S3AB - S3MB Taiwan Semiconductor 3A, 50V - 1000V Surface Mount Rectifier FEATURES KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Low forward voltage drop High surge current capability Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF(AV) 3 A VRRM 50 - 1000 V IFSM 80 A TJ MAX 150 C Package DO-214AA (SMB) Configuration Single Die Switching mode power supply (SMPS) Adapters Lighting application Converter MECHANICAL DATA Case: DO-214AA (SMB) Molding compound meets UL 94V-0 flammability rating Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Moisture sensitivity level: level 1, per J-STD-020 Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: As marked Weight: 0.09 g (approximately) DO-214AA (SMB) ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted) PARAMETER Marking code on the device Repetitive peak reverse voltage Reverse voltage, total rms value Maximum DC blocking voltage Forward current Surge peak forward current, 8.3 ms single half sine-wave superimposed on rated load per diode Junction temperature Storage temperature SYMBOL VRRM VR(RMS) VDC IF(AV) S3AB S3BB S3DB S3GB S3JB S3KB S3MB UNIT S3AB S3BB S3DB S3GB S3JB S3KB S3MB 50 100 200 400 600 800 1000 V 35 70 140 280 420 560 700 V 50 100 200 400 600 800 1000 V 3 A IFSM 80 A TJ - 55 to +150 C TSTG - 55 to +150 C 1 Version:L1705 S3AB - S3MB Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT RJL 10 C/W Junction-to-lead thermal resistance ELECTRICAL SPECIFICATIONS (TA = 25C unless otherwise noted) PARAMETER CONDITIONS Forward voltage per diode (1) SYMBOL TYP MAX UNIT VF - 1.15 V - 10 A - 250 A CJ 40 - pF trr 1500 - ns IF = 3A,TJ = 25C Reverse current @ rated VR per diode TJ = 25C (2) IR TJ = 125C Junction capacitance 1 MHz, VR=4.0V IF=0.5A , IR=1.0A Reverse recovery time IRR=0.25A Notes: 1. Pulse test with PW=0.3 ms 2. Pulse test with PW=30 ms ORDERING INFORMATION PART NO. PART NO. SUFFIX PACKING PACKING CODE CODE SUFFIX(*) R5 S3xB (Note 1) H R4 G M4 PACKAGE PACKING SMB 850 / 7" Plastic reel SMB 3,000 / 13" Paper reel SMB 3,000 / 13" Plastic reel Note: 1. "x" defines voltage from 50V (S3AB) to 1000V (S3MB) *: Optional available EXAMPLE P/N EXAMPLE P/N PART NO. S3ABHR5G S3AB PART NO. PACKING PACKING CODE SUFFIX CODE SUFFIX H R5 G 2 DESCRIPTION AEC-Q101 qualified Green compound Version:L1705 S3AB - S3MB Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 100 3 2.5 CAPACITANCE (pF) AVERAGE FORWARD CURRENT (A) 3.5 2 1.5 1 0.5 10 RESISTIVE OR INDUCTIVE LOAD 0 0 20 40 60 80 100 120 140 f=1.0MHz Vsig=50mVp-p 1 160 1 10 REVERSE VOLTAGE (V) LEAD TEMPERATURE (C) Fig.3 Typical Reverse Characteristics Fig.4 Typical Forward Characteristics 100 10 TJ=125C 1 TJ=25C 0.1 20 40 60 80 100 120 140 10 10 TJ=125C TJ=25C 0.1 1 0.01 0.001 0.3 0.1 0.6 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) UF1DLW 1 (A) INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (A) 100 0 100 0.7 0.4 0.8 0.5 0.9 0.6 1 0.7 1.1 Pulse width Pulse Width=300s 1% Duty Cycle 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 FORWARD VOLTAGE (V) 3 Version:L1705 1.2 S3AB - S3MB Taiwan Semiconductor Fig.5 Maximum Non-repetitive Forward Surge Current PEAK FORWARD SURGE URRENT (A) 100 8.3ms Single Half Sine Wave 10 1 10 100 NUMBER OF CYCLES AT 60 Hz Fig.6 Reverse Recovery Time Characteristic And Test Circuit Diagram 4 Version:L1705 S3AB - S3MB Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AA (SMB) DIM. Unit (mm) Unit (inch) Min Max Min Max A 1.95 2.20 0.077 0.087 B 4.05 4.60 0.159 0.181 C 3.30 3.95 0.130 0.156 D 1.95 2.65 0.077 0.104 E 0.75 1.60 0.030 0.063 F 5.10 5.60 0.201 0.220 G 0.05 0.20 0.002 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 2.3 0.091 B 2.5 0.098 C 4.3 0.169 D 1.8 0.071 E 6.8 0.268 MARKING DIAGRAM P/N G YW F 5 = Marking Code = Green Compound = Date Code = Factory Code Version:L1705 S3AB - S3MB Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version:L1705