A54SX72A-1FG256I - Actel Corporation

February 2001 1

Preliminary v1.2

SX-A Family FPGAs

Leading-Edge Performance

• 250 MHz System Performance

• 4.2ns Clock-to-Out (Pad-to-Pad)

• 350 MHz Internal Performance

Specifications

• 12,000 to 108,000 Available System Gates

• Up to 360 User-Programmable I/O Pins

• Up to 2,012 Dedicated Flip-Flops

• 0.22µ/0.25µ CMOS Process Technology

Features

• Hot-Swap Compliant I/Os

• Power-Up/Down Friendly (No Sequencing Required for

Supply Voltages)

• 66 MHz PCI Compliant

•CPLD and FPGA Integration

• Single-Chip Solution

• Nonvolatile

• Configurable I/O Support for 3.3V/5.0V PCI, 5.0V TTL, and

2.5 V/3.3V LVTTL

• 2.5V, 3.3V, and 5.0V Mixed Voltage Operation with 5.0V

Input Tolerance and 5.0V Drive Strength

• Configurable Weak-Resistor Pull-up or Pull-down for

Tristated Outputs at Power Up

• Individual Output Slew Rate Control

• Up to 100% Resource Utilization and 100% Pin Locking

• Very Low Power Consumption

• Deterministic, User-Controllable Timing

• Unique In-System Diagnostic and Verification Capability

with Silicon Explorer II

• Boundary Scan Testing in Compliance with IEEE

Standard 1149.1 (JTAG)

• Secure Programming Technology Prevents Reverse

Engineering and Design Theft

SX-A Product Profile

Device A54SX08A A54SX16A A54SX32A A54SX72A

Capacity

Typical Gates

System Gates 8,000

12,000 16,000

24,000 32,000

48,000 72,000

108,000

Logic Mod ules

Combinatorial Cells 768

512 1,452

924 2,880

1,800 6,036

4,024

Dedicated Flip-Flops

Maximum Flip-Flops 256

512 528

990 1,080

1,980 2,012

4,024

Maximum User I/Os 130 180 249 360

Global Clocks 3333

Quadrant Clocks 0004

Boundary Scan Testing Yes Yes Yes Yes

3.3V/5.0V PCI Yes Yes Yes Yes

Clock-to-Out 4.2 ns 4.6 ns 4.7 ns 5.8 ns

Input Set-Up (External) 0 ns 0 ns 0 ns 0 ns

Speed Grades –F, Std, –1, –2, –3 –F, Std, –1, –2, –3 –F, Std, –1, –2, –3 –F, Std, –1, –2, –3

Temperature Grades C, I C, I, M C, I, M C, I, M

Package (by pin count)

PQFP

TQFP

PBGA

FBGA

208

100, 144

—

144

208

100, 144

—

144, 256

208

100, 144, 176

329

144, 256, 484

208

—

256, 484

SX-A Family FPGAs

2 Preliminary v1.2

General Description

Actel’s SX-A family of FPGAs features a sea-of-modules

architecture that delivers device performance and

integration levels not currently achieved by any other FPGA

architecture. SX-A devices simplify design time, enable

dramatic reductions in design costs and power

consumption, and further decrease time to market for

performance-intensive applications.

Actel’s SX-A architecture features two types of logic

modules, the combinatorial cell (C-cell) and the register

cell (R-cell), each optimized for fast and efficient mapping

of synthesized logic functions. The routing and interconnect

resources are in the metal layers above the logic modules,

providing optimal use of silicon. This enables the entire

floor of the device to be spanned with an uninterrupted grid

of fine-grained, synthesis-friendly logic modules (or

“sea-of-modules”), which reduces the distance signals have

to travel between logic modules. To minimize signal

propagation delay, SX-A devices employ both local and

general routing resources. The high-speed local routing

resources (DirectConnect and FastConnect) enable very

fast local signal propagation that is optimal for fast

counters, state machines, and datapath logic. The general

system of segmented routing tracks allows any logic module

in the array to be connected to any other logic or I/O

module. Within this system, propagation delay is minimized

by limiting the number of antifuse interconnect elements to

five (90 percent of connections typically use only three or

fewer antifuses). The unique local and general routing

structure featured in SX-A devices gives fast and predictable

performance, allows 100 percent pin-locking with full logic

utilization, enables concurrent PCB development, reduces

design time, and allows designers to achieve performance

goals with minimum effort.

Further complementing SX-A’s flexible routing structure is a

hard-wired, constantly loaded clock network that has been

tuned to provide fast clock propagation with minimal clock

skew. Additionally, the high performance of the internal

logic has eliminated the need to embed latches or flip-flops

in the I/O cells to achieve fast clock-to-out or fast input

set-up times. SX-A devices have easy-to-use I/O cells that do

not require HDL instantiation, facilitating design re-use and

reducing design and verification time.

Ordering Information

Applic ation (Tem pera t ure Range)

Blank = Commercial (0 to +70°C)

I = Industrial (–40 to +85°C)

M = Military (–55 to +125°C)

PP = Pre-production

Package Type

BG = 1.27mm Plastic Ball Grid Array

FG = 1.0mm Fine Pitch Ball Grid Array

PQ = Plastic Quad Flat Pack

TQ = Thin (1.4mm) Quad Flat Pack

Speed Grade

Blank = Standard Speed

–1 = Approximately 15% Faster than Standard

–2 = Approximately 25% Faster than Standard

–3 = Approximately 35% Faster than Standard

–F = Approximately 40% Slower than Standard

Part Number

A54SX08 = 12,000 System Gates

A54SX16 = 24,000 System Gates

A54SX32 = 48,000 System Gates

A54SX72 = 108,000 System Gates

Package Lead Count

A54SX16 – PQ 2082

A = 0.22µ/0.25µ CMOS Technology

Preliminary v1.2 3

SX-A Family FPGAs

Product Plan

Speed Gra de* Applic atio n

–FStd–1–2–3CI

†M•

A54SX08A Device

100-Pin Thin Quad Flat Pack (TQFP) ✔✔✔✔P✔✔—

144-Pin Thin Quad Flat Pack (TQFP) ✔✔✔✔P✔✔—

208-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔P✔✔—

144-Pin Fine Pitch Ball Grid Array (FBGA) ✔✔✔✔P✔✔—

A54SX16A Device

100-Pin Thin Quad Flat Pack (TQFP) ✔✔✔✔✔ ✔✔P

144-Pin Thin Quad Flat Pack (TQFP) ✔✔✔✔✔ ✔✔P

208-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔P

144-Pin Fine Pitch Ball Grid Array (FBGA) ✔✔✔✔✔ PP—

256-Pin Fine Pitch Ball Grid Array (FBGA) ✔✔✔✔✔ PP—

A54SX32A Device

100-Pin Thin Quad Flat Pack (TQFP) ✔✔✔✔✔ ✔✔P

144-Pin Thin Quad Flat Pack (TQFP) ✔✔✔✔✔ ✔✔P

176-Pin Thin Quad Flat Pack (TQFP) ✔✔✔✔✔ ✔✔P

208-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔P

144-Pin Fine Pitch Ball Grid Array (FBGA) ✔✔✔✔✔ ✔✔—

256-Pin Fine Pitch Ball Grid Array (FBGA) ✔✔✔✔✔ ✔✔—

329-Pin Plastic Ball Grid Array (PBGA) ✔✔✔✔✔ ✔✔—

484-Pin Fine Pitch Ball Grid Array (FBGA) ✔✔✔✔✔ ✔✔—

A54SX72A Device

208-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔P

256-Pin Fine Pitch Ball Grid Array (FBGA) ✔✔✔✔✔ ✔✔—

484-Pin Fine Pitch Ball Grid Array (FBGA) ✔✔✔✔✔ ✔✔—

Contact your Actel sales representative for product availability.

Applications: C = Commercial Availability: ✔= Available *Speed Grade: –1 = Approx. 15% faster than Standard

I = Industrial P = Planned –2 = Approx. 25% faster than Standard

M = Military — = Not Planned –3 = Approx. 35% faster than Standard

–F = Approx. 40% slower than Standard

† Only Std, –1, –2 Speed Grade

• Only Std, –1 Speed Grade

Plastic Device Resources

User I/Os (including clock buffers)

Device PQFP

208-Pin TQFP

100-Pin TQFP

144-Pin TQFP

176-Pin PBGA

329-Pin FBGA

144-Pin FBGA

256-Pin FBGA

484-Pin

A54SX08A 130 81 113 ——111 ——

A54SX16A 175 81 113 ——111 180 —

A54SX32A 174 81 113 147 249 111 203 249

A54SX72A 171 —————203 360

Contact your Actel sales representative for product availability.

Package Definitions

PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, PBGA = 1.27mm Plastic Ball Grid Array, FBGA = 1.0mm Fine Pitch Ball

Grid Array.

SX-A Family FPGAs

4 Preliminary v1.2

SX-A Family Architecture

The SX-A family architecture was designed to satisfy

next-generation performance and integration requirements

for production-volume designs in a broad range of

applications.

Programmable Interconnect Element

The SX-A family provides efficient use of silicon by locating

the routing interconnect resources between the top two

metal layers (Figure 1). This completely eliminates the

channels of routing and interconnect resources between

logic modules (as implemented on SRAM FPGAs and

previous generations of antifuse FPGAs), and enables the

entire floor of the device to be spanned with an

uninterrupted grid of logic modules.

Interconnection between these logic modules is achieved

using Actel’s patented metal-to-metal programmable

antifuse interconnect elements. The antifuses are normally

open circuit and, when programmed, form a permanent

low-impedance connection.

The extremely small size of these interconnect elements

gives the SX-A family abundant routing resources and

provides excellent protection against design pirating.

Reverse engineering is virtually impossible because it is

extremely difficult to distinguish between programmed and

unprogrammed antifuses, and since SX-A is a nonvolatile,

single-chip solution, there is no configuration bitstream to

intercept.

Additionally, the interconnect (i.e., the antifuses and metal

tracks) have lower capacitance and lower resistance than

any other device of similar capacity, leading to the fastest

signal propagation in the industry.

Note: A54SX72A has 4 layers of metal with the antifuse between Metal 3 and Metal 4.

Figure 1 • SX-A Family Interconnect Elements

Silicon Substrate

Tungsten Plug

Contact

Metal 1

Metal 2

Metal 3

Routing Tracks

Amorphous Silicon/

Dielectric Antifuse

Tungsten Plug Via

Preliminary v1.2 5

SX-A Family FPGAs

Logic Module Design

The SX-A family architecture is described as a

“sea-of-modules” architecture because the entire floor of

the device is covered with a grid of logic modules with

virtually no chip area lost to interconnect elements or

routing. Actel’s SX-A family provides two types of logic

modules, the register cell (R-cell) and the combinatorial

cell (C-cell).

The R-cell contains a flip-flop featuring asynchronous clear,

asynchronous preset, and clock enable (using the S0 and S1

lines) control signals (Figure 2). The R-cell registers

feature programmable clock polarity selectable on a

while allowing mapping of synthesized functions into the

SX-A FPGA. The clock source for the R-cell can be chosen

from either the hard-wired clock, the routed clocks, or

internal logic.

The C-cell implements a range of combinatorial functions up

to 5 inputs (Figure 3 on page 6). Inclusion of the DB input

and its associated inverter function increases the number of

combinatorial functions that can be implemented in a single

module from 800 options (as in previous architectures) to

more than 4,000 in the SX-A architecture. An example of the

improved flexibility enabled by the inversion capability is

the ability to integrate a 3-input exclusive-OR function into

a single C-cell. This facilitates construction of 9-bit

parity-tree functions with 1.9 ns propagation delays. At the

same time, the C-cell structure is extremely synthesis

friendly, simplifying the overall design and reducing

synthesis time.

Chip Architecture

The SX-A family’s chip architecture provides a unique

approach to module organization and chip routing that

delivers the best register/logic mix for a wide variety of new

and emerging applications.

Module Organization

Actel has arranged all C-cell and R-cell logic modules into

horizontal banks called Clusters. There are two types of

Clusters: Type 1 contains two C-cells and one R-cell, while

Type 2 contains one C-cell and two R-cells.

To increase design efficiency and device performance, Actel

has further organized these modules into

SuperClusters

(Figure 4 on page 6). SuperCluster 1 is a two-wide grouping

of Type 1 clusters. SuperCluster 2 is a two-wide group

containing one Type 1 cluster and one Type 2 cluster. SX-A

devices feature more SuperCluster 1 modules than

SuperCluster 2 modules because designers typically require

significantly more combinatorial logic than flip-flops.

Routing Resources

Clusters and SuperClusters can be connected through the

use of two innovative local routing resources called

FastConnect and DirectConnect, which enable extremely

fast and predictable interconnection of modules within

Clusters and SuperClusters (Figure 5 and Figure 6 on

page 7). This routing architecture also dramatically reduces

the number of antifuses required to complete a circuit,

ensuring the highest possible performance.

Figure 2 •R-Cell

DirectConnect

Input

CLKA,

CLKB,

Internal Logic

HCLK

CKS CKP

CLR

PSET

Routed

Data Input

S0 S1

SX-A Family FPGAs

6 Preliminary v1.2

Figure 3 •C-Cell

Figure 4 •Cluster Organization

A0 B0 A1 B1

Sa Sb

Type 1 SuperCluster Type 2 SuperCluster

Cluster 1 Cluster 1 Cluster 2 Cluster 1

R-Cell C-Cell

A0 B0 A1 B1

Sa Sb

DirectConnect

Input

CLKA,

CLKB,

Internal Logic

HCLK

CKS CKP

CLR

PSET

YDQ

Routed

Data Input

Preliminary v1.2 7

SX-A Family FPGAs

Figure 5 •DirectConnect and FastConnect for Type 1 SuperClusters

Figure 6 •DirectConnect and FastConnect for Type 2 SuperClusters

Type 1 SuperClusters

DirectConnect

• No antifuses

• 0.1 ns routing dela

FastConnect

• One antifuse

• 0.3 ns routing delay

Routing Segments

• Typically 2 antifuse

• Max. 5 antifuses

Type 2 SuperClusters

Routing Segments

• Typically 2 antifuses

• Max. 5 antifuses

FastConnect

• One antifuse

• 0.3 ns routing delay

DirectConnect

• No antifuses

• 0.1 ns routing delay

SX-A Family FPGAs

8 Preliminary v1.2

DirectConnect is a horizontal routing resource that provides

connections from a C-cell to its neighboring R-cell in a given

SuperCluster. DirectConnect uses a hard-wired signal path

requiring no programmable interconnection to achieve its

fast signal propagation time of less than 0.1 ns.

FastConnect enables horizontal routing between any two

logic modules within a given SuperCluster and vertical

routing with the SuperCluster immediately below it. Only

one programmable connection is used in a FastConnect

path, delivering maximum pin-to-pin propagation of 0.3 ns.

In addition to DirectConnect and FastConnect, the

architecture makes use of two globally oriented routing

resources known as segmented routing and high-drive

routing. Actel’s segmented routing structure provides a

variety of track lengths for extremely fast routing between

SuperClusters. The exact combination of track lengths and

antifuses within each path is chosen by the 100 percent

automatic place-and-route software to minimize signal

propagation delays.

Clock Resources

Actel’s high-drive routing structure provides three clock

networks. The first clock, called HCLK, is hardwired from the

HCLK buffer to the clock select MUX in each R-cell. HCLK

cannot be connected to combinational logic. This provides a

fast propagation path for the clock signal, enabling the 4.2ns

clock-to-out (pad-to-pad) performance of the SX-A devices.

The hard-wired clock is tuned to provide clock skew is less

than 0.2ns worst case.

The remaining two clocks (CLKA, CLKB) are global clocks

that can be sourced from external pins or from internal logic

signals within the SX-A device. CLKA and CLKB may be

connected to sequential cells or to combinational logic. If

CLKA or CLKB is sourced from internal logic signals then the

external clock pin cannot be used for any other input and

must be tied low or high. Figure 7 describes the clock circuit

used for the constant load HCLK. Figure 8 describes the

CLKA and CLKB circuit used in SX-A devices with the

exception of A54SX72A. The CLKA, CLKB, and QCLK circuits

for A54SX72A are shown in Figure 9.

Figure 7 •SX-A Constant Load Clock Pad

Note: This does not include the clock pad for A54SX72A.

Figure 8 •SX-A Clock Pads

Constant Load

Clock Network

HCLKBUF

Clock Network

From Internal Logic

CLKBUF

CLKBUFI

CLKINT

CLKINTI

Figure 9 •A54SX72A Clock/QClock Pads

Clock Network

From Internal Logic

QCLKBUF

QCLKBUFI

QCLKINT

QCLKINTI

QCLKBIBUF

QCLKBIBUFI

CLKBUF

CLKBUFI

CLKINT

CLKINTI

CLKBIBUF

CLKBIBUFI

Preliminary v1.2 9

SX-A Family FPGAs

In addition, the A54SX72A device provides four quadrant

clocks (QCLKA, QCLKB, QCLKC, QCLKD), which can be

sourced from external pins or from internal logic signals

within the device. Each of these clocks can individually drive

up to a quarter of the chip, or they can be grouped together to

drive multiple quadrants. For more information, refer to “Pin

Description” on page 50.

Other Architectural Features

Technology

Actel’s SX-A family is implemented on a high-voltage

twin-well CMOS process using 0.22µ/0.25µ design rules. The

metal-to-metal antifuse is made up of a combination of

amorphous silicon and dielectric material with barrier

metals and has a programmed (“on” state) resistance of 25

ohms with capacitance of 1.0 fF for low signal impedance.

Performance

The combination of architectural features described above

enables SX-A devices to operate with internal clock

frequencies exceeding 350 MHz, enabling very fast

execution of even complex logic functions. Thus, the SX-A

family is an optimal platform upon which to integrate the

functionality previously contained in multiple CPLDs. In

addition, designs that previously would have required a gate

array to meet performance goals can now be integrated into

an SX-A device with dramatic improvements in cost and

time-to-market. Using timing-driven place-and-route tools,

designers can achieve highly deterministic device

performance.

I/O Modules

Each I/O on an SX-A device can be configured as an input, an

output, a tristate output, or a bidirectional pin. Even without

the inclusion of dedicated I/O registers, these I/Os, in

combination with array registers, can achieve clock-to-out

(pad-to-pad) timing as fast as 4.2ns. I/O cells that have

embedded latches and flip-flops require instantiation in HDL

code; this is a design complication not encountered in SX-A

FPGAs. Fast pin-to-pin timing ensures that the device will

have little trouble interfacing with any other device in the

system, which in turn enables parallel design of system

components and reduces overall design time. See Table 1 for

more information.

SX-A I/O's are designed to be driven by high speed push-pull

devices with a low resistance pull-up device. If the input

voltage is greater than VCCI and a fast push-pull device is not

used, a voltage divider may be created with the high

resistance pull-up of the driver, and the internal circuitry of

the SX-A I/O. This voltage divider may pull the input voltage

below spec for some devices connected to the driver so a logic

'1' may not be correctly realized. Also, a small pull-down

current may be generated by an internal detection circuit.

