TF019-19
Product Catalog
Product Catalog
ELECTRONIC DEVICES MARKETING DIVISION
Electronic devices information on WWW server
Revised March 2001
Printed in Japan H
CMOS LSIs Product Catalog
2001/2002
2001/2002
2001/2002
http://www.epson.co.jp/device/
This catalog was made with recycle paper,
and printed using soy-based inks
2
The Information of the product number change 4
Comparison table between new and previous number 5
PACKAGE
Information 12
Configurations 14
Dimensions 18
1. ASICs Application Specific ICs 33
1----1 Gate Arrays 34
■High-speed, high-density lineup 34
S1L60000 series,S1L50000 series,S1L35000 series,S1L30000 series,S1L9000F series
1----2 Embedded Arrays 37
■Designing the embedded arrays 37
1----3 Standard Cells 38
■Standard Cells 38
S1K70000 series,S1K60000 series,S1K50000 series
■Ultra Low
Voltage Standard Cell 38
S1K2500 series
1----4 Development of Gate Arrays 39
2.
MCUs Application-oriented Microcomputer 41
2----1 4-bit Microcomputers 42
■4-bit single-
chip application-oriented microcomputers 42
S1C60 series ,S1C62100 series ,S1C6S200 series ,S1C62N30/6S300 series ,
S1C62400/6S400 series ,S1C62N50/S1C62900 series ,S1C62600 series ,
S1C62700 series ,S1C62N80 series,S1C62M00 series
2----2 High performance 4-bit microcomputers 46
■High performance 4-bit single-chip microcomputers 46
S1C63100 series, S1C63200 series, S1C63300 series, S1C63400 series,
S1C63500 series, S1C63600 series, S1C63A/B00 series
2----3 Peripheral 49
■FSK receiver 49
S1C05250 series
2----4 8-bit Microcomputers 50
■8-bit single-chip application-oriented microcomputers 50
S1C88100 series,S1C88300 series,S1C88400 series,S1C88800 series,
S1C88A00 series
2----5 32-bit Microcomputers 52
■32-bit RISC microcomputers 52
S1C33200 series,S1C33L00 series,S1C33T00 series,S1C33S00 series
S1C33 Special-purpose line-up
2----6 Microcomputer Development 54
■Program development process 54
■Development tools 58
3. ASSPs Application Specific Standard Products 59
3----1 LCD Controllers 60
■LCD controllers 60
S1D13305 series,S1D13503/13700 series,S1D13A00 series,S1D13500/13800 series
3----2 LCD Controller-drivers and Drivers 62
■LCD controller-drivers for small-sized displays 62
S1D12000 series
■LCD drivers with RAM for small- and medium-sized displays 63
S1D15000 series
■MLS drivers for medium sized displays 66
MLS Driver
■LCD drivers for large-sized displays 67
S1D16000 series,S1D17000 series
■LCD drivers for grayscale displays 68
S1D18000 series,S1D17900 series ,S1D19000 series
3
2001/2002
SEIKO EPSON
CMOS LSI
PACKAGE
ASICs
MCUs
ASSPs
Memories
Custom IC
Contents
Sub-system
Assembly
Technology
3----3 Other Drivers 69
■Thermal-head drivers 69
S1D50000 series
■LED Printer-head drivers 69
S1D41000 series
3----4 Interface ICs 70
■IEEE1394 controller 70
S1R72000 series
■USB2.0 device controller 70
S1R72000 series
■SCSl controller 70
S1R72100 series
3----5 Power Supply ICs 71
■Power supply ICs for logic 71
S1F70000 series
■Power supply ICs for liquid crystal 71
S1F75000 series
■DC to DC converters 71
S1F76600 series
■DC to DC converters and voltage regulators 71
S1F76600 series,S1F76500 series
■Switching regulators 71
S1F76300 series
■High precision voltage regulators 72
S1F78100 series, S1F79100 series
■High pecision voltage detectors 73
S1F77200 series
3----6 Melody ICs 74
■Melody ICs 74
S1V75600 series,S1V71000 series
■Music generators 74
S1V75700 series
■Standard melodies 75
3----7 Melody ICs-Music Generator Development 76
■Melody ICs development 76
■Music generator ICs development 76
4. Memories 79
4----1 Static RAMs 80
5. Custom IC 81
5----1 Development of Custom IC 82
6. Sub-system Assembly Technology 85
6―1ApplicationProductsofSub-systemAssemblyTechnology 86
Example of Applied Products, Sub-system Assembly Technologies
6―2DevelopmentofApplicationProducts 88
LSI Device Precautions 91
Sales Information 95
ENERGY SAVING EPSON/WORNING WITH ENVIRONMENTAL ISSUES/WORKING FOR HIGH QUALITY 96
SALES OFFICE FOR EPSON’S SEMICONDUCTOR OPERATIONS 98
NOTICE
No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to
this material without notice. Seiko Epson does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product
or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual
property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright
infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic products under the control of the Foreign Exchange and Foreign
Trade Law of Japan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency.
Seiko Epson Corporation 2001, All rights reserved.
4
Configurations
The information of the product number change
The information of the product number change
Starting April 1, 2001 the product number will be changed as listed below. To order from April 1, 2001 please use the
new product number. For further information, please contact Epson sales representative.
How to describe the Product number on this document
Product number are basically described with previous number, such as Product Number (Previous nimber).
