Standard range - 10Vdc to 6kVdc X8R High Temperature capacitors TCC/VCC capacitors High Q capacitors Copper Barrier capacitors Open Mode and Tandem capacitors IECQ-CECC range AEC-Q200 range S02A Space grade range Safety Certified capacitors 250Vac Non Safety rated AC capacitors 115Vac 400Hz & DWV ranges LCD Inverter chip range E01 & E07 feedthrough chip capacitors X2Y Integrated Passive Components Radial Leaded capacitors Introduction to Syfer Technology Contents First in the market with flexible polymer Products terminations - the revolutionary FlexiCapTM Syfer's excellence in ceramic materials technology, has enabled us to offer an unrivalled range of multilayer ceramic products including: l Multilayer ceramic chip capacitors l High voltage MLCCs l FlexiCapTM capacitors with flexible terminations l Class `X' and `Y' SMD Safety Certified capacitors l Radial leaded capacitors l AEC-Q200 qualified capacitors l IECQ CECC approved capacitors and radials l Capacitors for space applications l High Q capacitors l Non Magnetic capacitors l 3 terminal EMI chips l X2Y Integrated Passive Components l Capacitors for medical applications capacitors - our capacitor range also includes X8R high temperature types, High Q capacitors and other application specific types. Our renowned high voltage MLCC expertise has led to the development of an impressive range with working voltage capability up to 10kV. This includes surface mount Class `X' and `Y' approved Safety Certified capacitors, 0603 chips with working voltages up to 500V, and 0805 types up to 1kV. As part of the Dover Ceramic & Microwave Products group (CMP), we are able to offer unrivalled product quality with short lead-times, backed up by excellent sales and technical support. With a commitment Benefits all aspects of customer service and support. l High quality and reliability l World-leading high voltage expertise l Suitable for the most demanding applications including: automotive, aerospace, military, space and medical l Approvals to international specifications l Continual product improvement and innovation l Tight tolerances available l Large case sizes, up to 8060 l Custom product capability l Strong technical support l Short lead-times l Environmentally responsible Our quality management systems meet Suffix code controlled items such as Low profile, defined thickness and custom lead forms available by special request. international requirements, with approval to Other Syfer products IS0 9001, environmental approval to IS0 14001 l l l l l l l l l to product innovation, new ranges are continually being developed. Our experienced applications engineers are also available to provide custom solutions for specific applications. This catalogue details the standard ranges but we can provide items such as tight tolerance, low profile and non standard sizes on request. Flexibility is key, not only in design but in and Occupational Health and Safety approval to OHSAS 18001. Product approvals include, IECQCECC, UL, TUV and qualification to AEC-Q200. SPC is used extensively, supported by Continuous Improvement Programmes, 6 Sigma projects and Lean Manufacturing initiatives. Surface mount Pi filters Panel mount threaded filters Panel mount solder-in filters Custom filter assembly capability Varistor filters Discoidal capacitors Planar capacitor and planar varistor arrays EMI Power Filters Hermetically sealed EMI filters Syfer - Innovative, World-Class Ceramic Capacitors General introduction 2 Definitions of Ultra-Stable and Stable 3 Dielectric characteristics 4 Capacitance, Impedance and E.S.R. vs Frequency 5 Ageing, capacitance measurements and tight tolerance capacitors 6 Production processes and reliability 7 FlexiCapTM overview 8 Testing and termination types 9 Documentation and compliance 10 IECQ-CECC and AEC-Q200 periodic tests 11 Handling notes 12 Soldering information 13 Chip dimensions 14-15 Product Selector Ceramic Chip capacitors Standard MLCC ranges - 10Vdc to 6kVdc - C0G/NP0 & X7R X8R High Temperature capacitors TCC/VCC range High Q capacitors - MS range Copper Barrier capacitors Open Mode & Tandem capacitors IECQ-CECC ranges AEC-Q200 ranges S02A Space grade ranges Safety Certified capacitors 250Vac Non Safety Rated AC capacitors 115Vac 400Hz & DWV ranges LCD Inverter chip range 16-18 19 20-21 22-23 24-25 26 27 28 29 30-32 33 34 35 Surface Mount EMI filters E01 & E07 feedthrough capacitors X2Y Integrated Passive Components 36-37 38-39 Packaging information - Ceramic chip capacitors 40-41 Radial Leaded capacitors Packaging information - Radial leaded capacitors 42-47 48-49 MLCC standard range 10V - 6kVdc Contents Notes: 1) Capacitance in F. 2) *These parts may require conformal coating post soldering. 3) T = Maximum thickness. 10V C0G/ NP0 X7R 16V X5R C0G/ NP0 25V X7R X5R C0G/ NP0 X7R 50/63V X5R C0G/ NP0 100v 200/ 250V X7R X5R C0G/ NP0 0.47p 100p 1.5n 47n 56n 68n 0.47p 100p 0.47p 100p 0.47p 100p 470p 33n 220p 10n 150p* 1.5n* X7R C0G/ NP0 500V X7R C0G/ NP0 X7R 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV Syfer - Innovative, World-Class Ceramic Capacitors 6kV C0G/ NP0 X7R C0G/ NP0 X7R C0G/ NP0 X7R C0G/ NP0 X7R C0G/ NP0 X7R C0G/ NP0 X7R C0G/ NP0 X7R C0G/ NP0 X7R C0G/ NP0 X7R C0G/ NP0 X7R -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 0603 0603 0.47p 100p 3.9n 100n 120n 0.47p 100p 150n 2.7n 100n 120n 0.47p 100p 2.2n 100n 0805 1.0p 15n 100p 330n 390n 680n 1.0p 12n 100p 330n 390n 470n 1.0p 10n 100p 220n 270n 390n 1.0p 5.6n 100p 220n 270n 330n 1.0p 2.2n 100p 100n 1.0p 1n 100p 56n 1.0p 680p 100p 10n 1.0p 560p 100p 6.8n 1.0p 180p 100p 4.7n 1.0p 120p -- 1.0p 82p -- 1.0p 39p -- -- -- -- -- -- -- -- -- -- -- 0805 1206 1.0p 47n 100p 1.0 1.2 1.5 1.0p 33n 100p 1.0 1.2 1.0p 27n 100p 820n 1.0 1.0p 22n 100p 470n 560n 680n 1.0p 8.2n 100p 330n 1.0p 3.3n 100p 150n 1.0p 2.2n 100p 47n 1.0p 1.5n 100p 33n 1.0p 1.0n 100p 27n 1.0p 680p 100p 15n 1.0p 330p 100p 10n 1.0p 220p 100p 2.2n 1.0p 100p -- 1.0p 68p -- -- -- -- -- -- -- 1206 1210 3.9p 100n 330p 1.5 1.8 3.3 3.9p 68n 330p 1.5 1.8 2.7 3.9p 56n 330p 1.2 1.5 2.2 3.9p 33n 330p 1.0 1.2 1.5 3.9p 18n 330p 680n 3.9p 8.2n 330p 330n 3.9p 6.8n 330p 120n 3.9p 3.9n 330p 47n 3.9p 2.2n 330p 33n 3.9p 1.5n 330p 10n 3.9p 820p 330p 6.8n 3.9p 390p 330p 4.7n 3.9p 220p -- 3.9p 150p -- -- -- -- -- -- -- 1210 1808 4.7p 100n 100p 1.5 1.8 2.7 4.7p 68n 100p 1.5 1.8 2.2 4.7p 47n 100p 1.2 1.5 4.7p 33n 100p 680n 820n 1.0 4.7p 18n 100p 560n 4.7p 8.2n 100p 270n 4.7p 5.6n 100p 120n 4.7p 3.9n 100p 68n 4.7p 2.2n 100p 47n 4.7p 1.5n 100p 10n 4.7p 1.0n 100p 6.8n 4.7p 470p 100p 4.7n 4.7p 270p 100p 1.5n 4.7p 180p 100p 4.7p 100p 4.7p 100p 4.7p 100p 1.2n 120p* 1.0n* 68p* 680p* 47p* 390p* 1812 10p 220n 150p 3.3 3.9 10 10p 180n 150p 3.3 3.9 6.8 10p 150n 150p 2.2 2.7 4.7 10p 100n 150p 2.2 2.7 3.3 10p 47n 150p 1.5 10p 22n 150p 680n 10p 15n 150p 330n 10p 10n 150p 180n 10p 6.8n 150p 100n 10p 4.7n 150p 33n 10p 2.7n 150p 22n 10p 1.5n 150p 10n 10p 820p 150p 3.3n 10p 560p 150p 10p 150p 10p 150p 10p 150p 2.7n 270p* 2.2n* 180p* 1.2n* 120p* 1.0n* 1812 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 27n -- 18n 22n -- 12n -- 8.2n -- 5.6n 6.8n -- 3.3n -- 1.8n -- 1.0n -- 680p 1825 10p 470n 220p 4.7 5.6 15 10p 330n 220p 4.7 5.6 12 10p 220n 220p 3.9 4.7 10 10p 150n 220p 1.8 2.2 6.8 10p 68n 220p 1.5 10p 33n 220p 1.0 10p 27n 220p 560n 10p 22n 220p 180n 10p 12n 220p 120n 10p 6.8n 220p 68n 10p 4.7n 220p 47n 10p 3.3n 220p 10n 10p 1.5n 220p 6.8n 10p 1.2n -- 33n -- 27n -- 15n -- 8.2n 10n -- 5.6n 6.8n -- 3.9n -- 1.8n 2.2n -- 1.5n T=2.5mm T=3.2mm T=2.5mm -- -- 330p 390p* -- 220p 270p* -- 150p 180p* -- 220p 10p 220p 10p 220p 10p 220p 3.9n 560p* 2.2n* 390p* 1.8n* 270p* 1.5n* 1825 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 39n 47n 2220 10p 470n 220p 5.6 6.8 18 10p 330n 220p 5.6 6.8 12 10p 220n 220p 4.7 5.6 10 10p 150n 220p 3.3 3.9 6.8 10p 68n 220p 2.2 10p 33n 220p 1.0 10p 22n 220p 560n 10p 18n 220p 330n 10p 15n 220p 120n 10p 10n 220p 82n 10p 5.6n 220p 47n 10p 3.3n 220p 27n 10p 1.8n 220p 8.2n 10p 1.5n 2220 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 39n 56n -- 27n 39n -- 22n 33n -- 18n 22n -- 12n 15n -- 6.8n 10n -- 3.9n 5.6n -- 2.2n 3.3n -- 1.8n 2.2n 2225 10p 560n 330p 6.8 8.2 22 10p 470n 330p 6.8 8.2 15 10p 330n 330p 5.6 6.8 12 10p 220n 330p 3.3 3.9 10 10p 82n 330p 2.7 10p 47n 330p 1.5 10p 33n 330p 820n 10p 22n 330p 390n 10p 18n 330p 150n 10p 12n 330p 100n 10p 6.8n 330p 68n 10p 4.7n 330p 33n 10p 2.2n 330p 12n 10p 1.8n 2225 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 56n 68n -- 39n 47n -- 27n 39n -- 22n 27n -- 15n 22n -- 8.2n 12n -- 5.6n 6.8n -- 2.7n 3.9n -- 2.2n 2.7n -- 1.0n 1.5n* -- 680p 1.0n* -- 470p 680p* -- 3640 -- -- -- -- -- -- -- -- -- 10p 330n 470p 10 -- 10p 270n 470p 5.6 10p 120n 470p 3.3 10p 82n 470p 1.0 10p 68n 470p 680n 10p 47n 470p 180n 10p 33n 470p 150n 10p 22n 470p 100n 10p 10n 470p 47n 10p 6.8n 470p 33n 10p 4.7n 470p 22n 10p 1.8n 470p 6.8n 10p 1.5n -- 10p 1.0n -- 3640 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 150n 180n -- 100n 120n -- 82n 100n -- 56n 82n -- 39n 56n -- 27n 39n -- 12n 18n -- 8.2n 12n -- 5.6n 8.2n -- 2.2n 3.3n -- 1.8n 2.2n -- 1.2n 1.5n -- -- 390p 680n 1.0n 15 -- 390p 470n 1.0n 10 390p 270n 1.0n 5.6 390p 180n 1.0n 1.8 390p 120n 1.0n 1.2 390p 82n 1.0n 390n 390p 68n 1.0n 220n 390p 39n 1.0n 150n 390p 22n 1.0n 82n 390p 12n 1.0n 68n 390p 10n 1.0n 47n 390p 4.7n 1.0n 15n 390p 2.7n 1.0n 10n 390p 1.8n -- -- -- -- -- -- -- 330n -- 220n 270n -- 150n 180n -- 100n 150n -- 82n 100n -- 47n 68n -- 27n 39n -- 15n 22n -- 12n 18n -- 5.6n 6.8n -- 3.3n 4.7n -- 2.2n 3.3n -- -- 680p 1.0 2.2n 22 -- 680p 680n 2.2n 15 680p 390n 2.2n 10 680p 270n 2.2n 3.3 680p 220n 2.2n 2.2 680p 150n 2.2n 1.0 680p 100n 2.2n 470n 680p 68n 2.2n 330n 680p 39n 2.2n 150n 680p 22n 2.2n 100n 680p 15n 2.2n 82n 680p 8.2n 2.2n 33n 680p 5.6n 2.2n 22n 680p 3.9n -- -- -- -- -- -- -- 470n 560n -- 330n 470n -- 270n 390n -- 180n 270n -- 120n 180n -- 82n 120n -- 47n 68n -- 27n 39n -- 18n 27n -- 10n 15n -- 6.8n 10n -- 4.7n 6.8n -- T=3.2mm T=2.5mm T=4.0mm T=2.5mm T=4.0mm T=2.5mm T=4.0mm 5550 -- 5550 -- T=2.5mm T=4.0mm 8060 -- 8060 -- T=2.5mm T=4.0mm -- -- -- -- -- -- -- Note: 0402, 0505, 1111 & 2211 case sizes -- -- -- -- -- -- -- are available in our speciality ranges. Please refer to the relevant sections of this -- catalogue -- --for more -- details. -- -- -- -- 10V -- -- -- 16V -- -- -- 25V 50/63V 100v 200/ 250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV -- 680p* -- 470p* -- 330p* -- 220p 10p 220p 10p 220p 10p 220p 6.8n 680p* 4.7n* 470p* 3.9n* 330p* 2.2n* -- 820p 1.2n* -- 560p 820p* -- 390p 560p* -- 330p 10p 330p 10p 330p 10p 330p 8.2n 820p* 5.6n* 560p* 4.7n* 390p* 2.7n* 3kV 4kV 5kV 6kV 1808 1812 (T=2.5mm) 1812 (T=3.2mm) 1825 (T=2.5mm) 1825 (T=3.2mm) 2220 (T=2.5mm) 2220 (T=4.0mm) 2225 (T=2.5mm) 2225 (T=4.0mm) 3640 (T=2.5mm) 3640 (T=4.0mm) 5550 (T=2.5mm) 5550 (T=4.0mm) 8060 (T=2.5mm) 8060 (T=4.0mm) General introduction 2 Definitions of Ultra-Stable and Stable 3 Dielectric characteristics 4 Capacitance, Impedance and E.S.R. vs Frequency 5 Ageing, capacitance measurements and tight tolerance capacitors 6 Production processes and reliability 7 FlexiCapTM overview 8 Testing and termination types 9 Documentation and compliance 10 IECQ-CECC and AEC-Q200 periodic tests 11 Handling notes 12 Soldering information 13 Chip dimensions 14-15 Product Selector Ceramic Chip capacitors Standard MLCC ranges - 10Vdc to 6kVdc - C0G/NP0 & X7R X8R High Temperature capacitors TCC/VCC range High Q capacitors - MS range Copper Barrier capacitors Open Mode & Tandem capacitors IECQ-CECC ranges AEC-Q200 ranges S02A Space grade ranges Safety Certified capacitors 250Vac Non Safety Rated AC capacitors 115Vac 400Hz & DWV ranges LCD Inverter chip range 16-18 19 20-21 22-23 24-25 26 27 28 29 30-32 33 34 35 Surface Mount EMI filters E01 & E07 feedthrough capacitors X2Y Integrated Passive Components 36-37 38-39 Packaging information - Ceramic chip capacitors 40-41 Radial Leaded capacitors Packaging information - Radial leaded capacitors 42-47 48-49 Definitions of Ultra-Stable and Stable Technical Summary Multilayer Ceramic Capacitors are generally divided into classes which are defined by the capacitance temperature characteristics over specified temperature ranges. These are designated by alpha numeric codes. Code definitions are summarised below and are also available in the relevant national and international specifications. C0G/NP0 - Ultra Stable Class 1 Ceramic (EIA Class 1) Spec. Classification Temperature range C CECC 1B/CG -55 +125 0 30ppm/C C EIA C0G/NP0 -55 +125 0 30ppm/C C MIL CG (BP) -55 +125 0 30ppm/C C Capacitors within this class have a dielectric constant range from 10 to 100. They are used in applications which require ultra stable dielectric characteristics with negligible dependence of capacitance and dissipation factor with time, voltage and frequency. They exhibit the following characteristics:- Syfer dielectric code MIL a) Time does not significantly affect capacitance and dissipation factor (Tan ) - no ageing. b) Capacitance and dissipation factor are not affected by voltage. c) Linear temperature coefficient. Maximum capacitance change % over temperature range No DC volt applied Rated DC Volt Syfer dielectric code +20 -30 +15 -25 R X B 2C1 2R1 2X1 -55 +125 -55 +125 -55 +125 20 15 15 EIA X8R X7R X5R -55 +150 -55 +125 -55 +85 15 15 15 MIL BX BZ -55 +125 -55 +125 15 20 Capacitors of this type have a dielectric constant range of 1000-4000, and also have a non-linear temperature characteristic which exhibits a dielectric constant variation of less than 15% (2R1) from its room temperature value, over the specified temperature range. Generally used for by-passing (decoupling), coupling, filtering, frequency discrimination, DC blocking and voltage transient suppression - 0 -25 LOWER LIMIT -50 -55 -25 0 25 50 75 Temperature (C) 2 100 125 Power ratings C0G/NP0 and X7R 20 15 10 Typical capacitance change curves will lie within the shown limits 5 0 -5 -10 -35 -15 5 25 45 65 Temperature (C) 85 105 Tangent of loss angle (tan ) X7R X8R Ultra stable Stable Stable Stable 1B/CG - - - 2C1 2R1 2X1 - - C0G/ NP0 - X5R - X7R - X8R - - CG (BP) - BZ - BX - -55C to +125C -55C to +85C 0 30 ppm/C 15% 20% 15% 15% 15% - +20 -30% - +15 -25% - C P R X B N Cr > 50pF 0.0015 Cr 50pF = 0.0015 (15 + 0.7) Cr 0.025 0.025 0.025 100G or 1000s 100G or 1000s 100G or 1000s 100G or 1000s Insulation resistance (Ri) Time constant (Ri x Cr) (whichever is the least) Capacitance tolerance Cr < 10pF Cr > 10pF 0.05pF (H) 0.10pF (B) 0.25pF (C) 0.50pF (D) 1.0pF (F) 1% (F) 2% (G) 5% (J) 10% (K) <200V >200V to <500V 500V to <1000V 500V to <1000V >1kV to <1200V >1200V >1000V 5% (J) 10% (K) 20% (M) -55C to +125C -55C to +150C 5% (J) 10% (K) 20% (M) 5% (J) 10% (K) 20% (M) Voltage applied for 5 seconds. Charging current limited to 50mA maximum. Dielectric strength 2.5 times Rated voltage + 250V 1.5 times 1.25 times 1.2 times - 2.5 times - 2.5 times Rated voltage + 250V 1.5 times 1.2 times 2.5 times - Climatic category (IEC) Chip 55/125/56 55/85/56 55/125/56 55/150/56 Dipped 55/125/21 - 55/125/21 - Discoidal 55/125/56 - 55/125/56 - Zero <2% per time decade <2% per time decade <2% per time decade Ageing characteristic (Typical) The table above highlights the difference in coding for IECQ-CECC, EIA and MIL standards when defining the temperature coeffiecient and the voltage coefficient. -15 -20 -55 No DC voltage applied B R Power (mW) C ppm/C TYPICAL LIMIT N X P with greater volumetric efficiency than Class l units, whilst maintaining stability within defined limits. Capacitance and dissipation factor are affected by:Time (Ageing) Voltage (AC or DC) Frequency