53252-117 - Micropac Industries, Inc.

Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.

Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.

MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION •• 905 E. Walnut St., Garland, TX 75040 •• (972) 272-3571 •• Fax (972) 494-2281

www.micropac.com E-MAIL: microsales@micropac.com 6/9/03 Pg. 1 of 6

53252 90V - 0.8A DUAL POWER

MOSFET OPTOCOUPLERS

DSCC DWG #5962-03247 Mii

Features:

• 8-Pin Dual-In-Line Hermetic Package

• Performance over –55°C to +125°C

• Compact Isolation Solid State Switches

• Continuous Output Current: 0.8 A (1)

• Optically Coupled between Input and Output

• Isolation Tested to 1000 VDC

• High Level of Transient Immunity

• 3 A Output Surge Current

• Shock and Vibration Resistant

• MIL-PRF-38534 screening optional

Applications:

• Military/High Reliability Systems

• Standard 28 VDC and 48 VDC Load Driver

• Aircraft Controls

• Electromechanical and Solid State Relay

Replacement

• I/O Modules

• Switching Heaters

DESCRIPTION

The 53252 is two power MOSFET optocouplers in a single 8-pin dual-in-line package suitable for applications

where two independent switches are required. The popular hermetic eight-pin dual-in-line ceramic package

combined with 1000 VDC isolation between input and output and between two isolated relays, makes this device

ideal for solid-state relay applications. Performance is specified over the full military temperature range. This device

is available in a variety of quality levels from COTS to class H including any custom screening requirements. Gold

plated leads are standard, but other lead finishes per MIL-PRF-38534 are also available.

Functionally, the device operates as two SPST, normally open (2 Form “A”) solid-state relays. Each relay is

actuated by an input current, which can be driven from a standard TTL device. The input current biases a light

emitting diode that is optically coupled to an integrated photovoltaic diode array. The photovoltaic diode array

energizes control circuitry that operates the output MOSFET.

MICROPAC

MICROCIRCUITS PRODUCTS

DIVISION

53252 90VDC – 0.8A Dual Power MOSFET Optocouplers

DSCC DWG# 5962-03247

Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.

Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.

MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION •• 905 E. Walnut St., Garland, TX 75040 •• (972) 272-3571 •• Fax (972) 494-2281

www.micropac.com E-MAIL: microsales@micropac.com 6/9/03 Pg. 2 of 6

ABSOLUTE MAXIMUM RATINGS:

(Per relay unless otherwise noted)

Storage Temperature Range ..…………………………………………………………........……............ -65°C to +150°C

Operating Ambient Temperature - TA ...................…………………………………………………..….. -55°C to +125°C

Junction Temperature - TJ ..............................…………………………………………………….......…........…. +150°C

Lead Solder Temperature for 10 seconds .......................………………………………………....…….............. +260°C

(1.6 mm below seating plane)

Average Input Current - IF ....................…...………………………………………………..……......................... 20 mA

Peak Repetitive Input Current - IFpk .............……………………………………...…………………..................... 40 mA

(pulse width < 100 ms; duty cycle < 50%)

Peak Surge Input Current - IFpk surge .............……………………………………………………….................. 100 mA

(pulse width < 0.2 ms; duty cycle < 0.1%)

Continuous Output Current per relay - IO ...…………………………………..………….................................... 0.8 A (1)

Single Shot Output Current per relay- IOpk surge (pulse width < 10 ms) …………..……………..…...…………...... 3 A

Output Voltage - VO ............................…...………………………………………..……………….…….............. 90 VDC

RECOMMENDED OPERATING CONDITIONS:

Parameter Symbol Min. Max. Units

Input Current (ON) IF (ON) 10 20 mA

Input Voltage (OFF) VF (OFF) 0 0.6 VDC

Operating Temperature TA -55 +125 °C

53252 90VDC – 0.8A Dual Power MOSFET Optocouplers

DSCC DWG# 5962-03247

Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.

Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.

MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION •• 905 E. Walnut St., Garland, TX 75040 •• (972) 272-3571 •• Fax (972) 494-2281

www.micropac.com E-MAIL: microsales@micropac.com 6/9/03 Pg. 3 of 6

ELECTRICAL SPECIFICATIONS

Limits

Test Symbol Conditions

-55°C ≤ TA ≤ +125°C

unless otherwise specified.

Group A

subgroups

Device

type Min Max Unit

Output Withstand Voltage VO(OFF) VFOFF = 0.6 V, IO = 10 µA 1, 2, 3 All 90 V

Output On-Resistance 2/ R(ON)

IFON = 10 mA, IO = 800 mA,

pulse duration ≤ 30 ms,

duty cycles < 10% 1, 2, 3 All 1.2 Ω

Output Leakage Current IO (OFF) VFOFF = 0.6 V, VO = 90 V 1, 2, 3 All 10 µA

Input Forward Voltage VFOFF IFON = 10 mA 1, 2, 3 All 1.0 1.7 V

Input Reverse Breakdown Voltage VR IR = 10 µA 1, 2, 3 All 5.0 V

Input-Output Isolation Current 3/ II-O VI-O = 1000 V dc, t = 5 s,

RH ≤ 45%, TA = +25°C 1, 2, 3 All 1.0 µA

Channel-Channel Isolation Current 3/ IISO VISO = 1000 V dc, t = 5 s,

RH ≤ 45%, TA = +25°C 1, 2, 3 All 1.0 µA

Turn-On Time 2/ tON IFON = 10 mA, IO = 800 mA,

Pulse duration ≤ 30 ms,

duty cycles < 10% 1, 2, 3 All 6.0 ms

Turn-Off time 2/ tOFF IFON = 10 mA, IO = 800 mA,

pulse duration ≤ 30 ms,

duty cycles < 10% 1, 2, 3 All 2.0 ms

Notes:

1. Maximum average current rating where the case temperature (TC) is maintained below 120°C.

2. During the pulsed RON measurement (IO duration < 30 ms), ambient (TA) and case temperature (TC) are equal.

3. This is a momentary withstand test, not a continuous operating condition.

4. Typical junction to case thermal resistance (θJC) for the device is 15°C/W, where case temperature (TC) is measured at the center of the

package bottom.

CAUTION:

Care should be taken not to exceed the maximum output power dissipation, maximum case temperature, and maximum junction temperature

when repetitively switching loads.

53252 90VDC – 0.8A Dual Power MOSFET Optocouplers

DSCC DWG# 5962-03247

Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.

Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.

MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION •• 905 E. Walnut St., Garland, TX 75040 •• (972) 272-3571 •• Fax (972) 494-2281

www.micropac.com E-MAIL: microsales@micropac.com 6/9/03 Pg. 4 of 6

Case outlines X, Y

Terminal number Terminal symbol

+ IN 1

- IN 1

- OUT 2

+ OUT 2

+ IN 2

- IN 2

- OUT 1

+ OUT 1

FIGURE 2. Terminal connections.

Input Output

OFF OFF

ON ON

FIGURE 3. Truth table(s).

53252 90VDC – 0.8A Dual Power MOSFET Optocouplers

DSCC DWG# 5962-03247

Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.

Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.

MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION •• 905 E. Walnut St., Garland, TX 75040 •• (972) 272-3571 •• Fax (972) 494-2281

www.micropac.com E-MAIL: microsales@micropac.com 6/9/03 Pg. 5 of 6

Case outline X

e b

5°

0°

SEATING

PLANE

BASE

PLANE

Millimeters Inches

Symbol Min Max Min Max

A 6.99 .275

A1 1.40 1.65 .055 .065

b 0.41 0.53 .016 .021

c 0.18 0.33 .007 .013

D 9.40 9.91 .370 .390

e 2.29 2.79 .090 .110

E 9.65 9.91 .380 .390

E1 8.13 .320

L 1.07 1.32 .042 .052

S 0.89 1.27 .035 .050

Case outline Y

beA

BASE

PLANE

SETTING

PLANE

Millimeters Inches

Symbol Min Max Min Max

A 6.60 .260

A1 0.76 1.27 .030 .050

b 0.41 0.53 .016 .021

c 0.18 0.33 .007 .013

D 9.40 9.91 .370 .390

e 2.29 2.79 .090 .110

E 8.13 .320

eA 7.37 7.87 .290 .310

L 12.70 .500

Q 0.51 .020

S 0.89 1.27 .035 .050

NOTES:

1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement.

In case of problems involving conflicts between the metric and in-pound units, the inch-pound units shall rule.

2. Pin 1 is indicated by the ESD triangle(s) marked on top of the package.

53252 90VDC – 0.8A Dual Power MOSFET Optocouplers

DSCC DWG# 5962-03247

Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.

Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.

MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION •• 905 E. Walnut St., Garland, TX 75040 •• (972) 272-3571 •• Fax (972) 494-2281

www.micropac.com E-MAIL: microsales@micropac.com 6/9/03 Pg. 6 of 6

The following chart explains the ordering procedure for Micropac Part Numbers.

Please contact Micropac for other desired options.

Mii DASH NO. CASE

OUTLINE LEAD FINISH SCREENING LEVEL PER MIL-PRF-38534

53252-101 Y SOLDER DIP NO SCREENING

53252-102 Y GOLD PLATE NO SCREENING

53252-103 Y SOLDER DIP SCREENING PER TABLE C1X H LEVEL

53252-104 Y GOLD PLATE SCREENING PER TABLE C1X H LEVEL

53252-105 Y SOLDER DIP SCREENING PER TABLE C1X K LEVEL

53252-106 Y GOLD PLATE SCREENING PER TABLE C1X K LEVEL

53252-107 Y SOLDER DIP COMPLIANT TO H LEVEL

53252-108 Y GOLD PLATE COMPLIANT TO H LEVEL

53252-111 X SOLDER DIP SCREENING PER TABLE C1X H LEVEL

53252-112 X GOLD PLATE SCREENING PER TABLE C1X H LEVEL

53252-113 X SOLDER DIP SCREENING PER TABLE C1X K LEVEL

53252-114 X GOLD PLATE SCREENING PER TABLE C1X K LEVEL

53252-115 X SOLDER DIP NO SCREENING

53252-116 X GOLD PLATE NO SCREENING

53252-117 X SOLDER DIP COMPLIANT TO H LEVEL

53252-118 X GOLD PLATE COMPLIANT TO H LEVEL