INTEGRATED CIRCUITS AU5790 Single wire CAN transceiver Product data Supersedes data of 2001 Jan 31 IC18 Data Handbook 2001 May 18 Philips Semiconductors Product data Single wire CAN transceiver AU5790 FEATURES DESCRIPTION * Supports in-vehicle class B multiplexing via a single bus line with The AU5790 is a line transceiver, primarily intended for in-vehicle multiplex applications. The device provides an interface between a CAN data link controller and a single wire physical bus line. The achievable bus speed is primarily a function of the network time constant and bit timing, e.g., up to 33.3 kbps with a network including 32 bus nodes. The AU5790 provides advanced sleep/wake-up functions to minimize power consumption when a vehicle is parked, while offering the desired control functions of the network at the same time. Fast transfer of larger blocks of data is supported using the high-speed data transmission mode. ground return * 33 kbps CAN bus speed with loading as per J2411 * 83 kbps high-speed transmission mode * Low RFI due to output waveshaping * Direct battery operation with protection against load dump, jump start and transients * Bus terminal protected against short-circuits and transients in the automotive environment * Built-in loss of ground protection * Thermal overload protection * Supports communication between control units even when network in low-power state * 70 A typical power consumption in sleep mode * 8- and 14-pin small outline packages * 8 kV ESD protection on bus and battery pins QUICK REFERENCE DATA SYMBOL PARAMETER VBAT Operating supply voltage Tamb Operating ambient temperature range VBATld Battery voltage VCANHN Bus output voltage VT tTrN CONDITIONS MIN. 5.3 TYP. 13 MAX. UNIT 27 V +125 C +40 V 3.65 4.55 V Bus input threshold 1.8 2.2 V Bus output delay, rising edge 3 6.3 s tTfN Bus output delay, falling edge 3 9 s tDN Bus input delay 0.3 1 s IBATS Sleep mode supply current 100 A -40 load dump; 1s 70 ORDERING INFORMATION DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG # SO8: 8-pin plastic small outline package -40 C to +125 C AU5790D SOT96-1 SO14: 14-pin plastic small outline package -40 C to +125 C AU5790D14 SOT108-1 2001 May 18 2 853-2237 26343 Philips Semiconductors Product data Single wire CAN transceiver AU5790 BLOCK DIAGRAM BATTERY (+12V) BAT 1 VOLTAGE TEMP. REFERENCE PROTECTION TxD NSTB OUTPUT BUFFER 7 CANH (BUS) 3 (Mode 0) MODE BUS RECEIVER CONTROL 6 EN (Mode 1) RT RxD 5 4 LOSS OF GROUND PROTECTION RTH (LOAD) AU5790 8 GND SL01199 Figure 1. 2001 May 18 Block Diagram 3 Philips Semiconductors Product data Single wire CAN transceiver AU5790 SO8 PIN CONFIGURATION TxD 1 NSTB (Mode 0) 2 SO14 PIN CONFIGURATION 8 GND 7 CANH (BUS) 6 RTH (Load) 5 BAT GND 1 14 GND TxD 2 13 N.C. NSTB (Mode 0) 3 12 CANH (BUS) EN (Mode 1) 4 11 RTH (Load) RxD 5 10 BAT N.C. 6 9 N.C. GND 7 8 GND AU5790 EN (Mode 1) 3 RxD 4 AU5790 SO8 SL01198 SO14 SO8 PIN DESCRIPTION SYMBOL PIN DESCRIPTION TxD 1 Transmit data input: high = transmitter passive; low = transmitter active NSTB (Mode 0) 2 Stand-by control: high = normal and high-speed mode; low = sleep and wake-up mode EN (Mode 1) 3 Enable control: high = normal and wake-up mode; low = sleep and high-speed mode RxD 4 Receive data output: low = active bus condition detected; float/high = passive bus condition detected BAT 5 Battery supply input (12 V nom.) RTH (LOAD) 6 Switched ground pin: pulls the load to ground, except in case the module ground is disconnected CANH (BUS) 7 Bus line transmit input/output GND 8 Ground SL01251 SO14 PIN DESCRIPTION SYMBOL PIN DESCRIPTION GND 1 Ground TxD 2 Transmit data input: high = transmitter passive; low = transmitter active NSTB (Mode 0) 3 Stand-by control: high = normal and high-speed mode; low = sleep and wake-up mode EN (Mode 1) 4 Enable control: high = normal and wake-up mode; low = sleep and high-speed mode RxD 5 