For example, if an open drain driver is used with a pull-up

resistor to 5V to provide the logic '1' input, and VCCI is set to

3.3V on the SX-A device, the input signal may be pulled down

by the SX-A input.

Hot Swapping

SX-A I/Os can be configured to be hot swappable in

compliance with Compact PCI Specification. During

power-up/down (or partial up/down), all I/Os are tristated.

VCCA and VCCI do not have to be stable during power

up/down, and they do not require a specific power-up or

power-down sequence in order to avoid damage to the SX-A

devices. After the SX-A device is plugged into an electrically

active system, the device will not degrade the reliability of

or cause damage to the host system. The device’s output

pins are driven to a high impedance state until normal chip

operating conditions are reached. Please see Actel’s web

site for future Application Notes concerning Hot Swapping.

Power Requirements

The SX-A family supports 2.5V/3.3V/5.0V mixed voltage

operation and is designed to tolerate 5.0V inputs in each

case (Table 2 on page 10). Power consumption is extremely

low due to the very short distances signals are required to

travel to complete a circuit. Power requirements are further

reduced because of the small number of low-resistance

antifuses in the path. The antifuse architecture does not

require active circuitry to hold a charge (SRAM or EPROM

do), making it the lowest-power architecture FPGA

available today.

Table 1 •I/O Features

Function Description

4 Level

Selections •2.5V/3.3V LVTTL

•3.3V PCI

•5V CMOS

•5V PCI/TTL

Output

Buffer “Hot-Swap” Capability

•I/O on an unpowered device does not

sink current

•Can be used for “cold-sparing”

Selectable on an individual I/O basis

Individually selectable low-slew option

3.3V PCI Individually selectable current clamp

preventi ng refl ection of a si gna l gr eate r t han

3.3V (VCCI)

Power Up Individually selectable pull-ups and

pull-downs during power up (default is to

power up in tristate)

Enables deterministic power up of device

VCCA and VCCI can be powered in any order

SX-A Family FPGAs

10 Preliminary v1.2

Boundary Scan Testing (BST)

All SX-A devices are IEEE 1149.1 compliant. SX-A devices

offer superior diagnostic and testing capabilities by

providing Boundary Scan Testing (BST) and probing

capabilities. These functions are controlled through the

special test pins in conjunction with the program fuse. The

functionality of each pin is described in Table 3. In the

dedicated test mode, TCK, TDI and TDO are dedicated pins

and cannot be used as regular I/Os. In flexible mode, TMS

should be set HIGH through a pull-up resistor of 10kΩ. TMS

can be pulled LOW to initiate the test sequence.

Configuring Diagnostic Pins

The JTAG and Probe pins (TDI, TCK, TMS, TDO, PRA, and

PRB) are placed in the desired mode by selecting the

appropriate check boxes in the "Variation" dialog window.

This dialog window is accessible through the Design Setup

Wizard under the Tools menu in Actel’s Designer software.

TRST pin

When the "Reserve JTAG Reset" box is checked (default

setting in Designer software), the TRST pin will become a

Boundary Scan Reset pin. In this mode, the TRST pin will

function as an asynchronous , active-low input to initialize

or reset the BST circuit. An internal pull-up resistor will be

automatically enabled on the TRST pin.

The TRST pin will function as a user I/O when "Reserve

JTAG Reset" box is not checked. The internal pull-up

resistor will be disabled in this mode.

Dedicated Test mode

When the "Reserve JTAG" box is checked, the SX-A is placed

in Dedicated Test mode, which configures the TDI, TCK, and

TDO pins for BST or in-circuit verification with Silicon

Explorer II. An internal pull-up resistor is automatically

enabled on both the TMS and TDI pins. In Dedicated test

mode, TCK, TDI, and TDO are dedicated test pins and

become unavailable for pin assignment in the Pin Editor.

The TMS pin will function as specified in the IEEE 1149.1

(JTAG) Specification.

Flexible mode

When the "Reserve JTAG" box is not selected (default

setting in Designer software), the SX-A is placed in Flexible

mode, which allows the TDI, TCK, and TDO pins to function

as user I/Os or BST pins. In this mode the internal pull-up

resistors on the TMS and TDI pins are disabled. An external

10K ohm pull-up resistor to VCCI is required on the TMS pin.

The TDI, TCK, and TDO pins are transformed from user I/Os

into BST pins when a rising edge on TCK is detected while

TMS is at logical low. Once the BST pins are in test mode

they will remain in BST mode until the internal BST state

machine reaches the "logic reset" state. At this point the

BST pins will be released and will function as regular I/O

pins. The "logic reset" state is reached 5 TCK cycles after the

TMS pin is set to logical HIGH.

The Program fuse determines whether the device is in

Dedicated Test or Flexible mode. The default (fuse not

programmed) is Flexible mode.

Development Tool Support

The SX-A devices are fully supported by Actel’s line of FPGA

development tools, including the Actel DeskTOP series and

Designer tools. The Actel DeskTOP series is an integrated

design environment for PCs that includes design entry,

simulation, synthesis, and place-and-route tools. Designer,

Actel’s suite of FPGA development point tools for PCs and

Workstations, includes the ACTgen Macro Builder, timing

driven place-and-route analysis tools, and fuse file

generation.

In addition, the SX-A devices contain internal probe

circuitry that provides built-in access to the output of every

C-cell, R-cell, and routed clock in the design, enabling

100-percent real-time observation and analysis of a device's

internal logic nodes without design iteration. The probe

circuitry is accessed by Silicon Explorer II, an easy-to-use

integrated verification and logic analysis tool that can

sample data at 100 MHz (asynchronous) or 66 MHz

(synchronous). Silicon Explorer II attaches to a PC’s

standard COM port, turning the PC into a fully functional

18-channel logic analyzer. Silicon Explorer II allows

designers to complete the design verification process at

their desks and reduces verification time from several hours

per cycle to only a few seconds.

Table 2 •Supply Voltages

VCCA VCCI

Maximum

Input

Tolerance

Maximum

Output

Drive

A54SX08A

A54SX16A

A54SX32A

A54SX72A

2.5V 2.5V 5.0V 2.5V

2.5V 3.3V 5.0V 3.3V

2.5V 5.0V 5.0V 5.0V

Table 3 •Boundary Scan Pin Functionality

Program Fuse Blown

(Dedicated Test Mode) Program Fuse Not Blown

(Flexible Mode)

TCK, TDI, TDO are

dedicated BST pins TCK, TDI, TDO are flexible

and may be used as I/Os

No need for pull-up resistor

for TMS Use a pull-up resistor of

10kΩ on TMS

Preliminary v1.2 11

SX-A Family FPGAs

SX-A Probe Circuit Control Pins

The Silicon Explorer II tool uses the boundary scan ports

(TDI, TCK, TMS and TDO) to select the desired nets for

verification. The selected internal nets are assigned to the

PRA/PRB pins for observation. Figure 10 illustrates the

interconnection between Silicon Explorer II and the FPGA

to perform in-circuit verification. The TRST pin is equipped

with an internal pull-up resistor. To remove the boundary

scan state machine from the reset state during probing, it is

recommended that the TRST pin be left floating.

Design Considerations

For prototyping, the TDI, TCK, TDO, PRA, and PRB pins

should not be used as input or bidirectional ports. Because

these pins are active during probing, critical signals input

through these pins are not available while probing. In

addition, the security fuse should not be programmed

during prototyping because doing so disables the probe

circuitry.

2.5V/3.3V/5.0V Operating Conditions

Figure 10 •Probe Setup

Silicon Explorer II

TDI

TCK

TDO

TMS

PRA

PRB

Serial Connection

Additional

Channels

SX-A FPGA

Absolute Maximum Ratings1

Symbol Parameter Limits Units

VCCI DC Supply V olta ge –0.3 to +6.0 V

VCCA DC Supply V olta ge –0.3 to +3.0 V

VIInput Voltage –0.5 to +5.5 V

VOOutput Voltage –0.5 to +VCCI + 0.5 V

TSTG Storage Temperature –65 to +150 °C

Notes:

1. Stresses beyond those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device. Exposure

to absolute maximum rated conditions for extended periods

may affect device reliability. Devices should not be operated

outside the Recommended Operating Conditions.

Recommended Operating Conditions

Parameter Commercial Industrial Military Units

Temperature

Range10 to +70 –40 to +85 –55 to

+125 °C

2.5V Power

Supply

Tolerance ±8±8±8%V

CCI

3.3V Power

Supply

Tolerance ±9±9±9%V

CCI

5.0V Power

Supply

Tolerance ±5±10 ±10 %VCCI

Note:

1. Ambient temperature (TA) is used for commercial and

industrial; case temperature (TC) is used for military.

SX-A Family FPGAs

12 Preliminary v1.2

3.3V and 5.0V Electrical Specifications

2.5V Electrical Specifications

Symbol

Commercial Industrial

Parameter Min. Max. Min. Max. Units

VOH (IOH = -8mA) (TTL)

(IOH = -6mA) (TTL) 2.4 VCCI 2.4 VCCI

VOL (IOL = 12mA) (TTL)

(IOL = 8mA) (TT L) 0.5 0.5 V

VIL Input Low Voltage 0.8 0.8 V

VIH Input High Voltage 2.0 2.0 V

IIL/ IIH Input Leakage Current, VIN = VCCI or GND –10 10 –10 10 µA

IOZ 3-State Output Leakage Current, VOUT = VCCI or GND –10 10 –10 10 µA

tR, tFInput Transition Time tR, tF10 10 ns

CIO I/O Capacitance 10 10 pF

ICC1Standby Current 10 20 mA

IV Curve2Can be converted from the IBIS model on the web.

Notes:

1. Individual device data is available in the www.actel.com/guru.

2. The IBIS model can be found at www.actel.com/support/support/support_ibis.html.

Symbol

Commercial Industrial

Parameter Min. Max. Min. Max. Units

VOH

VDD = MIN,

VI = VIH or VIL

(IOH = -100µA) 2.1 2.1 V

VDD = MIN,

VI = VIH or VIL

(IOH = -1 mA) 2.0 2. 0 V

VDD = MIN,

VI = VIH or VIL

(IOH = -2 mA) 1.7 1. 7 V

VOL

VDD = MIN,

VI = VIH or VIL

(IOL= 100µA) 0.2 0.2 V

VDD = MIN,

VI = VIH or VIL

(IOL= 1mA) 0.4 0.4 V

VDD = MIN,

VI = VIH or VIL

(IOL= 2 mA) 0.7 0.7 V

VIL Input Low Voltage, VOUT ≤ VVOL(max) -0.3 0.7 -0.3 0.7 V

VIH Input High Voltage, VOUT ≥ VVOH(min) 1.7 VDD + 0.3 1.7 VDD + 0.3 V

IOZ 3-State Output Leakage Current, VOUT = VCCI or GND –10 10 –10 10 µA

tR, tFInput Transition Time tR, tF10 10 ns

CIO I/O Capacitance 10 10 pF

ICC1Standby Current 10 20 mA

IV Curve2Can be converted from the IBIS model on the web.

Notes:

1. Individual device data is available in the www.actel.com/guru.

2. The IBIS model can be found at www.actel.com/support/support/support_ibis.html.

Preliminary v1.2 13

SX-A Family FPGAs

PCI Compliance for the SX-A Family

The SX-A family supports 3.3V and 5V PCI and is compliant

with the PCI Local Bus Specification Rev. 2.1.

DC Specifications (5.0V PCI Operation)

Symbol Parameter Condition Min. Max. Units

VCCA Supply Voltage for Array 2.3 2.7 V

VCCI Supply Voltage for I/Os 4.75 5.25 V

VIH Input High Voltage 2.0 VCCI + 0.5 V

VIL Input Low Voltage –0.5 0.8 V

IIH Input High Leakage Current1VIN = 2.7 70 µ A

IIL Input Low Leakage Current1VIN = 0.5 –70 µA

VOH Output High Voltage IOUT = –2 mA 2.4 V

VOL Output Low Voltage2IOUT = 3 mA, 6 mA 0.55 V

CIN Input Pin Capacitance310 pF

CCLK CLK Pin Cap acitance 5 12 pF

Notes:

1. Input leakage currents include hi-Z output leakage for all bidirectional buffers with tristate outputs.

2. Signals without pull-up resistors must have 3 mA low output current. Signals requiring pull up must have 6 mA; the latter includes,

FRAME#, IRDY#, TRDY#, DEVSEL#, STOP#, SERR#, PERR#, LOCK#, and, when used AD[63::32], C/BE[7::4]#, PAR64, REQ64#, and ACK64#.

3. Absolute maximum pin capacitance for a PCI input is 10 pF (except for CLK).

SX-A Family FPGAs

14 Preliminary v1.2

AC Specifications (5.0V PCI Operation)

Symbol Parameter Condition Min. Max. Units

IOH(AC)

Switching Current High

0 < VOUT ≤ 1.4 1–44 mA

1.4 ≤ VOUT < 2.4 1, 2 (–44 + (VOUT – 1.4)/0.024) mA

3.1 < VOUT < VCCI 1, 3 Equat ion A

on page 15

(Test Point) VOUT = 3.1 3–142 mA

IOL(AC)

Switching Current Low VOUT ≥ 2.2 195 mA

2.2 > VOUT > 0 .55 1(VOUT/0.023) mA

0.71 > VOUT > 0 1, 3 Equat ion B

on page 15

(Test Point) VOUT = 0.71 3206 mA

ICL Low Clamp Current –5 < VIN ≤ –1–25 + (VIN + 1)/0.015 mA

slewROutput Rise Slew Rate 0.4V to 2.4V load 415V/ns

slewFOutput Fall Slew Rate 2.4V to 0.4V load 415V/ns

Notes:

1. Refer to the V/I curves in Figure 11 on page 15. Switching current characteristics for REQ# and GNT# are permitted to be one half of that

specified here; i.e., half size output drivers may be used on these signals. This specification does not apply to CLK and RST#, which are

system outputs. “Switching Current High” specifications are not relevant to SERR#, INTA#, INTB#, INTC#, and INTD#, which are open drain

outputs.

2. Note that this segment of the minimum current curve is drawn from the AC drive point directly to the DC drive point rather than toward the

voltage rail (as is done in the pull-down curve). This difference is intended to allow for an optional N-channel pull-up.

3. Maximum current requirements must be met as drivers pull beyond the last step voltage. Equations defining these maximums (A and B)

are provided with the respective diagrams in Figure 11 on page 15. The equation defined maxima should be met by design. In order to

facilitate component testing, a maximum current test point is defined for each side of the output driver.

4. This parameter is to be interpreted as the cumulative edge rate across the specified range, rather than the instantaneous rate at any point

within the transition range. The specified load (diagram below) is optional; i.e., the designer may elect to meet this parameter with an

unloaded output per revision 2.0 of the PCI Local Bus Specification. However, adherence to both maximum and minimum parameters is

now required (the maximum is no longer simply a guideline). Since adherence to the maximum slew rate was not required prior to

revision 2.1 of the specification, there may be components in the market for some time that have faster edge rates; therefore, motherboard

designers must bear in mind that rise and fall times faster than this specification could occur and should ensure that signal integrity

modeling accounts for this. Rise slew rate does not apply to open drain outputs.

output

buffer

1/2 in. max.

50 pF

Preliminary v1.2 15

SX-A Family FPGAs

Figure 11 shows the 5.0V PCI V/I curve and the minimum

and maximum PCI drive characteristics of the SX-A

family.

Equation A

IOH = 11.9 * (VOUT – 5.25) * (VOUT + 2.45)

for VCCI > VOUT > 3.1V

Equation B

IOL = 78.5 * VOUT * (4.4 – VOUT)

for 0V < VOUT < 0.71V

DC Specifications (3.3V PCI Operation)

Figure 11 •5.0V PCI V/I Curve for SX-A Family

–200.0

–150.0

–100.0

–50.0

0.0

50.0

100.0

150.0

200.0

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Voltage Out (V)

Current (mA)

IOH

IOL

IOH MIN Spec

IOH MAX Spec

IOL MIN Spec

IOL MAX Spec

Symbol Parameter Condition Min. Max. Units

VCCA Supply Voltage for Array 2.3 2.7 V

VCCI Supply Voltage for I/Os 3.0 3.6 V

VIH Input High Voltage 0.5VCCI VCCI + 0.5 V

VIL Input Low Voltage –0.5 0.3VCCI V

IIPU Input Pull-up Voltage10.7VCCI V

IIL Input Leakage Current20 < VIN < VCCI –10 +10 µA

VOH Output High Voltage IOUT = –500 µA 0.9VCCI V

VOL Output Low Voltage IOUT = 1500 µA 0.1VCCI V

CIN Input Pin Capacitance310 pF

CCLK CLK Pin Cap acitance 5 12 pF

Notes:

1. This specification should be guaranteed by design. It is the minimum voltage to which pull-up resistors are calculated to pull a floated

network. Applications sensitive to static power utilization should assure that the input buffer is conducting minimum current at this input

voltage.

2. Input leakage currents include hi-Z output leakage for all bidirectional buffers with tristate outputs.

3. Absolute maximum pin capacitance for a PCI input is 10 pF (except for CLK).

SX-A Family FPGAs

16 Preliminary v1.2

AC Specifications (3.3V PCI Operation)

Symbol Parameter Condition Min. Max. Units

IOH(AC)

Switching Current High

0 < VOUT ≤ 0.3VCCI 1–12VCCI mA

0.3VCCI ≤ VOUT < 0.9VCCI 1(–17.1 + (VCCI – VOUT)) mA

0.7VCCI < VOUT < VCCI 1, 2 Equation C

on page 17

(Test Point) VOUT = 0.7VCC 2–32VCCI mA

IOL(AC)

Switching Current Low

VCCI > VOUT ≥ 0.6VCCI 116VCCI mA

0.6VCCI > VOUT > 0.1VCCI 1(26.7VOUT)mA

0.18VCCI > VOUT > 0 1, 2 Equa tion D

on page 17

(Test Point) VOUT = 0.18VCC 2 38VCCI mA

ICL Low Clamp Current –3 < VIN ≤ –1–25 + ( VIN + 1)/0.015 mA

ICH High Clamp Current VCCI + 4 > VIN ≥ VCCI + 1 25 + (VIN – VCCI – 1)/0.015 mA

slewROutput Rise Slew Rate 0.2VCCI to 0.6VCCI load 314V/ns

slewFOutput Fall Slew Rate 0.6VCCI to 0.2VCCI load 314V/ns

Notes:

1. Refer to the V/I curves in Figure 12 on page 17. Switching current characteristics for REQ# and GNT# are permitted to be one half of that

specified here; i.e., half size output drivers may be used on these signals. This specification does not apply to CLK and RST#, which are

system outputs. “Switching Current High” specifications are not relevant to SERR#, INTA#, INTB#, INTC#, and INTD#, which are open drain

outputs.

2. Maximum current requirements must be met as drivers pull beyond the last step voltage. Equations defining these maximums (C and D)

are provided with the respective diagrams in Figure 12 on page 17. The equation defined maxima should be met by design. In order to

facilitate component testing, a maximum current test point is defined for each side of the output driver.

