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FEATURES
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
PGND
LOUTN
GAIN0
PVDD
LINN
AGND
COSC
RINN
PVDD
SHUTDOWN
ROUTN
PGND
PGND
LOUTP
BYPASS
PVDD
LINP
VDD
ROSC
RINP
PVDD
GAIN1
ROUTP
PGND
PW OR PWP PACKAGE
(TOP VIEW)
DESCRIPTION
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
2-W FILTERLESS STEREO CLASS-D AUDIO POWER AMPLIFIER
•Short-Circuit Protection (Short to Battery,Ground, and Load)•Modulation Scheme Optimized to OperateWithout a Filter •-40°C to 85°C Operating Temperature Range•2 W Into 3- ΩSpeakers (THD+N< 0.4%)•< 0.08% THD+N at 1 W, 1 kHz, Into 4- ΩLoad•Extremely Efficient Third Generation 5-VClass-D Technology:
– Low Supply Current (No Filter) . . . 8 mA– Low Supply Current (Filter) . . . 15 mA– Low Shutdown Current . . . 1 µA– Low Noise Floor . . . 56 µV
RMS– Maximum Efficiency Into 3 Ω, 65-70%– Maximum Efficiency Into 8 Ω, 75-85%– 4 Internal Gain Settings . . . 8-23.5 dB– PSRR . . . -77 dB•Integrated Depop Circuitry
The TPA2000D2 is the third generation 5-V class-D amplifier from Texas Instruments. Improvements to previousgeneration devices include: lower supply current, lower noise floor, better efficiency, four different gain settings,smaller packaging, and fewer external components. The most significant advancement with this device is itsmodulation scheme that allows the amplifier to operate without the output filter. Eliminating the output filter savesthe user approximately 30% in system cost and 75% in PCB area.
The TPA2000D2 is a monolithic class-D power IC stereo audio amplifier, using the high switching speed ofpower MOSFET transistors. These transistors reproduce the analog signal through high-frequency switching ofthe output stage. The TPA2000D2 is configured as a bridge-tied load (BTL) amplifier capable of deliveringgreater than 2 W of continuous average power into a 3- Ωload at less than 1% THD+N from a 5-V power supplyin the high fidelity range (20 Hz to 20 kHz). With 1 W being delivered to a 4- Ωload at 1 kHz, the typical THD+Nis less than 0.08%.
A BTL configuration eliminates the need for external coupling capacitors on the output. Low supply current of 8mA makes the device ideal for battery-powered applications. Protection circuitry increases device reliability:thermal, over-current, and under-voltage shutdown.
Efficient class-D modulation enables the TPA2000D2 to operate at full power into 3- Ωloads at an ambienttemperature of 85°C.
AVAILABLE OPTIONS
(1)
PACKAGED DEVICET
A
TSSOP (PW) TSSOP (PWP)
(2)
–40°C to 85°C TPA2000D2PW TPA2000D2PWP
(1) For the most current package and ordering information, see the Package Option Addendum at the endof this document, or see the TI web site at www.ti.com.(2) The PWP package is available taped and reeled. To order a taped and reeled part, add the suffix R tothe part number (e.g., TPA2000D2PWPR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2000–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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Gate
Drive
_
+
Gate
Drive
_
+
_
+_
+
Gain
Adjust
Gain
Adjust
Start-Up
Protection
Logic
OC
Detect
OC
Detect
Thermal VDD ok
Ramp
Generator
Biases
and
References
Gate
Drive
_
+
Gate
Drive
_
+
_
+_
+
Gain
Adjust
Gain
Adjust
Gain 2
AGNDVDD
VDD PVDD
RINN ROUTN
PGND
PVDD
ROUTP
PGND
PVDD
LOUTP
PGND
PVDD
LOUTN
PGND
RINP
SHUTDOWN
GAIN1
GAIN0
COSC
ROSC
BYPASS
LINP
LINN
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
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ABSOLUTE MAXIMUM RATINGS
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
TERMINAL FUNCTION
TERMINAL
I/O DESCRIPTIONNAME NO.
