1/17
L6565
January 2003
QUASI-RESONANT (QR) ZERO-VOLTAGE-
SWITCHING (ZVS) TOPOLOGY
LINE FEED FORWARD TO DELIVER
CONSTANT P OWER vs. MAINS CHANGE
FRE QUEN C Y FO L DB ACK FOR OP TI MU M
STAND BY EFFI CI ENC Y
PULSE-BY-PULSE & HICCUP-MODE OCP
ULTRA-LOW S TART-UP (< 70µA) AND
QUIESCENT CURRENT (< 3.5mA)
DISABLE FUNCTION (ON/OFF CO NTROL)
1% PRECISION (@ Tj = 25°C) INTERNAL
REFERENCE VOLTAGE
±40 0 mA TOTEM POLE GA TE DRIVE R W I TH
UVLO PULL-DOWN
BLUE ANGEL, ENERGY STAR, ENERGY
2000 COMPLIANT
APPLICATIONS
TV/MONITOR SMPS
AC-DC ADAPTERS/CHA R GERS
DIGITAL CONSUMER
PRINTERS, FAX MACHINES,
PHOTOCOPIERS AND SCANNERS
DESCRIPTION
The L6565 is a current-mode primary controller IC,
specifically designed to build offline Quasi-resonant
ZVS (Zero Voltage Switching at switch turn-on) fly-
back converters.
Quasi-resonant operation is achieved by means of a
transformer demagnetization sensing input that trig-
gers MOSFET' s turn-on.
DIP8(Minidip) SO-8
ORDER ING NUMB ERS :
L6565N L6565D
QUASI-RESONANT SMPS CONTROLLER
BLOCK DIAGRAM
+
-
VREF2
VOLTAGE
REGULATOR
INTERNAL
SUPPLY
+
-
2.5V
R1
R2
+-
DRIVER
+
-
ZERO CURRENT
DETECTOR
2.1V
1.6V
VCC8
1
23
4
ZCD
VCC
INV
COMP VFF
CS
GD
7
5
GND
6
20V
40K
5pF
BLANKING
LINE VOLTAGE
FEEDFORWARD
Hiccup-mode
OCP
DISABLE
R
S
Q
STARTER
2 V
+-
Hiccup-mode
OCP
Starter
STOP
Q
UVLO
Blanking
START
L6565
2/17
DESCRIPTION
(continued)
Converter's power capability variations with the mains voltage are compensated by line voltage feedforward.
At light load the device features a special function that automatically lowers the operating frequency still main-
taining the operation as close to ZVS as possible. In addition to very low start-up and quiescent currents, this
feature helps keep low the consumption from the mains at light load and be Blue Angel and Energy Star com-
pliant.
The IC includes also a disable function, an on-chip filter on current sense, an error amplifier with a precise ref-
erence voltage for primary regulation and an effective two-level overcurrent protection.
PIN CONNECTION
(Top view, Minidip and SO8)
PIN DESCRIPTION
Name Function
1 INV Inverting input of the error amplifier. The information on the output voltage is fed into the pin
through either a resistor divider (primary regulation) or an optocoupler (secondary feedback).
This pin can be grounded in some secondary feedback schemes (see pin 2).
2 COMP Output of the error amplifier. Typically, a compensation network is placed between this pin and
the INV pin to a chieve stability and goo d dy namic per forman ce o f the voltage con trol lo op. With
secondar y feedback, the pin can be also driven directly by an optocoupler to control PWM by
modulating the current sunk from the pin (with the INV pin grounded).
3 VFF Line voltage feedforward. The information on the converter’s input voltage is fed into the pin
through a resistor divider and is used to change the setpoint of the pulse-by-pulse current
limitation (the higher the voltage, the lower the setpoint). If this function is not desired the pin will
be grounded and the current limitation setpoint will be maximum.