X7R capacitance vs temperature % Capacitance Change UPPER LIMIT 25 - +15 -25 +20 -30 Typical dielectric temperature characteristics 50 Maximum capacitance change over temperature range X5R Syfer dielectric ordering code CECC C0G/NP0 capacitance vs temperature Rated temperature range C0G/NP0 Rated DC voltage applied Temperature range C Classification IECQCECC EIA X8R, X7R and X5R - Stable Class II Ceramic (EIA Class II) Spec. Technical Summary Dielectric characteristics Maximum capacitance change @ rated DC volts Dielectric characteristics Technical Summary 125 Operating Temperature (C) Approvals Chip Dipped radial QC-32100 - QC-32100 - IECQ-CECC 30601-008 - IECQ-CECC 30701-013 - 3 Ultra Stable C0G/NP0 dielectric Ultradielectric Stable C0G/NP0 dielectric Ultra Stable C0G/NP0 Ultra Stable C0G/NP0 dielectric 1000 10000000 1000000 100000 10pF 100pF 1nF 10nF 100 ESR / Ohms Impedance (Ohms) 100000000 10000 1000 100 10 1 100pF 1nF 10nF 10 0.01 0.001 0.01 0.1 1 10 100 1000 0.1 0.001 0.001 10000 Frequency (MHz) Stable X7R dielectric 0.01 0.1 1 10 100 1000 10000 Frequency (MHz) Stable X7R dielectric Stable X7R dielectric Stable X7R dielectric 100000 10nF 100nF 1000nF 1000 100 10 1 0.1 0.01 0.001 Capacitor ageing is a term used to describe the negative, logarithmic capacitance change which takes place in ceramic capacitors with time. The crystalline structure for barium titanate based ceramics changes on passing through its Curie temperature (known as the Curie Point) at about 125C. This domain structure relaxes with time and in doing so, the dielectric constant reduces logarithmically; this is known as the ageing mechanism of the dielectric constant. The more stable dielectrics have the lowest ageing rates. Because of ageing it is necessary to specify an age for reference measurements at which the capacitance shall be within the prescribed tolerance. This is fixed at 1000 hours, since for practical purposes there is not much further loss of capacitance after this time. 100 10 The ageing constant, or ageing rate, is defined as the percentage loss of capacitance due to the ageing process of the dielectric which occurs during a decade of time (a tenfold increase in age) and is expressed as percent per logarithmic decade of hours. As the law of decrease of capacitance is logarithmic, this means that in a capacitor with an ageing rate of 1% per decade of time, the capacitance will decrease at a rate of: c) 1nF 10nF 100nF 1F 1000 ESR (Ohms) 10000 1nF Capacitance measurements a) b) 10000 1000000 Ageing The ageing process is reversible and repeatable. Whenever the capacitor is heated to a temperature above the Curie Point the ageing process starts again from zero. 1 0.01 0.1 Ageing of ceramic capacitors Technical Summary ESR vs Frequency - chips Impedance vs Frequency - chips Impedance (Ohms) Technical Summary d) e) 1 0.1 1% between 1 and 10 hours An additional 1% between the following 10 and 100 hours An additional 1% between the following 100 and 1000 hours An additional 1% between the following 1000 and 10000 hours etc The ageing rate continues in this manner throughout the capacitor's life. Typical values of the ageing constant for our Multilayer Ceramic Capacitors are: 0.01 All capacitors shipped are within their specified tolerance at the standard reference age of 1000 hours after having cooled through their Curie temperature. The ageing curve for any ceramic dielectric is a straight line when plotted on semi-log paper. Capacitance vs time (Ageing X7R @ 1% per decade) c % Capacitance, Impedance and E.S.R. vs Frequency C0G/NP0 1 0.001 0.01 0.1 1 10 100 1000 10000 0.01 0.1 1 10 100 1000 Frequency (MHz) 1000 10000 10000 Dielectric class Typical values Ultra Stable C0G/NP0 Negligible capacitance loss through ageing Stable X7R <2 % per decade of time Tight tolerance One of the advantages of Syfer's unique `wet process' of manufacture is the ability to offer capacitors with exceptionally tight capacitance tolerances. The accuracy of the printing screens used in the fully automated, computer controlled manufacturing process allows for tolerance as close as +/-1% on C0G/NP0 parts greater than or equal to 10pF. For capacitance values below 10pF, tolerances can be as tight as +/-0.05pF. Impedance vs Frequency - 10nF chips Stable X7R dielectric 10nF Stable X7R dielectric 100 Age (Hours) 0.0001 0.001 Frequency (MHz) 10 Impedance (Ohms) Impedance (Ohms) 100000 10000 1000 1808 0805 1206 1210 100 10 1 0.1 0.01 0.001 0.01 0.1 1 10 100 1000 10000 Frequency (MHz) (MHz) Frequency 4 5 Production processes and reliability Production process flowchart Ceramic powder preparation Technical Summary Syfer reliability grades Electrode ink material Space Grade ESCC 3009(1) FlexiCapTM termination High reliability (space quality) (wet process) Fire Standard components Rumble Standard reliability Notes: (1) Space grade tested in accordance with ESCC 3009. Refer to Syfer specification S02A 0100. Internal inspection (2) MIL Grade. Released in accordance with US standards available on request. (3) IECQ-CECC. The International Electrotechnical Commission (IEC) Quality Assessment System for Electronic Components. This is an internationally recognised product quality certification which provides customers with assurance that the product supplied meets high quality standards. Termination View Syfer's IECQ-CECC approvals at http://www.iecq.org or at www.syfer.com Plating (4) AEC-Q200. Automotive Electronics Council Stress Test Qualification For Passive Components. Refer to Syfer application note reference AN0009. (if specified) Printing (if specified) Syfer reliability surface mount product groups High reliability Electrical test Tandem FlexiCapTM capacitors(1) Test verification Standard MLC capacitors(4) (if specified) Additional Hi Rel activities (2) "Open Mode" capacitors with FlexiCapTM termination also reduce the possibility of a short circuit by utilising inset electrode margins. Refer to application note AN0022. Also available qualified to AEC-Q200. (S02A 100% burn-in, QC insp) Packaging (3) Multilayer capacitors with Syfer FlexiCapTM termination. By using FlexiCapTM termination, there is a reduced possibility of the mechanical cracking occurring. (4) "Standard" capacitors includes MLCCs with tin finish over nickel, but no FlexiCapTM. 6 Finished goods store Picture taken at 1,000x magnification using a SEM to demonstrate the fibrous nature of the FlexiCapTM termination that absorbs increased levels of mechanical stress. Available on the following ranges: Our answer is a proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish. FlexiCapTM will accommodate a greater degree of board bending than conventional capacitors. Safety Certified capacitor chips Syfer FlexiCapTM termination All High Reliability ranges Standard and High Voltage chips 3 terminal EMI chips X2Y Integrated Passive Components X8R High Temperature capacitors Summary of PCB bend test results All ranges are available with FlexiCapTM termination material offering increased reliability and superior mechanical performance (board flex and temperature cycling) when compared with standard termination materials. Refer to Syfer application note reference AN0001. FlexiCapTM capacitors enable the board to be bent almost twice as much before mechanical cracking occurs. Refer to application note AN0002. The bend tests conducted on X7R have proven that the FlexiCapTM termination withstands a greater level of mechanical stress before mechanical cracking occurs. The AEC-Q200 test for X7R requires a bend level of 2mm minimum and a cap change of less than 10%. Product X7R Standard termination FlexiCapTM Typical bend performance under AEC-Q200 test conditions 2mm to 3mm Typically 8mm to 10mm Application notes Standard reliability (1) "Tandem" construction capacitors, ie internally having the equivalent of 2 series capacitors. If one of these should fail short-circuit, there is still capacitance end to end and the chip will still function as a capacitor, although capacitance maybe affected. Refer to application note AN0021. Also available qualified to AEC-Q200. FlexiCapTM termination has no adverse effect on any electrical parameters, nor affects the operation of the MLCC in any way. FlexiCapTM has been developed as a result of listening to customers' experiences of stress damage to MLCCs from many manufacturers, often caused by variations in production processes. FlexiCapTM may be handled, stored and transported in the same manner as standard terminated capacitors. The requirements for mounting and soldering FlexiCapTM are the same as for standard SMD capacitors. Notes: QC inspection An additional benefit of FlexiCapTM is that MLCCs can withstand temperature cycling -55C to 125C in excess of 1,000 times without cracking. Syfer has the solution - FlexiCapTM Fired ceramic dielectric Standard FlexiCapTM capacitors(3) Syfer has delivered millions of FlexiCapTM components and during that time has collected substantial test and reliability data, working in partnership with customers world wide, to eliminate mechanical cracking. Careful process control is important at all stages of circuit board assembly and transportation - from component placement to test and packaging. Any significant board flexing may result in stress fractures in ceramic devices that may not always be evident during the board assembly process. Sometimes it may be the end customer who finds out - when equipment fails! FlexiCapTM is also suitable for Space applications having passed thermal vacuum outgassing tests. Refer to Syfer application note reference AN0026. Open Mode FlexiCapTM capacitors(2) Additional sample Rel tests MLCCs are widely used in electronic circuit design for a multitude of applications. Their small package size, technical performance and suitability for automated assembly makes them the component of choice for the specifier. However, despite the technical benefits, ceramic components are brittle and need careful handling on the production floor. In some circumstances they may be prone to mechanical stress damage if not used in an appropriate manner. Board flexing, depanelisation, mounting through hole components, poor storage and automatic testing may all result in cracking. MIL Grade(2) IECQ-CECC(3) AEC-Q200(4) Multilayer build FlexiCapTM overview Technical Summary Tin outer layer Intermediate nickel layer FlexiCapTM termination base Metal electrodes FlexiCap MLCC cross section TM FlexiCapTM benefits With traditional termination materials and assembly, the chain of materials from bare PCB to soldered termination, provides no flexibility. In circumstances where excessive stress is applied - the weakest link fails. This means the ceramic itself, which may fail short circuit. The benefit to the user is to facilitate a wider process window - giving a greater safety margin and substantially reducing the typical root causes of mechanical stress cracking. FlexiCapTM may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes. For customers currently using standard terminated capacitors there should be no requirement to change the assembly process when converting to FlexiCapTM. Based upon board bend tests in accordance with IEC 60384-1 the amount of board bending required to mechanically crack a FlexiCapTM terminated capacitor is significantly increased compared with standard terminated capacitors. It must be stressed however, that capacitor users must not assume that the use of FlexiCapTM terminated capacitors will totally eliminate mechanical cracking. Good process controls are still required for this objective to be achieved. 7 Testing and termination types Tests conducted during batch manufacture Solderability Technical Summary Documentation and compliance Technical Summary Release documentation Syfer reliability SM product group Standard SM capacitors IECQ-CECC / MIL grade AEC-Q200 S (Space grade) High Rel S02A l l l l Syfer reliability SM product group Standard SM capacitors IECQ-CECC AEC-Q200 MIL grade S (Space grade) High Rel S02A Certificate of conformance l - l l - l - - Resistance to soldering heat l l l l IECQ-CECC Release certificate of conformity Plating thickness verification (if plated) l l l l Batch electrical test report m m m DPA (Destructive Physical Analysis) l l l l Included in data pack Voltage proof test (DWV / Flash) l l l l S (space grade) data documentation package - - - l Insulation resistance l l l l Capacitance test l l l l Dissipation factor test l l l l 100% visual inspection m m l l 100% burn-in. (2xRV @125C for 168 hours) m m m l Load sample test @ 125C m m m LAT1 & LAT2 (1000 hours) Humidity sample test. 85C/85%RH m m m 240 hours Hot IR sample test m m m m voltage depends on components tested. Axial pull sample test (MIL-STD-123) m m m m l Humidity Test. 168 hours @ 85C/85%RH. Breakdown voltage sample test m m m m l Board Deflection (bend test). Deflection (bend) sample test m m m m Test results are available on request. SAM (Scanning Acoustic Microscopy) m m m m LAT1 (4 x adhesion, 8 x rapid temp change + LAT2 and LAT3) - - - m LAT2 (20 x 1000 hour life test + LAT3) - - - m From LAT3 (6 x TC and 4 x solderability) - - - m l Test conducted as standard. m Optional test. Please discuss with Syfer Sales. Termination types available F: Silver Palladium Syfer reliability SM product group Standard SM capacitors IECQ-CECC / MIL grade AEC-Q200 S (space grade) High Rel S02A l l - l m J: Silver base with nickel barrier (100% matte tin plating) l l C0G/NP0 dielectric only A: Silver base with nickel barrier (tin/lead plating with min 10% lead) l l - l Y: FlexiCapTM with nickel barrier (100% matte tin plating) l l l m H: FlexiCapTM with nickel barrier (tin/lead plating with min 10% lead) l l - m 2: Silver base with Copper Barrier (100% matte tin plating) l(1) - - - 3: FlexiCapTM with Copper Barrier (100% matte tin plating) l(2) - - - Notes: (1) Available on C0G/NP0 and High Q only. (2) Available on all dielectrics. l Termination available. m Termination available but generally not requested for space grade components. Please discuss with Syfer Sales. l Release documentation supplied as standard. m Original documentation. Periodic tests conducted and reliability data availability Standard Surface Mount c apacitors Components are randomly selected on a sample basis and the following routine tests are conducted: Example of FIT (Failure In Time) data available: 10000 l Load Test. 1,000 hours @125C (150C for X8R). Applied RV 50% of RV 25% of RV 10% of RV FIT 10 0.01 Conversion factors To Operation FITS MTBF (hours) 109 / FITS FITS MTBF (years) 109 / (FITS x 8760) 0.00001 25C 50C 75C 100C 125C Component type: 0805 (C0G/NP0 and X7R). FITS = Failures in 109 hours. MTBF = Mean time between failures. Testing location: REACH (Registration, Evaluation, Authorisation and restriction of Chemicals) statement All standard Syfer MLCC products are compliant with the EU RoHS directive 2002/95/EC (see below for special exceptions) and those with plated terminations are suitable for soldering using common Pb free solder alloys (refer to `Soldering Information' for more details on soldering limitations). Compliance with EU 2002/95/EC automatically signifies compliance with some other legislation (e.g. Korea RoHS). Please refer to Syfer for details of compliance with other materials legislation The main purpose of REACH is to improve the protection of human health and the environment from the risks arising from the use of chemicals. Syfer Technology Ltd maintains both ISO14001, Environmental Management System and OHSAS 18001 Health and Safety Management System approvals that require and ensure compliance with corresponding legislation such as REACH. For further information, please contact Syfer at sales@syfer.co.uk Syfer reliability test department. Results based on: 16,622,000 component test hours. Breakdown of material content, SGS analysis reports and tin whisker test results are available on request. RoHS compliance Most Syfer MLCC components are available with non RoHS compliant tin lead (SnPb) solderable termination finish by special request for exempt applications and where pure tin is not acceptable. Other tin free termination finishes may also be available - please refer to Syfer for further details. Syfer routinely monitors world wide material restrictions (e.g. EU / China & Korea RoHS mandates) and is actively involved in shaping future legislation. Radial components have tin plated leads as standard, but tin/ lead is available as a special option. Please refer to the radial section of the catalogue for further details. Export controls and dual-use regulations 8 Certain Syfer catalogue components are defined as `dual-use' items under international export controls - those that can be used for civil or military purposes which meet certain specified technical standards. automatically require a licence for export outside the EU, and may require a licence for export within the EU. The defining criteria for a dual-use component with respect to Syfer products is one with a voltage rating of >750V and a capacitance value >250nF and a series inductance <10nH. Please refer to sales if you require any further information on export restrictions. Components defined as `dual-use' under the above criteria The application for a licence is routine, but customers for these products will be asked to supply further information. Other special components may additionally need to comply with export regulations. 