3. This parameter is to be interpreted as the cumulative edge rate across the specified range, rather than the instantaneous rate at any point

within the transition range. The specified load (diagram below) is optional; i.e., the designer may elect to meet this parameter with an

unloaded output per the latest revision of the PCI Local Bus Specification. However, adherence to both maximum and minimum

parameters is required (the maximum is no longer simply a guideline). Rise slew rate does not apply to open drain outputs.

output

buffer

1/2 in. max.

10 pF

1k/25Ω

buffer

output

10 pF

Preliminary v1.2 17

SX-A Family FPGAs

Figure 12 shows the 3.3V PCI V/I curve and the minimum

and maximum PCI drive characteristics of the SX-A family.

Equation C

IOH = (98.0/VCCI) * (VOUT – VCCI) * (VOUT + 0.4VCCI)

for 0.7 VCCI < VOUT < VCCI

Equation D

IOL = (256/VCCI) * VOUT * (VCCI – VOUT)

for 0V < VOUT < 0.18 VCCI

Figure 12 •3.3V PCI V/I Curve for SX-A Family

–150.0

–100.0

–50.0

0.0

50.0

100.0

150.0

0 0.5 1 1.5 2 2.5 3 3.5 4

Voltage Out (V)

Current (mA)

IOH

IOL

IOH MIN Spec

IOH MAX Spec

IOL MIN Spec

IOL MAX Spec

SX-A Family FPGAs

18 Preliminary v1.2

Junction Temperature (TJ)

The temperature variable in the Designer Series software

refers to the junction temperature, not the ambient

temperature. This is an important distinction because the

heat generated from dynamic power consumption is usually

hotter than the ambient temperature. Equation 9, shown

below, can be used to calculate junction temperature.

Junction Temperature = ∆T + Ta(9)

Where:

Ta = Ambient Temperature

∆T = Temperature gradient between junction (silicon) and

ambient

∆T = θja * P (10)

P = Power

θja = Junction to ambient of package. θja numbers are

located in the Package Thermal Characteristics table below.

Package Thermal Characteristics

The device junction-to-case thermal characteristic is θjc,

and the junction-to-ambient air characteristic is θja. The

thermal characteristics for θja are shown with two different

air flow rates.

The maximum junction temperature is 150°C.

A sample calculation of the absolute maximum power

dissipation allowed for a TQFP 176-pin package at

commercial temperature and still air is as follows:

Package Thermal Characteristics

Package Type Pin Count θjc

θja

Still Air θja

300 ft/min Units

Thin Quad Flat Pack (TQFP ) 100 12 37.5 30 °C/W

Thin Quad Flat Pack (TQFP ) 144 11 32 24 °C/W

Thin Quad Flat Pack (TQFP ) 176 11 28 21 °C/W

Plastic Quad Flat Pack (PQFP)1208 8 30 23 °C/W

Plastic Quad Flat Pack (PQFP) with Heat Spreader2208 3.8 20 17 °C/W

Plastic Ball Grid Array (PBGA) 329 3 18 13.5 °C/W

Fine Pitch Ball Grid Array (FBGA) 144 3.8 38.8 26.7 °C/W

Fine Pitch Ball Grid Array (FBGA) 256 3.3 30 25 °C/W

Fine Pitch Ball Grid Array (FBGA) 484 3 20 15 °C/W

1. The SX-A PQ208 package has a heat spreader for A54SX16A, A54SX32A, and A54SX72A.

2. The A54SX08A PQ208 has no heat spreader.

Maximum Power Allowed Max. junction temp. (°C) Max. ambient temp. (°C)–

θja(°C/W)

--------------------------------------------------------------------------------------------------------------------------------- 150°C70°C–

28°C/W

-----------------------------------2.86W===

Preliminary v1.2 19

SX-A Family FPGAs

SX-A Timing Model*

Hard-Wired Clock

External Setup = tINYH + tRD1 + tSUD – tHCKL

= 0.6 + 0.3 + 0.4 – 1.1 = –0.2 ns

Clock-to-Out (Pin-to-Pin)

HCKL + tRCO + tRD1 + tDHL

= 1.1 + 0.7 + 0.3 + 2.6 = 4.7 ns

Routed Clock

External Setup = tINY + tRD1 + tSUD – tRCKH

= 0.6 + 0.3 + 0.4 – 1.2= –0.1 ns

Clock-to-Out (Pin-to-Pin)

RCKH + tRCO + tRD1 + tDHL

= 1.2+ 0.7 + 0.3 + 2.6 = 4.8 ns

*Values shown for A54SX08A–3, worst-case commercial conditions at 3.3V PCI, with standard place-and-route.

Output DelaysInternal DelaysInput Delays

Hard-Wired

I/O Module

FHMAX = 350 MHz

tINY = 0.6 ns tIRD2 = 0.4 ns

Combinatorial

Cell

tPD =0.7ns

Cell

I/O Module

tRD1 = 0.3 ns tDHL = 2.6 ns

I/O Module

Routed

Clock

FMAX = 250 MHz

DQDQ

tDHL = 2.6 ns

tENZL = 2.2 ns

tRD1 = 0.3 ns

tRCO = 0.7 ns

tSUD = 0.4 ns

tHD = 0.0 ns

tRD4 = 0.7 ns

tRD8 = 1.2 ns

Predicted

Routing

Delays

tRCKH = 1.2 ns

tRD1 = 0.3 ns

Cell

tRCO = 0.8 ns

Clock tHCKL = 1.1 ns

SX-A Family FPGAs

20 Preliminary v1.2

Output Buffer Delays

AC Test Loads

Input Buffer Delays C-Cell Delays

To AC test loads (shown below)

PAD

TRIBUFF

In VCC GND

50%

Out

VOL

VOH

1.5V

tDLH

50%

1.5V

tDHL

En VCC GND

50%

Out VOL

1.5V

tENZL

50%

10%

tENLZ

En VCC GND

50%

Out

GND

VOH

1.5V

tENZH

50%

90%

tENHZ

VCC

Load 1

(Used to measure Load 2

(Used to measure enable delays)

35 pF

To the output VCC GND

35 pF

To the output R to VCC for tPZL

R to GND for tPZH

R = 1 kΩ

propagation delay)

under test

Load 3

(Used to measure disable delays)

VCC GND

5 pF

To the output R to VCC for tPLZ

R to GND for tPHZ

R = 1 kΩ

under test

PAD Y

INBUF

In 3V 0V

1.5V

Out

GND

VCC

50%

1.5V

50%

S, A, o r B

Out

GND

VCC

50%

tPD

Out

GND

VCC

50%

50% 50%

VCC

50% 50%

tPD

Preliminary v1.2 21

SX-A Family FPGAs

Cell Timing Characteristics

Timing Characteristics

Timing characteristics for SX-A devices fall into three

categories: family-dependent, device-dependent, and

design-dependent. The input and output buffer characteristics

are common to all SX-A family members. Internal routing

delays are device-dependent. Design dependency means

actual delays are not determined until after placement and

routing of the user’s design are complete. Delay values may

then be determined by using the Timer utility or performing

simulation with post-layout delays.

Critical Nets and Typical Nets

Propagation delays are expressed only for typical nets,

which are used for initial design performance evaluation.

Critical net delays can then be applied to the most timing

critical paths. Critical nets are determined by net property

assignment prior to placement and routing. Up to 6 percent

of the nets in a design may be designated as critical, while

90 percent of the nets in a design are typical.

Long Tracks

Some nets in the design use long tracks. Long tracks are special

routing resources that span multiple rows, columns, or modules.

Long tracks employ three to five antifuse connections. This

increases capacitance and resistance, resulting in longer net

delays for macros connected to long tracks. Typically, up to

6 percent of nets in a fully utilized device require long tracks.

Long tracks contribute approximately 4 ns to 8.4 ns delay. This

additional delay is represented statistically in higher fanout

routing delays.

Timing Derating

SX-A devices are manufactured with a CMOS process.

Therefore, device performance varies according to

temperature, voltage, and process changes. Minimum timing

parameters reflect maximum operating voltage, minimum

operating temperature, and best-case processing. Maximum

timing parameters reflect minimum operating voltage,

maximum operating temperature, and worst-case processing.

Temperature and Voltage Derating Factors

(Normalized to Worst-Case Commercial, TJ = 70°C, VCCA = 2.3V)

(Positive edge triggered)

CLK CLR

CLK

CLR

tHPWH,

tWASYN

tHD

tSUD tHP

tHPWL,

tRCO

tCLR

tRPWL

tRPWH

PRESET

tPRESET

PRESET

Flip-Flops

VCCA

Junction Temperature (TJ)

–55°C–40°C0°C 25°C70°C 85°C 125°C

2.3V 0.75 0.79 0.88 0.89 1.00 1.04 1.16

2.5V 0.70 0.74 0.82 0.83 0.93 0.97 1.08

2.7V 0.66 0.69 0.79 0.79 0.88 0.92 1.02

SX-A Family FPGAs

22 Preliminary v1.2

A54SX08A Timing Characteristics

(Worst-Case Commercial Conditions, VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

C-Cell Propagation Delays1

tPD Internal Array Module 0.8 1.0 1.1 1.3 1.8 ns

Predicted Routing Delays2

tDC FO=1 Routing Delay, Direct Connect 0.1 0.1 0.1 0.1 0 .1 ns

tFC FO=1 Routing Delay, Fast Connect 0.3 0.3 0.3 0.4 0.6 ns

tRD1 FO=1 Routing Delay 0.3 0.3 0.4 0.5 0.6 ns

tRD2 FO=2 Routing Delay 0.4 0.5 0.5 0.6 0.8 ns

tRD3 FO=3 Routing Delay 0.5 0.6 0.7 0.8 1.1 ns

tRD4 FO=4 Routing Delay 0.7 0.8 0.9 1.0 1.4 ns

tRD8 FO=8 Routing Delay 1.2 1.4 1.5 1.8 2.5 ns

tRD12 FO=12 Routing Delay 1.7 2.0 2.2 2.6 3.6 ns

R-Cell Timing

tRCO Sequential Clock-to-Q 0.7 0.8 0.9 1.1 1.6 ns

tCLR Asynchronous Clear-to-Q 0.6 0.7 0.8 0.9 1.3 ns

tPRESET Asynchronous Preset-to-Q 0.7 0.8 0.9 1.1 1.6 ns

tSUD Flip-Flop Data Input Set-Up 0.4 0.4 0.5 0.6 0.8 ns

tHD Flip-Flop Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tWASYN Asynchronous Pulse Width 1.3 1.5 1.7 2.0 2.8 ns

tRECASYN Asynchronous Recovery Time 0.3 0 .4 0.4 0.5 0.7 ns

tHASYN Asynchronous Hold Time 0.3 0.3 0.3 0.4 0.6 ns

Input Module Propagation Delays

tINYH Input Data Pad-to-Y HIGH 0.5 0.6 0.7 0.8 1.1 ns

tINYL Input Data Pad-to-Y LOW 0.8 1.0 1.0 1.3 1.8 ns

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 0.3 0.3 0.3 0.4 0.6 ns

tIRD2 FO=2 Routing Delay 0.4 0.5 0.5 0.6 0.8 ns

tIRD3 FO=3 Routing Delay 0.5 0.6 0.7 0.8 1.1 ns

tIRD4 FO=4 Routing Delay 0.7 0.8 0.9 1.0 1.4 ns

tIRD8 FO=8 Routing Delay 1.2 1.4 1.5 1.8 2.5 ns

tIRD12 FO=12 Routing Delay 1.7 2.0 2.2 2.6 3.6 ns

Notes:

1. For dual-module macros, use tPD + tRD1 + tPDn , tRCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

Preliminary v1.2 23

SX-A Family FPGAs

A54SX08A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.1 1.3 1.5 1.8 2.4 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.1 1.2 1.4 1.6 2.2 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tHCKSW Maximum Skew 0.2 0.2 0.2 0.3 0.4 ns

tHP Minimum Period 2.8 3.2 3.6 4.2 6.0 ns

fHMAX Maximum Frequency 350 310 277 238 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.1 1.2 1.3 1.6 2.2 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 1.3 1.4 1.6 1.9 2.6 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 1.2 1.4 1.6 1.9 2.6 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 1.4 1.6 1.9 2.2 3.0 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 1.3 1.5 1.7 2.0 2.8 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 1.5 1.7 2.0 2.3 3.1 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.3 0.3 0.3 0.3 0.4 ns

tRCKSW Maximum Skew (50% Load) 0.3 0.3 0.4 0.4 0.7 ns

tRCKSW Maximum Skew (100% Load) 0.3 0.3 0.4 0.4 0.7 ns

SX-A Family FPGAs

24 Preliminary v1.2

A54SX08A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.1 1.2 1.4 1.6 2.4 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.0 1.2 1.3 1.5 2.3 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tHCKSW Maximum Skew 0.2 0.2 0.2 0.3 0.4 ns

tHP Minimum Period 2.8 3.2 3.6 4.2 6.0 ns

fHMAX Maximum Frequency 350 310 277 238 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.0 1.2 1.3 1.6 2.2 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 1.3 1.4 1.7 2.0 2.8 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 1.1 1.3 1.5 1.8 2.5 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 1.4 1.5 1.9 2.2 3.1 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 1.2 1.4 1.6 1.9 2.6 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 1.5 1.6 2.0 2.3 3.4 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.2 0.3 0.3 0.4 0.4 ns

tRCKSW Maximum Skew (50% Load) 0.3 0.3 0.4 0.4 0.7 ns

tRCKSW Maximum Skew (100% Load) 0.3 0.3 0.4 0.4 0.7 ns

Preliminary v1.2 25

SX-A Family FPGAs

A54SX08A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.0 1.2 1.4 1.5 2.3 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.0 1.1 1.3 1.5 2.2 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tHCKSW Maximum Skew 0.2 0.2 0.2 0.3 0.4 ns

tHP Minimum Period 2.8 3.2 3.6 4.2 6.0 ns

fHMAX Maximum Frequency 350 310 277 238 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.0 1.1 1.2 1.5 2.0 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 1.2 1.4 1.6 1.8 2.6 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 1.1 1.3 1.5 1.8 2.5 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 1.3 1.6 1.9 2.1 3.1 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 1.2 1.4 1.6 1.9 2.6 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 1.4 1.7 2.0 2.2 3.2 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.2 0.3 0.3 0.4 0.4 ns

tRCKSW Maximum Skew (50% Load) 0.3 0.3 0.4 0.4 0.7 ns

tRCKSW Maximum Skew (100% Load) 0.3 0.3 0.4 0.4 0.7 ns

SX-A Family FPGAs

26 Preliminary v1.2

A54SX08A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter

Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

2.5V LVTTL Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 3.3 3.9 4.4 5.2 7.2 ns

tDHL Data-to-Pad HIGH to LOW 2.6 3.0 3.4 4.0 5.5 ns

tDHLS Data-to-Pad HIGH to LOW—low slew 11.7 13.5 15.3 18.0 25.9 ns

tENZL Enable-to-Pad, Z to L 2.4 2.8 3.2 3.7 5.2 ns

tENZLS Data-to-Pad, Z to L—low slew 11.8 13.7 15.5 18.2 25.5 ns

tENZH Enable-to-Pad, Z to H 3.4 4.0 4.5 5.3 7.5 ns

tENLZ Enable-to-Pad, L to Z 2.1 2.5 2.8 3.3 4.7 ns

tENHZ Enable-to-Pad, H to Z 3.4 4.0 4.5 5.3 7.5 ns

dTLH2Delta LOW to HIGH 0.031 0.037 0.043 0.051 0.071 ns/pF

dTHL2Delta HIGH to LOW 0.017 0.017 0.023 0.023 0.037 ns/pF

dTHLS2Delta HIGH to LOW—low slew 0.057 0.060 0.071 0.086 0.117 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

Preliminary v1.2 27

SX-A Family FPGAs

A54SX08A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Spe ed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

3.3V PCI Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 2.0 2.3 2.6 3.0 4.3 ns

tDHL Data-to-Pad HIGH to LOW 2.1 2.4 2.8 3.3 4.6 ns

tENZL Enable-to-Pad, Z to L 1.4 1.7 1.9 2.2 3.1 ns

tENZH Enable-to-Pad, Z to H 1.4 1.7 1.9 2.2 3.1 ns

tENLZ Enable-to-Pad, L to Z 2.5 2.8 3.2 3.8 5.3 ns

tENHZ Enable-to-Pad, H to Z 2.5 2.8 3.2 3.8 5.3 ns

dTLH3Delta LOW to HIGH 0.025 0.03 0.03 0.04 0.045 ns/pF

dTHL3Delta HIGH to LOW 0.015 0.015 0.015 0.015 0.025 ns/pF

3.3V LVTTL Output Module Timing2

tDLH Data-to-Pad LOW to HIGH 2.7 3.2 3.6 4.2 5.9 ns

tDHL Data-to-Pad HIGH to LOW 2.7 3.1 3.5 4.1 5.8 ns

tDHLS Data-to-Pad HI GH to LOW—low slew 9 .6 11.1 12.6 1 4.8 20.7 ns

tENZL Enable-to-Pad, Z to L 2.2 2.6 2.9 3.4 4.8 ns

tENZLS Enable-to-Pad, Z to L—low slew 15.8 18.9 21. 3 25.4 34.9 ns

tENZH Enable-to-Pad, Z to H 2.9 3.3 3.7 4.4 6.2 ns

tENLZ Enable-to-Pad, L to Z 2.9 3.3 3.7 4.4 6.2 ns

tENHZ Enable-to-Pad, H to Z 2.5 2.8 3.2 3.8 5.3 ns

dTLH3Delta LOW to HIGH 0.025 0.03 0.03 0.04 0.045 ns/pF

dTHL3Delta HIGH to LOW 0.015 0.015 0.015 0.015 0.025 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.053 0.053 0.067 0.073 0.107 ns/pF

Notes:

1. Delays based on 10 pF loading and 25Ω resistance.

2. Delays based on 35 pF loading.

3. Slew rates measured from 10% to 90% VCCI.

SX-A Family FPGAs

28 Preliminary v1.2

A54SX08A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

5.0V PCI Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 2.1 2.5 2.8 3.3 4.6 ns

tDHL Data-to-Pad HIGH to LOW 2.8 3.2 3.7 4.3 6.0 ns

tDHLS Da ta-to-Pa d HIGH to LOW—lo w slew 7.4 8.5 9.6 11.3 15.9 ns

tENZL Enable-to-Pad, Z to L 1.3 1.5 1.7 2.0 2.8 ns

tENZLS Enable-to-Pad, Z to L—low slew 3.5 5.1 5.9 6.9 9.7 ns

tENZH Enable-to-Pad, Z to H 1.3 1.5 1.7 2.0 2.8 ns

tENLZ Enable-to-Pad, L to Z 3.0 3.5 3.9 4.6 6.4 ns

tENHZ Enable-to-Pad, H to Z 3.0 3.5 3.9 4.6 6.4 ns

dTLH3Delta LOW to HIGH 0.016 0.016 0.02 0.022 0.032 ns/pF

dTHL3Delta HIGH to LOW 0.026 0.03 0.032 0.04 0.052 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.04 0.052 0.06 0.07 0.096 ns/pF