4 CS Input to the PWM comparator. The primary current is sensed through a resistor, the resulting
voltage is applied to thi s pin and compared with an internal reference to determine MOSFET’s
turn -off. The inter nal reference is clamped at a value, which defin es the pulse-by-pulse current
limitation setpo int, d epen ding on th e voltage at p in VF F. If th e sig nal a t the pin C S exceeds 2 V,
the gate driver will be disabled (Hiccup-mode OCP).
5 ZCD Transformer’s demagnetization sensing input for Quasi-Resonant operation. Alternately,
synchron ization input for an exter nal signal. A nega tive-going edg e triggers MO SFET’s turn-on.
The trig ger circuit is blanked for a mini mum of 3.5 µs af ter MOSFET turn-o ff, for sa fe operation
under short circuit conditions and frequency foldback. If the pin is grounded the IC will be
disabled.
6 GND Ground. Current return for both the signal part of the IC and the gate driver.
7 GD Gate d river output. The totem pole output stage is able to drive power MOSFET s and IGBT’s
with a peak current of 400 mA (source and sink).
8 Vcc Supply Voltage of both the signal part of the IC and the gate driver. An electrolytic capacitor is
connected between this pin and ground. A resistor connected from this pin to the converter’s
input bulk capacitor will be typically used to start up the device.
ZCD
INV
COMP
VFF
CS
Vcc
GD
GND
1
2
3
4
8
7
6
5
3/17
L6565
THERMAL DATA
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter SO8 Minidip Unit
Rth j-amb Max. Thermal Resistance, Junction-to-ambient 150 100 °C/W
Symbol Pin Parameter Value Unit
IVcc 8I
CC + IZ30 mA
IGD 7 Output Totem Pole Peak Current (2 µs) ±700 mA
INV, COMP,
VFF, CS 1, 2, 3 4 Analog Inputs & Outputs -0.3 to 7 V
IZCD 5 Zero Current Detector 50 (source)
-10 (sink) mA
Ptot Power Dissipation @Tamb = 50°C (Minidip)
(SO8) 1
0.65 W
TjJunction Temperature Operating range -40 to 150 °C
Tstg Storage Temperature -55 to 150 °C
ELECTRICAL CHARACTERISTCS
(T
j
= -25 to 125°C, V
CC
= 12V, C
o
= 1nF; unless otherwise specified)
Symbol Parameter Test Condition Min. Typ. Max. Unit
SUPPLY VOLTAGE
Vcc Operating range After turn-on 10.3 18
VCCOn Tur n-on thresh old 12.5 13.5 14 .5 V
VCCOff Tur n-off thresh old 8.7 9.5 10.3 V
Hys Hysteresis 3.65 4 4.3 V
VZZener Voltage Icc = 25 mA 18 20 22 V
SUPPLY CURRENT
Istart-up Start-up Current Before turn-o n, VCC = 12V 45 70 µA
IqQuiescent Current After turn-on 2.3 3.5 mA
ICC Operating Supply Current @ 70 kHz 3.5 5 mA
IqQuiescent Current During Hiccup-mode OCP 1.6 3.5 mA
IqQuiescent Current VZCD < VDIS, VCC>VCCOff 1.4 2.1 mA
LINE FEEDFORWARD
IVFF I nput Bias Curren t VVFF = 0 to 3 V -1 µA
VVFF Operating Range 0 to 3 V
K Gain VVFF = 1.5V, VCOMP = 4V 0.16
ERROR AMPLIFIER
VINV Voltage Feedback Input
Threshold Tamb = 25°C 2.465 2.5 2.535 V
12V < VCC < 18V 2.44 2.56
Line Regulation Vcc = 12 to 18V 2 5 mV
IINV Input Bias Curren t -0.1 - 1 µA
L6565
4/17
GVVoltage Gain Open loop 60 80 dB