Receive data output: low = active bus condition detected; float/high = passive bus condition detected N.C. 6 No connection GND 7 Ground GND 8 Ground N.C. 9 No connection BAT 10 Battery supply input (12 V nom.) RTH 11 Switched ground pin: pulls the load to ground, except in case the module ground is disconnected 12 Bus line transmit input/output N.C. 13 No connection GND 14 Ground (LOAD) CANH (BUS) 2001 May 18 4 Philips Semiconductors Product data Single wire CAN transceiver AU5790 of signal edges on the bus line. If such edges are detected, this will be signalled to the CAN controller via the RxD output. Normal transmission mode will be entered again upon a high level being applied to the NSTB and EN control inputs. These signals are typically being provided by a controller device. FUNCTIONAL DESCRIPTION The AU5790 is an integrated line transceiver IC that interfaces a CAN protocol controller to the vehicle's multiplexed bus line. It is primarily intended for automotive "Class B" multiplexing applications in passenger cars using a single wire bus line with ground return. The achievable bit rate is primarily a function of the network time constant and the bit timing parameters. For example, the maximum bus speed is 33 kpbs with bus loading as specified in J2411 for a full 32 node bus, while 41.6 kbps at is possible with modified bus loading. The AU5790 also supports low-power sleep mode to help meet ignition-off current draw requirements. Sleeping bus nodes will generally ignore normal communication on the bus. They should be activated using the dedicated wake-up mode. When NSTB is low and EN is high the AU5790 enters wake-up mode i.e. it sends data with an increased signal level. This will result in an activation of other bus nodes being attached to the network. The protocol controller feeds the transmit data stream to the transceiver's TxD input. The AU5790 transceiver converts the TxD data input to a bus signal with controlled slew rate and waveshaping to minimize emissions. The bus output signal is transmitted via the CANH in/output, connected to the physical bus line. If TxD is low, then a typical voltage of 4 V is output at the CANH pin. If TxD is high then the CANH output is pulled passive low via the local bus load resistance RT. To provide protection against a disconnection of the module ground, the resistor RT is connected to the RTH pin of the AU5790. By providing this switched ground pin, no current can flow from the floating module ground to the bus. The bus receiver detects the data stream on the bus line. The data signal is output at the RxD pin being connected to a CAN controller. The AU5790 provides appropriate filtering to ensure low susceptibility against electromagnetic interference. Further enhancement is possible with applying an external capacitor between CANH and ground potential. The device features low bus output leakage current at power supply failure situations. The AU5790 also provides a high-speed transmission mode supporting bit rates up to 100 kbps. If the NSTB input is pulled high and the EN input is low, then the internal waveshaping function is disabled, i.e. the bus driver is turned on and off as fast as possible to support high-speed transmission of data. Consequently, the EMC performance is degraded in this mode compared to the normal transmission mode. In high-speed transmission mode the AU5790 supports the same bus signal level as specified for the CANH output in normal mode. The AU5790 features special robustness at its BAT and CANH pins. Hence the device is well suited for applications in the automotive environment. The BAT input is protected against 40 V load dump and jump start condition. The CANH output is protected against wiring fault conditions, e.g., short circuit to ground or battery voltage, as well as typical automotive transients. In addition, an