Configuratoin of product number
S5U1 C 88348 D1 1 00
Packing specification
Version
Tool type
Corresponding model number
Tool classification
Product classification (S5U1:
Development tool for semiconductor)
•Devices
•Development tools
B Assembled on board, COB, BGA
C Plastic DIP
D Bare Chip
F Plastic QFP
H Ceramic DIP
L Caramic QFP
M Plastic SOP
*2: Shape
R TAB-QFP
S Plastic Shrink DIP
T Tape Carrier (TAB)
Y SOT89 (3 terminals)
2 TSOP (Standard Bent)
3 TSOP (Reverse Bent)
*1: Medel name
M RAM
R Peripheral
V Melody, Voice
X Embedded Array
C Microcomputer
D Driver, Digital Products
F Power Supply
K Standard Cell
L Gate Array
Packing specification
Specifications
Shape (*2)
Model number
Model name (*1)
Product classification (S1: Semiconductor)
S1 D 15605 T 00A0 00
5
ASICs
Comparison table between new and previous number
ASICs
●S1L60000 series
Previous number New number
SLA6009 S1L60093
SLA600Q S1L60094
SLA6017 S1L60173
SLA601Q S1L60174
SLA6028 S1L60283
SLA602Q S1L60284
SLA6040 S1L60403
SLA604Q S1L60404
SLA6059 S1L60593
SLA605Q S1L60594
SLA6083 S1L60833
SLA608Q S1L60834
SLA6123 S1L61233
SLA612Q S1L61234
SLA6158 S1L61583
SLA615Q S1L61584
SLA6190 S1L61903
SLA619Q S1L61904
SLA6251 S1L62513
SLA625Q S1L62514
●S1L50000 series
Previous number New number
SLA5028H S1L50282
SLA502TH S1L50283
SLA502QH S1L50284
SLA5075H S1L50752
SLA507TH S1L50753
SLA507QH S1L50754
SLA5099H S1L50992
SLA509TH S1L50993
SLA509QH S1L50994
SLA5125H S1L51252
SLA512TH S1L51253
SLA512QH S1L51254
SLA5177H S1L51772
SLA517TH S1L51773
SLA517QH S1L51774
SLA5250H S1L52502
SLA525TH S1L52503
SLA525QH S1L52504
SLA5335H S1L53352
SLA533TH S1L53353
SLA533QH S1L53354
SLA5442H S1L54422
SLA544TH S1L54423
SLA544QH S1L54424
SLA5506H S1L55062
SLA550TH S1L55063
SLA550QH S1L55064
SLA5668H S1L56682
SLA566TH S1L56683
SLA566QH S1L56684
SLA5815H S1L58152
SLA581TH S1L58153
SLA581QH S1L58154
●S1L35000 series
Previous number New number
SLA3504 S1L35043
SLA3506 S1L35063
SLA3509 S1L35093
SLA3516 S1L35163
●S1L30000 series
Previous number New number
SLA3018 S1L30182
SLA301T S1L30183
SLA3030 S1L30302
SLA303T S1L30303
SLA3042 S1L30422
SLA304T S1L30423
SLA3055 S1L30552
SLA305T S1L30553
SLA3075 S1L30752
SLA307T S1L30753
SLA3109 S1L31092
SLA310T S1L31093
SLA3125 S1L31252
SLA312T S1L31253
SLA3216 S1L32162
SLA321T S1L32163
●S1L90000F series
Previous number New number
SLA902F S1L902F2
SLA904F S1L904F2
SLA907F S1L907F2
SLA909F S1L909F2
SLA913F S1L913F2
SLA919F S1L919F2
SLA927F S1L927F2
SLA944F S1L944F2
●Designing t he embedded arrays
Previous series New series
SSL60000 seri es S1X60000 series
SSL50000 seri es S1X50000 series
SSL35000 seri es S1X35000 series
●Standard cel l s
Previous series New series
SCB70000 seri es S1K70000 seri es
SCB60000 seri es S1K60000 seri es
SCB50000 seri es S1K50000 seri es
●Ultra low voltage s tandard cell
Previous series New series
SSC2500 seri es S1K2500 seri es
●Supporting li brari es for AS IC design t ool s
Previous number New number
SLA60000 S1L60000
SLA50000H S1L50000
SLA35000 S1L35000
SLA30000 S1L30000
SLA9000F S1L9000F
6
MCUs
●S1C60 series
Previous number New number
E0C6001 S1C60N01
E0C60L01 S1C60L01
E0C6002 S1C60N02
E0C60L02 S1C60L02
E0C6003 S1C60N03
E0C60L03 S1C60L03
E0C6004 S1C60N04
E0C6005 S1C60N05
E0C60L05 S1C60L05
E0C6006 S1C60N06
E0C6007 S1C60N07
E0C6008 S1C60N08
E0C60L08 S1C60L08
E0C60A08 S1C60A08
E0C6009 S1C60N09
E0C60L09 S1C60L09
E0C6011 S1C60110
●S1C62100 series
Previous number New number
E0C621A S1C621A0
E0C621C S1C621C0
●S1C6S200 seri es
Previous number New number
E0C6S27 S1C6S2N7
E0C6SL27 S1C6S2L7
E0C6SB27 S1C6S2B7
E0C6SA27 S1C6S2A7
●S1C62N30/6S300 series
Previous number New number
E0C6S37 S1C6S3N7
E0C6SL37 S1C6S3L7
E0C6SB37 S1C6S3B7
E0C6S32 S1C6S3N2
E0C6SL32 S1C6S3L2
E0C6SB32 S1C6S3B2
E0C6SA32 S1C6S3A2
E0C6233 S1C62N33
E0C62L33 S1C62L33
E0C62A33 E0C62A33
E0C623B S1C6N3B0
E0C62A3B S1C6A3B0
●S1C62400/6S400 series
Previous number New number
E0C6244 S1C62440
E0C624A S1C624A0
E0C6S46 S1C6S460
E0C6248 S1C62480
E0C6S48 S1C6S480
E0C624C S1C624C0
●S1C62N50/62500 series/
