ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON TRANSISTOR ARRAYS Check for Samples: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A FEATURES 1 * * * * * 500-mA-Rated Collector Current (Single Output) High-Voltage Outputs: 50 V Output Clamp Diodes Inputs Compatible With Various Types of Logic Relay-Driver Applications ULN2002A . . . N PACKAGE ULN2003A . . . D, N, NS, OR PW PACKAGE ULN2004A . . . D, N, OR NS PACKAGE ULQ2003A, ULQ2004A . . . D OR N PACKAGE (TOP VIEW) 1B 2B 3B 4B 5B 6B 7B E 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1C 2C 3C 4C 5C 6C 7C COM DESCRIPTION The ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, and ULQ2004A are high-voltage high-current Darlington transistor arrays. Each consists of seven npn Darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single Darlington pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers. For 100-V (otherwise interchangeable) versions of the ULN2003A and ULN2004A, see the SN75468 and SN75469, respectively. The ULN2001A is a general-purpose array and can be used with TTL and CMOS technologies. The ULN2002A is designed specifically for use with 14-V to 25-V PMOS devices. Each input of this device has a Zener diode and resistor in series to control the input current to a safe limit. The ULN2003A and ULQ2003A have a 2.7-k series base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. The ULN2004A and ULQ2004A have a 10.5-k series base resistor to allow operation directly from CMOS devices that use supply voltages of 6 V to 15 V. The required input current of the ULN/ULQ2004A is below that of the ULN/ULQ2003A, and the required voltage is less than that required by the ULN2002A. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1976-2009, Texas Instruments Incorporated ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA PDIP - N -20C to 70C SOIC - D SOP - NS TSSOP - PW PDIP - N -40C to 85C SOIC - D PDIP - N -40C to 105C SOIC - D TSSOP - PW (1) (2) ORDERABLE PART NUMBER Tube of 25 ULN2002AN ULN2002AN ULN2003AN ULN2003AN ULN2004AN ULN2004AN Tube of 40 ULN2003AD Reel of 2500 ULN2003ADR Tube of 40 ULN2004AD Reel of 2500 ULN2004ADR Reel of 2000 ULN2003A ULN2004A ULN2003ANSR ULN2003A ULN2004ANSR ULN2004A Tube of 90 ULN2003APW Reel of 2000 ULN2003APWR Tube of 25 TOP-SIDE MARKING UN2003A ULQ2003AN ULQ2003A ULQ2004AN ULQ2004AN Tube of 40 ULQ2003AD Reel of 2500 ULQ2003ADR Tube of 40 ULQ2004AD Reel of 2500 ULQ2004ADR Tube of 425 ULN2003AIN Tube of 40 ULN2003AID Reel of 2500 ULN2003AIDR Reel of 2500 ULN2003AIPWR ULQ2003A ULQ2004A ULN2003AIN ULN2003AI UN2003AI For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. LOGIC DIAGRAM 9 COM 1 16 1C 1B 2 15 2C 2B 3 14 3C 3B 4 13 4C 4B 5 12 5C 5B 6 11 6C 6B 7 7B 2 Submit Documentation Feedback 10 7C Copyright (c) 1976-2009, Texas Instruments Incorporated Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 SCHEMATICS (EACH DARLINGTON PAIR) 10.5 kW 7.2 kW 3 kW ULN2002A RB ULN/ULQ2003A: RB = 2.7 kW ULN2003AI: RB = 2.7 kW 7.2 kW 3 kW ULN/ULQ2004A: RB = 10.5 kW ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A All resistor values shown are nominal. The collector-emitter diode is a parasitic structure and should not be used to conduct current. If the collector(s) go below ground an external Schottky diode should be added to clamp negative undershoots. Copyright (c) 1976-2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 3 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) at 25C free-air temperature (unless otherwise noted) MIN VCC MAX Collector-emitter voltage V 50 V 30 V 500 mA Output clamp current 500 mA Total emitter-terminal current -2.5 A Clamp diode reverse voltage (2) Input voltage (2) VI See Figure 14 and Figure 15 Peak collector current IOK TA Operating free-air temperature range Package thermal impedance (3) JA (4) JC Package thermal impedance (5) TJ Operating virtual junction temperature ULN200xA -20 70 ULN200xAI -40 105 ULQ200xA -40 85 ULQ200xAT -40 105 D package 73 N package 67 NS package 64 PW package 108 D package (6) (1) (2) (3) (4) (5) (6) Storage temperature range C C/W 36 N package 54 Lead temperature for 1.6 mm (1/16 inch) from case for 10 seconds Tstg UNIT 50 -65 150 C 260 C 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Maximum power dissipation is a function of TJ(max), JC, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JC. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with MIL-STD-883. ELECTRICAL CHARACTERISTICS TA = 25C PARAMETER VI(on) VCE(sat) VF ICEX On-state input voltage Collector-emitter saturation voltage Clamp forward voltage Collector cutoff current TEST FIGURE Figure 6 Figure 4 TEST CONDITIONS IC = 200 mA 1 1.3 II = 500 A, IC = 350 mA 1.2 1.6 13 Figure 7 IF = 350 mA Figure 1 VCE = 50 V, II = 0 50 Figure 2 VCE = 50 V, TA = 70C II = 0 100 VI = 6 V 500 IC = 500 A Input current Figure 3 VI = 17 V Submit Documentation Feedback 1.1 II = 350 A, II 4 0.9 IC = 100 mA VCE = 50 V, Input capacitance MAX IC = 300 mA Figure 2 Ci TYP II = 250 A, Off-state input current Clamp reverse current MIN VCE = 2 V, II(off) IR ULN2002A Figure 6 VR = 50 V VI = 0, 1.7 50 1.25 100 50 f = 1 MHz V V V A A 65 0.82 TA = 70C 2 UNIT 25 mA A pF Copyright (c) 1976-2009, Texas Instruments Incorporated Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 ELECTRICAL CHARACTERISTICS TA = 25C PARAMETER TEST FIGURE TEST CONDITIONS ULN2003A MIN TYP ULN2004A MAX MIN TYP IC = 125 mA VI(on) On-state input voltage Figure 6 VCE = 2 V 2.4 IC = 250 mA 2.7 6 IC = 275 mA 7 ICEX VF Collector cutoff current Clamp forward voltage 8 II = 250 A, IC = 100 mA II = 350 A, II = 500 A, Figure 1 VCE = 50 V, II = 0 50 50 Figure 2 VCE = 50 V, TA = 70C II = 0 100 100 Figure 8 IF = 350 mA VCE = 50 V, TA = 70C, Figure 5 II(off) Off-state input current Figure 3 II Input current Figure 4 0.9 1.1 IC = 200 mA 1 IC = 350 mA 1.2 Clamp reverse current Ci Input capacitance Figure 7 VR = 50 V VI = 0, 1.1 1.3 1 1.3 1.6 1.2 1.6 V A 500 1.7 50 VI = 17 V IR 0.9 VI = 6 V IC = 500 A V 3 IC = 350 mA Collector-emitter saturation voltage UNIT 5 IC = 200 mA IC = 300 mA VCE(sat) MAX 2 65 50 0.93 2 V A 65 1.35 TA = 70C f = 1 MHz 1.7 15 0.35 0.5 1 1.45 50 50 100 100 25 15 25 mA A pF ELECTRICAL CHARACTERISTICS TA = 25C PARAMETER VI(on) On-state input voltage TEST FIGURE Figure 6 ULN2003AI TEST CONDITIONS VCE = 2 V MIN TYP IC = 200 mA 2.4 IC = 250 mA 2.7 IC = 300 mA IC = 100 mA 0.9 1.1 II = 350 A, IC = 200 mA 1 1.3 1.2 1.6 Collector-emitter saturation voltage Figure 5 II = 500 A, IC = 350 mA ICEX Collector cutoff current Figure 1 VCE = 50 V, II = 0 VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, II Input current Figure 4 VI = 3.85 V IR Clamp reverse current Figure 7 VR = 50 V Ci Input capacitance VI = 0, 50 1.7 IC = 500 A UNIT V 3 II = 250 A, VCE(sat) Copyright (c) 1976-2009, Texas Instruments Incorporated MAX 50 15 V 1.35 mA 50 A 25 pF Submit Documentation Feedback Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A A A 65 0.93 f = 1 MHz 2 V 5 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS TA = -40C to 105C PARAMETER VI(on) VCE(sat) TEST FIGURE On-state input voltage Figure 6 Collector-emitter saturation voltage VCE = 2 V Figure 5 ULN2003AI TEST CONDITIONS MIN 2.7 IC = 250 mA 2.9 IC = 300 mA 3 IC = 100 mA II = 350 A, II = 500 A, II = 0 Collector cutoff current Figure 1 VCE = 50 V, VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, II Input current Figure 4 VI = 3.85 V IR Clamp reverse current Figure 7 VR = 50 V Ci Input capacitance 0.9 1.2 IC = 200 mA 1 1.4 IC = 350 mA 1.2 1.7 100 1.7 IC = 500 A 30 2.2 f = 1 MHz 15 UNIT V V A V A 65 0.93 VI = 0, MAX IC = 200 mA II = 250 A, ICEX TYP 1.35 mA 100 A 25 pF ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST FIGURE TEST CONDITIONS ULQ2003A MIN TYP ULQ2004A MAX MIN TYP IC = 125 mA VI(on) On-state input voltage Figure 6 VCE = 2 V 2.7 IC = 250 mA 2.9 6 IC = 275 mA 7 IC = 300 mA VCE(sat) Collector-emitter saturation voltage ICEX Collector cutoff current VF Clamp forward voltage II = 350 A, II = 500 A, Figure 1 VCE = 50 V, II = 0 Figure 2 VCE = 50 V, TA = 70C II = 0 Figure 8 IF = 350 mA VCE = 50 V, TA = 70C, Figure 5 II(off) Off-state input current Figure 3 II Input current Figure 4 1.2 IC = 200 mA 1 IC = 350 mA 1.2 Clamp reverse current Ci Input capacitance 6 Figure 7 Submit Documentation Feedback VR = 50 V VI = 0, 0.9 1.1 1.4 1 1.3 1.7 1.2 1.6 100 A 500 1.7 2.3 65 0.93 TA = 25C f = 1 MHz V 50 100 VI = 6 V VI = 17 V IR 8 0.9 IC = 500 A V 3 IC = 350 mA IC = 100 mA UNIT 5 IC = 200 mA II = 250 A, MAX 15 1.7 50 2 V A 65 1.35 0.35 0.5 1 1.45 100 50 100 100 25 15 25 mA A pF Copyright (c) 1976-2009, Texas Instruments Incorporated Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 SWITCHING CHARACTERISTICS TA = 25C PARAMETER ULN2002A, ULN2003A, ULN2004A TEST CONDITIONS MIN TYP MAX tPLH Propagation delay time, low- to high-level output See Figure 9 0.25 1 tPHL Propagation delay time, high- to low-level output See Figure 9 0.25 1 VOH High-level output voltage after switching VS = 50 V, IO = 300 mA, See Figure 10 VS - 20 UNIT s s mV SWITCHING CHARACTERISTICS TA = 25C PARAMETER ULN2003AI TEST CONDITIONS MIN tPLH Propagation delay time, low- to high-level output See Figure 9 tPHL Propagation delay time, high- to low-level output See Figure 9 VOH High-level output voltage after switching VS = 50 V, IO 300 mA, See Figure 10 TYP MAX 0.25 1 0.25 1 VS - 20 UNIT s s mV SWITCHING CHARACTERISTICS TA = -40C to 105C PARAMETER ULN2003AI TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 s tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 s VOH High-level output voltage after switching VS = 50 V, IO 300 mA, See Figure 10 VS - 50 mV SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER ULQ2003A, ULQ2004A TEST CONDITIONS MIN TYP MAX tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 VOH High-level output voltage after switching VS = 50 V, IO = 300 mA, See Figure 10 Copyright (c) 1976-2009, Texas Instruments Incorporated VS - 20 Submit Documentation Feedback Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A UNIT s s mV 7 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION Open Open VCE ICEX VCE ICEX Open VI Figure 1. ICEX Test Circuit Open Figure 2. ICEX Test Circuit Open VCE II(off) II(on) IC Open VI Figure 3. II(off) Test Circuit A. Figure 4. II Test Circuit II is fixed for measuring VCE(sat), variable for measuring hFE. Open hFE = IC II VCE II Open Figure 5. hFE, VCE(sat) Test Circuit VI(on) IC VCE IC Figure 6. VI(on) Test Circuit VR IR VF IF Open Open Figure 7. IR Test Circuit Figure 8. VF Test Circuit Figure 9. Propagation Delay-Time Waveforms 8 Submit Documentation Feedback Copyright (c) 1976-2009, Texas Instruments Incorporated Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) 200 W 10 ns 5 ns 90% 1.5 V Input VIH (see Note C) 90% 1.5 V 10% 10% 0V 40 s VOH Output VOL VOLTAGE WAVEFORMS A. The pulse generator has the following characteristics: PRR = 12.5 kHz, ZO = 50 . B. CL includes probe and jig capacitance. C. For testing the ULN2003A, ULN2003AI, and ULQ2003A, VIH = 3 V; for the ULN2002A, VIH = 13 V; for the ULN2004A and the ULQ2004A, VIH = 8 V. Figure 10. Latch-Up Test Circuit and Voltage Waveforms Copyright (c) 1976-2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 9 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS VCE(sat) VCE(sat) - Collector-Emitter Saturation Voltage - V 2.5 TA = 25C 2 II = 250 A II = 350 A II = 500 A 1.5 1 0.5 0 0 100 200 300 400 500 600 700 800 VCE(sat) VCE(sat) - Collector-Emitter Saturation Voltage - V COLLECTOR-EMITTER SATURATION VOLTAGE vs TOTAL COLLECTOR CURRENT (TWO DARLINGTONS IN PARALLEL) COLLECTOR-EMITTER SATURATION VOLTAGE vs COLLECTOR CURRENT (ONE DARLINGTON) 2.5 TA = 25C II = 350 A 1.5 II = 500 A 1 0.5 0 0 100 300 400 500 600 Figure 11. Figure 12. COLLECTOR CURRENT vs INPUT CURRENT D PACKAGE MAXIMUM COLLECTOR CURRENT vs DUTY CYCLE 700 800 600 500 IIC C - Maximum Collector Current - mA RL = 10 TA = 25C 450 IC IC - Collector Current - mA 200 IC(tot) - Total Collector Current - mA IC - Collector Current - mA 400 VS = 10 V 350 VS = 8 V 300 250 200 150 100 50 0 500 N=1 400 N=4 N=3 300 N=2 N=6 200 N = 7 N=5 100 TA = 70C N = Number of Outputs Conducting Simultaneously 0 0 25 50 75 100 125 II - Input Current - A Figure 13. 