over-temperature shutdown function with hysteresis is incorporated protecting the device under system fault conditions. In case of the chip temperature reaching the trip point, the AU5790 will latch-off the transmit function. The transmit function is available again after a small decrease of the chip temperature. The AU5790 contains a power-on reset circuit. For Vbat < 2.5 V, the CANH output drive will be turned off, the output will be passive, and RxD will be high. For 2.5 V < Vbat < 5.3 V, the CANH output drive may operate normally or be turned off. If the NSTB and EN control inputs are pulled low or floating, the AU5790 enters a low-power or "sleep" mode. This mode is dedicated to minimizing ignition-off current drain, to enhance system efficiency. In sleep mode, the bus transmit function is disabled, e.g. the CANH output is inactive even when TxD is pulled low. An internal network active detector monitors the bus for any occurrence Table 1. Control Input Summary NSTB EN 0 0 Don't Care TxD Sleep mode Description 0V CANH float (high) RxD 0 1 Tx-data Wake-up transmission mode 0 V, 12 V bus state1 1 0 Tx-data High-speed transmission mode 0 V, 4 V bus state1 1 1 Tx-data Normal transmission mode 0 V, 4 V bus state1 NOTE: 1. RxD outputs the bus state. If the bus level is below the receiver threshold (i.e., all transmitters passive), then RxD will be floating (i.e., high, considering external pull-up resistance). Otherwise, if the bus level is above the receiver threshold (i.e., at least one transmitter is active), then RxD will be low. 2001 May 18 5 Philips Semiconductors Product data Single wire CAN transceiver AU5790 ABSOLUTE MAXIMUM RATINGS According to the IEC 134 Absolute Maximum System: operation is not guaranteed under these conditions; all voltages are referenced to pin 8 (GND); positive currents flow into the IC, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT -0.3 +27 V VBAT Supply voltage Steady state VBATld Short-term supply voltage Load dump; ISO7637/1 test pulse 5 (SAE J1113, test pulse 5), T < 1s +40 V VBATtr2 Transient supply voltage ISO 7637/1 test pulse 2 (SAE J1113, test pulse 2), with series diode and bypass cap of 100 nF between BAT and GND pins, Note 2. +100 V VBATtr3 Transient supply voltage ISO 7637/1 pulses 3a and 3b (SAE J1113 test pulse 3a and 3b), Note 2. -150 +100 V VCANH_1 CANH voltage VBAT > 2 V -10 +18 V VCANH_0 CANH voltage VBAT < 2 V -16 +18 V VCANHtr1 Transient bus voltage ISO 7637/1 test pulse 1, Notes 1 and 2 -100 VCANHtr2 Transient bus voltage ISO 7637/1 test pulse 2, Notes 1 and 2 VCANHtr3 Transient bus voltage ISO 7637/1 test pulses 3a, 3b, Notes 1 and 2 VRTH1 Pin RTH voltage VRTH0 Pin RTH voltage VI DC voltage on pins TxD, EN, RxD, NSTB ESDBAHB ESD capability of pin BAT ESDCHHB V +100 V -150 +100 V VBAT > 2 V, voltage applied to pin RTH via a 2 k series resistor -10 +18 V VBAT < 2 V, voltage applied to pin RTH via a 2 k series resistor -16 +18 V -0.3 +7 V Direct contact discharge, R=1.5 k, C=100 pF -8 +8 kV ESD capability of pin CANH Direct contact discharge, R=1.5 k, C=100 pF -8 +8 kV ESDRTHB ESD capability of pin RTH Direct contact discharge, R=1.5 k + 3 k, C=100 pF -8 +8 kV ESDLGHB ESD capability of pins TxD, NSTB, EN, RxD, and RTH Direct contact discharge, R=1.5 k , C=100 pF -2 +2 kV RTmin Bus load resistance RT being connected to pin RTH Tamb Operating ambient temperature -40 +125 C Tstg Storage temperature -40 +150 C Tvj Junction temperature -40 +150 C 2 NOTES: 1. Test pulses are coupled to CANH through a series capacitance of 1 nF. 2. Rise time for test pulse 1: tr < 1 s; pulse 2: tr < 100 ns; pulses 3a/3b: tr < 5 ns. 2001 May 18 6 k Philips Semiconductors Product data Single wire CAN transceiver AU5790 DC CHARACTERISTICS -40 C < Tamb < +125 C; 5.5 V < VBAT < 16 V; -0.3 V < VTxD < 5.5 V; -0.3 V < VNSTB < 5.5 V; -0.3 V < VEN < 5.5 V; -0.3 V < VRxD < 5.5 V; -1 V < VCANH < +16 V; bus load resistor at pin RTH: 2 k < RT < 9.2 k; total bus load resistance 270 < RL < 9.2 k; CL < 13.7 nF; 1s < RL CL < 4s; RxD pull-up resistor 2.2 k < Rd < 3.0 k; RxD: loaded with CLR < 30pF to GND; all voltages are referenced to pin 8 (GND); positive currents flow into the IC; typical values reflect the approximate average value at VBAT = 13 V and Tamb = 25 C, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 13 27 V 5.3 V 2.5 V Pin BAT VBAT Operating supply voltage Note 1 5.3 VBATL Low battery state Part functional or in undervoltage lockout state 2.5 VBATLO Supply undervoltage lockout state TxD = 1 or 0; check CANH and RxD are floating IBATPN Passive state supply current in normal mode NSTB = 5 V, EN = 5 V, TxD = 5 V 2 mA IBATPW Passive state supply current in wake-up mode NSTB = 0 V, EN = 5 V, TxD = 5 V, Note 2 3 mA IBATPH Passive state supply current in high speed mode NSTB = 5 V, EN = 0 V, TxD = 5 V, Note 2 4 mA IBATN Active state supply current in normal mode NSTB = 5 V, EN = 5 V, TxD = 0 V, RL = 270 , Tamb = 125 C 35 mA Tamb = 25 C, -40 C 40 mA NSTB = 0 V, EN = 5 V, TxD = 0 V, RL = 270 , Note 2, Tamb = 125 C 70 mA Tamb = 25 C, -40 C, Note 2 90 mA NSTB = 5 V, EN = 0 V, TxD = 0 V, RL = 100 , Note 2, Tamb = 125 C 70 mA Tamb = 25 C, -40 C, Note 2 85 mA 70 100 A 4.1 4.55 V IBATW Active state supply current in wake-up mode IBATH Active state supply current in high speed mode IBATS Sleep mode supply current NSTB = 0 V, EN = 0 V, TxD = 5 V, RxD = 5 V, -1 V < VCANH < +1 V, 5.5 V < VBAT < 14 V -40 C < Tj < 125 C VCANHN Bus output voltage in normal mode NSTB = 5 V, EN = 5 V, RL > 270; 5.5 V < VBAT < 27 V 3.65 VCANHW Bus output voltage in wake-up mode NSTB = 0 V, EN = 5 V, RL > 270; 11.3 V < VBAT < 16 V 9.80 min (VBAT, 13) V VCANHWL Bus output voltage in wake-up mode, low battery NSTB = 0 V, EN = 5 V, RL > 270; 5.5 V < VBAT < 11.3 V VBAT - 1.45 VBAT V VCANHH Bus output voltage in high-speed transmission mode NSTB = 5 V, EN = 0 V, RL > 100; 8 V < VBAT < 16 V 3.65 4.55 V ICANHRR Recessive state output current, bus recessive Recessive state or sleep mode, VCANH = -1 V; 0 V < VBAT < 27 V -10 10 A ICANHRD Recessive state output current, bus dominant Recessive state or sleep mode, VCANH = 10 V; 0 V < VBAT < 16 V -20 100 A ICANHDD Dominant state output current, bus dominant TxD = 0 V, normal mode, high-speed mode and sleep mode; VCANH = 10 V; 0 V < VBAT < 16 V -20 100 A -ICANH_N Bus short circuit current, normal mode VCANH = -1 V, TxD = 0 V; NSTB = 5 V; EN = 5 V 30 150 mA -ICANHW Bus short circuit current, wake-up mode VCANH = -1 V, TxD = 0 V; NSTB = 0 V; EN = 5 V 60 190 mA Pin CANH 2001 May 18 7 Philips Semiconductors Product data Single wire CAN transceiver SYMBOL AU5790 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Pin CANH (continued) -ICANHH Bus short circuit current in high-speed mode VCANH = -1 V, TxD = 0 V; NSTB = 5 V; EN = 0 V; 8 V < VBAT < 16 V 50 190 mA ICANLG Bus leakage current at loss of ground (I_CAN_LG = I_CANH + I_RTH) 0 V < VBAT < 16 V; see Figure 3 in the test circuits section -50 50 A Tsd Thermal shutdown Note 2 155 190 C Thys Thermal shutdown hysteresis Note 2 5 15 C VT Bus input threshold 5.8 V < VBAT < 27 V, all modes except sleep mode 1.8 2.2 V VTL Bus input threshold, low battery 5.5 V < VBAT < 5.8 V, all modes except sleep mode 1.5 2.2 V VTS Bus input threshold in sleep mode NSTB = 0 V, EN = 0 V, VBAT > 11.3 V 6.15 8.1 V VTSL Bus input threshold in sleep mode, low battery NSTB = 0 V, EN = 0 V, 5.5 V < VBAT < 11.3 V VBAT - 4.3 VBAT - 3.25 V VRTH1 Voltage on switched ground pin IRTH = 1 mA 0.1 V VRTH2 Voltage on switched ground pin IRTH = 6 mA 1 V Vih High level input voltage 5.5 V < VBAT < 27 V Vil Low level input voltage 5.5 V < VBAT < 27 V Ii Input current Vi = 1 V and Vi = 5 V Vitxd TxD input threshold 5.5 V < VBAT < 27 V 1 3 V -Iiltxd TxD low level input current in