Si2307BDS Vishay Siliconix P-Channel 30-V (D-S) MOSFET FEATURES PRODUCT SUMMARY RDS(on) () ID (A)b 0.078 at VGS = - 10 V - 3.2 0.130 at VGS = - 4.5 V - 2.5 VDS (V) - 30 * Halogen-free Option Available * TrenchFET(R) Power MOSFET RoHS COMPLIANT TO-236 (SOT-23) G 1 3 S D 2 Top View Si2307BDS (L7)* * Marking Code Ordering Information: Si2307BDS-T1-E3 (Lead (Pb)-free) Si2307BDS-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted Parameter Symbol 5s Steady State Drain-Source Voltage VDS - 30 Gate-Source Voltage VGS 20 Continuous Drain Current (TJ = 150 C)b TA = 25 C TA = 70 C Pulsed Drain Currenta Operating Junction and Storage Temperature Range IS TA = 25 C TA = 70 C PD V - 3.2 - 2.5 - 2.6 - 2.0 IDM Continuous Source Current (Diode Conduction)b Power Dissipationb ID - 12 - 1.25 - 0.75 1.25 0.75 0.8 0.48 TJ, Tstg Unit - 55 to 150 A W C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambientb Maximum Junction-to-Ambientc Symbol RthJA Typical Maximum 80 100 130 166 Unit C/W Notes: a. Pulse width limited by maximum junction temperature. b. Surface Mounted on FR4 board, t 5 s. c. Surface Mounted on FR4 board. For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm Document Number: 72699 S-80427-Rev. C, 03-Mar-08 www.vishay.com 1 Si2307BDS Vishay Siliconix SPECIFICATIONS TJ = 25 C, unless otherwise noted Limits Parameter Symbol Test Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage Gate-Threshold Voltage Gate-Body Leakage VDS VGS = 0 V, ID = - 10 A - 30 VGS(th) VDS = VGS, ID = - 250 A - 1.0 IGSS VDS = 0 V, VGS = 20 V 100 VDS = - 30 V, VGS = 0 V -1 VDS = - 30 V, VGS = 0 V, TJ = 55 C - 10 Zero Gate Voltage Drain Current IDSS On-State Drain Currenta ID(on) Drain-Source On-Resistancea RDS(on) VDS - 10 V, VGS = - 10 V - 3.0 -6 V nA A A VGS = - 10 V, ID = - 3.2 A 0.063 0.078 VGS = - 4.5 V, ID = - 2.5 A 0.105 0.130 Forward Transconductancea gfs VDS = - 10 V, ID = - 3.2 A 5.0 Diode Forward Voltage VSD IS = - 0.75 A, VGS = 0 V - 0.85 - 1.2 9.0 15 S V Dynamicb Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Gate Resistance Rg Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss VDS = - 15 V, VGS = - 10 V ID - 1.7 A f = 1.0 MHz nC 1.4 2.4 8.0 380 VDS = - 15 V, VGS = 0 V, f = 1 MHz pF 100 75 Switchingc Turn-On Time Turn-Off Time td(on) tr td(off) tf VDD = - 15 V, RL = 15 ID - 1.0 A, VGEN = - 4.5 V Rg = 6 9 20 12 20 25 40 14 21 ns Notes: a. Pulse test: pulse width 300 s, duty cycle 2 %. b. For DESIGN AID ONLY, not subject to production testing. c. Switching time is essentially independent of operating temperature. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 72699 S-80427-Rev. C, 03-Mar-08 Si2307BDS Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 12 12 VGS = 10 thru 5 V 10 4V I D - Drain Current (A) I D - Drain Current (A) 10 8 6 4 6 4 TC = 125 C 25 C 3V 2 8 2 - 55 C 2V 0 0 2 4 6 8 0 0.0 10 0.5 1.0 VDS - Drain-to-Source Voltage (V) 2.0 2.5 3.0 3.5 4.0 4.5 VGS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics 700 0.30 600 C - Capacitance (pF) 0.25 R DS(on) - On-Resistance () 1.5 0.20 0.15 VGS = 4.5 V 0.10 VGS = 10 V 500 Ciss 400 300 200 0.05 100 0.00 0 Coss Crss 0 2 4 6 8 0 10 10 15 20 25 ID - Drain Current (A) VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current Capacitance 30 1.6 10 VGS = 10 V ID = 3.2 A VDS = 15 V ID = 3 A 1.4 8 R DS(on) - On-Resistance (Normalized) VGS - Gate-to-Source Voltage (V) 5 6 4 1.2 1.0 0.8 2 0 0 2 4 6 Qg - Total Gate Charge (nC) Gate Charge Document Number: 72699 S-80427-Rev. C, 03-Mar-08 8 10 0.6 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (C) On-Resistance vs. Junction Temperature www.vishay.com 3 Si2307BDS Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 0.6 10 R DS(on) - On-Resistance () I S - Source Current (A) 0.5 TJ = 150 C 0.4 0.3 ID = 3.2 A 0.2 0.1 TJ = 25 C 0.0 1 0 0.2 0.4 0.6 0.8 1.0 0 1.2 2 6 8 10 VGS - Gate-to-Source Voltage (V) VSD - Source-to-Drain Voltage (V) Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage 0.3 10 0.2 8 ID = 250 A 0.1 Power (W) VGS(th) Variance (V) 4 0.0 6 4 - 0.1 - 0.3 - 50 TA = 25 C 2 - 0.2 0 - 25 0 25 50 75 100 125 150 0.01 0.1 1 TJ - Temperature (C) 10 100 1000 Time (s) Threshold Voltage Single Pulse Power 100 Limited by R DS(on)* I D - Drain Current (A) 10 10 s 100 s 1 ms 1 10 ms 100 ms 0.1 10 s, 1 s DC, 100 s 0.01 TA = 25 C Single Pulse 0.001 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) * VGS > minimum V GS at which R DS(on) is