Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 1 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
*Contents in this sheet are subject to change without prior notice.
MULTILAYER CERAMIC CAPACITORS
Soft Termination High Voltage Series (SH)
X7R Dielectric
0805 to 1812 Sizes, 500V to 3kV
RoHS Compliance
Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 2 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
1. INTRODUCTION
WTC Multilayer Ceramic Chip Capacitors supplied in tape & reel package are ideally suitable for thick-film hybrid
circuits and automatic surface mounting on any printed circuit boards. All of WTC’s MLCC products meet RoHS directive.
SH series use a special material between nickel-barrier and ceramic body. It provides excellent performance to
against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by
electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations
prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
4. HOW TO ORDER
SH 21 B 102 K 102 C T
Series
SH=Soft
termination
High Voltage
Size
21=0805 (2012)
31=1206 (3216)
32=1210 (3225)
42=1808 (4520)
43=1812 (4532)
Dielectric
B=X7R
Capacitance
Two significant digits
followed by no. of zeros.
And R is in place of
decimal point.
Eg.
102=10x10
2
=1000pF
Tolerance
J5%
K10%
M20%
Rated voltage
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
501=500 VDC
631=630 VDC
102=1000 VDC
202=2000 VDC
302=3000 VDC
Termination
C=Cu/Polymer
Ag/Ni/Sn
Packaging
T=7” reeled
G=13” reeled
Note 1: Please see below product range to find right termination code.
2. FEATURES
a. Withstanding 5mm of substrate bending.
b. High Voltage in a given case size.
c. High reliability and stability.
3. APPLICATIONS
a. DC to DC converter.
b. High voltage coupling/DC blocking.
c. Back-lighting inverters.
d. Snubbers in high frequency power convertors.
Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 3 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
5. EXTERNAL DIMENSIONS
6. GENERAL ELECTRICAL DATA
Dielectric X7R
Size 0805, 1206, 1210, 1808, 1812
Capacitance* 100pF to 0.12uF
Capacitance tolerance** J (±5%), K (±10%), M (±20%)
Rated voltage (WVDC) 500V, 630V, 1000V, 2000V, 3000V
Tan δ* 2.5%
Insulation resistance at Ur*** 10G or RxC500-F whichever is smaller
Operating temperature -55 to +125°C
Capacitance characteristic ±15%
Termination Ni/Sn (lead-free termination)
* Measured at 25°C ambient temperature and 30~70% related humidity. Apply 1.0±0.2Vrms, 1.0kHz±10%.
** Preconditioning for Class II MLCC: Perform a heat treatment at 1510°C for 1 hour, then leave in ambient condition for 24±2 hours
before measurement.
***Measured at 500VDC for 60 sec, for U
R
>500VDC
Size
Inch (mm)
L (mm) W (mm) T (mm)/Symbol Remark
M
B
(mm)
0.60±0.10 A
0.80±0.10 B
2.00±0.20 1.25±0.10
1.25±0.10 D
#
0805 (2012)
2.00+0.25/-0.2
1.25±0.20
1.25±0.20 I
#
0.50±0.20
0.80±0.10 B
0.95±0.10 C
1.15±0.15 J
#
3.20+0.4/-0.1
1.60±0.15
1.25±0.10 D
#
3.20+0.4/-0.1
1.60±0.20
1.60±0.20 G
#
1206 (3216)
3.20+0.4/-0.1
1.60+0.3/0.1
1.60+0.30/-0.10
P
#
0.60±0.20
(0.50±0.25)**
0.95±0.10 C
#
3.20±0.40 2.50±0.20
1.25±0.10 D
#
1.60±0.20 G
#
2.00±0.20 K
#
1210 (3225)
3.20±0.50 2.50±0.30
2.50±0.30 M
#
0.50±0.25
1.25±0.10 D
#
3.20±0.30
2.00±0.20 K
#
1812 (4532)