AGND 6 - Analog groundBYPASS 22 I Tap to voltage divider for internal midsupply bias generator used for analog reference.A capacitor connected to this terminal sets the oscillation frequency in conjunction with ROSC. ForCOSC 7 I
proper operation, connect a 220 pF capacitor from COSC to ground.GAIN0 3 I Bit 0 of gain control (TTL logic level)GAIN1 15 I Bit 1 of gain control (TTL logic level)LINN 5 I Left channel negative differential audio inputLINP 20 I Left channel positive differential audio inputLOUTN 2 O Left channel negative audio outputLOUTP 23 O Left channel positive audio output1, 24 - Power ground for left channel H-bridgePGND
12, 13 - Power ground for right channel H-bridge4, 21 - Power supply for left channel H-bridgePV
DD
9, 16 - Power supply for right channel H-bridgeRINN 8 I Right channel negative differential audio inputRINP 17 I Right channel positive differential audio inputA resistor connected to this terminal sets the oscillation frequency in conjunction with COSC. ForROSC 18 I
proper operation, connect a 120 k Ωresistor from ROSC to ground.ROUTN 11 O Right channel negative audio outputROUTP 14 O Right channel positive outputPlaces the amplifier in shutdown mode if a TTL logic low is placed on this terminal; normal operation ifSHUTDOWN 10 I
a TTL logic high is placed on this terminal.V
DD
19 - Analog power supply
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
V
DD
, PV
DD
Supply voltage -0.3 V to 6 VV
I
Input voltage -0.3 V to V
DD
+0.3 VContinuous total power dissipation See Dissipation Rating TableT
A
Operating free-air temperature range -40°C to 85°CT
J
Operating junction temperature range -40°C to 150°CT
stg
Storage temperature range -65°C to 150°CLead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
T
A
≤25°C DERATING FACTOR T
A
= 70°C T
A
= 85°CPACKAGE
POWER RATING ABOVE T
A
= 25°C POWER RATING POWER RATING
PW 1.04 W 8.34 mW/°C 0.67 W 0.54 WPWP 2.7 W 21.8 mW/°C 1.7 W 1.4 W
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RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
OPERATING CHARACTERISTICS
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
MIN TYP MAX UNIT
V
DD
, PV
DD
Supply voltage 4.5 5.5 VV
IH
High-level input voltage GAIN0, GAIN1, SHUTDOWN 2 VV
IL
Low-level input voltage GAIN0, GAIN1, SHUTDOWN 0.8 VR
OSC
Oscillator resistance 120 k ΩC
OSC
Oscillator capacitance 220 pFf
s
Switching frequency 200 300 kHzT
A
Operating free-air temperature -40 85 °C
T
A
= 25°C, V
DD
= PV
DD
= 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
| V
OO
| Output offset voltage (measured differentially) V
I
= 0 V 25 mVPSRR Power supply rejection ratio V
DD
=PV
DD
= 4.5 V to 5.5 V -77 dBI
IH
High-level input current V
DD
=PV
DD
= 5.5 V, V
I
= V
DD
= PV
DD
1 µAI
IL
Low-level input current V
DD
=PV
DD
= 5.5 V, V
I
= 0 V 1 µAI
DD
Supply current No filter (with or without speaker load) 8 10 mAI
DD
Supply current With filter, L = 22 µH, C = 1 µF 15 mAI
DD(SD)
Supply current, shutdown mode 1 15 µA
T
A
= 25°C, V
DD
= PV
DD
= 5 V, R
L
= 4 Ω, Gain = 8 dB (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
P
O
Output power THD = 0.1%, f = 1 kHz, R
L
= 3 Ω2 WTHD+N Total harmonic distortion plus noise P
O
= 1 W, f = 20 Hz to 20 kHz <0.5%B
OM
Maximum output power bandwidth THD = 5% 20 kHzk
SVR
Supply ripple rejection ratio f = 1 kHz, C
(BYPASS)
= 0.4 µF -60 dBSNR Signal-to-noise ratio 87 dBVIntegrated noise floor 20 Hz to 20 kHz, No input 56 µVZ
I
Input impedance >20 k Ω
Table 1. Gain Settings
AMPLIFIER GAIN INPUT IMPEDANCE(dB) (k Ω)GAIN1 GAIN0
TYP TYP
0 0 8 1040 1 12 741 0 17.5 441 1 23.5 24
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TYPICAL CHARACTERISTICS
TEST SET-UP FOR GRAPHS
C2
C1
L1
L2
OUT–
OUT+
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
Table of Graphs
FIGURE
ηEfficiency vs Output power 2, 3FFT at 1.5 W output power vs Frequency 4vs Output power 5-7THD+N Total harmonic distortion plus noise
vs Frequency 8, 9Crosstalk vs Frequency 10Power supply rejection ratio vs Frequency 11
The THD+N measurements shown do not use an LC output filter, but use a low pass filter with a cutofffrequency of 20 kHz so the switching frequency does not dominate the measurement. This is done to ensurethat the THD+N measured is just the audible THD+N. The THD+N measurements are shown at the highest gainfor worst case.
