Applications
• Point-of-load modules
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Notebook regulators
• Graphics cards and battery power systems
• DCR current sensing
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 700 parts per 13” diameter reel
HALOGEN
HF
FREE
Pb
Description
• Halogen free
• 125°C maximum total temperature operation
• 10.3 x 8.1 x 6.65mm surface mount package
• Ferrite core material
• Secure 3 terminal mounting
• High current carrying capacity, low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 0.3µH to 10.0µH
• Current range from 5.3 to 48 Amps
• Frequency range up to 1MHz
• RoHS compliant
High Current, High Frequency, Power Inductors
HCF1007 Series
0910 BU-SB10928 Page 1 of 4 Data Sheet 4361
SMD Device
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
4I
sat1: Peak current for approximately 20% rolloff at +25°C.
5I
sat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p:(Gauss), K:
(K-factor from table), L: (Inductance in μH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition:HCF1007-xxx-R
• HCF1007 = Product code and size
• xxx= Inductance value in μH, R = decimal point.
If no “R” is present then third character =# of zeros
• -R suffix = RoHS compliant
Product Specifications
OCL1FLL2Irms3 Isat14Isat25DCR mΩ
Part Number7µH ± 20% Min (µH) Amps Amps @25°C Amps @125°C @20°C K-factor6
HCF1007-R30-R 0.30 0.21 30 48 35 0.90±10% 279.9
HCF1007-R42-R 0.42 0.30 26 45 36 1.30±7% 186.6
HCF1007-R56-R 0.56 0.40 26 36 28 1.30±7% 186.6
HCF1007-R68-R 0.68 0.49 26 29 23 1.30±7% 186.6
HCF1007-1R0-R 1.0 0.72 16 26 21 2.65±6% 139.9
HCF1007-1R5-R 1.5 1.08 13 22 17 4.15±6% 112.0
HCF1007-2R2-R 2.2 1.57 10.7 18 14 6.35±6% 93.30
HCF1007-3R3-R 3.3 2.37 10 14.5 11 7.50±6% 79.97
HCF1007-4R7-R 4.7 3.38 9.4 12 8.9 8.65±6% 69.97
HCF1007-5R6-R 5.6 4.03 9.4 9.4 7.5 8.65±6% 69.97
HCF1007-6R8-R 6.8 4.90 9.4 7.8 6.1 8.65±6% 69.97
HCF1007-100-R 10.0 7.20 9.4 5.3 4.2 8.65±6% 69.97
S ection A -A
A
A
6.70
1.5 dia 1.5 dia
4.0
2.0
12.0
1.75
11.5
24.0
±
0.3
User direction of feed
1
2
10.50
8.20
HCF1007
wwllyy R
XXX
1
2
HCF1007
wwllyy R
10.10
± 0.2
7.8
± 0.3
6.65
max
1.80
ref
6.0
± 0.5
12
2.3
± 0.3
8.60 3.61
3.0
XXX
2.9
2.0
3.6
2.4
± 0.3
1.3
± 0.3
4.2
± 0.5
12
2
1
Top View Side View Bottom View Recommended Pad Layout Schematic
Test DCR at
the bend points
Dimensions - mm
Part Marking: Coiltronics logo HCF1007 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros yyllww = Date code R = Revision level
Supplied in tape-and-reel packaging, 700 parts per reel, 13” diameter reel.
Packaging Information - mm
0910 BU-SB10928 Page 2 of 4 Data Sheet 4361
Temperature Rise vs. Total Loss
0
10
20
30
40
50
60
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Total Loss (W)
Temperature Rise (°C)
0910 BU-SB10928 Page 2 of 4 Data Sheet 4361
Core Loss
Core Loss vs. B
0.00001
0.0001
0.001
0.01
0.1
1
10
100 1000 10000
B (G auss)
Core Loss(W)
1MHz
500kHz
300kHz
200kHz
100kHz
p-p
p-p
Inductance Characteristics
% of OCL vs. % of I
sat
1
0%
20%
40%
60%
80%
100%
0% 20% 40% 60% 80% 100% 120% 140% 160%
% of I
sat
1
% of OCL
+25°C
-40°C
+125
© 2009 Cooper Bussmann
www.cooperbussmann.com
0910 BU-SB10928 Page 4 of 4 Data Sheet 4361
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume
Package mm3mm3
Thickness <350 >
_350
<2.5mm 235°C220°C
>
_2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
Average ramp up rate Tsmaxto Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C217°C
Time at liquidous (tL)60-150 Seconds60-150 Seconds
Peak package body temperature (TP)*Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tpto Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
