TF019-19 CMOS LSIs Product Catalog 2001/2002 Product Catalog Product Catalog ELECTRONIC DEVICES MARKETING DIVISION 2001/2002 Electronic devices information on WWW server This catalog was made with recycle paper, and printed using soy-based inks Revised March 2001 Printed in Japan H 2001/2002 http://www.epson.co.jp/device/ The Information of the product number change Comparison table between new and previous number 4 5 PACKAGE Information Configurations Dimensions 12 14 18 1. ASICs Application Specific ICs 1----1 33 Gate Arrays 34 High-speed, high-density lineup 34 S1L60000 series,S1L50000 series,S1L35000 series,S1L30000 series,S1L9000F series 1----2 1----3 1----4 2. MCUs 2----1 2----3 2----4 2----5 2----6 37 Standard Cells 38 Standard Cells S1K70000 series,S1K60000 series,S1K50000 series Ultra Low Voltage Standard Cell S1K2500 series 38 Development of Gate Arrays 39 38 41 4-bit Microcomputers 42 4-bit single- chip application-oriented microcomputers S1C60 series ,S1C62100 series ,S1C6S200 series ,S1C62N30/6S300 series , S1C62400/6S400 series ,S1C62N50/S1C62900 series ,S1C62600 series , S1C62700 series ,S1C62N80 series,S1C62M00 series 42 High performance 4-bit microcomputers 46 High performance 4-bit single-chip microcomputers S1C63100 series, S1C63200 series, S1C63300 series, S1C63400 series, S1C63500 series, S1C63600 series, S1C63A/B00 series 46 Peripheral 49 FSK receiver S1C05250 series 49 8-bit Microcomputers 50 8-bit single-chip application-oriented microcomputers S1C88100 series,S1C88300 series,S1C88400 series,S1C88800 series, S1C88A00 series 50 32-bit Microcomputers 52 32-bit RISC microcomputers S1C33200 series,S1C33L00 series,S1C33T00 series,S1C33S00 series S1C33 Special-purpose line-up 52 Microcomputer Development 54 Program development process Development tools 54 58 Application Specific Standard Products 3----1 3----2 2 37 Designing the embedded arrays Application-oriented Microcomputer 2----2 3. ASSPs Embedded Arrays 59 LCD Controllers 60 LCD controllers S1D13305 series,S1D13503/13700 series,S1D13A00 series,S1D13500/13800 series 60 LCD Controller-drivers and Drivers 62 LCD controller-drivers for small-sized displays S1D12000 series LCD drivers with RAM for small- and medium-sized displays S1D15000 series MLS drivers for medium sized displays MLS Driver LCD drivers for large-sized displays S1D16000 series,S1D17000 series LCD drivers for grayscale displays S1D18000 series,S1D17900 series ,S1D19000 series 62 63 66 67 68 SEIKO EPSON CMOS LSI 3----3 3----4 Other Drivers Thermal-head drivers S1D50000 series LED Printer-head drivers S1D41000 series 69 69 Interface ICs 70 IEEE1394 controller S1R72000 series USB2.0 device controller S1R72000 series SCSl controller S1R72100 series 3----5 Power Supply ICs Power supply ICs for logic S1F70000 series Power supply ICs for liquid crystal S1F75000 series DC to DC converters S1F76600 series DC to DC converters and voltage regulators S1F76600 series,S1F76500 series Switching regulators S1F76300 series High precision voltage regulators S1F78100 series, S1F79100 series High pecision voltage detectors S1F77200 series 3----6 Melody ICs Melody ICs S1V75600 series,S1V71000 series Music generators S1V75700 series Standard melodies 3----7 Melody ICs-Music Generator Development Melody ICs development Music generator ICs development 4. Memories 4----1 Static RAMs 5. Custom IC 5----1 Development of Custom IC 6. Sub-system Assembly Technology 61ApplicationProductsofSub-systemAssemblyTechnology 69 70 Contents 2001/ 2002 PACKAGE 70 70 71 71 71 ASICs 71 71 71 72 73 74 MCUs 74 74 75 76 76 76 79 ASSPs 80 81 82 85 Memories 86 Example of Applied Products, Sub-system Assembly Technologies 62DevelopmentofApplicationProducts 88 LSI Device Precautions 91 Sales Information 95 ENERGY SAVING EPSON/WORNING WITH ENVIRONMENTAL ISSUES/WORKING FOR HIGH QUALITY SALES OFFICE FOR EPSON'S SEMICONDUCTOR OPERATIONS 96 98 Custom IC NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic products under the control of the Foreign Exchange and Foreign Trade Law of Japan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency. Seiko Epson Corporation 2001, All rights reserved. Sub-system Assembly Technology 3 The information of the product number change Configurations The information of the product number change Starting April 1, 2001 the product number will be changed as listed below. To order from April 1, 2001 please use the new product number. For further information, please contact Epson sales representative. How to describe the Product number on this document Product number are basically described with previous number, such as Product Number (Previous nimber). Configuratoin of product number Devices * S1 D 15605 T 00A0 00 Packing specification Specifications Shape (*2) Model number Model name (*1) Product classification (S1: Semiconductor) *1: Medel name C Microcomputer M D Driver, Digital Products R Peripheral F Power Supply V Melody, Voice K Standard Cell X Embedded Array L Gate Array RAM *2: Shape B Assembled on board, COB, BGA R TAB-QFP C Plastic DIP S Plastic Shrink DIP D Bare Chip T Tape Carrier (TAB) F Plastic QFP Y SOT89 (3 terminals) H Ceramic DIP 2 TSOP (Standard Bent) L Caramic QFP 3 TSOP (Reverse Bent) M Plastic SOP tools *Development S5U1 C 88348 D1 1 00 Packing specification Version Tool type Corresponding model number Tool classification Product classification (S5U1: Development tool for semiconductor) 4 ASICs Comparison table between new and previous number ASICs S1L60000 series Previous number SLA6009 SLA600Q SLA6017 SLA601Q SLA6028 SLA602Q SLA6040 SLA604Q SLA6059 SLA605Q SLA6083 SLA608Q SLA6123 SLA612Q SLA6158 SLA615Q SLA6190 SLA619Q SLA6251 SLA625Q New number S1L60093 S1L60094 S1L60173 S1L60174 S1L60283 S1L60284 S1L60403 S1L60404 S1L60593 S1L60594 S1L60833 S1L60834 S1L61233 S1L61234 S1L61583 S1L61584 S1L61903 S1L61904 S1L62513 S1L62514 S1L50000 series Previous number SLA5028H SLA502TH SLA502QH SLA5075H SLA507TH SLA507QH SLA5099H SLA509TH SLA509QH SLA5125H SLA512TH SLA512QH SLA5177H SLA517TH SLA517QH SLA5250H SLA525TH SLA525QH SLA5335H SLA533TH SLA533QH SLA5442H SLA544TH SLA544QH SLA5506H SLA550TH SLA550QH SLA5668H SLA566TH SLA566QH SLA5815H SLA581TH SLA581QH New number S1L50282 S1L50283 S1L50284 S1L50752 S1L50753 S1L50754 S1L50992 S1L50993 S1L50994 S1L51252 S1L51253 S1L51254 S1L51772 S1L51773 S1L51774 S1L52502 S1L52503 S1L52504 S1L53352 S1L53353 S1L53354 S1L54422 S1L54423 S1L54424 S1L55062 S1L55063 S1L55064 S1L56682 S1L56683 S1L56684 S1L58152 S1L58153 S1L58154 S1L35000 series Previous number SLA3504 SLA3506 SLA3509 SLA3516 New number S1L35043 S1L35063 S1L35093 S1L35163 S1L30000 series Previous number SLA3018 SLA301T SLA3030 SLA303T SLA3042 SLA304T SLA3055 SLA305T SLA3075 SLA307T SLA3109 SLA310T SLA3125 SLA312T SLA3216 SLA321T New number S1L30182 S1L30183 S1L30302 S1L30303 S1L30422 S1L30423 S1L30552 S1L30553 S1L30752 S1L30753 S1L31092 S1L31093 S1L31252 S1L31253 S1L32162 S1L32163 S1L90000F series Previous number SLA902F SLA904F SLA907F SLA909F SLA913F SLA919F SLA927F SLA944F New number S1L902F2 S1L904F2 S1L907F2 S1L909F2 S1L913F2 S1L919F2 S1L927F2 S1L944F2 Designing the embedded arrays Previous series New series SSL60000 series S1X60000 series SSL50000 series S1X50000 series SSL35000 series S1X35000 series Standard cells Previous series SCB70000 series SCB60000 series SCB50000 series New series S1K70000 series S1K60000 series S1K50000 series Ultra low voltage standard cell Previous series New series SSC2500 series S1K2500 series Supporting libraries for ASIC design tools Previous number New number SLA60000 S1L60000 SLA50000H S1L50000 SLA35000 S1L35000 SLA30000 S1L30000 SLA9000F S1L9000F 5 MCUs S1C60 series Previous number E0C6001 E0C60L01 E0C6002 E0C60L02 E0C6003 E0C60L03 E0C6004 E0C6005 E0C60L05 E0C6006 E0C6007 E0C6008 E0C60L08 E0C60A08 E0C6009 E0C60L09 E0C6011 New number S1C60N01 S1C60L01 S1C60N02 S1C60L02 S1C60N03 S1C60L03 S1C60N04 S1C60N05 S1C60L05 S1C60N06 S1C60N07 S1C60N08 S1C60L08 S1C60A08 S1C60N09 S1C60L09 S1C60110 S1C62100 series Previous number E0C621A E0C621C New number S1C621A0 S1C621C0 S1C6S200 series Previous number E0C6S27 E0C6SL27 E0C6SB27 E0C6SA27 New number S1C6S2N7 S1C6S2L7 S1C6S2B7 S1C6S2A7 S1C62N30/6S300 series Previous number New number E0C6S37 S1C6S3N7 E0C6SL37 S1C6S3L7 E0C6SB37 S1C6S3B7 E0C6S32 S1C6S3N2 E0C6SL32 S1C6S3L2 E0C6SB32 S1C6S3B2 E0C6SA32 S1C6S3A2 E0C6233 S1C62N33 E0C62L33 S1C62L33 E0C62A33 E0C62A33 E0C623B S1C6N3B0 E0C62A3B S1C6A3B0 S1C62400/6S400 series Previous number New number E0C6244 S1C62440 E0C624A S1C624A0 E0C6S46 S1C6S460 E0C6248 S1C62480 E0C6S48 S1C6S480 E0C624C S1C624C0 6 S1C62N50/62500 series/ S1C62900 series Previous number New number E0C6251 S1C62N51 E0C62L51 S1C62L51 E0C6256 S1C62560 E0C6292 S1C62920 S1C62600 series Previous number E0C6266 New number S1C62660 S1C62700 series Previous number E0C6274 New number S1C62740 S1C62N80 series Previous number E0C6281 E0C62L81 E0C6282 E0C62L82 E0C62A82 New number S1C62N81 S1C62L81 S1C62N82 S1C62L82 S1C62A82 S1C62M00 series Previous number New number E0C62M2 S1C62M20 S1C63100 series Previous number E0C63158 S1C63200 series Previous number E0C63256 S1C63300 series Previous number E0C63358 E0C63P366 S1C63400 series Previous number E0C63454 E0C63455 E0C63458 E0C63466 E0C63P466 S1C63500 series Previous number E0C63557 E0C63558 E0C63567 New number S1C63158 New number S1C63256 New number S1C63358 S1C6P366 New number S1C63454 S1C63455 S1C63458 S1C63466 S1C6P466 New number S1C63557 S1C63558 S1C63567 S1C63A/B00 series Previous number New number E0C63A08 S1C63A08 E0C63B07 S1C63B07 E0C63B08 S1C63B08 FSK receiver Previous number E0C5250 E0C5251 New number S1C05250 S1C05251 S1C88100 series Previous number E0C88104 E0C88112 New number S1C88104 S1C88112 S1C88300 series Previous number E0C88308 E0C88316 E0C88317 E0C88348 E0C88365 E0C88F360 New number S1C88308 S1C88316 S1C88317 S1C88348 S1C88365 S1C8F360 S1C88400 series Previous number E0C88408 E0C88409 New number S1C88408 S1C88409 S1C88800 series Previous number E0C88832 E0C88862 E0C88816 New number S1C88832 S1C88862 S1C88816 S1C88A00 series Previous number E0C88A32 New number S1C88A32 S1C33200 series Previous number E0C33209 E0C33264 E0C332129 E0C332F128 New number S1C33209 S1C33222 S1C33221 S1C33240 S1C33L00 series Previous number E0C332L01 E0C332L02 New number S1C33L01 S1C33L02 S1C33T00 series Previous number E0C332T01 New number S1C33T01 Comparison table between new and previous number MCUs MCUs S1C33S00 series Previous number E0C332S08 New number S1C33S01 S1C33 special-purpose line-up Previous number New number E0C33210 S1C33210 S1C62 Family/S1C60 family development tools Hardware Previous number New number ICE62R S5U1C62000H2 EVA62 S5U1C62E KIT60 S5U1C60K Software Previous number Flash writing tool Hardware Previous number URM00002 ADP88*** ADP63*** ADS00002 GWH00002 New number S5U1C88000C1 New number S5U1C88000W1 S5U1C88X1 S5U1C63X1 S5U1C88000X1 S5U1C88000W2 Software package Previous number New number ASM62 S5U1C62000A S1C63 Family development tools Hardware Previous number New number ICE63 S5U1C63000H1 PRC63 S5U1C63P Software package Previous number New number ASM63 S5U1C63000A S1C33 Family development tools Hardware Previous number New number ICD33 S5U1C33000H EPOD33 S5U1C33E DMT33 S5U1C33D MEM33 S5U1C33M Software package Previous number New number CC33 S5U1C33000C Middleware package Previous number New number VOX33 S5U1C330V1S JPEG33 S5U1C330J1S ROS33 S5U1C330R1S MON33 S5U1C330M2S MELODY33 S5U1C330M1S VRE33 S5U1C330V2S SOUND33 S5U1C330S1S TS33 S5U1C330T1S CF33 S5U1C330C1S GRAPHIC33 S5U1C330G1S S1C88 Family development tools Hardware Previous number New number ICE88UR S5U1C88000H5 PRC88 S5U1C88P DMT88348-DB S5U1C88348T 7 ASSPs S1D13305 series Previous number SED1335F0A SED1335F0B New number S1D13305F00A S1D13305F00B S1D13503/13700 series Previous number New number SED1353D0A S1D13503D00A SED1353F0A S1D13503F00A SED1353F1A S1D13503F01A SED1374F0A S1D13704F00A SED1375F0A S1D13705F00A SED1376F0A S1D13706F00A SED1376B0A S1D13706B00A SED1376D0A* S1D13706D00A* SED1378F0A* S1D13708F00A* SED1378B0B* S1D13708B00B* SED1378D0A* S1D13708D00A* S1D13A00 series Previous number SED13A3F0A* SED13A3B0B* SED13A4B0B* SED13A5B0B* New number S1D13A03F00A* S1D13A03B00B* S1D13A04B00B* S1D13A05B00B* S1D13500/13800 series Previous number New number SED1354F0A S1D13504F00A SED1354F1A S1D13504F01A SED1354F2A S1D13504F02A SED1355F0A S1D13505F00A SED1356F0A S1D13506F00A SED1386F0A S1D13806F00A S1D12000 series lineup Previous number New number SED1220D S1D12200D SED1220T S1D12200T SED1221D S1D12201D SED1221T S1D12201T SED122AD* S1D12210D SED1222D S1D12202D SED1225D S1D12205D SED1225T S1D12205T SED1230D S1D12300D SED1230T S1D12300T SED1231D S1D12301D SED1231T S1D12301T SED1232D S1D12302D SED1232T S1D12302T SED1233D S1D12303D SED1233T S1D12303T SED1234D S1D12304D SED1235D S1D12305D SED1240D S1D12400D SED1240T S1D12400T 8 S1D15000 series lineup Previous number New number SED1510D0C S1D15100D00C SED1510F0C S1D15100F00C SED1526D*A S1D15206DA SED1526D*B S1D15206DB SED1526F*A S1D15206FA SED1526T*A S1D15206TA SED1528D*A S1D15208DA SED1528D*B S1D15208DB SED1528F*A S1D15208FA SED1528T*A S1D15208TA SED1530D0A S1D15300D00A SED1530DAA S1D15300D10A SED1530D0B S1D15300D00B SED1530DAB S1D15300D10B SED1530TAA S1D15300T10A SED1531D0A S1D15301D00A SED1531D0B S1D15301D00B SED1531T0A S1D15301T00A SED1532D0A S1D15302D00A SED1532DBA S1D15302D11A SED1532D0B S1D15302D00B SED1532DBB S1D15302D11B SED1532T0A S1D15302T00A SED1532TBA S1D15302T11A SED1533DFB S1D15303D15B SED1540D0A S1D15400D00A SED1540D0B S1D15400D00B SED1540F0A S1D15400F00A SED1560D0A S1D15600D00A SED1560DAA S1D15600D10A SED1560D0B S1D15600D00B SED1560DAB S1D15600D10B SED1560T0B S1D15600T00B SED1560TQA S1D15600T26A SED1561D0A S1D15601D00A SED1561D0B S1D15601D00B SED1561DAB S1D15601D10B SED1561T0B S1D15601T00B SED1561TAB S1D15601T10B SED1561TQA S1D15601T26A SED1562D0A S1D15602D00A SED1562D0B S1D15602D00B SED1562T0B S1D15602T00B SED1562TQA S1D15602T26A SED1065D0B S1D10605D00B SED1065T0A S1D10605T00A SED1066D0A S1D10606D00A SED1067D0B S1D10607D00B SED1068D0B S1D10608D00B SED1069D0B S1D10609D00B SED1565DBB S1D15605D11B SED1565D0B S1D15605D00B SED1565D1B S1D15605D01B SED1565D2B S1D15605D02B SED1565T0A S1D15605T00A SED1565T0B S1D15605T00B SED1565T0C S1D15605T00C SED1566DBB S1D15606D11B SED1566D0B S1D15606D00B SED1566D1B S1D15606D01B SED1566D2B S1D15606D02B SED1566T0A S1D15606T00A SED1567DBB S1D15607D11B SED1567D0B S1D15607D00B SED1567D1B S1D15607D01B SED1567D2B S1D15607D02B SED1567T0B S1D15607T00B Previous number SED1567T0C SED1568DBB SED1568D0B SED1569DBB SED1569D0B SED1569T*** SED15A6D0B SED15B1D0B SED15B1T0A SED15E0D0B SED15E0T0A SED1575D0B SED1575D3B SED1575T0A SED1575T3A SED1577D0B SED1577D3B SED1577T0A SED1577T3A SED157AD0B SED157AT0A* New number S1D15607T00C S1D15608D11B S1D15608D00B S1D15609D11B S1D15609D00B S1D15609T S1D15A06D00B* S1D15B01D00B S1D15B01T00A S1D15E00D00B S1D15E00T00A S1D15705D00B S1D15705D03B S1D15705T00A S1D15705T03A S1D15707D00B S1D15707D03B S1D15707T00A S1D15707T03A S1D15710D00B S1D15710T00A MLS drivers for medium sized displays MLS driver lineup Previous number New number SED1580D0B S1D15800D00B SED1580T0A S1D15800T00A SED1590D0B S1D15900D00B SED1590T0A S1D15900T00A SED1594D0B* S1D15904D00B SED1594T0A* S1D15904T00A SED1751D0B S1D17501D00B SED1751T0A S1D17501T00A SED1750D0B S1D17500D00B SED1750T0A S1D17500T00A SED17C0D0B S1D17C00D00B SED17C0T0A S1D17C00T00A S1D16000 series lineup Segment drivers Previous number New number SED1606D0A S1D16006D00A SED1606D0B S1D16006D00B SED1606F0A S1D16006F00A SED1606D1A S1D16006D01A SED1606D1B S1D16006D01B SED1640D0B S1D16400D00B Common drivers Previous number SED1651D0A SED1670D0A SED1670D1A SED1670D0B SED1670D1B SED1672D0A SED1672D1A SED1672D0B SED1672D1B SED1672F0A New number S1D16501D00A S1D16700D00A S1D16700D01A S1D16700D00B S1D16700D01B S1D16702D00A S1D16702D01A S1D16702D00B S1D16702D01B S1D16702F00A Comparison table between new and previous number ASSPs ASSPs S1D17000 series lineup Segment drivers Previous number New number SED1758D0B S1D17508D00B SED1758T0A S1D17508T00A SED1758T0B S1D17508T00B SED1758T0G S1D17508T00G SED1752T0A S1D17502T00A SED1752T0B S1D17502T00B SED17A2T0A S1D17A02T00A SED17A2T0B S1D17A02T00B SED17A2T0E S1D17A02T00E Common drivers Previous number SED1743D1B SED1753D0B SED1753T0A New number S1D17403D01B S1D17503D00B S1D17503T00A LED printer-head drivers Previous number New number SED4100 S1D41000 SED4101 S1D41010 SED4180 S1D41800 IEEE1394 controller Previous number New number SPC7281F0A S1R72801F00A SPC7283F0A S1R72803F00A SPC7290F0A S1R72900F00A SPC7291F0A S1R72901F00A USB2.0 device controller Previous number New number SPC7202F0A S1R72002F00A S1D18000 series lineup Previous number New number SED1800D0B S1D18000D00B SED1801D0B S1D18001D00B SED18A1D0B S1D18A01D00B SCSI controller Previous number SPC7213F0A SPC7214F0B SPC7215F0A SPC7216F0A TFT LCDdrivers S1D17900 series lineup (Gate drivers) Previous number New number SED1790T0A S1D17900T00A SED1793T0B S1D17903T00B SED1794T0A S1D17904T00A SED1796D0B S1D17906D00B SED1797D0B S1D17907D00B SED1799T0A S1D17909T00A Power supply ICs for logic Previous number New number SCI7852* S1F785200 SCI7665* S1F76650* SCI7110M0A S1F71100M0A0 SCI7120M0A S1F71200M0A0 SCI7120M0B S1F71200M0B0 S1D19000 series lineup Previous number New number SED1906T0A S1D19006T00A Thermal-head drivers Previous number New number SED5035D0A S1D50350D0A0 SED5036D0A S1D50360D0A0 SED5036F0A S1D50360F0A0 SED5068D0A S1D50680D0A0 SED5300D0A S1D53000D0A0 SED5301D0A S1D53010D0A0 SED5310D0A S1D53100D0A0 SED5316D5A S1D53160D5A0 SED5316D6A S1D53160D6A0 SED5615D0A S1D56150D0A0 SED5620D0A S1D56200D0A0 SED5624D0A S1D56240D0A0 SED5625D0A S1D56250D0A0 SED5626D0A S1D56260D0A0 SED5628D0A S1D56280D0A0 SED5668D0A S1D56680D0A0 SED5680D0A S1D56800D0A0 SED5682D0A S1D56820D0A0 SED5684D0A S1D56840D0A0 SED5685D0A S1D56850D0A0 SED5686D0A S1D56860D0A0 SED5688D1A S1D56880D1A0 New number S1R72103F00A S1R72104F00B S1R72105F00A S1R72106F00A Power supply ICs for liquid crystal Previous number New number SCI7551* S1F75510* SCI7530M0A* S1F75300M0A0 DC to DC converters Previous number New number SCI7660D0B S1F76600D0B0 SCI7660C0B S1F76600C0B0 SCI7660M0B S1F76600M0B0 SCI7662M0A S1F76620M0A0 SCI7662D0A S1F76620D0A0 DC to DC converters and voltage regulators Previous number New number SCI7661D0B S1F76610D0B0 SCI7661C0B S1F76610C0B0 SCI7661M0B S1F76610M0B0 SCI7661MBB S1F76610M2B0 SCI7654C0A S1F76540C0A0 SCI7654M0A S1F76540M0A0 SCI7664M0A S1F76640M0A0 SCI7664D0A S1F76640D0A0 Switching regulators Previous number New number SCI7631MLA S1F76310M1L0 SCI7631MBA S1F76310M1B0 SCI7631MKA S1F76310M1K0 SCI7631MAA S1F76310M1A0 SCI7633MBA S1F76330M1B0 SCI7638MHA S1F76380M1H0 SCI7638MLA S1F76380M1L0 High precision voltage regulators Previous number New number SCI7810YHB S1F78100Y2H0 SCI7810YGB S1F78100Y2G0 SCI7810YFB S1F78100Y2F0 SCI7810YLB S1F78100Y2L0 SCI7810YRB S1F78100Y2R0 SCI7810YDB S1F78100Y2D0 SCI7810YCB S1F78100Y2C0 SCI7810YTB S1F78100Y2T0 SCI7810YNB S1F78100Y2N0 SCI7810YKB S1F78100Y2K0 SCI7810YPB S1F78100Y2P0 SCI7810YMB S1F78100Y2M0 SCI7810YBB S1F78100Y2B0 SCI7810YAB S1F78100Y2A0 SCI7910YHA S1F79100Y1H0 SCI7910YGA S1F79100Y1G0 SCI7910YDA S1F79100Y1D0 SCI7910YPA S1F79100Y1P0 SCI7910YBA S1F79100Y1B0 High precision voltage detectors Previous number New number SCI7720YVA S1F77200Y1V0 SCI7720YAA S1F77200Y1A0 SCI7720YYA S1F77200Y1Y0 SCI7720YBA S1F77200Y1B0 SCI7720YNA S1F77200Y1N0 SCI7720YCA S1F77200Y1C0 SCI7720YFA S1F77200Y1F0 SCI7720YTA S1F77200Y1T0 SCI7721YCA S1F77210Y1C0 SCI7721YCB# S1F77210Y2C0 SCI7721YPA S1F77210Y1P0 SCI7721YSA S1F77210Y1S0 SCI7721YEA S1F77210Y1E0 SCI7721YFA S1F77210Y1F0 SCI7721YFB# S1F77210Y2F0 SCI7721YRA S1F77210Y1R0 SCI7721YGA S1F77210Y1G0 SCI7721YHA S1F77210Y1H0 SCI7721Y3A S1F77210Y130 SCI7721YTA S1F77210Y1T0 SCI7721YMA S1F77210Y1M0 SCI7721YJA S1F77210Y1J0 SCI7721Y2A S1F77210Y120 SCI7721YKA S1F77210Y1K0 SCI7721YLA S1F77210Y1L0 9 ASSPs Melody ICs Previous number SVM7560M0A SVM7560M0B/C0B SVM7560D0K SVM7560M0M/C0M/ D0M SVM7560M0V SVM7561M0B/C0B/ D0B SVM7561M0C/C0C/ D0C SVM7100M0J New number S1V75600M00A S1V75600M00B/ C00B S1V75600D00K S1V75600M00M/ C00M/D00M S1V75600M00V S1V75601M00B/ C00B/D00B S1V75601M00C/ C00C/D00C S1V71000M00J Music generators Previous number SVM7570M5P SVM7570M6F SVM7571C5N SVM7571C6G SVM7571C6H SVM7571C6J SVM7571C6K SVM7571C6N SVM7571C6P New number S1V75700M05P S1V75700M06F S1V75701C05N S1V75701C06G S1V75701C06H S1V75701C06J S1V75701C06K S1V75701C06N S1V75701C06P Standard melodies Previous number 7571C5N (5.0V spec.) 7571C6G (5.0V spec.) 7571C6H (5.0V spec.) 7570M5P/ (5.0V spec.) 7571C6K (5.0V spec.) 7571C6N (5.0V spec.) 7571C6P (5.0V spec.) 7570M6F (5.0V spec.) 7560M0A 7560M0B/C0B 7560D0K 7560M0M/C0M/D0M 7560M0V 7561M0B/C0B/D0B 7561M0C/C0C/D0C 10 New number S1V75701C05N S1V75701C06G S1V75701C06H S1V75700M05P/S1V 75701C06J S1V75701C06K S1V75701C06N S1V75701C06P S1V75700M06F S1V75600M00A S1V75600M00B/ C00B S1V75600D00K S1V75600M00M/ C00M/D00M S1V75600M00V S1V75601M00B/ C00B/D00B S1V75601M00C/ C00C/D00C Comparison table between new and previous number ASSPs, MEMORIES MEMORIES Static RAMs Previous number SRM2AW216LLBT1 SRM2AW216LLBT7 SRM2AV213LLBT8 SRM2AW416LLBT1 SRM2AW416LLBT7 SRM2AV413LLBT8 SRM2AV400LLBT8 SRM2BW413LLBT7 SRM2AV613LLBT8 SRM2BV813LLBT7 New number S1M0W026B0J1 S1M0W026B0J7 S1M0V023B0J8 S1M0W046B0J1 S1M0W046B0J7 S1M0V043B0J8 S1M0V040B0J8* S1M1W043B0J7* S1M0V063B0J8* S1M1V083B0J7 11 PACKAGE Information Configurations Plastic Fine Pitch BGA Plastic QFP & Plastic TQFP Pin count Package code 48 QFP12 TQFP12 QFP13 TQFP13 QFP15 QFP5 QFP14 TQFP14 QFP5 TQFP14 QFP15 TQFP15 