normal mode NSTB = 5 V, EN = 5 V, VTxD = 0 V 50 180 A -Iihtxd TxD high level input current in sleep mode NSTB = 0 V, EN = 0 V, VTxD = 5 V -5 10 A Volrxd RxD low level output voltage IRxD = 2.2 mA; VCANH = 10 V, all modes 0.45 V Iolrxd RxD low level output current VRxD = 5 V; VCANH = 10 V 3 35 mA Iohrxd RxD high level leakage VRxD = 5 V; VCANH = 0 V, all modes -10 +10 A Pin RTH Pins NSTB, EN 3 15 V 1 V 50 A Pin TxD Pin RxD NOTES: 1. Operation at battery voltages down to 5.3 volts is guaranteed by design. Operation higher than 18 volts (18 V < VBAT < 27 V) for up to two minutes is permitted if the thermal design of the board prevents reaching the thermal protection temperature limit, Tsd, otherwise the device will self protect. Typically these requirements will be encountered during jump start operation at Tamb 85 C and VBAT < 27 V. Refer to the "Thermal Characteristics" section of this data sheet, or application note AN2005 for guidance. 2. This parameter is characterized but not subject to production test. 2001 May 18 8 Philips Semiconductors Product data Single wire CAN transceiver AU5790 Dynamic (AC) CHARACTERISTICS for 33 kbps operation -40 C < Tamb < +125 C; 5.5 V < VBAT < 16 V; -0.3 V < VTxD < 5.5 V; -0.3 V < VNSTB < 5.5 V; -0.3 V < VEN < 5.5 V; -0.3 V < VRxD < 5.5 V; -1 V < VCANH < +16 V; bus load resistor at pin RTH: 2 k < RT < 9.2 k; total bus load resistance 270 < RL < 9.2 k; CL < 13.7 nF; 1s < RL CL < 4s; RxD pull-up resistor 2.2 k < Rd < 3.0 k; RxD: loaded with CLR < 30pF to GND; all voltages are referenced to pin 8 (GND); positive currents flow into the IC; typical values reflect the approximate average value at VBAT = 13 V and Tamb = 25 C, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Pin CANH VdBAMN CANH harmonic content in normal mode NSTB = 5 V, EN = 5 V; RL = 270 , CL = 15 nF; fTxD = 20 kHz, 50% duty cycle; 8 V < VBAT< 16 V; 0.53 MHz < f < 1.7 MHz, Note 2 70 dBV VdBAMW CANH harmonic content in wake-up mode NSTB = 5 V, EN = 0 V; RL = 270 , CL = 15 nF; fTxD = 20 kHz, 50% duty cycle; 8 V < VBAT< 16 V; 0.53 MHz < f < 1.7 MHz, Note 2 80 dBV Pins NSTB, EN tNH Normal mode to high-speed mode delay 30 s tHN High-speed mode to normal mode delay 30 s tWN Wake-up mode to normal mode delay 30 s tNS Normal mode to sleep mode delay 500 s tSN Sleep mode to normal mode delay 50 s 8 V < VBAT < 16 V Pin TxD tTrN Transmit delay in normal mode, bus rising edge NSTB = 5 V, EN = 5 V; RL = 270 , CL = 15 nF; 5.5 V < VBAT < 27 V; measured from the falling edge on TxD to VCANH = 3.0 V 3 6.3 s tTfN Transmit delay in normal mode, bus falling edge NSTB = 5 V, EN = 5 V; RL = 270 , CL = 15 nF; 5.5 V < VBAT< 27 V; measured from the rising edge on TxD to VCANH = 1.0 V 3 9 s tTrW Transmit delay in wake-up mode, bus rising edge to normal levels NSTB = 0 V, EN = 5 V; RL = 270 , CL = 15 nF; 5.5 V < VBAT < 27 V; measured from the falling edge on TxD to VCANH = 3.0 V 3 6.3 s tTrW-S Transmit delay in wake-up mode, bus rising edge to wake-up level NSTB = 0 V, EN = 5 V; RL = 270 , CL = 15 nF; 11.3 V < VBAT < 27 V; measured from the falling edge on TxD to VCANH = 8.9 V 3 18 s tTfW-3.6 Transmit delay in wake-up mode, bus falling edge with 3.6 s time constant NSTB = 0 V, EN = 5 V; RL = 270 , CL = 13.3 nF; 5.5 V < VBAT < 27 V; measured from the rising edge on TxD to VCANH = 1 V, Note 2 3 12.7 s tTfW-4.0 Transmit delay in wake-up mode, bus falling edge with 4.0 s time constant NSTB = 0 V, EN = 5 V; RL = 270 , CL = 15 nF; 5.5 V < VBAT < 27 V; measured from the rising edge on TxD to VCANH = 1 V 3 13.7 s 2001 May 18 9 Philips Semiconductors Product data Single wire CAN transceiver SYMBOL PARAMETER AU5790 CONDITIONS MIN. TYP. MAX. UNIT Pin TxD (continued) tTrHS Transmit delay in high-speed mode, bus rising edge NSTB = 5 V, EN = 0 V; RL = 100 , CL = 15 nF; 8 V < VBAT < 16 V; measured from the falling edge on TxD to VCANH = 3.0 V 0.1 1.5 