1/13April 2004
■5V TOLERANT INPUTS
■HIGH SPEED: tPD = 4.2ns (MAX.) at VCC =3V
■LOW POWER DISSIPATION:
ICC =1µA(MAX.)atT
A=25°C
■POWER DOWN PROTECTION ON INPUTS
AND OUTPUTS
■SYMMETRICAL OUTPUT IMPEDANCE:
|IOH|=I
OL = 24mA (MIN) at VCC =3V
■BALANCED PROPAGATION DELAYS:
tPLH ≅tPHL
■OPERATING VOLTAGE RANGE:
VCC(OPR) = 1.65V to 5.5V
(1.2V Data Retention)
■IMPROVED LATCH-UP IMMUNITY
DESCRIPTION
The 74LX1G04 is a low voltage CMOS SINGLE
INVERTER fabricated with sub-micron silicon
gate and double-layer metal wiring C2MOS
technology.
It is ideal for 1.65 to 5.5 VCC operations and low
power and low noise applications. The internal
circuit is composed of 3 stages including buffer
output, which provide high noise immunity and
stable output.
Powerdownprotectionisprovidedoninputand
output and 0 to 7V can be accepted on inputs with
no regard to the supply voltage. It can be
interfaced to 5V signal environment for inputs in
mixed 3.3/5V system.
All inputs and outputs are equipped with
protection circuits against static discharge.
74LX1G04
LOW VOLTAGE CMOS SINGLE INVERTER
WITH 5V TOLERANT INPUT
PIN CONNECTION AND IEC LOGIC SYMBOLS (top view for SOT, top through view for Flip-Chip)
ORDER CODES
PACKAGE T & R
SOT23-5L 74LX1G04STR
SOT323-5L 74LX1G04CTR
Flip-Chip 74LX1G04BJR
Flip-Chip4
SOT23-5 SOT323-5
74LX1G04
2/13
INPUT AND OUTPUT EQUIVALENT CIRCUIT
PIN DESCRIPTION
TRUTH TABLE
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Rating are those value beyond which damage to the device may occur. Functional operation under these condition is not
implied
1) IOabsolute maximum rating must be observed
2) VO<GND
PIN for SOT PIN for Flip-Chip SYMBOL NAME AND FUNCTION
1 N.C. Not connected
2 1 1A Data Input
4 3 1Y Data Output
3 2 GND Ground (0V)
54 VCC Positive Supply Voltage
AY
LH
HL
Symbol Parameter Value Unit
VCC Supply Voltage -0.5 to +7.0 V
VIDC Input Voltage -0.5 to +7.0 V
VODC Output Voltage (VCC =0V) -0.5 to +7.0 V
VODC Output Voltage (High or Low State) (note 1) -0.5 to VCC +0.5 V
IIK DC Input Diode Current -50 mA
IOK DC Output Diode Current (note 2) -50 mA
IODC Output Current ±50 mA
ICC or IGND DC VCC or Ground Current per Supply Pin ±50 mA
Tstg Storage Temperature -65 to +150 °C
TLLead Temperature (10 sec) 260 °C
74LX1G04
3/13
RECOMMENDED OPERATING CONDITIONS
1) Truth Table guaranteed: 1.2V to 3.6V
2) VIN from 0.8V to 2V at VCC =3.0V
DC SPECIFICATION
Symbol Parameter Value Unit
VCC Supply Voltage (note 1) 1.65 to 5.5 V
VIInput Voltage 0to5.5 V
VOOutput Voltage (VCC =0V) 0to5.5 V
VOOutput Voltage (High or Low State) 0 to VCC V
IOH,I
OL High or Low Level Output Current (VCC =4.5to5.5V) ±32 mA
IOH,I
OL High or Low Level Output Current (VCC =3.0to3.6V) ±24 mA
IOH,I
OL High or Low Level Output Current (VCC =2.7to3.0V) ±16 mA
IOH,I
OL High or Low Level Output Current (VCC =2.3to2.7V) ±8mA
IOH,I
OL High or Low Level Output Current (VCC =1.65to2.3V) ±4mA
Top Operating Temperature -55 to 125 °C
dt/dv Input Rise and Fall Time (note 2) 0 to 10 ns/V
Symbol Parameter
Test Condition Value
Unit
VCC
(V)
-40 to 85 °C -55 to 125 °C
Min. Max. Min. Max.