5. 0V TTL Output Module Timing2

tDLH Data-to-Pad LOW to HIGH 1.9 2.2 2.5 3.0 4.2 ns

tDHL Data-to-Pad HIGH to LOW 2.6 3.0 3.4 4.0 5.6 ns

tDHLS Da ta-to-Pa d HIGH to LOW—lo w slew 6.7 7.7 8.8 10.3 14.4 ns

tENZL Enable-to-Pad, Z to L 2.1 2.4 2.7 3.2 4.5 ns

tENZLS Enable-to-Pad, Z to L—low slew 7.4 8.4 9.5 11.0 15.4 ns

tENZH Enable-to-Pad, Z to H 2.3 2.7 3.1 3.6 5.0 ns

tENLZ Enable-to-Pad, L to Z 3.6 4.2 4.7 5.6 7.8 ns

tENHZ Enable-to-Pad, H to Z 3.0 3.5 3.9 4.6 6.4 ns

dTLH3Delta LOW to HIGH 0.014 0.017 0.017 0.023 0.031 ns/pF

dTHL3Delta HIGH to LOW 0.023 0.029 0.031 0.037 0.051 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.043 0.046 0.057 0.066 0.089 ns/pF

Notes:

1. Delays based on 50 pF loading.

2. Delays based on 35 pF loading

3. Slew rates measured from 10% to 90% VCCI.

Preliminary v1.2 29

SX-A Family FPGAs

A54SX16A Timing Characteristics

(Worst-Case Commercial Conditions, VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

C-Cell Propagation Delays1

tPD Internal Array Module 0.8 1.0 1.1 1.3 1.8 ns

Predicted Routing Delays2

tDC FO=1 Routing Delay, Direct Connect 0.1 0.1 0.1 0.1 0 .1 ns

tFC FO=1 Routing Delay, Fast Connect 0.3 0.3 0.3 0.4 0.6 ns

tRD1 FO=1 Routing Delay 0.3 0.3 0.4 0.5 0.6 ns

tRD2 FO=2 Routing Delay 0.4 0.5 0.5 0.6 0.8 ns

tRD3 FO=3 Routing Delay 0.5 0.6 0.7 0.8 1.1 ns

tRD4 FO=4 Routing Delay 0.7 0.8 0.9 1.0 1.4 ns

tRD8 FO=8 Routing Delay 1.2 1.4 1.5 1.8 2.5 ns

tRD12 FO=12 Routing Delay 1.7 2.0 2.2 2.6 3.6 ns

R-Cell Timing

tRCO Sequential Clock-to-Q 0.7 0.8 0.9 1.1 1.6 ns

tCLR Asynchronous Clear-to-Q 0.6 0.7 0.8 0.9 1 .3 ns

tPRESET Asynchronous Preset-to-Q 0.7 0.8 0.9 1.1 1.6 ns

tSUD Flip-Flop Data Input Set-Up 0.4 0.4 0.5 0.6 0.8 ns

tHD Flip-Flop Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tWASYN Asynchronous Pulse Width 1.3 1.5 1.7 2.0 2.8 ns

tRECASYN Asynchronous Recovery Time 0.3 0.4 0.4 0.5 0.7 ns

tHASYN Asynchronous Removal Time 0.3 0.3 0.3 0.4 0.6 ns

Input Module Propagation Delays

tINYH Input Data Pad-to-Y HIGH 0.5 0.6 0.7 0.8 1.1 ns

tINYL Input Data Pad-to-Y LOW 0.8 1.0 1.0 1.3 1.8 ns

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 0.3 0.3 0.3 0.4 0.6 ns

tIRD2 FO=2 Routing Delay 0.4 0.5 0.5 0.6 0.8 ns

tIRD3 FO=3 Routing Delay 0.5 0.6 0.7 0.8 1.1 ns

tIRD4 FO=4 Routing Delay 0.7 0.8 0.9 1.0 1.4 ns

tIRD8 FO=8 Routing Delay 1.2 1.4 1.5 0.8 2.5 ns

tIRD12 FO=12 Routing Delay 1.7 2.0 2.2 2.6 3.6 ns

Notes:

1. For dual-module macros, use tPD + tRD1 + tPDn , tRCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

SX-A Family FPGAs

30 Preliminary v1.2

A54SX16A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.2 1.5 1.6 1.9 2.9 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.1 1.4 1.5 1.8 2.8 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tHCKSW Maximum Skew 0.1 0.1 0.1 0.1 0.2 ns

tHP Minimum Period 2.7 3.2 3.6 4.2 6.0 ns

fHMAX Maximum Frequency 350 310 277 238 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.2 1.3 1.5 1.8 2.5 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 1.3 1.4 1.6 1.9 2.7 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 1.5 1.7 2.0 2.3 3.3 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 1.6 1.8 2.1 2.4 3.4 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 1.7 1.9 2.2 2.6 3.6 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 1.8 2.0 2.3 2.7 3.8 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.3 0.4 0.4 0.4 0.6 ns

tRCKSW Maximum Skew (50% Load) 0.5 0.6 0.7 0.8 1.3 ns

tRCKSW Maximum Skew (100% Load) 0.5 0.6 0.7 0.8 1.3 ns

Preliminary v1.2 31

SX-A Family FPGAs

A54SX16A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.2 1.5 1.6 1.9 2.9 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.1 1.4 1.5 1.8 2.8 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tHCKSW Maximum Skew 0.1 0.1 0.1 0.1 0.2 ns

tHP Minimum Period 2.7 3.2 3.6 4.2 6.0 ns

fHMAX Maximum Frequency 350 310 277 238 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.2 1.3 1.5 1.8 2.4 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 1.3 1.4 1.7 2.0 2.8 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 1.5 1.7 2.0 2.3 3.3 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 1.6 1.8 2.1 2.4 3.4 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 1.7 1.9 2.2 2.6 3.6 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 1.8 2.0 2.3 2.7 3.8 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.3 0.4 0.4 0.4 0.6 ns

tRCKSW Maximum Skew (50% Load) 0.5 0.6 0.7 0.8 1.3 ns

tRCKSW Maximum Skew (100% Load) 0.5 0.6 0.7 0.8 1.3 ns

SX-A Family FPGAs

32 Preliminary v1.2

A54SX16A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.2 1.4 1.6 1.8 2.8 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.1 1.3 1.5 1.7 2.7 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tHCKSW Maximum Skew 0.1 0.1 0.1 0.1 0.2 ns

tHP Minimum Period 2.7 3.2 3.6 4.2 6.0 ns

fHMAX Maximum Frequency 350 310 277 238 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.1 1.2 1.4 1.7 2.3 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 1.2 1.4 1.6 1.8 2.6 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 1.4 1.6 1.8 2.2 3.1 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 1.5 1.7 1.9 2.3 3.4 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 1.6 1.9 2.1 2.5 3.5 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 1.7 2.0 2.2 2.6 4.0 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.1 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.1 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.3 0.4 0.4 0.4 0.6 ns

tRCKSW Maximum Skew (50% Load) 0.5 0.6 0.7 0.8 1.3 ns

tRCKSW Maximum Skew (100% Load) 0.5 0.6 0.7 0.8 1.3 ns

Preliminary v1.2 33

SX-A Family FPGAs

A54SX16A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

2.5V LVTTL Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 3.3 3.9 4.4 5.2 7.2 ns

tDHL Data-to-Pad HIGH to LOW 2.6 3.0 3.4 4.0 5.5 ns

tDHLS Data-to-Pad HIGH to LOW—low slew 11.7 1 3.5 15.3 18.0 25.9 ns

tENZL Enable-to-Pad, Z to L 2.4 2.8 3.2 3.7 5.2 ns

tENZLS Dat a-to-Pad, Z to L—low slew 11.8 13.7 15.5 18.2 25.5 ns

tENZH Enable-to-Pad, Z to H 3.4 4.0 4.5 5.3 7.5 ns

tENLZ Enable-to-Pad, L to Z 2.1 2.5 2.8 3.3 4.7 ns

tENHZ Enable-to-Pad, H to Z 3.4 4.0 4.5 5.3 7.5 ns

dTLH2Delta LOW to HIGH 0.031 0.037 0.043 0.051 0.071 ns/pF

dTHL2Delta HIGH to LOW 0.017 0.017 0.023 0.023 0.037 ns/pF

dTHLS2Delta HIGH to LOW—low slew 0.057 0.060 0.071 0.086 0.117 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

SX-A Family FPGAs

34 Preliminary v1.2

A54SX16A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

3.3V PCI Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 2.0 2.3 2.6 3.0 4.3 ns

tDHL Data-to-Pad HIGH to LOW 2.1 2.4 2.8 3.3 4.6 ns

tENZL Enable-to-Pad, Z to L 1.4 1.7 1.9 2.2 3.1 ns

tENZH Enable-to-Pad, Z to H 1.4 1.7 1.9 2.2 3.1 ns

tENLZ Enable-to-Pad, L to Z 2.5 2.8 3.2 3.8 5.3 ns

tENHZ Enable-to-Pad, H to Z 2.5 2.8 3.2 3.8 5.3 ns

dTLH3Delta LOW to HIGH 0.025 0.03 0.03 0.04 0.045 ns/pF

dTHL3Delta HIGH to LOW 0.015 0.015 0.015 0.015 0.025 ns/pF

3.3V LVTTL Output Module Timing2

tDLH Data-to-Pad LOW to HIGH 2.7 3.2 3.6 4.2 5.9 ns

tDHL Data-to-Pad HIGH to LOW 2.7 3.1 3.5 4.1 5.8 ns

tDHLS Data-to-Pad HIGH to LOW—low slew 9.6 11.1 12.6 14.8 20.7 ns

tENZL Enable-to-Pad, Z to L 2.2 2.6 2.9 3.4 4.8 ns

tENZLS Enable-to-Pad, Z to L—low slew 15.8 18.9 21.3 25.4 34.9 ns

tENZH Enable-to-Pad, Z to H 2.9 3.3 3.7 4.4 6.2 ns

tENLZ Enable-to-Pad, L to Z 2.9 3.3 3.7 4.4 6.2 ns

tENHZ Enable-to-Pad, H to Z 2.5 2.8 3.2 3.8 5.3 ns

dTLH3Delta LOW to HIGH 0.025 0.03 0.03 0.04 0.045 ns/pF

dTHL3Delta HIGH to LOW 0.015 0.015 0.015 0.015 0.025 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.053 0.053 0.067 0.073 0.107 ns/pF

Notes:

1. Delays based on 10 pF loading and 25Ω resistance.

2. Delays based on 35 pF loading.

3. Slew rates measured from 10% to 90% VCCI.

Preliminary v1.2 35

SX-A Family FPGAs

A54SX16A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

5.0V PCI Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 2.1 2.5 2.8 3.3 4.6 ns

tDHL Data-to-Pad HIGH to LOW 2.8 3.2 3.7 4.3 6.0 ns

tDHLS Data-to-Pad HIGH to LOW—low slew 7.4 8.5 9.6 11.3 15.9 ns

tENZL Enable-to-Pad, Z to L 1.3 1.5 1.7 2.0 2.8 ns

tENZLS Enable-to-Pad, Z to L—low slew 3.5 5.1 5.9 6.9 9.7 ns

tENZH Enable-to-Pad, Z to H 1.3 1.5 1.7 2.0 2.8 ns

tENLZ Enable-to-Pad, L to Z 3.0 3.5 3 .9 4.6 6.4 ns

tENHZ Enable-to-Pad, H to Z 3.0 3.5 3.9 4.6 6 .4 ns

dTLH3Delta LOW to HIGH 0.016 0.016 0.02 0.022 0.032 ns/pF

dTHL3Delta HIGH to LOW 0.026 0.03 0.032 0.04 0.052 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.04 0.052 0.06 0.07 0.096 ns/pF

5.0V TTL Output Module Timing2

tDLH Data-to-Pad LOW to HIGH 1.9 2.2 2.5 3.0 4.2 ns

tDHL Data-to-Pad HIGH to LOW 2.6 3.0 3.4 4.0 5.6 ns

tDHLS Data-to-Pad HIGH to LOW—low slew 6.7 7.7 8.8 10.3 14.4 ns

tENZL Enable-to-Pad, Z to L 2.1 2.4 2.7 3.2 4.5 ns

tENZLS Enable-to-Pad, Z to L—low slew 7.4 8.4 9.5 11.0 15.4 ns

tENZH Enable-to-Pad, Z to H 2.3 2.7 3.1 3.6 5.0 ns

tENLZ Enable-to-Pad, L to Z 3.6 4.2 4 .7 5.6 7.8 ns

tENHZ Enable-to-Pad, H to Z 3.0 3.5 3.9 4.6 6 .4 ns

dTLH3Delta LOW to HIGH 0.014 0.017 0.017 0.023 0.031 ns/pF

dTHL3Delta HIGH to LOW 0.023 0.029 0.031 0.037 0.051 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.043 0.046 0.057 0.066 0.089 ns/pF

Notes:

1. Delays based on 50 pF loading.

2. Delays based on 35 pF loading.

3. Slew rates measured from 10% to 90% VCCI.

SX-A Family FPGAs

36 Preliminary v1.2

A54SX32A Timing Characteristics

(Worst-Case Commercial Conditions, VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

C-Cell Propagation Delays1

tPD Internal Array Module 0.8 1.0 1.1 1.3 1.8 ns

Predicted Routing Delays2

tDC FO=1 Routing Delay, Direct Connect 0.1 0.1 0.1 0.1 0 .1 ns

tFC FO=1 Routing Delay, Fast Connect 0.3 0.3 0.3 0.4 0.6 ns

tRD1 FO=1 Routing Delay 0.3 0.3 0.4 0.5 0.6 ns

tRD2 FO=2 Routing Delay 0.4 0.5 0.5 0.6 0.8 ns

tRD3 FO=3 Routing Delay 0.5 0.6 0.7 0.8 1.1 ns

tRD4 FO=4 Routing Delay 0.7 0.8 0.9 1.0 1.4 ns

tRD8 FO=8 Routing Delay 1.2 1.4 1.5 1.8 2.5 ns

tRD12 FO=12 Routing Delay 1.7 2.0 2.2 2.6 3.6 ns

R-Cell Timing

tRCO Sequential Clock-to-Q 0.7 0.8 0.9 1.1 1.6 ns

tCLR Asynchronous Clear-to-Q 0.6 0.7 0.8 0.9 1 .3 ns

tPRESET Asynchronous Preset-to-Q 0.7 0.8 0.9 1.1 1.6 ns

tSUD Flip-Flop Data Input Set-Up 0.4 0.4 0.5 0.6 0.8 ns

tHD Flip-Flop Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tWASYN Asynchronous Pulse Width 1.3 1.5 1.7 2.0 2.8 ns

tRECASYN Asynchronous Recovery Time 0.3 0 .4 0.4 0.5 0.7 ns

tHASYN Asynchronous Removal Time 0.3 0.3 0.3 0.4 0.6 ns

Input Module Propagation Delays

tINYH Input Data Pad-to-Y HIGH 0.5 0.6 0.7 0.8 1.1 ns

tINYL Input Data Pad-to-Y LOW 0.8 1.0 1.0 1.3 1.8 ns

Input Module Predicted Routing Delays2

tIRD1 FO=1 Routing Delay 0.3 0.3 0.3 0.4 0.6 ns

tIRD2 FO=2 Routing Delay 0.4 0.5 0.5 0.6 0.8 ns

tIRD3 FO=3 Routing Delay 0.5 0.6 0.7 0.8 1.1 ns

tIRD4 FO=4 Routing Delay 0.7 0.8 0.9 1.0 1.4 ns

tIRD8 FO=8 Routing Delay 1.2 1.4 1.5 1.8 2.5 ns

tIRD12 FO=12 Routing Delay 1.7 2.0 2.2 2.6 3.6 ns

Notes:

1. For dual-module macros, use tPD + tRD1 + tPDn , tRCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

Preliminary v1.2 37

SX-A Family FPGAs

A54SX32A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.7 2.0 2.3 2.7 4.1 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.5 1.7 1.9 2.3 3.5 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tHCKSW Maximum Skew 0.3 0.4 0.4 0.5 0.8 ns

tHP Minimum Period 2.7 3.2 3.6 4.4 6.0 ns

fHMAX Maximum Frequency 350 310 277 227 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.7 2.0 2.2 2.6 3.7 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 2.1 2.4 2.7 3.2 4.5 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 2.1 2.4 2.8 3.2 4.5 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 2.3 2.5 2.9 3.4 5.0 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 2.5 2.9 3.2 3.8 6.4 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 2.5 2.9 3.2 3.8 6.4 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.9 1.0 1.1 1.3 2.2 ns

tRCKSW Maximum Skew (50% Load) 1.2 1.4 1.6 1.9 3.2 ns

tRCKSW Maximum Skew (100% Load) 1.3 1.5 1.7 2.0 3.4 ns

SX-A Family FPGAs

38 Preliminary v1.2

A54SX32A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.7 2.0 2.3 2.7 4.1 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.5 1.7 1.9 2.3 3.5 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tHCKSW Maximum Skew 0.3 0.4 0.4 0.5 0.8 ns

tHP Minimum Period 2.7 3.2 3.6 4.4 6.0 ns

fHMAX Maximum Frequency 350 310 277 227 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.7 2.0 2.2 2.6 3.7 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 2.1 2.4 2.8 3.3 4.6 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 2.1 2.4 2.8 3.2 4.5 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 2.3 2.5 2.9 3.4 5.0 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 2.5 2.9 3.2 3.8 6.4 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 2.5 2.9 3.2 3.8 6.4 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.9 1.0 1.1 1.3 2.2 ns

tRCKSW Maximum Skew (50% Load) 1.2 1.4 1.6 1.9 3.2 ns

tRCKSW Maximum Skew (100% Load) 1.3 1.5 1.7 2.0 3.4 ns

Preliminary v1.2 39

SX-A Family FPGAs

A54SX32A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.7 1.9 2.3 2.6 4.0 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.5 1.7 1.9 2.2 3.5 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tHCKSW Maximum Skew 0.3 0.4 0.4 0.5 0.8 ns

tHP Minimum Period 2.7 3.2 3.6 4.4 6.0 ns

fHMAX Maximum Frequency 350 310 277 227 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 1.6 1.9 2.1 2.5 3.5 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 2.0 2.4 2.7 3.1 4.4 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 2.0 2.4 2.7 3.1 2.5 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 2.2 2.5 2.8 3.3 5.5 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 2.5 2.9 3.2 3.8 6.4 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 2.5 2.9 3.2 3.8 6.4 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tRCKSW Maximum Skew (Light Load) 0.9 1.0 1.1 1.3 2.0 ns

tRCKSW Maximum Skew (50% Load) 1.2 1.4 1.6 1.9 3.2 ns

tRCKSW Maximum Skew (100% Load) 1.3 1.5 1.7 2.0 3.4 ns

SX-A Family FPGAs

40 Preliminary v1.2

A54SX32A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

2.5V LVTTL Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 3.3 3.9 4.4 5.2 7.2 ns

tDHL Data-to-Pad HIGH to LOW 2.6 3.0 3.4 4.0 5.5 ns

tDHLS Data-to-Pad HIGH to LOW—low slew 11.7 13.5 15.3 18.0 25.9 ns

tENZL Enable-to-Pad, Z to L 2.4 2.8 3.2 3.7 5.2 ns

tENZLS Data-to-Pad, Z to L—low slew 11.8 13.7 15.5 18.2 25.5 n s

tENZH Enable-to-Pad, Z to H 3.4 4.0 4.5 5.3 7.5 ns

tENLZ Enable-to-Pad, L to Z 2.1 2.5 2.8 3.3 4.7 ns

tENHZ Enable-to-Pad, H to Z 3.4 4.0 4.5 5.3 7.5 ns

dTLH2Delta LOW to HIGH 0.031 0.037 0.043 0.051 0.071 ns/pF

dTHL2Delta HIGH to LOW 0.017 0.017 0.023 0.023 0.037 ns/pF

dTHLS2Delta HIGH to LOW—low slew 0.057 0.060 0.071 0.086 0.117 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

