SN74CBT3244
OCTAL FET BUS SWITCH
SCDS001N − NOVEMBER 1992 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DStandard ’244-Type Pinout
D5-Ω Switch Connection Between Two Ports
DTTL-Compatible Input Levels
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2B4
1A2
2B3
1A3
2B2
1A4
2B1
GND
VCC
2OE
1B1
2A4
1B2
2A3
1B3
2A2
1B4
2A1
DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
120
10 11
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
2OE
1B1
2A4
1B2
2A3
1B3
2A2
1B4
1A1
2B4
1A2
2B3
1A3
2B2
1A4
2B1
2A1 V
GND
CC
1OE
terminal assignments
1234
A1A1 1OE VCC 2OE
B1A2 2A4 2B4 1B1
C1A3 2B3 2A3 1B2
D1A4 2A2 2B2 1B3
EGND 2B1 2A1 1B4
description/ordering information
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN − RGY Tape and reel SN74CBT3244RGYR CU244
SOIC DW
Tube SN74CBT3244DW
CBT3244
SOIC − DW Tape and reel SN74CBT3244DWR CBT3244
SSOP − DB Tape and reel SN74CBT3244DBR CU244
40°Cto85°C
SSOP (QSOP) − DBQ Tape and reel SN74CBT3244DBQR CBT3244
−40°C to 85°C
TSSOP PW
Tube SN74CBT3244PW
CU244
TSSOP − PW Tape and reel SN74CBT3244PWR CU244
TVSOP − DGV Tape and reel SN74CBT3244DGVR CU244
VFBGA − GQN
Tape and reel
SN74CBT3244GQNR
CU244
VFBGA − ZQN (Pb-free) Tape and reel SN74CBT3244ZQNR CU244
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
GQN OR ZQN PACKAGE
(TOP VIEW)
1234
A
B
C
D
E
SN74CBT3244
OCTAL FET BUS SWITCH
SCDS001N − NOVEMBER 1992 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
The SN74CBT3244 provides eight bits of high-speed TTL-compatible bus switching. The SOIC, SSOP, TSSOP,
and TVSOP packages provide a standard ’244 device pinout. The low on-state resistance of the switch allows
connections to be made with minimal propagation delay.
The device is organized as two 4-bit low-impedance switches with separate output-enable (OE) inputs. When
OE is low, the switch is on, and data can flow from port A to port B, or vice versa. When OE is high, the switch
is open, and the high-impedance state exists between the two ports.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each 4-bit bus switch)
INPUT
OE FUNCTION
LA port = B port
H Disconnect
logic diagram (positive logic)
1OE
1A1
1A4
1B1
1B4
2
8
1
18
12
2OE
2A1
2A4
2B1
2B4
11
17
19
9
3
Pin numbers shown are for the DB, DBQ, DGV, DW, RGY, and PW packages.
SN74CBT3244
OCTAL FET BUS SWITCH
SCDS001N − NOVEMBER 1992 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clamp current, IK (VI/O < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DBQ package 68°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package 92°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): GQN/ZQN package 78°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package 37°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
MIN MAX UNIT
VCC Supply voltage 4.5 5.5 V
VIH High-level control input voltage 2 V
VIL Low-level control input voltage 0.8 V
TAOperating free-air temperature −40 85 °C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP‡MAX UNIT
VIK VCC = 4.5 V, II = −18 mA −1.2 V
IIVCC = 5.5 V, VI = 5.5 V or GND ±5μA
ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 50 μA
ΔICC§Control inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND 3.5 mA
CiControl inputs VI = 3 V or 0 3 pF
Cio(OFF) VO = 3 V or 0, OE = VCC 6 pF
V 0
II = 64 mA 5 7
ron¶VCC = 4.5 V VI = 0 II = 30 mA 5 7 Ω
ron
CC
VI = 2.4 V, II = 15 mA 10 15
‡All typical values are at VCC = 5 V, TA = 25°C.
§This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
¶Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined
by the lowest voltage of the two (A or B) terminals.
SN74CBT3244
OCTAL FET BUS SWITCH
SCDS001N − NOVEMBER 1992 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER FROM
(INPUT)
TO
(OUTPUT) MIN MAX UNIT
tpd†A or B B or A 0.25 ns
ten OE A or B 1 8.9 ns
tdis OE A or B 1 7.4 ns
†This propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500 Ω
500 Ω
tPLH tPHL
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
3 V
0 V
VOH
VOL
0 V
VOL + 0.3 V
VOH − 0.3 V
0 V
Input
3 V
3.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74CBT3244DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74CBT3244DBQR ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBT3244DBQRE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBT3244DBQRG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBT3244DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244PW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74CBT3244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74CBT3244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT3244RGYR ACTIVE VQFN RGY 20 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBT3244RGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CBT3244DBQR SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74CBT3244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74CBT3244DGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74CBT3244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74CBT3244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74CBT3244RGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CBT3244DBQR SSOP DBQ 20 2500 367.0 367.0 38.0
SN74CBT3244DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74CBT3244DGVR TVSOP DGV 20 2000 367.0 367.0 35.0
SN74CBT3244DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74CBT3244PWR TSSOP PW 20 2000 367.0 367.0 38.0
SN74CBT3244RGYR VQFN RGY 20 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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