TPS82670SIPR - Texas Instruments - Datasheet.Directory

250

225

200

175

150

125

100

0.1 1 10 100 1000

I - Load Current - mA

Power Loss - mW

Efficiency - %

V = 3.6 V,

V = 1.8 V

Efficiency

PFM/PWM Operation

Power Loss

PFM/PWM Operation

VIN SW

MODE

GND

VOUT

1.8 V @ 600mA

TPS82671SIP

VIN

2.3 V .. 4.8 V

MODE

SELECTION

ENABLE

DC/DC Converter

GND

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION

DATA.

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

TPS8267x 600-mA, High-Efficiency MicroSiP™ Step-Down Converter (Profile <1.0mm)

1 Features

1• 90% Efficiency at 5.5 MHz Operation

• 17μA Quiescent Current

• Wide VIN Range From 2.3 V to 4.8 V

• 5.5MHz Regulated Frequency Operation

• Spread Spectrum, PWM Frequency Dithering

•Best in Class Load and Line Transient

• ±2% Total DC Voltage Accuracy

• Automatic PFM/PWM Mode Switching

• Low Ripple Light-Load PFM Mode

•≥35dB VIN PSRR (1kHz to 10kHz)

• Internal Soft Start, 120-µs Start-Up Time

• Integrated Active Power-Down Sequencing

(Optional)

• Current Overload and Thermal Shutdown

Protection

• Sub 1-mm Profile Solution

• Total Solution Size <6.7 mm2

2 Applications

• Cell Phones, Smart-Phones

• Camera Module, Optical Data Module

• Wearable Electronics

• Digital TV, WLAN, GPS and Bluetooth™

Applications

• POL Applications

3 Description

The TPS8267x device is a complete 600mA, DC/DC

step-down power supply intended for low-power

applications. Included in the package are the

switching regulator, inductor and input/output

capacitors. No additional components are required to

finish the design.

The TPS8267x is based on a high-frequency

synchronous step-down dc-dc converter optimized for

battery-powered portable applications. The

MicroSiP™ DC/DC converter operates at a regulated

5.5-MHz switching frequency and enters the power-

save mode operation at light load currents to maintain

high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing

the quiescent current to 17μA (typ) during light load

operation. For noise-sensitive applications, the device

has PWM spread spectrum capability providing a

lower noise regulated output, as well as low noise at

the input. These features, combined with high PSRR

and AC load regulation performance, make this

device suitable to replace a linear regulator to obtain

better power conversion efficiency.

The TPS8267x is packaged in a compact (2.3mm x

2.9mm) and low profile (1.0mm) BGA package

suitable for automated assembly by standard surface

mount equipment.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

TPS8267x µSIP (8) 2.30 x 2.90 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

4 Simplified Schematic

spacer Efficiency vs Output Current

spacer

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Simplified Schematic............................................. 1

5 Revision History..................................................... 2

6 Device Comparison Table..................................... 4

7 Pin Configuration and Functions......................... 5

8 Specifications......................................................... 5

8.1 Absolute Maximum Ratings ...................................... 5

8.2 ESD Ratings.............................................................. 6

8.3 Recommended Operating Conditions....................... 6

8.4 Thermal Information.................................................. 6

8.5 Electrical Characteristics........................................... 6

8.6 Typical Characteristics.............................................. 8

9 Detailed Description.............................................. 9

9.1 Overview................................................................... 9

9.2 Functional Block Diagram......................................... 9

9.3 Feature Description................................................. 10

9.4 Device Functional Modes........................................ 12

10 Applications and Implementation...................... 13

10.1 Application Information.......................................... 13

10.2 Typical Application ............................................... 13

11 Power Supply Recommendations ..................... 20

12 Layout................................................................... 21

12.1 Layout Guidelines ................................................. 21

12.2 Layout Example .................................................... 21

12.3 Surface Mount Information ................................... 21

13 Device and Documentation Support................. 22

13.1 Documentation Support ........................................ 22

13.2 Related Links ........................................................ 22

13.3 Community Resources.......................................... 22

13.4 Trademarks........................................................... 22

13.5 Electrostatic Discharge Caution............................ 22

13.6 Glossary................................................................ 23

14 Mechanical, Packaging, and Orderable

Information........................................................... 23

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision I (November 2014) to Revision J Page

• Added TPS8267195 part number to data sheet .................................................................................................................... 1

• Added TPS8267195 to Electrical Characteristics table ......................................................................................................... 7

• Changed Layout Example figure, Note 4 value from "...less than 0.5 mm.." to "...less than 0.5 µm.." ............................... 21

