March 2006 Rev 1 1/7
7
TN1515-600B
Standard
15 A SCR
Main features
Description
Specifically designed to control motor in hand
tools application, the TN15 SCR is available in
DPAK package, providing a high robustness
against stalled rotor operating conditions in a
small SMD package
Order Code
Symbol Value Unit
IT(RMS) 15 A
VDRM/VRRM 600 V
IGT (Q1)15 mA
Order code Marking
TTN1515-600B-TR TN15 15600
TTN1515-600B TN15 15600
DPAK
TN1515
Table 1. Absolute maximum ratings
Symbol Parameter Value Unit
IT(RMS) RMS on-state current (180° conduction angle) Tc = 109° C 15 A
IT(AV) Average on-state current (180° conduction angle) Tc = 109° C 9.5 A
ITSM Non repetitive surge peak on-state current tp = 8.3 ms Tj = 25° C 165 A
tp = 10 ms 150
I²tI
²t Value for fusing tp = 10 ms Tj = 25° C 113 A²s
dI/dt Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz Tj = 125° C 50 A/µs
IGM Peak gate current tp = 20 µs Tj = 125° C 4 A
PG(AV) Average gate power dissipation Tj = 125° C 1 W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125 °C
VRGM Maximum peak reverse gate voltage 5 V
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Characteristics TN1515-600B
2/7
1 Characteristics
Table 2. Electrical Characteristics (Tj = 25°C, unless otherwise specified)
Symbol Test Conditions Values Unit
IGT Vout = 12 V, RL = 33 ΩTj = 25° C MIN. 2 mA
MAX. 15
VGT Vout = 12 V, RL = 33 ΩMAX. 1.3 V
VGD Vout = VDRM, RL = 33 Ω Tj = 125° C MIN. 0.2 V
IHIT = 500 mA MAX. 40 mA
ILIG = 1.2 IGT MAX. 60 mA
dV/dt VD = 67% VDRM, gate open Tj = 125° C MIN. 200 V/µs
VTM ITM = 30 A, tp = 380 µs Tj = 25° C MAX. 1.6 V
VTO Threshold voltage Tj = 125° C MAX. 0.85 V
RDDynamic resistance Tj = 125° C MAX. 25 mΩ
IDRM VDRM = VRRM
Tj = 25° C MAX. 5µA
IRRM Tj = 125° C 2 mA
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Junction to case (DC) 1.2 °C/W
Rth(j-a) Junction to ambient S = 0.5 cm270 °C/W
Figure 1. Maximum power dissipation
versus average on-state current
Figure 2. Average and DC on-state current vs
case temperature
0
2
4
6
8
10
12
14
012345678910
P(W)
α=180°
360°
I(A)
T(AV)
0
2
4
6
8
10
12
14
16
0 25 50 75 100 125
α=180°
D.C.
TC(°C)
I (A)
T(AV)
TN1515-600B Characteristics
3/7
Figure 3. Average and DC on-state
current vs ambient temperature,
PCB FR4, copper
thickness 35 µm
Figure 4. Thermal impedance, junction to
ambient, vs pulse duration, PCB
FR4, copper thickness 35 µm
0.0
0.5
1.0
1.5
2.0
2.5
0 25 50 75 100 125
α=180°
D.C.
S
CU
=0.5cm²
Tamb (°C)
I (A)
T(AV)
1
10
100
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
(°C/W)
SCU= 0.5 cm²
t
P
(s)
Figure 5. Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
Figure 6. Surge peak on-state current vs
number of cycles
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100110120130
I
GT
,I
H
,I
L
[T
j
]/I
GT
,I
H
,I
L
[T
j
=25°C]
IGT
IH& IL
Tj(°C)
0
20
40
60
80
100
120
140
160
180
1 10 100 1000
I
TSM
(A)
Non repetitive
T
j
initial=25°C
Repetitive
T
C
=109°C
One cycle
tp=10ms
Number of cycles
Figure 7. Non-repetitive surge peak
on-state current for a sinusoidal
pulse with width tp < 10 ms and
corresponding value of I2t
Figure 8. On-state characteristics (maximum
values)
1.E+02
1.E+03
1.E+04
0.01 0.10 1.00 10.00
I
TSM
(A), I²t (A²s)
Tjinitial=25°C
ITSM
I²t
dI/dt limitation
tP(ms)
0.1
1.0
10.0
100.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
I
TM
(A)
T
j
=25°C
T
j
=125°C
T
j
max. :
V
to
= 0.85 V
R
D
= 25 mΩ
VTM (V)
Ordering information scheme TN1515-600B
4/7
2 Ordering information scheme
Figure 9. Junction to ambient thermal
resistance versus copper
surface under tab (PCB FR4,
copper thickness 35µm)
0
20
40
60
80
100
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
SCU (cm²)
TN 15 15 - 600 B (-TR)
SCR series
RMS Current
15 = 15 A
Sensitivity
15 = 15 mA
Voltage
600 = 600 V
Package
B = DPAK
Packing mode
Blank = Tube
-TR = Tape and reel
TN1515-600B Package information
5/7
3 Package information
Figure 10. DPAK footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 4. DPAK dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
H
L4
G
B
L2
E
B2
D
A1
R
R
C
A
C2
0.60 MIN.
V2
A2
6.7
6.7 3 3 1.6
1.6
2.3
2.3
Ordering information TN1515-600B
6/7
4 Ordering information
5 Revision history
Part Number Marking Package Weight Base qty Delivery mode
TN1515-600B-TR TN15 15600 DPAK 0.3 g 2500 Tape and reel
TN1515-600B TN15 15600 DPAK 0.3 g 75 Tube
Table 5. Document revision history
Date Revision Changes
13-Mar-2006 1 Initial release.
TN1515-600B
7/7
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