GB Gain-B andw idth Produ ct 1 MHz
ICOMP Source Current VCOMP = 4V, VINV = 2.4 V -2 -3.5 -5 mA
Sink Current VCOMP = 4V, VINV = 2.6 V 2.5 4.5 mA
VCOMP Upper Clamp Voltage ISOURCE = 0.5 mA 5 5.5 V
Lower Clamp Voltage ISINK = 0.5 mA 2.25 2.55 V
CURRENT SENSE COMPARATOR
ICS Input Bias Curren t V CS = 0 -0.05 -1 µA
td(H-L) Delay to Ou tput 200 450 ns
VCSx Current Sense Reference Clamp
V
COMP
= Upper clamp, V
VFF
= 0V
1.28 1.4 1.5 V
V
COMP
= Upper clamp , V
VFF
= 1.5V
0.62 0.7 0.78
V
COMP
= Upper clamp , V
VFF
= 3V
00.2
V
CSdis Hiccup-mode OCP level 1.85 2.0 2.2 V
ZERO CURRENT DETECTOR/ SYNCHRONIZATION
VZCDH Upper Clamp Voltage IZCD = 3mA 4.7 5.2 6.1 V
VZCDL Lower Clamp Voltage IZCD = - 3mA 0.3 0.65 1 V
VZCDA Arming Voltage
(positive-going edge) (1) 2.1 V
VZCDT Triggering Voltage
(nega tive-going edge) 1.6 V
IZCDb Input Bias Curren t VZCD = 1 to 4.5 V 2 µA
IZCDsrc Source Current Capability -3 -10 mA
IZCDsnk Sink Current Capability 3 10 mA
VDIS Disable Threshold 150 200 250 mV
IZCDr Restart Current After Disable VZCD < VDIS, Vcc > Vccoff -70 -150 -230 µA
TBLANK Blanking time after pin 7 high-to-
low transition VCOMP 3.2 V 3.5 µs
VCOMP = 2.5 V 18
START TIMER
tSTART Start Timer period 250 400 550 µs
GATE DRIVER
VOL Dropout Voltage IGDsource = 200mA 1.2 2 V
IGDsource = 20mA 0.7 1
VOH IGDsink = 200mA 2 V
IGDsink = 20mA 0.3
tfCurrent Fall Time 40 100 ns
trCurrent Rise Time 40 100 ns
IGDoff IGD sink current Vcc = 4 V, VGD = 1 V 5 10 mA
(1) Parameters guar anteed by design, not tes ted in production.
ELECTRICAL CHARACTERISTCS
(continued)
(T
j
= -25 to 125°C, V
CC
= 12V, C
o
= 1nF; unless otherwise specified)
Symbol Parameter Test Condition Min. Typ. Max. Unit
5/17
L6565
Figure 1. Supply current vs. Supply voltage
Figu re 2. Sta rt -up & U VL O vs. Te m pe ra ture
Figu re 3. Feedbac k ref ere n ce vs. Temperature
Figure 4. Line feedforw ard ch aracteristi cs
Figure 5. Pin 2 (COMP) V-I characteristics
Figure 6. ZCD blanking time vs. C OMP vo ltage
0 5 10 15 20 VCC
(
V
)
0
0.005
0.01
0.05
0.1
0.5
1
5
10
ICC
(mA)
CL = 1nF
f = 70K Hz
TA = 25° C
T (°C)
VCC-ON
(V)
VCC-OFF
(V)
-25 0 25 50 75 100 125
9
10
11
12
13
14
-50 0 50 100
2.46
2.48
2.50
T (°C)
VREF
(V)
D94IN048A
Vcsx [V]
0 0.5 1 1.5 2 2.5 3 3.5
0
0.5
1
1.5
VVFF [V]
VCOMP = 2.5V
3.0 V
3.5 V
4.0 V
4.5 V
5.0 V
Upper clamp
01234
0
1
2
3
4
5
6
Regulation
range
VCOMP [V]
ICOMP [mA]
Tj = 25 °C
Vpi n1 = 0
TBLANK [µs]
23456
0
5
10
15
20
VCOMP [V]
Tj = 25 °C
L6565
6/17
Figure 7. Gate-dr i ve output satu r ation
Figure 8. Gate-dr i ve output satu r ation
Figu re 9. IC consu m pti on v s. te m per ature
Figure 10. Zener voltage at Vcc pin vs. Tj
Figure 11. Start-up timer period vs. Tj
Vpin7 [V]
0 100 200 300 400 500
0
0.5
1
1.5
2
2.5
IGD [mA]
Tj = 25 °C
Vcc = 14.5 V
SINK
Vpin7 [V]
0 100 200 300 400 500
-2.5
-2
-1.5
-1
-0.5
0
IGD [mA]
Tj = 25 °C
Vcc = 14.5 V
SOURCE
Vcc - 0.5
Vcc - 1.0
Vcc - 1.5
Vcc - 2.0
Vcc - 0.5
Vcc - 0.5
Icc [mA]
-50 0 50 100 150
