ZXGD3004E6
Document Number DS33382 Rev. 2 - 2
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ZXGD3004E6
40V 8A GATE DRIVER IN SOT26
Description
The ZXGD3004E6 is a high-speed, non-inverting single gate driver
designed for switching MOSFETs or IGBTS. It can transfer up to 8A
peak source/source current into the gate for effective charging and
discharging of the capacitive gate load.
This gate driver ensures rapid switching of the MOSFET to minimize
power losses and distortion in high current switching applications. It can
typically drive 1.9A into the low gate impedance with just 10mA input
from a controller. The turn-on and turn-off switching behaviour of the
MOSFET can be individually tailored to suit an application. By defining
the switching characteristics appropriately, EMI and cross conduction
can be reduced.
Applications
Gate Driving Power MOSFET and IGBTs in:
AC-DC Power Supplies (SMPS)
DC-DC Converters
DC-AC Inverters (i.e. Solar)
1, 2 and 3-Phase Motor Control Circuits
Amplifier Output Stages
Features
High-Gain Buffer with Typically 1.9A Output from 10mA Input
8 Amps Peak Output Current
40V Supply for +20V to -18V Gate Driving to Prevent dV/dt
Induced False Triggering and Minimize On-Losses
Emitter-Follower that is Rugged to Latch-Up/Shoot-Though
Fast Switching Emitter-Follower Configuration
1ns Propagation Delay Time
14ns Rise/Fall Time, 1500pF load
Optimized Pin-Out to Simplify PCB Layout and Reduce
Parasitic Trace Inductances
Near-Zero Quiescent Supply Current
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
An Automotive-Compliant Part is Available Under Separate
Datasheet (ZXGD3004E6Q)
Mechanical Data
Case: SOT26
Case Material: Molded Plastic. ―GreenMolding Compound;
UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.018 grams (Approximate)
Ordering Information (Note 4)
Product
Marking
Reel Size (inches)
Tape Width (mm)
Quantity per Reel
ZXGD3004E6TA
3004
7
8
3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See http://www.diodes.com/quality/lead_free/ for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green"
and Lead-Free.
3. Halogen and Antimony free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl)
and <1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Pin Name
Pin Function
VCC
Driver Supply High
IN1 & IN2
Driver Input *
VEE
Supply Voltage Low
SOURCE
Source Current Output **
SINK
Sink Current Output **
Top View
Pin-Out
Top View
SOT26
* Typically connect IN1 & IN2 together
** Typically connect SOURCE & SINK together
ZXGD3004E6
Document Number DS33382 Rev. 2 - 2
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© Diodes Incorporated
ZXGD3004E6
Marking Information
Date Code Key
Year
2018
2019
2020
2021
2022
2023
2024
2025
Code
F
G
H
I
J
K
L
M
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Typical Application Circuit
3004 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: F = 2018)
M = Month (ex: 9 = September)
VCC
VEE
ZXGD3004E6
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ZXGD3004E6
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Supply Voltage, with Respect to VEE
VCC
40
V
Input Voltage, with Respect to VEE
VIN
40
V
Output Difference Voltage (Source Sink)
V(SOURCE-SINK)
±7
V
Peak Pulsed Output Current (Source Sink)
IOM
±8
A
Peak Pulsed Input Current
IIN1, IIN2
±1
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation (Notes 5 & 6)
Linear Derating Factor
PD
1.1
8.8
W
mW/°C
Thermal Resistance, Junction to Ambient (Notes 5 & 6)
RθJA
113
°C /W
Thermal Resistance, Junction to Lead (Note 7)
RθJL
105
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
ESD Ratings (Note 8)
Characteristic
Symbol
Value
Unit
JEDEC Class
Electrostatic Discharge - Human Body Model
ESD HBM
4,000
V
3A
Electrostatic Discharge - Machine Model
ESD MM
400
V
C
Electrostatic Discharge Charged Device Model
ESD CDM
1,000
V
IV
Notes: 5. For a device mounted on 25mm x 25mm 1oz copper that is on a single-sided 1.6mm FR-4 PCB; device is measured under still air conditions whilst
operating in a steady-state. The heatsink is split in half with the pin 1 (VCC) and pin 3 (VEE) connected separately to each half.
6. For device with two active die running at equal power.
7. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (VCC) and pin 3 (VEE).
8. Refer to JEDEC specification JESD22-A114, JESD22-A115 and JESD22-C101.
ZXGD3004E6
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ZXGD3004E6
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Output Voltage, High
VOUT(hi)
VIN1 - 0.4
V
Isource = A
Output Voltage, Low
VOUT(low)
VIN1 + 0.4
Isink = A
Source Output Leakage Current
IL(source)
1
µA
VCC = 40V,
VIN1 = VIN2 = 0V
Sink Output Leakage Current
IL(sink)
1
µA
VCC = 40V,
VIN1 = VIN2 = VCC
Quiescent Supply Current
IQ
50
nA
VCC = 32V,
VIN1 = VIN2 = 0V
Peak Pulsed Source Output Current
I(source)M
1.2
1.9
A
IIN1 + IIN2 = 10mA
Peak Pulsed Sink Output Current
I(sink)M
1.2
1.9
A
IIN1 + IIN2 = -10mA
Peak Pulsed Source Output Current
I(source)M
8
A
IIN1 + IIN2 = 1A
Peak Pulsed Sink Output Current
I(sink)M
8
A
IIN1 + IIN2 = -1A
Gate Driver Switching Times
td(rise)
tr
td(fall)
tf
1.1
13.4
0.95
12.4
ns
VCC = 15V, VEE = 0V,
VIN = 0 to 12.5V,
CL = 1.5nF, RL = 0.1,
RIN = 25
Gate Driver Switching Times
td(rise)
tr
td(fall)
tf
3.2
77.9
3.6
82
ns
VCC = 15V, VEE = 0V,
VIN = 0 to 12.5V,
CL = 1.5nF, RL = 0.1,
RIN = 1k
Switching Test Circuit and Timing Diagram
ZXGD3004E6
VCC
VEE
ZXGD3004E6
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ZXGD3004E6
Typical Gate Driver Characteristics (@TA = +2C, unless otherwise specified.)
ZXGD3004E6
Document Number DS33382 Rev. 2 - 2
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ZXGD3004E6
Typical Gate Driver Characteristics (Cont.)
ZXGD3004E6
Document Number DS33382 Rev. 2 - 2
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ZXGD3004E6
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT26
SOT26
Dim
Min
Max
Typ
A1
0.013
0.10
0.05
A2
1.00
1.30
1.10
A3
0.70
0.80
0.75
b
0.35
0.50
0.38
c
0.10
0.20
0.15
D
2.90
3.10
3.00
e
-
-
0.95
e1
-
-
1.90
E
2.70
3.00
2.80
E1
1.50
1.70
1.60
L
0.35
0.55
0.40
a
-
-
a1
-
-
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT26
Dimensions
Value (in mm)
C
2.40
C1
0.95
G
1.60
X
0.55
Y
0.80
Y1
3.20
a1
D
e
E1 E
b
A2 A1
Seating Plane
L
c
a
e1
A3
C1
Y1 G
X
Y
C
ZXGD3004E6
Document Number DS33382 Rev. 2 - 2
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ZXGD3004E6
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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