Changes from Revision H (October 2014) to Revision I Page

• Moved Tstg spec to Absolute Maximum Ratings table for clarification .................................................................................. 5

• Changed Handling Ratings to ESD Ratings and replaced MIN/MAX values with ± VALUE for clarification ........................ 6

• Added TPS826716 data and removed Product Preview note. .............................................................................................. 7

Changes from Revision G (September 2014) to Revision H Page

• Added TPS826716 to Device Comparison Table as Product Preview. ................................................................................. 4

Changes from Revision F (November 2012) to Revision G Page

• Added Device Information and Handling Rating tables, Feature Description section, Device Functional Modes,

Application and Implementation section, Power Supply Recommendations section, Layout section, Device and

Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1

• Added device TPS826721 ..................................................................................................................................................... 4

Changes from Revision E (October 2012) to Revision F Page

• Added TPS826745 to Header ................................................................................................................................................ 1

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Changes from Revision D (April 2012) to Revision E Page

• Added TPS826765 to Header ................................................................................................................................................ 1

Changes from Revision C (November 2011) to Revision D Page

• Added devices TPS82670, TPS82673, and TPS82674 to Header ....................................................................................... 1

Changes from Revision B (August 2011) to Revision C Page

• Added device TPS82672 to Header info................................................................................................................................ 1

Changes from Revision A (April 2011) to Revision B Page

• Added TPS82676 part number to data sheet header ........................................................................................................... 1

Changes from Original (October 2010) to Revision A Page

• Added devices TPS82677 and TPS82678 to Header info..................................................................................................... 1

• Added copyright attribution for spectrum illustrations........................................................................................................... 11

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com

6 Device Comparison Table

PART NUMBER (1) OUTPUT VOLTAGE DEVICE SPECIFIC FEATURE PACKAGE MARKING

TPS82670 1.86V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage

Output Capacitor Discharge YK

TPS82671 1.8V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage RA

TPS826711 1.8V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage

Output Capacitor Discharge YW

TPS826716 1.6V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage GS

TPS82672 1.5V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage WD

TPS826721 2.1V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage EO

TPS82673 1.26V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage

Output Capacitor Discharge YL

TPS82674 1.2V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage

Output Capacitor Discharge SW

TPS826745 1.225V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage

Output Capacitor Discharge B5

TPS82675 1.2V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage RB

TPS82676 1.1V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage

Output Capacitor Discharge TU

TPS826765 1.05V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage

Output Capacitor Discharge AN

TPS82677 1.2V Output Capacitor Discharge SK

TPS8267195 1.95V PWM Spread Spectrum Modulation

Low PFM Output Ripple Voltage 4A

SIP-8

(TOP VIEW)

SIP-8

(BOTTOMVIEW)

GND

MODE

VOUT

GND

VIN

GND

VIN

GND

VOUT

MODE

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

7 Pin Configuration and Functions

space

Pin Functions

PIN I/O DESCRIPTION

NAME NO.

VOUT A1 O Power output pin. Apply output load between this pin and GND.

VIN A2, A3 I The VIN pins supply current to the TPS8267x internal regulator.

EN B2 I This is the enable pin of the device. Connect this pin to ground to force the converter into

shutdown mode. Pull this pin to VIto enable the device. This pin must not be left floating and

must be terminated.

MODE B1 I

This is the mode selection pin of the device. This pin must not be left floating and must be

terminated.

MODE = LOW: The device is operating in regulated frequency pulse width modulation mode

(PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load

currents.

MODE = HIGH: Low-noise mode is enabled and regulated frequency PWM operation is forced.

GND C1, C2, C3 – Ground pin.

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

(3) Operation above 4.8V input voltage for extended periods may affect device reliability.

(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating temperature (TINT(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (RθJA), as given by the following equation: TA(max)= TJ(max)–(RθJA X PD(max)). To achieve optimum performance, it is

recommended to operate the device with a maximum internal temperature of 105°C.

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

VI(2)

Voltage at VIN(3) –0.3 6 V

Voltage at VIN (TPS826721)(3) -0.3 5.5

Voltage at VOUT –0.3 3.6 V

Voltage at EN, MODE –0.3 VIN + 0.3 V

Power dissipation Internally limited

TAOperating temperature range(4) –40 85 °C

TINT (max) Maximum internal operating temperature 125 °C

Tstg Storage temperature –55 125 °C

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in

to the device.

(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows

safe manufacturing with a standard ESD control process.

(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe

manufacturing with a standard ESD control process.

(4) The machine model is a 200-pF capacitor discharged directly into each pin.