S1C62900 s eries
Previous number New number
E0C6251 S1C62N51
E0C62L51 S1C62L51
E0C6256 S1C62560
E0C6292 S1C62920
●S1C62600 series
Previous number New number
E0C6266 S1C62660
●S1C62700 series
Previous number New number
E0C6274 S1C62740
●S1C62N80 series
Previous number New number
E0C6281 S1C62N81
E0C62L81 S1C62L81
E0C6282 S1C62N82
E0C62L82 S1C62L82
E0C62A82 S1C62A82
●S1C62M00 series
Previous number New number
E0C62M2 S1C62M20
●S1C63100 series
Previous number New number
E0C63158 S1C63158
●S1C63200 series
Previous number New number
E0C63256 S1C63256
●S1C63300 series
Previous number New number
E0C63358 S1C63358
E0C63P366 S1C6P366
●S1C63400 series
Previous number New number
E0C63454 S1C63454
E0C63455 S1C63455
E0C63458 S1C63458
E0C63466 S1C63466
E0C63P466 S1C6P466
●S1C63500 series
Previous number New number
E0C63557 S1C63557
E0C63558 S1C63558
E0C63567 S1C63567
●S1C63A/B 00 series
Previous number New number
E0C63A08 S1C63A08
E0C63B07 S1C63B07
E0C63B08 S1C63B08
●FSK receiver
Previous number New number
E0C5250 S1C05250
E0C5251 S1C05251
●S1C88100 series
Previous number New number
E0C88104 S1C88104
E0C88112 S1C88112
●S1C88300 series
Previous number New number
E0C88308 S1C88308
E0C88316 S1C88316
E0C88317 S1C88317
E0C88348 S1C88348
E0C88365 S1C88365
E0C88F360 S1C8F360
●S1C88400 series
Previous number New number
E0C88408 S1C88408
E0C88409 S1C88409
●S1C88800 series
Previous number New number
E0C88832 S1C88832
E0C88862 S1C88862
E0C88816 S1C88816
●S1C88A00 seri es
Previous number New number
E0C88A32 S1C88A32
●S1C33200 series
Previous number New number
E0C33209 S1C33209
E0C33264 S1C33222
E0C332129 S1C33221
E0C332F128 S1C33240
●S1C33L00 series
Previous number New number
E0C332L01 S1C33L01
E0C332L02 S1C33L02
●S1C33T00 series
Previous number New number
E0C332T01 S1C33T01
Comparison table between new and previous number
7
MCUs
MCUs
●S1C33S00 seri es
Previous number New number
E0C332S08 S1C33S01
●S1C33 spec i al -purpose line-up
Previous number New number
E0C33210 S1C33210
●S1C62 Family/S1C60 family development tools
Hardware
Previous number New number
ICE62R S5U1C62000H2
EVA62∗∗ S5U1C62∗∗∗E
KIT60∗∗ S5U1C60∗∗∗K
●Software pack age
Previous number New number
ASM62 S5U1C62000A
●S1C63 Fami l y devel opment t ool s
Hardware
Previous number New number
ICE63 S5U1C63000H1
PRC63∗∗∗ S5U1C63∗∗∗P
●Software pack age
Previous number New number
ASM63 S5U1C63000A
●S1C33 Fami l y devel opment t ool s
Hardware
Previous number New number
ICD33 S5U1C33000H
EPOD33∗∗∗ S5U1C33∗∗∗E
DMT33∗∗∗ S5U1C33∗∗∗D
MEM33∗∗∗ S5U1C33∗∗∗M
●Software pack age
Previous number New number
CC33 S5U1C33000C
●Middleware package
Previous number New number
VOX33 S5U1C330V1S
JPEG33 S5U1C330J1S
ROS33 S5U1C330R1S
MON33 S5U1C330M2S
MELODY33 S5U1C330M1S
VRE33 S5U1C330V2S
SOUND33 S5U1C330S1S
TS33 S5U1C330T1S
CF33 S5U1C330C1S
GRAPHIC33 S5U1C330G1S
●S1C88 Fami l y devel opment t ool s
Hardware
Previous number New number
ICE88UR S5U1C88000H5
PRC88∗∗∗ S5U1C88∗∗∗P
DMT88348-DB S5U1C88348T
●Software
Previous number New number
S5U1C88000C1
●Flash writing tool
Hardware
Previous number New number
URM00002 S5U1C88000W1
ADP88*** S5U1C88∗∗∗X1
ADP63*** S5U1C63∗∗∗X1
ADS00002 S5U1C88000X1
GWH00002 S5U1C88000W2
8
ASSPs
●S1D13305 series
Previous number New number
SED1335F0A S1D13305F00A
SED1335F0B S1D13305F00B
●S1D13503/13700 seri es
Previous number New number
SED1353D0A S1D13503D00A
SED1353F0A S1D13503F00A
SED1353F1A S1D13503F01A
SED1374F0A S1D13704F00A
SED1375F0A S1D13705F00A
SED1376F0A S1D13706F00A
SED1376B0A S1D13706B00A
SED1376D0A* S1D13706D00A*
SED1378F0A* S1D13708F00A*
SED1378B0B* S1D13708B00B*
SED1378D0A* S1D13708D00A*
●S1D13A00 seri es
Previous number New number
SED13A3F0A* S1D13A03F00A*
SED13A3B0B* S1D13A03B00B*
SED13A4B0B* S1D13A04B00B*
SED13A5B0B* S1D13A05B00B*
●S1D13500/13800 seri es
Previous number New number
SED1354F0A S1D13504F00A
SED1354F1A S1D13504F01A
SED1354F2A S1D13504F02A
SED1355F0A S1D13505F00A
SED1356F0A S1D13506F00A
SED1386F0A S1D13806F00A
●S1D12000 series lineup
Previous number New number
