Filter Type SFKB Feedthrough EMI Filter Datasheet (6-32 UNC Thread : 4.4mm Round Head) Circuit Configurations Available Electrical Details Electrical Configuration Capacitance Measurement Current Rating Insulation Resistance (IR) Temperature Rating Ferrite Inductance (Typical) C Filter @ 1000hr Point 10A 10G or 1000F -55oC to +125oC See relevant tables Mechanical Details 6-32 UNC Class 2A Thread Head Diameter Nut A/F Washer Diameter Mounting Torque Mounting Hole Max. Panel Thickness Weight (Typical) Finish 4.4mm (0.173") N/a. For use in tapped hole N/a 0.15Nm (1.32lbf in) max. 6-32 UNC Class 2B N/a 0.8g (0.03oz) Silver plate on copper undercoat C Configuration 100MHz 0.1MHz 0.01MHz Typical Insertion Loss (db) DWV (dc) * SFKBC5000100ZC0 10pF -20% / +80% C0G 500# 750 SFKBC5000150ZC0 15pF -20% / +80% C0G 500# 750 7 SFKBC5000220ZC0 22pF -20% / +80% C0G 500# 750 10 SFKBC5000330ZC0 33pF -20% / +80% C0G 500# 750 * SFKBC5000470ZC0 47pF -20% / +80% C0G 500# 750 1 15 1GHz Rated Voltage (dc) 10MHz Dielectric 1MHz Capacitance 20% UOS Product Code 4 12 * SFKBC5000680MC0 68pF C0G 500# 750 2 18 * SFKBC5000101MC0 100pF C0G 500# 750 4 22 SFKBC5000151MC0 150pF C0G 500# 750 7 25 * SFKBC5000221MC0 220pF C0G 500# 750 10 29 * SFKBC5000331MC0 330pF C0G 500# 750 13 33 * SFKBC5000471MX0 470pF X7R 500# 750 1 16 35 SFKBC5000681MX0 680pF X7R 500# 750 2 19 36 * SFKBC5000102MX0 1.0nF X7R 500# 750 4 23 41 SFKBC5000152MX0 1.5nF X7R 500# 750 7 26 45 * SFKBC5000222MX0 2.2nF X7R 500# 750 10 30 50 SFKBC5000332MX0 3.3nF X7R 500# 750 13 33 52 * SFKBC5000472MX0 4.7nF X7R 500# 750 1 16 36 55 SFKBC5000682MX0 6.8nF X7R 500# 750 2 19 39 57 * SFKBC5000103MX0 10nF X7R 500# 750 4 22 41 60 * SFKBC5000153MX0 15nF X7R 500# 750 7 25 44 62 * SFKBC5000223MX0 22nF X7R 500# 750 10 29 46 65 SFKBC5000333MX0 33nF X7R 500# 750 13 33 48 68 * SFKBC2000473MX0 47nF X7R 200 500 1 16 35 50 70 SFKBC2000683MX0 68.0nF X7R 200 500 2 19 39 54 70 *SFKBC1000104MX0 100nF X7R 100 250 4 22 41 57 70 *SFKBC0500154MX0 150nF X7R 50 125 7 25 45 60 70 # - Also rated for operation at 115Vac 400Hz. Self-heating will occur - evaluation in situ recommended * Recommended values Also available in C0G Syfer Technology Ltd. Old Stoke Road, Arminghall Norwich, Norfolk, NR14 8SQ United Kingdom Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com SFKB Issue 2 (P108893) Release Date 04/03/14 Page 1 of 4 L-C Configuration 0.1MHz 100MHz Typical Insertion Loss (db) 0.01MHz Ferrite Inductance (Typical) - 50nH Rated Voltage (dc) DWV (dc) * SFKBL5000100ZC0 10pF -20% / +80% C0G 500# 750 SFKBL5000150ZC0 15pF -20% / +80% C0G 500# 750 9 SFKBL5000220ZC0 22pF -20% / +80% C0G 500# 750 12 SFKBL5000330ZC0 33pF -20% / +80% C0G 500# 750 1 15 * SFKBL5000470ZC0 47pF -20% / +80% 1MHz 1GHz Dielectric 10MHz Capacitance 20% UOS Product Code 6 C0G 500# 750 2 19 * SFKBL5000680MC0 68pF C0G 500# 750 4 20 * SFKBL5000101MC0 100pF C0G 500# 750 7 24 SFKBL5000151MC0 150pF C0G 500# 750 10 27 * SFKBL5000221MC0 220pF C0G 500# 750 12 30 * SFKBL5000331MC0 330pF C0G 500# 750 1 16 34 * SFKBL5000471MX0 470pF X7R 500# 750 2 19 38 SFKBL5000681MX0 680pF X7R 500# 750 3 22 41 * SFKBL5000102MX0 1.0nF X7R 500# 750 6 25 44 SFKBL5000152MX0 1.5nF X7R 500# 750 9 29 48 * SFKBL5000222MX0 2.2nF X7R 500# 750 12 31 51 SFKBL5000332MX0 3.3nF X7R 500# 750 15 35 54 * SFKBL5000472MX0 4.7nF X7R 500# 750 1 18 39 57 SFKBL5000682MX0 6.8nF X7R 500# 750 2 21 41 60 * SFKBL5000103MX0 10nF X7R 500# 750 4 23 43 63 * SFKBL5000153MX0 15nF X7R 500# 750 7 27 46 66 * SFKBL5000223MX0 22nF X7R 500# 750 10 30 48 68 SFKBL5000333MX0 33nF X7R 500# 750 13 34 50 70 * SFKBL2000473MX0 47nF X7R 200 500 1 17 37 51 >70 SFKBL2000683MX0 68nF