8.2 ESD Ratings VALUE UNIT

VESD(1) Human body model (HBM) ESD stress voltage(2) ±2000 V

Charge device model (CDM) ESD stress voltage(3) ±1000

Machine model (MM) ESD stress voltage(4) ±200 V

(1) Operation above 4.8V input voltage for extended periods may affect device reliability.

(2) In certain applications larger capacitor values can be tolerable, see Output Capacitor Selection section for more details.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT

VIN Input voltage range 2.3 4.8(1) V

IOOutput current range TPS82671 to TPS826765 0 600 mA

Additional output capacitance (PFM/PWM operation)(2)

TPS82670 to TPS82676

TPS826711, TPS826716,

TPS826721, TPS826765,

TPS8267195 0 2.5 µF

TPS82677 0 4 µF

Additional output capacitance (PWM operation)(2) 0 7 µF

TAAmbient temperature –40 +85 °C

TJOperating junction temperature –40 +125 °C

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

8.4 Thermal Information

THERMAL METRIC(1) TPS8267x

UNITSIP

8 PINS

RθJA Junction-to-ambient (top) thermal resistance 125

°C/W

Junction-to-ambient (bottom) thermal resistance 70

RθJCtop Junction-to-case (top) thermal resistance -

RθJB Junction-to-board thermal resistance -

ψJT Junction-to-top characterization parameter -

ψJB Junction-to-board characterization parameter -

RθJCbot Junction-to-case (bottom) thermal resistance -

8.5 Electrical Characteristics

Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA= –40°C to 85°C;

Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT =

1.8V, EN = 1.8V, AUTO mode and TA= 25°C (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SUPPLY CURRENT

IQOperating quiescent current IO= 0mA. Device not switching 17 40 μA

IO= 0mA. PWM operation 5.8 mA

ISD Shutdown current EN = GND 0.5 5 μA

UVLO Undervoltage lockout threshold TPS8267195 only 2.08 2.14 V

all other versions 2.05 2.1

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Electrical Characteristics (continued)

Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA= –40°C to 85°C;

Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT =

1.8V, EN = 1.8V, AUTO mode and TA= 25°C (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