SED1220D S1D12200D
SED1220T S1D12200T
SED1221D S1D12201D
SED1221T S1D12201T
SED122AD* S1D12210D
SED1222D S1D12202D
SED1225D S1D12205D
SED1225T S1D12205T
SED1230D S1D12300D
SED1230T S1D12300T
SED1231D S1D12301D
SED1231T S1D12301T
SED1232D S1D12302D
SED1232T S1D12302T
SED1233D S1D12303D
SED1233T S1D12303T
SED1234D S1D12304D
SED1235D S1D12305D
SED1240D S1D12400D
SED1240T S1D12400T
●S1D15000 series lineup
Previous number New number
SED1510D0C S1D15100D00C∗
SED1510F0C S1D15100F00C∗
SED1526D*A S1D15206D∗∗A∗
SED1526D*B S1D15206D∗∗B∗
SED1526F*A S1D15206F∗∗A∗
SED1526T*A S1D15206T∗∗A∗
SED1528D*A S1D15208D∗∗A∗
SED1528D*B S1D15208D∗∗B∗
SED1528F*A S1D15208F∗∗A∗
SED1528T*A S1D15208T∗∗A∗
SED1530D0A S1D15300D00A∗
SED1530DAA S1D15300D10A∗
SED1530D0B S1D15300D00B∗
SED1530DAB S1D15300D10B∗
SED1530TAA S1D15300T10A∗
SED1531D0A S1D15301D00A∗
SED1531D0B S1D15301D00B∗
SED1531T0A S1D15301T00A∗
SED1532D0A S1D15302D00A∗
SED1532DBA S1D15302D11A∗
SED1532D0B S1D15302D00B∗
SED1532DBB S1D15302D11B∗
SED1532T0A S1D15302T00A∗
SED1532TBA S1D15302T11A∗
SED1533DFB S1D15303D15B∗
SED1540D0A S1D15400D00A∗
SED1540D0B S1D15400D00B∗
SED1540F0A S1D15400F00A∗
SED1560D0A S1D15600D00A∗
SED1560DAA S1D15600D10A∗
SED1560D0B S1D15600D00B∗
SED1560DAB S1D15600D10B∗
SED1560T0B S1D15600T00B∗
SED1560TQA S1D15600T26A∗
SED1561D0A S1D15601D00A∗
SED1561D0B S1D15601D00B∗
SED1561DAB S1D15601D10B∗
SED1561T0B S1D15601T00B∗
SED1561TAB S1D15601T10B∗
SED1561TQA S1D15601T26A∗
SED1562D0A S1D15602D00A∗
SED1562D0B S1D15602D00B∗
SED1562T0B S1D15602T00B∗
SED1562TQA S1D15602T26A∗
SED1065D0B S1D10605D00B∗
SED1065T0A S1D10605T00A∗
SED1066D0A S1D10606D00A∗
SED1067D0B S1D10607D00B
SED1068D0B S1D10608D00B∗
SED1069D0B S1D10609D00B∗
SED1565DBB S1D15605D11B∗
SED1565D0B S1D15605D00B∗
SED1565D1B S1D15605D01B∗
SED1565D2B S1D15605D02B∗
SED1565T0A S1D15605T00A∗
SED1565T0B S1D15605T00B∗
SED1565T0C S1D15605T00C∗
SED1566DBB S1D15606D11B∗
SED1566D0B S1D15606D00B∗
SED1566D1B S1D15606D01B∗
SED1566D2B S1D15606D02B∗
SED1566T0A S1D15606T00A∗
SED1567DBB S1D15607D11B∗
SED1567D0B S1D15607D00B∗
SED1567D1B S1D15607D01B∗
SED1567D2B S1D15607D02B∗
SED1567T0B S1D15607T00B∗
Previous number New number
SED1567T0C S1D15607T00C∗
SED1568DBB S1D15608D11B∗
SED1568D0B S1D15608D00B∗
SED1569DBB S1D15609D11B∗
SED1569D0B S1D15609D00B∗
SED1569T*** S1D15609T∗∗∗∗
SED15A6D0B S1D15A06D00B*
SED15B1D0B S1D15B01D00B∗
SED15B1T0A S1D15B01T00A∗
SED15E0D0B S1D15E00D00B∗
SED15E0T0A S1D15E00T00A∗
SED1575D0B S1D15705D00B∗
SED1575D3B S1D15705D03B∗
SED1575T0A S1D15705T00A∗
SED1575T3A S1D15705T03A∗
SED1577D0B S1D15707D00B∗
SED1577D3B S1D15707D03B∗
SED1577T0A S1D15707T00A∗
SED1577T3A S1D15707T03A∗
SED157AD0B S1D15710D00B∗
SED157AT0A* S1D15710T00A∗
●MLS drivers for medium sized displays
MLS driver lineup
Previous number New number
SED1580D0B S1D15800D00B∗
SED1580T0A S1D15800T00A∗
SED1590D0B S1D15900D00B∗
SED1590T0A S1D15900T00A∗
SED1594D0B* S1D15904D00B∗
SED1594T0A* S1D15904T00A∗
SED1751D0B S1D17501D00B∗
SED1751T0A S1D17501T00A∗
SED1750D0B S1D17500D00B∗
SED1750T0A S1D17500T00A∗
SED17C0D0B S1D17C00D00B∗
SED17C0T0A S1D17C00T00A∗
●S1D16000 series lineup
Segment drivers
Previous number New number
SED1606D0A S1D16006D00A∗
SED1606D0B S1D16006D00B∗
SED1606F0A S1D16006F00A∗
SED1606D1A S1D16006D01A∗
SED1606D1B S1D16006D01B∗
SED1640D0B S1D16400D00B∗
●Common drivers
Previous number New number
SED1651D0A S1D16501D00A∗
SED1670D0A S1D16700D00A∗
SED1670D1A S1D16700D01A∗
SED1670D0B S1D16700D00B∗
SED1670D1B S1D16700D01B∗
SED1672D0A S1D16702D00A∗
SED1672D1A S1D16702D01A∗
SED1672D0B S1D16702D00B∗
SED1672D1B S1D16702D01B∗
SED1672F0A S1D16702F00A∗
Comparison table between new and previous number
9
ASSPs
ASSPs
●S1D17000 series lineup
Segment drivers
Previous number New number
SED1758D0B S1D17508D00B∗
SED1758T0A S1D17508T00A∗
SED1758T0B S1D17508T00B∗
SED1758T0G S1D17508T00G∗
SED1752T0A S1D17502T00A∗
SED1752T0B S1D17502T00B∗
SED17A2T0A S1D17A02T00A∗
SED17A2T0B S1D17A02T00B∗
SED17A2T0E S1D17A02T00E∗
●Common drivers
Previous number New number
SED1743D1B S1D17403D01B∗
SED1753D0B S1D17503D00B∗