10 II = 250 A 2 Submit Documentation Feedback 150 175 200 0 10 20 30 40 50 60 70 80 90 100 Duty Cycle - % Figure 14. Copyright (c) 1976-2009, Texas Instruments Incorporated Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 TYPICAL CHARACTERISTICS (continued) N PACKAGE MAXIMUM COLLECTOR CURRENT vs DUTY CYCLE IIC C - Maximum Collector Current - mA 600 500 N=1 N=3 N=2 400 N=4 300 N=5 N=6 N=7 200 100 0 TA = 85C N = Number of Outputs Conducting Simultaneously 0 10 20 30 40 50 60 70 80 90 100 Duty Cycle - % Figure 15. Copyright (c) 1976-2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 11 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027H - DECEMBER 1976 - REVISED NOVEMBER 2009 www.ti.com APPLICATION INFORMATION ULN2002A VSS V 1 P-MOS Output ULQ2003A VCC 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 V 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 Lam Test TTL Output Figure 16. P-MOS to Load ULN2004A ULQ2004A VDD Figure 17. TTL to Load VCC V V ULQ2003A 1 16 1 16 2 15 2 15 3 14 3 14 4 13 4 13 5 12 5 12 6 11 6 11 7 10 7 10 8 9 8 9 RP CMOS Output TTL Output Figure 18. Buffer for Higher Current Loads 12 Submit Documentation Feedback Figure 19. Use of Pullup Resistors to Increase Drive Current Copyright (c) 1976-2009, Texas Instruments Incorporated Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) ULN2001AD OBSOLETE SOIC D 16 TBD Call TI Call TI ULN2001ADR OBSOLETE SOIC D 16 TBD Call TI Call TI ULN2001AN OBSOLETE PDIP N 16 TBD Call TI Call TI ULN2002AD OBSOLETE SOIC D 16 TBD Call TI Call TI ULN2002AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type ULN2002ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type ULN2003AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type ULN2003AINE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type ULN2003AIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003AJ OBSOLETE CDIP J 16 Addendum-Page 1 TBD Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty ULN2003AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type ULN2003ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type ULN2003ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003APW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003APWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2003APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2004AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2004ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2004ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2004ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2004ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2004ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2004AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type ULN2004ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type ULN2004ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULN2004ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003AD ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM ULQ2003ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003ADR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM ULQ2003ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003AN ACTIVE PDIP N 16 CU NIPDAU N / A for Pkg Type 25 Addendum-Page 2 Pb-Free (RoHS) Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) ULQ2004AD ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM ULQ2004ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2004ADR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM ULQ2004ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2004AN ACTIVE PDIP N 16 CU NIPDAU N / A for Pkg Type 25 Pb-Free (RoHS) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF ULQ2003A, ULQ2004A : * Automotive: ULQ2003A-Q1, ULQ2004A-Q1 NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 7-Oct-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ULN2003ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2003ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2003AIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2003AIPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 ULN2003ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 ULN2003APWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 ULN2004ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2004ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2004ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Oct-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ULN2003ADR SOIC D 16 2500 333.2 345.9 28.6 ULN2003ADR SOIC D 16 2500 346.0 346.0 33.0 ULN2003AIDR SOIC D 16 2500 333.2 345.9 28.6 ULN2003AIPWR TSSOP PW 16 2000 346.0 346.0 29.0 ULN2003ANSR SO NS 16 2000 346.0 346.0 33.0 ULN2003APWR TSSOP PW 16 2000 346.0 346.0 29.0 ULN2004ADR SOIC D 16 2500 346.0 346.0 33.0 ULN2004ADR SOIC D 16 2500 333.2 345.9 28.6 ULN2004ANSR SO NS 16 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. 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