIC ENABLE (EN)
The logic enable input pin (EN) can be used to termi-
nate a charge anytime during the charge cycle, initiate
a charge cycle or initiate a recharge cycle.
Applying a logic high input signal to the EN pin, or tying
it to the input source, enables the device. Applying a
logic low input signal disables the device and termi-
nates a charge cycle. When disabled, the device’s
supply current is reduced to 0.28 µA, typically.
TABLE 5-1: STATUS OUTPUTS – MCP73853
CHARGE
CYCLE STATE STAT1 STAT2
Qualification OFF OFF
Preconditioning ON OFF
Constant-
current Fast
Charge
ON OFF
Constant-
voltage
ON OFF
Charge
Complete
Flashing (1 Hz,
50% duty cycle)
OFF
Fault OFF ON
THERM Invalid OFF Flashing (1 Hz,
50% duty cycle)
Disabled -
Sleep mode
OFF OFF
Input Voltage
Disconnected
OFF OFF
Note: OFF state: open-drain is high-impedance;
ON state: open-drain can sink current,
typically 7 mA; FLASHING: toggles
between OFF and ON states.
TABLE 5-2: STATUS OUTPUT – MCP73855
CHARGE CYCLE STATE STAT1
Qualification OFF
Preconditioning ON
Constant Current Fast Charge ON
Constant Voltage ON
Charge Complete OFF
Fault Flashing (1Hz,
50% duty cycle)
THERM Invalid Flashing (1Hz,
50% duty cycle)
Disabled - Sleep mode OFF
Input Voltage Disconnected OFF
Note: OFF state: open-drain is high impedance;
ON state: open-drain can sink current, typ-
ically 7 mA; FLASHING: toggles between
OFF state and ON state.
2004-2013 Microchip Technology Inc. DS21915C-page 17
MCP73853/55
6.0 APPLICATIONS
The MCP7385X devices are designed to operate in
conjunction with a host microcontroller or in stand-
alone applications. The MCP7385X devices provide
the preferred charge algorithm for Li-Ion/Li-Polymer
cells. The algorithm uses a constant current followed
by a constant voltage charging method. Figure 6-1
depicts a typical stand-alone application circuit, while
Figure 6-2 and Figure 6-3 depict the accompanying
charge profile.
FIGURE 6-1: Typical Application Circuit.
FIGURE 6-2: Typical Charge Profile.
ENSTAT1
STAT2
VSET
VSS3
VDD1
VDD2
VSS2
TIMERPROG
THERM
THREF
VBAT3
VBAT2
VBAT1
CTIMER
RPROG
RT1
RT2
+
-
Single
Lithium-Ion
Cell
VSS1
1
2
3
4
MCP73853
141516
5678
9
10
11
12
13
Regulated Wall Cube
or
USB Power Bus
Regulation
Voltage
(VREG)
Regulation
Current
(IREG)
Transition
Threshold
(VPTH)
Precondition
Current
(IPREG)
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
Charge
Voltage
Preconditioning
Mode
Constant-current
Mode
Constant-voltage
Mode
Charge
Current
Termination
Current
(ITERM)
MCP73853/55
DS21915C-page 18 2004-2013 Microchip Technology Inc.
FIGURE 6-3: Typical Charge Profile in Thermal Regulation.
Regulation
Voltage
(VREG)
Regulation
Current
(IREG)
Transition
Threshold
(VPTH)
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
Charge
Voltage
Preconditioning
Mode
Constant-current
Mode
Constant-voltage
Mode
Charge
Current
Precondition
Current
(IPREG)
Termination
Current
(ITERM)
2004-2013 Microchip Technology Inc. DS21915C-page 19
MCP73853/55
6.1 Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost. These
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation
exists when the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
6.1.1 COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended to be a
guide for the component selection process.
6.1.1.1 CURRENT PROGRAMMING RESISTOR
(RPROG)
The preferred fast charge current for Lithium-Ion cells
is at the 1C rate, with an absolute maximum current at
the 2C rate. For example, a 500 mAh battery pack has
a preferred fast charge current of 500 mA. Charging at
this rate provides the shortest charge cycle times
without degradation to the battery pack performance or
life.
400 mA is the typical maximum charge current
obtainable from the MCP7385X devices. For this situa-
tion, the PROG input should be connected directly to
VSS.