9 IECQ-CECC and AEC-Q200 Periodic tests Periodic tests conducted for IECQ-CECC and AEC-Q200 Test ref Test P1 High temperature exposure (storage) All types Sample acceptance Additional requirements P Un-powered. 1,000 hours @ T=150C. Measurement at 24 2 hours after test conclusion 12 n 77 Reference 0 MIL-STD-202 Method 108 JESD22 Method JA-104 Ceramics are dense, hard, brittle and abrasive materials. They are liable to suffer mechanical damage, in the form of chips or cracks, if improperly handled. Handling 1,000 cycles -55C to +125C Measurement at 24 2 hours after test conclusion P3 Moisture resistance All types T = 24 hours/cycle. Note: Steps 7a and 7b not required. Un-powered. Measurement at 24 2 hours after test conclusion 12 77 0 MIL-STD-202 Method 106 P4 Biased humidity All types 1,000 hours 85C/85%RH. Rated voltage or 50V whichever is the least and 1.5V. Measurement at 24 2 hours after test conclusion 12 77 0 MIL-STD-202 Method 103 P5 Operational life All types Condition D steady state TA=125C at full rated. Measurement at 24 2 hours after test conclusion 12 77 0 MIL-STD-202 Method 108 P6 Resistance to solvents All types Note: Add aqueous wash chemical. Do not use banned solvents 12 5 0 MIL-STD-202 Method 215 P7 Mechanical shock C0G/NP0: All types X7R: Y and H only Figure 1 of Method 213. Condition F 12 30 0 MIL-STD-202 Method 213 C0G/NP0: All types X7R: Y and H only 5g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" x 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2,000Hz 12 Condition B, no pre-heat of samples: Single wave solder - Procedure 2 3 P8 Temperature cycling Vibration Resistance to soldering heat All types P10 Thermal shock C0G/NP0: All types X7R: Y and H only P11 Adhesion, rapid temp change and climatic sequence P9 P12 Board flex P13 Detailed application notes intended to guide and assist our customers in using multilayer ceramic capacitors in surface mount technology are available on the Syfer website www. syfer.com The information concentrates on the handling, mounting, connection, cleaning, test and re-work requirements particular to MLC's for SMD technology, to ensure a suitable match between component capability and user expectation. Some extracts are given below. c C0G/NP0: All types X7R: Y and H only P2 10 Termination type -55C/+125C. Number of cycles 300. Maximum transfer time - 20 seconds, dwell time - 15 minutes. Air-Air 12 12 77 30 12 30 0 0 0 MIL-STD-202 Method 204 MIL-STD-202 Method 210 0 MIL-STD-202 Method 107 0 BS EN132100 Clause 4.8, 4.12 and 4.13 Terminations may be abraded onto chip surfaces if loose chips are tumbled in bulk. Metallic tracks may be left on the chip surfaces which might pose a reliability hazard. Components should never be handled with fingers; perspiration and skin oils can inhibit solderability and will aggravate cleaning. Chip capacitors should never be handled with metallic instruments. Metal tweezers should never be used as these can chip the product and may leave abraded metal tracks on the product surface. Plastic or plastic coated metal types are readily available and recommended - these should be used with an absolute minimum of applied pressure. Counting or visual inspection of chip capacitors is best performed on a clean glass or hard plastic surface. If chips are dropped or subjected to rough handling, they should be visually inspected before use. Electrical inspection may also reveal gross damage via a change in capacitance, an increase in dissipation factor or a decrease either in insulation resistance or electrical strength. 5N force applied for 10s, -55C/ +125C for 5 cycles, damp heat cycles 12 27 C0G/NP0: All types X7R: Y and H only 3mm deflection Class I 2mm deflection Class II 12 30 0 AEC-Q200-005 X7R: A, F and J only 1mm deflection. 12 12 0 BS EN132100 Clause 4.9 All types Force of 1.8kg for 60 seconds 12 30 0 AEC-Q200-006 P14 Terminal strength P15 Beam load test All types - 12 30 0 AEC-Q200-003 P16 Damp heat steady state All types 56 days, 40C / 93% RH 15x no volts, 15x 5Vdc, 15x rated voltage or 50V whichever is the least. 12 45 0 BS EN132100 Clause 4.14 Test results are available on request. P = Period in months. N = Sample size. C = Acceptance criteria. Mechanical considerations for mounted ceramic chip capacitors Due to their brittle nature, ceramic chip capacitors are more prone to excesses of mechanical stress than other components used in surface mounting. One of the most common causes of failure is directly attributable to bending the printed circuit board after solder attachment. The excessive or sudden movement of the flexible circuit board stresses the inflexible ceramic block causing a crack to appear at the weakest point, usually the ceramic/termination interface. The crack may initially be quite small and not penetrate into the inner electrodes; however, subsequent handling and rapid changes in temperature may cause the crack to enlarge. This mode of failure is often invisible to normal inspection techniques as the resultant cracks usually lie under the capacitor terminations but if left, can lead to catastrophic failure. More importantly, mechanical cracks, unless they are severe may not be detected by normal electrical testing of the completed circuit, failure only occurring at some later stage after moisture ingression. The degree of mechanical stress generated on the printed circuit board is dependent upon several factors including the board material and thickness; the amount of solder and land pattern. The amount of solder applied is important, as an excessive amount reduces the chip's resistance to cracking. It is Syfer's experience that more than 90% are due to board depanelisation, a process where two or more circuit boards are separated after soldering is complete. Other manufacturing stages that should be reviewed include: 1) Attaching rigid components such as connectors, relays, display panels, heat sinks etc. Transportation 2) Fitting conventional leaded components. Special care Where possible, any transportation should be carried out with the product in its unopened original packaging. If already opened, any environmental control agents supplied should be returned to packaging and the packaging re-sealed. 3) Storage of boards in such a manner which allows warping. Avoid paper and card as a primary means of handling, packing, transportation and storage of loose components. Many grades have a sulphur content which will adversely affect termination solderability. Loose chips should always be packed with sulphur-free wadding to prevent impact or abrasion damage during transportation. Storage X7R: A, F and J only Handling notes Technical Summary Incorrect storage of components can lead to problems for the user. Rapid tarnishing of the terminations, with an associated degradation of solderability, will occur if the product comes into contact with industrial gases such as sulphur dioxide and chlorine. Storage in free air, particularly moist or polluted air, can result in termination oxidation. must be exercised when rigid terminals, as found on large can electrolytic capacitors, are inserted. 4) Automatic test equipment, particularly the type employing "bed of nails" and support pillars. 5) Positioning the circuit board in its enclosure especially where this is a "snap-fit". Syfer were the first MLCC manufacturer to launch a flexible termination to significantly reduce the instances of mechanical cracking. FlexicapTM termination introduces a certain amount of give into the termination layer absorbing damaging stress. Unlike similar systems, FlexicapTM does not tear under tension, but absorbs the stress, so maintaining the characteristics of the MLCC. SM Pad Design Packaging should not be opened until the MLC's are required for use. If opened, the pack should be re-sealed as soon as is practicable. Alternatively, the contents could be kept in a sealed container with an environmental control agent. Syfer conventional 2-terminal chip capacitors can generally be mounted using pad designs in accordance with IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standards, but there are some other factors that have been shown to reduce mechanical stress, such as reducing the pad width to less than the chip width. In addition, the position of the chip on the board should also be considered. Long term storage conditions, ideally, should be temperature controlled between -5 and +40C and humidity controlled between 40 and 60% R.H. 3-Terminal components are not specifically covered by IPC-7351, but recommended pad dimensions are included in the Syfer catalogue / website for these components. Taped product should be stored out of direct sunlight, which might promote deterioration in tape or adhesive performance. Product, stored under the conditions recommended above, in its "as received" packaging, has a minimum shelf life of 2 years. 11 Soldering information Soldering information Rework of Chip capacitors Syfer MLCC's are compatible with all recognised soldering/ mounting methods for chip capacitors. A detailed application note is available on-line at www.syfer.com Syfer recommend hot air/ gas as the preferred method for applying heat for rework. Apply even heat surrounding the component to minimise internal thermal gradients. Soldering irons or other techniques that apply direct heat to the chip or surrounding area, should not be used as these can result in micro cracks being generated. Reflow soldering surface mount chip capacitors Syfer recommend reflow soldering as the preferred method for mounting MLCC's. Syfer MLCC's can be reflow soldered using a reflow profile generally as defined in IPC / JEDEC J-STD-020. Sn plated termination chip capacitors are compatible with both conventional and lead free soldering, with peak temperatures of 260C to 270C acceptable. The heating ramp rate should be such that components see a temperature rise of 1.5C to 4C per seconds to maintain temperature uniformity through the MLCC. The time for which the solder is molten should be maintained at a minimum, so as to prevent solder leaching. Extended times above 230C can cause problems with oxidisation of Sn plating. Use of inert atmosphere can help if this problem is encountered. PdAg terminations can be particularly susceptible to leaching with lead free, tin rich solders and trials are recommended for this combination. Cooling to ambient temperature should be allowed to occur naturally, particularly if larger chip sizes are being soldered. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Forced cooling should be avoided as this can induce thermal breakage. Wave soldering Chip and Radial Leaded capacitors Wave soldering is generally acceptable, but the thermal stresses caused by the wave have been shown to lead to potential problems with larger or thicker chips. Particular care should be taken when soldering SM chips larger than size 1210 and with a thickness greater than 1.0mm for this reason. Maximum permissible wave temperature is 270C for SM chips and 260C for Radial Leaded capacitors. The total immersion time in the solder should be kept to a minimum. It is strongly recommended that Sn/Ni plated terminations are specified for wave soldering applications. PdAg termination is particularly susceptible to leaching when subjected to lead free wave soldering and is not generally recommended for this application. Total immersion exposure time for Sn/Ni terminations is 30s at a wave temperature of 260C. Note that for multiple soldering operations, including the rework, the soldering time is cumulative. The pre-heat ramp should be such that the components see a temperature rise of 1.5C to 4C per second as for reflow soldering. This is to maintain temperature uniformity through the MLCC and prevent the formation of thermal gradients within the ceramic. The preheat temperature should be within 120C maximum (100C preferred) of the maximum solder temperature to minimise thermal shock. Cooling to ambient temperature should be allowed to occur naturally, particularly if larger chip sizes are being soldered. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Forced cooling should be avoided as this can induce thermal breakage. 12 Technical Summary Dimensions Minimise the rework heat duration and allow components to cool naturally after soldering. Hand soldering Radial Leaded capacitors Radial capacitors can be hand soldered into boards using soldering irons, provided care is taken not to touch the body of the capacitor with the iron tip. Soldering should be carried out from the opposite side of the board to the radial to minimise the risk of damage to the capacitor body. Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. Use of silver loaded epoxy adhesives Chip capacitors can be mounted to circuit boards using silver loaded adhesive provided the termination material of the capacitor is selected to be compatible with the silver loaded adhesive. This is normally PdAg. Standard tin finishes are often not recommended for use with silver loaded epoxies as there can be electrical and mechanical issues with the joint integrity due to material mismatch. Solder leaching Leaching is the term for the dissolution of silver into the solder causing a failure of the termination system which causes increased ESR, tan and open circuit faults, including ultimately the possibility of the chip becoming detached. Leaching occurs more readily with higher temperature solders and solders with a high tin content. Pb free solders can be very prone to leaching certain termination systems. To prevent leaching, exercise care when choosing solder alloys and minimize both maximum temperature and dwell time with the solder molten. Plated terminations with nickel or copper anti leaching barrier layers are available in a range of top coat finishes to prevent leaching occurring. These finishes also include Syfer FlexiCapTM for improved stress resistance post soldering. Multilayer ceramic chip - with nickel barrier termination Fired ceramic dielectric Tin or tin/lead outer layer (as specified by Intermediate customer) nickel layer Metal electrodes Silver termination Chip dimensions Technical Summary Size Length (L1) mm inches L1 Width (W) mm inches Max. Thickness (T) mm inches T Termination Band L2 mm inches min max W L2 0402 1.0 0.10 0.04 0.006 0.50 0.10 0.02 0.003 0.60 0.031 0.10 0.004 0.40 0.015 0505 1.4 0.38 0.055 0.015 1.4 0.25 0.055 0.010 1.27 0.050 0.13 0.005 0.5 0.020 0603 1.6 0.2 0.063 0.008 0.8 0.2 0.031 0.008 0.8 0.031 0.10 0.004 0.40 0.015 0805 2.0 0.3 0.08 0.012 1.25 0.2 0.05 0.008 1.3 0.051 0.13 0.005 0.75 0.03 1111 2.79 + 0.51 - 0.25 0.110 + 0.020 - 0.010 2.79 0.38 0.110 0.015 2.54 0.100 0.13 0.005 0.63 0.025 1206 3.2 0.3 0.126 0.012 1.6 0.2 0.063 0.008 1.6 0.063 0.25 0.01 0.75 0.03 1210 3.2 0.3 0.126 0.012 2.5 0.3 0.10 0.012 2.0 0.08 0.25 0.01 0.75 0.03 1410 3.6 0.3 0.14 0.012 2.5 0.3 0.10 0.012 2.0 0.08 0.25 0.01 0.75 0.03 1806 4.5 0.35 0.177 0.012 1.6 0.2 0.063 0.008 1.3 0.051 0.25 0.01 0.75 0.03 1808 4.5 0.35 0.18 0.014 2.0 0.3 0.08 0.012 2.0 0.08 0.25 0.01 1.0 0.04 1812 4.5 0.35 0.18 0.014 3.2 0.3 0.126 0.012 3.2 0.126 0.25 0.01 1.0 0.04 1825 4.5 0.35 0.18 0.014 6.30 0.4 0.25 0.016 4.2 0.16 0.25 0.01 1.0 0.04 2211 5.7 0.4 0.225 0.016 2.79 0.3 0.11 0.012 2.5 0.1 0.25 0.01 0.8 0.03 2215 5.7 0.4 0.225 0.016 3.31 0.35 0.15 0.014 2.5 0.1 0.25 0.01 0.8 0.03 2220 5.7 0.4 0.225 0.016 5.0 0.4 0.197 0.016 4.2 0.16 0.25 0.01 1.0 0.04 2225 5.7 0.4 0.225 0.016 6.3 0.4 0.25 0.016 4.2 0.16 0.25 0.01 1.0 0.04 2520 6.30 0.4 0.25 0.016 5.0 0.4 0.197 0.016 4.2 0.16 0.25 0.01 1.0 0.04 3640 9.2 0.5 0.36 0.02 10.16 0.5 0.40 0.02 4.2 0.16 0.5 0.02 1.5 0.06 3820 9.65 0.5 0.37 0.02 5.0 0.4 0.197 0.016 4.2 0.16 0.5 0.02 1.5 0.06 3035 7.62 0.4 0.30 0.016 8.90 0.5 0.35 0.02 4.2 0.16 0.5 0.02 1.5 0.06 4045 10.2 0.5 0.40 0.02 11.5 0.5 0.45 0.02 4.2 0.16 0.5 0.02 1.5 0.06 4545 11.5 0.5 0.45 0.02 11.5 0.5 0.45 0.02 4.2 0.16 0.5 0.02 1.5 0.06 5550 14.0 0.5 0.55 0.02 12.7 0.5 0.50 0.02 4.2 0.16 0.5 0.02 1.5 0.06 5868 14.8 0.5 0.58 0.02 17.3 0.5 0.68 0.02 4.2 0.16 0.5 0.02 1.5 0.06 8040 20.3 0.5 0.80 0.02 10.16 0.5 0.40 0.02 4.2 0.16 0.5 0.02 1.5 0.06 8060 20.3 0.5 0.80 0.02 15.24 0.5 0.60 0.02 4.2 0.16 0.5 0.02 1.5 0.06 Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to Syfer. Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request - please refer requests to the Sales Office. 13 Product Selector Applications for MLC capacitors X7R 1812/2220/2225 100nF to 1F - 250Vdc X7R, C0G/NP0 Y2/X1, Y3/X2, X2 Safety Certified Ranges UL/TUV 1808/1812/2211/2215/2220 High Capacitance Safety Certified Modem/Tip and Ring Class 1 Dielectrics Frequency Control/Tuning, Impedance Matching High Frequency Snubber Class 1 Dielectrics Low DF/ESR High Capacitance Balanced Line Capacitors Capacitors and Filters Decoupling/Smoothing Safety Certified AC Noise Removal C0G/NP0 Range 0402 to 8060 0.47pF to 1F - 10V to 12kV X7R/X5R Range 0402 to 8060 100pF to 22F - 10V to 12kV X7R, X2Y IPCs 0603 to 2220 150pF to 1.2F - 25V to 1kV X7R, C0G/NP0, Y2/X1, Y3/X2, X2 Safety Certified Ranges UL/TUV 1808/1812/2211/2215/2220 X7R, C0G/NP0 Ranges Non Safety Capacitors designed for use at mains voltages FB9 LCD Inverter Range 1808/1812 1.5pF to 68pF - 5kV/6kV 250Vac range 0505/1111/1825 Ranges X7R, C0G/NP0, High Q LCD Backlight Inverter High Speed Decoupling SM and Leaded C0G/NP0 Range 0402 to 8060 0.47pF to 1F - 10V to 12kV Low Capacitance High Voltage, Anti Flashover Low Inductance Capacitors MRI/Non Magnetic Medical Medical Implantable Feedthrough Filtering Capacitive Automotive X7R and C0G/NP0, X2Y IPCs 0603 to 2220 10pF to 1.2F X7R, C0G/NP0, High Q 0402 to 4040 Copper Barrier Termination 0.1pF to 6.8F - 16V to 3kV High Reliability Special Testing/burn in MLCC and X2Y X7R, C0G/NP0 E01/E07/SBSGC/SBSMC X7R, C0G/NP0 0805 to 2220 - 1A to 20A SBSP/SBSG/SBSM X7R, C0G/NP0 1206 to 2220 22pF to 470nF - 1A to 10A Capacitive/Inductive Pi X8R Range Operational temperature up to 150C Mil/Aero MLCC AEC-Q200 Ranges X7R, C0G/NP0 Filtering Harsh Environments Hi Reliability Capacitors and Filters 14 Dipped Radial Leaded Capacitors l FlexiCapTM is particularly recommended for these applications where possible. Tandem and Open Mode FlexiCapTM Capacitors with extra safe electrode design AEC-Q200 X2Y IPCs X7R and C0G/NP0 AEC-Q200 E01/E07 Feedthrough Capacitors 115Vac 400Hz range S02A/IECQ-CECC/MIL-PRF/Burn in Hi Rel X2Y IPCs X7R, C0G/NP0 4.7pF to 15F - 10V to 10kV 15 Standard MLCC ranges 10Vdc to 6kVdc an c e 3.2 6kV 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 6kV 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 200/250V 500V 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 4mm 3.2 3.2mm 4mm 4mm 4mm 4mm 4mm 4mm Note: X7R ranges on reverse 100V 50/63V 4mm 4mm 4mm 4mm 4mm 3.2 4mm 4mm 3.2 4mm 3.2 3.2 4mm 3.2 3.2mm Note: X7R ranges on reverse 0.47pF p47 1.0 1p0 1.2 1p2 1.5 1p5 1.8 1p8 2.2 2p2 2.7 2p7 3.3 3p3 3.9 3p9 4.7 4p7 5.6 5p6 6.8 6p8 8.2 8p2 10pF 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100pF 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nF 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10nF 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100nF 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0F 105 Note: The highlighted parts are defined as `dual-use' under export control legislation and as such are subject to export licence restrictions. Please refer to page 9 for further details. Note: 1) *These parts may require conformal coating post soldering. 2) Standard chip thickness = 2.5mm maximum unless specified as 3.2 or 4.0mm.. Note: X7R ranges on reverse e 8060 Co d acit 5550 6kV 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 6kV* 5kV* 4kV* 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 25V 10V 16V 6kV* 5kV* 4kV* 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 25V 16V 10V 6kV* 5kV* 4kV* 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV C0G/NP0 3.2 A = Silver base with nickel barrier (Tin/lead plating with min. 10% lead). 10pF First digit is 0. Second and third digits are significant figures of capacitance code. Fourth digit is number of zeros eg. 0101 = 100pF Values are E24 series 3.2 J = Silver base with nickel barrier (100% matte tin plating). RoHS compliant. 4mm F = Silver Palladium. RoHS compliant. 630V B = Bulk pack - tubs 4mm 3.2mm P = X5R 1.0pF & <10pF Insert a P for the decimal point as the second character. eg. 8P20 = 8.2pF Values are E24 series 4mm > 10pF F = 1% G = 2% J = 5% K = 10% M = 20% H = FlexiCapTM termination base with nickel barrier (Tin/lead plating with min. 10% lead). 500V R = 330mm (13") reel 200/250V X = X7R (2R1) Used for specific customer requirements 100V T = 178mm (7") reel 50/63V C = C0G/NP0 (1B) 25V <10pF B = 0.1pF C = 0.25pF D = 0.5pF 16V <1.0pF Insert a P for the decimal point as the first character. eg. P300 = 0.3pF Values in 0.1pF steps 3640 3.2mm 010 = 10V 016 = 16V 025 = 25V 050 = 50V 063 = 63V 100 = 100V 200 = 200V 250 = 250V 500 = 500V 630 = 630V 1K0 = 1kV 1K2 = 1.2kV 1K5 = 1.5kV 2K0 = 2kV 2K5 = 2.5kV 3K0 = 3kV 4K0 = 4kV 5K0 = 5kV 6K0 = 6kV 10V Y = FlexiCapTM termination base with nickel barrier (100% matte tin plating). RoHS compliant. 6kV* Suffix 3.2mm Packaging 2225 3.2mm Dielectric 5kV* Voltage 4kV* Termination 3.2 ___ 3.2 T 3kV X 2.5kV J Capacitance tolerance 3.2mm 0103 Capacitance in picofarads (pF) 3.2 16 100 C0G/NP0 2220 3.2 0603 0805 1206 1210 1808 1812 1825 2220 2225 3640 5550 8060 Y 2kV Chip size 1.5kV 1210 3.2 Ordering information - Standard MLCC ranges 3.2mm Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request - please refer requests to the factory. 3.2 Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to Syfer. 1.2kV 1.5 0.06 1825 3.2 0.5 0.02 1kV 2.5 0.1 630V 15.24 0.5 0.6 0.02 500V 20.3 0.5 0.8 0.02 200/250V 8060 100V 1.5 0.06 50/63V 0.5 0.02 25V 4.2 0.16 16V 12.7 0.5 0.5 0.02 10V 14.0 0.5 0.55 0.02 1812 6kV* 5kV* 4kV* 3kV 5550 2.5kV 1.5 0.06 2kV 0.5 0.02 1.2kV 2.5 0.1 1.5kV 10.16 0.5 0.4 0.02 1kV 9.2 0.5 0.36 0.02 500V 3640 630V 1.0 0.04 200/250V 0.25 0.01 100V 4.2 0.16 50/63V 6.3 0.4 0.25 0.016 16V 5.7 0.4 0.225 0.016 25V 2225 10V 1.0 0.04 1808 3kV 0.25 0.01 2.5kV 4.2 0.16 2kV 5.0 0.4 0.197 0.016 1.5kV 5.7 0.4 0.225 0.016 1.2kV 2220 1kV 1.0 0.04 630V 0.25 0.01 500V 2.5 0.1 200/250V 6.30 0.4 0.25 0.016 100V 4.5 0.35 0.18 0.014 50/63V 1825 25V 1.0 0.04 16V 0.25 0.01 10V 2.5 0.1 1210 3kV 3.2 0.3 0.126 0.012 2.5kV 4.5 0.35 0.18 0.014 2kV 1812 1.5kV 1.0 0.04 1.2kV 0.25 0.01 1kV 2.0 0.08 630V 2.0 0.3 0.08 0.012 200/250V 4.5 0.35 0.18 0.014 500V 1808 50/63V 0.75 0.03 100V 0.25 0.01 25V 2.0 0.08 10V 2.5 0.3 0.1 0.012 16V 3.2 0.3 0.126 0.012 1206 2kV 1210 1.5kV 0.75 0.03 1.2kV 0.25 0.01 1kV 1.6 0.063 630V 1.6 0.2 0.063 0.008 500V 3.2 0.3 0.126 0.012 200/250V 1206 100V 0.75 0.03 50/63V 0.13 0.005 25V 1.3 0.051 16V 1.25 0.2 0.05 0.008 10V 2.0 0.3 0.08 0.012 0805 500V* 0805 200/250V 0.40 0.015 100V 0.10 0.004 50/63V 0603 0.8 0.031 L2 25V max 0.8 0.2 0.031 0.008 W (L2) mm inches 16V min 1.6 0.2 0.063 0.008 T Termination Band (T) mm inches 0.47pF p47 1.0 1p0 1.2 1p2 1.5 1p5 1.8 1p8 2.2 2p2 2.7 2p7 3.3 3p3 3.9 3p9 4.7 4p7 5.6 5p6 6.8 6p8 8.2 8p2 10pF 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100pF 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nF 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10nF 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100nF 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0F 105 10V Max. Thickness (W) mm inches e e Width (L1) mm inches C ap an c Length L1 0603 Co d acit Standard MLCC range dimensions Size Standard MLCC - C0G/NP0 ranges C ap A range of dc rated multi-layer chip capacitors from 0.47pF to 22F and case sizes 0603 to 8060 in C0G/NP0 and X7R dielectrics. Suitable for all general purpose and high reliability applications where package size and reliability are important. All are manufactured using Syfer's unique wet process and incorporate precious metal electrodes. Standard MLCC - C0G/NP0 ranges 17 Standard MLCC - X7R ranges Standard MLCC - X7R ranges 2220 2225 6kV* 5kV* 4kV* 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 6kV* 5kV* 4kV* 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 6kV* 5kV* 4kV* 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 6kV* 5kV* 4kV* 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 500V 630V 5550 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1kV 1.2kV 500V Note: C0G/NP0 ranges on reverse 630V Note: C0G/NP0 ranges on reverse X7R 200/250V Note: 1) *These parts may require conformal coating post soldering. 100V 50/63V X7R 8060 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 200/250V 500V 100V 50/63V 200/250V 50/63V 100V 25V 10V 16V 200/250V 100V 50/63V 25V 16V 10V 6kV* 5kV* 4kV* 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 2kV 1.2kV 1.5kV 630V 1kV 500V 100V 200/250V 50/63V 25V 16V 10V 50/63V 25V 16V 10V 200/250V 100V 50/63V 25V 16V 10V 200/250V 100V 50/63V 25V 16V 10V 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 25V 16V 10V 630V 1kV 500V 100V 200/250V 16V 50/63V 10V 25V 200/250V 500V* 100V 50/63V 25V 16V 10V X7R 3640 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10nF 12 15 18 22 27 33 39 47 56 68 82 100nF 120 150 180 220 270 330 390 470 560 680 820 1.0F 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10F 12 15 22F e 1825 1812 Co d 1808 e 1210 an c e e 1206 acit an c Co d acit 18 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 226 0805 C ap C ap 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10nF 12 15 18 22 27 33 39 47 56 68 82 100nF 120 150 180 220 270 330 390 470 560 680 820 1.0F 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10F 12 15 22F 0603 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 226 X8R High Temperature capacitors The X8R dielectric will operate from -55C to +150C, with a maximum capacitance change 15% (without applied voltage). The devices are available in sizes 0805 to 2225, with voltage ranges from 25V to 250V and capacitance values from 1nF to 1.8F. The capacitors have been developed by Syfer to meet demand from various applications in the automotive and industrial markets and in other electronic equipment exposed to high temperatures. The increased use of electronics in automotive "under the hood" applications has created demand for this product range. The X8R range incorporates a specially formulated termination with a nickel barrier finish that has been designed to enhance the mechanical performance of these SMD chip capacitors in harsh environments typically present in automotive applications. Insulation Resistance (IR) 100G or 1000secs (whichever is the less). Capacitance Range 1.0nF to 1.8F Dielectric Withstand Voltage (DWV) 2.5 x rated voltage for 51 seconds, 50mA charging current maximum. Temperature Coefficient of Capacitance (TCC) 15% from -55C to +150C Dissipation Factor (DF) < 0.025 Ageing Rate 1% per decade (typical) Max cap. values according to the rated d.c. voltage 0805 1206 1210 1812 2220 2225 1.0nF 2.2nF 4.7nF 6.8nF 10nF 10nF 25V 56nF 180nF 330nF 680nF 1.5F 1.8F 50V 33nF 120nF 220nF 470nF 680nF 1.0F 100V 15nF 56nF 120nF 220nF 470nF 560nF 200/250V 10nF 33nF 68nF 120nF 220nF 330nF Min Cap. value Max. cap value according to the rated dc voltage Ordering information - X8R High Temperature capacitors 1206 Y 100 0473 K N T Chip size Termination Voltage d.c. Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging 0805 1206 1210 1812 2220 2225 Y = Nickel barrier with polymeric silver termination 025 = 25V 050 = 50V 100 = 100V 200 = 200V 250 = 250V First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. J = 5% K = 10% M = 20% N = X8R Example: 0473 = 47000pF = 47nF T = 178mm (7") reel R = 330mm (13") reel B = Bulk pack - tubs Note: The highlighted parts are defined as `dual-use' under export control legislation and as such are subject to export licence restrictions. Please refer to page 9 for further details. 19 Note: C0G/NP0 ranges on reverse TCC/VCC range 2C1 (BZ) and 2X1 (BX) TCC/VCC range 2C1 (BZ) and 2X1 (BX) TCC/VCC range X7R Dielectric characteristics X7R capacitors are available from Syfer with a defined capacitance variation under applied dc voltage, across the full operating temperature range. Whilst the capacitance of C0G/NP0 chips does not vary with applied voltage, standard X7R capacitors exhibit capacitance fluctuation, but with no specified limit. For applications where a limit is required, Syfer is able to offer either a "B" code dielectric (conforms to MIL "BX" dielectric and IECQCECC "2X1") or "R" code dielectric (conforms to MIL "BZ" dielectric and IECQ-CECC "2C1"). Stable 2C1 2R1 2X1 EIA - X7R - MIL BZ - BX IECQ-CECC Rated temperature range -55C to +125C Maximum capacitance charge over temperature range No DC voltage applied Rated DC voltage applied Syfer dielectric ordering code 20% 15% 15% +20-30% - +15-25% R X B For part numbering, the "X" denoting the X7R dielectric code needs to be replaced by either "B" or "R". Please contact the Sales Office for full range information. 