The LC output filter used in the efficiency curves (Figure 2 and Figure 3 ) is shown in Figure 1 .L1 = L2 = 22 µH (DCR = 110 m Ω,Part number = SCD0703T-220 M-S,Manufacturer = GCI)C1 = C2 = 1 µF
The ferrite filter used in the efficiency curves (Figure 2 and Figure 3 ) is shown in Figure 1 , where L is a ferritebead.
L1 = L2 = ferrite bead (part number = 2512067007Y3, manufacturer = Fair-Rite)C1 = C2 = 1 nF
Figure 1. Class-D Output Filter
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TYPICAL CHARACTERISTICS
0
10
20
30
40
50
60
70
80
90
0 0.2 0.4 0.6 0.8 1 1.2
No Filter
Ferrite Bead Filter
LC Filter
Class−AB
RL = 8 Ω, Multimedia Speaker
VDD = 5 V
Efficiency − %
PO − Output Power − W
0
10
20
30
40
50
60
70
80
0 0.5 1 1.5 2
Ferrite Bead Filter
Notebook Speaker
Class−AB
Efficiency − %
PO − Output Power − W
LC Filter
RL = 3 Ω, Notebook PC Speaker
VDD = 5 V
−140
+0
−120
−100
−80
−60
−40
−20
0 24k2k 4k 6k 8k 10k 12k 14k 16k 18k 20k 22k
Power − VdB
f − Frequency − Hz
VDD = 5 V,
Gain = 8 dB,
f = 1 kHz,
PO = 1.5 W,
Bandwidth = 20 Hz to 22 kHz,
16386 Frequency Bins
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
EFFICIENCY EFFICIENCYvs vsOUTPUT POWER OUTPUT POWER
Figure 2. Figure 3.
FFT AT 1.5 W OUTPUT POWERvsFREQUENCY
Figure 4.
6
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0.01
0.1
1
10
10 m
THD+N − Total Harmonic Distortion − %
100 m 1 2 3
PO − Output Power − W
VDD = 5 V
Gain = 23.5 dB
RL = 3 Ω
1 kHz
20 kHz
20 Hz
1 kHz
20 kHz
20 Hz
VDD = 5 V
Gain = 23.5 dB
RL = 4 Ω
0.1
0.01
10 m 100 m
1
10
1 2 3
THD+N − Total Harmonic Distortion − %
PO − Output Power − W
1 kHz
0.1
0.01
10 m 100 m
1
10
1 2
THD+N − Total Harmonic Distortion − %
PO − Output Power − W
VDD = 5 V
Gain = 23.5 dB
RL = 8 Ω
20 Hz
20 kHz
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
TYPICAL CHARACTERISTICS (continued)
TOTAL HARMONIC DISTORTION PLUS NOISE TOTAL HARMONIC DISTORTION PLUS NOISEvs vsOUTPUT POWER OUTPUT POWER
Figure 5. Figure 6.