6.1.1.2 THERMAL CONSIDERATIONS
The worst-case power dissipation in the battery char-
ger occurs when the input voltage is at its maximum
and the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this case, the power dissipation is:
Where VDDMAX is the maximum input voltage, IREGMAX
is the maximum fast charge current, and VPTHMIN is the
minimum transition threshold voltage. Power
dissipation with a 5V, +/-10% input voltage source is:
With the battery charger mounted on a 1 in2 pad of
1 oz. copper, the junction temperature rise is approxi-
mately 50°C. This allows for a maximum operating
ambient temperature of 35°C before thermal regulation
is entered.
6.1.1.3 EXTERNAL CAPACITORS
The MCP7385X devices are stable with or without a
battery load. To maintain good AC stability in the
Constant-voltage mode, a minimum capacitance of
4.7 µF is recommended to bypass the VBAT pin to VSS.
This capacitance provides compensation when there is
no battery load. In addition, the battery and intercon-
nections appear inductive at high frequencies. These
elements are in the control feedback loop during
Constant-voltage mode. Therefore, the bypass
capacitance may be necessary to compensate for the
inductive nature of the battery pack.
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 4.7 µF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability for up to
the maximum output current.
6.1.1.4 REVERSE BLOCKING PROTECTION
The MCP7385X devices provide protection from a
faulted or shorted input or from a reversed-polarity
input source. Without the protection, a faulted or
shorted input would discharge the battery pack through
the body diode of the internal pass transistor.
6.1.1.5 ENABLE INTERFACE
In the stand-alone configuration, the enable pin is gen-
erally tied to the input voltage. The MCP7385X devices
automatically enter a low power mode when voltage on
the VDD input falls below the UVLO voltage (VSTOP),
reducing the battery drain current to 0.28 µA, typically.
6.1.1.6 CHARGE STATUS INTERFACE
Two status outputs provide information on the state of
charge. The current-limited, open-drain outputs can be
used to illuminate external LEDs. Refer to Table 5-1
and Ta ble 5 - 2 for a summary of the state of the status
output during a charge cycle.
6.2 PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins.
It is recommended that the designer minimizes voltage
drops along the high-current-carrying PCB traces.
If the PCB layout is used as a heat sink, adding many
vias in the heat sink pad helps to conduct more heat to
the PCB backplane, thus reducing the maximum junc-
tion temperature.
PowerDissipation VDDMAX VPTHMIN
–IREGMAX
=
PowerDissipation 5.5 V2.7V–475mA1.33W==
MCP73853/55
DS21915C-page 20 2004-2013 Microchip Technology Inc.
NOTES:
2004-2013 Microchip Technology Inc. DS21915C-page 21
MCP73853/55
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
Legend: XX...X Customer specific information*
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
16-Lead QFN (MCP73853) Example
PIN 1 PIN 1
10-Lead DFN (MCP73855)
(3x3x0.9 mm)
Example
XXXX
YYWW
NNN
PIN 1 PIN 1
73853
I/ML
1139
256
3855
I139
256
MCP73853/55
DS21915C-page 22 2004-2013 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2004-2013 Microchip Technology Inc. DS21915C-page 23
MCP73853/55
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP73853/55
DS21915C-page 24 2004-2013 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2004-2013 Microchip Technology Inc. DS21915C-page 25
MCP73853/55
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D
E
N
2
1
EXPOSED
PAD
D2
E2
2
1
e
b
K
N
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A3
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TOP VIEW BOTTOM VIEW
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
MCP73853/55
DS21915C-page 26 2004-2013 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2004-2013 Microchip Technology Inc. DS21915C-page 27
MCP73853/55
APPENDIX A: REVISION HISTORY
Revision C (April 2013)
Following is the list of modifications:
1. Updated Table 3-1 with the Exposed Pad
information.
2. Minor grammatical and spelling corrections.
Revision B (February 2012)
Following is the list of modifications:
3. Updated Section 7.1 “Package Marking
Information”.
Revision A (November 2004)
• Original Release of this Document.
MCP73853/55
DS21915C-page 28 2004-2013 Microchip Technology Inc.
NOTES:
2004-2013 Microchip Technology Inc. DS21915C-page 29
MCP73853/55
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
MCP73853/55
DS21915C-page 30 2004-2013 Microchip Technology Inc.
NOTES:
2004-2013 Microchip Technology Inc. DS21915C-page 31
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
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Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
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TSHARC, UniWinDriver, WiperLock and ZENA are
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-162-4
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
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QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS21915C-page 32 2004-2013 Microchip Technology Inc.
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Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Worldwide Sales and Service
11/29/11