2C1 (BZ) capacitor range Cap 200V 100V 50V 200V 100V 50V 200V 100V 50V 200V 100V 50V 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 115 155 e 200V 100V 50V Cod 200V 100V 50V 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0 1.2 1.5 e 200V 100V 50V = FlexiCapTM termination only. Other values available in J, Y and F terminations. anc acit 2225 2220 1812 1808 1210 1206 0805 100V 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 115 155 50V 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0 1.2 1.5 0603 Cod 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 115 155 e e 200V 100V 50V 200V 100V 50V anc acit 200V 100V 50V e 200V 100V 50V Cod 200V 100V 50V 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0 1.2 1.5 e 200V 100V 50V anc acit 200V 100V 50V = FlexiCapTM termination only. Other values available in J, Y and F terminations. Cap Cap 2225 2220 1812 1808 1210 1206 0805 100V Cod 50V e e anc acit 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 115 155 0603 Cap 20 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0 1.2 1.5 2X1 (BX) capacitor range 21 High Q capacitors MS range The Syfer MS range offers a very stable, High Q material system that provides excellent, low loss performance in systems below 3GHz. Available in 0402 to 3640 case sizes with various termination options including FlexiCapTM, this range of high frequency capacitors is suitable for many applications where economical, high performance is required. High Q capacitors MS range Typical performance data - 0805 chip size* Typical performance data - 1111 chip size* ESR vs Frequency 0805 case size ESR vs Frequency 1111 case size 1 Operating Temperature -55C to +125C Temperature Coefficient (Typical) 0 30 ppm/C Insulation resistance at +25C >100G ESR (Ohms) ESR (Ohms) 1 0.1 1pF 4.7pF 10pF 1pF 100pF 0.01 100 Insulation resistance at +125C >10G 0.1 4.7pF 10pF 100pF 0.01 100 1000 1000 Frequency (MHz) Frequency (MHz) Q vs Capacitance 0805 case size Q vs Capacitance 1111 case size High Q capacitors - capacitance values 0805 1206 1111 1210 1812 2220 2225 3640 0.1pF 0.1pF 50V 63V 33pF 220pF 0.2pF 0.2pF 0.5pF 0.3pF 0.3pF 1.0pF 2.0pF 2.0pF 4.0pF 330pF 680pF 2.2nF 100V 22pF 150pF 220pF 470pF 1.5nF 3.3nF 3.3nF 6.8nF 15nF 18nF 150V 18pF 200V250V 120pF 180pF 390pF 1.2nF 2.7nF 2.7nF 4.7nF 12nF 15nF 15pF 100pF 150pF 330pF 1.0nF 2.2nF 2.2nF 3.9nF 10nF 10nF 56pF 100pF 220pF 680pF 1.5nF 1.5nF 3.3nF 6.8nF 8.2nF 300V 500V 100pF 630V 330pF 820pF 820pF 2.2nF 4.7nF 5.6nF 15nF 390pF 390pF 1.0nF 2.2nF 3.3nF 6.8nF 1000V 82pF 220pF 220pF 680pF 1.5nF 2.2nF 4.7nF 2000V 18pF 68pF 68pF 150pF 470pF 560pF 1.5nF 68pF 150pF 220pF 470pF 7" reel 2500 7" reel 1000 7" reel 2000 7" reel 500 13" reel 2000 Tape quantities 7" reel 5000 7" reel 4000 7" reel 2500 7" reel 3000 13" reel quantities available on request 7" reel 7" reel 500 500 13" reel 2000 13" reel 2000 22 1000 1000 100 10 10 150 MHz 1 0.1 1 500 MHz 10 150 MHz 1 GHz 100 J 250 4P70 B Q T Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric Packaging 0402 0603 0505 0805 1206 1111 1210 1812 2220 2225 3640 Y = FlexiCapTM termination base with nickel barrier (100% matte tin plating). RoHS compliant. Lead free. 050 = 50V 063 = 63V 100 = 100V 150 = 150V 200 = 200V 250 = 250V 300 = 300V 500 = 500V 630 = 630V 1K0 = 1000V 2K0 = 2000V 3K0 = 3000V <1.0pF Insert a P for the decimal point as the first character. eg. P300 = 0.3pF Values in 0.1pF steps <4.7pF H = 0.05pF B = 0.1pF C = 0.25pF D = 0.5pF Q = High Q Ceramic T = 178mm (7") reel 1000 1.0pF & <10pF Insert a P for the decimal point as the second character. eg. 8P20 = 8.2pF Values are E24 series <10pF B = 0.1pF C = 0.25pF D = 0.5pF 10pF First digit is 0. Second and third digits are significant figures of capacitance code. Fourth digit is number of zeros eg. 0101 = 100pF Values are E24 series R = 330mm (13") reel 0.1 1 500 MHz 10 1 GHz 100 Capacitance (pF) Resonant Frequency vs Capacitance 0805 case size Resonant Frequency vs Capacitance 1111 case size 1000 100000 10000 1000 Series 100 0.1 1 Capacitance (pF) 10000 0505 A = Silver base with nickel barrier (Tin/lead plating with min. 10% lead). 10000 100000 Ordering information - High Q capacitors - MS range J = Silver base with nickel barrier (100% matte tin plating). RoHS compliant. Lead free. 10000 7" reel n/a 13" reel n/a Below 1pF capacitance values are available in 0.1pF steps. Above 1pF capacitance values are available in E24 series values. Other values and taping quantities may be available on request, consult the sales office for details. H = FlexiCapTM termination base with nickel barrier (Tin/lead plating with min. 10% lead). 100000 100 150pF 3000V 100000 Q Min Cap 0505 Frequency (Mhz) 0603 Q 0402 Frequency (Mhz) Chip Size 1 1000 Parallel 10 Series 100 Capacitance (pF) 1000 100 0.1 1 Parallel 10 100 1000 Capacitance (pF) B = Bulk pack - tubs 10pF F = 1% G = 2% J = 5% K = 10% 23 * Refer to the Sales Office for other chip size electrical data. Copper Barrier capacitors C0G/NP0, High Q, X7R Multilayer ceramic capacitors with silver/palladium (Ag/Pd) terminations have often been used in medical applications where non-magnetic components are required, for example in MRI equipment. The use of conventional nickel barrier terminations is not suitable due to nickel exhibiting magnetic properties. Reeled Quantities 7" Reel 5000 13" Reel 4000 2500 3000 2500 10002000 13" reel quantities available on request 2000 500 500 500 8000 2000 2000 2000 Note: Other capacitance values may become available, please contact our Sales Office if you need values other than those shown in the above tables. For dimensions and soldering information, please go to our website (www.syfer.com) or see our MLC Catalogue. However, RoHS requirements have dictated the use of lead-free solders, and the composition of these solders has resulted in an increase in soldering temperatures. This has caused solder leaching problems for the Ag/ Pd termination, and meant alternative terminations have had to be found. Ordering information - Copper Barrier capacitors As copper is non-magnetic, one solution is to use a copper barrier instead of a nickel barrier, with a tin finish on top, and this is the solution Syfer has developed. profiles as detailed in J-STD-020, C0G/NP0 dielectrics are supplied with sintered termination and X7R dielectrics are supplied with Syfer's award winning FlexiCapTM termination. This copper barrier termination is offered with selected non-magnetic C0G/NP0, High Q and X7R dielectrics, providing a fully non-magnetic component. To meet high temperature 260C soldering reflow C0G/NP0 & High Q - maximum capacitance values Chip Size 0402 0603 0505 0805 1206 1111 1210 1808 1812 2220 2225 Min Cap 0.1pF 0.1pF 0.2pF 0.2pF 0.5pF 0.3pF 1.0pF 1.0pF 2.0pF 2.0pF Min Cap Tolerance Copper Barrier capacitors C0G/NP0, High Q, X7R 0.05pF (<4.7pF), 0.1pF (>4.7pF & <10pF) and 1% (>10pF) 50V 63V 22pF 100pF 220pF 470pF 1.5nF - - - - - 100V 15pF 68pF 150pF 330pF 1.0nF 2.2nF 2.2nF 4.7nF 10nF 15nF 47pF 100pF 220pF 680pF 1.5nF 1.5nF 3.3nF 6.8nF 10nF 150V 10pF 200V250V 6.8pF 33pF 56pF 150pF 470pF 1.0nF 1.0nF 2.2nF 4.7nF 6.8nF 300V - 27pF 47pF 120pF 390pF 820pF 820pF 1.8nF 3.9nF 5.6nF 500V - - - 68pF 270pF 680pF 680pF 1.5nF 3.3nF 4.7nF 630V - - - - 150pF 390pF 390pF 1.0nF 2.2nF 3.3nF 1000V - - - - 82pF 220pF 220pF 680pF 1.5nF 2.2nF 2000V - - - - 18pF 68pF 68pF 150pF 470pF 560pF 3000V - - - - - - - 68pF 150pF 220pF 1210 3 100 0103 J X T ___ Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging Suffix 2 = Sintered silver base with copper barrier (100% matte tin plating). RoHS compliant. (available on C0G/NP0 & High Q only). 016 = 16V 025 = 25V 050 = 50V 063 = 63V 100 = 100V 150 = 150V 200 = 200V 250 = 250V 500 = 500V 630 = 630V 1K0 = 1000V 1K2 = 1200V 1K5 = 1500V 2K0 = 2000V 3K0 = 3000V <10pF Insert a P for the decimal point, eg P300 = 0.3pF, 8P20 = 8.2pF. <4.7pF H = 0.05pF B = 0.1pF C = 0.25pF D = 0.5pF C = C0G/NP0 (1B) T = 178mm (7") reel Used for specific customer requirements 0402 0603 0505 0805 1206 1111 1210 1808 1812 2220 2225 3 = FlexiCapTM base with copper barrier (100% matte tin plating). RoHS compliant. 4 = Sintered silver base with copper barrier (tin/ lead plating). Non RoHS compliant. (available on C0G/NP0 & High Q only). 10pF 1st digit is 0. 2nd and 3rd digits are significant figures of capacitance code. The 4th digit is number of 0's following eg. 0103 = 10000pF Values <1pF in 0.1pF steps, above this values are E24 series 4.7pF & <10pF B = 0.1pF C = 0.25pF D = 0.5pF X = X7R (2R1) Q = High Q R = 330mm (13") reel B = Bulk pack - tubs 10pF F = 1% G = 2% J = 5% K = 10% 5 = FlexiCapTM base with copper barrier (tin/ lead plating). Non RoHS compliant. X7R - maximum capacitance values Chip Size 0402 0603 0805 1206 1210 1808 1812 2220 2225 Min Cap 47pF 100pF 330pF 680pF 1.5nF 2.2nF 3.3nF 6.8nF 10nF Min Cap Tolerance 24 5% 16V 10nF 100nF 330nF 1.0F 1.5F 1.5F 3.3F 5.6F 6.8F 25V 6.8nF 68nF 220nF 820nF 1.2F 1.2F 2.2F 4.7F 5.6F 50V 63V 4.7nF 47nF 150nF 470nF 1.0F 680nF 1.5F 3.3F 3.3F 100V 1.5nF 10nF 47nF 150nF 470nF 330nF 1.0F 1.5F 1.5F 200V250V 680pF 5.6nF 27nF 100nF 220nF 180nF 470nF 1.0F 1.0F 500V - 1.5nF 8.2nF 33nF 100nF 100nF 270nF 560nF 680nF 630V - - 4.7nF 10nF 27nF 33nF 150nF 330nF 390nF 1000V - - 3.3nF 4.7nF 15nF 18nF 56nF 120nF 150nF 1200V - - - 3.3nF 10nF 10nF 33nF 82nF 100nF 1500V - - - 2.7nF 6.8nF 6.8nF 22nF 47nF 68nF 2000V - - - 2.2nF 4.7nF 4.7nF 10nF 27nF 33nF 25 Open Mode and Tandem capacitors X7R Open Mode capacitors have been designed specifically for use in applications where mechanical cracking is a severe problem and short circuits due to cracking are unacceptable. A range of specialist high reliability MLCC's for use in critical or high reliability environments. All fully tested / approved and available with a range of suitable termination options, including tin/lead plating and Syfer FlexicapTM. Open Mode capacitors use inset electrode margins, which prevent any mechanical cracks which may form during board assembly from connecting to the internal electrodes. Ranges include :1. Range tested and approved in accordance with IECQ-CECC QC32100. When combined with Syfer's FlexiCapTM termination, Syfer Open Mode capacitors provide a robust component with the assurance that if a part becomes cracked, the crack will be unlikely to result in short circuit failure. 2. Range qualified to the requirements of AEC-Q200. 3. Range qualified to the requirements of ESCC 3009 European Space Specification. Open Mode capacitor - Open Mode max capacitance (X7R only) 0603 0805 1206 1210 1812 2220 2225 16V 39nF 150nF 470nF 680nF 1.5F 3.3F 4.7F 25V 33nF 120nF 330nF 560nF 1.2F 2.2F 3.9F 50/63V 22nF 100nF 220nF 470nF 1.0F 1.5F 2.7F 100V 6.8nF 27nF 100nF 220nF 680nF 1.0F 1.8F 200/ 250V 2.7nF 15nF 68nF 100nF 330nF 680nF 1.0F IECQ-CECC - maximum capacitance values Qualification included cracking the components by severe bend tests. Following the bend tests cracked components were subjected to endurance / humidity tests, with no failures evident due to short circuits. Note: Depending on the severity of the crack, capacitance loss was between 0% and 70%. 0603 16V 25V 50/63V Tandem Capacitors have been designed as a fail safe range using a series section internal design, for use in any application where short circuits would be unacceptable. 100V When combined with Syfer's FlexiCapTM termination, Syfer Tandem capacitors provide an ultra robust and reliable component, for use in the most demanding applications. 200V 500V Tandem max capacitance (X7R only) 1kV 0603 0805 1206 1210 1812 2220 2225 16V 12nF 47nF 150nF 270nF 560nF 1.2F 1.5F 25V 10nF 39nF 120nF 220nF 470nF 1.0F 1.2F 50/63V 6.8nF 33nF 100nF 180nF 390nF 680nF 1.0F 100V 2.2nF 10nF 47nF 82nF 220nF 470nF 680nF 200/ 250V 1.0nF 4.7nF 22nF 47nF 100nF 220nF 330nF Chip size 26 0603 0805 1206 1210 1812 2220 2225 Y Qualification included cracking the components by severe bend tests. Following the bend tests cracked components were subjected to endurance / humidity tests, with no failures evident due to short circuits. Note: Depending on the severity of the crack, capacitance loss was between 0% and 50%. 050 0224 K X T ___ Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging Suffix Y = Polymer Termination FlexiCapTM 016 = 16V 025 = 25V 050 = 50V 063 = 63V 100 = 100V 200 = 200V 250 = 250V First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. K = 10% X = X7R E = X7R (AEC-Q200 product) T = 178mm (7") reel M01 = Syfer Open Mode capacitor Example: 0224 = 220000pF 0805 1206 1210 1808 1812 2220 2225 C0G/NP0 1.5nF 6.8nF 22nF 33nF 33nF 100nF 150nF 220nF X7R 100nF 330nF 1.0F 1.5F 1.5F 3.3F 5.6F 6.8F C0G/NP0 1.0nF 4.7nF 15nF 22nF 27nF 68nF 100nF 150nF X7R 56nF 220nF 820nF 1.2F 1.2F 2.2F 4.7F 5.6F C0G/NP0 470pF 2.7nF 10nF 18nF 18nF 33nF 68nF 100nF X7R 47nF 220nF 470nF 1.0F 680nF 1.5F 2.2F 3.3F C0G/NP0 330pF 1.8nF 6.8nF 12nF 12nF 27nF 47nF 68nF X7R 10nF 47nF 150nF 470nF 330nF 1.0F 1.5F 1.5F C0G/NP0 100pF 680pF 2.2nF 4.7nF 4.7nF 12nF 22nF 27nF X7R 5.6nF 27nF 100nF 220nF 180nF 470nF 1.0F 1.0F C0G/NP0 n/a 330pF 1.5nF 3.3nF 3.3nF 10nF 15nF 22nF X7R n/a 8.2nF 33nF 100nF 100nF 270nF 560nF 820nF C0G/NP0 n/a n/a 470pF 1.0nF 1.2nF 3.3nF 8.2nF 10nF X7R n/a n/a 4.7nF 15nF 18nF 56nF 120nF 150nF Ordering information - IECQ-CECC ranges Tandem capacitor - Ordering information - Open Mode and Tandem capacitors 1206 IECQ-CECC ranges Speciality High Rel. and approved parts R = 330mm (13") reel T01 = Syfer Tandem capacitor 1210 Y 100 0103 J D T ___ Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric Release codes Packaging Suffix code Y = FlexiCapTM termination base with Ni barrier (100% matte tin plating). RoHS compliant. 016 = 16V 025 = 25V 050 = 50V 063 = 63V 100 = 100V 200 = 200V 250 = 250V 500 = 500V 630 = 630V 1K0 = 1kV First digit is 0. <10pF B = 0.1pF C = 0.25pF D = 0.5pF D = X7R (2R1) with IECQCECC release H = FlexiCapTM termination base with Ni barrier (Tin/lead plating with min. 10% lead). F = Silver Palladium. RoHS compliant. J = Silver base with nickel barrier (100% matte tin plating). RoHS compliant. A = Silver base with nickel barrier (Tin/lead plating with min. 10% lead). Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following Example: 0103 = 10nF > 10pF F = 1% G = 2% J = 5% K = 10% M = 20% F = C0G/NP0 (1B/NP0) with IECQCECC release B = 2X1/ BX released in accordance with IECQ-CECC T = 178mm (7") reel R = 330mm (13") reel B = Bulk pack - tubs Used for specific customer requirements R = 2C1/ BZ released in accordance with IECQ-CECC 27 AEC-Q200 ranges Speciality High Rel. and approved parts AEC-Q200 ranges S02A Space ranges Maximum capacitance values Maximum capacitance values 50/63V 100V 200V 500V 630V 1kV 0603 0805 1206 1210 1812 C0G/NP0 470pF 2.7nF 10nF 18nF 39nF X7R 33nF 150nF 330nF 680nF 1.5F C0G/NP0 330pF 1.8nF 6.8nF 12nF 27nF X7R 10nF 47nF 150nF 470nF 1F C0G/NP0 100pF 680pF 2.2nF 4.7nF 12nF X7R 5.6nF 27nF 100nF 220nF 470nF C0G/NP0 n/a 330pF 1.5nF 3.9nF 10nF X7R n/a 8.2nF 33nF 100nF 270nF C0G/NP0 n/a n/a 1.0nF 1.8nF 5.6nF X7R n/a n/a 10nF 27nF 150nF C0G/NP0 n/a n/a 470pF 1nF 3.3nF X7R n/a n/a 4.7nF 15nF 56nF 16V 25V 50/63V 100V Ordering information - AEC-Q200 1210 Y 100 0103 J E T ___ Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric Release codes Packaging Suffix code Y = FlexiCap termination base with Ni barrier (100% matte tin plating). RoHS compliant. TM H = FlexiCapTM termination base with Ni barrier (Tin/lead plating with min. 10% lead). F = Silver Palladium. RoHS compliant. 