Preliminary v1.2 41

SX-A Family FPGAs

A54SX32A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Spe ed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

3.3V PCI Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 2.0 2.3 2.6 3.0 4.3 ns

tDHL Data-to-Pad HIGH to LOW 2.1 2.4 2.8 3.3 4.6 ns

tENZL Enable-to-Pad, Z to L 1.4 1.7 1.9 2.2 3.1 ns

tENZH Enable-to-Pad, Z to H 1.4 1.7 1.9 2.2 3.1 ns

tENLZ Enable-to-Pad, L to Z 2.5 2.8 3.2 3.8 5.3 ns

tENHZ Enable-to-Pad, H to Z 2.5 2.8 3.2 3.8 5.3 ns

dTLH3Delta LOW to HIGH 0.025 0.03 0.03 0.04 0.045 ns/pF

dTHL3Delta HIGH to LOW 0.015 0.015 0.015 0.015 0.025 ns/pF

3.3V LVTTL Output Module Timing2

tDLH Data-to-Pad LOW to HIGH 2.7 3.2 3.6 4.2 5.9 ns

tDHL Data-to-Pad HIGH to LOW 2.7 3.1 3.5 4.1 5.8 ns

tDHLS Data-to-Pad HI GH to LOW—low slew 9 .6 11.1 12. 6 14.8 20.7 ns

tENZL Enable-to-Pad, Z to L 2.2 2.6 2.9 3.4 4.8 ns

tENZLS Enable-to-Pad, Z to L—low slew 15.8 18.9 21.3 25.4 34.9 ns

tENZH Enable-to-Pad, Z to H 2.9 3.3 3.7 4.4 6.2 ns

tENLZ Enable-to-Pad, L to Z 2.9 3.3 3.7 4.4 6.2 ns

tENHZ Enable-to-Pad, H to Z 2.5 2.8 3.2 3.8 5.3 ns

dTLH3Delta LOW to HIGH 0.025 0.03 0.03 0.04 0.045 ns/pF

dTHL3Delta HIGH to LOW 0.015 0.015 0.015 0.015 0.025 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.053 0.053 0.067 0.073 0.107 ns/pF

Notes:

1. Delays based on 10 pF loading and 25Ω resistance.

2. Delays based on 35 pF loading.

3. Slew rates measured from 10% to 90% VCCI.

SX-A Family FPGAs

42 Preliminary v1.2

A54SX32A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

5.0V PCI Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 2.1 2.5 2.8 3.3 4.6 ns

tDHL Data-to-Pad HIGH to LOW 2.8 3.2 3.7 4.3 6.0 ns

tDHLS Da ta-to-Pa d HIGH to LOW—lo w slew 7.4 8.5 9.6 11.3 15.9 ns

tENZL Enable-to-Pad, Z to L 1.3 1.5 1.7 2.0 2.8 ns

tENZLS Enable-to-Pad, Z to L—low slew 3.5 5.1 5.9 6.9 9.7 ns

tENZH Enable-to-Pad, Z to H 1.3 1.5 1.7 2.0 2.8 ns

tENLZ Enable-to-Pad, L to Z 3.0 3.5 3.9 4.6 6.4 ns

tENHZ Enable-to-Pad, H to Z 3.0 3.5 3.9 4.6 6.4 ns

dTLH3Delta LOW to HIGH 0.016 0.016 0.02 0.022 0.032 ns/pF

dTHL3Delta HIGH to LOW 0.026 0.03 0.032 0.04 0.052 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.04 0.052 0.06 0.07 0.096 ns/pF

5. 0V TTL Output Module Timing2

tDLH Data-to-Pad LOW to HIGH 1.9 2.2 2.5 3.0 4.2 ns

tDHL Data-to-Pad HIGH to LOW 2.6 3.0 3.4 4.0 5.6 ns

tDHLS Da ta-to-Pa d HIGH to LOW—lo w slew 6.7 7.7 8.8 10.3 14.4 ns

tENZL Enable-to-Pad, Z to L 2.1 2.4 2.7 3.2 4.5 ns

tENZLS Enable-to-Pad, Z to L—low slew 7.4 8.4 9.5 11.0 15.4 ns

tENZH Enable-to-Pad, Z to H 2.3 2.7 3.1 3.6 5.0 ns

tENLZ Enable-to-Pad, L to Z 3.6 4.2 4.7 5.6 7.8 ns

tENHZ Enable-to-Pad, H to Z 3.0 3.5 3.9 4.6 6.4 ns

dTLH3Delta LOW to HIGH 0.014 0.017 0.017 0.023 0.031 ns/pF

dTHL3Delta HIGH to LOW 0.023 0.029 0.031 0.037 0.051 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.043 0.046 0.057 0.066 0.089 ns/pF

Notes:

1. Delays based on 50 pF loading.

2. Delays based on 35 pF loading.

3. Slew rates measured from 10% to 90% VCCI.

Preliminary v1.2 43

SX-A Family FPGAs

A54SX72A Timing Characteristics

(Worst-Case Commercial Conditions, VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

C-Cell Propagation Delays1

tPD Internal Array Module 0.8 1.0 1.1 1.3 1.8 ns

Predicted Routing Delays2

tDC FO=1 Routing Delay, Direct Connect 0.1 0.1 0.1 0.1 0.1 ns

tFC FO=1 Routing Delay, Fast Connect 0.3 0.3 0.3 0.4 0.6 ns

tRD1 FO=1 R outing Delay 0.3 0.3 0.4 0.5 0.7 ns

tRD2 FO=2 R outing Delay 0.4 0.5 0.6 0.7 1.0 ns

tRD3 FO=3 R outing Delay 0.5 0.7 0.8 0.9 1.3 ns

tRD4 FO=4 R outing Delay 0.7 0.9 1.0 1.1 1.5 ns

tRD8 FO=8 R outing Delay 1.2 1.5 1.7 2.1 2.9 ns

tRD12 FO=12 Routing Delay 1.7 2.2 2.5 3.0 4.2 ns

R-Cell Timing

tRCO Sequential Clock-to-Q 0.7 0.8 0.9 1.1 1.6 ns

tCLR As ynchro nous Cle ar- to-Q 0.6 0.7 0.8 0.9 1.3 ns

tPRESET Asynchro nous Preset- to-Q 0.7 0.8 0.9 1.1 1.6 ns

tSUD Flip-Flop Data Input Set-Up 0.4 0.4 0.5 0.6 0.8 ns

tHD Flip-Flop Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tWASYN Asynchro nous Pulse Widt h 1.3 1.5 1.7 2.0 2.8 ns

tRECASYN Asynchro nous Recover y T ime 0.3 0.4 0.4 0.5 0.7 ns

tHASYN Asynchro nous Hold T im e 0.3 0.3 0.3 0.4 0.6 ns

Input Module Propagation Delays

tINYH Input Data Pad-to-Y HIGH 0.5 0.6 0.7 0.8 1.1 ns

tINYL Input Data Pad-to-Y LOW 0.8 1.0 1.0 1.3 1.8 ns

Input Module Predicted Routing Delays2

tIRD1 FO= 1 Routing Delay 0.3 0.3 0.4 0.5 0.7 ns

tIRD2 FO= 2 Routing Delay 0.4 0.5 0.6 0.7 1.0 ns

tIRD3 FO= 3 Routing Delay 0.5 0.7 0.8 0.9 1.3 ns

tIRD4 FO= 4 Routing Delay 0.7 0.9 1.0 1.1 1.5 ns

tIRD8 FO= 8 Routing Delay 1.2 1.5 1.7 2.1 2.9 ns

tIRD12 FO=12 Routing Delay 1.7 2.2 2.5 3.0 4.2 ns

Notes:

1. For dual-module macros, use tPD + tRD1 + tPDn , tRCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

SX-A Family FPGAs

44 Preliminary v1.2

A54SX72A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.3 1.5 1.7 2.1 3.1 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.1 1.3 1.5 1.9 2.9 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tHCKSW Maxim um Skew 0.7 0.8 0.9 1.0 1.6 ns

tHP Minimum Period 2.8 3.2 3.6 4.4 6.0 ns

fHMAX Maximum Fre quen cy 350 310 277 22 7 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 2.3 2.6 2.9 3.5 4.8 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 2.6 3.1 3.4 4.0 5.6 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 3.0 3.5 3.9 4.6 6.5 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 3.3 3.8 4.2 4.9 7.1 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 3.7 4.3 4.8 5.7 8.0 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 4.0 4.6 5.1 6.0 8.6 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tRCKSW Maximum Ske w (Ligh t Load) 1.8 2.1 2.4 2.7 3.8 ns

tRCKSW Maximum Ske w (50% Load) 1.2 1.4 1.6 1.9 3.2 ns

tRCKSW Maximum Ske w (100% Load) 1. 4 1.5 1.7 2.0 3.4 ns

Preliminary v1.2 45

SX-A Family FPGAs

A54SX72A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.3 1.5 1.7 2.1 3.1 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.1 1.3 1.5 1.9 2.9 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tHCKSW Maxim um Skew 0.7 0.8 0.9 1.0 1.6 ns

tHP Minimum Period 2.8 3.2 3.6 4.4 6.0 ns

fHMAX Maximum Fre quen cy 350 310 277 22 7 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 2.2 2.6 2.9 3.5 4.8 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 2.7 3.1 3.5 4.1 5.7 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 3.0 3.5 3.9 4.6 6.5 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 3.3 3.8 4.2 4.9 7.1 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 3.7 4.3 4.8 5.7 8.0 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 4.0 4.6 5.1 6.0 8.6 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tRCKSW Maximum Ske w (Ligh t Load) 1.8 2.1 2.4 2.7 3.8 ns

tRCKSW Maximum Ske w (50% Load) 1.2 1.4 1.6 1.9 3.2 ns

tRCKSW Maximum Ske w (100% Load) 1. 4 1.5 1.7 2.0 3.4 ns

SX-A Family FPGAs

46 Preliminary v1.2

A54SX72A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Dedicated (Hard-Wired) Array Clock Networks

tHCKH Input LOW to HIGH

(Pad to R-Cell Input) 1.3 1.4 1.7 2.0 3.0 ns

tHCKL Input HIGH to LOW

(Pad to R-Cell Input) 1.1 1.2 1.5 1.8 2.8 ns

tHPWH Minimum Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tHPWL Minimum Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tHCKSW Maxim um Skew 0.7 0.8 0.9 1.0 1.6 ns

tHP Minimum Period 2.8 3.2 3.6 4.4 6.0 ns

fHMAX Maximum Fre quen cy 350 310 277 22 7 166 MHz

Routed Array Clock Networks

tRCKH Input LOW to HIGH (Light Load)

(Pad to R-Cell Input) 2.2 2.5 2.8 3.4 4.6 ns

tRCKL Input HIGH to LOW (Light Load)

(Pad to R-Cell Input) 2.6 3.0 3.4 3.9 5.5 ns

tRCKH Input LOW to HIGH (50% Load)

(Pad to R-Cell Input) 3.0 3.5 3.9 4.6 6.5 ns

tRCKL Input HIGH to LOW (50% Load)

(Pad to R-Cell Input) 3.3 3.8 4.2 4.9 7.1 ns

tRCKH Input LOW to HIGH (100% Load)

(Pad to R-Cell Input) 3.7 4.3 4.8 5.7 8.0 ns

tRCKL Input HIGH to LOW (100% Load)

(Pad to R-Cell Input) 4.0 4.6 5.1 6.0 8.6 ns

tRPWH Min. Pulse Width HIGH 1.4 1.6 1.8 2.2 3.0 ns

tRPWL Min. Pulse Width LOW 1.4 1.6 1.8 2.2 3.0 ns

tRCKSW Maximum Ske w (Ligh t Load) 1.8 2.1 2.4 2.7 3.8 ns

tRCKSW Maximum Ske w (50% Load) 1.4 1.6 1.9 3.2 ns

tRCKSW Maximum Ske w (100 % Load) 1.5 1.7 2.0 3.4 ns

Preliminary v1.2 47

SX-A Family FPGAs

A54SX72A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

2.5V LVTTL Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 3.3 3.9 4.4 5.2 7.2 ns

tDHL Data-to-Pad HIGH to LOW 2.6 3.0 3.4 4.0 5.5 ns

tDHLS Data-to-Pad HIGH to LOW—low slew 11.7 13.5 15.3 18.0 25.9 ns

tENZL Enable-to-Pad, Z to L 2.4 2.8 3.2 3.7 5.2 ns

tENZLS Data-to-Pad, Z to L—low slew 11.8 13.7 15.5 18.2 25.5 ns

tENZH Enable-to-Pad, Z to H 3.4 4.0 4.5 5.3 7.5 ns

tENLZ Enable-to-Pad, L to Z 2.1 2.5 2.8 3.3 4.7 ns

tENHZ Enable-to-Pad, H to Z 3.4 4.0 4.5 5.3 7.5 ns

dTLH2Delta LOW to HIGH 0.031 0.037 0.043 0.051 0.071 ns/pF

dTHL2Delta HIGH to LOW 0.017 0.017 0.023 0.023 0.037 ns/pF

dTHLS2Delta HIGH to LOW—low slew 0.057 0.060 0.071 0.086 0.117 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

SX-A Family FPGAs

48 Preliminary v1.2

A54SX72A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

3.3V PCI Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 2.0 2.3 2.6 3.0 4.3 ns

tDHL Data-to-Pad HIGH to LOW 2.1 2.4 2.8 3.3 4.6 ns

tENZL Enable-to-Pad, Z to L 1 .4 1.7 1.9 2.2 3.1 ns

tENZH Enable-to-Pad, Z to H 1.4 1.7 1.9 2.2 3.1 ns

tENLZ Enable-to-Pad, L to Z 2.5 2.8 3.2 3.8 5.3 ns

tENHZ Enable-to-Pad, H to Z 2.5 2.8 3.2 3.8 5.3 ns

dTLH3Delta LOW to HIGH 0.025 0.03 0.03 0.04 0.045 ns/pF

dTHL3Delta HIGH to LOW 0.015 0.015 0.015 0.015 0.025 ns/pF

3.3V LVTTL Output Module Timing2

tDLH Data-to-Pad LOW to HIGH 2.7 3.2 3.6 4.2 5.9 ns

tDHL Data-to-Pad HIGH to LOW 2.7 3.1 3.5 4.1 5.8 ns

tDHLS Data-to-Pad HIGH to LOW—low slew 9.6 11.1 12.6 14.8 2 0.7 ns

tENZL Enable-to-Pad, Z to L 2 .2 2.6 2.9 3.4 4.8 ns

tENZLS Enable-to-Pad, Z to L—low slew 15.8 18.9 21.3 25.4 34.9 ns

tENZH Enable-to-Pad, Z to H 2.9 3.3 3.7 4.4 6.2 ns

tENLZ Enable-to-Pad, L to Z 2.9 3.3 3.7 4.4 6.2 ns

tENHZ Enable-to-Pad, H to Z 2.5 2.8 3.2 3.8 5.3 ns

dTLH3Delta LOW to HIGH 0.025 0.03 0.03 0.04 0.045 ns/pF

dTHL3Delta HIGH to LOW 0.015 0.015 0.015 0.015 0.025 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.053 0.053 0.067 0.073 0.1 07 ns/pF

Notes:

1. Delays based on 10 pF loading and 25Ω resistance.

2. Delays based on 35 pF loading.

3. Slew rates measured from 10% to 90% VCCI.

Preliminary v1.2 49

SX-A Family FPGAs

A54SX72A Timing Characteristics (Continued)

(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’

Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

5.0V PCI Output Module Timing1

tDLH Data-to-Pad LOW to HIGH 2.1 2.5 2.8 3.3 4.6 ns

tDHL Data-to-Pad HIGH to LOW 2.8 3.2 3.7 4.3 6.0 ns

tDHLS Data-to-Pad HI GH to LOW—low slew 7.4 8.5 9.6 11.3 15.9 ns

tENZL Enable-to-Pad, Z to L 1.3 1.5 1.7 2.0 2.8 ns

tENZLS Enable-to-Pad, Z to L—low slew 3.5 5.1 5.9 6.9 9.7 ns

tENZH Enable-to-Pad, Z to H 1.3 1.5 1.7 2.0 2.8 ns

tENLZ Enable-to-Pad, L to Z 3.0 3.5 3.9 4.6 6.4 ns

tENHZ Enable-to-Pad, H to Z 3.0 3.5 3.9 4.6 6.4 ns

dTLH3Delta LOW to HIGH 0.016 0.016 0.02 0.022 0.032 ns/pF

dTHL3Delta HIGH to LOW 0.026 0.03 0.032 0.04 0.052 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.04 0.052 0.06 0.07 0.096 ns/pF

5. 0V TTL Output Module Timing2

tDLH Data-to-Pad LOW to HIGH 1.9 2.2 2.5 3.0 4.2 ns

tDHL Data-to-Pad HIGH to LOW 2.6 3.0 3.4 4.0 5.6 ns

tDHLS Data-to-Pad HI GH to LOW—low slew 6.7 7.7 8.8 10.3 14.4 ns

tENZL Enable-to-Pad, Z to L 2.1 2.4 2.7 3.2 4.5 ns

tENZLS Enable-to-Pad, Z to L—low slew 7.4 8.4 9.5 11.0 15.4 ns

tENZH Enable-to-Pad, Z to H 2.3 2.7 3.1 3.6 5.0 ns

tENLZ Enable-to-Pad, L to Z 3.6 4.2 4.7 5.6 7.8 ns

tENHZ Enable-to-Pad, H to Z 3.0 3.5 3.9 4.6 6.4 ns

dTLH3Delta LOW to HIGH 0.014 0.017 0.017 0.023 0.031 ns/pF

dTHL3Delta HIGH to LOW 0.023 0.029 0.031 0.037 0.051 ns/pF

dTHLS3Delta HIGH to LOW—low slew 0.043 0.046 0.057 0.066 0.089 ns/pF

Notes:

1. Delays based on 50 pF loading.

2. Delays based on 35 pF loading.

3. Slew rates measured from 10% to 90% VCCI.

SX-A Family FPGAs

50 Preliminary v1.2

Pin Description

CLKA/B Clock A and B

These pins are clock inputs for clock distribution networks.