QFP5 QFP8 QFP15 TQFP15 QFP26 QFP20 TQFP24 QFP8 QFP21 QFP20 QFP23 QFP8 QFP22 QFP21 QFP23 QFP8 QFP22 QFP10 64 80 100 128 144 160 176 184 208 216 240 256 304 Body size (mm) 7 X 7 X 7 X 7 X 10 X 10 X 10.2 X 10.2 X 14 X 14 X 14 X 20 X 12 X 12 X 12 X 12 X 14 X 20 X 12 X 12 X 14 X 14 X 14 X 14 X 14 X 20 X 28 X 28 X 14 X 14 X 14 X 14 X 14 X 20 X 20 X 20 X 16 X 16 X 28 X 28 X 24 X 24 X 20 X 20 X 32 X 32 X 28 X 28 X 28 X 28 X 24 X 24 X 32 X 32 X 28 X 28 X 28 X 28 X 40 X 40 X 1.4 1.0 1.4 1.0 1.4 2.7 1.4 1.0 2.7 1.0 1.4 1.0 2.7 3.35 1.4 1.0 1.4 1.4 1.0 3.35 1.4 1.4 3.4 3.35 1.4 1.4 3.4 3.35 1.4 3.8 Lead type Pin count Package code Body size (mm) Ball pitch (mm) STD STD STD STD STD S2 STD STD S2 STD STD STD S2 E1 STD STD STD STD STD E1 STD STD STD S1 STD STD S1 S3 STD S1 48 81 121 180 220 PFBGA48 PFBGA81 PFBGA121 PFBGA180 PFBGA220 7X 7 8X 8 10 X10 12 X12 14 X14 0.8 0.8 0.8 0.8 0.8 Tape BGA Pin count Package code Body size (mm) Ball pitch (mm) 352 420 480 T-BGA352 T-BGA420 T-BGA480 35 X 35 35 X 35 35 X 35 1.27 1.27 1.27 Package code Body size (mm) Lead type HQFP12 H3QFP12 HQFP13 H3QFP13 H4TQFP13 H3QFP14 H2QFP5 H3QFP5 HQFP15 H2QFP15 H3QFP15 H4TQFP15 HQFP5 H3QFP5 HQFP8 H3QFP15 HQFP8 HQFP8 HQFP8 H2QFP8 HQFP23 H2QFP23 H2QFP8 7 X 7 X1.4 7 X 7 X1.4 10 X 10 X1.4 10 X 10 X1.4 10 X 10 X1.4 12 X 12 X1.4 14 X 20 X2.7 14 X 20 X2.7 14 X 14 X1.4 14 X 14 X1.4 14 X 14 X1.4 14 X 14 X1.4 14 X 20 X2.7 14 X 20 X2.7 28 X 28 X3.35 14 X 14 X1.4 28 X 28 X3.35 28 X 28 X3.35 28 X 28 X3.35 28 X 28 X3.35 32 X 32 X3.4 32 X 32 X3.4 28 X 28 X3.35 STD STD STD STD STD STD S2 S2 STD STD STD STD S2 S2 E1 STD E1 E1 S1 S1 S1 S1 S3 HQFP Pin count 48 64 80 100 128 Plastic BGA Pin count 225 256 352 388 Package code PBGA225 PBGA256 PBGA352 PBGA388 Body size (mm) Ball pitch (mm) 27 X 27 27 X 27 35 X 35 35 X 35 1.5 1.27 1.27 1.27 144 160 208 240 256 Ceramic Fine Pitch LGA 12 Pin count Package code Body size (mm) Land pitch (mm) 104 104 152 239 307 424 CFLGA104 CFLGA104 CFLGA152 CFLGA239 CFLGA307 CFLGA424 8X 8 9X 9 11 X 11 13 X 13 15 X 15 17 X 17 0.65 0.8 0.8 0.8 0.8 0.8 Plastic DIP Pin count 8 18 24 28 32 Package code Body size (mm) DIP DIP DIP DIP DIP 9.7 X 6.4 23.2 X 6.3 32 X 13.6 37.4 X 13.4 42.5 X 13.4 PACKAGE Configurations Plastic SOP 8 16 28 Package code SOP3A SOP3A SOP2 Body size (mm) Lead type 5.2 X 4.4 10.2 X 4.4 18.1 X 8.4 STD STD STD Pin count 28 44 Package code Body size (mm) Lead type TSOP( I ) TSOP( II ) 11.8 X 8 18.81 X 10.16 STD STD Package code Body size (mm) SOT89 SOT89 4.5 X 2.5 4.5 X 2.5 PACKAGE Pin count Plastic TSOP SOT89 Plastic SSOP Pin count 16 20 Package code Body size (mm) Lead type SSOP2 SSOP1 7 X 4.4 6.5 X 4.4 STD STD Pin count 3 5 Lead type STD Standard type Standard Seiko Epson Product S1 Short lead type1 S2 Short lead type2 S3 Short lead type3 Short lead version of Seiko Epson standard product E1 Equivalent lead type1 Type with identical lead length, but different standoff height from Seiko Epson standard product Ordering: When placing device orders, always specify the package code (EPSON code), package material, pin count and lead type. For example, Plastic Material QFP5 Package code 100pin Pin count S2 Lead type Note: If thers is more than one assembly manufacture for a device, the package dimensions may differ for each manufacture. Detailed descriptions of each device, including package dimensions, are available on request. Inch dimensions are given for reference only. When designing patterns, use the metric dimensions. 13 PACKAGE Configurations Plastic DIP 32 pin 24 pin 28 pin 18 pin 8 pin Plastic SOP SOP2-28 pin Plastic TSOP 28 pin SOP3A-16 pin SOP3A-8 pin Plastic SSOP SSOP1-20 pin SSOP2-16 pin Plastic QFP QFP10-304 pin 14 QFP22-256 pin QFP8-256 pin PACKAGE Configurations PACKAGE Plastic QFP QFP20-184 pin QFP8-128 pin QFP23-240 pin QFP5-128 pin QFP21-176 pin QFP22-208 pin QFP15-100 pin QFP8-160 pin QFP5-100 pin QFP8-208 pin QFP20-144 pin QFP14-80pin QFP23-184 pin QFP15-128 pin QFP5-80 pin 15 PACKAGE Configurations Plastic QFP QFP15-64 pin QFP13-64 pin QFP12-48 pin Plastic TQFP TQFP15-128 pin TQFP15-100 pin Plastic HQFP HQFP15-100pin H2QFP23-240pin HQFP8-144pin H3QFP13-64pin H3QFP12-48pin HQFP8-208pin HQFP8-128pin HQFP5-128pin HQFP8-160pin 16 PACKAGE Configurations 5 pin PACKAGE SOT 89 3 pin BGA 256 pin 480 pin 225 pin 388 pin 17 PACKAGE Dimensions Unit: mm Plastic QFP Plastic QFP10-304pin-S1 Plastic QFP23-240pin-S1 42.60.4 400.1 34.60.4 320.1 153 229 180 152 121 320.1 400.1 120 42.60.4 181 34.60.4 228 INDEX INDEX 304 77 76 61 240 3.98max 0.150.05 0 10 0.50.2 1 3.40.1 +0.1 0.2 -0.05 +0.1 0.5 0.2 -0.05 60 0.15 0.38 3.80.1 0.5 0.4 4.5max 1 0.50.2 1.3 0 10 1.3 Plastic QFP22-256pin Plastic QFP21-216pin 260.4 300.4 240.1 280.1 162 129 193 108 240.1 INDEX INDEX 256 64 1 54 0.1 1.40.1 0.180.1 0.125 0 10 0.50.2 0.1 +0.05 0.125-0.025 0 10 0.50.2 1.7max 0.4 1.40.1 0.4 +0.05 0.16-0.03 55 216 65 1 1 1 Plastic QFP8-256pin-S3 Plastic QFP22-208pin 300.4 30.60.4 280.1 280.1 192 156 129 193 280.1 280.1 30.60.4 104 INDEX INDEX 65 64 0.32 4max +0.05 0.125 -0.025 0 10 0.50.2 1.40.1 0.5 1.3 18 53 1 1.7max 0.4 +0.1 0.15-0.05 208 0.1 3.350.1 256 1 105 157 128 300.4 1.7max 109 163 300.4 280.1 128 260.4 192 +0.1 0.2 -0.05 52 +0.05 0.125-0.025 0 10 0.50.2 1 PACKAGE Dimensions Unit: mm Plastic QFP21-176pin 30.60.4 260.4 280.1 240.1 156 105 132 104 88 240.1 280.1 INDEX INDEX 53 208 1 +0.1 1 52 0.5 0.32 4max 0.150.05 0 10 0.50.2 44 +0.1 0.2-0.05 1.40.1 0.2 -0.05 1.7max 0.5 45 176 +0.05 0.125 -0.025 0 10 0.50.2 0.1 1 1.3 Plastic QFP23-184pin Plastic QFP8-160pin-E1 35.20.4 31.20.4 320.1 280.1 93 120 92 280.1 320.1 80 INDEX INDEX 160 47 184 46 0.38 0.150.05 0 10 0.80.2 0.65 0.30.1 4max 0.30.1 40 0.150.05 0 10 0.80.2 0.35 3.40.1 0.65 41 1 3.350.1 1 3.98max 81 121 35.20.4 139 1.6 1.6 Plastic QFP20-184pin Plastic QFP20-144pin 220.4 220.4 200.1 200.1 138 93 108 92 72 200.1 220.4 INDEX INDEX 46 1 36 +0.05 0.125-0.025 0 10 0.50.2 1 1.40.1 0.5 1.7max 0.4 +0.05 0.16-0.03 0.1 1 37 144 47 184 1.40.1 73 109 200.1 139 1.7max 31.20.4 138 220.4 3.350.1 89 133 30.60.4 157 0.1 PACKAGE Plastic QFP8-208pin-S1 260.4 Plastic QFP +0.1 0.2 -0.05 +0.05 0.125-0.025 0 10 0.50.2 1 19 PACKAGE Dimensions Unit: mm Plastic QFP Plastic QFP26-128pin Plastic QFP5-128pin-S2 220.4 23.20.4 200.1 200.1 102 102 65 65 103 103 64 140.1 INDEX 39 128 128 39 38 0.5 +0.09 0.5 0.20.05 3.5max +0.05 0.125 -0.02 0 10 0.50.2 0.35 2.70.1 0.18 -0.03 0.1 0.150.05 0 10 0.80.2 1.6 1 Plastic QFP15-128pin Plastic QFP15-100pin 160.4 160.4 140.1 140.1 65 75 64 50 140.1 160.4 INDEX INDEX 33 128 1 1 +0.1 +0.1 0.18 -0.05 +0.05 0.125 -0.025 0 10 0.50.2 0.1 +0.05 0.125-0.025 0 10 0.50.2 25 0.5 1.40.1 0.16 -0.05 1.7max 1.40.1 0.4 26 100 32 0.1 1.7max 51 76 140.1 97 1 1 Plastic QFP8-128pin-E1 Plastic QFP5-100pin-S2 31.20.4 23.20.4 280.1 200.1 96 65 80 64 140.1 280.1 1 0.65 32 +0.1 30 0.3 -0.05 0.150.05 0 10 0.80.2 1.6 3.5max 0.350.1 0.35 2.70.1 0.35 31 100 33 1 3.350.1 50 INDEX INDEX 128 0.8 51 81 31.20.4 97 4max 160.4 96 17.20.4 1.7max 1 38 1.40.1 1 20 17.20.4 160.2 140.1 64 0.150.05 0 10 0.80.2 1.6 PACKAGE Dimensions Unit: mm Plastic QFP13-64pin 120.4 140.4 100.1 120.1 60 48 41 61 40 32 100.1 140.4 120.1 INDEX 20 +0.05 0.1 0.125 -0.025 0 10 0.50.2 16 1.40.1 1 +0.1 0.18 -0.05 1.7max 0.5 0.5 +0.1 0.18 -0.05 +0.05 0.125 -0.025 0 10 0.50.2 0.1 1 17 64 21 1.40.1 33 49 INDEX 80 1 1 Plastic QFP5-80pin-S2 Plastic QFP12-48pin 90.4 23.20.4 70.1 200.1 64 36 41 25 40 65 70.1 INDEX 24 17.20.4 140.1 37 90.4 1.7max PACKAGE Plastic QFP14-80pin 120.4 Plastic QFP INDEX 25 80 48 1 +0.1 0.8 13 24 0.35 -0.05 2.70.1 1 12 0.35 1.6 1.7max 0.150.05 0 10 0.80.2 +0.1 0.18 -0.05 0.1 1.40.1 3.5max 0.5 +0.05 0.125-0.025 0 10 0.50.2 1 Plastic QFP15-64pin 160.4 140.1 48 33 140.1 160.4 32 49 INDEX 17 64 1.40.1 16 0.8 +0.1 0.35 -0.05 +0.05 0.125 -0.025 0 10 0.50.2 0.1 1.7max 1 1 21 PACKAGE Dimensions Unit: mm Plastic TQFP Plastic TQFP15-128pin Plastic TQFP14-80pin 160.4 140.2 140.1 96 120.1 60 65 97 41 40 80 21 120.1 140.2 61 160.4 140.1 64 INDEX 128 33 1 32 +0.05 0.16-0.03 0.50.2 20 1.2max 10.1 0 10 0.20.03 0.5 +0.035 0.125 -0.025 0 10 0.50.2 0.1 10.1 1 +0.05 0.125 -0.025 0.1 1.2max 0.4 1 1 Plastic TQFP15-100pin Plastic TQFP13-64pin 160.4 120.4 10.20.1 140.1 75 48 51 33 32 64 17 10.20.1 160.4 140.1 49 120.4 50 76 INDEX 26 100 1 25 +0.1 1 0.2 -0.03 16 1.2max 10.1 +0.05 0.125 -0.025 0 10 0.50.2 +0.07 0.5 0.15 0.1 10.1 0.18-0.05 0.1 0.50.2 Plastic TQFP12-48pin Plastic TQFP14-100pin 90.4 70.1 140.4 36 120.1 37 24 48 13 INDEX 70.1 140.4 120.1 50 100 26 +0.1 0.15 -0.05 1 25 0.2 0.1 0.4 0.50.2 1 0 10 0.5 0.20.03 12 1.2max 0.1 10.1 1 1.2max 10.1 25 51 76 22 0 10 1 1 75 +0.05 -0.025 90.4 1.2max 0.5 0.1250.035 0 10 0.50.2 1 PACKAGE Dimensions Unit: mm Plastic HQFP8-208pin-S1 PACKAGE Plastic H2QFP8-256pin-S3 30.60.4 30.60.4 280.1 280.1 192 156 129 104 280.1 128 280.1 30.60.4 193 105 157 30.60.4 Plastic HQFP INDEX INDEX 208 65 3.350.1 +0.1 0.4 64 0.15 -0.05 4max +0.05 0.32 0.125 -0.025 0 10 0.50.2 1.3 Plastic H2QFP23-240pin-S1 0.5 +0.1 0.2 -0.05 52 0.150.05 0 10 0.50.2 4max 1 53 1 0.32 3.350.1 256 1.3 Plastic HQFP8-160pin-E1 31.20.4 34.60.4 280.1 320.1 120 81 121 121 280.1 80 34.60.4 320.1 120 31.20.4 180 181 INDEX INDEX 160 61 3.350.1 0.2 -0.05 60 0.15 0 10 0.2 40 0.65 0.30.1 0.150.05 0 10 0.80.2 4max +0.1 0.5 41 1 0.35 3.40.1 1 0.38 3.98max 240 0.5 1.3 1.6 Plastic HQFP8-144pin-E1 Plastic H2QFP8-208pin-S1 31.20.4 31.20.4 280.1 280.1 105 108 104 72 280.1 INDEX INDEX 52 3.350.1 +0.1 0.150.05 0 10 0.60.2 1.6 4max 0.2-0.05 0.35 3.350.1 3.65max 0.1 0.5 37 144 53 208 1 73 109 31.20.4 280.1 157 31.20.4 156 1 36 0.65 0.30.1 0.150.05 0 10 0.80.2 1.6 23 PACKAGE Dimensions Unit: mm Plastic HQFP Plastic H3QFP15-128pin-STD Plastic H4TQFP15-100pin 160.4 160.4 140.1 96 140.1 65 75 97 51 64 140.1 160.4 50 160.4 140.1 76 INDEX 128 1 26 1 32 0.5 +0.1 0.16 -0.05 +0.1 25 0.18 -0.05 1.2max 0.1 10.1 1.40.1 0.4 +0.05 0.125-0.025 0 10 0.50.2 0.1 1.7max 100 33 +0.05 0.125 -0.025 0 10 0.50.2 1 1 Plastic HQFP8-128pin-E1 Plastic H3QFP15-100pin-STD 31.20.4 160.4 280.1 140.1 65 64 50 140.1 280.1 INDEX INDEX 128 1 32 4max 0.150.05 0.35 0 10 0.80.2 25 0.5 1.40.1 1.7max 0.350.1 +0.1 0.18 -0.05 +0.05 0.125 -0.025 0 10 0.50.2 0.1 1 1.6 Plastic HQFP15-100pin-STD (Under development) Plastic HQFP5-128pin-S2 23.20.4 160.4 200.1 140.1 102 75 65 103 51 76 INDEX 50 140.1 17.20.4 140.1 64 160.4 0.8 26 100 33 1 3.350.1 51 76 31.20.4 97 75 160.4 96 INDEX 39 128 38 0.150.05 0 10 0.80.2 1.6 24 1.40.1 1 0.20.05 1.7max 3.5max 0.35 2.70.1 0.5 26 25 0.5 +0.1 0.18 -0.05 +0.05 0.125 -0.025 0 10 0.50.2 0.1 1 100 1 PACKAGE Dimensions Unit: mm Plastic H2QFP5-100pin-S2 Plastic H4TQFP13-64pin 23.20.4 PACKAGE Plastic HQFP 120.4 200.1 100.1 80 51 48 33 100 32 64 17 120.4 49 100.1 140.1 50 17.20.4 81 31 1 30 0.30.1 2.70.1 10.1 1.2max 0.35 0.150.05 0 10 0.80.2 0.5 +0.1 16 0.18-0.05 0.180.1 0 10 0.50.2 0.1 3.5max 1 1 1.6 Plastic H3QFP14-80pin-STD Plastic H3QFP12-48pin-STD 90.4 140.4 70.1 120.1 60 36 41 61 40 25 24 70.1 140.4 120.1 37 90.4 0.65 INDEX INDEX 80 21 1 13 1 20 12 +0.1 0.5 +0.05 0.1 0.125 -0.025 0 10 0.50.2 1.7max 0.18 -0.05 +0.1 0.18 -0.05 0.1 1.40.1 +0.05 0.125-0.025 0 10 0.50.2 1 1 Plastic H3QFP13-64pin-STD Plastic HQFP12-48pin 120.4 90.4 100.1 48 70.1 33 36 24 48 13 120.4 100.1 37 70.1 32 49 25 90.4 0.5 1.40.1 1.7max 48 INDEX 17 16 +0.1 0.18 -0.05 +0.05 0.125 -0.025 0.1 0 10 0.50.2 1 0.5 +0.1 12 0.18 -0.05 +0.05 1.7max 0.5 0.125 -0.025 0 10 0.1 1.40.1 1.7max 1 1.40.1 64 0.50.2 1 1 25 PACKAGE Dimensions Unit: mm Plastic DIP Plastic DIP-32pin (600mil) Plastic DIP-18pin (300mil) 23.2max 42.5max (0.913max) 41.9 (0.89 -0.004) (1.673max) 0.1 22.6+0.003 (1.65) 16 10 1 9 6.30.1 1 18 (0.2480.003) 17 13.4 (0.528) 32 0.80.1 +0.004 (0.031 -0.003 ) 3.90.1 +0.003 002 0.457 (0.018) 0 15 15.24 (0.6) 3min 0.05 0.25+0.001 ) (0.01 -0. 2.54 (0.1) (0.119min) (0.154 -0.004 ) 0.51min (0.021min) 5.08max 2.7min (0.107min) (0.2max) 40.1 +0.004 (0.157 -0.003 ) 1.5 (0.059) 1.524 (0.06) +0.03 1 0.25 -0.0 +0.001 0.460.01 (0.018) 2.54 (0.1) Plastic DIP-28pin (600mil) 0 15 (0.01 -0 7.62 (0.3) Plastic DIP-8pin (300mil) 9.7max (0.381max) 37.4max (1.472max) 9.10.2 +0.008 (0.358 -0.007 ) 0.1 36.7+0.003 (1.445 -0.004 ) INDEX 1 1 4 14 1.5 05 0 15 (0.018 -0.003 ) 002 15.24 (0.6) 32max 0.1 13.6+0.004 (0.535 -0.003 ) 13 3min 0.80.1 +0.004 4.40.1 +0.004 (0.119min) (0.173 -0.003 ) (0.031 -0.003 ) 12 1.5 (0.059) +0.03 -0.01 0.25 +0.001 ) 2.54 (0.1) 0.460.05 +0.002 (0.018 -0.001 ) (0.01 -0 0 15 (0.016min) 0.4min 3.75 2.54 0.1 31.6+0.004 (1.244 -0.003 ) 1 +0.03 1 0.25 -0.0 +0.001 (0.1) (1.259max) 24 (0.148) 4.6max 0.60.1 +0.003 (0.024 -0.004 ) ( 0. 0.25+0.001 ) (0.01 -0. 0.1 0.46+0.004 2.54 (0.1) 3.1min 40.1 +0.004 0.157 -0.003 1.5 (0.059) (0.123min) (0.181max) 3min 4.60.1 +0.004 (0.119min) (0.181 -0.003 ) ) (0.059) Plastic DIP-24pin(600mil) 26 6.40.2 0.1 13.4+0.003 5 (0.2520.007) 8 15 (0.528 -0.004 ) 28 15.24 (0.6) ( 0.1 0.46+0.004 0.018 -0.003 (0.01 -0 ) 0 15 7.62 (0.3) ) ) PACKAGE Dimensions Plastic SOP2-28pin (450mil) Unit: mm Plastic SSOP Plastic SSOP1-20pin PACKAGE Unit: mm Plastic SOP 6.50.1 +0.003 18.1max (0.256 -0.004 ) (0.712max) 0.1 17.8+0.003 0.701 -0.004 ( ) 20 11 6.40.3 INDEX (0.2520.011) 4.40.1 +0.004 (0.173 -0.003 ) 8.40.1 +0.003 0.3 11.8+0.011 (0.465 -0.012 ) 15 (0.331 -0.004 ) 28 0 10 0 10 1.05 (0.041) 2.50.15 +0.006 10 2.9max (0.114max) 1 0.150.05 +0.001 1.2max (0.047max) 14 (0.098 -0.005 ) 1 0.15 (0.006 -0.002 ) 0.1 0.22+0.003 0.65 (0.026) 1.7 (0.067) 0.2 0.5+0.007 (0.02 -0.008 ) 0.1 ) (0.004) ( 0.2 1.27 (0.05) (0.006) 10.3 +0.012 (0.039 -0.011 ) (0.008) 0.40.1 +0.003 0.016 -0.004 (0.009 -0.004 ) 1 (0.039) Plastic SSOP2-16pin Plastic SOP3A-16pin (225mil) 0.2 10.2+0.007 7max (0.402 -0.008 ) (0.275max) 0.2 6.6+0.007 (0.26 -0.008 ) 9 4.40.2 +0.008 (0.173 -0.007 ) INDEX 9 6.20.3 (0.2440.011) 4.40.2 +0.008 (0.173 -0.007 ) 16 INDEX 6.20.3 (0.2440.011) 16 0 10 0 10 1.50.1 (0.002) (0.059) 1.5 (0.006 -0.002 ) 0.50.2 +0.007 0.02 -0.008 ( ) 0.9 (0.035) 0.8 (0.031) 0.1 0.36+0.004 0.014 -0.003 ( ) 0.05 (0.016 -0.004 ) 0.150.05 +0.003 0.15 (0.006) 0.05 0.40.1 +0.003 1.27 (0.05) (0.0590.003) 8 1.7max (0.066max) 1 1.7max (0.066max) 8 (0.002) 1 0.2 0.5+0.007 (0.02 -0.008 ) 0.9 (0.035) Plastic SOP3A-8pin (225mil) 5.20.2 +0.007 (0.205 -0.008 ) 1.7max 1.50.1 (0.066max) 4 (0.0590.003) 1 6.20.3 4.40.2 +0.008 INDEX (0.2440.011) 5 (0.173 -0.007 ) 8 +0.1 0.15-0.05 +0.003 0.40.1 +0.003 (0.016 -0.004 ) 0.05 1.27 (0.05) (0.002) (0.006 -0.002) 0.40.2 +0.007 (0.016 -0.008 ) 0.9 (0.035) 27 PACKAGE Dimensions Unit: mm Plastic TSOP Plastic TSOP(II)-44pin Unit: mm SOT89 SOT89-5pin 4.50.1 1.6 18.81max (0.740max) 0.44max 0.49max 0.4 0 10 1 2 3 1.5 1.5 0.44max 1.15max (0.045max) 1.50.1 0.50.2 (0.0200.007) 0.8 0.49max 0.54max SOT89-3pin Plastic TSOP(I)-28pin 0.3 13.4+0.011 4.50.1 (0.528 -0.012 ) 0.4 (0.3150.007) 1.1 80.2 1 8 0 10 3 1.50.1 (0.006 -0.004 ) 0.1 0.5+0.003 (0.02 -0.004 ) 0.8 (0.031) 28 0.55 (0.022) 0.40.03 1.50.1 1.27max (0.05max) 0 0.1 0.15+0.003 2 1.50.1 (0) 7 2.50.1 21 INDEX 28 1 0.40.03 1.60.2 0.2 11.8+0.007 (0.465 -0.008 ) 22 0.49max (0.031) 40.25 0.10.1 0.30.1 (0.0120.003) 0.1250.05 (0.0050.001) 0.05 0.8 (0.031) (0.0390.003) 23 (0.002) 1 0.950.3 2.50.1 0.950.3 12.760.3 INDEX (0.5020.011) 10.160.1 24 (0.40.003) 44 4 +0.5 5 4.5-0.3 18.410.1 (0.7250.003) 0.20.1 +0.003 (0.008 -0.004 ) 0.420.06 0.420.06 0.470.06 PACKAGE Dimensions Unit: mm PBGA-388pin PBGA-225pin 35 27 300.2 240.1 PACKAGE Plastic BGA INDEX 25 0.60.1 +0.14 0.76 -0.16 0.60.1 30 1.530.1 21.3 1.730.2 2.33 300.2 35 24 -0.5 27 +0.7 INDEX 0.750.15 1.27 1.27 AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 1.5 1.5 R P N M L K J H G F E D C B A 1 3 5 7 9 11 13 15 17 19 21 23 25 2 4 6 8 10 12 14 16 18 20 22 24 26 1 2 3 4 5 6 7 8 9 101112131415 Plastic Fine Pitch BGA PBGA-256pin Unit: mm PFBGA-220pin +0.3 14 -0.15 27 +0.7 24 -0.5 INDEX 0.60.1 Y W V U T R P N M L K J H G F E D C B A 0.8 0.4 1.0 S R P N M L K J H G F E D C B A 0.8 1.27 1.27 0.4 +0.14 0.76 -0.16 1.0 30 1.2max 1.530.05 2.13 +0.1 0.35 -0.05 24 -0.5 27 +0.7 +0.3 14 -0.15 INDEX 1 2 3 4 5 6 7 8 9 10111213141516 1 2 3 4 5 6 7 9 11 13 15 17 19 8 10 12 14 16 18 20 29 PACKAGE Dimensions Plastic Fine Pitch BGA Unit: Unit: mm mm PFBGA-180pin PFBGA-81pin +0.3 +0.3 12 -0.15 8 -0.15 INDEX 0.8 0.4 +0.1 0.8 1.2max 0.35 -0.05 0.8 0.8 P N M L K J H G F E D C B A 0.8 J 0.8 H G 0.8 0.4 F E D B 0.8 A PFBGA-121pin +0.3 10 -0.15 +0.1 0.8 0.8 1.2max 0.35 -0.05 +0.3 10 -0.15 INDEX 1.0 1.0 0.8 0.8 L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 1 2 3 4 5 6 7 8 9 0.8 0.8 C 1 2 3 4 5 6 7 8 9 1011121314 30 1.2max +0.1 0.35 -0.05 +0.3 8 -0.15 +0.3 12 -0.15 INDEX PACKAGE Dimensions Ceramic Fine Pitch LGA Unit: mm CFLGA-239pin PACKAGE CFLGA-424pin 130.2 1.0max 0.05 1.0 0.05 17 130.2 17 0.5 16 0.8 0.80 0.4 0.5 T R AA Y W V U T R P N M L K J H G F E D C B A P N M L J 0.4 11.2 K H 16 G F E 0.8 D C 0.5 B A 1 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 1 0.5 21 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 20 11.2 CFLGA-307pin CFLGA-152pin 110.2 0.8 0.4 0.05 0.05 1.0max 1.0max 150.2 110.2 150.2 0.7 0.8 0.5 N M 0.4 L K J 2 4 5 6 7 8 9 10 11 12.8 12 13 14 15 16 17 18 0.8 F E D 0.8 3 G C B A 0.5 1 9.2 0.8 H 0.7 12.8 0.8 V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 9.2 31 PACKAGE Dimensions Ceramic Fine Pitch LGA Unit: mm CFLGA-104pin TBGA-420pin (Under development) 350.1 90.2 33.6 1.7max 0.05 0.6 1.0max 350.1 90.2 33.6 1.27 0.5 J H 7.2 G 0.8 F E 0.8 C B 1 2 3 4 5 6 7 8 9 10 0.5 A 11 1.625 0.635 L K D 0.635 AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 1.27 0.8 1 3 2 5 4 7 6 9 8 1.625 0.8 11 13 15 17 19 21 23 25 10 12 14 16 18 20 22 24 26 7.2 Unit: mm TBGA-352pin (Under development) 1.27 0.635 1.625 1 3 2 32 5 4 7 6 9 8 11 13 15 17 19 21 23 25 10 12 14 16 18 20 22 24 26 1.625 1.27 0.635 AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 0.635 1.625 AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 0.635 1.27 1.7max 33.6 0.6 33.6 350.1 33.6 1.7max 350.1 33.6 0.6 350.1 350.1 TBGA-480pin (Under development) 1 2 3 4 5 6 7 8 9 11 13 15 17 19 21 23 25 10 12 14 16 18 20 22 24 26 1.625 1.27 T-BGA Section 1 ASICs Page Gate arrays Embedded arrays S1L60000 series 34 S1L50000 series 34 S1L35000 series 35 S1L30000 series 35 S1L9000F series 36 S1X60000 series 37 S1X50000 series 37 S1X35000 series 37 S1K70000 series 38 S1K60000 series 38 S1K50000 series 38 S1K2500 series 38 Standard cells * : Under development 1 ASICs Gate Arrays -1 High-speed, high-density lineup S1L60000 Series S1L60000 Series (SLA60000 series) Series Features Triple layer Model Quadruple layer Raw gates Triple layer Quadruple layer Usable gates Pads z Ultra-high density (0.25m silicon gate CMOS with triple/quadruple layer metal) Raw gates: 99,220~2,519,604 gates z Ultra-high speed operation (Propagation delay: 107 ps/2.5V, 2-input NAND, typical) z Selectable supply voltage (Internal gate: 2.5V, 2.0V I/O Cell: 3.3V, 2.5V/2.0V) (built-in level shifter) z Low power consumption (0.18W/MHz/BC at 2.5V of the internal cell) z Driving capacity (IOL=0.1, 1, 3, 6, 12, 24mA, PCI/at 5.0V, IOL=0.1, 1, 2, 6, 9, 12mA, PCI/at 2.5V, IOL=0.05, 0.3, 1, 2, 3, 6mA/at 2.0V) z On-chip RAM, PLL* and various other functions. z Low noise output cell, PCI I/F, fail safe I/O, gated I/O, JTAG S1L60093 S1L60173 S1L60283 S1L60403 S1L60593 S1L60833 S1L61233 S1L61583 S1L61903 (SLA6017) (SLA6028) (SLA6040) (SLA6059) (SLA6083) (SLA6123) (SLA6158) (SLA6190) (SLA6251) S1L60094 S1L60174 S1L60284 S1L60404 S1L60594 S1L60834 S1L61234 S1L61584 S1L61904 S1L62514 (SLA600Q) (SLA601Q) (SLA602Q) (SLA604Q) (SLA605Q) (SLA608Q) (SLA612Q) (SLA615Q) (SLA619Q) (SLA625Q) 99,220 171,720 284,394 400,290 595,362 831,572 1,234,820 1,587,754 1,902,960 2,519,604 79,376 137,376 199,076 280,203 416,753 540,522 802,633 1,032,040 1,141,776 1,511,762 89,298 154,548 241,735 340,247 506,058 665,258 987,856 1,270,203 1,427,220 1,889,703 104*/112 132*/148 168*/188 200*/224 240*/272 284/320* 334/388* 388/440* 424/480* 488/552* Internal gates Propagation delay S1L62513 (SLA6009) tpd=107ps (at 2.5V, typical), 140ps (at 2.0V, 2-input NAND, typical) Input buffer tpd=260ps (at 5.0V, typical) level shifter, 270ps (at 2.5V, typical), 360ps (at 2.0V, typical) Output buffer tpd=1.5ns (at 5.0V, typical) level shifter, 1.6ns (at 2.5V, typical), 2.3ns (at 2.0V, typical), CL=15pF I/O level CMOS, LVTTL, PCI Input mode Normal, pull-up/pull-down, schmitt, level shifter, fail safe, Gated Output mode Normal, open-drain, 3-state, level shifter, fail safe, Gated * : Under development S1L50000 Series S1L50000 Series (SLA50000H series) Series z Ultra-high density (0.35m silicon gate CMOS with double/triple/quadruple layer metal) Raw gates: 28,710~815,486 gates z Ultra-high speed operation (Propagation delay: 0.14ns/3.3V, 2-input Power-NAND, typical) z Selectable supply voltage (Internal gate: 3.3V, 2.0V I/O Cell: 5.0V, 3.3V/2.0V) (built-in level shifter) z Low power consumption (0.70W/MHz/BC at 3.3V of the internal cell) z Driving capacity (IOL=0.1, 1, 3, 8, 12, 24mA, PCI/at 5.0V, IOL=0.1, 1, 2, 6, 12mA, PCI/at 3.3V, IOL=0.05, 0.3, 0.6, 2, 4mA/at 2.0V) z On-chip RAM, PLL and various other functions. z Low noise output cell, PCI I/F, USB I/F, fail safe output, JTAG Features Double layer Model Triple layer Quadruple layer Raw gates Double layer Triple Usable gates layer Quadruple layer Pads Propagation delay S1L50282 S1L50752 S1L50992 S1L51252 S1L51772 S1L52502 S1L53352 S1L54422 S1L55062 S1L56682 (SLA5028H) (SLA5075H) (SLA5099H) (SLA5125H) (SLA5177H) (SLA5250H) (SLA5335H) (SLA5442H) (SLA5506H) (SLA5668H) S1L58152 (SLA5815H) S1L50283 S1L50753 S1L50993 S1L51253 S1L51773 S1L52503 S1L53353 S1L54423 S1L55063 S1L56683 S1L58153 (SLA502TH) (SLA507TH) (SLA509TH) (SLA512TH) (SLA517TH) (SLA525TH) (SLA533TH) (SLA544TH) (SLA550TH) (SLA566TH) (SLA581TH) S1L50284 S1L50754 S1L50994 S1L51254 S1L51774 S1L52504 S1L53354 S1L54424 S1L55064 S1L56684 S1L58154 (SLA502QH) (SLA507QH) (SLA509QH) (SLA512QH) (SLA517QH) (SLA525QH) (SLA533QH) (SLA544QH) (SLA550QH) (SLA566QH) (SLA581QH) 28,710 75,774 99,198 125,772 177,062 250,160 335,858 442,112 506,688 668,552 815,468 14,355 35,614 46,623 56,597 79,678 112,572 144,419 176,845 202,675 267,421 326,187 25,265 64,408 84,318 100,618 132,797 187,620 251,894 309,478 354,682 467,986 570,828 27,275 71,985 94,238 119,483 168,209 237,652 319,065 397,901 456,019 601,697 733,921 88/104 144/168 168/192 188/216 224/256 264/304* 308/352* 352/404* 376/432* 432/496* 480/548* Internal gates tpd=0.14ns (at 3.3V, typical), 0.21ns (at 2.0V, typical) Input buffer tpd=0.38ns (at 5.0V, typical) level shifter, 0.4ns (at 3.3V, typical), 1.3ns (at 2.0V, typical) Output buffer tpd=2.12ns (at 5.0V, typical) level shifter, 2.02ns (at 3.3V, typical), 3.9ns (at 2.0V, typical), CL=15pF I/O level CMOS, LVTTL, PCI, USB Input mode Normal, pull-up/pull-down, schmitt, level shifter, fail safe, Gated Output mode Normal, open-drain, 3-state, level shifter, fail safe, Gated * : Under development Usable gates: 34 Differ depending on the circuit and the listing is for your reference. ASICs S1L35000 Series S1L35000 Series (SLA35000 series) Series z High density (0.6m silicon gate CMOS with triple layer metal) z High speed operation (Propagation delay: 0.4ns at 3.3V, 2-input Power - NAND, typical) z Selectable supply voltage (5.0V, 3.3V, 3.0V) z Low power consumption (0.77W/MHz/BC at 3.0V of the internal cell) z Driving capacity (IOL=1, 4, 8, 12mA at 5.0V) (IOL=0.5A, 2, 4, 6mA at 3.3V) z On-chip RAM S1L35043 S1L35063 Features S1L35093 S1L35163 (SLA3504) (SLA3506) (SLA3509) (SLA3516) Raw gates 41,417 64,320 95,760 161,841 Usable gates 26,921 38,592 52,668 80,920 Pads 110 130 162 210 Model Internal gates Propagation delay Input buffer Output buffer tpd=0.3ns (at 5.0V, typical), 0.4ns (at 3.3V, typical) tpd=0.48ns (at 5.0V, typical), 0.63ns (at 3.3V, typical) tpd=2.08ns (at 5.0V, typical), 2.86ns (at 3.3V, typical), CL=50pF I/O level CMOS, TTL Input mode Normal, pull-up/pull-down, schmitt Output mode Normal, open-drain, 3-state S1L30000 Series S1L30000 Series (SLA30000 series) Series Features Double layer Model Triple layer z High density (0.6m silicon gate CMOS with double-layer/triple-layer metal) z Ultra high speed operation (Propagation delay: 0.25ns at 5V 2-input Power-NAND, typical) z Selectable supply voltage (5V, 3.3V, 3V) (built-in level shifter) z High driving capacity (IOL=0.1A, 1, 4, 8, 12 or 24mA at 5V, IOL=0.05A, 0.5A, 2, 4, 6 or 12mA, PCI at 3.3V) z On-chip RAM z Low Noise Out Put Cell, PCI I/F S1L30182 S1L30302 S1L30422 S1L30552 S1L30752 S1L31092 S1L31252 S1L32162 (SLA3018) (SLA3030) (SLA3042) (SLA3055) (SLA3075) (SLA3109) (SLA3125) (SLA3216) S1L30183 S1L30303 S1L30423 S1L30553 S1L30753 S1L31093 S1L31253 S1L32163 (SLA301T) (SLA303T) (SLA304T) (SLA305T) (SLA307T) (SLA310T) (SLA312T) (SLA321T) Twin-power 18,544 30,846 42,262 55,341 75,450 109,080 125,836 216,216 Single-power 23,572 37,232 49,680 63,784 85,251 120,802 138,400 232,582 Usable gates (Dual-power) Double layer 9,272 15,423 19,863 26,010 33,952 49,086 54,109 86,486 Triple layer 16,318 26,219 35,077 44,272 58,851 81,810 94,377 151,351 Usable gates (Single-power) Double layer 11,786 18,616 23,349 29,978 38,362 54,360 59,512 93,032 Triple layer 20,743 31,647 41,234 51,027 66,495 90,601 103,800 162,807 128 160 184 208 240 256 304 376 Raw gates Pads Internal gate Propagation delay tpd=0.25ns (at 5.0V, typical), 0.33ns (at 3.3V, typical) Input buffer tpd=0.48ns (at 5.0V, typical), 0.63ns (at 3.3V, typical) Output buffer tpd=2.08ns (at 5.0V, typical), 2.86ns (at 3.3V, typical), CL=50pF I/O level CMOS, TTL, PCI Input mode Normal, pull-up/pull-down, schmitt, level interface Output mode Normal, open-drain, 3-state, level shifter Usable gates: Differ depending on the circuit and the listing is for your reference. 35 1 ASICs Gate Arrays -1 S1L9000F Series S1L9000F Series (SLA9000F series) Series z 1.0m silicon gate CMOS with double layer metal. z High speed operation (Internal gate delay tpd = 0.3ns at 5.0V, 2-input Power- NAND, typical). z Usable with simplified level shifter. z High drive output (IOL = 0.1A, 2, 6, 12 or 24mA/at 5.0V, IOL = 0.1, 1, 3, 6, 12mA/at 3.3V) z On-chip RAM z Low noise output cell Features S1L902F2 S1L904F2 S1L907F2 S1L909F2 S1L913F2 S1L919F2 S1L927F2 S1L944F2 (SLA902F) (SLA904F) (SLA907F) (SLA909F) (SLA913F) (SLA919F) (SLA927F) (SLA944F) Raw gates 2,784 4,392 7,872 9,540 13,144 19,350 27,234 44,070 Usable gates 1,809 2,854 4,723 5,724 7,229 10,642 13,617 22,035 Pads 80 100 128 144 160 184 208 256 Model Internal gate Propagation delay Input buffer tpd=0.91ns (at 5.0V, typical), 1.08ns (at 3.3V, typical) Output buffer tpd=3.5ns (at 5.0V, typical), 4.2ns (at 3.3V, typical), CL=50pF I/O level CMOS, TTL Input mode Normal, pull-up/pull-down, schmitt Output mode Normal, open-drain, 3-state Usable gates: 36 tpd=0.30ns (at 5.0V, typical), 0.43ns (at 3.3V, typical) Differ depending on the circuit and the listing is for your reference. 1 -2 ASICs Embedded Arrays An embedded array is an ASIC under a new method featuring consolidation of "Sea of gates" of a gate array and hard-macro cells for specific applications. With this product, the concept of system-on-chip has been realized by use of hard-macro cells with high functions and quicker delivery leadtime has become available when modifying the circuit, thanks to adoption of the "Sea of Gates" for the logic portion. Designing the embedded arrays When designing embedded arrays, execute system design first and determine the number of gates for the logic section and select the macro-cell to be used before starting manufacture of base bulks. The base bulks, placing necessary hard-macro cells and the Sea of Gates for the logic portion, are manufactured up to just before the routing process. In parallel with this manufacturing processes, processes from the circuit designing of the logic portion through post-simulation fix should be executed, similar to the cases of ordinary gate arrays, to go into sample production process after sign-off. After the sign-off, samples can be shipped with the same delivery leadtime as that of the gate arrays. Also, when making logic circuit modifications or ROM data changes, NRE charge and developing leadtime can be reduced to a level similar to that of the gate arrays. Products S1X60000 Series S1X50000 Series (SSL60000 Series) (SSL50000 Series) (SSL35000 Series) 0.25m, 3/4/5 layer metal 0.35m, 2/3/4 layer metal 0.6m, 3 layer metal Series Process S1X35000 Series Raw gates ~2.5M ~1.4M ~500K Internal cell delay 107ps / 2NAND, 2.5V 140ps / 2NAND, 3.3V 300ps / 2NAND, 5.0V Power consumption 0.17W/MHz/gate, 2.5V 0.39W/MHz/gate, 3.3V 2.4W/MHz/gate, 5.0V 1.8~2.7V 1.8~3.6V 2.7~5.0V 1.8~3.6V 1.8~5.5V 2.7~5.5V Supply voltage (Internal) Supply voltage (I/O) Macro-cell list y 1port RAM (Synchronous) y DMAC (F37) y IrDA Controller y PLL y 2port RAM (Synchronous) y RTC (F42) y USB Function Controller y ADC y FIFO y USRAT (F51) y PCMCIA Controller y DAC y ROM y PIT (F54) y USB2.0 Tranceiver* y Flash y PPI (F55) y IEEE1394 LINK* y OTPROM* y PIC (F59) y IEEE1394 PHY* y 8bit CPU (F80) y URAT (F65) y LVDS Receiver y 32bit RISC (S1C33) y LVDS Transmitter* y ARM7TDMI y TMDS Receiver* y LCD Controller * : Under development 37 1 ASICs Standard Cells -3 Standard Cells The standard cells are semi-custom ICs that incorporates a well-designed internal logic cell and ROM/RAM, CPU peripheral circuits or analog circuits into a single chip. Compared to the gate arrays, they boast higher design flexibility, functionality and integration capabilities, providing system LSI chips optimized to the customer needs. These features greatly help electronic device manufacturers design products with a compact body, lower power consumption, and a lower price. Integration (%) Power consumption (W/MHz/FF) Gate array Embedded array Standard cell S1L50000 Series S1X50000 Series S1K50000 Series (SLA50000H Series) (SSL50000 series) (SCB50000 series) 100 73 40 7.65 4.51 2.22 The standard cells offer 2/5 the degree of integration and 1/3 the power consumption of our S1L50000 series gate arrays. S1K70000 Series* Series S1K70000 Series (SCB70000 series) Features z High integrated (Use of 0.25m silicon-gate with 3/4/5-layer wiring process) z High-speed operation (Internal gate delay:TBD) z Selective supply voltage For a single power supply (1.8V, 1.5V, 1.1V) For dual power supplies (IO / Internal = 3.3V / 2.5V, 2.5V / 1.5V) z Low power consumption (TBD) z Output Current(TBD) Macro cell z Same as the embedded-array-mountable macrocells. Package z PKG lineup QFP48-304 pins, PBGA, TBGA, PFBGA, CFLGA *: Under development S1K60000 Series Series S1K60000 Series (SCB60000 series) Features z High integrated (Use of 0.25m silicon-gate with 3/4/5-layer wiring process) z High-speed operation (Internal gate delay: 107ps/2.5V, 2-input NAND, typical load) z Selective supply voltage For a single power supply (2.5V, 2.0V) For dual power supplies (3.3V I/O / 2.5V Internal, 3.3V I/O / 2.0V Internal) z Low power consumption (2.5V/MHz/gale, Internal cell at 2.5V) z Output Current (IOL=0.1, 1, 3, 6, 12, 24mA/at 3.3V, IOL=0.1, 1, 3, 6, 9, 18mA/2.5V internal, IOL=0.05, 0.3, 1, 2, 3, 6mA/at 2.0V) Macro cell z Same as the embedded-array-mountable macrocells. Package z PKG lineup QFP48-304 pins, PBGA, TBGA, PFBGA, CFLGA S1K50000 Series Series S1K50000 Series (SCB50000 series) Features z High integrated (Use of 0.35m silicon-gate with 2/3/4-layer wiring process) z High-speed operation (Internal gate delay: 0.14ns/3.3V, 2-input power NAND, typical load) z Selective supply voltage For a single power supply (2.0V, 2.5V, 3.3V) For dual power supplies (5.0V I/O / 3.3V Internal, 3.3V I/O / 2.5V Internal, 3.3V I/O / 2.0V Internal) z Low power consumption (0.25m/MHz/gate, Internal cell at 3.3V) z Output Current (IOL=0.1, 1, 3, 8, 12, 24mA/at 5.0V, IOL=0.1, 1, 2, 6, 12mA/at 3.3V, IOL=0.05, 0.3, 0.6, 2, 4mA/at 2.0V) Macro cell z Same as the embedded-array-mountable macro cells. Package z PKG lineup QFP48-304 pins, PBGA, TBGA, PFBGA, CFLGA Ultra Low Voltage Standard Cell S1K2500 Series Series S1K2500 Series (SSC2500 series) Features z Silicon gate CMOS, two layers (1.6 m) z Ultra low operating voltage (VDD = 0.9 to 5.5 V) z 300 to 16,000 gates available z Very low power consumption (1.0 W/MHz/gate, 3.0V; 0.25 W/MHz/gate, 1.5V) z The internal power supplies (with built-in internal level shifter and I/O level shifter) z Full built-in oscillating circuits (INV, RF, RD, CG, CD) z Analog cells can be incorporated. Package z PKG lineup QFP48~144 pins, SOP Usable gates: 38 Differ depending on the circuit and the listing is for your reference. 1 -4 ASICs Development of Gate Arrays Gate Arrays are developed you to coraborate with Seiko Epson. We are preparing design libraries for various ASIC development tools 1. RTL Interface After taking development as far as the function simulation stage, customers can send their Verilog-HDL or VHDL source files and test patterns to EPSON via an HDL interface, so that EPSON can perform logic synthesis. 2. Netlist Interface Customers can use the netlist interface to send EPSON gate-level netlists and test patterns for Verilog-HDL or VHDL code that has completed the logic synthesis stage, and EPSON will then implement the logic simulation stage. 3. Simulation Interface Customers can use this interface to send EPSON gate-level netlists and test patterns for Verilog-HDL or VHDL code that has completed the logic simulation stage. EPSON will then perform the subsequent tasks beginning with interconnect layout. Supporting libraries for ASIC design Tools ASIC Design Tools Available as of January, 2001 S1L60000 S1L50000 S1L35000 S1L30000 S1L9000F (SLA60000) (SLA50000H) (SLA35000) (SLA30000) (SLA9000F) Auklet Verilog-XL Design Compiler Design Power Prime Time --- --- --- : TestGen --- ModelSim Leonardo Supported, ---: Not Supported 39 1 -4 ASICs Development of Gate Arrays Customer SEIKO EPSON Function Design 1. RTL Interface Language Design Test Pattern Generation 2. Netlist Interface Logic Synthesis Logic Synthesis Logic Simulation Logic Simulation 3. Simulation Interface Post-layout Simulation 3. Simulation Interface Sample 40 Layout Post-layout Simulation Sign-off Preparation of Samples Section 2 MCUs Page S1C60 Family 4-bit microcomputers S1C62 Family High performance S1C63 Family 4-bit microcomputers Micro Mini S1C60 series 42 LCD drivers Infrared remote carrier modulation ourput S1C62100 series 43 LCD drivers Stepping motor driver For low-power application S1C6S200 series 43 LCD drivers for For low-power application S1C62N30/6S300 series 43 LCD drivers for Dot-matrix display S1C62400/6S400 series 44 LCD drivers On-chip R-F converter S1C62N50/62900 series 44 Multiple I /O ports S1C62600 series 45 LCD drivers On-chip dual slope A/D converter S1C62700 series 45 LCD drivers Melody function For low-power application S1C62N80 series 45 LCD drivers On-chip A-D converter and serial I/O ports S1C62M00 series 45 A/D converter S1C63100 series 46 Wide operation voltage High Speed S1C63200 series 46 7 Seg LCD drivers S1C63300 series 46 LCD drivers for Dot-matrix displays S1C63400 series 47 S1C63500 series 47 S1C63600 series 47 S1C63A/B00 series 48 FSK+CAS S1C05250 series 49 DTMF/DP generator LCD drivers On-chip R-F converter LCD drivers Built-in gate array Peripheral 8-bit S1C52 Family S1C88 Family microcomputers 32-bit microcomputers S1C33 Family Serial I/O S1C88100 series 50 LCD drivers for Dot-matrix displays Serial I/O ports S1C88300 series 50 LCD controller S1C88400 series 51 LCD driver internal bus only S1C88800 series 51 Basic model S1C33200 series 52 LCD controller S1C33L00 series 52 The diet functional version S1C33S00 series 53 Many pins (I/O ports) S1C33T00 series 52 For specific uses S1C33210 53 2 MCUs -1 4-bit Microcomputers 4-bit single-chip applicationoriented microcomputers S1C62/60(E0C62/60) family microcomputers are truly application-oriented, because they offer the features you need to get the job done -- flexible, modular architectures, a range of performance levels, and a wide selection of power supply voltages and package configurations. Built around the S1C6200(E0C6200) or S1C6200A(E0C6200A), SEIKO EPSON's powerful 4-bit core CPUs, the S1C62(E0C62) family lineup provides a wide choice of ROM and RAM capacities, I/O ports, on-chip LCD drivers, supply voltage detectors, and high-performance peripheral circuits. All devices are fabricated using power-saving, low-voltage (1.5, 3.0 or 5.0V) technology. S1C60/62(E0C60/62)Family Application-oriented microcomputer S1C60(E0C60) series Using the same core CPU as of the S1C62(E0C62) Family, the S1C60(E0C60) series devices are optimized for specification upto 4Kword of ROM capacities. They are suitable for applications to small sized equipment such as clocks, timers and thermometers. Internal U1 External SVD RF Converter Infrared output A/D Comparator Clock synchronous --- Asynchronous WDT --- --- Clock --- Event 4 Stopwatch 2 Interrupts LCD Driver segxcom Package (Form of delivery) { --- --- --- --- --- --- --- QFP12-48 Chip 1 1.2~2.0 1,024 80 1 20x4 1.8~3.5 (E0C6002) S1C60L02 4 SIO 1.8~3.6 (E0C60L01) S1C60N02 RAM x4bit Programmable 8bit (E0C6001) S1C60L01 ROM x12bit Input / Output S1C60N01 Supply current HALT/operating A (Typ.) Timer Input Products (Previous number) Clock frequency Low/high Hz (Typ.) Output Port Supply voltage range (V) 1.0/2.5 32.768K 4 4 4 --- --- --- { --- --- --- 1 QFP6-60 Chip 2 1.2~2.0 (E0C60L02) S1C60N03 1.8~3.6 (E0C6003) S1C60L03 768 64 4 4 0 --- --- --- { --- --- --- --- --- --- --- 1 1 15x4 Chip 26x4 QFP12-48 Chip 1.2~2.0 (E0C60L03) S1C60N04 2.7~3.6 (E0C6004) 4.5~5.5 S1C60N05 (E0C6005) S1C60L05 (E0C60L05) S1C60N06 (E0C6006) S1C60N07 (E0C6007) S1C60N08 (E0C6008) S1C60L08 (E0C60L08) S1C60A08 (E0C60A08) S1C60N09 (E0C6009) S1C60L09 (E0C60L09) 2M 1,536 144 4 4 4 --- --- --- --- { --- --- --- --- --- --- --- 1 1 8/15 32.768K 1,536 80 4 4 4 --- --- --- --- { --- --- --- --- --- 1 2 1.8~3.5 QFP6-60 Chip 20x4 QFP6-60 QFP13-64 Chip 2/9(32K) /130(455K) 32.768K/ 455K 2,048 128 8 4 4 --- --- --- { { --- --- --- --- --- 1 --- 2 4 2.2~5.5 2.5/6.5(32K) /1m(2M) 32.768K/ 2M 4,096 512 4 6 4 1 --- { { { --- --- --- --- --- --- --- 1 3 40x8/16 QFP15-100 Chip 1.0/2.2 32.768K 4,096 832 9 8 8 --- 2 { { { --- --- { --- --- { 3 3 48x4 QFP5-100 QFP15-100 Chip 1.8~3.5 0.9~1.7 2.2~3.5 1 1.1/3.0(32K) 50(500K) 32.768K/ 500K 1.0/3.0 32.768K 1,536 144 4 4 8 --- --- { --- { --- --- --- --- --- --- --- 1 2 38x4 Chip 65260K 1,536 144 4 4 8 --- --- --- --- { --- --- --- --- --- --- --- 1 1 38x4 QFP5-80 QFP14-80 Chip 4,096 256 5 9 8 --- 2 --- { { --- { 2 3 38x4 QFP14-80 QFP5-80 Chip 4,096 208 8 10 4 --- --- --- { --- --- --- --- --- --- 1 { 2 3 32x4 QFP5-80 Chip 4,096 832 9 8 8 --- 2 { { --- --- --- { --- --- { 3 2 48x4 QFP5-100 QFP15-100 Chip 2.6~3.6 1.2~1.8 1.2~1.8 2.2~3.6 S1C60L13* 1.2~1.8 4.0/8.0 U2 TBD 32.768K S1C60A13* 2.2~3.6 TBD 32.768K/ 1M S1C60140* 2.2~3.6 TBD 32.768K/ 455K TBD 32.768K TBD 32.768K/ 500K S1C60N15* 1.8~3.6 S1C60L15* 1.2~1.7 2.2~3.6 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: At the time of Sleep is 0.3A. * : Under development 42 --- 2.2~3.5 S1C60N13* S1C60A15* 2 1.2~2.0 S1C60N11 (E0C6011) 330/450 (3V) 1 --- --- --- --- MCUs S1C62100(E0C6210) series The microcomputer of this series integrates ROM, RAM, LCD driver, BLD (SVD) circuit, comparator (1/2 ch), and clock function provided with remote control carrier output circuit. This series can also be applied to handy equipment, including simplified electronic notes, from infrared remote controller. 1 --- 1 { 2 4 32x4 QFP5-80 QFP14-80 Chip --- 2 1 { 2 3 34x4 QFP5-80 Chip U1 Internal --- SVD A/D Clock synchronous Asynchronous WDT 4 Clock 4 8 208 External 32.768K/ 455K or 1M --- RF Converter (E0C621C) 3/7(32K) 170(455K) 4 Interrupts Infrared output 4,096 2.2~5.5 9 SIO Comparator S1C621C0 208 Event 32.768K/ 455K Stopwatch 2/9(32K) /130(455K) RAM x4bit Programmable 8bit 2.2~3.5 (E0C621A) ROM x12bit Timer Input / Output S1C621A0 Supply current HALT/operating A (Typ.) Input Products (Previous number) Clock frequency Low/high Hz (Typ.) Output Port Supply voltage range (V) LCD Driver segxcom { --- --- --- --- --- { Package (Form of delivery) { : Available U1: SVD is an abbreviation for Supply Voltage Detector. S1C6S200(E0C6S20) series The microcomputer of this series integrates ROM, RAM, LCD driver, stepping motor drive 1 ch, timer and stopwatch function. This series best fit for combination watches, timers, and counters. Internal { --- --- --- --- --- --- U1 --- SVD --- { External --- RF Converter 4 Infrared output 4 A/D 60/70 4 Comparator 2.2~3.6 80 Clock synchronous 0.7/1.9 1,536 Asynchronous 0.9~3.6 32.768K WDT 0.6/1.7 Interrupts Clock 0.9~1.8 RAM x4bit Event 0.7/1.9 ROM x12bit SIO Stopwatch 2.2~3.6 Clock frequency Low/high Hz (Typ.) Programmable 8bit Supply current HALT/operating A (Typ.) Input / Output S1C6S2N7 Supply voltage range (V) Input Products (Previous number) Timer Output Port 1 3 LCD Driver segxcom Package (Form of delivery) (E0C6S27) S1C6S2L7 { 26x4 (E0C6SL27) S1C6S2B7 QFP6-60 Chip (E0C6SB27) S1C6S2A7 200K (E0C6SA27) { : Available U1: SVD is an abbreviation for Supply Voltage Detector. S1C62N30/6S300(E0C6230/6S30) series The microcomputer of this series integrates ROM, RAM, LCD driver, timer and stopwatch function. This series is best fit for clocks, timers, and counters. Package (Form of delivery) Internal { --- --- --- --- --- --- U1 --- SVD --- { LCD Driver segxcom External RF Converter Infrared output 144 --- A/D 2,048 4 Comparator 32.768K 4 Clock synchronous 0.65/2.0 4 Asynchronous 80 WDT 1,024 Interrupts Clock 32.768K Event 1.0/2.5 SIO Stopwatch RAM x4bit Programmable 8bit ROM x12bit Input / Output S1C6S3N7 Supply current HALT/operating A (Typ.) Timer Input Products (Previous number) Clock frequency Low/high Hz (Typ.) Output Port Supply voltage range (V) 1 2 26x4 QFP6-60 Chip 2 2 38x4 QFP5-80 QFP14-80 Chip 2 3 40x4 QFP5-100 Chip 2 3 26x4 QFP12-48 QFP5-60 Chip 1.8~3.6 (EOC6S37) S1C6S3L7 0.9~2.0 { (E0C6SL37) S1C6S3B7 0.9~3.6 (E0C6SB37) S1C6S3N2 1.8~3.6 (E0C6S32) S1C6S3L2 0.9~1.8 (E0C6SL32) S1C6S3B2 --- 0.9~3.6 (E0C6SB32) S1C6S3A2 1.8~3.6 1.5/4.0 /150(1M) 1.8~3.5 1.5/6.0 0.9~1.7 1.0/3.0 2.2~3.5 2.0/8.0(32K) 135(500K) 32.768K/ 500K 0.8~3.6 2.5/3.0 32.768K (E0C6SA32) S1C62N33 (E0C6233) S1C62L33 32.768K/ 1M 5 8 8 --- 1 { { { --- --- { --- --- { 32.768K 3,072 256 1,536 96 1 (E0C62L33) E0C62A33 (E0C62A33) S1C6N3B0 (E0C623B) S1C6A3B0 (E0C62A3B) 1.7~3.6 80/100(1M) U2 1M 4 4 4 --- --- { --- { --- 1 --- --- --- --- --- { : Available U1 : SVD is an abbreviation for Supply Voltage Detector. U2: At the time of Sleep is 1A. 43 2 MCUs -1 4-bit Microcomputers S1C62400/6S400(E0C6240/6S40) series The microcomputer of these series integrates ROM, RAM, dot matrix LCD driver, timer and stopwatch function. These series feature many input/output ports and built-in clock synchronous serial ports that provide control of external memory. The microcomputer of these series is best fit for such equipment that requires dot matrix display, including high performance electronic memorandum equipment and dictionary. S1C62440 S1C624A0 U2 2.5/6.5(32K) 1000(2M) 32.768K/ 2M 2.2~5.5 2.5/6.5(32K) 400(1M) 32.768K/ 1M 3.5~5.5 2.5/6.5(32K) 1000(2M) 32.768K/ 2M (E0C6S46) S1C62480 (E0C6248) 6,144 2.2~5.5 2.5/6.5(32K) 400(1M) 32.768K/ 1M 3.5~5.5 2.5/6.5(32K) 1000(2M) 32.768K/ 2M 2.2~5.5 2.5/6.5(32K) 400(1M) 32.768K/ 1M 3.5~5.5 2.5/6.5(32K) 1000(2M) 32.768K/ 2M U2 (E0C6S48) S1C624C0 Package (Form of delivery) 40x8/16 QFP5-128 Chip 51x8/16 QFP8-144 Chip 640 20 1 --- { { { --- 1 --- --- --- --- { 2 4 16 5,120 (E0C624C) LCD Driver segxcom 12 12 8 8,192 S1C6S480 Internal 2.2~5.5 S1C6S460 U1 32.768K/ 2M SVD 2.5/6.5(32K) 1000(2M) External 3.5~5.5 (E0C624A) RF Converter 32.768K/ 1M Infrared output 2.5/6.5(32K) 400(1M) 384 A/D 2.2~5.5 4,096 Interrupts Comparator 32.768K/ 2M Clock synchronous 2.5/6.5(32K) 1000(2M) Asynchronous 3.5~5.5 (E0C6244) WDT 32.768K/ 1M SIO Clock 2.5/6.5(32K) 400(1M) RAM x4bit Event 2.2~5.5 ROM x12bit Stopwatch Clock frequency Low/high Hz (Typ.) Programmable 8bit Supply current HALT/operating A (Typ.) Timer Input / Output Supply voltage range (V) Input Products (Previous number) Output Port 768 1152 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: No external memory accessing function. S1C62N50(E0C6250)/S1C62900(E0C6290) series The microcomputer of these series integrates ROM, RAM, R/F comparator for measuring temperature, LCD driver, and timer. An external thermistor and built-in R/F comparators provide the function of a thermometer. The S1C62900(E0C6290) series also contains clock synchronous serial ports that provide control of external memory. 