PROTECTION

Thermal shutdown 140 °C

Thermal shutdown hysteresis 10 °C

ILIM Peak Input Current Limit 1100 mA

ISC Input current limit under short-circuit

conditions VOshorted to ground 13.5 mA

ENABLE, MODE

VIH High-level input voltage 1.0 V

VIL Low-level input voltage 0.4 V

Ilkg Input leakage current Input connected to GND or VIN 0.01 1.5 μA

OSCILLATOR

fSW Oscillator frequency IO= 0mA. PWM operation 4.9 5.45 6.0 MHz

OUTPUT

VOUT Regulated DC

output voltage

TPS82670

TPS82671

TPS826711

TPS826716

TPS82672

TPS826721

TPS82673

TPS82674

TPS826745

TPS82675

TPS82676

TPS826765

2.5V ≤VI≤4.8V, 0mA ≤IO≤600 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

2.5V ≤VI≤5.5V, 0mA ≤IO≤600 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

2.5V ≤VI≤5.5V, 0mA ≤IO≤600 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

TPS8267195

2.5V ≤VI≤4.8V, 0mA ≤IO≤600 mA

PFM/PWM operation 0.975×VNOM VNOM 1.035×VNOM V

2.5V ≤VI≤5.5V, 0mA ≤IO≤600 mA

PFM/PWM operation 0.975×VNOM VNOM 1.045×VNOM V

2.5V ≤VI≤5.5V, 0mA ≤IO≤600 mA

PWM operation 0.975×VNOM VNOM 1.025×VNOM V

TPS82677

2.5V ≤VI≤4.8V, 0mA ≤IO≤600 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

2.5V ≤VI≤5.5V, 0mA ≤IO≤600 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

Line regulation VI= VO+ 0.5V (min 2.5V) to 5.5V, IO= 200 mA 0.23 %/V

Load regulation IO= 0mA to 600 mA. PWM operation –0.00085 %/mA

Feedback input resistance 480 kΩ

ΔVOPower-save mode

ripple voltage

TPS82671

TPS826711 IO= 1mA, VO= 1.8V 19 mVPP

TPS826716 IO= 1mA, VO= 1.6V 19 mVPP

TPS826721 IO= 1mA, VO= 2.1V 19 mVPP

TPS82673

TPS82674

TPS826745

TPS82675

IO= 1mA, VO= 1.2V 16 mVPP

TPS82676 IO= 1mA, VO= 1.1V 16 mVPP

TPS826765 IO= 1mA, VO= 1.05V 16 mVPP

TPS82677 IO= 1mA, VO= 1.2V 25 mVPP

Start-up time TPS82671

TPS826711 IO= 0mA, Time from active EN to VO120 μs

rDIS Discharge resistor

for power-down

sequence Devices featuring active discharge 70 150 Ω

0 40

300 m

250 m

200 m

150 m

100 m

50 m

5 n

Spurious Output Noise (PWM Mode) - V

f - Frequency - MHz

Span = 4 MHz

350 m

400 m

450 m

500 m

V = 2.7 V

V = 4.2 V

V = 3.6 V

0.1

0.01

0.001

0.1 1 10 100 1000

f - Frequency - kHz

I = 10 mA (PFM Mode)

OUT

I = 150 mA (PWM Mode)

OUT

Output Spectral Noise Density - HzµV/V

0 10

3.5 m

3 m

2.5 m

2 m

1.5 m

1 m

500 m

50 n

Spurious Output Noise (PFM Mode) - V

f - Frequency - MHz

Span = 1 MHz

5 m

4.5 m

5 m

V = 3.6 V

V = 2.7 V

V = 4.2 V

0.01 0.1 1 10 100 1000

f - Frequency - kHz

PSRR - Power Supply Rejection Ratio - dB

I = 10 mA

PFM Operation

I = 400 mA

PWM Operation

I = 150 mA

PWM Operation

V -InputVoltage-V

I -QuiescentCurrent- A

2.7 3 3.3 3.6 3.9 4.2 4.5 4.8

T =85°C

T =25°C

T =-40°C

5.5

4.5

3.5

2.5

2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5

V - Input Voltage - V

f - Switching Frequency - MHz

I = 150 mA

I = 500 mA

I = 400 mA

I = 300 mA

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

8.6 Typical Characteristics

Figure 1. Quiescent Current vs. Input Voltage

VO= 1.8 V

Figure 2. PWM Switching Frequency vs. Input Voltage

VI= 3.6 V VO= 1.8 V (TPS82671)

Figure 3. Power Supply Rejection Ratio vs. Frequency VO= 1.8 V RL= 150 Ω(TPS82671)

Figure 4. Spurious Output Noise (PFM Mode) vs. Frequency

VO= 1.8 V RL= 12 Ω(TPS82671)

Figure 5. Spurious Output Noise (PWM Mode) vs. Frequency

VI= 3.6 V VO= 1.8 V (TPS82671)

Figure 6. Output Spectral Noise Density vs. Frequency

Gate Driver

Anti-

Shoot Through

Power Save Mode

Feedback Divider

–

Frequency

Control

GND

Soft-Start

EN VIN

Current Limit

Detect

Undervoltage

Lockout

Bias Supply

Bandgap

Thermal

Shutdown

Negative Inductor

Current Detect

VIN

MODE

V = 0.8 V

REF

VREF

1µH

4.7 µF

Switching

VOUT

DC/DC CONVERTER 2.2 µF

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

9 Detailed Description

9.1 Overview

The TPS8267x is a stand-alone, synchronous, step-down converter. The converter operates at a regulated 5.5-

MHz frequency pulse width modulation (PWM) at moderate to heavy load currents. At light load currents, the

TPS8267x converter operates in power-save mode with pulse frequency modulation (PFM).

The converter uses a unique frequency-locked ring-oscillating modulator to achieve best-in-class load and line

response. One key advantage of the non-linear architecture is that there is no traditional feed-back loop. The

loop response to change in VOis essentially instantaneous, which explains the transient response. Although this

type of operation normally results in a switching frequency that varies with input voltage and load current, an

internal frequency lock loop (FLL) holds the switching frequency constant over a large range of operating

conditions.

Combined with best-in-class load and line-transient response characteristics, the low quiescent current of the

device (approximately 17μA) helps to maintain high efficiency at light load while that current preserves a fast

transient response for applications that require tight output regulation.

The TPS8267x integrates an input current limit to protect the device against heavy load or short circuits and

features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages. Fully

functional operation is permitted down to 2.1V input voltage.

9.2 Functional Block Diagram

PFMModeatLightLoad

PFMRipple

PWMModeatHeavyLoad

NominalDCOutputVoltage

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

9.3 Feature Description

9.3.1 Power-Save Mode

If the load current decreases, the converter enters power-save mode automatically. During power-save mode,

the converter operates in discontinuous current, (DCM) single-pulse PFM mode, which produces a low output

ripple compared with other PFM architectures.