Input levels are compatible with standard TTL, LVTTL, 3.3V

PCI or 5.0V PCI specifications. The clock input is buffered

prior to clocking the R-cells. If not used, this pin must be set

LOW or HIGH on the board. It must not be left floating. (For

A54SX72A, these clocks can be configured as user I/O.)

QCLKA/B/C/D, Quadrant Clock A, B, C, and D

I/O

These four pins are the quadrant clock inputs and are only

for A54SX72A. They are clock inputs for clock distribution

networks. Input levels are compatible with standard TTL,

LVTTL, 3.3V PCI or 5.0V PCI specifications. Each of these

clock inputs can drive up to a quarter of the chip, or they

can be grouped together to drive multiple quadrants. The

clock input is buffered prior to clocking the R-cells. If not

used as a clock it will behave as a regular I/O.

GND Ground

LOW supply voltage.

HCLK Dedicated (Hard-wired)

Array Clock

This pin is the clock input for sequential modules. Input

levels are compatible with standard TTL, LVTTL, 3.3V PCI or

5.0V PCI specifications. This input is directly wired to each

R-cell and offers clock speeds independent of the number of

R-cells being driven. If not used, this pin must be set LOW or

HIGH on the board. It must not be left floating.

I/O Input/Output

The I/O pin functions as an input, output, tristate, or

bidirectional buffer. Based on certain configurations, input

and output levels are compatible with standard TTL, LVTTL,

3.3V PCI or 5.0V PCI specifications. Unused I/O pins are

automatically tristated by the Designer Series software.

NC No Connection

This pin is not connected to circuitry within the device.

These pins can be driven to any voltage or can be left

floating with no effect on the operation of the device.

PRA, PRB, Probe A/B

I/O

The Probe pin is used to output data from any user-defined

design node within the device. This independent diagnostic

pin can be used in conjunction with the other probe pin to

allow real-time diagnostic output of any signal path within

the device. The Probe pin can be used as a user-defined I/O

when verification has been completed. The pin’s probe

capabilities can be permanently disabled to protect

programmed design confidentiality.

TCK, I/O Test Clock

Test clock input for diagnostic probe and device

programming. In flexible mode, TCK becomes active when

the TMS pin is set LOW (refer to Table 3 on page 10). This

pin functions as an I/O when the boundary scan state

machine reaches the “logic reset” state.

TDI, I/O Test Data Input

Serial input for boundary scan testing and diagnostic probe.

In flexible mode, TDI is active when the TMS pin is set LOW

(refer to Table 3 on page 10). This pin functions as an I/O

when the boundary scan state machine reaches the “logic

reset” state.

TDO, I/O Test Data Output

Serial output for boundary scan testing. In flexible mode,

TDO is active when the TMS pin is set LOW (refer to Table 3

on page 10). This pin functions as an I/O when the boundary

scan state machine reaches the “logic reset” state.

TMS Test Mode Select

The TMS pin controls the use of the IEEE 1149.1 Boundary

Scan pins (TCK, TDI, TDO, TRST). In flexible mode when

the TMS pin is set LOW, the TCK, TDI, and TDO pins are

boundary scan pins (refer to Table 3 on page 10). Once the

boundary scan pins are in test mode, they will remain in that

mode until the internal boundary scan state machine

reaches the “logic reset” state. At this point, the boundary

scan pins will be released and will function as regular I/O

pins. The “logic reset” state is reached 5 TCK cycles after

the TMS pin is set HIGH. In dedicated test mode, TMS

functions as specified in the IEEE 1149.1 specifications.

TRST, I/O Boundary Scan Reset Pin

Once it is configured as the JTAG Reset pin, the TRST pin

functions as an active-low input to asynchronously initialize

or reset the boundary scan circuit. The TRST pin is equipped

with an internal pull-up resistor. This pin functions as an I/O

when the “Reserve JTAG Reset Pin” is not selected in

Designer.

VCCI Supply Voltage

Supply voltage for I/Os. See Table 2 on page 10.

VCCA Supply Voltage

Supply voltage for Array. See Table 2 on page 10.

Preliminary v1.2 51

SX-A Family FPGAs

Package Pin Assignments

208-Pin PQFP (Top View)

208-Pin PQFP

208

SX-A Family FPGAs

52 Preliminary v1.2

208-Pin PQFP

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function A54SX72A

Function

1GNDGNDGNDGND

2 TDI, I/O TDI, I/O TDI, I/O TDI, I/O

3 I/O I/O I/O I/O

4 NC I/O I/O I/O

5 I/O I/O I/O I/O

6 NC I/O I/O I/O

7 I/O I/O I/O I/O

8 I/O I/O I/O I/O

9 I/O I/O I/O I/O

10 I/O I/O I/O I/O

11 TMS TMS TMS TMS

12 VCCI VCCI VCCI VCCI

13 I/O I/O I/O I/O

14 NC I/O I/O I/O

15 I/O I/O I/O I/O

16 I/O I/O I/O I/O

17 NC I/O I/O I/O

18 I/O I/O I/O GND

19 I/O I/O I/O VCCA

20 NC I/O I/O I/O

21 I/O I/O I/O I/O

22 I/O I/O I/O I/O

23 NC I/O I/O I/O

24 I/O I/O I/O I/O

25 NC NC NC I/O

26 GNDGNDGNDGND

27 VCCA VCCA VCCA VCCA

28 GNDGNDGNDGND

29 I/O I/O I/O I/O

30 TRST, I/O TRST, I/O TRST, I/O TRST, I/O

31 NC I/O I/O I/O

32 I/O I/O I/O I/O

33 I/O I/O I/O I/O

34 I/O I/O I/O I/O

35 NC I/O I/O I/O

36 I/O I/O I/O I/O

37 I/O I/O I/O I/O

38 I/O I/O I/O I/O

39 NC I/O I/O I/O

40 VCCI VCCI VCCI VCCI

41 VCCA VCCA VCCA VCCA

42 I/O I/O I/O I/O

43 I/O I/O I/O I/O

44 I/O I/O I/O I/O

45 I/O I/O I/O I/O

46 I/O I/O I/O I/O

Preliminary v1.2 53

SX-A Family FPGAs

47 I/O I/O I/O I/O

48 NC I/O I/O I/O

49 I/O I/O I/O I/O

50 NC I/O I/O I/O

51 I/O I/O I/O I/O

52 GNDGNDGNDGND

53 I/O I/O I/O I/O

54 I/O I/O I/O I/O

55 I/O I/O I/O I/O

56 I/O I/O I/O I/O

57 I/O I/O I/O I/O

58 I/O I/O I/O I/O

59 I/O I/O I/O I/O

60 VCCI VCCI VCCI VCCI

61 NC I/O I/O I/O

62 I/O I/O I/O I/O

63 I/O I/O I/O I/O

64 NC I/O I/O I/O

65 I/O I/O NC I/O

66 I/O I/O I/O I/O

67 NC I/O I/O I/O

68 I/O I/O I/O I/O

69 I/O I/O I/O I/O

70 NC I/O I/O I/O

71 I/O I/O I/O I/O

72 I/O I/O I/O I/O

73 NC I/O I/O I/O

74 I/O I/O I/O QCLKA

75 NC I/O I/O I/O

76 PRB, I/O PRB, I/O PRB, I/O PRB,I/O

77 GNDGNDGNDGND

78 VCCA VCCA VCCA VCCA

79 GNDGNDGNDGND

80 NC NC NC NC

81 I/O I/O I/O I/O

82 HCLK HCLK HCLK HCLK

83 I/O I/O I/O VCCI

84 I/O I/O I/O QCLKB

85 NC I/O I/O I/O

86 I/O I/O I/O I/O

87 I/O I/O I/O I/O

88 NC I/O I/O I/O

89 I/O I/O I/O I/O

90 I/O I/O I/O I/O

91 NC I/O I/O I/O

92 I/O I/O I/O I/O

208-Pin PQFP (Continued)

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function A54SX72A

Function

SX-A Family FPGAs

54 Preliminary v1.2

93 I/O I/O I/O I/O

94 NC I/O I/O I/O

95 I/O I/O I/O I/O

96 I/O I/O I/O I/O

97 NC I/O I/O I/O

98 VCCI VCCI VCCI VCCI

99 I/O I/O I/O I/O

100 I/O I/O I/O I/O

101 I/O I/O I/O I/O

102 I/O I/O I/O I/O

103 TDO, I/O TDO, I/O TDO, I/O TDO, I/O

104 I/O I/O I/O I/O

105 GND GND GND GND

106 NC I/O I/O I/O

107 I/O I/O I/O I/O

108 NC I/O I/O I/O

109 I/O I/O I/O I/O

110 I/O I/O I/O I/O

111 I/O I/O I/O I/O

112 I/O I/O I/O I/O

113 I/O I/O I/O I/O

114 VCCA VCCA VCCA VCCA

115 VCCI VCCI VCCI VCCI

116 NC I/O I/O GND

117 I/O I/O I/O VCCA

118 I/O I/O I/O I/O

119 NC I/O I/O I/O

120 I/O I/O I/O I/O

121 I/O I/O I/O I/O

122 NC I/O I/O I/O

123 I/O I/O I/O I/O

124 I/O I/O I/O I/O

125 NC I/O I/O I/O

126 I/O I/O I/O I/O

127 I/O I/O I/O I/O

128 I/O I/O I/O I/O

129 GND GND GND GND

130 VCCA VCCA VCCA VCCA

131 GND GND GND GND

132NCNCNCI/O

133 I/O I/O I/O I/O

134 I/O I/O I/O I/O

135 NC I/O I/O I/O

136 I/O I/O I/O I/O

137 I/O I/O I/O I/O

138 NC I/O I/O I/O

208-Pin PQFP (Continued)

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function A54SX72A

Function

Preliminary v1.2 55

SX-A Family FPGAs

139 I/O I/O I/O I/O

140 I/O I/O I/O I/O

141 NC I/O I/O I/O

142 I/O I/O I/O I/O

143 NC I/O I/O I/O

144 I/O I/O I/O I/O

145 VCCA VCCA VCCA VCCA

146 GND GND GND GND

147 I/O I/O I/O I/O

148 VCCI VCCI VCCI VCCI

149 I/O I/O I/O I/O

150 I/O I/O I/O I/O

151 I/O I/O I/O I/O

152 I/O I/O I/O I/O

153 I/O I/O I/O I/O

154 I/O I/O I/O I/O

155 NC I/O I/O I/O

156 NC I/O I/O I/O

157 GND GND GND GND

158 I/O I/O I/O I/O

159 I/O I/O I/O I/O

160 I/O I/O I/O I/O

161 I/O I/O I/O I/O

162 I/O I/O I/O I/O

163 I/O I/O I/O I/O

164 VCCI VCCI VCCI VCCI

165 I/O I/O I/O I/O

166 I/O I/O I/O I/O

167 NC I/O I/O I/O

168 I/O I/O I/O I/O

169 I/O I/O I/O I/O

170 NC I/O I/O I/O

171 I/O I/O I/O I/O

172 I/O I/O I/O I/O

173 NC I/O I/O I/O

174 I/O I/O I/O I/O

175 I/O I/O I/O I/O

176 NC I/O I/O I/O

177 I/O I/O I/O I/O

178 I/O I/O I/O QCLKD

179 I/O I/O I/O I/O

180 CLKA CLKA CLKA CLKA

181 CLKB CLKB CLKB CLKB

182NCNCNCNC

183 GND GND GND GND

184 VCCA VCCA VCCA VCCA

208-Pin PQFP (Continued)

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function A54SX72A

Function

SX-A Family FPGAs

56 Preliminary v1.2

185 GND GND GND GND

186 PRA, I/O PRA, I/O PRA, I/O PRA, I/O

187 I/O I/O I/O VCCI

188 I/O I/O I/O I/O

189 NC I/O I/O I/O

190 I/O I/O I/O QCLKC

191 I/O I/O I/O I/O

192 NC I/O I/O I/O

193 I/O I/O I/O I/O

194 I/O I/O I/O I/O

195 NC I/O I/O I/O

196 I/O I/O I/O I/O

197 I/O I/O I/O I/O

198 NC I/O I/O I/O

199 I/O I/O I/O I/O

200 I/O I/O I/O I/O

201 VCCI VCCI VCCI VCCI

202 NC I/O I/O I/O

203 NC I/O I/O I/O

204 I/O I/O I/O I/O

205 NC I/O I/O I/O

206 I/O I/O I/O I/O

207 I/O I/O I/O I/O

208 TCK, I/O TCK, I/O TCK, I/O TCK, I/O

208-Pin PQFP (Continued)

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function A54SX72A

Function

Preliminary v1.2 57

SX-A Family FPGAs

Package Pin Assignments (Continued)

100-Pin TQFP (Top View)

100-Pin

TQFP

100

SX-A Family FPGAs

58 Preliminary v1.2

100-TQFP

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function

1 GND GND GND 51 GND GND GND

2 TD I, I/O TDI, I/O TD I, I/O 5 2 I/O I/O I/ O

3 I/O I/O I/O 53 I/O I/O I/O

4 I/O I/O I/O 54 I/O I/O I/O

5 I/O I/O I/O 55 I/O I/O I/O

6 I/O I/O I/O 56 I/O I/O I/O

7 TMS TMS TMS 57 VCCA VCCA VCCA

CCI VCCI VCCI 58 VCCI VCCI VCCI

9 GND GND GND 59 I/O I/O I/O

10 I/O I/O I/O 60 I/O I/O I/O

11 I/O I/O I/O 61 I/O I/O I/O

12 I/O I/O I/O 62 I/O I/O I/O

13 I/O I/O I/O 63 I/O I/O I/O

14 I/O I/O I/O 64 I/O I/O I/O

15 I/O I/O I/O 65 I/O I/O I/O

16 TRST, I/O TRST, I/O TRST, I/O 66 I/O I/O I/O

17 I/O I/O I/O 67 VCCA VCCA VCCA

18 I/O I/O I/O 68 GND GND GND

19 I/O I/O I/O 69 GND GND GND

20 VCCI VCCI VCCI 70 I/O I/O I/O

21 I/O I/O I/O 71 I/O I/O I/O

22 I/O I/O I/O 72 I/O I/O I/O

23 I/O I/O I/O 73 I/O I/O I/O

24 I/O I/O I/O 74 I/O I/O I/O

25 I/O I/O I/O 75 I/O I/O I/O

26 I/O I/O I/O 76 I/O I/O I/O

27 I/O I/O I/O 77 I/O I/O I/O

28 I/O I/O I/O 78 I/O I/O I/O

29 I/O I/O I/O 79 I/O I/O I/O

30 I/O I/O I/O 80 I/O I/O I/O

31 I/O I/O I/O 81 I/O I/O I/O

32 I/O I/O I/O 82 VCCI VCCI VCCI

33 I/O I/O I/O 83 I/O I/O I/O

34 PR B , I/O PRB, I/O PRB, I/ O 8 4 I/O I/O I/O

35 VCCA VCCA VCCA 85 I/O I/O I/O

36 GND GND GND 86 I/O I/O I/O

37 NC NC NC 87 CLKA CLKA CLKA

38 I/O I/O I/O 88 CLKB CLKB CLKB

39 HCLK HCLK HCLK 89 NC NC NC

40 I/O I/O I/O 90 VCCA VCCA VCCA

41 I/O I/O I/O 91 GND GND GND

42 I/O I/O I/O 92 PRA, I/O PRA, I/O PRA, I/O

43 I/O I/O I/O 93 I/O I/O I/O

44 VCCI VCCI VCCI 94 I/O I/O I/O

45 I/O I/O I/O 95 I/O I/O I/O

46 I/O I/O I/O 96 I/O I/O I/O

47 I/O I/O I/O 97 I/O I/O I/O

48 I/O I/O I/O 98 I/O I/O I/O

49 TDO, I/O TDO, I/O TDO, I/O 99 I/O I/O I/O

50 I /O I/O I/ O 10 0 TCK , I/O TC K , I/O TCK, I/O

Preliminary v1.2 59

SX-A Family FPGAs

Package Pin Assignments (continued)

144-Pin TQFP (Top View)

144

144-Pin

TQFP

SX-A Family FPGAs

60 Preliminary v1.2

144-Pin TQFP

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function

1 GND GND GND 39 I/O I/O I/O

2 TDI, I/O TDI, I/O TDI, I/O 40 I/O I/O I/O

3 I/O I/O I/O 41 I/O I/O I/O

4 I/O I/O I/O 42 I/O I/O I/O

5 I/O I/O I/O 43 I/O I/O I/O

6 I/O I/O I/O 44 VCCI VCCI VCCI

7 I/O I/O I/O 45 I/O I/O I/O

8 I/O I/O I/O 46 I/O I/O I/O

9 TMS TMS TMS 47 I/O I/O I/O

10 VCCI VCCI VCCI 48 I/O I/O I/O

11 GND GND GND 49 I/O I/O I/O

12 I/O I/O I/O 50 I/O I/O I/O

13 I/O I/O I/O 51 I/O I/O I/O

14 I/O I/O I/O 52 I/O I/O I/O

15 I/O I/O I/O 53 I/O I/O I/O

16 I/O I/O I/O 54 PRB, I/O PRB, I/O PRB, I/O

17 I/O I/O I/O 55 I/O I/O I/O

18 I/O I/O I/O 56 VCCA VCCA VCCA

19 NC NC NC 57 GND GND GND

20 VCCA VCCA VCCA 58 NC NC NC

21 I/O I/O I/O 59 I/O I/O I/O

22 TRST, I/O TRST, I/O TRST, I/O 60 HCLK HCLK HCLK

23 I/O I/O I/O 61 I/O I/O I/O

24 I/O I/O I/O 62 I/O I/O I/O

25 I/O I/O I/O 63 I/O I/O I/O

26 I/O I/O I/O 64 I/O I/O I/O

27 I/O I/O I/O 65 I/O I/O I/O

28 GND GND GND 66 I/O I/O I/O

29 VCCI VCCI VCCI 67 I/O I/O I/O

30 VCCA VCCA VCCA 68 VCCI VCCI VCCI

31 I/O I/O I/O 69 I/O I/O I/O

32 I/O I/O I/O 70 I/O I/O I/O

33 I/O I/O I/O 71 TDO, I/O TDO, I/O TDO, I/O

34 I/O I/O I/O 72 I/O I/O I/O

35 I/O I/O I/O 73 GND GND GND

36 GND GND GND 74 I/O I/O I/O

37 I/O I/O I/O 75 I/O I/O I/O

38 I/O I/O I/O 76 I/O I/O I/O

Preliminary v1.2 61

SX-A Family FPGAs

77 I/O I/O I/O 111 I/O I/O I/O

78 I/O I/O I/O 112 I/O I/O I/O

79 VCCA VCCA VCCA 113 I/O I/O I/O

80 VCCI VCCI VCCI 114 I/O I/O I/O

81 GND GND GND 115 VCCI VCCI VCCI

82 I/O I/O I/O 116 I/O I/O I/O

83 I/O I/O I/O 117 I/O I/O I/O

84 I/O I/O I/O 118 I/O I/O I/O

85 I/O I/O I/O 119 I/O I/O I/O

86 I/O I/O I/O 120 I/O I/O I/O

87 I/O I/O I/O 121 I/O I/O I/O

88 I/O I/O I/O 122 I/O I/O I/O

89 VCCA VCCA VCCA 123 I/O I/O I/O

90 NC NC NC 124 I/O I/O I/O

91 I/O I/O I/O 125 CLKA CLKA CLKA

92 I/O I/O I/O 126 CLKB CLKB CLKB

93 I/O I/O I/O 127 NC NC NC

94 I/O I/O I/O 128 GND GND GND

95 I/O I/O I/O 129 VCCA VCCA VCCA

96 I/O I/O I/O 130 I/O I/O I/O

97 I/O I/O I/O 131 PRA, I/O PRA, I/O PRA, I/O

98 VCCA VCCA VCCA 132 I/O I/O I/O

99 GND GND GND 133 I/O I/O I/O

100 I/O I/O I/O 134 I/O I/O I/O

101 GND GND GND 135 I/O I/O I/O

102 VCCI VCCI VCCI 136 I/O I/O I/O

103 I/O I/O I/O 137 I/O I/O I/O

104 I/O I/O I/O 138 I/O I/O I/O

105 I/O I/O I/O 139 I/O I/O I/O

106 I/O I/O I/O 140 VCCI VCCI VCCI

107 I/O I/O I/O 141 I/O I/O I/O

108 I/O I/O I/O 142 I/O I/O I/O

109 GND GND GND 143 I/O I/O I/O

110 I/O I/O I/O 144 TCK, I/O TCK, I/O TCK, I/O

144-Pin TQFP (Continued)