2.0/5.0(32K) 270(1M) 32.768K/ 1M 2,048 128 4 4 { { --- --- --- 26x4 2 2 5 60x5 3 1 3 22x4 Package (Form of delivery) --- 1 QFP6-64 Chip 0.9~2.0 0.9~3.6 (E0C6256) 2.2~3.6 S1C62920 2.2~5.5 { --{ 8 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. 44 1 Internal 8 2 U1 8 1 SVD 640 --- LCD Driver segxcom External 6,144 --- --- RF Converter 32.768K/ 1M --- Infrared output 0.65/ 2.0(32K) 170(1M) 4 A/D 4 Comparator 4 Clock synchronous 80 Asynchronous 1,024 Clock 32.768K Event 1.0/2.5 Interrupts 1.8~3.5 S1C62560 (E0C6292) RAM x4bit WDT (E0C62L51) ROM x12bit Stopwatch S1C62L51 Clock frequency Low/high Hz (Typ.) SIO Programmable 8bit (E0C6251) Supply current HALT/operating A (Typ.) Timer Input / Output S1C62N51 Supply voltage range (V) Input Products (Previous number) Output Port --- --- --- { 1 QFP5-100 QFP5-128 Chip QFP6-64 QFP13-64 Chip MCUs S1C62600(E0C6260) series The microcomputer of this series integrates ROM, RAM, high current output port, event counter, interval timer, synchronous/start/stop system serial port, comparator, and clock function. This series is best fit for application to the area of telemeter. 1 1 2 --- 2 --- --- { Internal { U1 { SVD --- External 1 Infrared output 1 RF Converter 12 16 12 A/D 1024 Interrupts Comparator 6,144 Clock synchronous 38.4K/ 500K Asynchronous 1.3/9.0(38.4K) 110(500K) WDT 2.2~5.5 (E0C6266) SIO Clock RAM x4bit Event ROM x12bit Stopwatch Clock frequency Low/high Hz (Typ.) Input / Output Supply current HALT/operating A (Typ.) Timer Programmable 8bit S1C62660 Supply voltage range (V) Input Products (Previous number) Output Port 3 9 LCD Driver segxcom --- Package (Form of delivery) QFP6-60 Chip { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: The start/stop system can be chosen on a mask option. S1C62700(E0C6270) series The microcomputer of this series integrates ROM, RAM, double integral type A/D converter, LCD driver, timer and serial I/O port. This series is best fit for a system that performs analog input control of measuring instruments, etc. and provides LCD display. { --- 1 5 { --- --- 2 { Internal { U1 { { SVD 1 External 12 RF Converter 4 Infrared output 5 A/D 512 Interrupts Comparator 4,096 Clock synchronous 32.768K/ 1M U3 Asynchronous 2.0/6.0(32K) 200(1M) WDT 2.2~5.5 (E0C6274) Clock RAM x4bit Event ROM x12bit SIO Stopwatch Clock frequency Low/high Hz (Typ.) Programmable 8bit Supply current HALT/operating A (Typ.) Input / Output S1C62740 Supply voltage range (V) Input Products (Previous number) Timer Output Port 2 5 LCD Driver segxcom Package (Form of delivery) 32x4 QFP5-100 QFP15-100 Chip { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Dual slope type. U3: At the time of Sleep is 0.7A. S1C62N80(E0C6280) series The microcomputer of this series integrates ROM, RAM, melody generator, LCD driver, clock, and stopwatch function. This series is best fit for clocks, watches and timers using melody. Notes: For customers who will use the S1C62N80(E0C6280) series, they should make applications to our company regardless of the use or non-use of melody ROM, before working on software development. As regards the copyright in Japan, we will file an application for the number to Japanese Society of Rights of Authors and Composer (JASRAC) and deal with the number involving the copyright. Internal U1 SVD External RF Converter Infrared output 4 A/D 32.768K 7 Interrupts Comparator 1.5/4.0 5 Clock synchronous 96 Asynchronous 1,024 WDT 32.768K Clock 1.0/3.0 Event RAM x4bit Stopwatch ROM x12bit Programmable 8bit Clock frequency Low/high Hz (Typ.) SIO LCD Driver segxcom Package (Form of delivery) 1.8~3.5 (E0C6281) S1C62L81 Supply current HALT/operating A (Typ.) Input / Output S1C62N81 Supply voltage range (V) Input Products (Previous number) Timer Output Port 26x4 QFP6-64 Chip 42x4 38x8 QFP5-80 QFP14-80 Chip 0.9~3.5 (E0C62L81) S1C62N82 --- 2.2~5.5 (E0C6282) S1C62L82 2,048 0.9~3.5 224 5 8 --- { --- { --- --- --- 1 --- --- { 2 3 4 (E0C62L82) S1C62A82 2.2~5.5 (E0C62A82) 1.7/4.0(32K) 150(1M) 32.768K/ 1M { : Available U1: SVD is an abbreviation for Supply Voltage Detector. S1C62M00(E0C62M2) series The microcomputer of this series integrates ROM, RAM, double integral type A/D converter, LCD driver, timer, and serial I/O port. This series is best fit for portable measuring instruments. 3 --- --- --- U3 { Internal 1 U1 { --- SVD { External --- --- RF Converter --- Infrared output 4 A/D 4 Interrupts Comparator 8 Clock synchronous 128 Asynchronous 1,536 Event 32.768K WDT U2 Clock 3.0/900 SIO Stopwatch 2.15~3.5 RAM x4bit Programmable 8bit (E0C62M2) ROM x12bit Input / Output S1C62M20 Supply current HALT/operating A (Typ.) Timer Input Products (Previous number) Clock frequency Low/high Hz (Typ.) Output Port Supply voltage range (V) 2 3 LCD Driver segxcom 16x4 Package (Form of delivery) QFP5-80 QFP14-80 Chip { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Consumption current at the time of measuring A/D. U3: Dual slope type. 45 2 MCUs -2 High Performance 4-bit Microcomputers High performance 4-bit singlechip microcomputers S1C63(E0C63)Family Application-oriented microcomputer S1C63(E0C63)Family microcomputers integrate a wide variety of peripheral circuits including ROM, RAM, I/O port, LCD driver into a single chip design with CMOS 4-bit core CPU at their center. High speed operation has been realized owing to a wide range of instructions and the high speed instruction cycle (2-6 CPI). Low voltage and low supply current are, same as S1C62(E0C62) Family, additional features of this CMOS 4-bit microcomputer. S1C63100(E0C63100) series A microcomputer being equipped with ROM, RAM, serial I/F, A/D converter, various timer functions, etc. It features built-in A/D converter, wide operating voltage range and low power consumption and is suitable for portable equipment. (E0C63158) 4 U3 { { --- --- --- Internal 1 Interrupts External { --- FSK demodulation circuit { DP output --- DTMF output 2 U2 *1 12 20 SVD 9 A/D 512 32.768K/4M Buzzer 8,192 32.768K WDT RAM x4bit Clock ROM x13bit Asynchronous 2.2~3.6 2.0/4.0(32K) 900(4M) Clock frequency Low/high Hz (Typ.) SIO Clock synchronous 0.9~3.6 U4 Supply current HALT/operating A (Typ.) Input S1C63158 Supply voltage range (V) Output Products (Previous number) Timer Input / Output Programmable 8bit Stopwatch Port 3 8 LCD Driver segxcom --- Package (Form of delivery) Chip QFP12-48 QFP13-64 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: 8 bits successive-approximation type and serves as general-purpose I/O. U4: The S1C63P366 also serves as flash microcomputer for evaluating S1C63158. S1C63200(E0C63200) series A microcomputer being equipped with ROM, RAM, A/D converter, various timer functions, etc. It features wide operating voltage range and wide working frequency range (0.5~4.5 MHz), suitable for application to the control units of household electric products and portable products which require A/D conversion and LCD indicatinos. { { --- --- 4 { U3 --- --- --- --- Internal --- Interrupts External 4 U2 FSK demodulation circuit 8 DP output 4 *1 4 SVD 256 Asynchronous 6,144 Clock synchronous 500K~4.5M U4 WDT 740(3V,2M)/ 1200(3V,2M) Clock RAM x4bit DTMF output 2.7~5.5 ROM x13bit A/D (E0C63256) Clock frequency Low/high Hz (Typ.) SIO Buzzer S1C63256 Supply current HALT/operating A (Typ.) Input / Output Programmable 8bit Stopwatch Supply voltage range (V) Input Products (Previous number) Timer Output Port 1 5 LCD Driver segxcom 20x4 Package (Form of delivery) Chip QFP13-64 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: 8 bits successive-approximation type and serves as general-purpose I/O. U4: At the time of Sleep is 0.3A. S1C63300(E0C63300) series A microcomputer being equipped with ROM, RAM, LCD driver, A/D converter, various timer functions, etc. It features built-in A/D converter, wide operating voltage range and low power consumption, suitable for application to portable products which require LCD indications. (E0C63P366) 2.7~5.5 2.5/120(32K) 800(4M) 32.768K/4M 16,384 (Flash) --- --- --- Internal { External { FSK demodulation circuit 1 Interrupts LCD Driver segxcom Package (Form of delivery) 8 2,560 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: 8 bits successive-approximation type and serves as general-purpose I/O. U4: This series also serves as flash microcomputer for evaluating S1C63158. 46 { --- DP output 12 20 *1 9 A/D 512 WDT 8,192 DTMF output 32.768K Clock 32.768K/4M SVD S1C6P366 U4 2.0/6.0(32K) 900(4M) RAM x4bit Buzzer 2.3~3.6 ROM x13bit Asynchronous 0.9~3.6 (E0C63358) Clock frequency Low/high Hz (Typ.) SIO Clock synchronous S1C63358 Supply current HALT/operating A (Typ.) Input Supply voltage range (V) Output Products (Previous number) Timer Input / Output Programmable 8bit Stopwatch Port 2 U2 --- { 4 U3 3 32x4 4 Chip QFP15-100 MCUs S1C63400(E0C63400) series 32.768K 2.2~6.4 1.8~6.4 (E0C63466) 2.2~6.4 1.0/10(32K) 1200(4M) 32.768K/4M 2.7~5.5 2.5/90(32K) 1000(4M) 32.768K/4M 1.2~3.6 1.5/14(45K) 610(1.8M) 32.768K 2.2~3.6 U3 32.768K/1.8M S1C63467 4,096 1,024 4 4 8 --- Internal External 1 9 60x8 32.768K/4M 1.0/10(32K) 1000(4M) 32.768K/4M 32.768K LCD Driver segxcom Package (Form of delivery) 40x8/16/17 Chip QFP15-100 32.768K 1.0/10(32K) 1000(4M) (E0C63458) (E0C63P466) Interrupts 32.768K S1C63466 S1C6P466 DP output 1.8~6.4 U1 S1C63458 DTMF output 2.2~6.4 SVD 1.8~6.4 (E0C63455) A/D S1C63455 Buzzer 32.768K/4M Asynchronous 1.0/10(32K) 1000(4M) Clock synchronous 2.2~6.4 WDT 1.8~6.4 (E0C63454) RAM x4bit SIO Clock S1C63454 ROM x13bit Input / Output Clock frequency Low/high Hz (Typ.) Timer Programmable 8bit Stopwatch Supply current HALT/operating A (Typ.) Input Supply voltage range (V) Products (Previous number) Output Port FSK demodulation circuit A microcomputer being equipped with ROM, RAM, dot-matrix LCD driver, various timer functions, etc. It features wide operating voltage range and low power consumption and is suitable for portable equipment such as data banks which require dot-matrix indications. 2 U2 8,192 { { { --- 1 --- { --- --- --- 5,120 8 12 12 { 2 9 Chip 60x8/16/17 QFP5-128 QFP8-144 QFP17-144 Chip 60x8/16/17 QFP8-144 QFP17-144 16,384 1,792 16,384 (Flash) 5,120 8 2 { 12 12 U2 { { --- 1 --- { { --- --- --- 2 4 16,384 2,304 8 14 16 --- { { --- 1 --- { { --- --- --- 2 5 --- Chip QFP5-128 QFP8-128 60x8/9 Chip QFP5-128 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: At the time of Sleep is 0.5A. S1C63500(E0C63500) series 1 --- Internal DP output DTMF output U1 SVD A/D Buzzer Asynchronous Clock synchronous WDT Clock RAM x4bit Interrupts 2 10 8,192 2.2~5.5 (E0C63558) S1C63567 1.5/10(32K) 600(3.58M) 32.768K/ 3.58M 1.5/10(32K) 1000(3.58M) (E0C63567) S1C6F567* ROM x13bit 1.5/10(32K) 1000(3.58M) (E0C63557) S1C63558 Clock frequency Low/high Hz (Typ.) SIO External S1C63557 Supply current HALT/operating A (Typ.) Output Supply voltage range (V) Timer Input / Output Programmable 8bit Stopwatch Products (Previous number) Input Port FSK demodulation circuit A microcomputer being equipped with ROM, RAM, dot-matrix LCD driver, DTMF/DP generator, FSK demodulator, various timer functions, etc. It features wide operating voltage rane and low power consumption and is suitable for communication-equipment and portable-equipment such as data banks and Caller-ID which require dot-matrix indications. 2.7~5.5 1.5/10(32K) 1000(3.58M) 5,120 8 12 16 2 U2 { { { 16,384 32.768K/ 3.58M 16,384 (Flash) 2 U3 --- { { { { 1 5,120 8 12 16 2 U2 { { { 1 U3 --- { { { { { LCD Driver segxcom Package (Form of delivery) 40x8/16/17 Chip QFP15-128 2 17 --- 2 12 60x8/16/17 Chip QFP8-144 --- 2 12 60x8/16/17 Chip QFP8-144 U4 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: Either start/stop system or clock synchronous system can be selected, depending on software. U4: It conforms to the ITU-T V.23/Bell 202. *: Under development S1C63600(E0C63600) series The microcomputer of this series integrates ROM, RAM, multiplication and division circuits, LCD driver, R/F converter, and a variety of timer functions. Since this series features a wide range of operating voltage and low power consumption, it is best fit for portable equipment with temperature measuring facility that requires battery-powered operation. S1C63658* 2.4~3.6 TBD 32.768K 8,192 1,028 8 8 8 16,384 5,120 8 8 8 3 U2 { { --- 1 { { { --- 1 { { { --- 1 2 U3 2 U3 { { --- --- --- Internal 32.768K/4M { Interrupts External 32.768K/2M TBD 3 U2 FSK demodulation circuit TBD 2.4~3.6 8 DP output 1.8~3.6 8 DTMF output 32.768K 8 U1 TBD 5,120 SVD 2.4~3.6 16,384 A/D 32.768K/4M Buzzer 32.768K/2M TBD Asynchronous TBD 2.4~3.6 RAM x4bit WDT 1.8~3.6 ROM x13bit Clock Clock frequency Low/high Hz (Typ.) SIO Clock synchronous S1C63666* Supply current HALT/ operating A (Typ.) Input / Output Programmable 8bit Stopwatch (Previous number) Supply voltage range (V) Input Products Timer Output Port 1 5 LCD Driver segxcom Package (Form of delivery) 64x8 Chip QFP20-144 { { --- --- --- 2 5 56x8 { { --- --- --- 2 5 64x8 TBD S1C63F666* 2.7~3.6 TBD 32.768K/4M 3 U2 2 U3 Chip QFP20-144 TBD { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: R/F converter *: Under development 47 2 MCUs -2 High Performance 4-bit Microcomputers S1C63A/B00(E0C63A/B0) series S1C63A08 0.9~3.6 (E0C63A08) 2.2~3.6 S1C63B07 0.9~3.6 1.2/5.3(32K) 87.5(400K) (E0C63B08) S1C63B58* U3 0.9~3.6 1.2/5.3(32K) 87.5(400K) 32.768K 2,048 Internal Interrupts External DP output DTMF output U1 SVD A/D Buzzer Asynchronous Clock synchronous WDT RAM x4bit Clock ROM x13bit SIO LCD Driver segxcom Package (Form of delivery) 72x8/16/17 Chip QFP8-208 60x4 Chip QFP8-160 13 32x4 Chip QFP15-100 5 32x4 Chip QFP15-100 20 20 32.768K/1M 1.2/6.0(32K) 85(400K) (E0C63B07) S1C63B08 1.5/10(32K) 300(1M) Clock frequency Low/high Hz (Typ.) Timer Input / Output Programmable 8bit Stopwatch (Previous number) Supply voltage range (V) Input Products Output Port Supply current HALT/ operating A (Typ.) FSK demodulation circuit A microcomputer being equipped with ROM, RAM, LCD driver, various timer functions, etc. Moreover, it carries built-in gate array for your optional circuit configurations. It features wide operating voltage range and high speed operation and is suitable for portable equipment such as data banks and pagers. 14 8,192 1,024 32.768K, 76.8K 153.6K/400K 8,192 2 8 1,024 U2 8 8 8 { { { --- 1 --- { { --- --- --- 2 12 12 2 U2 { { { --- 1 --- { { --- --- --- 2 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: It incorporates POCSAG decoder and Use is possible also as logic area of 5K. Notes: For customers who will use the S1C63A08 and/or S1C63B07, they should make applications to our company regardless of the use or non-use of melody ROM, before working on software development. As regards the copyright in Japan, we will file an application for the number to Japanese Society of Rights of Authors and Composer (JASRAC) and take care of the number involving the copyright. *: Under development 48 2 -3 MCUs Peripheral FSK receiver S1C05250(E0C5250) series Including FSK receiver & CAS tone detector, Especially suitable for Caller-ID application with S1C063557(E0C63557). Products (Previous number) S1C05250 (E0C5250) S1C05251 (E0C5251) Feature Package y ITU V.23 & Bell 202 FSK receiver y Bellcore "CPE Alerting Signal" (CAS) detection y BT "Idle Tone Alert signal" detection. SOP-24pin y ITU V.23 & Bell 202 FSK receiver y Bellcore "CPE Alerting Signal" (CAS) detection y BT "Idle Tone Alert signal" detection. y FSK Energy detect mode SOP2-28pin 49 2 MCUs -4 8-bit Microcomputers 8-bit single-chip applicationoriented microcomputers Built around the S1C88000(E0C88000), SEIKO EPSON's powerful 8-bit core CPU, the S1C88(E0C88) Family lineup integrates a wide choice of ROM and RAM sizes, LCD drivers, serial ports and other high-performace peripheral circuits into a single chip design. All devices are fabricated using power-saving, low voltage (1.5, 3.0 or 5.0V) technology. S1C88(E0C88)Family Application-oriented microcomputer S1C88100(E0C88100) series (E0C88112) { { Internal 2 U1 --- External SVD --- Buzzer output 1 D/A 1 Comparator { Interrupts A/D Asynchronous 1 SIO Clock synchronous 2M Input/output 256 Programmable 8bit 32K/ Low powers 4.2M/ Normal 8.2M/ High speed Input 0.3/ 2.0/14(32K) 2000(4.2M) RAM x8bit Timer WDT S1C88112 1.8~3.5/ Low speed powers 2.4~5.5/ Normal 3.5~5.5/ High speed ROM x8bit Port Clock (E0C88104) Clock frequency/ operation mode Hz (Max.) Stopwatch S1C88104 Supply current Sleep/Halt/ operating A (Typ.) Output Products (Previous number) Supply voltage range operation mode (V) External expansion Max. (Byte) S1C88100 series microcomputers equipped with a ROM, a RAM, serial I/Os, timers, external bus-line and analog comparators. Easy connection to external ROM, RAM, peripherals and LCD drivers such as S1D15600(SED1560) series. Especially suitable for portable equipments such as high-performance data banks. 3 12 LCD Driver segxcom Package (Form of delivery) --- Chip QFP14-80 QFP15-100 4K 34 16 10 U2 12K U2 2 U4 U3 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: It doubles as external bus terminal. U3: Either start/stop system or clock synchronous system can be selected, depending on software. U4: Two 8 bits serve as a 16-bit timer. S1C88300(E0C88300) series S1C88308 (E0C88308) S1C88317 (E0C88317) S1C88348 (E0C88348) 1.8~3.5/ Low speed powers 2.4~5.5/ Normal 3.5~5.5/ High speed S1C88349* 0.3/ 2.0/14(32K) 2000(4.9M) 32K/ Low powers 4.2M/ Normal 8.2M/ High speed 9 Internal External U1 SVD Comparator Buzzer output D/A A/D Interrupts Clock synchronous Clock SIO Asynchronous 256 WDT 8K Stopwatch RAM x8bit Input/output ROM x8bit Timer Programmable 8bit Clock frequency/ operation mode Hz (Max.) Output (Previous number) Supply current Sleep/Halt/ operating A (Typ.) Port Input Products Supply voltage range operation mode (V) External expansion Max. (Byte) S1C88300 series microcomputers are equipped with ROM, RAM, LCD driver, serial I/O, timers and external bus line. Easy connection to external ROM, RAM, peripherals and LCD drivers. Especially suitable for portable equipments such as high-performance data banks and pager. 30 U2 --- LCD Driver segxcom Package (Form of delivery) 41x32 57x8/16 Expandable U5 Chip QFP8-160 16K 2K 2M 34 U2 48K 16 2 U2 U6 1 { 1 1 TBD --- U3 10 2 { { 3 12 4 51x32 67x8/16 Expandable U5 U4 S1C88365 (E0C88365) S1C8F360 (E0C88F360) 2.2~5.5 0.3/ 2.0/14(32K) 1500(2.5M) 32K/2.5M 64K 3K 2.0~3.5/ Low speed powers 2.4~5.5/ Normal 3.5~5.5/ High speed 0.3/ 2.0/12(32K) 1500(4M) 32K/ Low powers 4.2M/ Normal 8.2M/ High speed 60K 2K 42 --- U2 2M 10 34 16 2 U2 U2 U6 1 { 1 1 4 U3 U4 --- 2 { { 3 12 Chip QFP8-160 QFP17-160 Chip QFP18-176 QFP21-176 80x18 Expandable U5 Chip 51x32 67x8/16 Expandable U5 Chip QFP18-176 QFP21-176 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: It doubles as external bus terminal. U3: Either start/stop system or clock synchronous system can be selected, depending on software. U4: 10 bits is used also I/O / general-purpose / a compared type and ] one by one. Since S1C88349 differs from A/D accuracy of S1C8F360, it should be careful. U5: LCD extension is possible using a segment driver. U6: Two 8 bits serve as a 16-bit timer. * : Under development 50 MCUs S1C88400(E0C88400) series 3.5~5.5 1.8~5.5 S1C88409 2.6~5.5 (E0C88409) 3.5~5.5 Internal U1 --- SVD --- Buzzer output Interrupts Comparator Clock synchronous Clock SIO Asynchronous WDT Stopwatch Input/output Programmable 8bit Input RAM x8bit Timer External 2.6~5.5 ROM x8bit Port D/A (E0C88408) Clock frequency/ operation mode Hz (Max.) A/D 1.8~5.5 S1C88408 Supply current Sleep/Halt/ operating A (Typ.) Output Products (Previous number) Supply voltage range operation mode (V) External expansion Max. (Byte) S1C88400 Series microcomputers are being equipped with ROM, RAM, LCD controller, serial I/C, timer, etc. Featuring external buses, for easy connection of ROM, RAM and peripherals with outstanding extendibility. As they carry a built-in LCD controller, they are most suitable for applications to panel systems of intermediate capacity levels. 