s tTfHS Transmit delay in high-speed mode, bus falling edge NSTB = 5 V, EN = 0 V; RL = 100 , CL = 15 nF; 8 V < VBAT < 16 V; measured from the rising edge on TxD to VCANH = 1.0 V 0.2 3 s tDN Receive delay in normal mode, bus rising and falling edge NSTB = 5 V, EN = 5 V; 5.5 V < VBAT < 27 V; CANH to RxD time measured from VCANH = 2.0 V to VRxD = 2.5 V 0.3 1 s tDW Receive delay in wake-up mode, bus rising and falling edge NSTB = 0 V, EN = 5 V; 5.5 V < VBAT < 27 V; CANH to RxD time measured from VCANH = 2.0 V to VRxD = 2.5 V 0.3 1 s tDHS Receive delay in high-speed mode, bus rising and falling edge NSTB = 5 V, EN = 0 V; 8 V < VBAT < 16 V; CANH to RxD time measured from VCANH = 2.0 V to VRxD = 2.5 V 0.3 1 s tDS Receive delay in sleep mode, bus rising edge NSTB = 0 V, EN = 0 V; CANH to RxD time, measured from VCANH = min {(VBAT - 3.78 V), 7.13 V} to VRxD = 2.5 V 10 70 s Pin RxD NOTES: 1. Operation at battery voltages down to 5.3 volts is guaranteed by design. Operation higher than 18 volts (18 V < VBAT < 27 V) for up to two minutes is permitted if the thermal design of the board prevents reaching the thermal protection temperature limit, Tsd, otherwise the device will self protect. Typically these requirements will be encountered during jump start operation at Tamb 85 C and VBAT < 27 V. Refer to the "Thermal Characteristics" section of this data sheet, or application note AN2005 for guidance. 2. This parameter is characterized but not subject to production test. 2001 May 18 10 Philips Semiconductors Product data Single wire CAN transceiver AU5790 TxD 50% tTf tTr CANH 3V 2V 1V RxD tD tD 50% SL01255 NOTE: 1. When AU5790 is in normal, high-speed, or wake-up mode, the transmit delay in rising edge tTr may be expressed as tTrN, tTrHS, or tTrW, respectively; the transmit delay in falling edge tTf may be expressed as tTfN, tTfHS, or tTfW, respectively; and the receive delay tD as tDN, tDHS, or tDW, respectively. Figure 2. Timing Diagrams: Pin TxD, CANH, and RxD 2001 May 18 11 Philips Semiconductors Product data Single wire CAN transceiver AU5790 TEST CIRCUITS 5.1V TxD S1 EN S2 GND NSTB CANH AU5790 RxD 1.5 k RTH BAT 1 F 9.1 k S3 I_CAN_LG 2.4 k VBAT SL01234 Figure 3. Loss of ground test circuit NOTES: Opening S3 simulates loss of module ground. Check I_CAN_LG with the following switch positions to simulate loss of ground in all modes: 1. S1 = open = S2 2. S1 = open, S2 = closed 3. S1 = closed, S2 = open 4. S1 = closed = S2 2001 May 18 12 Philips Semiconductors Product data Single wire CAN transceiver AU5790 APPLICATION INFORMATION The information in this section is not part of the IC specification, but is presented for information purposes only. Additional information on single wire CAN networks, application circuits, and thermal management are included in application note AN2005. CAN CONTROLLER (e.g. SJA1000) TX0 PORT PORT RX0 RD +5V 2.4 to 2.7k TxD NSTB RxD 1N5060 or equiv. EN +12V BAT AU5790 100 nF TRANSCEIVER 1 to 4.7 F GND CANH RTH 9.1k, 1% RT L 47 H CL 10% 220 pF CAN BUS LINE Note 1 Note 2 TX0 should be configured to push-pull operation, active low; e.g., Output Control Register = 1E hex. Recommended range for the load resistor is 3k < RT < 11k. Figure 4. SL01200 Application circuit example for the AU5790 AU5790 transceivers may require additional PCB surface at ground pin(s) as heat conductor(s) in order to meet thermal requirements. See thermal characteristics section for details. Table 2. Maximum CAN Bit Rate MODE MAXIMUM BIT RATE AT 0.35% CLOCK ACCURACY Normal transmission 33.3 kbps High-speed transmission 83.3 kbps Sample point as % of bit time 85% 1.0 to 4.0 s Bus Time constant, normal mode 2001 May 18 13 Philips Semiconductors Product data Single wire CAN transceiver AU5790 THERMAL CHARACTERISTICS Tj =Ta + Pd * ja The AU5790 provides protection from thermal overload. When the IC junction temperature reaches