VIH High Level Input
Voltage 1.65 to 1.95 0.75VCC 0.75VCC V2.3 to 2.7 0.7VCC 0.7VCC
3.0 to 5.5 0.7VCC 0.7VCC
VIL Low Level Input
Voltage 1.65 to 1.95 0.25VCC 0.25VCC V2.3 to 2.7 0.3VCC 0.3VCC
3.0 to 5.5 0.3VCC 0.3VCC
VOH High Level Output
Voltage 1.65 to 4.5 IO=-100 µAV
CC-0.1 VCC-0.1
V
1.65 IO=-4 mA 1.2 1.2
2.3 IO=-8 mA 1.9 1.9
3.0 IO=-16 mA 2.4 2.4
IO=-24 mA 2.2 2.2
4.5 IO=-32 mA 3.8 3.8
VOL Low Level Output
Voltage 1.65 to 4.5 IO=100 µA0.1 0.1
V
1.65 IO=4 mA 0.45 0.45
2.3 IO=8 mA 0.3 0.3
3.0 IO=16 mA 0.4 0.4
IO=24 mA 0.55 0.55
4.5 IO=32 mA 0.55 0.55
IIInput Leakage
Current 1.65 to 5.5 VI= 0 to 5.5V ±10 ±10 µA
Ioff Power Off Leakage
Current 0VIor VO=5.5V 10 10 µA
ICC Quiescent Supply
Current 1.65 to 5.5 VI=V
CC or GND 10 10 µA
74LX1G04
4/13
AC ELECTRICAL CHARACTERISTICS
CAPACITANCE CHARACTERISTICS
1) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without
load. (Refer to Test Circuit). Average current can be obtained by the following equation. ICC(opr) =C
PD xV
CC xf
IN +I
CC
Symbol Parameter
Test Condition Value
Unit
VCC
(V) CL
(pF) RL
(Ω)ts=tr
(ns)
-40to85°C -55to125°C
Min. Max. Min. Max.
tPLH tPHL Propagation Delay
Time 1.65 to 1.95
15 1MΩ2.0
29.5210.5
ns
2.3to2.7 26.527.6
3.0to3.6 15.516.5
4.5to5.5 14.115.5
1.65 to 1.95 30 1000 2.0 2 10.5 2 11.5
2.3 to 2.7 30 500 2.0 2 7.5 2 8.5
2.7 50 500 2.5 1 6.1 1 7.1
3.0 to 3.6 50 500 2.5 1 5.5 1 6.5
4.5 to 5.5 50 500 2.5 1 4.2 1 5.2
Symbol Parameter
Test Condition Value
Unit
VCC
(V)
TA=25°C
Min. Typ. Max.
CIN Input Capacitance 04pF
CPD Power Dissipation Capacitance
(note 1) 1.8 fIN =10MHz 36.8 pF2.5 37
3.3 38
74LX1G04
5/13
TEST CIRCUIT
RT=Z
OUT of pulse generator (typically 50Ω)
TEST CIRCUIT AND WAVEFORM SYMBOL VALUE
WAVEFORM: PROPAGATION DELAY (f=1MHz; 50% duty cycle)
Symbol VCC
1.65 to 1.95V 2.3 to 2.7V 2.7 to 5.5V
CL15pF/30pF 15pF/30pF 15pF/50pF
RL1MΩ/1000Ω500Ω500Ω
VIH VCC VCC VCC
VMVCC/2 VCC/2 VCC/2
tr=t
r<2.0ns <2.0ns <2.5ns
74LX1G04
6/13
Figure 1 : RECOMMENDED SOLDERING REFLOW PROFILE FOR LEADFREE FLIP-CHIP
MOUNTING ON PCB
For Flip-Chip mounting on the PCB, STMicroelectronics recommends the use of a solder stencil aperture
of 330 x 330 µm² maximum and a typical stencil thickness of 125µm. Flip-Chips are fully compatible with
the use of near eutectic 95.5Sn 4Ag 0.5Cu solder paste with no clean flux. ST's recommendations for
Flip-Chip board mounting are illustrated on the soldering reflow profile shown in figure 1 below.
Dwell time in the soldering zone (with temperature higher than 220°C) has to be kept as short as possible
to prevent component and substrate damages. Peak temperature must not exceed 260°C. Controlled
atmosphere (N2 or N2H2) is recommended during the whole reflow, specially above 150°C.
