Application Specification
114-1056
Dual In-Line Package (DIP)
Programming Switches
LOC B
1
of 7
E
2006 Tyco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
Tyco is a trademark. *Trademark
Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1-800-722-1111
PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at
www.tycoelectronics.com
(7000 and 7100 Series)
04 MAY 06 Rev B
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2
_
.
Figures and illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of DIP Programming Switches (7000 and 7100
Series). The 7000 Series switches are designed for a life of 7000 cycles per pole. The 7100 Series switches
are recommended for programming applications where the number of cycles is limited to 2000 per pole.
Switches are manually rocker actuated and are designed for wave soldering on printed circuit (pc) boards or
insertion into DIP Sockets with in–row centerline spacing of 7.62 mm (.300 in.). The 7000 series switches are
black, and are available in 2 through 12 positions, while the 7100 series switches are blue, and are available in
2 through 12 positions. Both series are available with a premium seal, an economy seal, or unsealed in the
raised rocker (standard profile) or flush rocker profile (low profile). In addition, the 7000 series switches are
available with a side rocker profile (side actuated). Both series are individual single–pole, single–throw (SPST).
The 7000 series raised rocker profile switches may have ganged rockers for single–pole, double–throw (SPDT)
and double–pole, double–throw (DPDT) make–before–break circuits.
The unsealed switches are designed for socket applications and the sealed switches are designed for soldering
directly to the pc board. The sealants prevent flux and other contaminants from entering the switch during
soldering and cleaning. The raised rocker and side rocker profiles come unsealed or with an optional economy
or premium masking top seal. The flush rocker profile comes unsealed or with an optional economy tape top
seal or premium masking top seal. The multi–pole switches come unsealed only. All switches come standard
with a bottom seal. Switches are designed for use in logic level switching applications.
When corresponding with Tyco Electronics Personnel, use the terminology provided on this specification to
help facilitate your inquiry for information. Basic terms and features of this product line are provided in Figure 1.
Figure 1
Raised Rocker
White Dot Identifies Pin 1
Solder Tail
Housing
Position Number
Flush Rocker
White Dot Identifies Pin 1
Standard Profile Switch
Side Rocker Switch
Low-Profile Switch
NOTE
114-1056
DIP Programming Switches (7000 and 7100 Series)
Rev
B2
of 7
2. REFERENCE MATERIAL
2.1. Revision Summary
S
Updated document to corporate requirements
S
General update to document
S
Deleted premium seal information
2.2. Customer Assistance
Reference Base Product Part Number 435802 and Product Code 4546 identify the DIP Programming Switches
(7000 and 7100 series). Use of these numbers will identify the product line and expedite your inquiries through
a service network established to help you obtain product and tooling information. Such information can be
obtained through a local Tyco Electronics Representative or, after purchase, by calling the Tooling Assistance
Center or the Product Information Center number at the bottom of page 1.
2.3. Drawings
Customer drawings for specific products are available from the service network. The information contained in
the customer drawings takes priority if there is a conflict with this specification or with any other technical
documentation supplied by Tyco Electronics. Contact the Product Information Center number at the bottom of
page 1 if such a conflict is encountered.
2.4. Specifications
Product Specifications 108–7519 (7000 series), and 108–7532 (7100 series) provide performance
requirements for DIP Programming Switches. Qualification Test Report 501–135 (7000 series), and 501–128
(7100 series) provides an independent corporate test report to show the switch conforms to the above
mentioned Product Specifications.
2.5. Instructional Material
Instruction Sheet 408–7779 provides installation information and procedures on DIP Programming Switches
(7000 and 7100 Series).
2.6. Manuals
Manual 402–40 can be used as a guide to soldering. This manual provides information on various flux types
and characteristics with the commercial designation and flux removal procedures. A checklist is included in the
manual as a guide for information on soldering problems.
3. REQUIREMENTS
3.1. Safety
Do not stack product shipping containers so high that the containers buckle or deform.
3.2. Limitations
The switches are designed to operate within a temperature range of –55
_
to 105
_
C [–67
_
to 221
_
F].
3.3. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition of components used in
the switches.
B. Shelf Life
The switches should remain in the shipping containers until ready for use to prevent damage. These
products should be used on a first in, first out basis to avoid storage contamination.
