16-213SYGC/S530-E3/TR8 - EVERLIGHT ELECTRONICS

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 1 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Technical Data Sheet

0402 Package Chip LED (0.45 mm Height)

16-213SYGC/S530-XX/TR8

Features

․Package in 8mm tape on 7〞diameter reel.

․Compatible with automatic placement equipment.

․Compatible with infrared and vapor phase reflow

solder process.

․Mono-color type.

․Pb-free.

․The product itself will remain within RoHS

compliant version.

Descriptions

․The 16-213 SMD LED is much smaller than lead

frame type components, thus enable smaller board

size, higher packing density, reduced storage space

and finally smaller equipment to be obtained.

․Besides, lightweight makes them ideal for

miniature applications. etc.

Applications

․Backlighting in dashboard and switch.

․Telecommunication: indicator and backlighting in

telephone and fax.

․Flat backlight for LCD, switch and symbol.

․General use.

Device Selection Guide

Chip

Material Emitted Color

Resin Color

AlGaInP Brilliant Yellow Green Water Clear

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 2 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Package Outline Dimensions

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 3 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Rating Unit

Reverse Voltage VR 5 V

Forward Current IF 25 mA

Peak Forward Current

(Duty 1/10 @1KHz) IFP 60 mA

Power Dissipation Pd 60 mW

Electrostatic Discharge(HBM) ESD 2000 V

Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40 ~ +90 ℃

Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec.

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 4 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Electro-Optical Characteristics (Ta=25℃)

Parameter Symbol *Chip

Rank Min. Typ. Max. Unit Condition

E1 10 15 -----

E2 20 25 -----

E3 30 35 -----

Luminous Intensity Iv

E4 40 45 -----

mcd

Viewing Angle 2θ1/2 ----- ----- 120 ----- deg

Peak Wavelength λp ----- ----- 575 ----- nm

Dominant Wavelength λd ----- ----- 573 ----- nm

Spectrum Radiation

Bandwidth △λ ----- ----- 20 ----- nm

Forward Voltage VF ----- 1.7 2.0 2.4

V

IF=20mA

Reverse Current IR ----- ----- ----- 10 μA VR=5V

*16-213SYGC/S530-XX/TR8

Chip Rank

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 5 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Typical Electro-Optical Characteristics Curves

Relative luminous intensity

Forward Current Derating Curve

Forward Current F

I (mA) %)

(

Luminous Intensity vs.

Ambient Temperature

Relative luminous intensity %)

(

Forward Current I (mA)

F

Forward Current I (mA)

F

Spectrum Distribution

Ta=25°C

Forward Current vs.

Forward Voltage Ta=25°C

Wavelength λ (nm) F

Forward Voltage V (V)

Forward Current

Luminous Intensity vs.

Ta=25°C

Radiation Diagram Ta=25°C

Relative luminous intensity (%)

Ambient Temperature Ta (°C)

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 6 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Label Explanation

CAT: Luminous Intensity Rank

HUE: Dom. Wavelength Rank

REF: Forward Voltage Rank

Reel Dimensions

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

RoHS

Pb

CPN :

PN : XXXXXXXXXXXXX

XXXXXXXXXXXXX

QTY : XXX

LOT NO : XXXXXXXXXX

Reference : XXXXXXXX

CAT : XXX

HUE : XXX

REF : XXX

EVERLIGHT

MADE IN TAIWAN

MSL-2

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 7 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

Moisture Resistant Packaging

Label Desiccant Label

Aluminum moisture-proof bag

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 8 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below.

Confidence level：90%

LTPD：10%

No. Items Test Condition

Test

Hours/Cycles Sample

Size Ac/Re

1 Reflow Soldering

Temp. : 260℃±5℃

Min. 5sec. 6 Min. 22 PCS. 0/1

2 Temperature Cycle

H : +100℃ 15min

∫ 5 min

L : -40℃ 15min 300 Cycles 22 PCS. 0/1

3 Thermal Shock

H : +100℃ 5min

∫ 10 sec

L : -10℃ 5min 300 Cycles 22 PCS. 0/1

4 High Temperature

Storage Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1

5 Low Temperature

Storage Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1

6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1

7 High Temperature /

High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS. 0/1

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 9 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

Precautions For Use

1. Over-current-proof

Customer must apply resistors for protection, otherwise slight voltage shift will cause big

current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.

If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

120 Sec. Max.

1~5 °C / Sec. Pre-heating

180~200°C 60 Sec. Max.

Above 220°C

260°C. Max.

10 Sec. Max.

1~5 °C / Sec.

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

16-213SYGC/S530-XX/TR8

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 2 Page: 10 of 10

Device No: DSE-163-023 Prepared date: 08-Jan-2009 Prepared by: Betty Lin

4.Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds

within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do

soldering of each terminal. Be careful because the damage of the product is often started at the time of

the hand solder.

5.Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a

double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether

the characteristics of the LEDs will or will not be damaged by repairing.