5 15 LCD Driver segxcom Package (Form of delivery) 1.1M 0.6/ 3.0/15(32K) 2000(4M) 4.4M 8.2M 1.1M 0.6/ 3.0/15(32K) 2000(4M) /9000(8M) 4.5~5.5 8K 3.75K U7 12M 12 30 28 U2 U2 3 U3 --- { 1 1 --- U4 4.4M 8 2 6.6M U5 U6 { --Chip (LCDC QFP15-100 included) { 5 18 8.8M { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: It doubles as external bus terminal. U3: Two 8 bits serve as a 16-bit timer. U4: Either start/stop system or clock synchronous system can be selected, depending on software. U5: It is a 10-bit successive approximation type and doubles as general-purpose I/O. U6: It doubles as general-purpose I/O. U7: It doubles as RAM for display (set by mask option.) S1C88800(E0C88800) series (E0C88862) 1.8~3.5/ Low power 2.4~5.5/ Normal 3.5~5.5/ High speed 0.3/1.5/ 9(32K)/ 1100(4M) 80K/ Low power 4.2M/ Normal 8.2M/ High speed 0.45/1.5/ 7.0(32K) 900(4M) S1C88816 (E0C88816) 1.5K 9 8K 2 4 7 U2 1 { 1 1 U3 --- 4 16 U4 --- --- --- --- { Internal { External --- U1 Buzzer output --- SVD Comparator Clock synchronous Clock Asynchronous WDT Stopwatch --8 --- 60K 116K Input/output 5 Interrupts D/A 32K (E0C88832) S1C88862 RAM x8bit Cannot access external memory. SIO A/D S1C88832 ROM x8bit Timer Programmable 8bit Clock frequency/ operation mode Hz (Max.) Input Supply current Sleep/Halt/ operating A (Typ.) Port Output Products (Previous number) Supply voltage range operation mode (V) External expansion Max. (Byte) S1C88800 Series microcomputers are equipped with ROM, RAM, LCD Driver, serial I/O and timers. 3 12 3 14 { { U5 LCD Driver segxcom 51x32 67x8/16 Nonexpandable 41x32 57x8/16 Nonexpandable 72x32 88x8/16 Nonexpandable Package (Form of delivery) QFP8-128 QFP15-128 Chip Chip QFP18-176 QFP21-176 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: Either start/stop system or clock synchronous system can be selected, depending on software. U4: It is a 10-bit successive approximation type and doubles as general-purpose I/O. U5: A melody generator is included. S1C88A00(E0C88A00) series 1 U3 --- --- --- { { Internal 1 U1 { External U2 1 SVD 2 Buzzer output 29 16 Comparator 8 D/A 2M Interrupts A/D 512 Clock synchronous 32K Clock 160K/ Low speed 6.0M/ Normal Asynchronous TBD SIO WDT 1.8~3.6/ Low speed 2.4~3.6/ Normal Input/output RAM x8bit Timer Programmable 8bit ROM x8bit Port Stopwatch (E0C88A32) U4 Clock frequency/ operation mode Hz (Max.) Input S1C88A32* Supply current Sleep/Halt/ operating A (Typ.) Output Products (Previous number) Supply voltage range operation mode (V) External expansion Max. (Byte) The microcomputer of this series integrates ROM, RAM, LCD driver, and various kinds of timer functions. In addition, it incorporates a gate array, which enables users to freely form circuits. Since this series provides a wide range of operating voltage and fast operation, it is best fit for electronic memorandum equipment and pager. 2 16 LCD Driver segxcom Package (Form of delivery) 57x32 73x8/16 Expandable Chip QFP18-176 QFP21-176 { : Available U1: SVD is an abbreviation for Supply Voltage Detector. U2: Two 8 bits serve as a 16-bit timer. U3: Either start/stop system or clock synchronous system can be selected, depending on software. U4: Use is possible also as logic area of POCSAG decoder built-in and user gate 5K. * : Under development 51 2 MCUs -5 32-bit Microcomputers 32 bit RISC Microcomputers S1C33(E0C33) family is SEIKO EPSON's original 32-bit RISC CPU. The product incorporates peripheral functions in abundance, including rapid DMA, multi-channel SIO, programmable timer, PLL, and pre-scaler. Features of fast operation and extremely low power consumption qualify this family for application to OA equipment such as printer and portable equipment, including PDA and TOY. In addition, as this family incorporates A/D converter and PWM timer, its combination with middleware provides digital signal processing such as voice processing. S1C33200 series With S1C33209(E0C33209) as the dominant constituent, this is a general-purpose series equipped with MaskROM and flash memory. It features a rich lode of peripheral equipment and low current consumption. Its application has been widespread, including portable terminals and TOY. (E0C33264) S1C33221 (E0C332129) S1C33240* (E0C332F128) 2.7~3.6/ Inside 2.7~5.5/I/O 60M/High speed 32.768K/Low speed --- 8K 4W /215mW 50M/High speed 32.768K/Low speed 8K 13 50W /280mW (40MHz,3.3V) 40M/High speed 32.768K/Low speed 16 bit PWM WDT 13 29 6 6 { 1 29 6 6 { 1 Clock synchronous 4W /215mW 8bit 4 U1 Interrupts ADC 10bit DMA Internal S1C33222* RAM (Byte) SIO External (E0C33209) ROM (Byte) Timer Input S1C33209 2.7~3.6/ Inside 2.7~5.5/I/O 1.8~2.7/ Inside 1.8~3.6/I/O 2.7~3.6/ Inside 2.7~5.5/I/O 1.8~2.7/ Inside 1.8~3.6/I/O Clock frequency/ operation mode Hz (Max.) Input/output Products (Previous number) Supply current Sleep (Typ.) /operationg (50MHz, 3.3V) Asynchronous Port Supply voltage range operating section (V) 8ch 4ch 128ch 10 29 8ch 4ch 128ch 10 29 U1 128K 128K Flash Remarks Chip QFP5-128 QFP15-128 32 bit RISC ROMLess model Chip QFP5/15-128 64K 4 Package (Form of delivery) S1C33209 MaskROM model QFP5/15-128 8K 13 29 6 { 6 4 1 U1 8ch 4ch 128ch 10 29 S1C33209 FlashROM model QFP5-128 QFP15-128 { : Available U1 : Software setting * : Under development S1C33L00 series Incorporation of a LCD controller in a 32-bit RISC microcomputer significantly contributes to a decrease in mounting area and a reduction in power consumption in display-centered applications such as portable terminal. (E0C332L02) 50M/High speed 32.768K/Low speed 128K 8K VRAM: 40K T.B.D 50M/High speed 32.768K/Low speed --- 8K 13 16 bit PWM WDT 13 29 4 6 { 1 29 4 6 { 1 Clock synchronous 4W / 230mW 8bit 2 U1 2 U1 Interrupts Internal S1C33L02* RAM (Byte) SIO External (E0C332L01) ROM (Byte) Timer Input S1C33L01 2.7~3.6/ Inside 2.7~5.5/I/O 1.8~2.7/ Inside 1.8~3.6/I/O 2.7~3.6/ Inside 2.7~5.5/I/O 1.8~2.7/ Inside 1.8~3.6/I/O Clock frequency/ operation mode Hz (Max.) Input/output Products (Previous number) Supply current Sleep (Typ.) /operating (50MHz, 3.3V) Asynchronous Port Supply voltage range operating section (V) Package (Form of delivery) Remarks 10 29 QFP18-176 LCDCintegrated model (Monochrome and color) 29 Chip QFP20-144 LCDCintegrated model (Monochrome) ADC 10bit DMA 8ch 4ch 128ch 8ch 4ch 128ch 10 { : Available U1 : Software setting *: Under development S1C33T00 series This series feature further enhanced peripheral functions, including I/O ports, built-in timer, 12C bus, and the number of interruptions. S1C33T01 (E0C332T01) 2.7~3.6/ Inside 2.7~5.5/I/O 1.8~2.7/ Inside 1.8~3.6/I/O { : Available U1 : Software setting U2 : I2C-bus correspondence is option specification. 52 --- 8K 13 69 6 16 bit 10 PWM { WDT 1 4 U1 ADC 10bit 8ch DMA 4ch 128ch 18 Internal 8bit Interrupts External RAM (Byte) SIO Clock synchronous 4W / 215mW 60M/High speed 32.768K/Low speed ROM (Byte) Timer Asynchronous Clock frequency/ operation mode Hz (Max.) Input Products (Previous number) Supply current Sleep (Typ.) /operating (50MHz, 3.3V) Input/output Port Supply voltage range operating section (V) 51 Package (Form of delivery) QFP18-176 Remarks A 12C-bus compatible, enhanced peripheral functions U2 MCUs S1C33S00 series Downsizing of a package and low power consumption has been achieved by narrowing down functions on S1C33200 series to specific ones. 4W/195mW 50M/High speed 32.768K/Low speed --- 8K --- 29 4 6 { 2 1 U1 Interrupts ADC 10bit DMA --- --- Internal 1.8~3.6 SIO WDT External RAM (Byte) Timer 16 PWM bit Clock synchronous ROM (Byte) 8bit Asynchronous Clock frequency/ operation mode Hz (Max.) Input S1C33S01 (E0C332S08) Supply current Sleep (Typ.) /operating (50MHz, 3.3V) Input/output Products (Previous number) Port Supply voltage range operating section (V) 10 23 Package (Form of delivery) Remarks Chip QFP15-100 S1C33209 Diet model { : Available U1 : Software setting S1C33 Special-purpose line-up As I/F circuit linking to PHS, PDC, and CdmaOne is incorporated into this product line-up, It can be used for data communications etc. between communication terminals by combining with software modem module. T.B.D 60M/High speed 32.768K/Low speed --- 8K 7 25 6 6 { 1 3 U1 Interrupts ADC 10bit DMA 8ch 4ch 128ch Internal 2.7~3.6 SIO WDT External RAM (Byte) Timer 16 PWM bit Clock synchronous ROM (Byte) 8bit Input S1C33210 (E0C33210) Clock frequency/ operation mode Hz (Max.) Input/output Products (Previous number) Supply current Sleep (Typ.) /operating (50MHz, 3.3V) Asynchronous Port Supply voltage range operating section (V) 10 29 Package (Form of delivery) Remarks QFP15-128 Bridge IC for communication terminal { : Available U1 : Software setting S1C33104(E0C33A104) and S1C33208/204/202(E0C33208/204/202) are not listed because they are old types. For new development, we recommend you to use a successor to the old version, S1C33209(E0C33209). 53 2 MCUs -6 Microcomputer Development Program development process (S1C62/60 Family) The relationship between the S1C62(E0C62) Family program development procedure and development tools is illustrated below. [Operation] 1. Determining on the product specifications 2. System designs Determining on the microcomputer choice [Development procedure] [Development tools] [Documentations] Data Sheet (Technical Manual) Selecting the most suitable microcomputer for the product specifications, system designs to meet the product specifications are started. Then, outline flows of the hardware specifications and application softwares are determined. Technical Manual 3. Setting out the flow chart The outline flow of the application programs are converted into detail flows to finalize the program flow. Completed detail flow is then converted into instructions to microcomputers. S1C6200/S1C6200A Core CPU Manual 4. Coding Coded application of programs are input into the host system through the editor to use as the source programs. 5. Assembly Object programs are made out from the source programs by cross assemblers S5U1C62000A (ASM62) Development Tool Manual# Assembler Package Manual# 6. Program evaluation The system operations are checked using the object programs and evaluation tools. S5U1C62E, (EVA62) S5U1C62000A (ASM62) S5U1C62000H2 (ICE62R) S5U1C62000H Manual# Assembler Package Manual# S5U1C62E Manual# Development tool Manual# 7. Making into the mask ROM Preparing for submission data After making sure the system is operating properly by use of the program evaluation tools, data are produced to make into mask ROM. S5U1C62E, (EVA62) S5U1C62000A (ASM62) S5U1C62000H2 (ICE62R) Assembler Package Manual# S5U1C62000H Manual# S5U1C62E Manual# Development tool Manual# 8. Ordering for sampling Comment: Development tools and documentations for S1C60(E0C60) Family are common to those for S1C62(E0C62) Family depending on models. # : Included in respective development tool set. 54 MCUs Program development process (S1C63 Family) The relationship between the S1C63(E0C63) Family program development procedure and development tools is illustrated below. [Operation] [Development procedure] [Development tools] 1. General specifications 2. System designs and microcomputer model selection [Documentations] Data Sheet (Technical Manual) Select the most suitable microcomputer for your product specifications, then design the system required by the specifications. Based on the system specifications, determine the hardware specifications and the general flow chart of the application software. Technical Manual 3. Draw flow charts Revise the general flow chart of the application software into a detailed flow chart so as to determine the program flow. Convert the detailed flow chart into instructions for the microcomputer. S1C63000 Core CPU Manual 4. Coding Load the coded application program into the host system using the editor, thereby making it the source program. 5. Assembly Generate the object program from the source program using the cross assembler. S5U1C63000A (ASM63) Assembler Package Manual# 6. Program evaluation Confirm the proper operation of the system using the object program and evaluation tools. S5U1C63000H2, (ICE63) S5U1C63P (PRC63) S5U1C63000A (ASM63) (S5U1C88000Q1 *1) S5U1C63000H2 Manual# S5U1C63P Manual# Assembler Packege Manual Development tool Manual# 7. Generate mask producing data After confirming that the proper operation of the system using the evaluation tools, generate the data necessary to mask the ROM. S5U1C63000H2, (ICE63) S5U1C63P (PRC63) S5U1C63000A (ASM63) (S5U1C88000Q1 *1) S5U1C63000H2 Manual# S5U1C63P Manual# Assembler Packege Manual Development tool Manual# 8. Sample order placement # : Included in respective development tool set *1: S1C63/88(E0C63/88) Family embedded system simulator 55 2 MCUs -6 Microcomputer Development Program development process (S1C88 Family) The relationship between the S1C88(E0C88) Family program development procedure and development tools is illustrated below. [Operation] [Development procedure] [Development tools] 1. General specifications 2. System design and microcomputer model selection [Documentations] Data Sheet (Technical Manual) Select the most suitable microcomputer for your product specifications, then design the system required by the specifications. Based on the system specifications, determine the hardware specifications and the general flow chart of the application software. Technical Manual 3. Draw flow charts Revise the general flow chart of the application software into a detailed flow chart so as to determine the program flow. Convert the detailed flow chart into instructions for the microcomputer. #1 S1C88 Family Core CPU Manual 4. Coding Load the coded application program into the host system using the editor, thereby making it the source program. 5. Assembly Generate the object program from the source program using the cross assembler. 6. Program evaluation Confirm the proper operation of the system using the object program and evaluation tools. 7. Generate mask producing data After confirming that the proper operation of the system using the evaluation tools, generate the data necessary to mask the ROM. 8. Sample order placement # : Included in respective development tool set *1 : C compiler assembler package for S1C88(E0C88) *2 : S1C63/88(E0C63/88) Family embedded system simulator 56 S5U1C88000C1 (Software tool *1) S5U1C88000C1 Manual# S5U1C88000H5 (ICE88UR) S5U1C88P (PRC88) S5U1C88000C1 (Software tool *1) (S5U1C88000Q1 *2) S5U1C88000C1 Manual# S5U1C88000H5 Manual# S5U1C88P Manual# Development tool Manual# S5U1C88000H5 (ICE88UR) S5U1C88P (PRC88) S5U1C88000C1 (Software tool *1) (S5U1C88000Q1 *2) S5U1C88000C1 Manual# Development tool Manual# MCUs Program development process (S1C33 Family) The relationship between the S1C33(E0C33) Family program development procedure and development tools is illustrated below. [Operation] [Development procedure] [Development tools] 1. General specifications 2. System design and microcomputer model selection [Documentations] Data Sheet (Technical Manual) Select the most suitable microcomputer for your product specifications, then design the system required by the specifications. Based on the system specifications, determine the hardware specifications and the general flow chart of the application software. Technical Manual 3. Draw flow charts Revise the general flow chart of the application software into a detailed flow chart so as to determine the program flow. Convert the detailed flow chart into instructions for the microcomputer. #1 S1C33 Family Core CPU Manual 4. Coding Load the coded application program into the host system using the editor, thereby making it the source program. 5. Compiler Generate the object program from the source program using the c-compiler and cross assembler. 6. Program evaluation Confirm the proper operation of the system using the object program and evaluation tools. 7. Generate mask producing Data After confirming that the proper operation of the system using the evaluation tools, generate the data necessary to mask the ROM. S5U1C33000C (CC33) S1C33C-Compiler Package Manual# S5U1C33000H (ICD33) S5U1C33000C (CC33) S1C33C-Compiler Package Manual# S5U1C33000H Manual# S5U1C33000H (ICD33) S5U1C33000C (CC33) S1C33C-Compiler Package Manual# S5U1C33000H Manual# 8. Sample order placement # : Included in respective development tool set 57 2 MCUs -6 Microcomputer Development Development tools S1C62 Family/S1C60 Family development tools Hardware S5U1C62000H2 (ICE62R) S5U1C62E (EVA62) S5U1C60K (KIT60) S1C60,62 Family Common In-circuit emulator S1C88 Family development tools Hardware S5U1C88000H5 (ICE88UR) Evaluation board S5U1C88P S1C60 Individual ROM (PRC88) S5U1C88348T (DMT88348-DB) S1C88 Family Common In-circuit emulator (USB interface) Peripheral circuit board Demonstration board Software package S5U1C62000A (ASM62) E0C60, 62 Family Common Tool (including model-by-model software tool) Software package S5U1C88000C1 S1C63 Family development tools Hardware S5U1C63000H2 (ICE63) S5U1C63P (PRC63) S1C63 Family Common In-circuit emulator Peripheral circuit board Flash writing tool Hardware S5U1C88000W1 (URM00002) S5U1C88X1 (ADP88) Software package S5U1C63000A (ASM63) S5U1C63X1 S1C63 Family Common tool (including model-by-model software tool) (ADP63) S5U1C88000X1 (ADS00002) S5U1C88000W2 S1C33 Family development tools Hardware S5U1C33000H (ICD33) S5U1C33E (EPOD33) S5U1C33D (DMT33) S5U1C33M (MEM33) (GWH00002) (CC33) (VOX33) S5U1C330J1S (JPEG33) S5U1C330R1S (ROS33) S5U1C330M2S (MON33) S5U1C330M1S (MELODY33) S5U1C330V2S (VRE33) S5U1C330S1S (SOUND33) S5U1C330T1S (TS33) S5U1C330C1S (CF33) S5U1C330G1S (GRAPHIC33) Socket for parallel writing (S1C63) Socket for serial writing Gang writer ROM Emulation board S5U1C88000Q1 Demonstration board Emulation memory board S1C33 Family Common C Compiler package Voice compression and decompression middleware JPEG decompression middleware Realtime OS Debug monitor Melody Voice recognition Sound playback Text to Speach CompactFlash Interface Graphic Library S5U1C330H1S* Voice recognition, a version with more functionality S5U1C330P1S* Handwritten character recognition S5U1C330S2S* Smart media card Interface * : Under development 58 Socket for parallel writing (S1C88) S1C63/S1C88 Option Soft tool Middleware package S5U1C330V1S ROM Writer S1C33 Family Common Omitted pin type On-chip ICE Software package S5U1C33000C S1C88 Family Common (C compiler assembler package for S1C88) S1C63/S1C88 Family embedded system simulator Section 3 ASSPs Page LCD controllers MPU interface LCD drivers for small and medium displays LCD drivers S1D13000 series 60~61 S1D12000 series 62 63~66 S1D15000 series S1D16000 series S1D19000 series 67 66~68 68 68 Thermal-head drivers S1D50000 series 69 LED printer-head drivers S1D40000 series 69 LCD controller interface LCD drivers for large displays S1D17000 series S1D18000 series Drivers S1R72800/72900 series IEEE1394 controller Interface ICs USB2.0 device controller SCSI controller Power supply ICs S1R72000 series 70 S1R72100 series 70 S1F70000 series Melody ICs Multi music type 70 71~73 S1V71000 series S1V75600 series 74~76 S1V75700 series 74~75 Melody ICs Music generators ICs 3 ASSPs -1 LCD Controllers LCD Controllers Our LCD controllers feature high performance, low power consumption which was achieved by applying an original architecture based on our own "saving technology". These LCD controllers can be used on a variety of CPUs. Since the product line-up listed below allows to support a wide range of LCD panels, including those from small to large scale and those from monochrome to color, these controllers are best suited to office automation equipment and Windows CE installed equipment. For small- and medium-sized displays S1D13305 series These controllers are used for displaying characters and graphics on small-to-medium- sized LCD panels. A character generator built in this series enables to overlap character and graphic screens. Products (Previous number) S1D13305F00A (SED1335F0A) S1D13305F00B (SED1335F0B) Maximum display area CPU interface Target LCD panels Display memory Package 640x256x3 68-series, 80-series STN Maximum 64KB QFP5-60pin (Composition of 3 screens) (8bit) SRAM QFP6-60pin S1D13503/13700 series This series features low power consumption and space-saving with a video random access memory (VRAM) incorporated in the controller. This series provides display from monochrome to a maximum of 64K colors. Products (Previous number) S1D13503D00A (SED1353D0A) S1D13503F00A (SED1353F0A) Maximum display area CPU interface Target LCD panels Target LCD panels Package Evaluation board 640x200 68-series, 80-series STN (4/8/16 bits) Maximum 128KB Chip S5U13503P00C (256 color) (8/16 bit) SRAM QFP5-100pin (SDU1353#0C) S1D13503F01A ISA bus (SED1353F1A) S1D13704F00A (SED1374F0A) S1D13705F00A (SED1375F0A) S1D13706F00A (SED1376F0A) S1D13706B00A (SED1376B0A) 240x160 (256 color) 320x240 (256 color) S1D13708B00B* (SED1378B0B*) STN TFT, D-TFD 40KB Built-in SRAM QFP14-80pin S5U13704P00C (SDU1374#0C) STN TFT, D-TFD 80KB Built-in SRAM QFP14-80pin S5U13705P00C (SDU1375#0C) SH3/4, Mips-type STN 80KB TQFP15-100pin S5U13706P00C (64K color) 68-series, 80-series TFT, D-TFD Built-in SRAM CFLGA-104pin (SDU1376#0C) No WAIT CPU (SED1376D0A*) (SED1378F0A*) QFP15-100pin 160x240 S1D13706D00A* S1D13708F00A* SH3/4, Mips-type 68-series, 80-series, ISA bus SH3/4, Mips-type 68-series, 80-series, ISA bus Chip 160x240 SH3/4, Mips-type STN 80KB TQFP15-100pin S5U13708P00C* (64K color) 68-series, 80-series TFT, D-TFD Built-in SRAM PFBGA-121pin (SDU1378#0C*) S1D13708D00A* No WAIT CPU (SED1378D0A*) Chip * : Under development S1D13A00 series This series not only offer display memory (VRAM), but also more functionality by incorporating USB client and 2D accelerator. In addition, it provides low power consumption and saves space. Products (Previous number) Maximum display area CPU interface Target LCD panels Target LCD panels 