When in power-save mode, the converter resumes its operation when the output voltage falls below the nominal

voltage. The converter ramps up the output voltage with a minimum of one pulse and goes into power-save

mode when the output voltage is within its regulation limits.

The IC exits PFM mode and enters PWM mode when the output current can no longer be supported in PFM

mode. As a consequence, the DC output voltage is typically positioned approximately 0.5% above the nominal

output voltage. The transition between PFM and PWM is seamless.

Figure 7. Operation In PFM Mode And Transfer To PWM Mode

9.3.2 Mode Selection

The MODE pin selects the operating mode of the device. Connecting the MODE pin to GND enables the

automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode at

moderate to heavy loads, and operates in PFM mode during light loads. This type of operation maintains high

efficiency over a wide load current range.

Pulling the MODE pin high forces the converter to operate in PWM mode even at light-load currents. The

advantage is that the converter modulates its switching frequency according to a spread spectrum PWM

modulation technique that allows simple filtering of the switching harmonics in noise-sensitive applications. In this

mode, the efficiency is lower when compared to the power-save mode during light loads.

For additional flexibility, it is possible to switch from power-save mode to PWM mode during operation. This type

of operation allows efficient power management by adjusting the operation of the converter to the specific system

requirements.

9.3.3 Spread Spectrum, PWM Frequency Dithering

The goal of spread spectrum architecture is to spread out the emitted RF energy over a larger frequency range

so that any resulting electromagnetic interference (EMI) is similar to white noise. The end result is a spectrum

that is continuous and lower in peak amplitude. Spread spectrum makes it easier to comply with EMI standards.

It also makes it easier to comply with the power supply ripple requirements in cellular and non-cellular wireless

applications. Radio receivers are typically susceptible to narrowband noise that is focused on specific

frequencies.

Switching regulators can be particularly troublesome in applications where electromagnetic interference (EMI) is

a concern. Switching regulators operate on a cycle-by-cycle basis to transfer power to an output. In most cases,

the frequency of operation is either fixed or regulated, based on the output load. This method of conversion

creates large components of noise at the frequency of operation (fundamental) and multiples of the operating

frequency (harmonics).

( ) ( )

m c m

B = 2 1 + m = 2 +

´ ¦ ´ ´ D ¦ ¦

=ƒ

δ ƒ

m = ƒ

( )

hmfB

ffmfB

fmh

mcfm

×+××=

+D×=+××=

)(212

( ) )(212 mcfm ffmfB +D×=+××=

0dBV

0dBVref

FENV,PEAK Dfc Dfc Non-modulatedharmonic

Side-bandharmonics

windowaftermodulation

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Feature Description (continued)

(1) Spectrum illustrations and formulae (Figure 8 and Figure 9) copyright IEEE TRANSACTIONS ON ELECTROMAGNETIC

COMPATIBILITY, VOL. 47, NO.3, AUGUST 2005. See References Section for full citation.

The spread spectrum architecture varies the switching frequency by approximately ±10% of the nominal

switching frequency, thereby significantly reduces the peak radiated and conducting noise on both the input and

output supplies. The frequency dithering scheme is modulated with a triangle profile and a modulation frequency

fm.

Figure 8. Spectrum Of A Frequency Modulated Sin.

Wave With Sinusoidal Variation In Time Figure 9. Spread Bands Of Harmonics In

Modulated Square Signals (1)

Figure 8 and Figure 9 show that after modulation the sideband harmonic is attenuated when compared to the

non-modulated harmonic, and when the harmonic energy is spread into a certain frequency band. The higher the

modulation index (mf) the larger the attenuation.

(1)

With:

fcis the carrier frequency (i.e. nominal switching frequency)

fmis the modulating frequency (approx. 0.016*fc)

δis the modulation ratio (approx 0.1)

(2)

The maximum switching frequency is limited by the process and by the parameter modulation ratio (δ), together

with fm, which is the bandwidth of the side-band harmonics around the carrier frequency fc. The bandwidth of a

frequency modulated waveform is approximately given by the Carson’s rule and can be summarized as:

(3)

fm< RBW: The receiver is not able to distinguish individual side-band harmonics; so, several harmonics are

added in the input filter and the measured value is higher than expected in theoretical calculations.

fm> RBW: The receiver is able to properly measure each individual side-band harmonic separately, so that the

measurements match the theoretical calculations.

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

9.4 Device Functional Modes

9.4.1 Enable

The TPS8267x device starts operation when EN is set high and starts up with the soft start as previously

described. For proper operation, the EN pin must be terminated and must not be left floating.

Pulling the EN pin low forces the device into shutdown. In this mode, all internal circuits are turned off and the

VIN current reduces to the device leakage current, which is typically a few hundred nanoamps.