TOTAL HARMONIC DISTORTION PLUS NOISE TOTAL HARMONIC DISTORTION PLUS NOISEvs vsOUTPUT POWER FREQUENCY
Figure 7. Figure 8.
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0.1
0.0120 100 1 k
1
10
20 k
f − Frequency − Hz
0.1 W
1 W
0.5 W
THD+N − Total Harmonic Distortion − %
VDD = 5 V
Gain = 23.5 dB
RL = 8 Ω
f − Frequency − Hz
Crosstalk − dB
−70
−60
−50
−40
−30
1 10 100 1 k 10 k 100 k
Left to Right
Right to Left
−90
−80
−70
−60
−50
−40
−30
10 100 1 k 10 k 100 k
f − Frequency − Hz
PSRR − Power Supply Rejection Ratio − dB
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
TYPICAL CHARACTERISTICS (continued)TOTAL HARMONIC DISTORTION PLUS NOISEvsFREQUENCY
Figure 9.
CROSSTALK POWER SUPPLY REJECTION RATIOvs vsFREQUENCY FREQUENCY
Figure 10. Figure 11.
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APPLICATION INFORMATION
ELIMINATING THE OUTPUT FILTER WITH THE TPA2000D2
EFFECT ON AUDIO
TRADITIONAL CLASS-D MODULATION SCHEME
O V
–5 V
+5 V
Current
OUT+
Differential Voltage
Across Load
OUT–
TPA2000D2 MODULATION SCHEME
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
This section focuses on why the user can eliminate the output filter with the TPA2000D2.
The class-D amplifier outputs a pulse-width modulated (PWM) square wave, which is the sum of the switchingwaveform and the amplified input audio signal. The human ear acts as a band-pass filter such that only thefrequencies between approximately 20 Hz and 20 kHz are passed. The switching frequency components aremuch greater than 20 kHz, so the only signal heard is the amplified input audio signal.
The traditional class-D modulation scheme, which is used in the TPA005Dxx family, has a differential outputwhere each output is 180 degrees out of phase and changes from ground to the supply voltage, V
DD
. Therefore,the differential prefiltered output varies between positive and negative V
DD
, where filtered 50% duty cycle yields0 volts across the load. The traditional class-D modulation scheme with voltage and current waveforms is shownin Figure 12 . Note that even at an average of 0 volts across the load (50% duty cycle), the current to the load ishigh causing high loss, thus causing a high supply current.
Figure 12. Traditional Class-D Modulation Scheme's Output Voltage and Current Waveforms Into anInductive Load With No Input
The TPA2000D2 uses a modulation scheme that still has each output switching from 0 to the supply voltage.However, OUT+ and OUT- are now in phase with each other with no input. The duty cycle of OUT+ is greaterthan 50% and OUT- is less than 50% for positive voltages. The duty cycle of OUT+ is less than 50% and OUT-is greater than 50% for negative voltages. The voltage across the load sits at 0 volts throughout most of theswitching period greatly reducing the switching current, which reduces any I
2
R losses in the load.
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0 V
–5 V
+5 V
Current
OUT+
OUT–
Differential
Voltage
Across
Load
0 V
–5 V
+5 V
Current
OUT+
OUT–
Differential
Voltage
Across
Load
Output = 0 V
Output > 0 V
EFFICIENCY: WHY YOU MUST USE A FILTER WITH THE TRADITIONAL CLASS-D
EFFECTS OF APPLYING A SQUARE WAVE INTO A SPEAKER
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
APPLICATION INFORMATION (continued)
Figure 13. The TPA2000D2 Output Voltage and Current Waveforms Into an Inductive Load
MODULATION SCHEMEThe main reason that the traditional class-D amplifier needs an output filter is that the switching waveformresults in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripplecurrent is large for the traditional modulation scheme because the ripple current is proportional to voltagemultiplied by the time at that voltage. The differential voltage swing is 2 × V
DD
and the time at each voltage ishalf the period for the traditional modulation scheme. An ideal LC filter is needed to store the ripple current fromeach half cycle for the next half cycle, while any resistance causes power dissipation. The speaker is bothresistive and reactive, whereas an LC filter is almost purely reactive.