SED1753T0A S1D17503T00A∗
●S1D18000 series lineup
Previous number New number
SED1800D0B S1D18000D00B∗
SED1801D0B S1D18001D00B∗
SED18A1D0B S1D18A01D00B∗
●TFT LCDdrivers
S1D17900 series lineup
(Gate drivers)
Previous number New number
SED1790T0A S1D17900T00A∗
SED1793T0B S1D17903T00B∗
SED1794T0A S1D17904T00A∗
SED1796D0B S1D17906D00B∗
SED1797D0B S1D17907D00B∗
SED1799T0A S1D17909T00A∗
●S1D19000 series lineup
Previous number New number
SED1906T0A S1D19006T00A∗
●Thermal-head drivers
Previous number New number
SED5035D0A S1D50350D0A0
SED5036D0A S1D50360D0A0
SED5036F0A S1D50360F0A0
SED5068D0A S1D50680D0A0
SED5300D0A S1D53000D0A0
SED5301D0A S1D53010D0A0
SED5310D0A S1D53100D0A0
SED5316D5A S1D53160D5A0
SED5316D6A S1D53160D6A0
SED5615D0A S1D56150D0A0
SED5620D0A S1D56200D0A0
SED5624D0A S1D56240D0A0
SED5625D0A S1D56250D0A0
SED5626D0A S1D56260D0A0
SED5628D0A S1D56280D0A0
SED5668D0A S1D56680D0A0
SED5680D0A S1D56800D0A0
SED5682D0A S1D56820D0A0
SED5684D0A S1D56840D0A0
SED5685D0A S1D56850D0A0
SED5686D0A S1D56860D0A0
SED5688D1A S1D56880D1A0
●LED printer-head dri vers
Previous number New number
SED4100 S1D41000
SED4101 S1D41010
SED4180 S1D41800
●IEEE 1394 controller
Previous number New number
SPC7281F0A S1R72801F00A
SPC7283F0A S1R72803F00A∗
SPC7290F0A S1R72900F00A∗
SPC7291F0A S1R72901F00A∗
●USB2.0 devi ce cont rol l er
Previous number New number
SPC7202F0A S1R72002F00A∗
●SCSI controller
Previous number New number
SPC7213F0A S1R72103F00A
SPC7214F0B S1R72104F00B
SPC7215F0A S1R72105F00A
SPC7216F0A S1R72106F00A∗
●Power supply ICs for logic
Previous number New number
SCI7852* S1F785200∗
SCI7665* S1F76650*
SCI7110M0A S1F71100M0A0
SCI7120M0A S1F71200M0A0
SCI7120M0B S1F71200M0B0
●Power supply ICs for liqui d cryst al
Previous number New number
SCI7551* S1F75510*
SCI7530M0A* S1F75300M0A0∗
●DC to DC convert e rs
Previous number New number
SCI7660D0B S1F76600D0B0
SCI7660C0B S1F76600C0B0
SCI7660M0B S1F76600M0B0
SCI7662M0A S1F76620M0A0
SCI7662D0A S1F76620D0A0
●DC to DC convert ers and voltage
regulators
Previous number New number
SCI7661D0B S1F76610D0B0
SCI7661C0B S1F76610C0B0
SCI7661M0B S1F76610M0B0
SCI7661MBB S1F76610M2B0
SCI7654C0A S1F76540C0A0
SCI7654M0A S1F76540M0A0
SCI7664M0A S1F76640M0A0
SCI7664D0A S1F76640D0A0
●Switching regulators
Previous number New number
SCI7631MLA S1F76310M1L0
SCI7631MBA S1F76310M1B0
SCI7631MKA S1F76310M1K0
SCI7631MAA S1F76310M1A0
SCI7633MBA S1F76330M1B0
SCI7638MHA S1F76380M1H0
SCI7638MLA S1F76380M1L0
●High precis i on vol tage regulators
Previous number New number
SCI7810YHB S1F78100Y2H0
SCI7810YGB S1F78100Y2G0
SCI7810YFB S1F78100Y2F0
SCI7810YLB S1F78100Y2L0
SCI7810YRB S1F78100Y2R0
SCI7810YDB S1F78100Y2D0
SCI7810YCB S1F78100Y2C0
SCI7810YTB S1F78100Y2T0
SCI7810YNB S1F78100Y2N0
SCI7810YKB S1F78100Y2K0
SCI7810YPB S1F78100Y2P0
SCI7810YMB S1F78100Y2M0
SCI7810YBB S1F78100Y2B0
SCI7810YAB S1F78100Y2A0
SCI7910YHA S1F79100Y1H0
SCI7910YGA S1F79100Y1G0
SCI7910YDA S1F79100Y1D0
SCI7910YPA S1F79100Y1P0
SCI7910YBA S1F79100Y1B0
●High precis i on vol tage detectors
Previous number New number
SCI7720YVA S1F77200Y1V0
SCI7720YAA S1F77200Y1A0
SCI7720YYA S1F77200Y1Y0
SCI7720YBA S1F77200Y1B0
SCI7720YNA S1F77200Y1N0
SCI7720YCA S1F77200Y1C0
SCI7720YFA S1F77200Y1F0
SCI7720YTA S1F77200Y1T0
SCI7721YCA S1F77210Y1C0
SCI7721YCB# S1F77210Y2C0
SCI7721YPA S1F77210Y1P0
SCI7721YSA S1F77210Y1S0
SCI7721YEA S1F77210Y1E0
SCI7721YFA S1F77210Y1F0
SCI7721YFB# S1F77210Y2F0
SCI7721YRA S1F77210Y1R0
SCI7721YGA S1F77210Y1G0
SCI7721YHA S1F77210Y1H0
SCI7721Y3A S1F77210Y130
SCI7721YTA S1F77210Y1T0
SCI7721YMA S1F77210Y1M0
SCI7721YJA S1F77210Y1J0
SCI7721Y2A S1F77210Y120
SCI7721YKA S1F77210Y1K0
SCI7721YLA S1F77210Y1L0
10
ASSPs
●Melody ICs
Previous number New number
SVM7560M0A S1V75600M00A
SVM7560M0B/C0B S1V75600M00B/
C00B
SVM7560D0K S1V75600D00K
SVM7560M0M/C0M/
D0M S1V75600M00M/
C00M/D00M
SVM7560M0V S1V75600M00V
SVM7561M0B/C0B/
D0B S1V75601M00B/
C00B/D00B
SVM7561M0C/C0C/
D0C S1V75601M00C/
C00C/D00C
SVM7100M0J S1V71000M00J
●Music generators
Previous number New number