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function

SX-A Family FPGAs

62 Preliminary v1.2

Package Pin Assignments (Continued)

176-Pin TQFP (Top View)

176-Pin

TQFP

176

Preliminary v1.2 63

SX-A Family FPGAs

176-Pin TQFP

Number A54SX32A

Function Pin

Number A54SX32A

Function Pin

Number A54SX32A

Function Pin

Number A54SX32A

Function

1 GND 46 I/O 91 I/O 136 I/O

2 TDI, I/O 47 I/O 92 I/O 137 I/O

3 I/O 48 I/O 93 I/O 138 I/O

4 I/O 49 I/O 94 I/O 139 I/O

5 I/O 50 I/O 95 I/O 140 VCCI

6 I/O 51 I/O 96 I/O 141 I/O

7I/O 52V

CCI 97 I/O 142 I/O

8 I/O 53 I/O 98 VCCA 143 I/O

9 I/O 54 I/O 99 VCCI 144 I/O

10 TMS 55 I/O 100 I/O 145 I/O

11 VCCI 56 I/O 101 I/O 146 I/O

12 I/O 57 I/O 102 I/O 147 I/O

13 I/O 58 I/O 103 I/O 148 I/O

14 I/O 59 I/O 104 I/O 149 I/O

15 I/O 60 I/O 105 I/O 150 I/O

16 I/O 61 I/O 106 I/O 151 I/O

17 I/O 62 I/O 107 I/O 152 CLKA

18 I/O 63 I/O 108 GND 153 CLKB

19 I/O 64 PRB, I/O 109 VCCA 154 NC

20 I/O 65 GND 110 GND 155 GND

21 GND 66 VCCA 111 I/O 156 VCCA

22 VCCA 67 NC 112 I/O 157 PRA, I/O

23 GND 68 I/O 113 I/O 158 I/O

24 I/O 69 HCLK 114 I/O 159 I/O

25 TRST, I/O 70 I/O 115 I/O 160 I/O

26 I/O 71 I/O 116 I/O 161 I/O

27 I/O 72 I/O 117 I/O 162 I/O

28 I/O 73 I/O 118 I/O 163 I/O

29 I/O 74 I/O 119 I/O 164 I/O

30 I/O 75 I/O 120 I/O 165 I/O

31 I/O 76 I/O 121 I/O 166 I/O

32 VCCI 77 I/O 122 VCCA 167 I/O

33 VCCA 78 I/O 123 GND 168 I/O

34 I/O 79 I/O 124 VCCI 169 VCCI

35 I/O 80 I/O 125 I/O 170 I/O

36 I/O 81 I/O 126 I/O 171 I/O

37 I/O 82 VCCI 127 I/O 172 I/O

38 I/O 83 I/O 128 I/O 173 I/O

39 I/O 84 I/O 129 I/O 174 I/O

40 I/O 85 I/O 130 I/O 175 I/O

41 I/O 86 I/O 131 I/O 176 TCK, I/O

42 I/O 87 TDO, I/O 132 I/O

43 I/O 88 I/O 133 GND

44 GND 89 GND 134 I/O

45 I/O 90 I/O 135 I/O

SX-A Family FPGAs

64 Preliminary v1.2

Package Pin Assignments (Continued)

329-Pin PBGA (Top View)

2322212019181716151410 11 12 13987654321

Preliminary v1.2 65

SX-A Family FPGAs

329-Pin PBGA

Pin Number A54SX32A

Function Pin Number A54SX32A

Function

A1 GND AA23 VCCI AC22 VCCI C21 VCCI

A2 GND AB1 I/O AC23 GND C22 GND

A3 VCCI AB2 GND B1 VCCI C23 NC

A4 NC AB3 I/O B2 GND D1 I/O

A5 I/O AB4 I/O B3 I/O D2 I/O

A6 I/O AB5 I/O B4 I/O D3 I/O

A7 VCCI AB6 I/O B5 I/O D4 TCK, I/O

A8 NC AB7 I/O B6 I/O D5 I/O

A9 I/O AB8 I/O B7 I/O D6 I/O

A10 I/O AB9 I/O B8 I/O D7 I/O

A11 I/O AB10 I/O B9 I/O D8 I/O

A12 I/O AB11 PRB, I/O B10 I/O D9 I/O

A13 CLKB AB12 I/O B11 I/O D10 I/O

A14 I/O AB13 HCLK B12 PRA, I/O D11 VCCA

A15 I/O AB14 I/O B13 CLKA D12 NC

A16 I/O AB15 I/O B14 I/O D13 I/O

A17 I/O AB16 I/O B15 I/O D14 I/O

A18 I/O AB17 I/O B16 I/O D15 I/O

A19 I/O AB18 I/O B17 I/O D16 I/O

A20 I/O AB19 I/O B18 I/O D17 I/O

A21 NC AB20 I/O B19 I/O D18 I/O

A22 VCCI AB21 I/O B20 I/O D19 I/O

A23 GND AB22 GND B21 I/O D20 I/O

AA1 VCCI AB23 I/O B22 GND D21 I/O

AA2 I/O AC1 GND B23 VCCI D22 I/O

AA3 GND AC2 VCCI C1 NC D23 I/O

AA4 I/O AC3 NC C2 TDI, I/O E1 VCCI

AA5 I/O AC4 I/O C3 GND E2 I/O

AA6 I/O AC5 I/O C4 I/O E3 I/O

AA7 I/O AC6 I/O C5 I/O E4 I/O

AA8 I/O AC7 I/O C6 I/O E20 I/O

AA9 I/O AC8 I/O C7 I/O E21 I/O

AA10 I/O AC9 VCCI C8 I/O E22 I/O

AA11 I/O AC10 I/O C9 I/O E23 I/O

AA12 I/O AC11 I/O C10 I/O F1 I/O

AA13 I/O AC12 I/O C11 I/O F2 TMS

AA14 I/O AC13 I/O C12 I/O F3 I/O

AA15 I/O AC14 I/O C13 I/O F4 I/O

AA16 I/O AC15 NC C14 I/O F20 I/O

AA17 I/O AC16 I/O C15 I/O F21 I/O

AA18 I/O AC17 I/O C16 I/O F22 I/O

AA19 I/O AC18 I/O C17 I/O F23 I/O

AA20 TDO, I/O AC19 I/O C18 I/O G1 I/O

AA21 VCCI AC20 I/O C19 I/O G2 I/O

AA22 I/O AC21 NC C20 I/O G3 I/O

SX-A Family FPGAs

66 Preliminary v1.2

G4 I/O L20 NC R1 I/O Y4 GND

G20 I/O L21 I/O R2 I/O Y5 I/O

G21 I/O L22 I/O R3 I/O Y6 I/O

G22 I/O L23 NC R4 I/O Y7 I/O

G23 GND M1 I/O R20 I/O Y8 I/O

H1 I/O M2 I/O R21 I/O Y9 I/O

H2 I/O M3 I/O R22 I/O Y10 I/O

H3 I/O M4 VCCA R23 I/O Y11 I/O

H4 I/O M10 GND T1 I/O Y12 VCCA

H20 VCCA M11 GND T2 I/O Y13 NC

H21 I/O M12 GND T3 I/O Y14 I/O

H22 I/O M13 GND T4 I/O Y15 I/O

H23 I/O M14 GND T20 I/O Y16 I/O

J1 NC M20 VCCA T21 I/O Y17 I/O

J2 I/O M21 I/O T22 I/O Y18 I/O

J3 I/O M22 I/O T23 I/O Y19 I/O

J4 I/O M23 VCCI U1 I/O Y20 GND

J20 I/O N1 I/O U2 I/O Y21 I/O

J21 I/O N2 TRST, I/O U3 VCCA Y22 I/O

J22 I/O N3 I/O U4 I/O Y23 I/O

J23 I/O N4 I/O U20 I/O

K1 I/O N10 GND U21 VCCA

K2 I/O N11 GND U22 I/O

K3 I/O N12 GND U23 I/O

K4 I/O N13 GND V1 VCCI

K10 GND N14 GND V2 I/O

K11 GND N20 NC V3 I/O

K12 GND N21 I/O V4 I/O

K13 GND N22 I/O V20 I/O

K14 GND N23 I/O V21 I/O

K20 I/O P1 I/O V22 I/O

K21 I/O P2 I/O V23 I/O

K22 I/O P3 I/O W1 I/O

K23 I/O P4 I/O W2 I/O

L1 I/O P10 GND W3 I/O

L2 I/O P11 GND W4 I/O

L3 I/O P12 GND W20 I/O

L4 NC P13 GND W21 I/O

L10 GND P14 GND W22 I/O

L11 GND P20 I/O W23 NC

L12 GND P21 I/O Y1 NC

L13 GND P22 I/O Y2 I/O

L14 GND P23 I/O Y3 I/O

329-Pin PBGA (Continued)

Pin Number A54SX32A

Function Pin Number A54SX32A

Function

Preliminary v1.2 67

SX-A Family FPGAs

Package Pin Assignments (Continued)

144-Pin FBGA (Top View)

12345678910 11 12

Preliminary v1.2 68

SX-A Family FPGAs

144-Pin FBGA

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function

A1 I/O I/O I/O D3 TDI, I/O TDI, I/O TDI, I/O

A2 I/O I/O I/O D4 I/O I/O I/O

A3 I/O I/O I/O D5 I/O I/O I/O

A4 I/O I/O I/O D6 I/O I/O I/O

A5 VCCA VCCA VCCA D7 I/O I/O I/O

A6 GND GND GND D8 I/O I/O I/O

A7 CLKA CLKA CLKA D9 I/O I/O I/O

A8 I/O I/O I/O D10 I/O I/O I/O

A9 I/O I/O I/O D11 I/O I/O I/O

A10 I/O I/O I/O D12 I/O I/O I/O

A11 I/O I/O I/O E1 I/O I/O I/O

A12 I/O I/O I/O E2 I/O I/O I/O

B1 I/O I/O I/O E3 I/O I/O I/O

B2 GND GND GND E4 I/O I/O I/O

B3 I/O I/O I/O E5 TMS TMS TMS

B4 I/O I/O I/O E6 VCCI VCCI VCCI

B5 I/O I/O I/O E7 VCCI VCCI VCCI

B6 I/O I/O I/O E8 VCCI VCCI VCCI

B7 CLKB CLKB CLKB E9 VCCA VCCA VCCA

B8 I/O I/O I/O E10 I/O I/O I/O

B9 I/O I/O I/O E11 GND GND GND

B10 I/O I/O I/O E12 I/O I/O I/O

B11 GND GND GND F1 I/O I/O I/O

B12 I/O I/O I/O F2 I/O I/O I/O

C1 I/O I/O I/O F3 NC NC NC

C2 I/O I/O I/O F4 I/O I/O I/O

C3 TCK, I/O TCK, I/O T CK, I/O F5 GND GND GND

C4 I/O I/O I/O F6 GND GND GND

C5 I/O I/O I/O F7 GND GND GND

C6 PRA, I/O PRA, I/O PRA, I/O F8 VCCI VCCI VCCI

C7 I/O I/O I/O F9 I/O I/O I/O

C8 I/O I/O I/O F10 GND GND GND

C9 I/O I/O I/O F11 I/O I/O I/O

C10 I/O I/O I/O F12 I/O I/O I/O

C11 I/O I/O I/O G1 I/O I/O I/O

C12 I/O I/O I/O G2 GND GND GND

D1 I/O I/O I/O G3 I/O I/O I/O

D2 VCCI VCCI VCCI G4 I/O I/O I/O

Preliminary v1.2 69

SX-A Family FPGAs

G5 GND GND GND K3 I/O I/O I/O

G6 GND GND GND K4 I/O I/O I/O

G7 GND GND GND K5 I/O I/O I/O

G8 VCCI VCCI VCCI K6 I/O I/O I/O

G9 I/O I/O I/O K7 GND GND GND

G10 I/O I/O I/O K8 I/O I/O I/O

G11 I/O I/O I/O K9 I/O I/O I/O

G12 I/O I/O I/O K10 GND GND GND

H1 TRST, I/O TRST, I/O TRST, I/O K11 I/O I/O I/O

H2 I/O I/O I/O K12 I/O I/O I/O

H3 I/O I/O I/O L1 GND GND GND

H4 I/O I/O I/O L2 I/O I/O I/O

H5 VCCA VCCA VCCA L3 I/O I/O I/O

H6 VCCA VCCA VCCA L4 I/O I/O I/O

H7 VCCI VCCI VCCI L5 I/O I/O I/O

H8 VCCI VCCI VCCI L6 I/O I/O I/O

H9 VCCA VCCA VCCA L7 HCLK HCLK HCLK

H10 I/O I/O I/O L8 I/O I/O I/O

H11 I/O I/O I/O L9 I/O I/O I/O

H12 NC NC NC L10 I/O I/O I/O

J1 I/O I/O I/O L11 I/O I/O I/O

J2 I/O I/O I/O L12 I/O I/O I/O

J3 I/O I/O I/O M1 I/O I/O I/O

J4 I/O I/O I/O M2 I/O I/O I/O

J5 I/O I/O I/O M3 I/O I/O I/O

J6 PRB, I/O PRB, I/O PRB, I/O M4 I/O I/O I/O

J7 I/O I/O I/O M5 I/O I/O I/O

J8 I/O I/O I/O M6 I/O I/O I/O

J9 I/O I/O I/O M7 VCCA VCCA VCCA

J10 I/O I/O I/O M8 I/O I/O I/O

J11 I/O I/O I/O M9 I/O I/O I/O

J12 VCCA VCCA VCCA M10 I/O I/O I/O

K1 I/O I/O I/O M11 TDO, I/O TDO, I/O TDO, I/O

K2 I/O I/O I/O M12 I/O I/O I/O

144-Pin FBGA (Continued)

Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function Pin Number A54SX08A

Function A54SX16A

Function A54SX32A

Function

Preliminary v1.2 70

SX-A Family FPGAs

Package Pin Assignments (Continued)

256-Pin FBGA (Top View)