320x160 (64K color) SH3/4, Mips-type 68-series, 80-series No WAIT CPU STN TFT, D-TFD 112KB Built-in SRAM STN TFT, D-TFD 160KB Built-in SRAM PFBGA-121pin S5U13A04P00C* SDU13A4#0C* STN TFT, D-TFD 200KB Built-in SRAM PFBGA-121pin S5U13A05P00C* SDU13A5#0C* S1D13A03F00A* (SED13A3F0A*) S1D13A03B00B* (SED13A3B0B*) S1D13A04B00B* (SED13A4B0B*) S1D13A05B00B* (SED13A5B0B*) 320x240 (64K color) 320x320 (64K color) SH3/4, Mips-type 68-series, 80-series No WAIT CPU SH3/4, Mips-type 68-series, 80-series No WAIT CPU Package Evaluation board TQFP15-100pin PFBGA-121pin S5U13A03P00C* SDU13A3#0C* * : Under development 60 ASSPs For large-sized displays S1D13500/13800 series This series consists of LCD and CRT controllers that can be widely used on various types of CPU and LCD panels. Full evaluation environment of this series allows to easily evaluate the controller. Products (Previous number) Maximum display area CPU interface Target LCD panels Display memory 800x600 (64K color) SH3, Mips-type 68-series, 80-series, ISA bus STN (4/8/16 bits) TFP (16 bits) CRT Maximum 2MB DRAM (FPM/EDO) SH3, Mips-type 68-series, 80-series, ARM-type, ISA bus SH3/4, Mips-type 68-series, 80-series, ARM-type, ISA bus SH3/4, Mips-type 68-series, 80-series, ARM-type, ISA bus STN (4/8/16 bits) TFT (16 bits) CRT STN, TFT CRT TV (NTSC, PAL) STN, TFT CRT TV (NTSC, PAL) S1D13504F00A (SED1354F1A) S1D13504F02A (SED1355F0A) S1D13506F00A (SED1356F0A) S1D13806F00A (SED1386F0A) TQFP15-128pin S5U13504P00C (SDU1354#0C) QFP20-144pin (SED1354F2A) S1D13505F00A Evaluation board QFP15-128pin (SED1354F0A) S1D13504F01A Package 800x600 (64K color) 800x600 (64K color) 800x600 (64K color) 1024x768 (256 color) Maximum 2MB DRAM (FPM/EDO) QFP15-128pin S5U13505P00C (SDU1355#0C) Maximum 2MB DRAM (FPM/EDO) QFP15-128pin S5U13506P00C (SDU1356#0C) 10Mbit Built-in SDRAM QFP20-144pin S5U13806P00C (SDU1386#0C) * : Under development 61 3 ASSPs -2 LCD Controller-drivers and Drivers LCD controller-drivers for small-sized displays Built-in character generators together with segement and common drivers simplify the task of displaying microprocessor messages on small LCDs. S1D12000 series Products (Previous number) Supply LCD voltage range voltage range (V) (V) Duty Segment Common Display RAM (characters) Microprocessor interface 40 4 or 8-bit serial S1D12200D (SED1220D) S1D12200T 2.4~3.6 4.0~7.0 1/26 64 26 (SED1220T) S1D12201D (SED1221D) S1D12201T 2.4~3.6 4.0~7.0 1/18 64 18 40 4 or 8-bit serial (SED1221T) S1D12210D (SED122AD) S1D12202D (SED1222D) S1D12205T 18 40 4 or 8-bit serial Au bump chip 2.4~3.6 4.0~7.0 1/18 60 18 40 4 or 8-bit serial Al pad chip 1.8~3.6 4.0~6.0 1/18,1/26 60 26 40 4 or 8-bit serial 2.4~3.6 4.0~12.0 1/30 65 30 48 4 or 8-bit serial S1D12301D S1D12301T 2.4~3.6 4.0~12.0 1/23 65 23 48 4 or 8-bit serial (SED1231T) S1D12302D (SED1232D) S1D12302T 2.4~3.6 4.0~12.0 1/16 65 16 48 4 or 8-bit serial (SED1232T) S1D12303D (SED1233D) S1D12303T 2.4~3.6 4.0~12.0 1/16 80 16 48 4 or 8-bit serial (SED1233T) S1D12304D (SED1234D) S1D12305D (SED1235D) S1D12400T (SED1240T) 62 Au bump chip TCP Au bump chip TCP Au bump chip TCP Au bump chip TCP Au bump chip TCP 2.4~3.6 4.0~12.0 1/30 62 30 48 4 or 8-bit serial Al pad chip 2.4~3.6 4.0~12.0 1/16 62 16 48 4 or 8-bit serial Al pad chip 1.8~3.6 4.0~10.0 1/18,1/34 80 34 80 4 or 8-bit serial S1D12400D (SED1240D) TCP 64 (SED1230T) (SED1231D) Au bump chip 1/18 S1D12300D S1D12300T TCP 4.0~7.0 (SED1225T) (SED1230D) Au bump chip 2.4~3.6 S1D12205D (SED1225D) Package Comment Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters (JIS,ASCII) LCD static drive allowed Built-in power circuit for LCD Three standard characters JIS,ASCII LCD dynamic drive only. Built-in power circuit for LCD Three standard characters JIS,ASCII LCD dynamic drive only. Au bump chip Line Blink, Vertical Scroll TCP ASSPs LCD drivers with RAM for small and medium-sized displays Ultra-low power consumption and on-chip RAM make this series ideal for compact LCD-based equipment. S1D15000 series Products (Previous number) Supply voltage range (V) LCD voltage range (V) Duty 0.9~6.0 1.8~6.0 1/4 Segment Common Display RAM (bits) Microprocessor interface Frequency (kHz) 128 bits Serial 18 (internal) S1D15100D00C (SED1510D0C) S1D15100F00C 32 4 (SED1510F0C) S1D15206DA S1D15206DB S1D15206FA 2.4~6.0 (SED1526FA) 3.5 Supply voltagex3 1/8,1/9, 1/16,1/17 80 17 80x33 bits 8-bit parallel or serial Au bump chip 20 QFP5-128pin S1D15206TA S1D15208DA S1D15208DB 2.4~6.0 (SED1528FA) 3.5~ Supply voltagex3 1/32,1/33 64 33 80x33 bits 8-bit parallel or serial Au bump chip 20 QFP5-128pin S1D15208TA S1D15300D00A Al pad chip (SED1530D0A) S1D15300D10A Al pad chip (SED1530DAA) (SED1530D0B) 2.4~6.0 4.5~16 1/32,1/33 100 33 132x65 bits 8-bit parallel or serial --- S1D15300D10B S1D15300T10A TCP (SED1530TAA) S1D15301D00A Al pad chip (SED1531D0A) (SED1531D0B) 2.4~6.0 4.5~16 1/64,1/65 132 --- 132x65 bits 8-bit parallel or serial --- S1D15301T00A S1D15302D00A S1D15302D11A Al pad chip (SED1532DBA) S1D15302D00B 2.4~6.0 4.5~16 1/64,1/65 100 33 132x65 bits 8-bit parallel or serial Au bump chip --Au bump chip (SED1532DBB) S1D15302T00A TCP (SED1532T0A) S1D15302T11A (SED1533DFB) 2.4~6.0 4.5~16 1/17 116 17 132x65 bits 3,4 2,560 bits 8-bit parallel or serial --- S1D15400D00A (SED1540D0B) 2.4~7.0 3.5~11 1/3,1/4 73 18 (internal) 8-bit parallel 4 (external) S1D15400F00A S1D15600D00A S1D15600D10A S1D15600D00B S1D15600T00B (SED1560T0B) S1D15600T26A (SED1560TQA) Au bump chip Al pad chip (SED1560DAA) (SED1560DAB) Built-in power circuit for LCD (DC/DCx4) (S1D15303*15**, no VREG) Small segment-type LCD display. Al pad chip (SED1560D0A) S1D15600D10B Au bump chip QFP5-100pin (SED1540F0A) (SED1560D0B) Built-in power circuit for LCD (DC/DCx4) (S1D15302*00**, Common: Right side) (S1D15302*10**, Common: Both side) (S1D15302***10**, Common: Left side) Al pad chip (SED1540D0A) S1D15400D00B Built-in power circuit for LCD (DC/DCx4) (S1D15301*00**, Common: Right side) TCP (SED1532TBA) S1D15303D15B Built-in power circuit for LCD (DC/DCx4) (S1D15300*00**, Common: Right side) (S1D15300*10**, Common: Both side) (S1D15300*10**, Common: Left side) Al pad chip (SED1532D0A) S1D15302D11B Au bump chip TCP (SED1531T0A) (SED1532D0B) Au bump chip Au bump chip (SED1530DAB) S1D15301D00B (DC/DCx3) (S1D15208*00***,VREG) (S1D15208*14**, no VREG) TCP (SED1528TA) S1D15300D00B (DC/DCx3) (S1D15206*00**, VREG) (S1D15206*14**, no VREG) Al pad chip (SED1528DA) S1D15208FA Small segment-type LCD display. TCP (SED1526TA) (SED1528DB) Al pad chip QFP12-48pin Comment Al pad chip (SED1526DA) (SED1526DB) Package 2.4~6.0 6.0~16 1/48,1/49, 1/64,1/65 102 65 166x65 bits 8-bit parallel or serial Au bump chip 18 Au bump chip Built-in power circuit for LCD (DC/DCx3) (S1D15600*00B*, 1/9 bias) (S1D15600*10B*, 1/7 bias) TCP QTCP 63 3 ASSPs -2 Products (Previous number) LCD Controller-drivers and Drivers Supply voltage range (V) LCD voltage range (V) Duty Segment Common Display RAM Microprocessor interface Frequency (kHz) S1D15601D00A S1D15601D00B Au bump chip (SED1561D0B) S1D15601D10B S1D15601T00B 2.4~6.0 6.0~16 1/24,1/25, 1/32,1/33 134 33 166x65 bits 8-bit parallel or serial Au bump chip 18 TCP (SED1561T0B) S1D15601T10B S1D15601T26A QTCP (SED1561TQA) S1D15602D00A Al pad chip (SED1562D0A) S1D15602D00B S1D15602T00B 2.4~6.0 6.0~16 1/16,1/17 (1/5 bias) 150 17 166x65 bits 8-bit parallel or serial Au bump chip 18 TCP (SED1562T0B) S1D15602T26A S1D10605D00B S1D10605T00A 1.8~3.6 4.5~14 (SED1065T0A) S1D10606D00A (SED1066D0A) S1D10607D00B (SED1067D0B) S1D10608D00B (SED1068D0B) S1D10609D00B (SED1069D0B) 1.8~3.6 4.5~14 1.8~3.6 4.5~14 1.8~3.6 4.5~14 1.8~3.6 4.5~14 1.7~3.6 5~16 S1D15B10D0B (Under development) 1/65 (1/7,1/9 bias) 1/49 (1/6,1/8 bias) 1/33 (1/5,1/6 bias) 1/55 (1/6,1/8 bias) 1/53 (1/6,1/8 bias) 1/65 (1/7,1/9 bias) Au bump chip 65 132x65 bits 8-bit parallel or serial 33 132 49 132x65 bits 8-bit parallel or serial 33 Au bump chip 132 33 132x65 bits 8-bit parallel or serial 33 Au bump chip 132 55 132x65 bits 8-bit parallel or serial 33 Au bump chip 132 53 132x65 bits 8-bit parallel or serial 33 Au bump chip 132 53 132x65 bits 8-bit parallel or serial TBD Au bump chip 132 TCP S1D15605D11B S1D15605D00B S1D15605D01B 1.8~5.5 4.5~16 S1D15605T00A 1/65 (1/7,1/9 bias) 132 65 132x65 bits 8-bit parallel or serial 33 S1D15605T00B S1D15605T00C S1D15606D11B S1D15606D00B 1.8~5.5 4.5~16 S1D15606D02B 1/49 (1/6,1/8 bias) 132 49 132x65 bits 8-bit parallel or serial 33 S1D15606T00A S1D15607D11B S1D15607D00B Au bump chip (SED1567D0B) S1D15607D01B 1.8~5.5 4.5~16 (SED1567D2B) 1/33 (1/5,1/6 bias) 132 33 132x65 bits 8-bit parallel or serial Au bump chip 33 Au bump chip S1D15607T00B Built-in power circuit for LCD (DC/DCx4) TCP (SED1567T0B) S1D15607T00C TCP (SED1567T0C) S1D15608D11B 1.8~5.5 4.5~16 (SED1568D0B) 1/55 (1/6,1/8 bias) 132 55 132x65 bits 8-bit parallel or serial 132x65 bits 8-bit parallel or serial Au bump chip 33 Au bump chip S1D15609D11B Built-in power circuit for LCD (DC/DCx4) Au bump chip (SED1569DBB) 64 Built-in power circuit for LCD (DC/DCx4) Au bump chip (SED1567DBB) S1D15609T (SED1569T) Au bump chip TCP (SED1566T0A) (SED1569D0B) Built-in power circuit for LCD (DC/DCx4) Au bump chip (SED1566D2B) S1D15609D00B Au bump chip Au bump chip (SED1566D0B) S1D15608D00B circuit for Au bump chip (SED1566DBB) (SED1568DBB) circuit for TCP (SED1565T0C) S1D15607D02B circuit for TCP (SED1565T0B) (SED1567D1B) circuit for TCP (SED1565T0A) (SED1566D1B) circuit for Au bump chip (SED1565D1B) S1D15606D01B Built-in power LCD (DC/DCx4) Built-in power LCD (DC/DCx4) Built-in power LCD (DC/DCx4) Built-in power LCD (DC/DCx4) Built-in power LCD (DC/DCx5) Au bump chip (SED1565D0B) (SED1565D2B) Built-in power circuit for LCD (DC/DCx4) Au bump chip (SED1565DBB) S1D15605D02B Built-in power circuit for LCD (DC/DCx3) QTCP (SED1562TQA) (SED1065D0B) Built-in power circuit for LCD (DC/DCx3) (S1D15601*00B*, 1/9 bias) (S1D15601*10B*, 1/7 bias) TCP (SED1561TAB) (SED1562D0B) Comment Al pad chip (SED1561D0A) (SED1561DAB) Package 1.8~5.5 4.5~16 1/53 (1/6,1/8 bias) 132 53 33 Au bump chip TCP Built-in power circuit for LCD (DC/DCx4) ASSPs Products (Previous number) S1D15A06D00B (SED15A6D0B) Supply voltage range (V) LCD voltage range (V) Duty 1.8~5.5 4.5~16 1/55 102 1.8~5.5 4.5~16 1/65 132 Display RAM Microprocessor interface Frequency (kHz) Package 55 102x65 bits 8-bit parallel or serial 33 Au bump chip 65 132x65 bits 8-bit parallel or serial 33 132x100 bits serial TBD Segment Common S1D15B01D00B (SED15B1D0B) S1D15B01T00A Au bump chip TCP (SED15B1T0A) S1D15E00D00B (SED15E0D0B) S1D15E00T00A 1.8~3.6 3.2~10 1/100 132 100 (SED1575D0B) S1D15705D03B (SED1575D3B) S1D15705T00A (SED1575T0A) S1D15705T03A (SED1575T3A) S1D15707D00B (SED1577D0B) S1D15707D03B (SED1577D3B) S1D15707T00A (SED1577T0A) S1D15707T03A (SED1577T3A) S1D15710T00A (SED157AT0A) 4-line MLS X-driver 4.5~16 1/65 168 65 200x65 bits 8-bit parallel or serial 22 Au bump chip Built-in power circuit for LCD (DC/DCx4) 4.5~16 1/65 168 65 200x65 bits 8-bit parallel or serial 22 TCP Built-in power circuit for LCD (DC/DCx4) 4.5~16 1/33 200 33 200x65 bits 8-bit parallel or serial 22 Au bump chip Built-in power circuit for LCD (DC/DCx4) 4.5~16 1/33 200 33 200x65 bits 8-bit parallel or serial 22 TCP Built-in power circuit for LCD (DC/DCx4) 4.5~18 1/65 224 65 224x65 bits 8-bit parallel or serial 22 3.6~5.5 2.4~3.6 3.6~5.5 2.4~3.6 3.6~5.5 2.4~3.6 3.6~5.5 2.4~3.6 1.8~5.5 Built-in self-refreshing function TCP S1D15710D00B (SED157AD0B) Reduced ext. parts Au bump chip (SED15E0T0A) S1D15705D00B Comment Au bump chip TCP Built-in power circuit for LCD 65 3 ASSPs -2 LCD Controller-drivers and Drivers MLS drivers for medium sized displays MLS driving method means simultaneous and selective driving of multiple common lines and, with the MLS driving method, the response speed, contrast ratio and power consumption can be drastically improved. For MLS driving, use combinations of a segment driver and a common driver among what are listed below. MLS driver lineup Products (Previous number) Supply voltage range (V) LCD voltage range (V) Segment Common Display RAM MPU interface 3.0~3.6 6.0~7.2 160 --- 160x240 bits 4 bits / 8 bits S1D15800D00B (SED1580D0B) S1D15800T00A Au bump chip 2.7~3.6 5.4~7.2 160 --- 160x240 bits 8 bits TCP (SED1590T0A) S1D15904D00B (SED1594D0B) S1D15904T00A 2.4~3.6 4.8~7.2 160 --- 8 bits --- --- Au bump chip 2.7~5.5 14~42 --- 120 S1D17500D00B S1D17500T00A Au bump chip 2.7~5.5 14~42 --- 160 --- --- S1D17C00D00B S1D17C00T00A (SED17C0T0A) 66 4-line MLS X-driver (common) TCP (SED1750T0A) (SED17C0D0B) 4-line MLS X-driver (common) TCP (SED1751T0A) (SED1750D0B) 4-line MLS X-driver (segment) TCP S1D17501D00B S1D17501T00A Built-in control function 4-line MLS X-driver (segment) Au bump chip 160x120x2 (4 colors tone) (SED1594T0A) (SED1751D0B) 4-line MLS X-driver (segment) TCP S1D15900D00B S1D15900T00A Remarks Au bump chip (SED1580T0A) (SED1590D0B) Package Au bump chip 1.7~3.7 16(Max.) --- 120 --- --- 4-line MLS X-driver (common) TCP ASSPs LCD drivers for large-sized displays High-speed drivers for large-sized dot-matrix displays that complement SEIKO EPSON's dedicated LCD controllers. S1D16000 series Segment drivers Products (Previous number) Supply voltage range (V) LCD voltage range (V) Duty Outputs Data bus Package S1D16006D00A Al pad chip (for COB) (SED1606D0A) S1D16006D00B Au bump chip (SED1606D0B) S1D16006F00A (SED1606F0A) S1D16006D01A QFP5-100pin 2.7~5.5 8~28 1/100~1/300 80 4-bit parallel AI pad chip (DOFF type) (SED1606D1A) S1D16006D01B Au bump chip (DOFF type) (SED1606D1B) S1D16400D00B Au bump chip (slim TCP) (SED1640D0B) Common drivers Products (Previous number) S1D16501D00A (SED1651D0A) Supply voltage Range (V) LCD voltage range (V) Duty Outputs Package 2.7~5.5 8~28 1/64~1/300 100 Al pad chip (zigzag positioning) S1D16700D00A Al pad chip (INH type) (SED1670D0A) S1D16700D01A (SED1670D1A) S1D16700D00B Al pad chip (DOFF type) 2.7~5.5 8~28 1/64~1/300 100 Au bump chip (INH type) (SED1670D0B) S1D16700D01B Au bump chip (DOFF type) (SED1670D1B) S1D16702D00A Al pad chip (INH type) (SED1672D0A) S1D16702D01A Al pad chip (DOFF type) (SED1672D1A) S1D16702D00B (SED1672D0B) 2.7~5.5 8~28 1/64~1/300 68 Au bump chip (INH type) S1D16702D01B Au bump chip (DOFF type) (SED1672D1B) S1D16702F00A QFP5-80pin (INH type) (SED1672F0A)* S1D17000 series Segment drivers Products (Previous number) Supply voltage range (V) LCD voltage range (V) Duty Outputs Data bus Package S1D17508D00B Au bump chip (SED1758D0B) S1D17508T00A (SED1758T0A) S1D17508T00B 2.7~5.5 14~42 1/100~1/500 160 8-bit parallel 2.7~5.5 14~42 1/100~1/500 240 8-bit parallel 2.7~5.5 14~42 1/100~1/500 240 8-bit parallel (SED1758T0B) S1D17508T00G (SED1758T0G) S1D17502T00A (SED1752T0A) S1D17502T00B (SED1752T0B) S1D17A02T00A (SED17A2T0A) S1D17A02T00B (SED17A2T0B) Application S1D17A02T00E (SED17A2T0E) Slim TCP (Outer lead pitch 0.092 mm) Flex TCP (Outer lead pitch 0.092 mm) Slim TCP (Outer lead pitch 0.080 mm) Ultra slim TCP (Outer lead pitch 0.070 mm) Flex TCP (Outer lead pitch 0.070 mm) Ultra slim TCP (Outer lead pitch 0.070 mm) Bent ultra-slim TCP (OLB pitch 0.070 mm) Ultra-slim TCP (OLB pitch 0.074 mm) Used with the S1D17403 or S1D17503 Used with the S1D17403 or S1D17503 Used with the S1D17403 or S1D17503 Common drivers Products (Previous number) S1D17403D01B (SED1743D1B) Supply voltage range (V) LCD voltage range (V) Duty Outputs Package 2.7~5.5 14~40 1/100~1/500 160 Au bump chip 2.7~5.5 14~42 1/100~1/500 120 S1D17503D00B (SED1753D0B) S1D17503T00A (SED1753T0A) Application Au bump chip TCP (OLB pitch 0.19 mm) 67 3 ASSPs -2 LCD Controller-drivers and Drivers LCD drivers for grayscale displays Controlling the lighting time, they avail gray-scale displays in 16 or 64 levels on the LCD panel. The applicable type of panel differs depending on the speed, withstanding voltage and driving method. S1D18000 series Products (Previous number) S1D18000D00B (SED1800D0B) S1D18001D00B (SED1801D0B) S1D18A01D00B (SED18A1D0B) Supply volgage range (V) LCD voltage range (V) Duty Segment Common Package 2.7~5.5 4.0~6.0 --- 160 --- Au bump chip 2.7~5.5 4.0~6.0 --- 162 --- Au bump chip 2.7~5.5 4.0~6.0 --- 240 --- Au bump chip Supply voltage range (V) LCD voltage range (V) Source Gate Package 2.7~5.5 10.0~40.0 --- 120 (two value) TCP 2.7~5.5 10.0~40.0 --- 120 (two value) Bend TCP Application PWM technology 64-level gray (6 bitx1) PWM technology 64-level gray (6 bitx3) PWM technology 64-level gray (6 bitx3) TFT LCD Drivers S1D17900 series Products (Previous number) S1D17909T00A (SED1790T0A) S1D17903T00B (SED1793T0B) S1D17904T00A (SED1794T0A) S1D17906D00B (SED1796D0B) S1D17907D00B (SED1797D0B) S1D17909T00A (SED1799T0A) 190/200 (two value) 150/154 (four value) Application 2.7~5.5 10.0~40.0 --- TCP 1.8~5.5 15.0~40.0 --- Au bump chip for COG 1.8~5.5 15.0~40.0 --- 240 (two value) Au bump chip for COG 1.8~5.5 15.0~40.0 --- 256 (two value) TCP Supply voltage range (V) LCD voltage range (V) Range Source Data inputs Package Application 3.0~3.6 6.0~9.0 312 6 bit digital TCP For driving of a dot reversed S1D19000 series Products (Previous number) S1D19006T00A (SED1906T0A) 68 3 -3 ASSPs Other Drivers Thermal-head drivers Products (Previous number) Logic supply voltage range V Output withstand voltage V (Max.) S1D50350D0A0 Output current mA (Max.) Clock frequency MHz (Max.) [#] 150 (SED5035D0A) Number of driver outputs Description 16 Chip S1D50360D0A0 7 [5] (SED5036D0A) 70 S1D50360F0A0 Both sides outputs 32 QFP12-48pin (SED5036F0A) S1D50680D0A0 (SED5068D0A) S1D53010D0A0 60 10 [8] 22 7 [5] Both sides outputs S1D53000D0A0 (SED5300D0A) 510% 10 [8] 8 [8] (SED5310D0A) 128 S1D53160D0A0 (SED5316D0A) S1D56150D0A0 (SED5615D0A) S1D56200D0A0 (SED5620D0A) 2.7~5.5 10 510% 32 S1D56250D0A0 (SED5625D0A) S1D56260D0A0 (SED5628D0A) 20 7 [5] 70 7 [6] One side output 10 [8] /5V One side output 200dpi low voltage 60 One side output 200dpi 10 [8] 64 Chip One side output 200dpi 2.7~5.5 10 100 7 [6] /5V 60 (SED5668D0A) S1D56800D0A0 30 (SED5680D0A) S1D56820D0A0 One side output 300dpi (for 12 dot) 7 [5] 20 (SED5682D0A) (SED5684D0A) 16 [16] 50 S1D56680D0A0 S1D56840D0A0 One side output 400dpi 15 35 (SED5626D0A) S1D56280D0A0 Both sides outputs 600dpi 12 S1D53100D0A0 (SED5624D0A) 64 32 (SED5301D0A) S1D56240D0A0 Package 510% 32 50 10 [8] S1D56850D0A0 96 One side output 300dpi 64 One side output 300dpi (for 12 dot) 20 (SED5685D0A) S1D56860D0A0 (SED5686D0A) S1D56880D1A0 (SED5688D1A) 10 7 [5] 60 10 [10] # : In case of cascade connection LED Printer-head drivers Products (Previous number) Supply voltage V S1D41000 (SED4100) S1D41010 (SED4101) S1D41800 (SED4180) 55% Output current mA (Max.) Clock frequency MHz (Max.) [#] 7 8 4.5 10 4 20 Number of driver outputs Features 64 Provided with constant current regulation terminal, both sides output Provided with constant current regulation terminal, both sides output 300dpi 128 Package Chip One side output 600dpi # : In case of cascade connection 69 3 ASSPs -4 Interface ICs The IEEE1394/USB2.0 controller is SEIKO EPSON's proprietary technique that serves as IC for high-speed serial interface. This product is best suited to rapid transmission linking PC to peripheral equipment such as storage drive. For those customers who desire to make the most of the past technological assets, the line-up of SCSI controller is also available. IEEE1394 controller Products (Previous number) Supply voltage (V) S1R72801F00A 5.0/3.3 (SPC7281F0A) S1R72803F00A * 5.0/3.3 (SPC7283F0A) S1R72900F00A * 3.3 (SPC7290F0A) S1R72901F00A * 3.3 (SPC7291F0A) Additional features zConformity to the IEEE1394-1995, 1394a Draft 2 zLINK controller zSBP-2 protocol support zBuilt-in CPU flash zIDE interface (Ultra ATA/33) zConformity to the IEEE1394-1995, 1394a Draft 2 zLINK controller zSBP-2 protocol support zBuilt-in CPU flash zIDE interface (Ultra ATA/66) zConformity to the IEEE1394a-2000 zPhysical layer (PHY) IC zTwo 1394 ports zCompatibility with transfer rates of 400/200/100 Mbits zConformity to the IEEE1394a-2000 zIntegration of LINK, PHY, CPU and Flash zAchievement of rapid transfer at 1394 via one chip zTwo at 1394 port zUltra ATA/66-compatible IDE interface Package QFP20-184 QFP20-184 QFP13-64 QFP15-100 *: Under development USB2.0 device controller Products (Previous number) Supply voltage (V) S1R72003F00A * 3.3 Additional features zConformity to the USB2.0 zHigh-speed, full-speed mode-ready zCompatibility with control, bulk, and interrupt transmission mode z4 end points Package QFP15-100 *: Under development SCSI controller Products (Previous number) S1R72103F00A (SPC7213F0A) S1R72104F00B (SPC7214F0B) S1R72105F00A (SPC7215F0A) 70 Supply voltage (V) 5.0/3.3 5.0/3.3 5.0/3.3 Additional features zCompatibility with SCS1-2 zTransfer rate: 10 Mbyte/second (at synchronization), 5 Mbyte/second (at asynchronization) zSCS1-3 Fast20-ready zTransfer rate: 20 Mbyte/second (at synchronization) zBuilt-in IDE interface (Ultra ATA/33) zCompatibility with SCS1-2 zTransfer rate: 10 Mbyte/second (at synchronization), 5 Mbyte/second (at asynchronization) zSCS1-3 Fast20-ready zTransfer rate: 20 Mbyte/second (at synchronization) zBuilt-in port interface zCompatibility with SCS1-2 zSCS1-3 Fast20-ready zBuilt-in DMA interface zBuilt-in USB1.1 interface zUSB full speed mode-ready Package QFP15-128 QFP15-100 QFP15-100 ASSPs 3 -5 Power Supply ICs Power supply ICs for logic Products (Previous number) S1F785200* (SCI7852) S1F76650* (SCI7665) S1F71100M0A0 (SCI7110M0A) S1F71200M0A0 (SCI7120M0A) S1F71200M0B0 (SCI7120M0B) Supply voltage (V) Output voltage Consumption current Power-off current Package 2.8~5.5 3.3V series/1.8V series 80A 1.0A SSOP3-24pin 1.6~5.5 3.3V/3.0V/2.5V T.B.D 1.0A SSOP3-24pin 