The TPS8267x device can actively discharge the output capacitor when it turns off. The integrated discharge

resistor has a typical resistance of 100 Ω. The required time to ramp down the output voltage depends on the

load current and the capacitance present at the output node.

9.4.2 Soft Start

The TPS8267x has an internal soft-start circuit that limits the in-rush current during start-up. This circuit limits

input voltage drop when a battery or a high-impedance power source is connected to the input of the MicroSiP™

DC/DC converter.

The soft-start system progressively increases the switching on-time from a minimum pulse-width of 35ns as a

function of the output voltage. This mode of operation continues for approximately 100μs after the enable. If the

output voltage does not reach its target value within the soft-start time, the soft-start transitions to a second mode

of operation.

If the output voltage rises above approximately 0.5V, the converter increases the input current limit and thus

enables the power supply to come up properly. The start-up time mainly depends on the capacitance present at

the output node and the load current.

VIN SW

MODE

GND

TPS8267XSIP

VIN

MODE

SELECTION

ENABLE

DC/DC Converter

GND

VOUT

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

10 Applications and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

10.1 Application Information

The TPS8267x devices are complete power supply modules, not needing further external devices. The devices

are optimized to work best with the components populated. However application conditions might demand for

different input and/or output capacitance values.

10.2 Typical Application

Figure 10. MicroSIP Converter Module Schematic

10.2.1 Design Requirements

For applications requiring additional input and/or output capacitance, the following procedures should be

considered. For the maximum recommended values see Recommended Operating Conditions.

10.2.2 Detailed Design Procedure

10.2.2.1 Input Capacitor Selection

Because of the pulsating input current nature of the buck converter, a low ESR input capacitor is required to

prevent large voltage transients that can cause misbehavior of the device or interference in other circuits in the

system.

For most applications, the input capacitor that is integrated into the TPS8267x should be sufficient. If the

application exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance

to find a remedy.

The TPS8267x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable

inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing

can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance,

additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input of the

converter and the power source lead to reduce ringing that can occur between the inductance of the power

source leads and CI.

10.2.2.2 Output Capacitor Selection

The advanced, fast-response, voltage mode, control scheme of the TPS8267x allows the use of a tiny ceramic

output capacitor (CO). For most applications, the output capacitor integrated in the TPS8267x is sufficient.

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Typical Application (continued)

At nominal load current, the device operates in PWM mode; the overall output voltage ripple is the sum of the

voltage step that is caused by the output capacitor ESL and the ripple current that flows through the output

capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup

during large load transitions.

The TPS8267x is designed as a Point-Of-Load (POL) regulator, to operate stand-alone without requiring any

additional capacitance. Adding a 2.2μF ceramic output capacitor (X7R or X5R dielectric) generally works from a

converter stability point of view, but does not necessarily help to minimize the output ripple voltage.

For best operation (i.e. optimum efficiency over the entire load current range, proper PFM/PWM auto transition),

the TPS8267xSIP requires a minimum output ripple voltage in PFM mode. The typical output voltage ripple is ca.

1% of the nominal output voltage VO. The PFM pulses are time controlled resulting in a PFM output voltage

ripple and PFM frequency that depends (first order) on the capacitance seen at the MicroSiPTM DC/DC

converter's output.

In applications requiring additional output bypass capacitors located close to the load, care should be taken to

ensure proper operation. If the converter exhibits marginal stability or erratic switching frequency, experiment

with additional low value series resistance (e.g. 50 to 100mΩ) in the output path to find a remedy.

Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor

DCR, power-stage rDS(on), PWB DC resistance, load switches rDS(on) …) that are temperature dependant, the

converter small and large signal behavior must be checked over the input voltage range, load current range and

temperature range.

The easiest sanity test is to evaluate, directly at the converter’s output, the following aspects:

• PFM/PWM efficiency

• PFM/PWM and forced PWM load transient response

During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or

ringing that helps judge the converter’s stability. Without any ringing, the loop has usually more than 45° of phase

margin.