SVM7570M5P S1V75700M05P
SVM7570M6F S1V75700M06F
SVM7571C5N S1V75701C05N
SVM7571C6G S1V75701C06G
SVM7571C6H S1V75701C06H
SVM7571C6J S1V75701C06J
SVM7571C6K S1V75701C06K
SVM7571C6N S1V75701C06N
SVM7571C6P S1V75701C06P
●Standard melodies
Previous number New number
7571C5N (5.0V spec.) S1V75701C05N
7571C6G (5.0V spec.) S1V75701C06G
7571C6H (5.0V spec.) S1V75701C06H
7570M5P/
(5.0V spec.) S1V75700M05P/S1V
75701C06J
7571C6K (5.0V spec.) S1V75701C06K
7571C6N (5.0V spec.) S1V75701C06N
7571C6P (5.0V spec.) S1V75701C06P
7570M6F (5.0V spec.) S 1V 75700M06F
7560M0A S1V75600M00A
7560M0B/C0B S1V75600M00B/
C00B
7560D0K S1V75600D00K
7560M0M/C0M/D0M S1V75600M00M/
C00M/D00M
7560M0V S1V75600M00V
7561M0B/C0B/D0B S1V75601M00B/
C00B/D00B
7561M0C/C0C/D0C S1V75601M00C/
C00C/D00C
Comparison table between new and previous number
11
ASSPs, MEMORIES
MEMORIES
●Static RAMs
Previous number New number
SRM2AW216LLBT1 S1M0W026B0J1
SRM2AW216LLBT7 S1M0W026B0J7
SRM2AV213LLBT8 S1M0V023B0J8
SRM2AW416LLBT1 S1M0W046B0J1
SRM2AW416LLBT7 S1M0W046B0J7
SRM2AV413LLBT8 S1M0V043B0J8
SRM2AV400LLBT8 S1M0V040B0J8*
SRM2BW413LLBT7 S1M1W043B0J7*
SRM2AV613LLBT8 S1M0V063B0J8*
SRM2BV813LLBT7 S1M1V083B0J7
12
Configurations
PACKAGE
48 QFP12
7X7X1.4
STD
TQFP12
7X7X1.0
STD
64 QFP13
10 X10 X1.4
STD
TQFP13
10.2 X10.2 X1.0
STD
QFP15
14 X14 X1.4
STD
80 QFP5
14 X20 X2.7
S2
QFP14
12 X12 X1.4
STD
TQFP14
12 X12 X1.0
STD
100 QFP5
14 X20 X2.7
S2
TQFP14
12 X12 X1.0
STD
QFP15
14 X14 X1.4
STD
TQFP15
14 X14 X1.0
STD
128 QFP5
14 X20 X2.7
S2
QFP8
28 X28 X3.35
E1
QFP15
14 X14 X1.4
STD
TQFP15
14 X14 X1.0
STD
QFP26
14 X20 X1.4
STD
144 QFP20
20 X20 X1.4
STD
TQFP24
16 X16 X1.0
STD
160 QFP8
28 X28 X3.35
E1
176 QFP21
24 X24 X1.4
STD
184 QFP20
20 X20 X1.4
STD
QFP23
32 X32 X3.4
STD
208 QFP8
28 X28 X3.35
S1
QFP22
28 X28 X1.4
STD
216 QFP21
24 X24 X1.4
STD
240 QFP23
32 X32 X3.4
S1
256 QFP8
28 X28 X3.35
S3
QFP22
28 X28 X1.4
STD
304 QFP10
40 X40 X3.8
S1
225 PBGA225 27
X
27 1.5
256 PBGA256 27
X
27 1.27
352 PBGA352 35
X
35 1.27
388 PBGA388 35
X
35 1.27
104 CFLGA104 8
X
8 0.65
104 CFLGA104 9
X
9 0.8
152 CFLGA152 11
X
11 0.8
239 CFLGA239 13
X
13 0.8
307 CFLGA307 15
X
15 0.8
424 CFLGA424 17
X
17 0.8
48 PFBGA48 7
X
7 0.8
81 PFBGA81 8
X
8 0.8
121 PFBGA121 10
X
10 0.8
180 PFBGA180 12
X
12 0.8
220 PFBGA220 14
X
14 0.8
352 T-BGA352 35
X
35 1.27
420 T-BGA420 35
X
35 1.27
480 T-BGA480 35
X
35 1.27
8 DIP 9.7
X
6.4
18 DIP 23.2
X
6.3
24 DIP 32
X
13.6
28 DIP 37.4
X
13.4
32 DIP 42.5
X
13.4
Lead
type
Body size
(mm)
Package
code
Pin
count Ball pitch
(mm)
Body size
(mm)
Package
code
Pin
count
Ball pitch
(mm)
Body size
(mm)
Package
code
Pin
count
Lead
type
Body size
(mm)
Package
code
Pin
count
Body size
(mm)
Package
code
Pin
count
Ball pitch
(mm)
Body size
(mm)
Package
code
Pin
count
Land pitch
(mm)
Body size
(mm)
Package
code
Pin
count
Plastic QFP & Plastic TQFP
Plastic BGA
Ceramic Fine Pitch LGA
Plastic Fine Pitch BGA
Tape BGA
Plastic DIP
HQFP
48 HQFP12 7
X
7
X
1.4 STD
H3QFP12 7
X
7
X
1.4 STD
64 HQFP13 10
X
10
X
1.4 STD
H3QFP13 10
X
10
X
1.4 STD
H4TQFP13 10
X
10
X
1.4 STD
80 H3QFP14 12
X
12
X
1.4 STD
100 H2QFP5 14
X
20
X
2.7 S2
H3QFP5 14
X
20
X
2.7 S2
HQFP15 14
X
14
X
1.4 STD
H2QFP15 14
X
14
X
1.4 STD
H3QFP15 14
X
14
X
1.4 STD
H4TQFP15 14
X
14
X
1.4 STD
128 HQFP5 14
X
20
X
2.7 S2
H3QFP5 14
X
20
X
2.7 S2
HQFP8 28
X
28
X
3.35 E1
H3QFP15 14
X
14
X
1.4 STD
144 HQFP8 28
X
28
X
3.35 E1
160 HQFP8 28
X
28
X
3.35 E1
208 HQFP8 28
X
28
X
3.35 S1
H2QFP8 28
X
28
X
3.35 S1
240 HQFP23 32
X
32
X
3.4 S1
H2QFP23 32
X
32
X
3.4 S1
256 H2QFP8 28
X
28
X
3.35 S3
Information
13
PACKAGE
Configurations
PACKAGE
Lead type
Ordering:
When placing device orders, always specify the package code (EPSON code), package material, pin count and lead type. For example,
Note:
If thers is more than one assembly manufacture for a device, the package dimensions may differ for each manufacture.
Detailed descriptions of each device, including package dimensions, are available on request.
Inch dimensions are given for reference only. When designing patterns, use the metric dimensions.