0.02
0.05
0.1
0.2
0.5
1
2
5
Tj [°C]
Quiescent
Before Start-up
Vcc=12V
Vz [V]
-50 0 50 100 150
18
19
20
21
22
Tj [°C]
TSTART [µs]
-50 0 50 100 150
250
300
350
400
450
Tj [°C]
Vcc=12V
7/17
L6565
APPLICATION INFORMATION
Quasi- resonant operation i n offli ne fly back converters lies in s ynchroniz ing MO SFET's turn- on to the transfor m-
er's demagnetization. Detecting the resulting negative-going edge of the voltage across any winding of the
trans former can do this. The L6565 is provid ed with a dedicated pin that allow s doing the job with a very si mple
interface, just one resistor.
Variable frequency operation - as a result of different operating conditions in terms of input voltage and output
current - is inherent in such functionality. The system always works close to the boundary between DCM (Dis-
continuous Conduction Mode) and CCM (Continuous Conduction Mode) operation of the transformer. The op-
eration is then identical to that of the so-called self-oscillating or Ringing Choke Converter (RCC).
Detailed Device Description
Internal Supply Block (see fig. 12)
A linear voltage regulator supplied by V
cc
(pin 8) generates an internal 7V rail used for supplying the entire IC,
except for the gate driver that is supplied directly from Vcc. In addition, a bandgap circuit generates a precis e
internal reference (2.5V±1% @ 25°C) used by the control loop to ensure a good regulation with primary feed-
back technique.
In figure 12 it is also shown the undervoltage lockout (UVLO) comparator with hysteresis used to enable the
chip as long as the Vcc voltage is high enough to ensure a reliable operation.
Figure 12. L6 565 internal sup ply block
+Vin
REF.
UVLO
-
+
8
2.5V
7V bus
LIN.
REG.
Vcc
L6565
8/17
Zero Current Detection and Triggering Block (see fig. 13):
The Zero Current Det ection (ZCD) block sw itches on the extern al MOSFET if a negative-going edge falling be-
low 1.6 V i s ap plied to the input (pin 5, ZCD). H owever, to en sure hig h nois e im munity, the tr igge ring blo ck must
be armed first : prior to falling below 1.6V, the voltage on pin 5 must exper ience a positive-going edge exc eeding
2.1 V.
This feature is typically used to detect transformer demagnetization for QR operation, where the signal for the
ZCD in put is obtai ned from the transfor mer's auxil iar y winding us ed also to s upply the IC. A lternativel y, this can
be used to synchronize MOSFET's turn-on to the negative-going edge of an external clock signal, in case the
device is not required to work in QR mode but as a standard PWM controller in a synchronized system (e.g.
monitor SMPS).
The triggering block is blanked for a certain time after the MOSFET has been turned off. This has two goals:
first, to prevent any negative-going edge that follows leakage inductance demagnetization from triggering the
ZCD circuit erroneously; second, to realize the Frequency Foldback function (see the relevant description).
