BZT585B2V4T - BZT585B43T
Document number: DS36638 Rev. 5 - 2
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BZT585B2V4T - BZT585B43T
SURFACE MOUNT PRECISION ZENER DIODE
Features
±2.0% Tolerance on Breakdown Voltage
Small, Low Profile Surface Mount Package
Flat Lead Package Design for Low Profile and High Power
Dissipation
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOD523
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Band
Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
Ordering Information (Note 4)
Part Number Case Packaging
(Type Number)-7* (Note 4) SOD523 3000/Tape & Reel
*Add “-7” to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener = BZT585B6V2T-7.
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Top View
e3
xx = Product Type Marking Code
(See Electrical Characteristics Table)
xx
BZT585B2V4T - BZT585B43T
Document number: DS36638 Rev. 5 - 2
2 of 4
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March 2014
© Diodes Incorporated
BZT585B2V4T - BZT585B43T
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol
V
alue Unit
Forward Voltage @ IF = 10mA
@ IF = 100mA VF 0.9
1.1 V
Continuous Forward Current IF 200 mA
Thermal Characteristics
Characteristic Symbol
V
alue Unit
Power Dissipation (Note 5) PD 350 mW
Thermal Resistance, Junction to Ambient Air (Note 5) RθJA 357 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C
Note: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can
be found on our website at http://www.diodes.com.
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Type
Number
Marking
Codes
Zener Voltage Range
(Note 6)
Maximum Zener
Impedance (Note 7)
Temperature
Coefficient Total Capacitance
Maximum
Reverse
Current
(Note 6)
VZ @ IZT I
ZT
ZZT @
IZT
ZZK @
IZ
K
IZK TC @ IZT CT @ f = 1MHz,
VR = 0V IR @ VR
Nom (V) Min (V) Max (V) mA Ω mA Typical
(mV/°C)
Max
(pF) µA V
BZT585B2V4T 3C 2.4 2.35 2.45 5 100 400 1 -1.3 450 50 1
BZT585B2V7T 3E 2.7 2.65 2.75 5 100 450 1 -1.4 440 20 1
BZT585B3V3T 3H 3.3 3.23 3.37 5 95 500 1 -1.8 410 5 1
BZT585B3V6T 3J 3.6 3.53 3.67 5 90 500 1 -1.9 390 5 1
BZT585B3V9T 3K 3.9 3.82 3.98 5 90 500 1 -1.9 370 3 1
BZT585B4V3T 3L 4.3 4.21 4.39 5 90 600 1 -1.7 350 3 1
BZT585B4V7T 3M 4.7 4.61 4.79 5 80 500 1 -1.2 325 3 2
BZT585B5V1T 3N 5.1 5.00 5.20 5 60 480 1 -0.5 300 2 2
BZT585B5V6T 3P 5.6 5.49 5.71 5 40 400 1 1.0 275 1 2
BZT585B6V2T 3S 6.2 6.08 6.32 5 10 150 1 2.2 250 3 4
BZT585B6V8T 3T 6.8 6.66 6.94 5 15 80 1 3.0 215 2 4
BZT585B7V5T 3U 7.5 7.35 7.65 5 10 80 1 3.8 170 1 5
BZT585B8V2T 3V 8.2 8.04 8.36 5 10 80 1 4.7 150 0.7 5
BZT585B9V1T 3X 9.1 8.92 9.28 5 10 100 1 5.8 120 0.5 6
BZT585B10T 3Y 10 9.80 10.20 5 10 150 1 7.0 110 0.2 7
BZT585B11T 3Z 11 10.78 11.22 5 10 150 1 8.2 110 0.1 8
BZT585B12T 4A 12 11.76 12.24 5 10 150 1 9.5 105 0.1 8
BZT585B13T 4B 13 12.74 13.26 5 10 170 1 10.7 105 0.1 8
BZT585B15T 4D 15 14.70 15.30 5 15 200 1 13.2 100 0.05 10.5
BZT585B16T 4E 16 15.68 16.32 5 40 200 1 14.4 90 0.05 11.2
BZT585B18T 4F 18 17.64 18.36 5 45 225 1 16.9 80 0.05 12.6
BZT585B20T 4G 20 19.60 20.40 5 55 225 1 19.4 70 0.05 14.0
BZT585B22T 4H 22 21.56 22.44 5 55 250 1 21.9 60 0.05 15.4
BZT585B24T 4J 24 23.52 24.48 5 70 250 1 24.4 55 0.05 16.8
BZT585B27T 4K 27 26.46 27.54 2 80 300 0.5 25.4 50 0.05 18.9
BZT585B30T 4M 30 29.40 30.60 2 80 300 0.5 31.1 50 0.05 21.0
BZT585B33T 4N 33 32.34 33.66 2 80 325 0.5 36.7 45 0.05 23.1
BZT585B36T 4P 36 35.28 36.72 2 90 350 0.5 42.4 45 0.05 25.2
BZT585B39T 4R 39 38.22 39.78 2 130 350 0.5 48.1 45 0.05 27.3
BZT585B43T 4S 43 42.14 43.86 2 150 375 0.5 55.7 40 0.05 30.1
Notes: 6. Short duration pulse test used to minimize self-heating effect.
7. f = 1kHz.
BZT585B2V4T - BZT585B43T
Document number: DS36638 Rev. 5 - 2
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March 2014
© Diodes Incorporated
BZT585B2V4T - BZT585B43T
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
25
050 75 100 125 150
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (W)
D
Note 5
0
0.1
0.2
0.3
0.4
T , AMBIENT TEMPERATURE ( C)
Figure 1 Power Derating Curve
A
°
0.1
1
10
100
1000
200 400 600 800 1000 1200 1400 1600
V , INSTANTANEOUS FORWARD VOLTAGE(mV)
Figure 2 Typical Forward Characteristics
F
I , INS
T
AN
T
ANE
O
U
S F
O
R
WA
R
D
F
C
U
R
R
EN
T
(mA)
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
T = -55°C
A
0
10
20
30
40
50
012345678910
I, ZE
N
E
R
C
U
R
R
E
N
T
(mA)
Z
V , ZENER VOLTAGE (V)
Figure 3 Typical Zener Breakdown Characteristics
Z
T = 25°C
J
2V7
6V2
2V4
11 12
10
0
10
20
30
I, ZENE
R
C
U
R
R
EN
T
(mA)
Z
V , ZENER VOLTAGE (V)
Figure 4 Typical Zener Breakdown Characteristics
Z
10 20 30 40 50
20 39
43
30
33
36
22
24
27
15
T = 25°C
J
SOD523
Dim Min Max
A 0.25 0.35
B 0.70 0.90
C 1.50 1.70
H 1.10 1.30
K 0.55 0.65
L 0.10 0.30
M 0.10 0.12
All Dimensions in mm
H
C
A
BK
M
L
BZT585B2V4T - BZT585B43T
Document number: DS36638 Rev. 5 - 2
4 of 4
www.diodes.com
March 2014
© Diodes Incorporated
BZT585B2V4T - BZT585B43T
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
Dimensions Value (in mm)
G 0.80
X 0.60
X1 2.00
Y 0.70
X1
Y
X
G