Material
Plastic
Package code
QFP5
Pin count
100pin
Lead type
S2
Standard type
Short lead type1
Short lead type2
Short lead type3
Equivalent lead type1
STD
S1
S2
S3
E1
Standard Seiko Epson Product
Short lead version of
Seiko Epson standard product
Type with identical lead length, but different
standoff height from Seiko Epson standard product
8 SOP3A 5.2
X
4.4 STD
16 SOP3A 10.2
X
4.4 STD
28 SOP2 18.1
X
8.4 STD
Plastic SOP
16 SSOP2 7
X
4.4 STD
20 SSOP1 6.5
X
4.4 STD
Plastic SSOP
28 TSOP( I ) 11.8
X
8 STD
44 TSOP( I I ) 18.81
X
10.16 STD
Plastic TSOP
3 SOT89 4.5
X
2.5
5 SOT89 4.5
X
2.5
SOT89
Lead
type
Body size
(mm)
Package
code
Pin
count
Lead
type
Body size
(mm)
Package
code
Pin
count
Lead
type
Body size
(mm)
Package
code
Pin
count
Body size
(mm)
Package
code
Pin
count
14
Configurations
PACKAGE
Plastic DIP
24 pin32 pin
28 pin 18 pin 8 pin
SOP2-28 pin SOP3A-16 pin SOP3A-8 pin
28 pin SSOP1-20 pin
QFP10-304 pin QFP22-256 pin QFP8-256 pin
Plastic QFP
Plastic SOP
Plastic TSOP Plastic SSOP
SSOP2-16 pin
15
PACKAGE
Configurations
PACKAGE
Plastic QFP
QFP23-240 pin
QFP22-208 pin
QFP21-176 pin
QFP8-208 pin
QFP23-184 pin
QFP20-184 pin
QFP8-160 pin
QFP20-144 pin
QFP15-128 pin
QFP5-100 pin
QFP14-80pin
QFP5-128 pin
QFP5-80 pin
QFP8-128 pin
QFP15-100 pin
16
Configurations
PACKAGE
Plastic QFP
QFP15-64 pin QFP13-64 pin QFP12-48 pin
Plastic TQFP
TQFP15-128 pin TQFP15-100 pin
Plastic HQFP
H2QFP23-240pin
HQFP8-208pin
HQFP8-160pin
HQFP8-128pin
HQFP8-144pin
HQFP5-128pin
HQFP15-100pin
H3QFP13-64pin
H3QFP12-48pin
17
PACKAGE
Configurations
PACKAGE
SOT 89
BGA
5 pin 3 pin
480 pin 388 pin
256 pin 225 pin
18
Dimensions
PACKAGE
Unit: mm
Plastic QFP
40
±0.1
42.6
±0.4
153228
40
±0.1
42.6
±0.4
77
152
INDEX
0.2
761
304
229
3.8
±0.1
0.4
4.5max
0.5
±0.2
0°
10°
0.5
0.15
±0.05
1.3
+0.1
–0.05
Plastic QFP8-256pin-S3
28
±0.1
30.6
±0.4
129192
28
±0.1
30.6
±0.4
65
128
INDEX
0.15
641
256
193
3.35
±0.1
0.32
0.5
±0.2
0°
10°
0.125
0.4
1.3
+0.1
–0.05
+0.05
–0.025
4
max
Plastic QFP22-256pin
129192
65
128
INDEX
641
256
193
28±0.1
30±0.4
28±0.1
30±0.4
0.160.4 +0.05
–0.03
1.4±0.1
0.1
1.7
max
0.5±0.2
0°
10°
0.125
1
+0.05
–0.025
Plastic QFP21-216pin
24
±0.1
26
±0.4
109162
24
±0.1
26
±0.4
55
108
INDEX
0.18
±0.1
541
216
163
0.1
1.7max
0.5
±0.2
0°
10°
0.125
0.4
1.4
±0.1
1
Plastic QFP23-240pin-S1
32
±0.1
34.6
±0.4
180 121
120181
240 61
601
32
±0.1
34.6
±0.4
0.2
0.5
+0.1
–0.05
3.4
±0.1
0.38
3.98max
0.5
±0.2
0.15
1.3
0°
10°
INDEX
Plastic QFP22-208pin
28
±0.1
30
±0.4
105156
28
±0.1
30
±0.4
53
104
INDEX
0.2
521
208
157
1.4
±0.1
0.1
1.7
max
0.5
±0.2
0°
10°
0.125
0.5
+0.1
–0.05
1
+0.05
–0.025
Plastic QFP10-304pin-S1
PACKAGE
Dimensions
PACKAGE
19
Unit: mm
28±0.1
30.6±0.4
105156
28±0.1
30.6±0.4
53
104
INDEX
0.2+0.1
–0.05
521
208
157
3.35±0.1
0.32
4max
0.5±0.2
0°
10°
0.15±0.05
0.5
1.3
Plastic QFP
Plastic QFP23-184pin
32
±0.1
35.2
±0.4
93138
32
±0.1
35.2
±0.4
47
92
INDEX
0.3
±0.1
461
184
139
3.4
±0.1
0.38
3.98
max
0.8
±0.2
0°
10°
0.15
±0.05
0.65
1.6
Plastic QFP20-184pin
93138
47
92
INDEX
461
184
139
1.4
±0.1
0.1
1.7
max
20
±0.1
22
±0.4
20
±0.1
22
±0.4
0.160.4
+0.05
–0.03
1
0.5
±0.2
0°
10°
0.125
+0.05
–0.025
Plastic QFP21-176pin
24
±0.1
26
±0.4
89132
24
±0.1
26
±0.4
45
88
INDEX
0.2
441
176
133
0.1
1.7
max
0.5
±0.2
0°
10°
0.125
0.5
1.4
±0.1
1
+0.1
–0.05
+0.05
–0.025
Plastic QFP8-208pin-S1
Plastic QFP8-160pin-E1
28
±0.1
31.2
±0.4
81120
28
±0.1
31.2
±0.4
41
80
INDEX
0.3
±0.1
401
160
121
3.35
±0.1
0.35
4max
0.8
±0.2
0°
10°
0.15
±0.05
0.65
1.6
Plastic QFP20-144pin
20±0.1
22±0.4
73108
20±0.1
22±0.4
37
72
INDEX
0.2
361
144
109
1.4±0.1
0.1
1.7
max
1
0.5±0.2
0°
10°
0.125
0.5 +0.1
–0.05
+0.05
–0.025
20
Dimensions
PACKAGE
Unit: mm
Plastic QFP Plastic QFP5-128pin-S2
20
±0.1
23.2
±0.4
65102
14
±0.1
17.2
±0.4
39
64
INDEX
0.2
±0.05
381
128
103
2.7
±0.1
0.35
3.5max
1.6
0.8
±0.2
0°
10°
0.15
±0.05
0.5
Plastic QFP15-128pin
14±0.1
16±0.4
6596
14±0.1
16±0.4
33
64
INDEX
0.16
321
128
97
1.4±0.1
0.1
1.7
max
1
0.5±0.2
0°
10°
0.125
0.4 +0.1
–0.05
+0.05
–0.025
Plastic QFP8-128pin-E1
28
±0.1
31.2
±0.4
6596
28
±0.1
31.2
±0.4
33
64
INDEX
0.35
±0.1
321
128
97
3.35
±0.1
0.35
4
max
0.8
±0.2
0°
10°
0.15
±0.05
0.8
1.6
Plastic QFP15-100pin
14±0.1
16±0.4
5175
14±0.1
16±0.4
26
50
INDEX
0.18
251
100
76
1.4±0.1
0.1
1.7max
1
0.5±0.2
0°
10°
0.125
0.5 +0.1
–0.05
+0.05
–0.025
Plastic QFP5-100pin-S2
20
±0.1
23.2
±0.4
5180
14
±0.1
17.2
±0.4
31
50
INDEX
0.3
+0.1
–0.05
301
100
81
2.7
±0.1
0.35
3.5
max
1.6
0.8
±0.2
0°
10°
0.15
±0.05
0.65
Plastic QFP26-128pin
0.1 1.4±0.1
1.