Figure 13. Zero Current Detection and Triggeri ng Block; Disable and Frequen cy Fold back Blocks
A circuit is needed that turns on the external MOSFET at start-up since no signal is coming from the ZCD pin.
This is realized with an internal starter, which forces the driver to deliver a pulse to the gate of the MOSFET.
To minimize the external interface with the synchronization source (either the auxiliary winding or an external
clock), the voltage at the pin is both top and bottom limited by a double clamp, as illustrated in the internal dia-
gram of the ZCD block of figure 13. The upper clamp is typically located at 5.2 V, while the lower clamp is at
one V
BE
above ground. The i nterface wi ll then be made b y just one res istor that has to l imit the c urrent sour ced
by and sunk from the pin within the rated capability of the internal clamps.
Disable Block (see fig. 13):
The ZCD pin is used also to activate the Disable Block. If the voltage on the pin is taken below 150 mV the de-
vice will be shut down. To do so, it is necessary to override the source capability (10 mA max.) of the internal
lower clamp. While in disabl e, the current consumption of the IC will be reduced. To re- enable device operation,
the pull-down on the pin must be released.
Frequency Foldback Block (see fig. 13):
To prev ent the s witching frequenc y from r eac hing too high val ues, which is a typical drawback of QR operation,
1.6V
2.1V
0.2V
0.3V
DISABLE
5
GD
DRIVER
+
-
5.2V
+Vin
ZCD
PWM
7
150µA
R
SQ
BLANKING
TIME
+
-
2.5V
INVCOMP
E/A
Q
to line
FFWD
L6565
STARTER
+
-
MONO
STABLE
RZCD
starter STOP
blanking
START
9/17
L6565
the L6565 puts a limit on the minimum OFF-time of the switch. This is done by blanking the tr iggering block of
the ZCD circuit as mentioned before. The duration of the blanking time (3.5µs min.) is a function of the error
amplifier output VCOMP, as shown in the diagram of figure 6.
If the load current and the input voltage are such that the switch OFF-time falls below the minimum blanking
time of 3.5µs, the system will enter the " Frequency Fol dback" mo de, a sort of "ringi ng cycl e ski pping" ill ustrated
schematically in figure 14.
Figure 14. Frequency foldback: ringing cycle skipp ing as the load is progressively redu ced
In this mode, uneven switching cycles may be observed under some line/load conditions, due to the fact that
the OFF-time of the MOSFET is allowed to change with discrete steps (2·Tv), while the OFF-time needed for
cycle-by-cycle energy balance may fall in between. Thus one or more longer switching cycles will be compen-
sated by one or more shorter ones and vice versa. However, this mechanism is absolutely normal and there is
no appreciable effect on the performance of the converter or on its output voltage.
t
VDS
TFW
TBLANKmin
TV t
VDS
TBLANK
Pin = Pin'
(limit cond iti on) Pin = Pin'' < Pin' Pin = Pin''' < Pin''
t
VDS
TBLANK
Figure 15. Frequency Foldback: qualitative
frequenc y depen dence on po we r
throughput
Further load reductions involve lower values for
VCOMP, which increases the blanking time. There-
fore, more and more ringing cycles will be skipped.
When the lo ad is low enough , so many ringing cycl es
need to be skipped that their amplitude becomes
very smal l and they can no longer trigger the ZCD cir-
cuit. In that case the internal starter of the IC will be
activated, r esulting in burst-mode operation: a s eries
of few switching cycles spaced out by long periods
where the MOSFET is in OFF state.
Voltage Feedforward block (see fig. 17b):
The power that QR flyback converters with a fixed
overcurrent setpoint (like fixed-frequency systems)
are able to deliver changes with the input voltage
considerably. With wide-range mains, at maximum
line it can be more than twice the value at minimum
line, as shown by the upper curve in the diagram of
figure 16. The L6565 has the Line Feedforward func-
tion available to solve this issue.