The TPA2000D2 modulation scheme has very little loss in the load without a filter because the pulses are veryshort and the change in voltage is V
DD
instead of 2 × V
DD
. As the output power increases, the pulses widenmaking the ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but formost applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flowthrough the filter instead of the load. The filter has less resistance than the speaker, which results in less powerdissipated and increased efficiency.
Audio specialists have said for years not to apply a square wave to speakers. If the amplitude of the waveform ishigh enough and the frequency of the square wave is within the bandwidth of the speaker, the square wavecould cause the voice coil to jump out of the air gap and/or scar the voice coil. A 250-kHz switching frequency,however, is not significant because the speaker cone movement is proportional to 1/f
2
for frequencies beyondthe audio band. Therefore, the amount of cone movement at the switching frequency is very small. However,
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PSPKR = PSUP – PSUP THEORETICAL (at max output power)
(1)
PSPKR = PSUP / POUT – PSUP THEORETICAL / POUT (at max output power)
(2)
PSPKR = 1/ηMEASURED – 1/ηTHEORETICAL (at max output power)
(3)
WHEN TO USE AN OUTPUT FILTER
GAIN SETTING VIA GAIN0 AND GAIN1 INPUTS
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
APPLICATION INFORMATION (continued)damage could occur to the speaker if the voice coil is not designed to handle the additional power. To size thespeaker for added power, the ripple current dissipated in the load needs to be calculated by subtracting thetheoretical supplied power, P
SUP THEORETICAL
, from the actual supply power, P
SUP
, at maximum output power,P
OUT
. The switching power dissipated in the speaker is the inverse of the measured efficiency, η
MEASURED
, minusthe theoretical efficiency, η
THEORETICAL
.
The maximum efficiency of the TPA2000D2 with an 8- Ωload is 85%. Using Equation 3 with the efficiency atmaximum power from Figure 2 (78%), we see that there is an additional 106 mW dissipated in the speaker. Theadded power dissipated in the speaker is not an issue as long as it is taken into account when choosing thespeaker.
Design the TPA2000D2 without the filter if the traces from amplifier to speaker are short. The TPA2000D2passed FCC and CE radiated emissions with no shielding with speaker wires 8 inches (20,32 cm) long or less.Notebook PCs and powered speakers where the speaker is in the same enclosure as the amplifier are goodapplications for class-D without a filter.
A ferrite bead filter can often be used if the design is failing radiated emissions without a filter, and the frequencysensitive circuit is greater than 1 MHz. This is good for circuits that just have to pass FCC and CE because FCCand CE only test radiated emissions greater than 30 MHz. If choosing a ferrite bead, choose one with highimpedance at high frequencies, but very low impedance at low frequencies.
Use an output filter if there are low frequency (< 1 MHz) EMI sensitive circuits and/or there are long leads fromamplifier to speaker.
The gain of the TPA2000D2 is set by two input terminals, GAIN0 and GAIN1.
The gains listed in Table 2 are realized by changing the taps on the input resistors inside the amplifier. Thiscauses the input impedance, Z
I
, to be dependent on the gain setting. The actual gain settings are controlled byratios of resistors, so the actual gain distribution from part-to-part is quite good. However, the input impedancemay shift by 30% due to shifts in the actual resistance of the input resistors.
For design purposes, the input network (discussed in the next section) should be designed assuming an inputimpedance of 20 k Ω, which is the absolute minimum input impedance of the TPA2000D2. At the lower gainsettings, the input impedance could increase to as high as 115 k Ω.