X7R 200 500 2 20 40 55 >70 *SFKBL1000104MX0 100nF X7R 100 250 4 22 44 60 >70 *SFKBL0500154MX0 150nF X7R 50 125 7 25 47 62 >70 # - Also rated for operation at 115Vac 400Hz. Self-heating will occur - evaluation in situ recommended * Recommended values Also available in C0G Ordering Information Type Case Style Thread Electrical configuration Voltage (dc) Capacitance in picofarads (pF) Capacitance Tolerance Dielectric Hardware SF K B C 500 0102 M X 0 Syfer Filter 4.4mm 6-32 UNC O.D. C = C Filter L = L-C Filter 050 = 50V 100 = 100V 200 = 200V 500 = 500V First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is the number of zeros following. M = 20% Z = -20+80% C = C0G/NP0 0 = Without X = X7R Examples: 0101 = 100pF 0332 = 3300pF 1 Note : Installation tool available on request Note2: The addition of a 4-digit numerical suffix code can be used to denote changes to the standard part. Options include for example: change of pin length / custom body dimensions or threads / alternative voltage rating / non-standard intermediate capacitance values / test requirements. Please refer specific requests to the factory. Syfer Technology Ltd. SFKB Issue 2 (P108893) Release Date 04/03/14 Page 2 of 4 Surface Mount and Panel Mount Solder-in filters Solder pad layouts are included with the detailed information for each part. Recommended soldering profile E01, E03, E07 SBSP ranges are compatible with all standard solder types including lead-free, maximum temperature 260C. For SBSG, SBSM and SFSS ranges, solder time should be minimised, and the temperature controlled to a maximum of 220C. For SFSR, SFST and SFSU ranges the maximum temperature is 250C. Cooling to ambient temperature should be allowed to occur naturally. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Draughts should be avoided. Forced air cooling can induce thermal breakage, and cleaning with cold fluids immediately after a soldering process may result in cracked filters. Note: The use of FlexiCapTM terminations is strongly recommended to reduce the risk of mechanical cracking. Soldering to axial wire leads Soldering temperature The tip temperature of the iron should not exceed 300C. Dwell time Soldering of filters The soldering process should be controlled such that the filter does not experience any thermal shocks which may induce thermal cracks in the ceramic dielectric. The pre-heat temperature rise of the filter should be kept to around 2C per second. In practice successful temperature rises tend to be in the region of 1.5C to 4C per second dependent upon substrate and components. The introduction of a soak after pre-heat can be useful as it allows temperature uniformity to be established across the substrate thus preventing substrate warping. The magnitude or direction of any warping may change on cooling imposing damaging stresses upon the filter. Dwell time should be 3-5 seconds maximum to minimise the risk of cracking the capacitor due to thermal shock. Heat sink Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. Bending or cropping of wire leads Bending or cropping of the filter terminations should not be carried out within 4mm (0.157") of the epoxy encapsulation, the wire should be supported when cropping. Soldering irons should not be used for mounting surface mount filters as they can result in thermal shock damage to the chip capacitor. A more comprehensive application note covering installation of all Syfer products is available on the Syfer website. Syfer Technology Ltd. SFKB Issue 2 (P108893) Release Date 04/03/14 Page 3 of 4 Resin filled screw mounted EMI filters Grounding General To ensure the proper