C. Chemical Exposure
Do not store switches near any chemicals listed below, as they may cause stress corrosion cracking in the
components.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
114-1056
DIP Programming Switches (7000 and 7100 Series)
Rev
B 3
of 7
Where the above environmental conditions exist, phosphor-bronze contacts are recommended if available.
3.4. Printed Circuit (PC) Board Requirements
A. Material and Thickness
The pc board material must be glass epoxy (FR–4 or G–10). The pc board thickness shall be 2.36 mm
[.093 in.].
Contact the Product Information Center at the number listed at the bottom of page 1 for suitability of other board
materials and thicknesses.
B. Tolerance
Maximum allowable bow of the pc board must be 0.08 mm [.003 in.] over each 25.4 mm [1.000 in.] of
length.
C. PC Board Layout
The solder tail contact holes in the pc board must be precisely located to ensure proper placement and
optimum performance of the switch. The pc board layout dimensions and tolerances shown in Figure 2
must be observed when preparing pc boards for the various switches. The layout shows the top
(component) side of the board.
Figure 2
2.54 + 0.13
[.100 + .005]
Typ
0.89 + 0.13
[.035 + .005]
Dia Typ
7.62 + 0.13
[.300 + .005]
3.5. PC Board Solder Tail Holes
The holes in the pc board for the solder tails must be drilled and plated through to specific dimensions. See
Figure 3.
Figure 3
Pad Diameter
(As Required)
Copper Thickness (As Required)
(Maximum Hardness of Copper to
be 150 Knoop)
Tin/Lead Thickness
(As Required)
Drilled Hole Diameter
(As Required)
Dia of Finished Hole After Plating
∅
0.89 +0.13 [.035 +.005]
Board Thickness
2.36 [.093]
(Nominal)
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NOTE
NOTE
114-1056
DIP Programming Switches (7000 and 7100 Series)
Rev
B4
of 7
3.6. Mounting Requirements
Determine whether the switch will be soldered directly to the pc board (a sealed switch will be required), or
whether the switch is to be installed in a socket (an unsealed switch can be used).
A. DIP Socket Installation
1. Secure DIP socket to pc board according to instructions packaged with socket.
2. Start one row of contact leads into one row of contact cavities in socket, then rotate switch until it is
parallel with socket.
3. Gripping ends of switch push switch into socket until it is bottomed.
4. Determine which of the circuits are to be closed, then depress the applicable rockers to the ON
position.
5. If installing a protective dust cover, check to be sure there are no obstructions on the switch rockers
or in the protective cover, then slide the cover over the top of the housing.
B. PC Board Installation
1. Make a layout on pc board according to dimensions shown in Figure 2.
2. Hold switch at a slight angle and start one row of contact leads into pc board holes. Do NOT
over–insert. Switch should be rotated until second row of contact leads are aligned with opposite row of
contact holes.
3. Make certain all contact leads have started entry into holes. Grip sides of switch and push switch into
pc board until it is bottomed.
4. To hold switch in place during wave soldering, the four outside leads may be clinched inward at 45
_
.
See Figure 4.
Figure 4
Clinched Solder Tail
(Inward Only)
0.76 [.030] Max
3.7. Soldering
A. Flux Selection
Solder tails must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will
depend on the type of pc board and other components mounted on the board. Additionally, the flux must
be compatible with the wave solder line, manufacturing, health, and safety requirements. Call the
PRODUCT INFORMATION number at the bottom of page 1 for consideration of other types of flux. Flux
types that are compatible with these switches are provided in Figure 5.
114-1056
DIP Programming Switches (7000 and 7100 Series)
Rev
B 5
of 7
CLEANING FLUX
PROCESS STEPS ORGANIC RA (Active) ROSIN RMA (Mildly Active) ROSIN
1 Heat Heat Extra pre-clean
2 Solder Solder Heat
3Wash in tap water or saponifier
D
Wash with saponifier
D
Solder
4 Rinse in tap or de-ionized water Rinse in tap or de-ionized water Wash in saponifier
D
5 Dry in ambient air or radiant heater Dry in ambient or radiant heater Rinse in tap or de-ionized water
6 --- --- Dry in ambient air or radiant heater
D
Reduces residue to soap
Figure 5
B. Solder ing Process
Refer to Paragraph 2.5 for instructional material that is available for establishing soldering guidelines. The
switches can be soldered using wave soldering or equivalent soldering techniques. It is recommended
using SN60 or SN62 solder for these switches. The maximum solder profile temperature should be
245° +10°C [473° +10°F]. These switches are not recommended for reflow process.
C. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Automatic in–line cleaning is
recommended for the sealed switch. Installation in a socket is recommended for the unsealed switch.
Consult with the supplier of the solder and flux for recommended cleaning solvents. Cleaners must be free
of dissolved flux and other contaminants. It is recommended cleaning with the pc board on its edge. If
using an aqueous cleaner, standard equipment such as a soak–tank or an automatic in–line machine
should be used. The following is a list of common cleaning solvents that will not affect the switches for the
time and temperature specified. See Figure 6.
Vapor cleaning (with the pc board on edge) is preferred over submersion in a liquid cleaner. Unsealed switches should
not be submerged due to contaminants in the cleaning bath.
Do NOT ultrasonically clean switches sealed with tape or masking material.
CLEANER TIME TEMPERATURE
NAME TYPE (Minutes) (Maximum)
ALPHA 2110 Aqueous 1 100
_
C [212
_
F]
BIOACT EC-7 Solvent 5 100
_
C [212
_
F]
Butyl CARBITOL Solvent 1 Ambient Room
Isopropyl Alcohol Solvent 5 100
_
C [212
_
F]
KESTER 5778 Aqueous 5 100
_
C [212
_
F]
KESTER 5779 Aqueous 5 100
_
C [212
_
F]
LONCOTERGE 520 Aqueous 5 100
_
C [212
_
F]
LONCOTERGE 530 Aqueous 5 100
_
C [212
_
F]
Terpene Solvent Solvent 5 100
_
C [212
_
F]
Figure 6
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental
effects. Both are carcinogenic (cancer-causing).
NOTE
CAUTION
DANGER
114-1056
DIP Programming Switches (7000 and 7100 Series)
Rev
B6
of 7
If you have a particular solvent that is not listed, contact PRODUCT INFORMATION at the number at the bottom of
page 1.
D. Drying
When drying cleaned unsealed assemblies and pc boards, make certain that the housing temperature
does not exceed 130
_
C [270
_
F]. Excessive temperatures may cause housing degradation. When
processing the economy sealant, make certain that the sealant temperature does not exceed 100
_
C
[212
_
F] for 1 minute. This is a hot melt sealant and will reflow.
3.8. Checking Installed Switches
The solder tail must be through its intended hole in the pc board. Solder fillet must be evenly formed around
each solder tail. The housing of the switch must be seated on the pc board not exceeding the dimension given
in Figure 4.
3.9. Removal and Repair
Damaged or defective switches must NOT be used and should be replaced. The switches must be removed
from the pc board by standard de–soldering methods.
When removing or replacing switches, care must be taken not to damage other pc board components during the
de-soldering process.
4. QUALIFICATIONS
DIP Programming Switches are not required to be agency approved.
5. TOOLING
No tooling is required for manual placement of these switches; however, a pc board support that provides relief
for protruding components must be used to prevent deformation of contact tails. The pc board support must be
custom made. See Figure 7.
Figure 7
PC Board Support
(Customer Supplied)
Holes
(Ref)
Channel
(Ref)
NOTE
CAUTION
114-1056
DIP Programming Switches (7000 and 7100 Series)
Rev
B 7
of 7
6. VISUAL AID
Figure 8 shows a typical application of DIP Programming Switches. This illustration should be used by
production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should
be inspected using the information in the preceding pages of this specification and in the instructional material
shipped with the product or tooling.
FIGURE 8. VISUAL AID
NO CRACKS
IN SOLDER
SWITCH VISUALLY
BOTTOMED ON PC
BOARD
SWITCH BOTTOMED
ON SOCKET
SOLDERED SWITCH
SWITCH HOUSINGS
MUST NOT BE DAMAGED
IN ANY WAY
REMOVABLE SWITCH