specified Square Wave Pulse Duration (s) Safe Operating Area, Junction-to-Case www.vishay.com 4 Document Number: 72699 S-80427-Rev. C, 03-Mar-08 Si2307BDS Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 PDM 0.1 0.05 t1 t2 1. Duty Cycle, D = 0.02 t1 t2 2. Per Unit Base = R thJA = 62.5 C/W 3. T JM - TA = PDMZthJA(t) Single Pulse 4. Surface Mounted 0.01 10-4 10-3 10-2 10-1 1 10 100 600 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?72699. Document Number: 72699 S-80427-Rev. C, 03-Mar-08 www.vishay.com 5 Package Information Vishay Siliconix SOT-23 (TO-236): 3-LEAD b 3 E1 1 E 2 e S e1 D 0.10 mm C 0.004" A2 A C q Gauge Plane Seating Plane Seating Plane C A1 Dim 0.25 mm L L1 MILLIMETERS Min INCHES Max Min Max 0.044 A 0.89 1.12 0.035 A1 0.01 0.10 0.0004 0.004 A2 0.88 1.02 0.0346 0.040 b 0.35 0.50 0.014 0.020 c 0.085 0.18 0.003 0.007 D 2.80 3.04 0.110 0.120 E 2.10 2.64 0.083 0.104 E1 1.20 1.40 0.047 e 0.95 BSC e1 L 1.90 BSC 0.40 L1 q 0.0748 Ref 0.60 0.016 0.64 Ref S 0.024 0.025 Ref 0.50 Ref 3 0.055 0.0374 Ref 0.020 Ref 8 3 8 ECN: S-03946-Rev. K, 09-Jul-01 DWG: 5479 Document Number: 71196 09-Jul-01 www.vishay.com 1 AN807 Vishay Siliconix Mounting LITTLE FOOTR SOT-23 Power MOSFETs Wharton McDaniel Surface-mounted LITTLE FOOT power MOSFETs use integrated circuit and small-signal packages which have been been modified to provide the heat transfer capabilities required by power devices. Leadframe materials and design, molding compounds, and die attach materials have been changed, while the footprint of the packages remains the same. See Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs, (http://www.vishay.com/doc?72286), for the basis of the pad design for a LITTLE FOOT SOT-23 power MOSFET footprint . In converting this footprint to the pad set for a power device, designers must make two connections: an electrical connection and a thermal connection, to draw heat away from the package. ambient air. This pattern uses all the available area underneath the body for this purpose. 0.114 2.9 0.081 2.05 0.150 3.8 0.059 1.5 0.0394 1.0 0.037 0.95 FIGURE 1. Footprint With Copper Spreading The electrical connections for the SOT-23 are very simple. Pin 1 is the gate, pin 2 is the source, and pin 3 is the drain. As in the other LITTLE FOOT packages, the drain pin serves the additional function of providing the thermal connection from the package to the PC board. The total cross section of a copper trace connected to the drain may be adequate to carry the current required for the application, but it may be inadequate thermally. Also, heat spreads in a circular fashion from the heat source. In this case the drain pin is the heat source when looking at heat spread on the PC board. Figure 1 shows the footprint with copper spreading for the SOT-23 package. This pattern shows the starting point for utilizing the board area available for the heat spreading copper. To create this pattern, a plane of copper overlies the drain pin and provides planar copper to draw heat from the drain lead and start the process of spreading the heat so it can be dissipated into the Document Number: 70739 26-Nov-03 Since surface-mounted packages are small, and reflow soldering is the most common way in which these are affixed to the PC board, "thermal" connections from the planar copper to the pads have not been used. Even if additional planar copper area is used, there should be no problems in the soldering process. The actual solder connections are defined by the solder mask openings. By combining the basic footprint with the copper plane on the drain pins, the solder mask generation occurs automatically. A final item to keep in mind is the width of the power traces. The absolute minimum power trace width must be determined by the amount of current it has to carry. For thermal reasons, this minimum width should be at least 0.020 inches. The use of wide traces connected to the drain plane provides a low-impedance path for heat to move away from the device. www.vishay.com 1 Application Note 826 Vishay Siliconix 0.049 (1.245) 0.029 0.022 (0.559) (0.724) 0.037 (0.950) (2.692) 0.106 RECOMMENDED MINIMUM PADS FOR SOT-23 0.053 (1.341) 0.097 (2.459) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index Return to Index APPLICATION NOTE Document Number: 72609 Revision: 21-Jan-08 www.vishay.com 25 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Revision: 12-Mar-12 1 Document Number: 91000