3.3~12 3.3V 800A 1.0A SOP4-8pin 2.5~12 5.0V SSOP2-16pin 3.3V 150 A (at pressure rise) 15 A (at pressure fall) 1.0A 2.5~12 *: Under development Power supply ICs for liquid crystal Products (Previous number) S1F75510* Supply voltage (V) ~3.6 (SCI7551) S1F75300M0A0* 2.7~5.5 (SCI7530M0A) Output voltage Consumption current Double/triple in the positive direction Triple in the negative direction - 30V (Possible to set freely) 300A 200A (no-load) Features Package Conversion efficiency 90% Built-in stabilization circuit Built-in voltage follower Built-in electronic volume SSOP3-24pin SSOP1-20pin *: Under development DC to DC converters Products Features (Previous number) S1F76600D0B0 (SCI7660D0B) S1F76600C0B0 (SCI7660C0B) S1F76600M0B0 (SCI7660M0B) S1F76620M0A0 (SCI7662M0A) S1F76620D0A0 (SCI7662D0A) Package z Power supply voltage conversion IC Chip z Easy voltage conversions from input voltage to positive/ negative potential (two conversion types; one-fold for reverse polarity and two-fold for the same polarity) DIP-8pin z Power conversion efficiency: 95% typical SOP4-8pin z Possible to double pressure rise to positive potential SOP4-8pin z Power conversion efficiency: 95% typical Chip DC to DC converters and voltage regulators Features Products Package (Previous number) z Power supply voltage conversion IC z Easy voltage conversions from input voltage to positive negative potential (two conversion types; one- and two-fold for reverse (SCI7661C0B) polarity and two- and three-fold for the same polarity) S1F76610M0B0 z Power conversion efficiency: 95% typical (SCI7661M0B) z Built-in circuit for voltage stabilization S1F76610M2B0 z Four temperature coefficients suitable for LCD power supplies (SCI7661M ) S1F76610D0B0 (SCI7661D0B) S1F76610C0B0 BB z Power supply voltage conversion IC (SCI7654C0A) z Generation of 4/3/2 times output voltage in the negative direction S1F76540M0A0 z Power conversion efficiency: 95% (Max.) (SCI7654M0A) z Built-in voltage stabilization circuit z Possible to select temperature gradient for LCD power supply S1F76640M0A0 z Power supply voltage conversion IC (SCI7664M0A) z Possible to 2/3/4 times pressure rise output to the positive S1F76640D0A0 potential (SCI7664D0A) z Built-in stabilization circuit S1F76540C0A0 Chip DIP-14pin SOP5-14pin SSOP2-16pin DIP-16pin SSOP2-16pin SSOP2-16pin Chip Switching regulators Products (Previous number) Supply voltage range (V) S1F76310M1L0 S1F76310M1B0 S1F76310M1K0 (SCI7633MBA) S1F76380M1H0 (SCI7638MHA) S1F76380M1L0 (SCI7638MLA) Power-on clear Battery backup Ripple noise suppression input Built-in CR Provided Provided Provided Provided 3.5 (SCI7631MKA) S1F76330M1B0 Voltage detection Output voltage temperature (mV/C) Package 3.0 (SCI7631MBA) (SCI7631MAA) Oscillator 2.4 (SCI7631MLA) S1F76310M1A0 Output voltage (V) 1.5 Min. : 0.9 --SOP3-8pin 5.0 3.0 Crystal Not Provided Not Provided Built-in CR Provided Provided 2.2 2.4 Not Provided -4.5 Not Provided Provided -4 71 3 ASSPs -5 Power Supply ICs High precision voltage regulators Products (Previous number) Input voltage (V-max.) S1F78100Y2H0 S1F78100Y2G0 S1F78100Y2F0 2.2 (SCI7810YFB) S1F78100Y2L0 S1F78100Y2R0 S1F78100Y2D0 3.0 (SCI7810YDB) S1F78100Y2C0 3.2 3.3 S1F78100Y2N0 S1F78100Y2K0 3.9 (SCI7810YKB) S1F78100Y2P0 40 (VI=6V) S1F78100Y2M0 4.5 (SCI7810YMB) S1F78100Y2B0 (SCI7810YBB) S1F78100Y2A0 (SCI7810YAB) S1F79100Y2H0 5.0 50 (VI=7V) 6.0 50 (VI=8V) -1.5 (SCI7910YHA) S1F79100Y2G0 -1.8 (SCI7910YGA) (SCI7910YBA) SOT89-3pin 4.0 (SCI7810YPB) S1F79100Y2B0 30 (VI=5V) 3.5 (SCI7810YNB) (SCI7910YPA) 1.5 15 (SCI7810YTB) S1F79100Y2P0 10 (VI=3V) 2.8 (SCI7810YRB) (SCI7910YDA) Package 2.6 (SCI7810YLB) S1F79100Y2D0 Current consumption (A-typ.) 1.8 (SCI7810YGB) S1F78100Y2T0 Output current (mA-Typ.) 1.5 (SCI7810YHB) (SCI7810YCB) Output voltage (V) -5V -3.0 100 4.0 -4.0 -5.0 Note) Temperatures during reflow soldering must remain within the limits set out under LSI Device Precautions in this catalog. Do not immerse QFP and SOT89 packages during soldering, as the rapid temperature gradient during dipping can cause damage. 72 ASSPs High precision voltage detectors Products (Previous number) Output level (V) S1F77200Y1V0 (SCI7720YVA) S1F77200Y1A0 (SCI7720YAA) (SCI7720YYA) (SCI7720YCA) S1F77200Y1F0 (SCI7720YFA) S1F77200Y1T0 (SCI7720YTA) S1F77210Y1C0 (SCI7721YCA) S1F77210Y2C0 (SCI7721YCB#) S1F77210Y1P0 (SCI7721YPA) S1F77210Y1S0 (SCI7721YSA) (SCI7721YEA) 1.1 1.05 1.1 1.15 1.1 1.15 1.2 1.85 1.9 1.95 2.1 2.15 2.2 2.6 2.65 2.7 2.0 (VDD=3.0V) 3.9 4 4.1 2.0 (VDD=5.0V) 2.1 2.15 2.2 2.1 2.15 2.2 2.2 2.25 2.3 2.3 2.35 2.4 2.5 2.55 2.5 2.6 2.65 2.7 SOT89-3pin S1F77210Y1F0 (SCI7721YFA) S1F77210Y2F0 (SCI7721YFB#) S1F77210Y1R0 (SCI7721YRA) 2.6 2.65 2.7 2.73 2.8 2.87 2.93 3 3.07 3.13 3.2 3.27 3.43 3.5 3.57 1.5~15.0 CMOS S1F77210Y1H0 (SCI7721YHA) S1F77210Y130 (SCI7721Y3A) S1F77210Y1T0 (SCI7721YTA) S1F77210Y1M0 (SCI7721YMA) S1F77210Y1J0 (SCI7721YJA) S1F77210Y120 (SCI7721Y2A) S1F77210Y1K0 (SCI7721YKA) S1F77210Y1L0 (SCI7721YLA) (SCI7722YDA) 1 1.05 2.0 (VDD=3.0V) S1F77210Y1E0 S1F77220Y1D0 0.95 1 2.0 (VDD=3.0V) S1F77200Y1C0 (SCI7721YGA) 0.9 Package N-channel open drain (SCI7720YNA) S1F77210Y1G0 Operating current A-Typ. 0.8~10.0 S1F77200Y1B0 S1F77200Y1N0 Operating voltage range (V) 1.5 (VDD=1.5V) S1F77200Y1Y0 (SCI7720YBA) Detection voltage level (V) Min. Typ. Max. P-channel open drain 2.0 (VDD=4.0V) 3.9 4 4.1 4.1 4.2 4.3 4.3 4.4 4.5 4.5 4.6 4.7 4.7 4.8 4.9 4.9 5 5.1 2.0 (VDD=6.0V) 1.2 1.25 1.3 1.5 (VDD=1.5V) 2.0 (VDD=5.0V) #: Output Polarity reversed version Note) Temperatures during reflow soldering must remain within the limits set out under LSI Device Precautions in this catalog. Do not immerse QFP and SOT89 packages during soldering, as the rapid temperature gradient during dipping can cause damage. 73 3 ASSPs -6 Melody ICs Melody ICs SEIKO EPSON's melody ICs offers wide range of features and melodies to suit all applications. Custom melodies are easily implemented with the buil-in programmable mask ROMs. Transducer Products (Previous number) Melodies (notes) Melody selection Oscillator Dynamic Piezo- Binary Serial speaker buzzer code trigger Accom pani- Envelope ment CR oscillation (Both C External clock and Roscillators are built in.) Power supply voltage (V-typ.) Play mode Level hold Oneshot Abort play Package 1.5V 3V 5V Additional features S1V75600M00A (SVM7560M0A) S1V75600M00B/C00B 2(128) { --- { --- { { { --- { --- --- { 2(128) { --- { --- { { { --- --- (Oneshot C) --- { 2(128) { --- { --- { { { --- --- { (Oneshot A) --- { 16(512) { --- --- { { { --- { --- --- { 16(512) { --- --- { { { --- --- (Oneshot A) --- { 16(495) --- { { --- --- --- { { (SVM7560M0B/C0B) S1V75600D00K (SVM7560D0K) S1V75600M00M/C00M/ D00M (SVM7560M0M/C0M/D0M) S1V75600M00V (SVM7560M0V) S1V75601M00B/C00B/ D00B M** : SOP3A-8pin C** : DIP-8pin D** : chip (SVM7561M0B/C0B/D0B) S1V75601M00C/C00C/ D00C (SVM7561M0C/C0C/D0C) S1V71000M00J (SVM7100M0J) Music generators { --- --- SSOP-20pin : Selectable by the terminal Music generators are high-quality custom melody ICs capable or reproducing preprogrammed music by synthesizing the sounds of several musical and percussion instruments, as well as alarm signals. Transducer Products (Previous number) Melody selection Oscillator CR Accom Melodies pani- Envelope oscillation (notes) Dynamic Piezo- Binary Serial (Both C External ment speaker buzzer code trigger clock and Roscillators are built in.) Power supply voltage (V-typ.) Play mode Level hold Oneshot Abort play Package Additional features 1.5V 3V 5V --- --- { SOP1-24pin { Mode play: Level Hold One Shot DIP-16pin* B and C S1V75700M05P (SVM7570M5P) S1V75700M06F 15(620) { --- { --- 4 { --- { { { (SVM7570M6F) S1V75701C05N (SVM7571C5N) S1V75701C06G (SVM7571C6G) S1V75701C06H (SVM7571C6H) S1V75701C06J (SVM7571C6J) 15(620) { --- { --- 4 { (possible) { --- { { --- --- S1V75701C06K (SVM7571C6K) S1V75701C06N (SVM7571C6N) S1V75701C06P (SVM7571C6P) *: Selectable 8 melodies (Max.) in DIP-16pin 74 ASSPs Standard melodies Products (Previous number) Melody Goodbye Song Minuet Symphony No. 40 Fur Elise The Entertainer Mary Had a Little Lamb CHIME ALARM Runner I Want to Take Care of You Oribia wo Kikinagara September Saturday Lovers Autumn Surf heaven, Ski Heavey Color/White Blend Happy Birthday Mickey Mouse club march It's a small world Forest Bear Cha Cha Cha Toy Who Needs a Kid Like This? Lullaby Rudolph the Red-Nosed Reindeer F. Chopin J. S. Bach W. A. Mozart L. v. Beethoven American Folk Song American Folk Song ----New Funky Suekichi Yumi Matsutohya Ami Ozaki Mariya Takeuchi Tatsuroh Yamashita Kazumasa Oda Yumi Matsutohya Mariya Takeuchi M. J. Hill Jimmie Dodd Richard M. Sherman American Folk Song Nobuyoshi Koshibe Takeshi Shibuya F. Schubert Johnny Marks Twinkle Twinkle Little Star Old Macdonald had a Farm One sunny day London bridge is falling down Mary Had a Little Lamb Rock-A-Bye Baby Lullaby We Wish You a Merry Christmas French Folk Song American Folk Song American Folk Song English Folk Song American Folk Song American Folk Song J. Brahms English Folk Song S1V75701C06K Ampanman Theme Electric Parade New Year's Day Ureshii Hinamatsuri Carp Run Lonesome Journey Snow Jingle bells Rocky (theme) Star Wars (theme) James Bond (theme) Axel Foley (theme) Batman (theme) Indiana Jones (theme) Superman (theme) Popeye (theme) Takashi Miki J. Perrey & G. Kingsley Sanetsura Ue Kohyoh Kawamura Unknown Ordway J. P. Unknown J. Pierpont Bill Conti John Williams Manty Norman Harold Faltermeier Prince R. Nelso J. Williams J. Williams Lean Flatow 1 (SVM7571C6K) 2 (5.0V spec.) 3 4 5 6 7 8 S1V75701C06N 1 (SVM7571C6N) 2 (5.0V spec.) 3 4 5 6 7 8 Products Composer S1V75701C05N 1 (SVM7571C5N) 2 (5.0V spec.) 3 4 5 6 7 8 S1V75701C06G 1 (SVM7571C6G) 2 (5.0V spec.) 3 4 5 6 7 8 S1V75701C06H 1 (SVM7571C6H) 2 (5.0V spec.) 3 4 5 6 7 8 S1V75700M05P/ S1V75701C06J 1 2 (SVM7570M5P/ 3 SVM7571C6J) 4 (5.0V spec.) 5 6 7 8 Melody (Previous number) S1V75701C06P Composer She wore a yellow ribbon My darling Clementine The yellow rose of Texas Yankee Doodle When the saints go marchin' in Londonderry air Havah Nagilah Jamaica farewell Yellow Submarine Yesterday Penny Lane Let It Be Ob-La-Di, Ob-La-Da Hey Jude All My Loving Here Comes the Sun It's a small world Love me tender Old macdonald hada farm March of the Toy Soldiers Yankee doodle dandy Rudolph the Red-Nosed Reindeer / Santa Claus is Coming to Town 7 Wedding March 8 The Entertainer 9 Two Minutes 10 Landler Tanz 11 CHIME 12 Mickey Mouse club march S1V75600M00A 1 Je Te Veux 2 Minuet (SVM7560M0A) S1V75600M00B/ 1 Beauty and the beast C00B 2 A whole new world American Folk Song American Folk Song American Folk Song American Folk Song American Folk Song Old Irish Melody Judaic Folk Song Jamaican Folk Song J. Lennon J. Lennon J. Lennon J. Lennon & P. McCartney J. Lennon J. Lennon J. Lennon George Harrison Richard M. Sherman Elvis Presley American Folk Song Leon Jessel American Folk Song Johnny Marks J. Fred Coots R. Wagner American Folk Song J. S. Bach W. A. Mozart --Jimmie Dodd E. Statie L. Boccherini S1V75600D00K M. J. Hill 1 (SVM7571C6P) 2 (5.0V spec.) 3 4 5 6 7 8 S1V75700M06F 1 (SVM7570M6F) 2 (5.0V spec.) 3 4 5 6 7 8 S1V71000M00J 1 (SVM7100M0J) 2 3 4 5 6 (SVM7560M0B/C0B) (SVM7560D0K) 1 Happy Birthday To You S1V75600M00M/ 1 CHIME C00M/D00M (SVM7560M0M/C0M/ 2 BUZZER A. Menken A. Menken ----- D0M) S1V75600M00V 1 Calling sound (upper line) (SVM7560M0V) 2 Calling sound (lower line) S1V75601M00B/ 1 Aria C00B/D00B 2 Jimnopedi No.1 (SVM7561M0B/C0B/ 3 Spring song 4 Green Sleeves D0B) S1V75601M00C 5 Home on the Range 000/C00C/D00C 6 Minuet (SVM7561M0C/C0C/ 7 The Entertainer 8 Jingle bells D0C) 9 Magnificent Waltz 10 Heaven and Hell 11 Bright Spring Flower 12 Westminster 13 CHIME 14 BUZZER 15 Calling sound(upper line) 16 Calling sound(lower line) ----Pasel E. Statie F. Mendelson English folk Song American Folk Song J. S. Bach American Folk Song J. Pierpont F. Chopin Offenbach M. Lock J. E. Zartor ------- All the part numbers without voltage indication are for 1.5V. 75 3 ASSPs -7 Melody ICs/Music Generator Development Melody ICs development Melody ICs are customized by programming the ROM data with the customer's melody. Custom IC ordering information Minimum order Medium Simulation tape Test samples Delivery (5 units of schedule ceramic (standard) packages) Volume production Simulation tape Mask charge 30,000 ICs over six months Music score or magnetic tape Ten days after receipt of the medium Six weeks after approval of the simulation tape Ten weeks after receipt of the order 60,000 for the S1V75600 series (SVM7560 series), 120,000 for the S1V75601(SVM7560)/S1V71000(SVM7100) series 500,000 standard; Test samples are included. Period Six months from the start of volume delivery, or three months after the delivery of test samples, if no order is placed. Exclusiveness Applica A melody IC is an object of exclusiveness in its original form as defined in the customer's original specification. bility A melody IC with any amendments in form or function is not considered to be an object of exclusiveness. * Copyrighting will be handled by SEIKO EPSON * When selling our melody ICs or products using them to countries other than your own, dealing again with copyright matters may exceptionally become necessary depending on the regulations of the country to sell to. * Special options are not included in the mask charge. * Since the delivery schedule is based on that of a standard product, actual delivery dates may vary. Other Music generator ICs development Music generators are customized by programming the ROM data with the customer's music arrangement. Custom IC ordering information Minimum order Medium Simulation tape Test samples Delivery (5 units of schedule ceramic (standard) packages) Volume production Simulation tape Mask charge 10,000 ICs over six months Music score or magnetic tape Fourteen days after receipt of the medium, plus two days per extra tune for more than five tunes Six weeks after approval of the simulation tape Ten weeks after receipt of the order 120,000 plus 5,000 per extra tune for more than five tunes 500,000, including test samples Period Six months from the start of volume delivery, or three months after the delivery of the test samples, if no order is placed. Exclusiveness Applica A music generator is an object of exclusiveness in its original form as defined in the customer's original specification. bility A music generator with any amendments in form or function is not considered to be an object of exclusiveness. Other 76 * Copyrighting will be handled by SEIKO EPSON. * When selling our melody ICs or products using them to countries other than your own, dealing again with copyright matters may exceptionally become necessary depending on the regulations of the country to sell to. * Special options are not included in the mask charge. * Since the delivery schedule is based on that of a standard product, actual delivery dates may vary. ASSPs Development flow Customer Product planning Interface Musical score /music tape or CD Sample evalua -tion Approval Request for Tape and simulations score attached (* Musical scores) (in 3 copies) with the (* Recorded tapes) acknowledging Simulation SEIKO EPSON work Coding of ROM Creation of simulation cassette tape or EPPROM Delivery TS Advise of approval (Test sample) ES (Engineering *1 sample) document (arrangement) Sample approval Mask production Sample production TS/(ES) Advise of approval Volume production *2 *1 : Engineering samples are provided for the S1V75700(SVM7570). *2 : Shipping specifications will be issued, if required. 77 Section 4 Memories Capacity (bits) Organization (bits) 2M 128Kx16 Access time (ns) Page S1M0W026B0J 100/70 80 S1M0V023B0J 85 80 S1M0W046B0J 100/70 80 S1M0V043B0J 85 80 S1M1W043B0J* 70 80 512Kx8 S1M0V040B0J* 85 80 6M 384Kx16 S1M0V063B0J* 85 80 8M 512Kx16 S1M1V083B0J 100/70 80 256Kx16 Static RAM Products 4M * : Under development 4 Memories -1 Static RAMs Products (Previous number) Supply voltage V Operating mA (Max.) Standby A (Max.) Operating temperature (C) Access time ns (Max.) Package 128Kx16 1.8~2.2 30 15 -40~85 100 CSP-48 pin 128Kx16 2.2~3.0 35 20 -40~85 70 CSP-48 pin 128Kx16 2.4~3.3 35 15 -40~85 85 CSP-48 pin 256Kx16 1.8~2.2 30 15 -40~85 100 CSP-48 pin 256Kx16 2.2~3.0 35 20 -40~85 70 CSP-48 pin 256Kx16 2.4~3.3 35 15 -40~85 85 CSP-48 pin 512Kx8 2.4~3.3 35 15 -40~85 85 CSP-48 pin 256Kx16 1.65~2.2 25 10 -40~85 70 PCSP-48 pin 6M 384Kx16 2.4~3.3 35 30 -40~85 85 PCSP-72 pin 8M 512Kx16 2.4~3.0 35 15 -40~85 70 CSP-48 pin S1M0W026B0J1 (SRM2AW216LLBT1) S1M0W026B0J7 (SRM2AW216LLBT7) 2M S1M0V023B0J8 (SRM2AV213LLBT8) S1M0W046B0J1 (SRM2AW416LLBT1) S1M0W046B0J7 (SRM2AW416LLBT7) S1M0V043B0J8 (SRM2AV413LLBT8) 4M S1M0V040B0J8* (SRM2AV400LLBT8) S1M1W043B0J7* (SRM2BW413LLBT7) S1M0V063B0J8* (SRM2AV613LLBT8) S1M1V083B0J7 (SRM2BV813LLBT7) Power dissipation Bit organization (bits) Density (bits) * : Under development 80 Section 5 Custom IC 5 Custom IC -1 Development of Custom IC SEIKO EPSON always places itself in customers' shoes to offer ideal products. Customers also get involved in processes from examination of specifications at the stage of development, design to mass production. Custom ICs are developed by SEIKO EPSON jointly with the customers. All steps from examination of specifications including functions and features, review of the results of evaluation to mass production, including contracts, are taken in collaboration with our customers. For information on integration of your circuit with the existing products, contact SEIKO EPSON. Customer Merchandising Preparation of summary of specifications Interface Presentation of summary of specifications SEIKO EPSON Preview of merchandizing Crystal, CR oscillation Analog switch A/D, D/A conversion PLL VCO Op-Amp Comparator Filter Approval for specifications for development Circuit design Examination of specifications for development Examination of plan FIX Review of merchandizing Formulation of plan High withstand voltage technology Circuit design Meeting needs for features Power control 0.9V operation Analog technology Low voltage, low power consumption System technology Seiko Epson's advanced technology 82 Preparation of specifications for development Review of design Mixing with 1 chip Custom IC NO TS/ES Approval for preparation Approval for specifications for delivery TS/ES Evaluation Approval for starting mass production NO TS/ES Report of the results of evaluation Starting delivery of mass produced goods NO TS/ES Fabrication Preparation of specifications for delivery TS/ES Evaluation Approval for mass production Mass production Evaluation of mass production Approved products for delivery NO 1.5V logic Interface Applications User logic Detector, regulator RAM ROM Oscillation circuit Control circuit Electronic notebook, handy terminal, pager, clock, melody etc. Floppy disk controller, sensor application products, AV products, mobile phone, etc. Thermal head driver, LCD driver, Driver for ink-jet printer, VFD driver, etc. 83 Section 6 Sub-system Assembly Technology Chip-on-FPC Chip-on-board Tape automated bonding Hybrid modules 6 Sub-system Assembly Technology -1 Application Products of Sub-system Assembly Technology SEIKO EPSON supports customer products creation of miniaturization using super-low power CMOS LSI that is a key device and high density assembly that is a key technology. Today, miniaturization of electronics products continues to evolve as well as higher values are increasingly added to products such as the advent of products with enhanced performance and varied functions. ment-friendly products have been given priority. Meanwhile, environ- In implementing miniaturized, high value-added, improved quality products, the high-density packaging technology plays an important role. SEIKO EPSON pursues assembly technology originally by fusion of super-fine technology and low-power consumption technologies such as CMOS LSI technology, that are cultivated with watch manufacturing. SEIKO EPSON meets every possible need of customers by using advanced assembly technologies such as COB to realize a super-small-sized assembly, COF to realize a super-light and thin assembly, and SMT to be a base of high density assembly, etc. Application Products Assembly technology Application products Chip-on-Flexible LCD modules, microcomputer-applied printed circuit (COF) Chip-on-board (COB) assembly Tape automated bonding products, multi-chip modules LCD modules, microcomputer-applied products, multi-chip modules LCD modules, tape carrier packages (TAB) assembly (TCP) Surface-mount Microcomputer-applied products, Inter- technology (SMT) assembly Complete OEM Applications Cellular phone Pager Portable LCD game Databank, electronic calculator Personal digital assistant (PDA), handy terminal Remote control unit for portable audio system Remote control unit for air conditioner face module CARD-PC, remote control unit, custom PC card, GPS card Example of Applied Products LCD Module (COF) (Display module for the handheld products) CARD-PCI/GX (CARD size PC) Interface Module (IDE-IEEE1394 data exchange module) L54120010010000 (SEK2001B0A) S4E28720C series (SCE8720C series) S4E106600010000 (SEK0660B0A) 86 Sub-system Assembly Technology Sub-system Assembly Technologies Chip-on-FPC (COF) Flip chips are assembled on a flexible printed circuit (FPC) with their face down. Since the board is made of film, its shape is flexible, and it can be easily folded. Three-dimensional module is also possible, depending on the shape. The COF technology provides not only very thin board configurations, but also light, highly free, small, and high-density board configurations. Possible to assemble ICs with pad pitches up to 50m (40m:under development) Thickness of base film : 40m (25m:Under development) Possible to mount SMT devices on FPC and to shape key pad Chip-on-board (COB) Bare chips are directly mounted on the board to reduce assembled area. The COB technology provides thin, high-density board configurations, and realizes miniaturization of customer products. Custom configuration is possible. Multi-chip assembly is possible. Possible to use on multi-layer wiring board with 4 or more layers Tape automated bonding (TAB) The TAB assembly is a bonding technology used in tape carrier packages (TCP) for VLSIs containing many pins and LCD driver ICs. This technology is extremely effective as low impedance bonding without loss of performance of device, and realize thin, high-density assembly. Thin, small assembly down to approximately 1 mm in thickness is possible. Easy to adapt to applications with many pins B-TAB (Bumped-TAB) technology provides TAB production of bump-less ICs Assembly of surface mount devices (SMD) on a tape is possible. Hybrid modules Combination of SMT, TAB and COB assembly technologies provides very small, thin modules. Possible to use optimal assembly technology and configration from wide selection. Possible to assemble liquid crystal display Assembly technology matched with the shape of device and products can be chosen. 