016 = 16V 025 = 25V 050 = 50V 063 = 63V 100 = 100V 200 = 200V 250 = 250V 500 = 500V 630 = 630V 1K0 = 1kV First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following Example: 0103 = 10nF J = Silver base with nickel barrier (100% matte tin plating). RoHS compliant. <10pF B = 0.1pF C = 0.25pF D = 0.5pF E = X7R (2R1) AEC-Q200 T = 178mm (7") reel A = C0G/NP0 (1B/NP0) AEC-Q200 R = 330mm (13") reel B = Bulk pack - tubs > 10pF F = 1% G = 2% J = 5% K = 10% M = 20% Used for specific customer requirements 3 Terminal EMI Components (E01) - AEC-Q200 ranges Maximum capacitance values 100V 200V 500V 0603 0805 1206 1210 C0G/ NP0 390pF - 1.5nF 1pF - 6.8nF 1pF - 22nF 10pF - 33nF X7R 330pF - 100nF 100pF - 330nF 680pF - 1.0F 1.0nF - 1.5F 3.9nF - 3.3F C0G/ NP0 390pF - 1.0nF 220pF - 68nF 470pF - 100nF 560pF - 150nF X7R 330pF - 56nF 100pF - 220nF 680pF - 820nF 1.0nF - 1.2F 3.9nF - 2.2F 10nF - 4.7F C0G/ NP0 0.5pF - 470pF 220pF - 39nF 470pF - 68nF 560pF - 100nF X7R 330pF - 47nF 100pF - 220nF 680pF - 470nF 1.0nF - 1.0F 3.9nF - 2.2F 10nF - 3.3F 18nF - 3.3F C0G/ NP0 1pF - 330pF 220pF - 27nF 470pF - 47nF 560pF - 68nF X7R 100pF - 10nF 100pF - 47nF 100pF - 150nF 1.0nF - 470nF 3.9nF - 1.0F 10nF - 1.5F 18nF - 1.5F C0G/ NP0 1pF - 100pF 1pF - 680pF 220pF - 12nF 470pF - 22nF 560pF - 27nF X7R 100pF - 5.6nF 100pF - 27nF 100pF - 100nF 1.0nF - 220nF 3.9nF - 470nF 10nF - 1.0F 18nF - 1.0F C0G/ NP0 - 1pF - 270pF 180pF - 6.8nF 390pF - 15nF 4.7nF - 18nF X7R - 10pF - 8.2nF 1pF - 4.7nF 1pF - 2.7nF 1pF - 1.8nF 1pF - 15nF 1pF - 10nF 1pF - 6.8nF 1pF - 2.2nF 1pF - 1.2nF 1812 2220 2225 220pF - 100nF 470pF - 150nF 560pF - 220nF 10pF - 22nF 10pF - 18nF 10pF - 12nF 10pF - 4.7nF 10pF - 2.7nF 10nF - 5.6F 180pF - 33nF 390pF - 100nF 390pF - 270nF 1nF - 560nF 18nF - 6.8F 18nF - 5.6F 15nF - 820nF Note: In accordance with ESCC 3009. Ordering information - S02A Space ranges product code construction A = Silver base with nickel barrier (Tin/lead plating with min. 10% lead). 50V S02A Space ranges Speciality High Rel. and approved parts 0805 1206 1806 C0G/NP0 820pF 1.0nF 2.2nF X7R 47nF 100nF 200nF C0G/NP0 560pF 1.0nF 2.2nF X7R 15nF 15nF 68nF Note: For some lower capacitance parts, higher voltage rated parts may be supplied. Refer to page 36. 1210 A 100 0103 J X T ___ Chip size Termination(1) Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric Rel Release codes Packaging Suffix code A = Silver base with nickel barrier (Tin/ lead plating with min. 10% lead). F = Silver Palladium. RoHS compliant. 016 = 16V 025 = 25V 050 = 50V 063 = 63V 100 = 100V 200 = 200V 500 = 500V First digit is 0. <10pF B = 0.1pF C = 0.25pF D = 0.5pF C = C0G/NP0 (1B) T = 178mm (7") reel X = X7R (2R1) R = 330mm (13") reel Used for specific customer requirements H = FlexiCapTM termination base with Ni barrier (Tin/ lead plating with min. 10% lead). Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following Example: 0103 = 10nF > 10pF F = 1% G = 2% J = 5% K = 10% M = 20% B = Bulk pack - tubs Q = Waffle pack S02A = S (Space Grade) High Rel Notes: (1) Termination A, H & F available for Space applications. If another termination type is required then contact Syfer Sales. (2) Please include Lot Acceptance Test requirement (LAT1, LAT2 or LAT3) on purchase order against each line item. Tests conducted after 100% Burn-In (2xRV @125C for 168 hours): LAT1: 4 x adhesion, 8 x rapid temp change + LAT2 and LAT3. LAT2: 20 x 1000 hour life test + LAT3. LAT3: 6 x TC and 4 x solderability. X2Y Integrated Passive Components (E03) - AEC-Q200 ranges Maximum capacitance values 50V 28 100V 0805 1206 1410 1812 C0G/NP0 470pF 1.5nF 5.6nF 10nF X7R 33nF 150nF 330nF 560nF C0G/NP0 330pF 1.0nF 3.9nF 6.8nF X7R 15nF 47nF 150nF 330nF Note: For some lower capacitance parts, higher voltage rated parts may be supplied. Refer to page 38. 29 Safety Certified capacitors Safety Certified capacitors Safety Certified capacitors classification and approval specification. CHIP SIZE Syfer Technology's Safety Certified capacitors comply with international UL and TUV specifications to offer designers the option of using a surface mount ceramic multilayer capacitor to replace leaded film types. Offering the benefits of simple pick-and-place assembly, reduced board space required and lower profile, they are also available in a FlexiCapTM version to reduce the risk of mechanical cracking. 1808 1808 Syfer's high voltage capacitor expertise means the range offers among the highest range available of capacitance values in certain case sizes. Applications include: modems, AC-DC power supplies and where lightning strike or other voltage transients represent a threat to electronic equipment. Surface mount multilayer ceramic capacitors 1808 Meet Class Y2/X1, Y3/X2 and X2 requirements Certification specifications for larger sizes include IEC/ EN60384, UL/CSA60950 and UL1414 Approved for mains ac voltages, up to 250Vac Surface mount package Approved by UL and TUV Reduces board area and height restrictions Sizes 1808, 1812, 2211, 2215 and 2220 Reduced assembly costs over conventional through hole components Smaller sizes suitable for use in equipment certified to EN60950 1808 1812 CAP RANGE C0G/NP0 4.7pF to 1.5nF SP X7R 150pF to 2.2nF SP C0G/NP0 4.7pF to 390pF PY2 X7R 150pF to 1nF PY2 C0G/NP0 4.7pF to 390pF PY2 X7R 150pF to 1.0nF PY2 C0G/NP0 4.7pF to 1nF SP X7R 100pF to 2.2nF SP C0G/NP0 820pF to 1.0nF SP X7R 2.7nF to 3.3nF SP X7R 150pF to 4.7nF B16 150pF to 10nF B17 FlexiCapTM option available on all sizes. Class Rated voltage Impulse voltage Insulation bridging May be used in primary circuit Y1 250Vac 8000V Double or reinforced Line to protective earth Y2 250Vac 5000V Basic or supplementary* Line to protective earth Y3 250Vac None Basic or supplementary - Y4 150Vac 2500V Basic or supplementary* Line to protective earth X1 250Vac 4000V - Line to line X2 250Vac 2500V - Line to line X3 250Vac None - Line to line 1812 2211 2211 2215 2215 2220 2220 Notes (1), (2) (1), (2) (2) (2) PY2 SP SYFER FAMILY CODE DIELECTRIC * 2 x Y2 or Y4 rated may bridge double or reinforced insulation when used in series. 30 Safety Certified capacitors Certification Chart X7R (1) CLASSIFICATION APPROVAL SPECIFICATION APPROVAL BODY Y3/X2 IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL-60950-1, 2nd Ed CSA 60950-1-07 2nd Ed UL IEC60384-14:2005 EN60384-14:2005 TUV UL1414: 6th Edition UL IEC60384-14:2005 EN60384:2005 TUV NWGQ2, NWGQ8 (1) Y3/X2 NWGQ2, NWGQ8 (1) (1) (1) (1) (2) Y2/X1 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 Y2/X1 NWGQ2, NWGQ8 (2) Y2/X1 NWGQ2, NWGQ8 (2) Y2/X1 NWGQ2, NWGQ8 (2) Y2/X1 NWGQ2, NWGQ8 (2) (2) Y2/X1 (1) Y2/X1, FOWX2 X2 Termination Availability J: Silver base with Nickel Barrier (100% Matte Tin Plating). RoHS compliant. Y: FlexiCapTM termination base with Nickel Barrier (100% Tin Plating). RoHS compliant. H: FlexiCapTM termination base with Nickel Barrier (Tin/ Lead plating with min 10% Lead). A: Silver base with Nickel Barrier (Tin/ Lead Plating with min 10% Lead). Unmarked capacitors also available as released in accordance with approval specifications. Family code SY2 applies. Unmarked capacitors also available as released in accordance with approval specifications. Family code SPU applies. BAUART GEPRUFT Rheinland Product Safety TYPE APPROVED 31 Safety Certified capacitors Ordering information - Safety Certified capacitors - Class SPU/SP ranges 1808 J A25 0102 J C T SP Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging Suffix J = Nickel barrier A25 = 250Vac First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. <10pF C = 0.25pF D = 0.5pF C = C0G/NP0 X = X7R T = 178mm (7") reel SP = Surge Protection capacitors (marked and approved) 1808 2211 2215 Y = FlexiCapTM termination base with nickel barrier (100% matte tin plating). RoHS compliant. 2211/2215 only A = Silver base with nickel barrier (Tin/lead plating with min. 10% lead). 250Vac Non Safety Rated AC capacitors Ordering information R = 330mm (13") reel > 10pF F = 1% G = 2% J = 5% K = 10% M = 20% Example: 0102 = 1.0nF B = Bulk pack - tubs SPU = Surge Protection capacitors (un-marked parts are in accordance with, but not certified) H = FlexiCapTM termination base with Ni barrier (Tin/lead plating with min. 10% lead). Industry wide standard multilayer ceramic capacitors are supplied with a DC rating only. For AC use, Surge and Safety capacitors with an AC rating of 250Vac have been available but the capacitance range is limited as a result of the strict impulse and VP requirements in the international standards. Syfer Technology have developed a range which provides a solution for use at up to 250Vac 60Hz continuous use and provides for non safety-critical applications where extended capacitance ranges are required. Capacitance range Case sizes 0805 to 2220 are available in both X7R and C0G/NP0 dielectrics with capacitances of up to 120nF. The capacitance ranges are divided into four groups which are based on the voltage coefficient of capacitance, C0G/NP0 which has negligible capacitance shift with applied voltage and three subgroups of X7R. Type A with 30% maximum capacitance shift 0V-240V, Type B with +30% to Ordering information - Safety Certified capacitors - Class PY2/SY2 Chip size 0805 1206 1210 1808 1812 2220 C0G/NP0 1.0pF - 470pF 1.0pF - 1.2nF 4.7pF - 2.2nF 4.7pF - 2.2nF 10pF - 5.6nF 10pF - 10nF 1808 J A25 0102 J X T PY2 X7R A 30% 560pF - 1.5nF 1.5nF - 10nF 2.7nF - 22nF 2.7nF - 22nF 6.8nF - 56nF 12nF - 120nF Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging Suffix X7R B +30% -50% 1.8nF - 3.3nF 12nF 27nF 27nF 68nF - 82nF - J = Nickel barrier A25 = 250Vac First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. <10pF C = 0.25pF D = 0.5pF C = C0G/NP0 X = X7R T = 178mm (7") reel PY2 = Safety tested Surge Protection capacitors (marked and approved) X7R C +30% -80% 3.9nF - 10nF 15nF - 47nF 33nF - 100nF 33nF - 100nF 100nF - 120nF - 1808 1812 Y = FlexiCap termination base with nickel barrier (100% matte tin plating). RoHS compliant. TM Example: 0102 = 1.0nF R = 330mm (13") reel > 10pF F = 1% G = 2% J = 5% K = 10% M = 20% B = Bulk pack - tubs SY2 = Surge Protection capacitors (un-marked parts are in accordance with, but not certified) 2220 J A25 0102 J X T B16 Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging Suffix 2220 J = Nickel barrier A25 = 250Vac First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. J = 5% K = 10% M = 20% X = X7R T = 178mm (7") reel B16 = Type A: X1/Y2 B17 = Type B: X2 Y = FlexiCap termination base with nickel barrier (100% matte tin plating). RoHS compliant. TM A = Silver base with nickel barrier (Tin/lead plating with min. 10% lead). H = FlexiCapTM termination base with Ni barrier (Tin/ lead plating with min. 10% lead). Example: 0471 = 470pF NOTE: X7R A) has a VCC of 30% over 0 to 240Vac 50Hz X7R B) has a VCC of +30% to -50% over 0 to 240Vac 50Hz X7R C) has a VCC of +30% to -80% over 0 to 240Vac 50Hz Measurement conditions described in Syfer Application Notes AN0033 Ordering information - 250Vac Non Safety Rated AC capacitors Ordering information - Safety Certified capacitors - Class B16/B17 ranges 32 -50% maximum capacitance shift 0V-240V and Type C with +30 to -80% maximum capacitance shift 0V to 240V. 1812 Y A25 0103 K X T Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging Y = FlexiCapTM 250Vac 60Hz <10pF Insert a P for the decimal point, eg P300 = 0.3pF, 8P20 = 8.2pF. <10pF B = 0.1pF C = 0.25pF D = 0.5pF C = C0G/NP0 0805 1206 1210 1808 1812 2220 J = Nickel Barrier 10pF 1st digit is 0. 2nd and 3rd digits are significant figures of capacitance code. The 4th digit is number of 0's following eg. 0103 = 10000pF Values <1pF in 0.1pF steps, above this values are E24 series 10pF F = 1% G = 2% J = 5% K = 10% X = X7R T = 178mm (7") reel R = 330mm (13") reel B = Bulk pack - tubs 1000 pieces R = 330mm (13") reel 4000 pieces B = Bulk 33 115Vac 400Hz & DWV ranges 115Vac 400Hz Capable capacitors for aerospace applications Syfer Technology has conducted reliability testing on standard surface mount ceramic capacitors in order to ensure their performance at 115Vac 400Hz and the associated voltage and frequency transients required by MIL-STD-704. Self heating will occur due to losses in the capacitor but has been measured at less than 25C rise with neutral mounting conditions at room temperature. 115Vac 400Hz Capable capacitor range 0805 1206 Dielectric 1210 1808 1812 2220 Capacitance values C0G/NP0 330pF 1.5nF 3.9nF 3.9nF 10nF 15nF X7R 4.7nF 18nF 39nF 39nF 82nF 100nF 1206 Y A12 0103 J X T Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging 0805 1206 1210 1808 1812 2220 J = Nickel barrier A12 = 115Vac First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. <4.7pF H = 0.05pF B = 0.1pF C = 0.25pF D = 0.5pF C = C0G/NP0 X = X7R T = 178mm (7") reel Example: 0103 = 10nF 4.7pF & <10pF B = 0.1pF C = 0.25pF D = 0.5pF A = (Tin/lead) H = FlexiCapTM (Tin/lead) Syfer Technology has developed a range of surface mount multilayer ceramic capacitors aimed specifically at the LCD inverter market. The advantage gained over standard product is a reduced susceptibility to surface arcing which allows for the replacement of leaded components. The improved properties are achieved by the utililisation of a unique C0G/NP0 dielectric material. Parts for these applications are identified with the suffix code FB9. Users should carefully consider solder pad design as this can influence arcing voltage. Capacitance range Ordering information - 115Vac 400Hz Capable capacitors Y = FlexiCapTM LCD Inverter chip range C0G/NP0 R = 330mm (13") reel B = Bulk pack - tubs 1808 1812 5kV 1.5pF - 22pF 3.9pF - 68pF 6kV 1.5pF - 12pF 3.9pF - 33pF Ordering information - LCD Inverter range 1808 Y 5K0 0220 J C T FB9 Chip size Termination Voltage d.c. Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging Suffix Y = FlexiCapTM termination base with Nickel barrier (100% matte tin plating). RoHS compliant. 5K0 = 5kV 6K0 = 6kV <1.0pF Insert a P for the decimal point as the first character. eg. P300 = 0.3pF Values in 0.1pF steps <10pF B = 0.1pF C = 0.25pF D = 0.5pF C = C0G/NP0 T = 178mm (7") reel LCD Inverter range 1808 1812 10pF F = 1% G = 2% J = 5% K = 10% J = Nickel barrier. High Dielectric Withstand Voltage capacitors (DWV range) 1.0pF & <10pF Insert a P for the decimal point as the second character. eg. 8P20 = 8.2pF Values are E24 series > 10pF F = 1% G = 2% J = 5% K = 10% R = 330mm (13") reel B = Bulk pack - tubs 10pF First digit is 0. Second and third digits are significant figures of capacitance code. Fourth digit is number of zeros eg. 0101 = 100pF Values are E24 series The Syfer DWV range is specifically designed for use in applications where a high Dielectric Withstand Voltage (DWV) is required. These parts have a continuous rated voltage of 500Vdc minimum and are 100% DWV tested at the specified voltages to ensure Flashover (arcing) across the surface does not occur. High dielectric withstand voltages (DWV) of 1.5kV and 2.5kV These ratings are based on an application of the DWV voltage for a period of up to 60 seconds (where the charging current is limited to 50mA) Case sizes 1206 to 2225 Capacitance values from 4.7pF to 120nF For full range information please see Syfer web site, or contact our Sales Office. C0G/NP0 and X7R dielectrics Ordering information - DWV capacitors 34 1812 J 1K5 0820 K C T DWV Chip size Termination Dielectric Withstand Voltage Capacitance in picofarads (pF) Capacitance tolerance Dielectric codes Packaging Suffix J = Nickel barrier 1K5 = 1500V 2K5 = 2500V J = 5% K = 10% M = 20% C = C0G/NP0 X = X7R T = 178mm (7") reel Dielectric Withstand Voltage 1206 1210 1808 1812 2220 2225 Y = FlexiCapTM First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 0820 = 82pF R = 330mm (13") reel B = Bulk pack - tubs 35 Surface mount EMI Filters E01 & E07 feedthrough capacitors The Syfer E01 and E07 ranges of feedthrough MLCC chip `C' filters are 3 terminal chip devices designed to offer reduced inductance compared to conventional MLCC's when used in signal line filtering. Open board insertion loss performance in 50W system Open Board Performance Capacitance 0.1MHz 1MHz 10MHz 100MHz 1GHz Resonance Freq (MHz) approx. The filtered signal passes through the chip internal electrodes and the noise is filtered to the grounded side contacts, resulting in reduced length noise transmission paths. 