100

0.1 1 10 100 1000

V = 3.6 V

Forced PWM Operation

V = 4.2 V

PFM/PWM Operation

V = 3.6 V

PFM/PWM Operation

V = 2.7 V

PFM/PWM Operation

I - Load Current - mA

Efficiency - %

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Typical Application (continued)

10.2.3 Application Curves

VO= 1.95V

Figure 11. Efficiency vs. Load Current

VO= 1.8 V

Figure 12. Efficiency vs. Load Current

VO= 1.2 V

Figure 13. Efficiency vs. Load Current

VO= 1.8 V PFM/PWM Operation

Figure 14. Efficiency vs. Input Voltage

VO= 1.8 V PFM/PWM Operation (TPS82671)

Figure 15. Peak-to-Peak Output Ripple Voltage vs. Load

Current

VO= 1.2 V PFM/PWM Operation (TPS82675)

Figure 16. Peak-to-Peak Output Ripple Voltage vs. Load

Current

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Typical Application (continued)

VO= 1.2 V (TPS82671)

Figure 17. Peak-to-Peak Output Ripple Voltage vs. Load

Current

VO= 1.8 V PFM/PWM Operation (TPS82671)

Figure 18. DC Output Voltage vs. Load Current

VO= 1.2 V (TPS82675)

Figure 19. DC Output Voltage vs. Load Current VO= 1.2 V PFM/PWM Operation (TPS82677)

Figure 20. DC Output Voltage vs. Load Current

VO= 1.8 V MODE = Low (TPS82671)

Figure 21. Combined Line/Load Transient Response

VO= 1.8 V MODE = Low (TPS82671)

Figure 22. Combined Line/Load Transient Response

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Typical Application (continued)

VO= 1.8 V VI= 3.6 V MODE = Low (TPS82671)

Figure 23. Load Transient Response in PFM/PWM

Operation

VO= 1.8 V VI= 3.6 V MODE = Low (TPS82671)

Figure 24. Load Transient Response in PFM/PWM

Operation

VO= 1.8 V VI= 2.7 V MODE = Low (TPS82671)

Figure 25. Load Transient Response in PFM/PWM

Operation

VO= 1.8 V VI= 4.5 V MODE = Low (TPS82671)

Figure 26. Load Transient Response in PFM/PWM

Operation

VO= 1.8 V VI= 3.6 V MODE = Low (TPS82671)

Figure 27. Load Transient Response in PFM/PWM

Operation

VO= 1.8 V VI= 2.7 V MODE = Low (TPS82671)

Figure 28. Load Transient Response in PFM/PWM

Operation

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Typical Application (continued)

VO= 1.8 V VI= 4.5 V MODE = Low (TPS82671)

Figure 29. Load Transient Response in PFM/PWM

Operation

VO= 1.8 V VI= 3.6 V MODE = Low (TPS82671)

Figure 30. AC Load Transient Response

VO= 1.2 V VI= 3.6 V MODE = Low

Figure 31. Load Transient Response in PFM/PWM

Operation

VO= 1.2 V VI= 3.6 V MODE = Low

Figure 32. Load Transient Response in PFM/PWM

Operation

VO= 1.2 V VI= 2.7 V MODE = Low

Figure 33. Load Transient Response in PFM/PWM

Operation

VO= 1.2 V VI= 4.5 V MODE = Low

Figure 34. Load Transient Response in PFM/PWM

Operation

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Typical Application (continued)

VO= 1.2 V VI= 3.6 V MODE = Low

Figure 35. Load Transient Response in PFM/PWM

Operation

VO= 1.2 V VI= 2.7 V MODE = Low

Figure 36. Load Transient Response in PFM/PWM

Operation

VO= 1.2 V VI= 4.5 V MODE = Low (TPS82671)

Figure 37. Load Transient Response in PFM/PWM

Operation

VO= 1.2 V VI= 3.6 V MODE = Low (TPS82671)

Figure 38. AC Load Transient Response

VO= 1.8 V (TPS82671)

Figure 39. PFM/PWM Boundaries

VO= 1.2 V (TPS82674)

Figure 40. PFM/PWM Boundaries

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

Typical Application (continued)

VO= 1.8 V VI= 3.6 V IO= 0 mA

MODE = Low

Figure 41. Start-Up

VO= 1.8 V VI= 3.6 V (TPS82671)

RL= 100 ΩMODE = Low

Figure 42. Start-Up

11 Power Supply Recommendations

The TPS8267X devices are designed to operate from a 2.3-V to 4.8-V input voltage supply. The input power

supply's output current needs to be rated according to the output voltage and the output current of the power rail

application.

Copper Trace Width

Solder Pad Width

Solder Mask Opening

Copper Trace Thickness

Solder Mask Thickness

M0200-01

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

(1) Circuit traces from non-solder-mask defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask

opening. Wider trace widths reduce device stand off and affect reliability.

(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the

intended application.

(3) Recommend solder paste is Type 3 or Type 4.

(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5 µm to avoid a reduction in thermal fatigue

performance.

(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.

(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste

volume control.