Table 2. Gain Settings
AMPLIFIER GAIN INPUT IMPEDANCE(dB) (k Ω)GAIN1 GAIN0
TYP TYP
0 0 8 1040 1 12 741 0 17.5 441 1 23.5 24
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INPUT RESISTANCE
CIIN ZI
ZF
Input
Signal
f*3 dB +1
2pCIZI
(4)
INPUT CAPACITOR, C
I
fc(highpass) +1
2pZICI
−3 dB
fc
(5)
CI+1
2pZIfc
(6)
CI ≤ CBYP / 10
(7)
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
Each gain setting is achieved by varying the input resistance of the amplifier, which can range from its smallestvalue to over 6 times that value.
The -3 dB frequency can be calculated using Equation 4 :
In the typical application an input capacitor, C
I
, is required to allow the amplifier to bias the input signal to theproper dc level for optimum operation. In this case, C
I
and the input impedance of the amplifier, Z
I
, form ahigh-pass filter with the corner frequency determined in Equation 5 .
The value of C
I
is important, as it directly affects the bass (low frequency) performance of the circuit. Considerthe example where Z
I
is 20 k Ωand the specification calls for a flat bass response down to 80 Hz. Equation 5 isreconfigured as Equation 6 .
In this example, C
I
is 0.1 µF, so one would likely choose a value in the range of 0.1 µF to 1 µF. If the gain isknown and is constant, use Z
I
from Table 1 to calculate C
I
. A further consideration for this capacitor is theleakage path from the input source through the input network (C
I
) and the feedback network to the load. Thisleakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especiallyin high gain applications. For this reason a low-leakage tantalum or ceramic capacitor is the best choice. Whenpolarized capacitors are used, the positive side of the capacitor should face the amplifier input in mostapplications as the dc level there is held at V
DD
/2, which is likely higher than the source dc level. Note that it isimportant to confirm the capacitor polarity in the application.
C
I
should be 10 times smaller than the bypass capacitor to reduce clicking and popping noise from power on/offand entering and leaving shutdown. After sizing CI for a given cutoff frequency, size the bypass capacitor up to10 times that of the input capacitor.
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SWITCHING FREQUENCY
fs+6.6
ROSC COSC
(8)
POWER SUPPLY DECOUPLING, C
S
MIDRAIL BYPASS CAPACITOR, C
BYP
CBYP ≥ 10 × CI
(9)
DIFFERENTIAL INPUT
SHUTDOWN MODES
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
The switching frequency is determined using the values of the components connected to R
OSC
(pin 18) and C
OSC(pin 7) and is calculated with the following equation:
The switching frequency was chosen to be centered on 250 kHz. This frequency is the optimum audio fidelity ofoversampling and of maximizing efficiency by minimizing the switching losses of the amplifier. Therecommended values are a resistance of 120 k Ωand a capacitance of 220 pF. Using these component values,the amplifier operates properly by using 5% tolerance resistors and 10% tolerance capacitors. The tolerance ofthe components can be changed, as long as the switching frequency remains between 200 kHz and 300 kHz.Within this range, the internal circuitry of the device provides stable operation.
The TPA2000D2 is a high-performance CMOS audio amplifier that requires adequate power supply decouplingto ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling alsoprevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling isachieved by using two capacitors of different types that target different types of noise on the power supply leads.For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance(ESR) ceramic capacitor, typically 0.1 µF placed as close as possible to the device V
DD
lead works best. Forfiltering lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed nearthe audio power amplifier is recommended.
The midrail bypass capacitor, C
BYP
, is the most critical capacitor and serves several important functions. Duringstart-up or recovery from shutdown mode, C
BYP
determines the rate at which the amplifier starts up. The secondfunction is to reduce noise produced by the power supply caused by coupling into the output drive signal. Thisnoise is from the midrail generation circuit internal to the amplifier, which appears as degraded PSRR andTHD+N.
Bypass capacitor, C
BYP
, values of 0.47 µF to 1 µF ceramic or tantalum low-ESR capacitors are recommendedfor the best THD and noise performance.
Increasing the bypass capacitor reduces clicking and popping noise from power on/off and entering and leavingshutdown. To have minimal pop, C
BYP
should be 10 times larger than C
I
.