Figure 16. Typical power capability change vs.
input voltage in ZVS QR flyback
c onverters
fsw
Pin
00000000
0
00
00000
0
00
00000
0
00
00000
0
00
00000
0
00
00000
00000000
BURST MODE
without freq uency foldback
with frequency fold back
Vin fixe d
Vin
Vinmin
Pinlim @ Vin
Pinlim @ Vinmin
11.522.533.54
0.5
1
1.5
2
2.5
system optimall y
compensated
system not
compensated
L6565
10/17
It acts on the clamp level of the control voltage V
csx
, that is on the overcurrent setpoint, so that it is a function
of the converter's input v oltage sensed through a dedi cated pin (#3, VFF): the hi gher the input voltage, the l ower
the setpoint. This is illustrated in the diagram of figure 17a that shows the relationship between the voltage at
the pin VFF and V
csx
(with the error ampli fier saturated high in the attempt of k eeping output voltage regulation) .
The schematic i n figur e 17b shows also how the function is included i n the control loop. With a proper selec tion
of the external divider R1-R2 it is possible to achieve the optimum compensation described by the lower curve
in the diagram of figure 16.
In applications where this function is not w anted, e.g. bec ause of a na rrow input v oltage range, the VFF pin can
be sim ply gro unded, thus sav ing t he resis tor divider . The overcurr ent setpoint will be then fixed at th e maxi mum
value of about 1.4V (1.5V max.).
Line Feedforward is also beneficial to other characteristics of quasi-resonant converters: it improves their input
ripple rejection ability and limits the variation of the power stage's small-signal gain versus the line voltage.
Figu re 17. a) Ov ercurre nt s et po in t vs. VF F vol ta ge; b) Line Feedf o rwa r d fu nction blo ck
Vcsx [V]
0 0.5 1 1.5 2 2.5 3 3.5
0
0.5
1
1.5
VVFF [V]
VCOMP = Upper clamp
+
-
E/A
4
23
Rs
PWM
VOLTAGE
FEED
FORWARD
+Vin
+
-
2.5V
1DRIVER 7
R1
R2
INV
COMP VFF CS
GD
L6565
2 V
+
-
Hiccup DISABLE
R
S
Q
5
ZCD
STARTER
ZCD
(reset-dominant)
starter STOP
a)
b)
11/17
L6565
Error Amplifier Block (see fig. 17b):
The Error Amplifi er (E /A) inverting input is used i n pri mary feedback technique to compare a parti tion of the volt-
age generated by the auxiliary winding with the internal reference, to achieve converter's output voltage regu-
lation ( s ee "Applica tion Ideas ", fig. 24) . With secondary feedback (typi cally usi ng a TL4 31 at the sec ondary s ide
and an optocoupler to transfer output voltage information to the primary side through the isolation barrier) the
E/A can be used as an inverting level-shifter to achieve negative feedback and shape the loop gain (see "Ap-
plication Ideas", fig. 23).
The E/A output is used typically for control loop compensation, realized with an R C network connected to the
inverting input. With other secondary feedback techniques, the output is driven directly by an emitter-grounded
optocoupler to modulate the duty cycle (the inverting input will be grounded in that case - see figure 23 in "Ap-
plication Ideas").
Current Comparator, PWM Latch and Hiccup-mode OCP (see fig. 17b):
The current c omparator senses the voltage ac ross the curr ent sens e resistor ( Rs) and, by com pari ng it with the
programmi ng signal del ivered by the feedfor war d block, determi nes the exact ti me when the external MOSFET
is to be switched off. The PWM latch avoids spurious switching of the MOSFET, which might result from the
noise generated ("double-pulse suppression").
A comparator senses the voltage on the current sense input and disables the gate dr iver if the vo ltage at the pin
exceeds 2 V . Such anomalous condition i s typic ally gene rated by a short cir cuit on the secondar y rectifier or on
the se condary winding. To re-enable the driver, fir st the IC must be turned off and then can be restarted, that is
the Vcc voltage must fall below the UVLO threshold.