10pF 0 0 0 0 7.5 2200 22pF 0 0 0 0 16 1600 33pF 0 0 0 1 22 1350 47pF 0 0 0 2 28 1150 Available in C0G/NP0 and X7R dielectrics, with current ratings of 300mA, 1A, 2A and voltage ratings of 25Vdc to 200Vdc. Also available with FlexiCapTM termination which is strongly recommended for new designs. 68pF 0 0 0 3 41 900 100pF 0 0 0 5 28 800 150pF 0 0 0 8 24 700 220pF 0 0 0 12 20 600 330pF 0 0 1 15 20 500 470pF 0 0 2 18 20 425 560pF 0 0 3 20 20 350 680pF 0 0 4 22 20 300 820pF 0 0 5 24 20 260 1nF 0 0 7 27 20 220 1.5nF 0 0 9 31 20 200 2.2nF 0 0 12 34 20 170 3.3nF 0 1 14 39 20 135 4.7nF 0 2 18 46 20 110 6.8nF 0 3 21 50 20 90 10nF 0 5 24 48 20 80 15nF 0 8 27 45 20 65 22nF 0 12 31 43 20 56 33nF 1 14 34 40 20 40 47nF 2 17 38 40 20 34 68nF 4 20 41 40 20 30 100nF 6 24 45 40 20 28 150nF 8 26 48 40 20 24 220nF 10 30 52 40 20 17 330nF 13 33 55 40 20 15.5 470nF 16 36 60 40 20 14 560nF 18 39 65 40 20 12 Commonly used in automotive applications, a range qualified to AECQ-200 is also available. E01 300mA, E07 1A/2A C E01 / E07 Recommended solder lands E01/E07 L D B T Earth track E A W C Signal track Dimensions 0603 0805 1206 1806 L 1.6 0.2 (0.063 0.008) 2.0 0.3 (0.079 0.012) 3.2 0.3 (0.126 0.012) 4.5 0.35 (0.177 0.014) W 0.8 0.2 (0.003 0.008) 1.25 0.2 (0.049 0.008) 1.6 0.2 (0.063 0.008) T 0.5 0.15 (0.02 0.006) 1.0 0.15 (0.039 0.006) B1 0.3 0.2 (0.012 0.008) B2 0.2 0.1 (0.008 0.004) 0603 0805 1206 1806 A 0.6 (0.024) 0.95 (0.037) 1.2 (0.047) 1.2 (0.047) 1.6 0.2 (0.063 0.008) B 0.6 (0.024) 0.9 (0.035) 0.9 (0.035) 1.4 (0.055) 1.1 0.2 (0.043 0.008) 1.1 0.2 (0.043 0.008) C 0.4 (0.016) 0.3 (0.012) 0.6 (0.024) 0.8 (0.031) 0.60 0.2 (0.024 0.008) 0.95 0.3 (0.037 0.012) 1.4 0.3 (0.055 0.012) D 0.2 (0.008) 0.4 (0.016) 0.8 (0.031) 1.4 (0.055) 0.3 0.15 (0.012 0.006) 0.5 0.25 (0.02 0.01) 0.5 0.25 (0.02 0.01) E 0.4 (0.016) 0.75 (0.030) 1.0 (0.039) 1.4 (0.055) 10 0 -10 Loss (db) Loss (db) B1 B2 Notes: 1) All dimensions mm (inches). 2) Pad widths less than chip width gives improved mechanical performance. 3) The solder stencil should place 4 discrete solder pads. The unprinted distance between ground pads is shown as dim E. 4) Insulating the earth track underneath the filters is acceptable and can help avoid displacement of filter during soldering but can result in residue entrapment under the chip. E01 Type -20 -40 -50 -60 -70 -80 0.00 E07 0603 0805 1206 1806 0603 0805 1206 1806 Max Current 300mA 300mA 300mA 300mA 1A 2A 2A 2A 820pF-4.7nF 1206 Chip Size Termination 0603 0805 1206 1806 J = Nickel Barrier (Tin) Y = FlexiCapTM (Tin) A = (Tin/Lead) H = FlexiCapTM (Tin/Lead) 25Vdc 50Vdc 100Vdc 200Vdc Dielectric Minimum and maximum capacitance values C0G/NP0 150pF-390pF 180pF-1.5nF 560pF-3.9nF 820pF-4.7nF 150pF-390pF 180pF-1.5nF 560pF-3.9nF X7R 6.8nF-18nF 470pF-100nF 5.6nF-330nF 3.9nF-560nF 6.8nF-18nF 820pF-100nF 10nF-330nF 22nF-560nF C0G/NP0 10pF-56pF 22pF-820pF 22pF-3.3nF 22pF-3.9nF 12pF-56pF 10pF-220pF 22pF-1nF 100pF-2.2nF X7R 2.7nF-12nF 560pF-68nF 4.7nF-220nF 3.3nF-330nF 2.7nF-12nF 1nF-68nF 10nF-220nF 22nF-330nF C0G/NP0 - 22pF-560pF 22pF-2.2nF 22pF-3.3nF - 10pF-120pF 22pF-560pF 100pF-680pF X7R - 560pF-27nF 1.8nF-100nF 3.3nF-180nF - 1nF-27nF 10nF-100nF 22nF-180nF C0G/NP0 - - 560pF-1.2nF 56pF-1nF - - 15pF-180pF 56pF-470pF X7R - - 2.7nF-56nF 3.9nF-100nF - - 12nF-56nF 22nF-100nF Notes: 1) E01 ranges in red available as qualified AEC-Q200. 2) E07 25Vdc C0G/NP0 0805 to 1806 ranges in green, have maximum current of 1A. 10pF - C0G 22pF - C0G 47pF - C0G 100pF - C0G 470pF - C0G 2.2nF - C0G 2.2nF - X7R 4.7nF - X7R 10nF - X7R 22nF - X7R 100nF - X7R 200nF - X7R -30 Chip Size Rated Voltage 36 Surface mount EMI Filters E01 & E07 feedthrough capacitors 0.01 0.10 1.0 10.0 100.0 1000.0 1000.0 10000.0 Frequency (MHz) Frequency (MHz) Ordering Information - E01 & E07 feedthrough capacitors Reeled quantities Y 178mm (7") reel 100 0103 M Voltage Capacitance in picofarads (pF) Tolerance 025 = 25Vdc First digit is 0. Second and third M = 20% 050 = 50Vdc digits are significant figures of 100 = 100Vdc capacitance code. The fourth digit 200 = 200Vdc is number of zeros following Example: 0103=10000pF. X T E07 Dielectric Packaging Type A = C0G/NP0 AEC-Q200 T = 178mm (7") reel E01 E07 C = C0G/NP0 R = 330mm (13") reel E = X7R AEC-Q200 37 B = Bulk X = X7R 0805 3000 1206 2500 1806 2500 330mm (13") reel 0805 1206 1806 12000 10000 10000 Surface mount EMI filters X2Y Integrated Passive Components X2Y Surface mount EMI filters X2Y Integrated Passive Components AEC-Q200 range (E03) - capacitance values Chip size The Syfer X2Y Integrated Passive Component is a 3 terminal EMI chip device. 50Vdc When used in balanced line applications, the revolutionary design provides simultaneous line-toline and line-to-ground filtering, using a single ceramic chip. In this way, differential and common mode filtering are provided in one device. 100Vdc 0805 1206 1410 1812 C0G/NP0 390pF - 470pF 1.2nF - 1.5nF 4.7nF - 5.6nF 8.2nF - 10nF X7R 18nF - 33nF 56nF - 150nF 180nF - 330nF 390nF- 560nF C0G/NP0 10pF - 330pF 22pF - 1.0nF 100pF - 3.9nF 820pF - 6.8nF X7R 470pF - 15nF 1.5nF - 47nF 4.7nF - 150nF 8.2nF - 330nF For unbalanced applications, it provides ultra low ESL (equivalent series inductance). Capable of replacing 2 or more conventional devices, it is ideal for balanced and unbalanced lines, twisted pairs and dc motors, in automotive, audio, sensor and other applications. Component Advantages Disadvantages Applications Available in sizes from 0603 to 2220, these filters can prove invaluable in meeting stringent EMC demands. Chip capacitor Industry standard Requires 1 per line High inductance Capacitance matching problems By-pass Low frequency 3 terminal feedthrough Feedthrough Lower inductance Current limited Feedthrough Unbalanced lines High frequency Syfer X2Y Integrated Passive Component Very low inductance Replaces 2 (or 3) components Negates the effects of temperature, voltage and ageing Provides both common mode and differential mode attenuation Can be used on balanced & unbalanced lines Care must be taken to optimise circuit design By-pass Balanced lines High frequency dc electric motors Unbalanced lines Audio amplifiers CANBUS Manufactured in the UK by Syfer Technology Limited under licence from X2Y attenuators LLC. Dielectric X7R or C0G/NP0 Typical capacitance matching Better than 5% Electrical configuration Multiple capacitance Temperature rating -55C to 125C Capacitance measurement At 1000hr point Insulation resistance 100Gohms or 1000s (whichever is the less) Type E03 Chip size 0603 0805 Dielectric 50Vdc 100Vdc 200Vdc 500Vdc 2220 - 150pF - - - - 15nF - - - - - 120pF 560pF - 820pF 1.8nF - 3.3nF 6.8nF - 8.2nF 12nF - 15nF 22nF - 33nF 12nF 56nF - 68nF - 470nF 820nF 1.2F 10pF - 100pF 390pF - 470pF 4.7nF - 5.6nF 8.2nF - 10nF 18nF - 47nF 56nF - 220nF 180nF - 400nF 390nF - 680nF 560nF - 1.0F 10pF - 330pF 22pF - 1.0nF 100pF - 3.9nF 820pF - 6.8nF 1.0nF - 15nF A INPUT 1 A SIGNAL C1 C1 C2 GROUND C1 C1 10nF - 470nF RETURN B INPUT 2 B 470pF - 15nF 1.5nF - 47nF 4.7nF - 150nF 8.2nF - 330nF - - 22pF - 1.0nF 100pF - 3.3nF 820pF - 5.6nF 1.0nF - 15nF 0 0 - - 820pF - 33nF 1.2nF - 120nF 2.7nF - 180nF 4.7nF - 470nF -10 -10 - - - - 820pF - 3.9nF 1.0nF - 10nF - - - - 2.7nF - 100nF 4.7nF - 180nF T 0603 0805 1206 1410 1812 2220 1.60.2 (0.0630.008) 2.00.3 (0.080.012) 3.20.3 (0.1260.012) 3.60.3 (0.140.012) 4.50.35 (0.180.014) 5.70.4 (0.220.016) W 0.80.2 (0.030.008) 1.250.2 (0.050.008) 1.600.2 (0.0630.008) 2.50.3 (0.10.012) 3.20.3 (0.1260.012) 5.00.4 (0.20.016) T 0.50.15 (0.020.006) 1.00.15 (0.040.006) 1.10.2 (0.0430.008) 2.0 max. (0.08 max.) 2.1 max. (0.08 max.) 2.5 max. (0.1 max.) B1 0.40.15 (0.0160.006) 0.50.25 (0.020.01) 0.950.3 (0.0370.012) 1.200.3 (0.0470.012) 1.40.35 (0.060.014) 2.250.4 (0.090.016) B2 0.250.15 (0.0100.006) 0.30.15 (0.0120.006) 0.50.25 (0.020.01) 0.50.25 (0.020.01) 0.750.25 (0.030.01) 0.750.25 (0.030.01) Notes: 1) All dimensions mm (inches). 2) Pad widths less than chip width gives improved mechanical performance. 3) The solder stencil should place 4 discrete solder pads. The un-printed distance between ground pads is shown as dim E. 4) Insulating the earth track underneath the filters is acceptable and can help avoid displacement of filter during soldering but can result in residue entrapment under the chip. W B1 Recommended solder lands 0603 0805 1206 1410 1812 2220 0.6 (0.024) 0.95 (0.037) 1.2 (0.047) 2.05 (0.08) 2.65 (0.104) 4.15 (0.163) D A B B 0.6 (0.024) 0.9 (0.035) 0.9 (0.035) 1.0 (0.040) 1.4 (0.055) 1.4 (0.055) C 0.4 (0.016) 0.3 (0.012) 0.6 (0.024) 0.7 (0.028) 0.8 (0.031) 1.2 (0.047) D 0.2 (0.008) 0.4 (0.016) 0.8 (0.031 ) 0.9 (0.035) 1.4 (0.055) 1.8 (0.071) E 0.4 (0.016) 0.75 (0.030) 1.0 (0.039) 1.85 (0.071) 2.05 (0.080) 3.95 (0.156) C Decoupling application - L E Filtering application 18nF - L B2 1.2nF - 1.5nF 150pF - 10nF Notes: 1) For some lower capacitance parts, higher voltage rated parts may be supplied. 38 1812 A Insertion loss (dB) 25Vdc 1410 Minimum and maximum capacitance values C0G/NP0 X7R C0G/NP0 X7R C0G/NP0 X7R C0G/NP0 X7R C0G/NP0 X7R C0G/NP0 X7R 16Vdc 1206 Insertion loss (dB) Rated voltage Dielectric withstand voltage <200V 2.5 times rated Volts for 5 secs 500V 1.5 times rated Volts for 5 secs Charging current limited to 50mA Max. -20 -30 -40 -50 -60 -70 0.1 47nF 27pF 100nF 100pF 220nF 470pF 400nF 1nF 680nF 10nF 1 10 100 1000 470pF 1nF -20 -30 -40 -50 47nF 10nF -60 100nF -70 5000 1 10 Frequency (MHz) 100 1000 5000 Frequency (MHz) Ordering information 1812 Y Chip Size Termination 0603 0805 1206 1410 1812 2220 J = Nickel barrier Y = FlexiCapTM A = (Tin/lead) H = FlexiCapTM (Tin/lead) 100 0334 M Voltage Capacitance in picofarads (pF) C1 Tolerance Dielectric Packaging Type 016 = 16Vdc 025 = 25Vdc 050 = 50Vdc 100 = 100Vdc 200 = 200Vdc 500 = 500Vdc First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following M = 20% A = C0G/NP0 AEC-Q200 T = 178mm (7") reel C = C0G/NP0 R = 330mm (13") reel Syfer X2Y Integrated Passive Component Example: 0334=330nF. X (Tighter tolerances may be available on request). Note: C1 = 2C2 Reeled quantities 178mm (7") reel 0603 0805 1206 1410 1812 2220 4000 3000 2500 2000 1000 1000 E = X7R AEC-Q200 T E03 B = Bulk X = X7R 39 330mm (13") reel 0603 0805 1206 1410 1812 2220 16000 12000 10000 8000 4000 4000 Ceramic chip capacitors Packaging information Reel dimensions mm (inches) 20.2(0.795) min 1.5(.06) min Missing components Plastic carrier tape T 0.5(0.02) Product identifying label The number of missing components in the tape may not exceed 0.25% of the total quantity with not more than three consecutive components missing. This must be followed by at least six properly placed components. 13(0.512) Tape and reel packing of surface mounting chip capacitors for automatic placement are in accordance with IEC60286-3. 60(2.36) min 178mm (7") or 330mm (13") dia. reel Embossment Peel force The peel force of the top sealing tape is between 0.2 and 1.0 Newton at 180. The breaking force of the carrier and sealing tape in the direction of unreeling is greater than 10 Newtons. Symbol Description 178mm reel 330mm reel A Reel diameter 178 (7) 330 (13) G Reel inside width 8.4 (0.33) 12.4 (0.49) T Reel outside width 14.4 (0.56) max 18.4 (0.72) max D0 Each reel is labelled with the following information: manufacturer, chip size, capacitance, tolerance, rated voltage, dielectric type, batch number, date code and quantity of components. 40 empty sealed embossments minimum length is quantity dependent TRAILER COMPONENTS 20 sealed embossments minimum LEADER 400mm min. NOTES: 1) IED60286 stats Ao < Bo (see Tape Dimensions above). 2) Regarding the orientation of 1825 & 2225 components, the termination bands are right to left, NOT front to back. Please see diagram. Outer Packaging Orientation of 1825 & 2225 components Outer Carton Dimensions mm (inches) max. Feed direction P0 Sealing tape START Tape and reeling is in accordance with IEC 60286 part 3, which defines the packaging specifications of leadless components on continuous tapes. Tape dimensions T END Component orientation G 8 or 12mm nominal Leader and Trailer Identification A Top tape Ceramic chip capacitors Packaging information P2 T Reel Size No. of reels L W T 178 (7.0) 1 185 (7.28) 185 (7.28) 25 (0.98) 178 (7.0) 4 190 (7.48) 195 (7.76) 75 (2.95) 330 (13.0) 1 335 (13.19) 335 (13.19) Product identifying label W 25 (0.98) E F K0 t1 L W B0 D1 P1 Embossment Cavity centre lines Note: Labelling of box and reel with bar codes (Code 39) available by arrangement. A0 Reel quantities Chip size Dimensions mm (inches) Symbol Description A0 B0 K0 Width of cavity Length of cavity Depth of cavity Dependent on chip size to minimize rotation W Width of tape 8.0 (0.315) 3.5 (0.138) F Distance between drive hole centres and cavity centres E Distance between drive hole centres and tape edge 8mm tape 12mm tape 12.0 (0.472) 5.5 (0.213) 1.75 (0.069) P1 Distance between cavity centres P2 Axial distance between drive hole centres and cavity centres 2.0 (0.079) P0 Axial distance between drive hole centres 4.0 (0.156) D0 Drive hole diameter 1.5 (0.059) D1 Diameter of cavity piercing XT Carrier tape thickness Xt1 Top tape thickness 4.0 (0.156) 8.0 (0.315) 178mm (7") Reel quantities 330mm (13") 0505 0603 0805 1111 1206 1210 1410 1808 1812 1825 2211 2215 2220 2225 0.5mm 1.3mm 0.8mm 1.3mm 2.0mm 1.6mm 2.0mm 2.0mm 2.0mm 2.5mm 2.5mm 2.5mm 2.5mm 2.5mm 2.5mm 0.02" 0.05" 0.03" 0.05" 0.08" 0.06" 0.08" 0.08" 0.08" 0.1" 0.1" 0.1" 0.1" 0.1" 0.1" 5000 2500 4000 3000 1000 2500 2000 2000 1500 500/ 1000 500 750 500 500/ 1000 500/ 1000 - - 16000 12000 - 10000 8000 8000 6000 2000/ 4000 2000 - 4000 2000/ 4000 2000/ 4000 Notes: (1) The above quantities per reel are for the maximum manufactured chip thickness. Thinner chips can be taped in larger quantities per reel. (2) Where two different quantities are shown for the same case size, please contact the Sales Office to determine the exact quantity for any specific part number. Bulk packing - tubs 1.0 (0.039) 1.5 (0.059) 0.3 (0.012) 0.1 (0.004) 0.4 (0.016) 0.1 (0.004) 0.1 (0.004) max Max. chip thickness 0402 Chips are supplied in rigid re-sealable plastic tubs together with impact cushioning wadding. Tubs are labelled with the details: chip size, capacitance, tolerance, rated voltage, dielectric type, batch number, date code and quantity of components. Product identifying label Caution label H Dimensions mm (inches) 40 H 60 (2.36) D 50 (1.97) D 41 Radial Leaded capacitors Radial Leaded capacitors Dimensions - Dipped Radial Syfer Technology produces a wide range of dipped radial leaded capacitors. These are available in rated voltages of 50V up to 6kV. Although our catalogue range extends to 6kV, we are able to offer a capability for specials up to 10kV. Our larger case sizes and high voltage versions are particularly in demand, especially for mil/aero and medical power supply applications. Please contact our Sales Office to discuss any special requirements. IECQ-CECC approved parts are also included within the ranges. High working voltage - up to 10kVdc Large case sizes RoHS compliant versions Tin-lead plated wire option to reduce tin whiskers (quote suffix A97 for 8111 to 8141 & A31 for 8151, 8161, 8171). 