The differential input stage of the amplifier cancels any noise that appears on both input lines of a channel. Touse the TPA2000D2 EVM with a differential source, connect the positive lead of the audio source to the RINP(LINP) input and the negative lead from the audio source to the RINN (LINN) input. To use the TPA2000D2 witha single-ended source, ac ground the RINN and LINN inputs through a capacitor and apply the audio single tothe RINP and LINP inputs. In a single-ended input application, the RINN and LINN inputs should beac-grounded at the audio source instead of at the device inputs for best noise performance.
The TPA2000D2 employs a shutdown mode of operation designed to reduce supply current, I
DD
, to the absoluteminimum level during periods of nonuse for battery-power conservation. The SHUTDOWN input terminal shouldbe held high during normal operation when the amplifier is in use. Pulling SHUTDOWN low causes the outputsto mute and the amplifier to enter a low-current state, I
DD(SD)
= 1 µA. SHUTDOWN should never be leftunconnected, because amplifier operation would be unpredictable.
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USING LOW-ESR CAPACITORS
EVALUATION CIRCUIT
RIGHT AUDIO INPUT+
TO SYSTEM CONTROL
TPA2000D2
C7
220 pF
C18
C2
C3
C4
LEFT AUDIO INPUT+
C17
C1
C6
C5 LEFT AUDIO OUTPUT+
C8
VDD
VDD
RIGHT AUDIO OUTPUT –
R1
120k
C19
C20
C21
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
1 µF
10 µF
0.1 µF
0.1 µF
0.1 µF
SHUTDOWN
PGND
LOUTN
GAIN0
LPVDD
LINN
AGND
COSC
RINN
RPVDD
ROUTN
PGND
PGND
LOUTP
BYPASS
LPVDD
LINP
VDD
ROSC
RINP
RPVDD
GAIN1
ROUTP
PGND
20
10 10 µF
LEFT AUDIO INPUT–
RIGHT AUDIO INPUT–
VDD
VDD
GAIN SELECT
GAIN SELECT
RIGHT AUDIO OUTPUT +
LEFT AUDIO OUTPUT–
TPA2000D2
SLOS291F – MARCH 2000 – REVISED MARCH 2007
Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal)capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across thisresistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of thisresistance the more the real capacitor behaves like an ideal capacitor.
Table 3. TPA2000D2 Application Bill of Materials
REFERENCE DESCRIPTION SIZE QUANTITY MANUFACTURER PART NUMBER
C1-4, C17-21 Capacitor, ceramic chip, 0.1 µF, ±10%, X7R, 50 V 0805 9 Kemet C0805C104K5RACC5 Capacitor, ceramic, 1.0 µF, 80%/-20%, Y5V, 16 V 0805 1 Murata GRM40-Y5V105Z16C6, C8 Capacitor, ceramic, 10 µF, 80%/-20%, Y5V, 16 V 1210 2 Murata GRM235-Y5V106Z16C7 Capacitor, ceramic, 220 pF, ±10%, XICON, 50 V 0805 2 Mouser 140-CC501B221KR1 Resistor, chip, 120 k Ω, 1/10 W, 5%, XICON 0805 1 Mouser 260-120KIC, TPA2000D2, audio power amplifier, 2-W, 24 pinU1 1 TI TPA2000D2PWP2-channel, class-D TSSOP
14
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPA2000D2PW ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPA2000D2PWG4 ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPA2000D2PWP ACTIVE HTSSOP PWP 24 60 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPA2000D2PWPG4 ACTIVE HTSSOP PWP 24 60 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPA2000D2PWPR ACTIVE HTSSOP PWP 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPA2000D2PWPRG4 ACTIVE HTSSOP PWP 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPA2000D2PWR ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPA2000D2PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Apr-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPA2000D2PWPR HTSSOP PWP 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
TPA2000D2PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA2000D2PWPR HTSSOP PWP 24 2000 367.0 367.0 38.0
TPA2000D2PWR TSSOP PW 24 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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