When the gate driver is disabled the quiescent current of the IC is unchanged and, since no energy is coming
from the self-supply circuit, the Vcc capacitor will be discharged below the UVLO threshold after some time.
Then the dev ice w ill initi ate a new start-up cyc le. In case of fai lur e of th e seco ndary diode the resul t ing beh avior
will be a low-frequency intermittent operation (Hiccup-mode operation), with very low stress on the power circuit.
Gate Driver (see fig. 18):
A totem pole buffer, with 400mA source and sink capability, drives the external MOSFET. It is made up of a
high-side NPN Darlington and a low-side MOSFET. In this way there is no need of an external diode clamp to
prevent the voltage at the gate drive output (pin 7, GD) from being pulled too negative.
An internal pull-down circuit holds the output low when the device is in UVLO conditions, to ensure that the ex-
ternal MOSFET cannot be turned on accidentally (e.g. at power-on).
Figure 18. Gate driver with UVLO pull-down
7
6
8
GD
UVLO
GND
DRIVER
Vcc
Q
L6565
L6565
12/17
TYPICAL APPLICATIONS
Figure 19. 50W Wide Range Mains SMPS for 14" TV
Figure 20. 40W Wide Range Mai ns SMPS for inkjet printer
TRANSFORMER SPECS:
CO RE : ETD29x16x 1 0, N6 7 mat eri al or eq uiv al ent
1 mm air gap for a primary inductance of 285 µH
N1: 48 T (24T+24T series co nnect ed), 2xAWG28 (0.37 mm )
N2: 31 T, AWG28
N3: 5 T, AWG28
Naux: 5 T, A WG32 (0.24 mm)
7
4
18
5
3
6
IC1
L6565
105 V
0.35 A
2
B1 2KBP 04M
C1
150 µF
400 V
C2
180 pF
630V
R6 100
C4
47µF
25V
Q1
STP7NB80FI
R8 22
D4
1N4148
R11
0.47
R1
75k
Vin
8 8 to
264 Vac
F1
2A fuse
R2
75k
D1
1N4148
C12
100 µF 25V
R15
1.8 k
C13
100 nF
D3 STT A106
R12
47 k
R13
3.3 k
DZ1
15 V R14
1.5 k
C6 4700pF/ 4KV
R9
4.7M R10
4.7M
C7 4700pF/ 4KV
R18
150 k
R17
4.7 k
C9
220 µF
160 V
P1
100 k
T1
ZCD
GD
CS
Vcc
GNDINV
VFF
COMP +5 V
50 mA
C11
47 µF
25V
IC4
L7805
14 V
1 A
D6
BYW98-100
C10
470 µF
25 V
R3
3 M
R4
16 K
D5
BYT01-400
C3
1 nF
R7 10
C8
8.2 nF
250 V
R5
100 k
IC2 TL431
IC3 PC817
C5
2.2 nF R16
220 k
R20 22 k
D2
1N4148
C22
100 pF
C23
100nF C24
100nF
C25
1nF
C26
1nF
NTC1
16R
L1
15mH
3
1
4
5
8
10
1
2
3
4
3
2
1
12
3
9
C27
220nF
N1
N2
N3
Naux
7
4
85
L6565
10 nF
250V
47µF
STP4NA80FP
STTA106
1N4148
0.39
1/2 W
PC817
2200pF 4KV
2 x 470µF
35V
100 nF
28V / 0. 7A
GND
470µF
16V
BYW100-50
BYW98-100
BYW100-200
12V / 1. 5A
5V / 0. 5A
2 x 100 F
16V
PC817A
TL431
N1
N2
N3
N4N5
6
3.3 nF
1
3
2
47 k
75 k
56 k
2 W
10
3.9 k
5.1 k
270 k
2.7 k
220
16 k
3 M
10 nF
2KBP04M
Vin
88 to
264 Vac
2A fuse
100nF 100nF 1nF
1nF
16R
15mH 75 k
1N4148
TRANSFORMER SPECS:
CORE: ETD29x16x10, 3C85 material or equivalent
1 mm air gap for a primary inductance of 700 µH
N1: 75 T, AWG25 (0.51 mm)
N2: 8 T, AWG25
N3: 7 T, AWG20 (0. 89 mm)
N4: 3 T, AWG25
N5: 7 T, AWG32 (0. 24 mm)
10
13/17
L6565
APPLICATION IDEAS
Here follows a series of ideas/suggestions aimed at either improving performance or solving common applica-
tion issues of L6565-based power supplies.