the threshold (155 C), the AU5790 will disable the transmitter drivers, reducing power dissipation to protect the device. The transmit function will become available again after the junction temperature drops. The thermal shutdown hysteresis is about 5 C. where: Tj is junction temperature (C); Ta is ambient temperature (C); Pd is dissipated power (W); ja is thermal resistance (C/W). Thermal Resistance Thermal resistance is the ability of a packaged IC to dissipate heat to its environment. In semiconductor applications, it is highly dependant on the IC package, PCBs, and airflow. Thermal resistance also varies slightly with input power, the difference between ambient and junction temperatures, and soldering material. In order to avoid this transmit function shutdown, care must be taken to not overheat the IC during application. The relationships between junction temperature, ambient temperature, dissipated power, and thermal resistance can be expressed as: Figures 5 and 6 show the thermal resistance as the function of the IC package and the PCB configuration, assuming no airflow. Thermal resistance (C/W) 200 very low conductance board 150 100 low conductance board 50 high conductance board 0 0 50 100 150 200 250 SL01249 Cu area on fused pins (mm2) Figure 5. SO-8 Thermal Resistance vs. PCB Configuration, Note 1, 2, 3 Thermal resistance (C/W) 150 very low conductance board 100 low conductance board high conductance board 50 0 0 100 200 300 400 500 SL01250 Cu area on fused pins (mm2) Figure 6. 2001 May 18 SO-14 Thermal Resistance vs. PCB Configuration, Note 1, 2, 3 14 Philips Semiconductors Product data Single wire CAN transceiver AU5790 Table 3 shows the maximum power dissipation of an AU5790 without tripping the thermal overload protection, for specified combinations of package, board configuration, and ambient temperature. Table 3. Maximum power dissipation JA Ptot Power Dissipation Max. Board Type Additional Foil Area for Heat Dissipation Thermal Resistance Ta= 85 C Ta= 125 C K/W mW mW SO-8 on High Conductance Board Normal traces 103 631 243 225 Sq. mm of copper foil attached to pin 8. 82 793 305 SO-8 on Low Conductance Board Normal traces 163 399 153 225 Sq. mm of copper attached to pin 8. 119 546 210 SO-8 on Very Low Conductance Board Normal traces 194 335 129 225 Sq. mm of copper attached to pin 8. 135 481 185 SO-14 on High Conductance Board Normal traces 63 1032 397 105 Sq. mm of copper attached to each of pins 1, 7, 8, & 14. 50 1300 500 SO-14 on Low Conductance Board Normal traces 103 631 243 105 Sq. mm of copper attached to each of pins 1, 7, 8, & 14. 70 929 357 SO-14 on Very Low Conductance Board Normal traces 126 516 198 105 Sq. mm of copper attached to each of pins 1, 7, 8, & 14. 82 793 305 NOTES: 1. The High Conductance board is based on modeling done to EIA/JEDEC Standard JESD51-7. The board emulated contains two one ounce thick copper ground planes, and top surface copper conductor traces of two ounce (0.071 mm thickness of copper). 2. The Low Conductance board is based on modeling done to EIA/JEDEC Standard EIA/JESD51-3. The board does not contain any ground planes, and the top surface copper conductor traces of two ounce (0.071 mm thickness of copper). 3. The Very Low Conductance board is based on the EIA/JESD51-3, however the thickness of the surface conductors has been reduced to 0.035 mm (also referred to as 1.0 Ounce copper). 