87 6 Sub-system Assembly Technology -2 Development of Application Products SEIKO EPSON for a module product Development flow development with customer, wholly supplies the most suitable technology for a product specification. It is possible to support design of not only circuit but also board and packing. To realize high value-added products Customer with becoming high-density and thin, SEIKO EPSON participates from a specification examination of customer for high-density assemble technology. Product planning SEIKO EPSON handle from circuit General specifications Approval of detailed specifications Circuit design design to board and packing design as request of customer. For mass production, doing the general design to be the most suitable for a product specification, pass for a trial production and evaluation. Of course, all production processes pursue high quality under consistent quality control. Due to short lead times and cost down, SEIKO EPSON is provided with the exclusive manufacturing line for vari- Interface Specification guidelines and shematic circuit diagram Review and specification fixing ous assemble technology. SEIKO EPSON 88 Initial review and appoximate estimating Product planning Development specifications Test and evaluation sample design Sub-system Assembly Technology No Approval of delivery specification Test and evaluate samples Delivery of volume production and delivery Production order No Test and evaluation report Yes No Test and evaluation sample production Test and evaluate samples Delivery Volume specifi- production plan cation Order components and special tooling for volume production Final authorization Volume production start Volume production Evaluation Shipping authorization No 89 LSI Device Precautions Handling and operating precautions SEIKO EPSON's plastic-molded LSIs are designed and manufactured for trouble-free operation when used under normal operating conditions. All products are subjected to stringent electrical and mechanical testing to ensure reliability. When working with our products, you should take the following precautions. Use ICs within the rated operating voltage, operating temperature, operating input/output voltage and input/output current ranges. If ICs are used outside the rated ranges, you may experience high failure rates. Excessive electrical noise applied to a power or input pin can cause ICs to latch up, resulting in device malfunction or damage. If this occurs, turn off the power, isolate the problem, then supply power again. Do not expose ICs to excessive mechanical vibration, repetitive shock stress, or rapid temperature changes. These factors van cause the plastic package resin to crack and/or the bonding wires to break. Although all pins have electrostatic discharge protection circuits, excessive electrostatic stress can damage ICs. Use anti-static tubes or foam, conductive containers or aluminum foil for packaging and transportation. Do not use untreated plastic containers. Use grounded soldering tools and test equipment. Also ensure that all personnel which handle ICs wear appropriate anti-static overalls and grounding wriststraps. Electromagnetic interference can cause ICs to operate erratically. Shield all interference sources in equipment that uses ICs. Dust, liquids, acidic and other corrosive gases cause oxidation and package degradation that can result in shorting. Apply a sealing coat to ICs exposed to hazardous environments. Store ICs in a dry environment within the rated storage temperature range. Large temperature fluctuations can cause corrosion as the result of dewing. Do not place heavy objects directly on ICs. Handle ICs carefully at all times so as not to deform package leads. 91 Mounting precautions for surface mount devices Recommended storage conditions The resin used in plastic packages absorbs moisture. Consequently, certain storage conditions should be maintained prior to reflow soldering. The table below shows the allowable storage conditions for plastic packages. Always store packages in an environment that satisfies these conditions. The allowable storage duration under sealed moisture proof bag is one year. Storage conditions and storage time of standard surface mounting type ICs Package products Standard Surface Mount Device (SMD) ... QFP, SOP, PLCC, etc. Storage condition Storage rank S I-1 I-2 I-3 I-4 B 25C 60%RH 30C 80%RH 1.5 months (6 weeks) 10 days (240 hours) 12 days (288 hours) 7 days (168 hours) 7 days (168 hours) 5 days (120 hours) 5 days (120 hours) 1 day (24 hours) 1 day (24 hours) 12 hours Make sure to assemble within 48 hours from the time when the baking has been done after opening the sealed moisture proof bag. Allowable storage duration before opening the package (sealed moisture proof bag): 12 months When reflow is done twice, be sure to carry it out within the storage duration of each package rank. When the storage time after opening the package has been exceeded or it has become unknown, carry out mounting after re-baking. Certain Standard Mount Device ... BGA Storage atmosphere Storage time after opening 25C 60%RH 3 days (72 hours) The allowable storage duration prior to opening the package (moisture proof bag): 12 months When reflow is done twice, be sure to carry it out within the storage duration of each package rank. When the storage duration after opening the package has been exceeded or it has become unknown, carry out mounting after re-baking. Standard THD ... DIP etc. Storage atmosphere Storage time after opening 25C 60%RH 1.5 months (6 weeks) Allowable storage duration before opening the package (sealed moisture proof bag): 12 months For details on storage rank, please contact the nearest Sales Office. TAB products Storage condition Before opening moisture proof bag After opening 25C, 60%RH 30C, 80%RH Allowable storage time 12 months 3 weeks 1 week Package baking conditions Packages which exceed the recommended storage conditions should be baked before reflow soldering. This baking process will prevent the resin from cracking or losing adherence during soldering. Meanwhile, baking should be done up to 2-times under the following conditions. Baking conditions for standard surface mounting type ICs Baking temperature 125C Package thickness 5 hours t<2mm t2mm 24 hours The above conditions are typical specification. So please ask Seiko Epson about the storage conditions, storage limits and baking condition for each package, because the humidity condition depends on the thickness of package. 92 Mounting precautions for surface mount devices Soldering precautions When soldering surface mounting packages (QFP, SOP, PLCC, etc.) under methods wherein the whole packages get heated such as infrared reflow and vapor phase reflow, observe the following conditions. Such reflowing may be carried out upto 2-times only. Meanwhile, pay extra attention to the storage conditions since humid plastic packages more tend to cause non-conformities such as occurence of cracks. During reflow soldering, plastic packages are exposed to high temperatures. Consequently, the following precautions should be taken. Infrared reflow soldering The infrared reflow soldering temperatures shown in Fig. A must not be exceeded; and the maximum allowable package resin temperature, of 235 C should not be maintained for more than ten seconds. Fig. A Infrared reflow soldering Vapor-phase reflow soldering The vapor-phase reflow soldering temperatures shown in Fig. B should not be exceeded, and temperature gradient must be held below 1 to 5 C/sec. Fig. B Vapor-phase reflow soldering Wave soldering Do not use wave soldering for QFP or SOT89 packages, since the steep temperature gradient during dipping can cause device damage. Handling precautions for surface mount packages With surface mount packages, the patterns of the P.C.B. and the leads of the packages are soldered at direct contacts. Seiko Epson is therefore shipping them out guaranteeing flatness of the leads good enought for such soldering. Consequently, it is suggested to handle them with suffi- cient care to keep them from stress which may cause deformation of the leads. 93 Sales Information Sales Information Information about discontinued products The following products will be discontinued and could you consider the alternative product for the new development. But we can accept the only repeat purchase order of current mass production. ASICs MCUs LCD controllers LCD drivers Plasma display drivers DVD chip set CD-ROM decoders SLA40000 series, SSL40000 series E0C33A104, E0C33202, E0C33204, E0C33208, E0C6215, E0C623A, E0C62L3A, E0C623E, E0C62A3E, E0C62L3E, E0C6235, E0C62A35, E0C62L35, E0C6247, E0C6262, E0C62A62, E0C62L62, E0C62T3, E0C63404 SED13A0 SED1765, SED1766, SED17B0 SED2710 SPC7451, SPC7425* SPC7221, SPC7223* Information of Contract IC Assembly Business The Contract IC Assembly Business is also available. Please contact the following department. IC Business Planning & Sales Department Semiconductor Operations Division TEL(+81)48-286-7702 FAX(+81)48-286-7829 EPSON Products Information Seiko Epson also produces the following electronic devices. Category System products LCDs Crystal devices Products CARD-PC, GPS card, Interface module Passive-matrix LCD module D-TFD active-matrix LCD module TFT ultra-compact liquid crystal module Crystal unit, Crystal oscillator, Real time clock module Temperature sensor, SAW device 95 ENERGY SAVING EPSON Epson offers effective savings to its customers through a wide range of electronic devices, such as semiconductors, liquid crystal display (LCD) modules, and crystal devices. These savings are achieved through a sophisticated melding of three different efficiency technologies. Power saving technology provides low power conEnergy Saving sumption at low voltages. Space saving technology provides further reductions Power Saving in product size and weight through super-precise processing and high-density assembly technology. Space Saving Time saving technology shortens the time required for design and development Time Saving on the customer side and shortens delivery times. Our concept of Energy Saving technology conserves resources by blending the essence of these three efficiency technologies. The essence of these technologies is represented in each of the products that we provide to our customers. In the industrial sector, leading priorities include measures to counter the greenhouse effect by reducing CO 2, measures to preserve the global environment, and the development of energyefficient products. Environmental problems are of global concern, and Resource although the contribution of enerSaving gy-saving technology developed by Epson may appear insignificant, we seek to contribute to the development of energy-saving products by our customers through the utilization of our electronic devices. Epson is committed to the conservation of energy, both for the sake of people and of the planet on which we live. WORKING WITH ENVIRONMENTAL ISSUES In 1988, Epson led in working to abolish CFCs, and perfect abolition of those ozone layer-destroying substances was achieved in 1992. In 1998, the 10th year of start of the CFC-free activity, Epson set this year as the "Second Environmental Benchmark Year" and established a new corporate General Environmental Policy. Epson is tackling with environmental issues comprehensively. At the end of Fiscal 1988, Epson succeeded in abolishing chloric solvents doubted to be harmful to human body. In fiscal 1999, Epson started the activity with a goal of abolishing lead solder pointed out possibility of environmental pollutant. Co-existence Mark The environmental mark symbolizing Epson's basic stance of "Co-existence with Nature". The design incorporates a fish, flower, and water, representing mutually supportive co-existence. ISO 14001 008 ISO14000 is an international standard for environmental management that was established by the International Standards Organization in 1996 against the background of growing concern regarding global warming, destruction of the ozone layer, and global deforestation. WORKING FOR HIGH QUALITY ISO9000 is an international standard for a product quality system that prescribes demands to the manufacturers on a standpoint of customers. Epson quickly began working to acquire company-wide ISO certification. The Semiconductor Operations Division has acquired ISO9000 certification with its IC, IC card/module and their application products. ISO 9001 96 Accredited by the Dutch Council for Accreditation A RICH LINEUP OF LOW-VOLTAGE-OPERATION AND LOW-POWER-CONSUMPTION CMOS LSIs BASED UPON "ENERGY SAVING EPSON" Epson's CMOS LSIs feature "power saving", "space saving" and "time saving" characteristics according to "Energy Saving Epson", the electronic devices business concept. In power saving, we are seeking after low-voltageoperation and low-power-consumption technology for battery driven products. In space saving, we are cultivating high-integration technology and high-density assembly technology for portable equipments. In time saving, we are creating IP (Intellectual Property) and development environment to achieve shorter development time. As result of all these pursuits, we are leading the industry in many application fields. Incorporated into gate arrays, microcomputers, controllers, drivers and memories, these frontier technologies are offered to you as our CMOS LSI products featuring not only low-voltage-operation and low-power-consumption but also high performance and high quality. From a rich lineup of our products, you can select the product ideal for your application. Information on Changes to Product Codes The product codes in this document are scheduled for change as of 1 April, 2001. This catalog will therefore remain valid until the end of March, 2001. For purchasing products after this date, please request the latest version of this document with the new product codes from your nearest sales office. Epson's LSI lineup CMOS LSIs Gate arrays ASICs Embedded arrays Standard cells MCUs 4-bit microcomputers High-performance 4-bit microcomputers Peripheral 8-bit microcomputers 32-bit microcomputers LCD controllers ASSPs Fujimi Plant / Fujimi-machi, Suwa-gun, Nagano-ken LCD drivers Drivers Disk storage management ICs Power supply ICs Melody ICs Memories Static RAMs Sakata Plant & Tohoku Epson Corporation / Sakata-shi, Yamagata-ken Custom IC Assembly technology Epson's application-specific LSIs Application-Specific integrated circuits (ASICs) Epson Hatogaya Corp. / Hatogaya-shi, Saitama-ken Application-Specific standard Products (ASSPs) 97 SALES OFFICE FOR EPSON'S SEMICONDUCTOR OPERATIONS INTERNATIONAL SALES NETWORK Seiko Epson Corporation Korea Office (Seoul) Leverkusen London Epson (China) Co.,Ltd. (Beijing) Paris Epson Europe Electronics GmbH (Munich) Barcelona Epson Taiwan Technology & Trading Ltd. (Taipei) Shanghai Shenzhen HsinChu Epson Hong Kong Ltd. (Hong Kong) Pinang Epson Singapore Pte.,Ltd. (Singapore) Electronic Devices Marketing Division (Hino Office) / Hino-shi Tokyo Electronic Devices Marketing Division Regional Headquarters Branch Offices America Epson Electronics America, Inc. (Los Angels) Atlanta, Chicago San Jose, Boston Europe Epson Europe Electronics GmbH (Munich) Paris, Leverkusen London, Barcelona Epson (China) Co.,Ltd. (Beijing) Shanghai Epson Hong Kong Ltd. (Hong Kong) Shenzhen Epson Singapore Pte.,Ltd. (Shingapore) Pinang Epson Taiwan Technology & Trading Ltd. (Taipei) HsinChu ED International Marketing Department Asia Seiko Epson Corporation Korea Office (Seoul) 98 Chicago Boston San Jose Epson Electronics America, Inc. (Los Angels) Atlanta Epson Electronics America, Inc. / Los Angels Regional Headquarters Branch Offices Epson Europe Electronics GmbH / Munich Epson (China) Co.,Ltd. / Beijing Epson Hong Kong Ltd. / Hong Kong Epson Taiwan Technology & Trading Ltd. / Taipei Epson Singapore Pte.,Ltd. / Shingapore Seiko Epson Corporation Korea Office / Seoul 99 Trademark & Company Name Design Compiler, Design Power, Test Gen: Synopsys Inc. in U.S.A. Verilog-XL: Cadence Design Systems Inc. in U.S.A. Windows : Microsoft Corp. in U.S.A. Model Sim : Model Technology Inc. in U.S.A. Leonardo : Exemplar Logic Inc. U.S.A. I2C Bus : Philips Electronics Corp. SH3 : HITACHI Limited ARM7TDMI : ARM Limited in U.K. All other product names mentioned herein are trademarks and/or registered trademarks of their respective owners. 100 International Sales Operations AMERICA ASIA EPSON ELECTRONICS AMERICA, INC. EPSON (CHINA) CO.,LTD. HEADQUARTERS 150 River Oaks Parkway San Jose, CA 95134, U.S.A. Phone : +1-408-922-0200 Fax : +1-408-922-0238 http://www.eea.epson.com 28F, Beijing Silver Tower 2# North RD DongSanHuan ChaoYang District, Beijing, CHINA Phone : 64106655 Fax : 64107319 SALES OFFICES West 1960 East Grand Avenue El Segundo, CA 90245, U.S.A. Phone : +1-310-955-5300 Fax : +1-310-955-5400 Central 101 Virginia Street, Suite 290 Crystal Lake, IL 60014, U.S.A. Phone : +1-815-455-7630 Fax : +1-815-455-7633 Northeast 301 Edgewater Place, Suite 120 Wakefield, MA 01880, U.S.A. Phone : +1-781-246-3600 Fax : +1-781-246-5443 Southeast 3010 Royal Blvd. South, Suite 170 Alpharetta, GA 30005, U.S.A. Phone : +1-877-EEA-0020 Fax : +1-770-777-2637 EUROPE EPSON EUROPE ELECTRONICS GmbH HEADQUARTERS Riesstrasse 15 80992 Munich, GERMANY Phone : +49- (0) 89-14005-0 Fax : +49- (0) 89-14005-110 http://www.epson-electronics.de SALES OFFICE Altstadtstrasse 176 51379 Leverkusen, GERMANY Phone : +49- (0) 2171-5045-0 Fax : +49- (0) 2171-5045-10 UK BRANCH OFFICE Unit 2.4, Doncastle House, Doncastle Road Bracknell, Berkshire RG12 8PE, ENGLAND Phone : +44- (0) 1344-381700 Fax : +44- (0) 1344-381701 FRENCH BRANCH OFFICE 1 Avenue de l' Atlantique, LP 915 Les Conquerants Z.A. de Courtaboeuf 2, F-91976 Les Ulis Cedex, FRANCE Phone : +33- (0) 1-64862350 Fax : +33- (0) 1-64862355 BARCELONA BRANCH OFFICE Barcelona Design Center Edificio Prima Sant Cugat Avda. Alcalde Barrils num. 64-68 E-08190 Sant Cugat del Valles. SPAIN Phone : +34-93-544-2490 Fax : +34-93-544-2491 SHANGHAI BRANCH 4F, Bldg., 27, No. 69, Gui Jing Road Caohejing, Shanghai, CHINA Phone : 21-6485-5552 Fax : 21-6485-0775 EPSON ELECTRONIC TECHNOLOGY DEVELOPMENT (SHENZHEN) CO.,LTD. 16A/F, New Times Plaza, No.1 Taizi Road Shekou, Shenzhen, CHINA Phone : 755-6811118 Fax : 755-6677786 EPSON HONG KONG LTD. 20/F., Harbour Centre, 25 Harbour Road Wanchai, Hong Kong Phone : +852-2585-4600 Fax : +852-2827-4346 Telex : 65542 EPSCO HX http://www.epson.com.hk EPSON TAIWAN TECHNOLOGY & TRADING LTD. 10F, No. 287,Nanking East Road, Sec. 3 Taipei Phone : 02-2717-7360 Fax : 02-2712-9164 Telex : 24444 EPSONTB http://www.epson.com.tw HSINCHU OFFICE 13F-3, No.295, Kuang-Fu Road, Sec. 2 HsinChu 300 Phone : 03-573-9900 Fax : 03-573-9169 EPSON SINGAPORE PTE., LTD. No. 1 Temasek Avenue, #36-00 Millenia Tower, SINGAPORE 039192 Phone : +65-337-7911 Fax : +65-334-2716 http://www.epson.com.sg EPSON TRADING (MALAYSIA) SDN. BHD. ED PINANG OFFICE 8-1-04, Sunny Point Complex, Jalan Batu Uban 11700 Pulau Pinang, MALAYSIA Phone : +60-(0)4-6589243 Fax : +60-(0)4-6589249 SEIKO EPSON CORPORATION KOREA OFFICE 50F, KLI 63 Bldg., 60 Yoido-dong Youngdeungpo-Ku, Seoul, 150-763, KOREA Phone : 02-784-6027 Fax : 02-767-3677 SEIKO EPSON CORPORATION ELECTRONIC DEVICES MARKETING DIVISION Electronic Device Marketing Department IC Marketing & Engineering Group 421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN Phone: +81-(0)42-587-5816 Fax: +81-(0)42-587-5624 ED International Marketing Department Europe & U.S.A. 421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN Phone: +81-(0)42-587-5812 Fax: +81-(0)42-587-5564 ED International Marketing Department Asia 421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN Phone: +81-(0)42-587-5814 Fax: +81-(0)42-587-5110 http://www.epson.co.jp TF019-19 CMOS LSIs Product Catalog 2001/2002 Product Catalog Product Catalog ELECTRONIC DEVICES MARKETING DIVISION 2001/2002 Electronic devices information on WWW server This catalog was made with recycle paper, and printed using soy-based inks Revised March 2001 Printed in Japan H 2001/2002 http://www.epson.co.jp/device/