Fi gure 21 . En hanc ed t urn-off f or big MOSFET' s dr i ve
Figure 22. Latched shutdown on: a) feedback disconnection; b) overload or short circuit
Figure 23. Second ary Feedback loop configurations
7
6
8
GD
GND
DRIVER
Vcc
Q
L6565 Rs
BC327
a)
8
Vcc
L6565
2
COMP
b)
8
Vcc
L6565
2
COMP
BC337
BC327 1N4148
BC337
BC327
1N4148
Vout
TL431
L6565
COMP INV
Vcc
8
12
RA
RB
Vout
TL431
L6565
COMPINV
12
ICOMP
Vout
TL431
L6565
4
CS
1
INV
Vcc
8
Rs
Roff
a) b) c)
L6565
14/17
Figure 24. Pri mary Feed back loop con figurations
a)
Vcc
-
+
GND L6565
E/A
INV
2.5V
COMP
to VFF
block
RH
RL
8
2
1
6
Vcc
-
+
GND L6565
E/A
INV
2.5V
COMP
to VFF
block
RH
RL
8
2
1
6
b)
Figure 25. Protection against secon dary
feedback discon ne ction by primary
regul ation take-over
Figu re 26. Leading edge bl anking ci rcui t for
enhance d primary reg ulatio n
Figure 27. Remote ON/OFF control
Figure 28. Low-consumption start-up circuit
8
Vcc
L6565
INV 1
15 V
2.2 kCOMP
2
Vcc
GND
L6565
1N4148BC327
2.7 k
470 pF
L6565
ZCD
ON
OFF BC337
5
8
6
L6565
CSUPPLY
Vac
R1N4148
+Vin
Vcc
GND
CSTART
1N4148
RELATED DOCUMENTATION
[1] "L6565, QUASI-RESONANT CONTROLLER” (AN1326)
[2] “25W QU ASI-RESONANT FLYBACK CONVERTER FOR SET-TOP B OX APPLI CATIONS USING THE
L6565” (AN1376)
[3] “EVAL6565N, 30W AC-DC ADAPTER WITH THE L6565 QUASI-RESONANT PWM CONTROLLER”
(AN1439).
15/17
L6565
OUTLINE AND
MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 3.32 0.131
a1 0.51 0.020
B 1.15 1.65 0.045 0.065
b 0.356 0.55 0.014 0.022
b1 0.204 0.304 0.008 0.012
D 10.92 0.430
E 7.95 9.75 0.313 0.384
e2.54 0.100
e3 7.62 0.300
e4 7.62 0.300
F 6.6 0.260
I 5.08 0.200
L 3.18 3.81 0.125 0.150
Z 1.52 0.060
Minidip
L6565
16/17
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.069
a1 0.1 0.25 0.004 0.010
a2 1.65 0.065
a3 0.65 0.85 0.026 0.033
b 0.35 0.48 0.014 0.019
b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.020
c1 45° (typ.)
D (1) 4.8 5.0 0.189 0 .197
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 3.81 0.150
F (1) 3.8 4.0 0.15 0.157
L 0.4 1.27 0.016 0.050
M 0.6 0.024
S8° (max.)
(1) D and F do not include mold flash or protrusions. Mold flash or
potrusions shall not exceed 0.15mm (.006inch).
SO8
OUTLINE AND
MECHANICAL DATA
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17/17
L6565