
2 - 3 © 2005 CTS Corporation. All rights reserved. Information subject to change. 4/22/05
CTS Electronic Components, 171 Covington Dr., Bloomingdale IL, 60108 Tel: 630-924-3500 Fax: 630-295-6601 www.ctscorp.com
Mechanical Diagram
Recommended Land Pattern
1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum)
1
.27mm pitch (B6) = 0.64mm/.025 inch (minimum)
Outline of Substrate
PCB Pa d Diamete r
or .006" Thick Solder Paste Stencil, Ap erture Opening Should
be Equal to the PCB Pad Diameter.
Refer to www.ctscorp.com/resistor
F
for Land Pattern Library
KP (Pitch)
LH
W
P (Pitch)
A1 Id en ti fi e r
RT14_ _B_
CTS YRWK
D
1.27mm Pitch L W H P D K Coplanarity
mm 3.81±0.15 3.81±0.15 1.32±0.15 1.27±0.25 0.76±0.05 0.64±0.25 0.15
3 x 3 Array
(8 Bit) inch .150±.006 .150±.006 .052±.006 .050±.010 .030±.002 .025±.010 .006
mm 7.62±0.15 3.81±0.15 1.32±0.15 1.27±0.25 0.76±0.05 0.64±0.25 0.15
3 x 6 Array
(16 Bit) inch .300±.006 .150±.006 .052±.006 .050±.010 .030±.002 .025±.010 .006
mm 15.24±0.15 3.81±0.15 1.32±0.15 1.27±0.25 0.76±0.05 0.64±0.25 0.15
3 x 12 Arr ay
(32 Bit) inch .600±.006 .150±.006 .052±.006 .050±.010 .030±.002 .025±.010 .006
1.00mm Pitch L W H P D K Coplanarity
mm 12.00±0.15 3.00±0.15 1.19±0.15 1.00±0.25 0.64±0.05 0.50±0.25 0.15
3 x 12 Arr ay
(32 Bit) inch .472±.006 .118±.006 .047±.006 .039±.010 .025±.002 .020±.010 .006
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F requency R esponse for 50 ohm Netw ork
Fr eque ncy Per formance (5 0 ohm Netw ork)
Cross Talk Performance (50 oh m Net wor k)
AC
B
H
1nS
250mV
Aggressor D
E
F
I
Aggressor on
Lead A
250mV 1nS
Ri se T im e
Measured
Voltage
(Pe ak to Peak)
Victim B 3.3 mV
Vic tim C 1.9 mV
Vic tim D 1.5 mV
Victim E 1.5 mV
Vic tim F 1.5 mV
Vic tim H 2.1 mV
Victim I 3.3 mV
Aggressor on
Lead B
250mV 1nS
Ri se Time
Measured
Voltage
(Peak to Pe a k)
Victim A 3.2 mV
Victim C 2.7 mV
Victim D 1.8 mV
Victim E 1.4 mV
Victim F 1.5 mV
Victim H 1.5 mV
Victim I 2.0 mV
Solder Mask Dia = Pad
Diameter +.15mm
(.006 inch)