12 Layout

12.1 Layout Guidelines

In making the pad size for the µSiP LGA balls, it is recommended that the layout use non-solder-mask defined

(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the

opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiPTM

layout.

12.2 Layout Example

Figure 43. Recommended Land Pattern Image And Dimensions

SOLDER PAD

DEFINITIONS(1)(2)(3)(4) COPPER PAD SOLDER MASK (5)

OPENING COPPER

THICKNESS STENCIL (6)

OPENING STENCIL THICKNESS

Non-solder-mask

defined (NSMD) 0.30mm 0.360mm 1oz max (0.032mm) 0.34mm diameter 0.1mm thick

12.3 Surface Mount Information

The TPS8267x MicroSiP™ DC/DC converter uses an open frame construction that is designed for a fully

automated assembly process and that features a large surface area for pick and place operations. See the "Pick

Area" in the package drawings.

Package height and weight have been kept to a minimum thereby to allow the MicroSiP™ device to be handled

similarly to a 0805 component.

See JEDEC/IPC standard J-STD-20b for reflow recommendations.

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

www.ti.com

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 References

"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE

TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by

Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

TPS82670 Click here Click here Click here Click here Click here

TPS82671 Click here Click here Click here Click here Click here

TPS82672 Click here Click here Click here Click here Click here

TPS82673 Click here Click here Click here Click here Click here

TPS82674 Click here Click here Click here Click here Click here

TPS82675 Click here Click here Click here Click here Click here

TPS82676 Click here Click here Click here Click here Click here

TPS82677 Click here Click here Click here Click here Click here

TPS826711 Click here Click here Click here Click here Click here

TPS826716 Click here Click here Click here Click here Click here

TPS826721 Click here Click here Click here Click here Click here

TPS826745 Click here Click here Click here Click here Click here

TPS826765 Click here Click here Click here Click here Click here

TPS8267195 Click here Click here Click here Click here Click here

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

13.4 Trademarks

MicroSiP, E2E are trademarks of Texas Instruments.

Bluetooth is a trademark of Bluetooth SIG, Inc.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

TPS82670

TPS82671

TPS82672

TPS82673

TPS82674

TPS82675

TPS82676

TPS82677

TPS826711

TPS826716

TPS826721

TPS826745

TPS826765

TPS8267195

www.ti.com

SLVSAI0J –OCTOBER 2010–REVISED MAY 2016

Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677

TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195

13.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 3-Sep-2018

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TPS82670SIPR ACTIVE uSiP SIP 8 3000 RoHS (In

Work) & Green

(In Work)

Call TI Call TI -40 to 85 YK

TXI670

TPS82670SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 YK

TXI670

TPS826711SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 YW

TXI671

TPS826711SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 YW

TXI671

TPS826716SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 GS

(TXI671, TXI6716)

TPS826716SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 GS

(TXI671, TXI6716)

TPS82671SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS

& no Sb/Br) SnAgCu Level-2-260C-1 YEAR -40 to 85 RA

TXI671

TPS82671SIPT ACTIVE uSiP SIP 8 250 Green (RoHS

& no Sb/Br) SnAgCu Level-2-260C-1 YEAR -40 to 85 RA

TXI671

TPS826721SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS

& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 EO

TXI672

TPS826721SIPT ACTIVE uSiP SIP 8 250 Green (RoHS

& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 EO

TXI672

TPS82672SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 WD

TXI672

TPS82672SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 WD

TXI672

TPS82673SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 YL

TXI673

TPS82673SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 YL

TXI673

TPS826745SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 B5

TXI674

TPS826745SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 B5

TXI674

TPS82674SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 SW

PACKAGE OPTION ADDENDUM

www.ti.com 3-Sep-2018

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TXI674

TPS82674SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 SW

TXI674

TPS82675SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 RB

TXI675

TPS82675SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 RB

TXI675

TPS826765SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 AN

TXI676

TPS826765SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 AN

TXI676

TPS82676SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 TU

TXI676

TPS82676SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 TU

TXI676

TPS82677SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 SK

TXI677

TPS82677SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 SK

TXI677

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 3-Sep-2018

Addendum-Page 3

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TPS826721SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 6-May-2018

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS826721SIPR uSiP SIP 8 3000 223.0 194.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 6-May-2018

Pack Materials-Page 2

IMPORTANT NOTICE

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semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers

should obtain the latest relevant information before placing orders and should verify that such information is current and complete.

TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated

circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and

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Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is

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remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have

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Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that

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third party, or a license from TI under the patents or other intellectual property of TI.

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REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO

ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL

PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,

INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF

PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,

DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN

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Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949

and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

TPS82670SIPR TPS82670SIPT