operation of the filters, the filter body should be adequately grounded to the panel to allow an effective path for the interference. The use of locking adhesives is not recommended, but if used should be applied after the filter has been fitted. The ceramic capacitor, which is the heart of the filter, can be damaged by thermal and mechanical shock, as well as by over-voltage. Care should be taken to minimise the risk of stress when mounting the filter to a panel and when soldering wire to the filter terminations. Mounting to chassis Mounting torque It is important to mount the filter to the bulkhead or panel using the recommended mounting torque, otherwise damage may be caused to the capacitor due to distortion of the case. When a threaded hole is to be utilised, the maximum mounting torque should be 50% of the specified figure which relates to unthreaded holes. For details of torque figures for each filter range, please see below. Torque (max.) Thread Minimum plate thickness Users should be aware that the majority of these filters have an undercut between the thread and the mounting flange of the body, equal to 1.5 x the pitch of the thread. Mounting into a panel thinner than this undercut length may result in problems with thread mating and filter position. It is recommended that a panel thicker than this undercut length be used wherever possible. Maximum plate thickness This is specified for each filter in order that the nut can be fully engaged even when using a washer. Soldering to axial wire leads With nut Into tapped hole - 0.15Nm (1.32lbf in) The tip temperature of the iron should not exceed 300C. 0.25Nm (2.21lbf in) 0.15Nm (1.32lbf in) Dwell time 0.3Nm (2.65lbf in) 0.15Nm (1.32lbf in) Dwell time should be 3-5 seconds maximum to minimise the risk of cracking the capacitor due to thermal shock. 0.35Nm (3.09lbf in) 0.18Nm (1.59lbf in) Heat sink M4 & 8-32 UNC 0.5Nm (4.42lbf in) 0.25Nm (2.21lbf in) M5, 12-32 UNEF & 2BA 0.6Nm (5.31lbf in) 0.3Nm (2.65lbf in) Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. M6 & 1/4-28 UNF 0.9Nm (7.97lbf in) - M2.5 & 4-40 UNC M3 6-32 UNC M3.5 Tools Hexagonal devices should be assembled using a suitable socket. Round bodied filters may be fitted to the panel in one of two ways (and should not be fitted using pliers or other similar tools which may damage them): Round bodies with slotted tops are designed to be screwed in using a simple purpose-designed tool. Round bodies without slotted tops are intended to be inserted into slotted holes and retained with a nut. Syfer Technology Ltd. Soldering temperature Bending or cropping of wire leads Bending or cropping of the filter terminations should not be carried out within 4mm (0.157") of the epoxy encapsulation, the wire should be supported when cropping. RoHS compliance All surface mount filters, resin sealed panel mount filters and power filters are fully RoHS compliant through material exemption, although care must be taken not to exceed the maximum soldering temperatures of surface mount parts. Standard hermetic sealed panel mount filters use SnPb solders as part of their assembly, and are intended for exempt applications such as aerospace or military. Substitution of the SnPb solder with Pb free solders is possible to create a RoHS compliant part - please contact factory for further details. SFKB Issue 2 (P108893) Release Date 04/03/14 Page 4 of 4 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Syfer: SFKBC5000102MX0 SFKBC0500473MX0 SFKBC2000683MX0 SFKBC5000100SC0 SFKBC5000100ZC0 SFKBC5000223MX0 SFKBC5000682MX0 SFKBL0500154MX0 SFKBL5000101MC0 SFKBL5000103MX0 SFKBL5000223MX0