4. The above mentioned JEDEC specifications are available from: http://www.jedec.org/ 2001 May 18 15 Philips Semiconductors Product data Single wire CAN transceiver AU5790 ILOAD = VCANHN/RLOAD Power Dissipation Power dissipation of an IC is the major factor determining junction temperature. AU5790 power dissipation in active and passive states are different. The average power dissipation is: IBATN = ILOAD + IINT where: Ptot = PINT*Dy + PPNINT * (1-Dy) where: IINT will decrease slightly when the node number decreases. To simplify this analysis, we will assume IINT is fixed. Ptot is total dissipation power; PINT is dissipation power in an active state; PPNINT is dissipation power in a passive state; IINT = IBATN (32 nodes) - ILOAD (32 nodes) IBATN (32 nodes) may be found in the DC Characteristics table. Dy is duty cycle, which is the percentage of time that TxD is in an active state during any given time duration. A power dissipation example follows. The assumed values are chosen from specification and typical applications. At passive state there is no current going into the load. So all of the supply current is dissipated inside the IC. Assumptions: PPNINT = VBAT * IBATPN where: IINT is an active state current dissipated within the IC in normal mode. VBAT = 13.4 V RT = 9.1 k 32 nodes IBATPN = 2 mA IBATN (32 nodes) = 35 mA VCANHN = 4.55 V Duty cycle = 50% VBAT is the battery voltage; IBATPN is the passive state supply current in normal mode. In an active state, part of the supply current goes to the load, and only part of the supply current dissipates inside the IC, causing an incremental increase in junction temperature. Computations: PINT = PBATAN - PLOADN where: RLOAD = 9.1 k / 32 = 284.4 PPNINT = 13.4 V x 2 mA = 26.8 mW ILOAD = 4.55 V / 284.4 = 16mA PLOADN = 4.55 V x 16 mA = 72.8 mW IINT = 35 mA - 16 mA = 19 mA PBATAN = 13.4 V x 35 mA = 469 mW PINT = 469 mW - 72.8 mW = 396.2 mW Ptot = 396.2 mW x 50% + 26.8 mW x (1-50%) = 211.5 mW PBATAN is active state battery supply power in normal mode; PBATAN = VBAT * IBATAN PLOADN is load power consumption in normal mode. PLOADN = VCANHN * ILOADN where: IBATAN is active state supply current in normal mode; Additional examples with various node counts are shown in Table 4. VCANHN is bus output voltage in normal mode; ILOADN is current going through load in normal mode. Table 4. Representative Power Dissipation Analyses Nodes RLOAD () VBAT (V) IBATPN (mA) PPNINT (mW) VCANHN (V) ILOAD (mA) IBATN (mA) IINT (mA) PINT (mW) Dcycle Ptot (mW) 2 4550 13.4 2 26.8 4.55 1 20 19 263.5 0.5 145.1 10 910 13.4 2 26.8 4.55 5 24 19 298.9 0.5 162.8 20 455 13.4 2 26.8 4.55 10 29 19 343.1 0.5 184.9 32 284.4 13.4 2 26.8 4.55 16 35 19 396.2 0.5 211.5 2 4550 26.5 2 53 4.55 1 20 19 525.5 0.5 289.2 10 910 26.5 2 53 4.55 5 24 19 613.3 0.5 333.1 20 455 26.5 2 53 4.55 10 29 19 723 0.5 388 32 284.4 26.5 2 53 4.55 16 35 19 854.7 0.5 453.8 By knowing the maximum power dissipation, and the operation ambient temperature, the required thermal resistance without tripping the thermal protection can be calculated, as shown in Figure 7. Then from Figure 5 or 6, a suitable PCB can be selected. 2001 May 18 16 Philips Semiconductors Product data Single wire CAN transceiver AU5790 500 THERMAL RESISTANCE (C/W) 450 400 Ptot = 453.8 mW (Vbat = 26.5 V, 32 nodes) 350 300 Ptot = 333.1 mW (Vbat = 26.5 V, 10 nodes) 250 Ptot = 211.5 mW (Vbat = 13.4 V, 32 nodes) 200 150 100 50 0 50 60 70 80 90 100 110 120 130 SL01256 AMBIENT TEMPERATURE (C) Figure 7. 2001 May 18 Required Thermal Resistance vs. Ambient Temperature and Power Dissipation 17 Philips Semiconductors Product data Single wire CAN transceiver AU5790 SO8: plastic small outline package; 8 leads; body width 3.9 mm 2001 May 18 18 SOT96-1 Philips Semiconductors Product data Single wire CAN transceiver AU5790 SO14: plastic small outline package; 14 leads; body width 3.9 mm 2001 May 18 19 SOT108-1 Philips Semiconductors Product data Single wire CAN transceiver AU5790 Data sheet status Data sheet status [1] Product status [2] Definitions Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. [1] Please consult the most recently issued datasheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. Definitions Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 Date of release: 05-01 Document order number: 2001 May 18 20 9397 750 08401