4.50+0.6/-0.4
3.20±0.40
2.50±0.30 M
# 0.50±0.25
# Reflow soldering only is recommended.
** For 1206_1kV~3kV
T
W
L
M
B
M
B
Fig. 1 The outline of MLCC
Inner electrode
Ceramic
Sn
Cu/Ni
Ag polymer
Metallic
termination
Fig. 2 The construction of S
oft
termination series
MLCC
Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 4 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
7. CAPACITANCE RANGE (X7R Dielectric)
DIELECTRIC X7R
SIZE 0805 1206 1210 1808 1812
RATED VOLTAGE
(VDC) 500,
630
500,
630
1000
2000
500,
630
1000
1000
2000
3000
500,
630
1000
2000
3000
100pF (101)
B
120pF (121)
B
150pF (151)
B D D D D D D
180pF (181)
B D D D D D D
220pF (221)
B D D D D D D
270pF (271)
B D D D D D D
330pF (331)
B D D D D D K
390pF (391)
B D D D D D K
470pF (471)
B D D D D D K D D D K
560pF (561)
B D D D D D K D D D K
680pF (681)
B D D D D D K D D D K
820pF (821)
B D D G D D K D D D K
1,000pF (102)
B D D G G G D K K D D D K
1,200pF (122)
B D D G G D K D D D
1,500pF (152)
B D D G G D K D D D
1,800pF (182)
B D D G G D K D D K
2,200pF (222)
B D D G G D D D K
2,700pF (272)
B D D G G D D D K
3,300pF (332)
B D D G G D D D K
3,900pF (392)
B D D G G D D D K
4,700pF (472)
D D D G G D D D K
5,600pF (562)
D D D G G K D D
6,800pF (682)
D D D G G K D D
8,200pF (822)
D D D G G K D D
0.010µF (103)
D D D G G K D D
0.012µF (123)
D G D K
0.015µF (153)
D G D K
0.018µF (183)
D G D
0.022µF (223)
G G D
0.027µF (273)
G G D
0.033µF (333)
G G D
0.039µF (393)
G D
0.047µF (473)
G D
0.056µF (563)
G D
0.068µF (683)
G K
0.082µF (823)
K
0.10µF (104)
K
Capacitance
0.12µF (124)
K
Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 5 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
8. PACKAGING DIMENSION AND QUANTITY
Paper tape Plastic tape
Size Thickness (mm)/Symbol 7” reel 13” reel 7” reel 13” reel
0.80±0.10 B 4k 15k - -
1.25±0.10 D - - 3k 10k
0805 (2012)
1.25±0.20 I - - 3k 10k
0.80±0.10 B 4k 15k - -
0.95±0.10 C - - 3k 10k
1.15±0.15 J - - 3K 10K
1.25±0.10 D - - 3k 10k
1.60±0.20 G - - 2k 10k
1206 (3216)
1.60+0.30/-0.10 P - - 2k 9k
0.95±0.10 C - - 3k 10k
1.25±0.10 D - - 3k 10k
1.60±0.20 G - - 2k -
2.00±0.20 K - - 1k 6k
1210 (3225)
2.50±0.30 M - - 1k 6k
1.25±0.10 D - - 1k 5k
2.00±0.20 K - - 1k -
1812 (4532)
2.50±0.30 M - - 0.5k 3k
Unit: pieces
Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 6 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Condition Requirements
1.
Visual and
Mechanical
--- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance * Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
Class I: (NP0)
Cap1000pF, 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
Class II: (X7R, Y5V)
1.0±0.2Vrms, 1kHz±10%
NP0: Cap30pF, Q1000; Cap<30pF, Q400+20C
X7R: 2.5%
Y5V: 5.0%
4.
Dielectric
Strength
* To apply voltage:
200V~300V 2 times VDC
500V~999V 1.5 times VDC
1000V~3000V 1.2 times VDC
* Cut-off, set at 10mA
* TEST= 15 sec.
* RAMP=0
* No evidence of damage or flash over during test.
Rated voltage:
200~630V
To apply rated voltage (500V max.)
for 60 sec.
10G or RxC100-F whichever is smaller
5.
Insulation
Resistance
Rated voltage: 630V To apply 500V for 60 sec. 10G
6.
Temperature
Coefficient
With no electrical load.
T.C. Operating Temp
NP0 -55~125°C at 25°C
X7R -55~125°C at 25°C
Y5V -25~85°C at 20°C
T.C. Capacitance Change
NP0 Within ±30ppm/°C
X7R Within ±15%
Y5V Within +30%/-80%
7.
Adhesive
Strength of
Termination
* Pressurizing force
5N (0603) and 10N (>0603)
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time:0.5 sec.
95% min. coverage of all metalized area.
10.
Bending Test
*The middle part of substrate shall be pressurized by means of the
pressurizing rod at a rate of about 1 mm per second until the
deflection becomes 1 mm / SH series: 5 mm** & 3 mm*** and then
the pressure shall be maintained for 5±1 sec.
*Measurement to be made after keeping at room temp. for 24±2
hrs. (** Thickness >1.0mm; *** Thickness 1.0mm)
* No remarkable damage.
* Cap change
NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R: within ±12.5%
Y5V: within ±30%
(This capacitance change means the change of capacitance under
specified flexure of sub
strate from the capacitance measured before
the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before imme rse the
capacitor in a eutectic solder.
* Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at r oom temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change:
NP0: within ±2.5% or ±0.25pF whichever is larger.
X7R: within ±7.5%
Y5V: within ±20%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 7 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
No.
Item Test Condition Requirements
12.
Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
Step
Temp. (°C) Time (min.)
1 Min. operating temp. +0/-3
30±3
2 Room temp. 2~3
3 Max. operating temp. +3/-0 30±3
4 Room temp. 2~3
* Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at r oom temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change
NP0: within ±2.5 or ±0.25pF whichever is larger.
X7R: within ±7.5%
Y5V: within ±20%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
13.
