1. Product profile
1.1 General description
Planar PIN diode in a SOD523 ultra small SMD plastic package.
1.2 Features and benefits
1.3 Applications
2. Pinning information
3. Ordering information
4. Marking
BAP65-02
Silicon PIN diode
Rev. 5 — 28 September 2010 Product data sheet
High voltage, current cont ro lled Low diode forward resistance (low loss)
RF resistor for RF switches Very low series inductance
Low diode capacitance
RF attenuators and switches Series diode for mobile communication
transmit/receive switch
Bandswitch for TV tuners
Table 1. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode
2 anode
21
sym006
Tabl e 2. Ordering information
Type number Package
Name Description Version
BAP65-02 - plastic surface-mounted package; 2 leads SOD523
Table 3. Marking codes
Type number Marking code
BAP65-02 K6
BAP65-02 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 5 — 28 September 2010 2 of 9
NXP Semiconductors BAP65-02
Silicon PIN diode
5. Limiting values
6. Thermal characteristics
7. Characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRcontinuous reverse voltage - 30 V
IFcontinuous forward current - 100 mA
Ptot total power dissipation Ts90 C-715mW
Tstg storage temperature 65 +150 C
Tjjunction temperature 65 +150 C
Tamb ambient temperature 40 +85 C
Table 5. Thermal characteris tics
Symbol Parameter Conditions Typ Unit
Rth j-s thermal resistance from junction
to soldering point 85 K/W
Table 6. Characteristics
Tj= 25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF=50mA - 0.9 1.1 V
IRreverse leakage current VR=20V --20nA
Cddiode capacitance VR=0V; f=1MHz - 0.65 - pF
VR= 1 V; f = 1 MHz - 0.55 0.9 pF
VR=3V; f=1MHz - 0.5 0.8 pF
VR=20V; f=1MHz - 0.375 - pF
rDdiode forward resistance IF= 1 mA; f = 100 MHz - 1 -
IF= 5 mA; f = 100 MHz [1] - 0.65 0.95
IF=10mA; f=100MHz [1] - 0.56 0.9
IF= 100 mA; f = 100 MHz - 0.35 -
s212isolation VR=0; f=900MHz - 10 - dB
VR= 0; f = 1800 MHz - 5.8 - dB
VR= 0; f = 2450 MHz - 4.4 - dB
s212insertion loss IF= 1 mA; f = 900 MHz - 0.11 - dB
IF= 1 mA; f = 1800 MHz - 0.13 - dB
IF= 1 mA; f = 2450 MHz - 0.16 - dB
s212insertion loss IF= 5 mA; f = 900 MHz - 0.08 - dB
IF= 5 mA; f = 1800 MHz - 0.11 - dB
IF= 5 mA; f = 2450 MHz - 0.13 - dB
BAP65-02 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 5 — 28 September 2010 3 of 9
NXP Semiconductors BAP65-02
Silicon PIN diode
[1] Guaranteed on AQL basis: inspection level S4, AQL 1.0.
s212insertion loss IF=10mA; f=900MHz - 0.07 - dB
IF= 10 mA; f = 1800 MHz - 0.1 - dB
IF= 10 mA; f = 2450 MHz - 0.13 - dB
s212insertion loss IF= 100 mA; f = 900 MHz - 0.07 - dB
IF=100mA;
f = 1800 MHz -0.1-dB
IF=100mA;
f = 2450 MHz -0.128-dB
Lcharge carrier life time when switched from
IF=10mA to I
R=6mA;
RL= 100 ; measured at
IR=3mA
-0.17-s
LSseries inductance IF= 100 mA; f = 100 MHz - 0.6 - nH
Table 6. Characteristics …continued
Tj= 25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
BAP65-02 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 5 — 28 September 2010 4 of 9
NXP Semiconductors BAP65-02
Silicon PIN diode
f = 100 MHz; Tj=25Cf=1MHz; T
j=25C
Fig 1. Forward re si stance as a function of forward
current; typical values Fig 2. Diode ca pacitance as a function of reverse
voltage; typical values
(1) IF=0.5mA
(2) IF=1mA
(3) IF=5mA
(4) IF=10mA
(5) IF= 100 mA
Diode inserted in series with a 50 stripline circuit and
biased via the analyzer Tee network. Tamb =25C.
Diode zero biased and inserted in series with a 50
stripline circuit. Tamb =25C.
Fig 3. Insertion loss (s212) of the diode as a function
of frequency; typical values Fig 4. Isolation (s212) of the diode as a function of
frequency; typical values
10
1
10−1
mld499
10−11IF (mA)
rD
(Ω)
10 102
020
1000
0
200
400
600
800
4
Cd
(fF)
VR (V)
81216
mld500
0 1000
(1) (2) (3) (4)
(5)
2000 f (MHz) 3000
0
−0.5
−0.1
−0.2
−0.3
−0.4
mld501
s21 2
(dB)
0 1000 2000 f (MHz) 3000
0
−10
−30
−40
−20
mld502
s21 2
(dB)
BAP65-02 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 5 — 28 September 2010 5 of 9
NXP Semiconductors BAP65-02
Silicon PIN diode
8. Package outline
Fig 5. Package outline SOD523
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOD523 SC-79 02-12-13
06-03-16
Plastic surface-mounted package; 2 leads SOD523
0 0.5 1 mm
scale
D
12
HE
Ebp
A
c
vMA
A
UNIT bpcDEv
mm
AH
E
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode.
(1) 0.34
0.26 0.17
0.11 0.1
0.85
0.75
1.25
1.15
0.65
0.58 1.65
1.55
BAP65-02 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 5 — 28 September 2010 6 of 9
NXP Semiconductors BAP65-02
Silicon PIN diode
9. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAP65-02 v.5 20100928 Product data sheet - BAP65-02_N v.4
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been updated.
•Table 4 “Limiting values”: added Tamb (ambient temperature).
BAP65-02_N v.4 20080108 Product data sheet - BAP65-02 v.3
BAP65-02 v.3
(9397 750 08364) 20010511 Product specification - BAP65-02 v.2
BAP65-02 v.2
(9397 750 08237) 20010507 Product specification - BAP65-02 v.1
BAP65-02 v.1
(9397 750 07724) 20001220 Product specification - -
BAP65-02 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 5 — 28 September 2010 7 of 9
NXP Semiconductors BAP65-02
Silicon PIN diode
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device (s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or comple teness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ion — The information and data provided in a Product
data sheet shall define the specification of the product as agr eed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-crit ical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors pro duct can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with t heir
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessa ry
testing for th e customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property right s.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
BAP65-02 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 5 — 28 September 2010 8 of 9
NXP Semiconductors BAP65-02
Silicon PIN diode
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors prod uct is automotive qualified,
the product is not suitable for automotive use. It i s neit her qua lified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applicati ons.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BAP65-02
Silicon PIN diode
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 September 2010
Document id en tifier: BAP65-02
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning in formation. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