Flip-Chips are able to withstand three times the previous recommended reflow profile in order to be
compatible with a double reflow when SMDs are mounted on both sides of the PCB plus one additional
repair. A maximum of three soldering reflows are allowed for these leadfree packages (with repair step
included). The use of a no clean flux is highly recommended to avoid any cleaning operation. In order to
prevent any bump cracks, ultrasonic cleaning methods are not recommended.
001234567
Time (min)
Temperature (˚C)
2˚C/s recommended
6˚C/s max
220˚C
125 ˚C
260˚C max
255˚C
180˚C
90 sec max
10-30 sec
90 to 150 sec
3˚C/s max
001234567
Time (min)
Temperature (˚C)
2˚C/s recommended
6˚C/s max
220˚C
125 ˚C
260˚C max
255˚C
180˚C
90 sec max
10-30 sec
3˚C/s max
74LX1G04
7/13
DIM. mm. mils
MIN. TYP MAX. MIN. TYP. MAX.
A 0.90 1.45 35.4 57.1
A1 0.00 0.10 0.0 3.9
A2 0.90 1.30 35.4 51.2
b 0.35 0.50 13.7 19.7
C 0.09 0.20 3.5 7.8
D 2.80 3.00 110.2 118.1
E 1.50 1.75 59.0 68.8
e0.95 37.4
H 2.60 3.00 102.3 118.1
L 0.10 0.60 3.9 23.6
SOT23-5L MECHANICA L DATA
7049676C
.
74LX1G04
8/13
DIM. mm. mils
MIN. TYP MAX. MIN. TYP. MAX.
A 0.80 1.10 31.5 43.3
A1 0.00 0.10 0.0 3.9
A2 0.80 1.00 31.5 39.4
b 0.15 0.30 5.9 11.8
C 0.10 0.18 3.9 7.1
D 1.80 2.20 70.9 86.6
E 1.80 2.40 70.9 94.5
E1 1.15 1.35 45.3 53.1
e.65 25.6
e1 1.3 51.2
L 0.10 0.30 3.9 11.8
SOT323-5L MECHANICAL DATA
0
74LX1G04
9/13
DIM. mm. mils
MIN. TYP MAX. MIN. TYP. MAX.
A 0.585 0.65 0.715 23.03 25.59 28.15
A1 0.21 0.25 0.29 8.27 9.84 11.42
A2 0.40 15.75
b 0.265 0.315 0.365 10.43 12.40 14.37
D 1.02 1.07 1.12 40.15 42.13 44.09
D1 0.5 19.69
E 1.02 1.07 1.12 40.15 42.13 44.09
E1 0.5 19.69
Flip-Chip4 MECHANICAL DATA
7224716/D
74LX1G04
10/13
DIM. mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 180 7.086
C 12.8 13.0 13.2 0.504 0.512 0.519
D 20.2 0.795
N 60 2.362
T 14.4 0.567
Ao 3.13 3.23 3.33 0.123 0.127 0.131
Bo 3.07 3.17 3.27 0.120 0.124 0.128
Ko 1.27 1.37 1.47 0.050 0.054 0.0.58
Po 3.9 4.0 4.1 0.153 0.157 0.161
P 3.9 4.0 4.1 0.153 0.157 0.161
Tape & Reel SOT23-xL MECHANICAL DATA
74LX1G04
11/13
DIM. mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 175 180 185 6.889 7.086 7.283
C 12.8 13 13.2 0.504 0.512 0.519
D 20.2 0.795
N 59.5 60 60.5 2.362
T 14.4 0.567
Ao 2.25 0.088
Bo 2.7 0.106
Ko 1.2 0.047
Po 3.9 4 4.1 0.153 0.157 0.161
P 3.8 4 4.2 0.149 0.157 0.165
Tape & Reel SOT323-xL MECHANICAL DATA
74LX1G04
12/13
DIM. mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 178 6.926
C 12.8 13.2 0.504 0.519
D 20.2 0.795
N 59 60 61 2.323 2.362 2.401
T 8.4 0.331
Ao 1.12 1.17 1.22 0.044 0.046 0.048
Bo 1.12 1.17 1.22 0.044 0.046 0.048
Ko 0.68 0.73 0.78 0.027 0.029 0.031
Po 3.9 4 4.1 0.153 0.157 0.161
P 3.9 4 4.1 0.153 0.157 0.161
Tape & Reel Flip-Chip 4 MECHANICAL DATA
74LX1G04
13/13
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conseq uences of use o f suc h info rmat ion n or for any in fringeme nt of paten ts or oth er righ ts of third part ies whic h may resul t from
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mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
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