Humidity
(Damp Heat)
Steady State
* Test temp.: 40±2°C
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
*Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at r oom temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R: within ±12.5%
Y5V: within ±30%
* Q/D.F. value:
NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C
Cap<10pF; Q200+10C
X7R: 3.0%
Y5V: 7.5%
* I.R.: 1G or RxC50-F whichever is smaller.
14.
Humidity
(Damp Heat)
Load
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltagerated voltage (Max. 500V)
* Before initial measurement (Class II only): To apply test
voltage for 1hr at 40°C and then set for 24±2 hrs at room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: NP0: within ±7.5% or ±0.75pF whichever is larger.
X7R: within ±12.5%
Y5V: within ±30%
* Q/D.F. value:
NP0: Cap30pF, Q200; Cap<30pF, Q100+10/3C
X7R: 3.0%
Y5V: 7.5%
* I.R.: 500M or RxC25-F whichever is smaller.
15.
High
Temperature
Load
(Endurance)
* Test temp.:
NP0, X7R: 125±3°C
Y5V: 85±3°C
* To apply voltage:
(1) <500V: 200% of rated voltage.
(2) 500V: 150% of rated voltage.
(3) 630V: 120% of rated voltage.
(4) 1206,NP0 1.5pF: 100% of rated voltage.
* Test time: 1000+24/-0 hrs.
*Before initial measurement (Class II only): To apply test
voltage for 1hr at test temp. and then set for 24±2 hrs at room
temp.
*Measurement to be made after keeping at room temp. for
24±2 hrs
* No remarkable damage.
* Cap change: NP0: within ±3.0% or ±0.3pF whichever is larger.
X7R: within ±12.5%
Y5V: within ±30%
* Q/D.F. value:
NP0: Cap30pF, Q350
10pFCap<30pF, Q275+2.5C
Cap<10pF, Q200+10C
X7R: 3.0%
Y5V: 7.5%
* I.R.: 1G or RxC50-F whichever is smaller.
Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 8 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
APPENDIXES
Tape & reel dimensions
Size 0603 0805 1206 1210 1808 1812
Thickness
S, X B C, D, I
B C, D G C, D, G
M D K D, K
A
0
1.02±0.05
1.50±0.10
<1.57 2.00±0.10
<1.85 <1.95 <2.97 <2.97 <2.35 <2.35 <3.81
B
0
1.80±0.05
2.30±0.10
<2.40 3.50±0.10
<3.46 <3.67 <3.73 <3.73 <4.98 <5.00 <5.30
T 0.95±0.05
0.95±0.05
0.23±0.05
0.95±0.05
0.23±0.05
0.23±0.05
0.23±0.05
0.23±0.05
0.25±0.05
0.25±0.05
0.25±0.05
K
0
- - <2.50 - <2.50 <2.50 <2.50 <3.0 <2.50 <2.50 <2.50
W 8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
12.0±0.20
12.0±0.20
12.0±0.20
P
0
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.100
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
10xP
0
40.0±0.10
40.0±0.10
40.0±0.10
40.0±0.10
40.0±0.10
40.0±0.10
40.0±0.10
40.0±0.10
40.0±0.10
40.0±0.10
40.0±0.10
P
1
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
8.00±0.10
P
2
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
D
0
1.55±0.05
1.55±0.05
1.50±0.05
1.50±0.05
1.50±0.05
1.50±0.05
1.50±0.05
1.50±0.05
1.50±0.05
1.50±0.05
1.50±0.05
D
1
- - 1.00±0.10
- 1.00±0.10
1.00±0.10
1.00±0.10
1.00±0.10
1.50±0.10
1.50±0.10
1.50±0.10
E 1.75±0.05
1.75±0.05
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
F 3.50±0.05
3.50±0.05
3.50±0.05
3.50±0.05
3.50±0.05
3.50±0.05
3.50±0.05
3.50±0.05
5.50±0.05
5.50±0.05
5.50±0.05
Fig. 4 The dimension of plastic tape
Fig. 5 The dimension of reel
Fig. 3 The dimension of paper tape
Size 0603, 0805, 1206, 1210 1808, 1812
Reel size
7” 10” 13” 7”
C 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2
W
1
8.4+1.5/-0 8.4+1.5/-0 8.4+1.5/-0 12.4+2.0/-0
A 178.0±0.10 250.0±1.0 330.0±1.0 178.0±0.10
N 60.0+1/-0 100.0±1.0 100±1.0 60.5±1.0
Approval sheet
Soft Termination High voltage (SH_500V~3kV)
Page 9 of 9 ASC_Soft term high voltage_(SH_500V~3kV)_021E Oct. 2012
Description of customer label
Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,
chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low
reliability.
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by
direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.
Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N
2
within oven are recommended.
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
Fig. 6 Recommended reflow soldering profile for SMT process
with SnAgCu series solder paste.
4
/ sec max
Over 60sec at least by
natural cooling
4
/ sec max
Over 60sec at least by
natural cooling
Fig. 7 Recommended wave soldering profile for SMT process
with SnAgCu series solder.