1357911

13 15

246

810 12 14 16

Preliminary v1.2 71

SX-A Family FPGAs

256-Pin FBGA

Pin Number A54SX16A

Function A54SX32A

Function A54SX72A

Function Pin Number A54SX16A

Function A54SX32A

Function A54SX72A

Function

A1 GND GND GND C13 I/O I/O I/O

A2 TCK, I/O TCK, I/O TCK, I/O C14 I/O I/O I/O

A3 I/O I/O I/O C15 I/O I/O I/O

A4 I/O I/O I/O C16 I/O I/O I/O

A5 I/O I/O I/O D1 I/O I/O I/O

A6 I/O I/O I/O D2 I/O I/O I/O

A7 I/O I/O I/O D3 I/O I/O I/O

A8 I/O I/O I/O D4 I/O I/O I/O

A9 CLKB CLKB CLKB D5 I/O I/O I/O

A10 I/O I/O I/O D6 I/O I/O I/O

A11 I/O I/O I/O D7 I/O I/O I/O

A12 NC I/O I/O D8 P RA, I/O PRA, I/O PRA, I/O

A13 I/O I/O I/O D9 I/O I/O QCLKD

A14 I/O I/O I/O D10 I/O I/O I/O

A15 GND GND GND D11 NC I/O I/O

A16 GND GND GND D12 I/O I/O I/O

B1 I/O I/O I/O D13 I/O I/O I/O

B2 GND GND GND D14 I/O I/O I/O

B3 I/O I/O I/O D15 I/O I/O I/O

B4 I/O I/O I/O D16 I/O I/O I/O

B5 I/O I/O I/O E1 I/O I/O I/O

B6 NC I/O I/O E2 I/O I/O I/O

B7 I/O I/O I/O E3 I/O I/O I/O

B8 VCCA VCCA VCCA E4 I/O I/O I/O

B9 I/O I/O I/O E5 I/O I/O I/O

B10 I/O I/O I/O E6 I/O I/O I/O

B11 NC I/O I/O E7 I/O I/O QCLKC

B12 I/O I/O I/O E8 I/O I/O I/O

B13 I/O I/O I/O E9 I/O I/O I/O

B14 I/O I/O I/O E10 I/O I/O I/O

B15 GND GND GND E11 I/O I/O I/O

B16 I/O I/O I/O E12 I/O I/O I/O

B16 I/O I/O I/O E13 NC I/O I/O

C1 I/O I/O I/O E14 I/O I/O I/O

C2 T DI, I/O TDI, I/O TDI, I/O E15 I/O I/O I/O

C3 GND GND GND E16 I/O I/O I/O

C4 I/O I/O I/O F1 I/O I/O I/O

C5 NC I/O I/O F2 I/O I/O I/O

C6 I/O I/O I/O F3 I/O I/O I/O

C7 I/O I/O I/O F4 TMS TMS TMS

C8 I/O I/O I/O F5 I/O I/O I/O

C9 CLKA CLKA CLKA F6 I/O I/O I/O

C10 I/O I/O I/O F7 VCCI VCCI VCCI

C11 I/O I/O I/O F8 VCCI VCCI VCCI

C12 I/O I/O I/O F9 VCCI VCCI VCCI

SX-A Family FPGAs

72 Peliminary v1.2

F10 VCCI VCCI VCCI J7 GND GND GND

F11 I/O I/O I/O J8 GND GND GND

F12 VCCA VCCA VCCA J9 GND GND GND

F13 I/O I/O I/O J10 GND GND GND

F14 I/O I/O I/O J11 VCCI VCCI VCCI

F15 I/O I/O I/O J12 I/O I/O I/O

F16 I/O I/O I/O J13 I/O I/O I/O

G1 NC I/O I/O J14 I/O I/O I/O

G2 I/O I/O I/O J15 I/O I/O I/O

G3 NC I/O I/O J16 I/O I/O I/O

G4 I/O I/O I/O K1 I/O I/O I/O

G5 I/O I/O I/O K2 I/O I/O I/O

G6 VCCI VCCI VCCI K3 NC I/O I/O

G7 GND GND GND K4 VCCA VCCA VCCA

G8 GND GND GND K5 I/O I/O I/O

G9 GND GND GND K6 VCCI VCCI VCCI

G10 GND GND GND K7 GND GND GND

G11 VCCI VCCI VCCI K8 GND GND GND

G12 I/O I/O I/O K9 GND GND GND

G13 GND GND GND K10 GND GND GND

G14 NC I/O I/O K11 VCCI VCCI VCCI

G15 VCCA VCCA VCCA K12 I/O I/O I/O

G16 I/O I/O I/O K13 I/O I/O I/O

H1 I/O I/O I/O K14 I/O I/O I/O

H2 I/O I/O I/O K15 NC I/O I/O

H3 VCCA VCCA VCCA K16 I/O I/O I/O

H4 TRST, I/O TRST, I/O TRST, I/O L1 I/O I/O I/O

H5 I/O I/O I/O L2 I/O I/O I/O

H6 VCCI VCCI VCCI L3 I/O I/O I/O

H7 GND GND GND L4 I/O I/O I/O

H8 GND GND GND L5 I/O I/O I/O

H9 GND GND GND L6 I/O I/O I/O

H10 GND GND GND L7 VCCI VCCI VCCI

H11 VCCI VCCI VCCI L8 VCCI VCCI VCCI

H12 I/O I/O I/O L9 VCCI VCCI VCCI

H13 I/O I/O I/O L10 VCCI VCCI VCCI

H14 I/O I/O I/O L11 I/O I/O I/O

H15 I/O I/O I/O L12 I/O I/O I/O

H16 NC I/O I/O L15 I/O I/O I/O

J1 NC I/O I/O L16 NC I/O I/O

J2 NC I/O I/O M1 I/O I/O I/O

J3 NC I/O I/O M2 I/O I/O I/O

J4 I/O I/O I/O M3 I/O I/O I/O

J5 I/O I/O I/O M4 I/O I/O I/O

J6 VCCI VCCI VCCI M5 I/O I/O I/O

256-Pin FBGA (Continued)

Pin Number A54SX16A

Function A54SX32A

Function A54SX72A

Function Pin Number A54SX16A

Function A54SX32A

Function A54SX72A

Function

Preliminary v1.2 73

SX-A Family FPGAs

M6 I/O I/O I/O P12 I/O I/O I/O

M7 I/O I/O QCLKA P13 VCCA VCCA VCCA

M8 PRB, I/O PRB, I/O PRB, I/O P14 I/O I/O I/O

M9 I/O I/O I/O P15 I/O I/O I/O

M10 I/O I/O I/O P16 I/O I/O I/O

M11 I/O I/O I/O R1 I/O I/O I/O

M12 NC I/O I/O R2 GND GND GND

M13 I/O I/O I/O R3 I/O I/O I/O

M14 NC I/O I/O R4 NC I/O I/O

M15 I/O I/O I/O R5 I/O I/O I/O

M16 I/O I/O I/O R6 I/O I/O I/O

N1 I/O I/O I/O R7 I/O I/O I/O

N2 I/O I/O I/O R8 I/O I/O I/O

N3 I/O I/O I/O R9 HCLK HCLK HCLK

N4 I/O I/O I/O R10 I/O I/O QCLKB

N5 I/O I/O I/O R11 I/O I/O I/O

N6 I/O I/O I/O R12 I/O I/O I/O

N7 I/O I/O I/O R13 I/O I/O I/O

N8 I/O I/O I/O R14 I/O I/O I/O

N9 I/O I/O I/O R15 GND GND GND

N10 I/O I/O I/O R16 GND GND GND

N11 I/O I/O I/O T1 GND GND GND

N12 I/O I/O I/O T2 I/O I/O I/O

N13 I/O I/O I/O T3 I/O I/O I/O

N14 I/O I/O I/O T4 NC I/O I/O

N15 I/O I/O I/O T5 I/O I/O I/O

N16 I/O I/O I/O T6 I/O I/O I/O

P1 I/O I/O I/O T7 I/O I/O I/O

P2 GND GND GND T8 I/O I/O I/O

P3 I/O I/O I/O T9 VCCA VCCA VCCA

P4 I/O I/O I/O T10 I/O I/O I/O

P5 NC I/O I/O T11 I/O I/O I/O

P6 I/O I/O I/O T12 NC I/O I/O

P7 I/O I/O I/O T13 I/O I/O I/O

P8 I/O I/O I/O T14 I/O I/O I/O

P9 I/O I/O I/O T15 TDO, I/O TDO, I/O TDO, I/O

P10 NC I/O I/O T16 GND GND GND

P11 I/O I/O I/O

256-Pin FBGA (Continued)

Pin Number A54SX16A

Function A54SX32A

Function A54SX72A

Function Pin Number A54SX16A

Function A54SX32A

Function A54SX72A

Function

SX-A Family FPGAs

74 Peliminary v1.2

Package Pin Assignments (Continued)

484-Pin FBGA (Top View)

123 4 5 6 7 8 9 10 11121314 15161718 19 20212223 242526

Preliminary v1.2 75

SX-A Family FPGAs

484-Pin FBGA

Number A54SX32A

Function A54SX72A

Function Pin

Number A54SX32A

Function A54SX72A

Function Pin

Number A54SX32A

Function A54SX72A

Function

A1 NC NC AB11 I/O I/O AD5 I/O I/O

A2 NC NC AB12 PRB, I/O PRB, I/O AD6 I/O I/O

A3 NC I/O AB13 VCCA VCCA AD7 I/O I/O

A4 NC I/O AB14 I/O I/O AD8 I/O I/O

A5 NC I/O AB15 I/O I/O AD9 VCCI VCCI

A6 I/O I/O AB16 I/O I/O AD10 I/O I/O

A7 I/O I/O AB17 I/O I/O AD11 I/O I/O

A8 I/O I/O AB18 I/O I/O AD12 I/O I/O

A9 I/O I/O AB19 I/O I/O AD13 VCCI VCCI

A10 I/O I/O AB20 TDO, I/O TDO, I/O AD14 I/O I/O

A11 NC I/O AB21 GND GND AD15 I/O I/O

A12 NC I/O AB22 NC I/O AD16 I/O I/O

A13 I/O I/O AB23 NC I/O AD17 VCCI VCCI

A14 NC NC AB24 I/O I/O AD18 I/O I/O

A15 NC I/O AB25 NC I/O AD19 I/O I/O

A16 NC I/O AB26 NC I/O AD20 I/O I/O

A17 I/O I/O AC1 I/O I/O AD21 I/O I/O

A18 I/O I/O AC2 I/O I/O AD22 I/O I/O

A19 I/O I/O AC3 I/O I/O AD23 VCCI VCCI

A20 I/O I/O AC4 NC I/O AD24 NC I/O

A21 NC I/O AC5 NC VCCI AD25 NC I/O

A22 NC I/O AC6 I/O I/O AD26 NC I/O

A23 NC I/O AC7 VCCI VCCI AE1 NC NC

A24 NC I/O AC8 I/O I/O AE2 I/O I/O

A25 NC NC AC9 I/O I/O AE3 NC I/O

A26 NC NC AC10 I/O I/O AE4 NC I/O

AA1 NC I/O AC11 I/O I/O AE5 NC I/O

AA2 NC I/O AC12 I/O QCLKA AE6 NC I/O

AA3 VCCA VCCA AC13 I/O I/O AE7 I/O I/O

AA4 I/O I/O AC14 I/O I/O AE8 I/O I/O

AA5 I/O I/O AC15 I/O I/O AE9 I/O I/O

AA22 I/O I/O AC16 I/O I/O AE10 I/O I/O

AA23 I/O I/O AC17 I/O I/O AE11 NC I/O

AA24 I/O I/O AC18 I/O I/O AE12 NC I/O

AA25 NC I/O AC19 I/O I/O AE13 I/O I/O

AA26 NC I/O AC20 VCCI VCCI AE14 I/O I/O

AB1 NC NC AC21 I/O I/O AE15 NC I/O

AB2 VCCI VCCI AC22 I/O I/O AE16 NC I/O

AB3 I/O I/O AC23 NC I/O AE17 I/O I/O

AB4 I/O I/O AC24 NC I/O AE18 I/O I/O

AB5 NC I/O AC25 NC I/O AE19 I/O I/O

AB6 NC I/O AC26 NC I/O AE20 I/O I/O

AB7 I/O I/O AD1 I/O I/O AE21 NC I/O

AB8 I/O I/O AD2 I/O I/O AE22 NC I/O

AB9 I/O I/O AD3 GND GND AE23 NC I/O

AB10 I/O I/O AD4 I/O I/O AE24 NC I/O

SX-A Family FPGAs

76 Peliminary v1.2

AE25 NC NC B19 I/O I/O D13 I/O I/O

AE26 NC NC B20 I/O I/O D14 I/O I/O

AF1 NC NC B21 NC I/O D15 I/O I/O

AF2 NC NC B22 NC I/O D16 I/O I/O

AF3 NC I/O B23 NC I/O D17 I/O I/O

AF4 NC I/O B24 NC I/O D18 I/O I/O

AF5 NC I/O B25 I/O I/O D19 I/O I/O

AF6 NC I/O B26 NC NC D20 I/O I/O

AF7 I/O I/O C1 NC I/O D21 VCCI VCCI

AF8 I/O I/O C2 NC I/O D22 GND GND

AF9 I/O I/O C3 NC I/O D23 I/O I/O

AF10 I/O I/O C4 NC I/O D24 I/O I/O

AF11 NC I/O C5 I/O I/O D25 NC I/O

AF12 NC NC C6 VCCI VCCI D26 NC I/O

AF13 HCLK HCLK C7 I/O I/O E1 NC I/O

AF14 I/O QCLKB C8 I/O I/O E2 NC I/O

AF15 NC I/O C9 VCCI VCCI E3 I/O I/O

AF16 NC I/O C10 I/O I/O E4 I/O I/O

AF17 I/O I/O C11 I/O I/O E5 GND GND

AF18 I/O I/O C12 I/O I/O E6 TDI, IO TD I, IO

AF19 I/O I/O C13 PRA, I/O PRA, I/O E7 I/O I/O

AF20 NC I/O C14 I/O I/O E8 I/O I/O

AF21 NC I/O C15 I/O QCLKD E9 I/O I/O

AF22 NC I/O C16 I/O I/O E10 I/O I/O

AF23 NC I/O C17 I/O I/O E11 I/O I/O

AF24 NC I/O C18 I/O I/O E12 I/O I/O

AF25 NC NC C19 I/O I/O E13 VCCA VCCA

AF26 NC NC C20 VCCI VCCI E14 CLKB CLKB

B1 NC NC C21 I/O I/O E15 I/O I/O

B2 NC NC C22 I/O I/O E16 I/O I/O

B3 NC I/O C23 I/O I/O E17 I/O I/O

B4 NC I/O C24 I/O I/O E18 I/O I/O

B5 NC I/O C25 NC I/O E19 I/O I/O

B6 I/O I/O C26 NC I/O E20 I/O I/O

B7 I/O I/O D1 NC I/O E21 I/O I/O

B8 I/O I/O D2 TMS TMS E22 I/O I/O

B9 I/O I/O D3 I/O I/O E23 I/O I/O

B10 I/O I/O D4 VCCI VCCI E24 I/O I/O

B11 NC I/O D5 NC I/O E25 VCCI VCCI

B12 NC I/O D6 NC TCK, I/O E26 G ND GND

B13 VCCI VCCI D7 I/O I/O F1 VCCI VCCI

B14 CLKA CLKA D8 I/O I/O F2 NC I/O

B15 NC I/O D9 I/O I/O F3 NC I/O

B16 NC I/O D10 I/O I/O F4 I/O I/O

B17 I/O I/O D11 I/O I/O F5 I/O I/O

B18 VCCI VCCI D12 I/O QCLKC F22 I/O I/O

484-Pin FBGA (Continued)

Number A54SX32A

Function A54SX72A

Function Pin

Number A54SX32A

Function A54SX72A

Function Pin

Number A54SX32A

Function A54SX72A

Function

Preliminary v1.2 77

SX-A Family FPGAs

F23 I/O I/O K17 GND GND N5 I/O I/O

F24 I/O I/O K22 I/O I/O N10 GND GND

F25 I/O I/O K23 I/O I/O N11 GND GND

F26 NC I/O K24 NC NC N12 GND GND

G1 NC I/O K25 NC I/O N13 GND GND

G2 NC I/O K26 NC I/O N14 GND GND

G3 NC I/O L1 NC I/O N15 GND GND

G4 I/O I/O L2 NC I/O N16 GND GND

G5 I/O I/O L3 I/O I/O N17 GND GND

G22 I/O I/O L4 I/O I/O N22 VCCA VCCA

G23 VCCA VCCA L5 I/O I/O N23 I/O I/O

G24 I/O I/O L10 GND GND N24 I/O I/O

G25 NC I/O L11 GND GND N25 I/O I/O

G26 NC I/O L12 GND GND N26 NC NC

H1 NC I/O L13 GND GND P1 NC I/O

H2 NC I/O L14 GND GND P2 NC I/O

H3 I/O I/O L15 GND GND P3 I/O I/O

H4 I/O I/O L16 GND GND P4 I/O I/O

H5 I/O I/O L17 GND GND P5 VCCA VCCA

H22 I/O I/O L22 I/O I/O P10 GND GND

H23 I/O I/O L23 I/O I/O P11 GND GND

H24 I/O I/O L24 I/O I/O P12 GND GND

H25 NC I/O L25 I/O I/O P13 GND GND

H26 NC I/O L26 I/O I/O P14 GND GND

J1 NC I/O M1 NC NC P15 GND GND

J2 NC I/O M2 I/O I/O P16 GND GND

J3 I/O I/O M3 I/O I/O P17 GND GND

J4 I/O I/O M4 I/O I/O P22 I/O I/O

J5 I/O I/O M5 I/O I/O P23 I/O I/O

J22 I/O I/O M10 GND GND P24 VCCI VCCI

J23 I/O I/O M11 GND GND P25 I/O I/O

J24 I/O I/O M12 GND GND P26 I/O I/O

J25 VCCI VCCI M13 GND GND R1 NC I/O

J26 NC I/O M14 GND GND R2 NC I/O

K1 NC I/O M15 GND GND R3 I/O I/O

K2 VCCI VCCI M16 GND GND R4 I/O I/O

K3 I/O I/O M17 GND GND R5 TRST, I/O TRST, I/O

K4 I/O I/O M22 I/O I/O R10 GND GND

K5 VCCA VCCA M23 I/O I/O R11 GND GND

K10 GND GND M24 I/O I/O R12 GND GND

K11 GND GND M25 NC I/O R13 GND GND

K12 GND GND M26 NC I/O R14 GND GND

K13 GND GND N1 I/O I/O R15 GND GND

K14 GND GND N2 VCCI VCCI R16 GND GND

K15 GND GND N3 I/O I/O R17 GND GND

K16 GND GND N4 I/O I/O R22 I/O I/O

484-Pin FBGA (Continued)

Number A54SX32A

Function A54SX72A

Function Pin

Number A54SX32A

Function A54SX72A

Function Pin

Number A54SX32A

Function A54SX72A

Function

SX-A Family FPGAs

78 Peliminary v1.2

R23 I/O I/O U3 I/O I/O V25 NC I/O

R24 I/O I/O U4 I/O I/O V26 NC I/O

R25 NC I/O U5 I/O I/O W1 I/O I/O

R26 NC I/O U10 GND GND W2 I/O I/O

T1 NC I/O U11 GND GND W3 I/O I/O

T2 NC I/O U12 GND GND W4 I/O I/O

T3 I/O I/O U13 GND GND W5 I/O I/O

T4 I/O I/O U14 GND GND W22 I/O I/O

T5 I/O I/O U15 GND GND W23 VCCA VCCA

T10 GND GND U16 GND GND W24 I/O I/O

T11 GND GND U17 GND GND W25 NC I/O

T12 GND GND U22 I/O I/O W26 NC I/O

T13 GND GND U23 I/O I/O Y1 NC I/O

T14 GND GND U24 I/O I/O Y2 NC I/O

T15 GND GND U25 VCCI VCCI Y3 I/O I/O

T16 GND GND U26 I/O I/O Y4 I/O I/O

T17 GND GND V1 NC I/O Y5 NC I/O

T22 I/O I/O V2 NC I/O Y22 NC I/O

T23 I/O I/O V3 I/O I/O Y23 I/O I/O

T24 I/O I/O V4 I/O I/O Y24 VCCI VCCI

T25 NC I/O V5 I/O I/O Y25 I/O I/O

T26 NC I/O V22 VCCA VCCA Y26 I/O I/O

U1 I/O I/O V23 I/O I/O

U2 VCCI VCCI V24 I/O I/O

484-Pin FBGA (Continued)

Number A54SX32A

Function A54SX72A

Function Pin

Number A54SX32A

Function A54SX72A

Function Pin

Number A54SX32A

Function A54SX72A

Function

Preliminary v1.2 79

SX-A Family FPGAs

List of Changes

The following table lists critical changes that were made in the current version of the document.

Data Sheet Categories

In order to provide the latest information to designers, some data sheets are published before data has been fully

characterized. These data sheets are marked as “Advanced” or Preliminary” data sheets. The definition of these categories

are as follows:

Advanced

The data sheet contains initial estimated information based on simulation, other products, devices, or speed grades. This

information can be used as estimates, but not for production.

Preliminary

The data sheet contains information based on simulation and/or initial characterization. The information is believed to be

correct, but changes are possible.

Unmarked (production)

The data sheet contains information that is considered to be final.

Previous version Changes in current version (Preliminary v1.2) Page

Preliminary v1.1

Because the changes in this data sheet are extensive and technical in nature, this

should be viewed as a new document. Please read it as you would a data sheet that

is published for the first time. ALL

Note that the “Package Characteristics and Mechanical Drawings” section has been

eliminated from the data sheet. The mechanical drawings are now contained in a

separate document, “Package Characteristics and Mechanical Drawings,” available

on the Actel web site.

Actel and the Actel logo ar e regi stered trademarks of Actel Corpora ti on.

All other trademarks are the property of their owners.

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