8111M Min. cap values 50/63V 100V 200/ 250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV 8111N 8121M 8121N 8121T 8131M 8131M 8131T T= 6.3mm 8141M 8151M 8151M T= 6.3mm 8161M 8161M T= 7.0mm 8171M F B 8121M B A 8121N C B 5.31 0.21 5.31 0.21 6.58 0.26 6.58 0.26 5.80 0.23 9.12 0.36 9.12 0.36 11.66 0.46 14.20 0.56 16.50 0.65 19.00 0.75 20.00 0.79 2.54 0.10 2.54 0.10 3.18 0.125 3.18 0.125 4.50 0.18 3.81/6.30 0.15/0.25 4.50 0.18 3.81 0.15 5.08/6.30 0.20/0.25 6.00/7.00 0.24/0.28 6.00 0.24 6.00/7.00 0.24/0.28 2.540.4 0.1.0.016 5.080.4 0.20.016 2.540.4 0.10.016 5.080.4 0.20.016 7.620.4 0.300.016 5.080.4 0.20.016 7.620.4 0.300.016 5.080.4 0.20.016 10.10.4 0.40.016 14.50.5 0.570.02 17.150.5 0.670.02 20.50.5 0.810.02 0.50.05 0.020.002 0.50.05 0.020.002 0.50.05 0.020.002 0.50.05 0.020.002 0.50.05 0.020.002 0.50.05 0.020.002 0.50.05 0.020.002 0.50.05 0.020.002 0.60.05 0.0250.002 0.60.05 0.0250.002 0.60.05 0.0250.002 0.60.05 0.0250.002 A - 39pF - 68pF - 470pF - 1.0nF - 2.2nF - C0G/NP0 5.6nF 5.6nF 18nF 18nF 18nF 100nF - 47nF 150nF 220nF - 390nF - 680nF - X7R 220nF 220nF 1.0F 1.0F 1.0F 3.3F - 2.2F 4.7F 8.2F - 10F - 15F - C0G/NP0 2.7nF 2.7nF 12nF 12nF 12nF 68nF - 27nF 100nF 180nF - 330nF - 560nF - X7R 100nF 100nF 470nF 470nF 470nF 1.5F - 1.0F 2.2F 8.2F - 10F - 15F - C0G/NP0 1.0nF 1.0nF 4.7nF 4.7nF 4.7nF 27nF 68nF 12nF 47nF 82nF 180nF 120nF 330nF 270nF 560nF X7R 56nF 56nF 220nF 220nF 220nF 1.0F - 470nF 1.0F 1.5F - 3.9F - 8.2F - C0G/NP0 470pF 470pF 3.9nF 3.9nF 3.9nF 22nF 47nF 10nF 33nF 56nF 120nF 100nF 270nF 180nF 470nF X7R 8.2nF 8.2nF 100nF 100nF 100nF 820nF - 270nF 680nF 1.0F - 1.8F - 3.3F - C0G/NP0 270pF 270pF 1.8nF 1.8nF 1.8nF 15nF 39nF 5.6nF 22nF 39nF 100nF 68nF 180nF 150nF 390nF X7R 4.7nF 4.7nF 27nF 27nF 27nF 390nF - 150nF 470nF 680nF - 1.2F - 2.2F - C0G/NP0 100pF 100pF 1.0nF 1.0nF 1.0nF 10nF 27nF 3.3nF 15nF 22nF 82nF 39nF 150nF 68nF 270nF X7R 3.3nF 3.3nF 15nF 15nF 15nF 150nF - 56nF 150nF 180nF - 390nF - 1.0F - 6.8nF 18nF 56nF 33nF 100nF 47nF X7R - - 10nF 10nF 10nF 100nF - 33nF 100nF 150nF - 220nF - 470nF - - - 470pF 470pF 470pF 4.7nF 12nF 1.5nF 4.7nF 12nF 39nF 22nF 68nF 33nF 120nF X7R - - 6.8nF 6.8nF 6.8nF 68nF - 22nF 68nF 100nF - 150nF - 330nF - C0G/NP0 - - 220pF 220pF 220pF 2.2nF 6.8nF 820pF 3.3nF 5.6nF 18nF 10nF 39nF 18nF 68nF X7R - - 4.7nF 4.7nF 4.7nF 33nF - 10nF 47nF 47nF - 82nF - 150nF - C0G/NP0 - - - - - 1.8nF 3.9nF 680pF 1.8nF 4.7nF 12nF 6.8nF 22nF 12nF 39nF X7R - - - - - 12nF - 3.3nF 12nF 33nF - 68nF - 100nF - C0G/NP0 - - - - - 1.5nF 2.7nF 470pF 1.0nF 2.2nF 8.2nF 4.7nF 18nF 8.2nF 27nF X7R - - - - - 6.8nF - 2.7nF 10nF 18nF - 39nF - 68nF - C0G/NP0 - - - - - 820pF 1.5nF 270pF 680pF 1.0nF 3.3nF 2.2nF 6.8nF 4.7nF 15nF X7R - - - - - 5.6nF - 2.2nF 5.6nF 6.8nF - 15nF - 33nF - C0G/NP0 - - - - - 560pF 1.0nF 180pF 470pF 560pF 2.2nF 1.5nF 4.7nF 3.3nF 10nF X7R - - - - - 4.7nF - 1.2nF 3.3nF 3.9nF - 8.2nF - 18nF - C0G/NP0 - - - - - 390pF 680pF 120pF - 1.0nF 1.5nF - 3.3nF - 6.8nF X7R - - - - - 2.7nF - 1.0nF 1.0nF 2.7nF - - - - - 8111M 8111N 8121M 8121N 8121T 8131M 8131M 8131T 8141M 8151M 8151M 8161M 8161M 8171M 8171M T= 6.3mm T= 7.0mm Pattern A Pattern B X T= 7.0mm Note: T = Maximum thickness. CECC case size Syfer product code Dipped A 8111M Climatic category: 55/125/21 F 8111N Capacitance tolerances: C0G/NP0 - 5%, 10% & 20% B 8121M C 8121N D 8131M Dielectric Capacitance range CECC specification C0G/NP0 3.9pF to 27nF CECC 30 601 008 X7R 100pF to 1.0uF CECC 30 701 013 X Z Y Seating 5.0 (0.2) min. 5.0 (0.2) min. 1.5 (0.6) max. S Seating Plane Plane d S d Note: Pattern A may be substituted with Pattern B at Syfer's discretion. Capacitance Marking information All encapsulated capacitors are marked with:- Capacitance value, tolerance, rated d.c. voltage, dielectric, and where size permits the Syfer Technology `S' logo. Logo Dielectric code Voltage code Capacitance tolerance code Example: 1000pF 10% 50V 2X1 dielectric Ordering information - Radial Leaded capacitors 8111M 100 0102 J C Type No./ Size ref Voltage d.c. Capacitance in picofarads (pF) Capacitance tolerance Dielectric Rel Release codes First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. <10pF D: 0.5pF F: 1.0pF 8111M 8111N 8121M 8121N 8121T 8131M 8131T 8141M 8151M 8161M 8165M 8171M Dipped product approval range Z Y 180nF C0G/NP0 T= 6.3mm A 8171M 10pF 100pF 2.2nF D A 4.7pF 150pF 22nF B 8165M 10pF - 50V/63V, 100V & 200V 8111N 3.81 0.15 3.81 0.15 5.08 0.20 5.08 0.20 10.16 0.40 7.62 0.30 10.16 0.40 10.16 0.40 12.70 0.50 18.50 0.73 19.00 0.75 25.00 0.98 A - Approved rated voltages: A 8161M 4.7pF 100pF X7R - 10% & 20% A A 4.7pF 330pF 42 8111M 8151M 4.7pF 100pF Fixed Multilayer Ceramic Radial capacitor IECQ-CECC approvals (d) mm inches A 4.7pF 100pF 6.8nF Pattern 8141M 4.7pF 680pF Lead Diameter (S) mm inches B 100pF 680pF Lead Space (Z) max. mm inches 8131T T= 7.0mm 4.7pF 680pF Thickness (Y) max. mm inches 8171M 100pF - Height (X) max. mm inches 8131M X7R - Width Case reference 8121T C0G/NP0 C0G/NP0 CECC (marking code) 050 063 100 200 500 1K0 1K2 1K5 2K0 2K5 3K0 4K0 5K0 6K0 = = = = = = = = = = = = = = 50V 63V 100V 200V 500V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV (A) (D) (B) (C) (Q) (Z) (0) (T) (M) (P) (S) (2) Example: 8P20 = 8.2pF >10pF J: 5% K: 10% M: 20% >27pF G: 2% (C0G/NP0 only). C = C0G/NP0 (1B/CG; CG/BP) X = X7R (2R1) Suffix Suffix Used for specific customer requirements. "C42" denotes RoHS compliant. To Special Order B = 2X1 (BX) R = 2C1 (BZ) Notes: The voltage code may be replaced with the complete voltage (e.g. 1500V = 1K5V) at Syfer's discretion. Marking may be over both sides of the component as necessary. A31 or A97 denote non-RoHS tin/lead wires. Suffix A97 for 8111 to 8141 & A31 for 8151, 8161, 8171. 43 Radial Leaded capacitors C0G/NP0 X7R C0G/NP0 X7R C0G/NP0 X7R e 6kV 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 500V 1kV 630V 200/250V 4p7 5p6 6p8 8p2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 100V 4.7pF 5.6 6.8 8.2 10pF 12 15 18 22 27 33 39 47 56 68 82 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10nF 12 15 18 22 27 33 39 47 56 68 82 100nF 120 150 180 220 270 330 390 470 560 680 820 1.0F 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10F 12 15F 50/63V 4p7 5p6 6p8 8p2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 an c e Co d X7R 8131T e C0G/NP0 8131M acit X7R 8121T e an c Co d acit 6kV 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 630V 1kV 500V 200/250V 100V 50/63V 6kV 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 500V 630V 5kV 4kV 6kV 3kV 2.5kV 2kV 1.5kV 630V 1.2kV 1kV 500V 100V 50/63V 200/250V 200/250V 100V 50/63V 2kV 1.5kV 1.2kV 630V 1kV 500V 100V 200/250V 50/63V 500V 1kV 200/250V 630V 100V 50/63V 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 6.3mm 6.3mm 6.3mm 6.3mm 6.3mm 6.3mm 6.3mm 6.3mm 6.3mm 6.3mm 6.3mm 6.3mm 4.7pF 5.6 6.8 8.2 10pF 12 15 18 22 27 33 39 47 56 68 82 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10nF 12 15 18 22 27 33 39 47 56 68 82 100nF 120 150 180 220 270 330 390 470 560 680 820 1.0F 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10F 12 15F C0G/NP0 8121M / 8121N C ap 8111M / 8111N C ap 44 C0G/NP0 & X7R ranges 45 Radial Leaded capacitors C0G/NP0 & X7R ranges X7R C0G/NP0 X7R e e 6kV 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 6kV 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 5kV 4kV 6kV 3kV 2.5kV 2kV 1.5kV 630V 1.2kV 1kV 500V 100V 200/250V 50/63V 5kV 6kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 5kV 4kV 6kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 50/63V 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1kV 1.2kV 630V 500V 200/250V 50/63V 100V 6.3mm 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 630V 500V 200/250V 100V 7.0mm 6.3mm 50/63V 6.3mm 7.0mm 7.0mm 7.0mm 7.0mm 7.0mm 7.0mm 7.0mm 6.3mm 7.0mm 6.3mm 6.3mm 7.0mm 7.0mm 6.3mm 7.0mm 7.0mm 6.3mm 7.0mm 7.0mm 6.3mm 7.0mm 7.0mm 7.0mm 6.3mm 6.3mm 6.3mm 7.0mm 7.0mm 7.0mm 7.0mm 7.0mm 7.0mm Note: The highlighted parts are defined as `dual-use' under export control legislation and as such are subject to export licence restrictions. Please refer to page 9 for further details. 4.7pF 5.6 6.8 8.2 10pF 12 15 18 22 27 33 39 47 56 68 82 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10nF 12 15 18 22 27 33 39 47 56 68 82 100nF 120 150 180 220 270 330 390 470 560 680 820 1.0F 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10F 12 15F Co d C0G/NP0 an c X7R acit C0G/NP0 8171M 5kV 4kV 3kV 2.5kV 2kV 1.5kV 1.2kV 1kV 200/250V 630V 100V 500V 50/63V 46 X7R 8161M e Co d 4p7 5p6 6p8 8p2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 an c e acit 4.7pF 5.6 6.8 8.2 10pF 12 15 18 22 27 33 39 47 56 68 82 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10nF 12 15 18 22 27 33 39 47 56 68 82 100nF 120 150 180 220 270 330 390 470 560 680 820 1.0F 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10F 12 15F C0G/NP0 8151M C ap C ap 8141M 4p7 5p6 6p8 8p2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 47 Radial Leaded capacitors Packaging information Cropped leads Cropped leads between 4.0 (0.157) and 30.0 (1.18) are available to special order. Some of the preferred codes are listed below, together with the appropriate suffix code. Dimensions as for standard product except as specified. Suffix code - AE3 All radial ranges Suffix code - AE4 All radial ranges Suffix code - AD7 All radial ranges Suffix code - AD5 All radial ranges Lead length (L) 6 1 (0.236 0.04) from seating plane Lead length (L) 4 1 (0.162 0.04) from seating plane Lead length (L) 5 1 (0.2 0.04) from seating plane Lead length (L) 10 1 (0.4 0.04) from seating plane Radial Leaded capacitors Packaging information A maximum of 3 consecutive components may be missing from the bandolier, followed by at least 6 filled positions. Components missing from the bandolier are included in the total quantity, whereby the number of missing components may not exceed 0.25% of this total per packing module. At the beginning and end of a reel the bandolier will exhibit at least 10 blank positions. Dh Minimum pull strength of product from tape = 5N. W W1 W0 t F D0 P1 In accordance with IEC 60286 part 2. Description For PCB holes 1.2mm diameter Types 8131M 40.5 Seating plane L Y Dimensions Y = 10 (0.294) Max L = Min: 2.75 (0.108) Max: 3.50 (0.138) 50.5 60.5 Symbol 2.5mm lead space 5mm lead space Tolerance d 0.5 (0.02) 0.6 (0.025) 0.5 (0.02) 0.6 (0.025) 0.05 (0.002) Lead wire diameter Suffix code - AD2 Y Seating plane L 4.20.5 6.0 +1.0 50.5 Component pitch P 12.7 (0.5) 12.7 (0.5) 1.00 (0.04) Feed hole pitch P0 12.7 (0.5) 12.7 (0.5) 0.30 (0.01) Feed hole centre to lead P1 5.08 (0.2) 3.81 (0.15) 0.70 (0.03) Feed hole centre to component P2 6.35 (0.25) 6.35 (0.25) 0.70 (0.03) Lead spacing F 2.54 (0.10) 5.08 (0.20) +0.6 (0.02) -0.1 (0.004) 8.8 Max Y Seating plane 50.5 6.60.5 7.6 Max Dipped radial leaded with 2.54 and 5.08mm lead spacing can be supplied bandoliered on reels or in ammo boxes to special order. Some of the preferred suffix codes for bandoliered products are given below. For bandoliered products the minimum order quantity, pieces, is specified in the tables below, larger orders must be in multiples of this quantity. Dipped - straight and formed leads Suffix code Reel A H0 AMMO pack Lead style Diagram H H0 2500pcs 1000pcs 2000pcs 8111M Straight 2.54 crs A 191 - C01 C02 C11 8111M Straight 2.54 crs A 160.5 - C30 C31 C32 8111N Formed 5.08 crs B - 160.5 C01 C02 C11 8121M Straight 2.54 crs A 191 - C01 C02 C11 8121M Straight 2.54 crs A 160.5 - C30 C31 C32 8121N Formed 5.08 crs B - 160.5 C01 C02 C11 8131M Straight 5.08 crs A 191 - C01 C02 C11 8131M Straight 5.08 crs A 160.5 - C30 C31 C32 8121T and 8131T available in bulk packaging only. B Dipped - stand-off lead form 48 Product code Y H0 This style has been developed to provide a meniscus-free seating plane with a stress relieving form for auto-insertion. 0 0 2.00(0.08) W 18.0 (0.70) 18.0 (0.70) +1.00 (0.04) -0.50 (0.02) Hold down tape width W0 6.0 (0.23) 6.0 (0.23) 0.30 (0.01) Hole position W1 9.0 (0.35) 9.0 (0.35) 0.50 (0.02) Hold down tape position W2 0.50 (0.02) 0.50 (0.02) Max Height to seating plane from tape centre (straight leads) (2) H 16 (0.63) to 20 (0.79) 16 (0.63) to 20 (0.79) As required Height to seating plane from tape centre (formed leads) (2) H0 16 (0.63) to 20 (0.79) 16 (0.63) to 20 (0.79) As required Height to top of component from tape centre H1 32.2 (1.26) 32.2 (1.26) Max Feed hole diameter 0.20 (0.008) Lead style Y max H0 2500pcs 1000pcs 2000pcs 8111N Formed 5.08 crs 7.5 160.5 C12 C23 C22 8111N Formed 5.08 crs 7.5 191 C13 C25 C24 8121N Formed 5.08 crs 8.5 160.5 C12 C23 C22 8121N Formed 5.08 crs 8.5 191 C13 C25 C24 D0 4.0 (0.16) 4.0 (0.16) Carrier tape plus adhesive tape thickness t 0.7 (0.03) 0.7 (0.03) 0.20 (0.008) Carrier tape thickness - 0.5 (0.02) 0.5 (0.02) 0.10 (0.004) Cut out component snipped lead length from tape centre L 11.0 (0.43) 11.0 (0.43) Max Lead wire protusion from hold down L2 2.0 (0.08) 2.0 (0.08) Max Bandoliered reels Bandoliered ammo packing 48 (1.88) 2 carton sizes 52 max 335.1) (13 851.0 4.20.5 Bandoliered suffix codes H Dh L Dimensions Y = 8 (0.315) Max L = Min: 2.75 (0.108) Max: 3.50 (0.138) Product code Component alignment Tape width 301.0 For PCB holes 1.2mm diameter Types 8121N H1 P0 6.60.5 Suffix code - AD3 H Dimensions mm (inches) Suffix code - AD1 Dimensions Y = 8121N 8 (0.315) Max 8131M 10 (0.394) Max L = Min: 2.75 (0.108) Max: 3.50 (0.138) L H0 L2 Each reel/carton is provided with a label showing the: Manufacturer, product style, batch identification, quantity and date code. Labelling with bar codes (code 39) is available on request. Various forms of snap in leads (preformed) are available to special order, some of the preferred suffix codes are listed below. Dimensions as for standard product except as specified. For PCB holes 0.9mm diameter Types 8121N and 8131M P W2 Dimensions mm (inches) Snap in leads P2 3551.0 451.0 The adhesive tape faces outwards. The dispensing direction is as shown. For the protection of the components a paper inlay is inserted between the windings of the bandolier. At the end of the bandolier this paper inlay continues for at least a further two rotations. 230 (9.05) 24 (0.94) (2000 pcs) 115 (4.50) (1000 pcs) 20 dia. (0.79) 45 (1.77) 49 (c) Copyright Syfer Technology Limited 2011 - design - creations@panpublicity.co.uk BSC Filters Limited Dover House, 10-11 Sterling Park, Amy Johnson Way, Clifton Moor, York YO30 4WU UK Phone: +44 1904 438438 Fax: +44 1904 438123 Email: sales@bscfilters.com Dielectric Laboratories, Inc 2777 Route 20 East, Cazenovia, NY 13035 USA Phone: +1 315 655 8710 Fax: +1 315 655 0445 Email: sales@dilabs.com Dow-Key Microwave 4822 McGrath Street, Ventura, CA 93003 USA Phone: +1 805 650 0260 Fax: +1 805 650 1734 Email: askdk@dowkey.com K&L Microwave 2250 Northwood Drive, Salisbury, MD 21801 USA Phone: +1 410 749 2424 Fax: +1 443 260 2268 Email: sales@klmicrowave.com Novacap 25111 Anza Drive, Valencia, CA 91355 USA Phone: +1 661 295 5920 Fax: +1 661 295 5928 Email: info@novacap.com Pole/Zero Corporation 5558 Union Centre Drive, West Chester, OH 45069 USA Phone: +1 513 870 9060 Fax: +1 513 870 9064 Email: support@polezero.com Syfer Technology Limited Old Stoke Road, Arminghall, Norwich, NR14 8SQ UK Phone: +44 1603 723300 Fax: +44 1603 723301 Email: sales@syfer.co.uk Voltronics Corporation 2250 Northwood Drive, Salisbury, MD 21801 USA Phone: +1 410 749 2424 Fax: +1 443 260 2263 Email: info@voltronicscorp.com www.dovercmp.com 46/11/C Ceramic & Microwave Products (CMP) designs, manufactures and sells special electronic components and systems, including highperformance filters, switches, capacitors and EMI and cosite signal interference solutions. Our products are used in military, space, telecom infrastructure, medical and industrial applications where function and reliability are crucial.