TN1515-600B Standard 15 A SCR Main features Symbol Value Unit IT(RMS) 15 A VDRM/VRRM 600 V IGT (Q1) 15 mA Description Specifically designed to control motor in hand tools application, the TN15 SCR is available in DPAK package, providing a high robustness against stalled rotor operating conditions in a small SMD package DPAK TN1515 Order Code Order code Marking TTN1515-600B-TR TN15 15600 TTN1515-600B TN15 15600 Table 1. Absolute maximum ratings Symbol Parameter Value Unit RMS on-state current (180 conduction angle) Tc = 109 C 15 A IT(AV) Average on-state current (180 conduction angle) Tc = 109 C 9.5 A ITSM Non repetitive surge peak on-state current IT(RMS) I t tp = 8.3 ms tp = 10 ms It Value for fusing tp = 10 ms dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns IGM Peak gate current PG(AV) 165 Tj = 25 C A 150 Tj = 25 C 113 As F = 120 Hz Tj = 125 C 50 A/s tp = 20 s Tj = 125 C 4 A Tj = 125 C 1 W Average gate power dissipation Tstg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 C VRGM Maximum peak reverse gate voltage 5 V March 2006 Rev 1 1/7 www.st.com 7 Characteristics TN1515-600B 1 Characteristics Table 2. Electrical Characteristics (Tj = 25C, unless otherwise specified) Symbol Test Conditions IGT Vout = 12 V, RL = 33 VGT Vout = 12 V, RL = 33 VGD Vout = VDRM, RL = 33 Values Tj = 25 C Unit MIN. 2 MAX. 15 MAX. 1.3 V MIN. 0.2 V mA Tj = 125 C IH IT = 500 mA MAX. 40 mA IL IG = 1.2 IGT MAX. 60 mA dV/dt VD = 67% VDRM, gate open Tj = 125 C MIN. 200 V/s VTM ITM = 30 A, tp = 380 s Tj = 25 C MAX. 1.6 V VTO Threshold voltage Tj = 125 C MAX. 0.85 V RD Dynamic resistance Tj = 125 C MAX. 25 m 5 A 2 mA IDRM Tj = 25 C VDRM = VRRM IRRM Table 3. MAX. Tj = 125 C Thermal resistance Symbol Parameter Rth(j-c) Junction to case (DC) Rth(j-a) Junction to ambient Figure 1. S = 0.5 cm2 Maximum power dissipation versus average on-state current Figure 2. P(W) Value Unit 1.2 C/W 70 C/W Average and DC on-state current vs case temperature IT(AV) (A) 14 16 =180 12 14 10 12 8 10 D.C. =180 8 6 6 4 4 360 2 2 I T(AV) (A) 0 0 2/7 TC (C) 0 1 2 3 4 5 6 7 8 9 10 0 25 50 75 100 125 TN1515-600B Figure 3. Characteristics Average and DC on-state current vs ambient temperature, PCB FR4, copper thickness 35 m Figure 4. Thermal impedance, junction to ambient, vs pulse duration, PCB FR4, copper thickness 35 m Zth( j-a) (C/W) IT(AV) (A) 100 2.5 SCU= 0.5 cm SCU=0.5cm =180 2.0 1.5 D.C. 10 1.0 0.5 T amb (C) 0.0 0 25 Figure 5. 50 75 100 125 Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) 1 1.E-03 1.E-02 Figure 6. 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Surge peak on-state current vs number of cycles ITSM (A) IGT, IH, IL [T j] / IGT, IH, IL [T j=25C] 2.4 180 2.2 160 2.0 IGT 1.8 140 1.6 tp=10ms Non repetitive Tj initial=25C One cycle 120 1.4 1.2 t P (s) 100 I H & IL 1.0 80 0.8 60 0.6 Repetitive TC=109C 40 0.4 20 Tj(C) 0.2 0.0 Number of cycles 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100110120130 Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t 1 10 Figure 8. 100 1000 On-state characteristics (maximum values) ITM (A) ITSM(A), It (As) 100.0 1.E+04 Tj initial=25C dI/dt limitation 10.0 Tj=125C Tj=25C 1.E+03 ITSM 1.0 1.E+02 0.01 It t P(ms) 0.10 1.00 Tj max. : Vto = 0.85 V RD = 25 m VTM (V) 10.00 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 3/7 Ordering information scheme Figure 9. TN1515-600B Junction to ambient thermal resistance versus copper surface under tab (PCB FR4, copper thickness 35m) Rth(j-a) (C/W) 100 80 60 40 20 SCU (cm) 0 0 2 5 10 15 20 25 30 35 40 Ordering information scheme TN 15 15 - 600 SCR series RMS Current 15 = 15 A Sensitivity 15 = 15 mA Voltage 600 = 600 V Package B = DPAK Packing mode Blank = Tube -TR = Tape and reel 4/7 B (-TR) TN1515-600B 3 Package information Package information Table 4. DPAK dimensions DIMENSIONS REF. E A B2 C2 Millimeters Inches Min. Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 D R H L4 A1 B G R C A2 0.60 MIN. V2 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0 8 0 8 Figure 10. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 4 5 Ordering information Part Number Marking Package Weight Base qty Delivery mode TN1515-600B-TR TN15 15600 DPAK 0.3 g 2500 Tape and reel TN1515-600B TN15 15600 DPAK 0.3 g 75 Tube Revision history Table 5. 6/7 TN1515-600B Document revision history Date Revision 13-Mar-2006 1 Changes Initial release. TN1515-600B Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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