7
max
1
0.125+0.05
–0.02
0.18 +0.09
–0.03
0.5±0.2
20±0.1
22±0.4
65102
14±0.1
16±0.2
39
64
381
128
103
0.5
0°
10°
PACKAGE
Dimensions
PACKAGE
21
Unit: mm
Plastic QFP5-80pin-S2
20
±0.1
23.2
±0.4
4164
14
±0.1
17.2
±0.4
25
40
INDEX
0.35
241
80
65
2.7
±0.1
0.35
1.6
0.8
±0.2
0°
10°
0.15
±0.05
0.8
3.5
max
+0.1
–0.05
Plastic QFP Plastic QFP14-80pin
12±0.1
14±0.4
4160
12±0.1
14±0.4
21
40
INDEX
0.18
201
80
61
1.4±0.1
0.1
1.7
max
1
0.5±0.2
0°
10°
0.125
0.5 +0.1
–0.05
+0.05
–0.025
Plastic QFP15-64pin
14±0.1
16±0.4
3348
14±0.1
16±0.4
17
32
INDEX
0.35
161
64
49
1.4±0.1
0.1
1.7
max
1
0.5±0.2
0°
10°
0.125
0.8 +0.1
–0.05
+0.05
–0.025
Plastic QFP13-64pin
10
±0.1
12
±0.4
3348
10
±0.1
12
±0.4
17
32
INDEX
0.18
161
64
49
1.4
±0.1
0.1
1.7max
1
0.5
±0.2
0°
10°
0.125
+0.1
–0.05
+0.05
–0.025
0.5
Plastic QFP12-48pin
7
±0.1
9
±0.4
2536
7
±0.1
9
±0.4
13
24
INDEX
0.18
121
48
37
1.4
±0.1
0.1
1.7
max
1
0.5
±0.2
0°
10°
0.125
0.5
+0.1
–0.05
+0.05
–0.025
22
Dimensions
PACKAGE
Unit: mm
Plastic TQFP
6596
33
64
INDEX
321
128
97
14±0.1
16±0.4
14±0.1
16±0.4
0.160.4 +0.05
–0.03
1±0.1
0.1
1.2
max
1
0.5±0.2
0°
10°
0.125+0.05
–0.025
14±0.1
16±0.4
5175
14±0.1
16±0.4
26
50
INDEX
0.18
251
100
76
1±0.1
0.1
1.2
max
1
0.5±0.2
0°
10°
0.125+0.05
–0.025
0.5 +0.1
–0.05
Plastic TQFP14-100pin
12
±0.1
14
±0.4
12
±0.1
14
±0.4
0.1 1
±0.1
1.2
max
0.4 0.15
1
0.2
0.5
±0.2
0°
10°
+0.1
–0.05
INDEX
5175
26
50
251
100
76
Plastic TQFP15-100pin
Plastic TQFP15-128pin
Plastic TQFP12-48pin
Plastic TQFP13-64pin
Plastic TQFP14-80pin
12
±0.1
14
±0.2
12
±0.1
14
±0.2
0.1 1
±0.1
1.2max
0.5
1
0.5
±0.2
0.2
±0.03
4160
21
40
80
61
201
0.125
+0.035
–0.025
0°
10°
7±0.1
9±0.4
7±0.1
9±0.4
0.2±0.03
0.1 1±0.1
0.5
1
0.5±0.2
13
24
48
37
121
2536
1.2
max
0°
10°
0.125±0.035
10.2
±0.1
12
±0.4
10.2
±0.1
12
±0.4
0.1 1
±0.1
1.2
max
0.5 0.2
1
0.5
±0.2
+0.07
–0.03
3348
17
32
161
64
49
0.15
+0.05
–0.025
0°
10°
PACKAGE
Dimensions
PACKAGE
23
Unit: mm
Plastic HQFP
Plastic H2QFP23-240pin-S1
32
±0.1
34.6
±0.4
180 121
120181
240 61
601
32
±0.1
34.6
±0.4
0.2
0.5
+0.1
–0.05
3.4
±0.1
0.38
3.98max
0.5
±0.2
0.15
1.3
0°
10°
INDEX
Plastic HQFP8-208pin-S1
28
±0.1
30.6
±0.4
28
±0.1
30.6
±0.4
0.2
+0.1
–0.05
3.35
±0.1
0.32
4
max
0.5
±0.2
0°
10°
0.15
±0.05
0.5
1.3
105156
53
104
INDEX
521
208
157
Plastic H2QFP8-208pin-S1
28
±0.1
31.2
±0.4
105156
28
±0.1
31.2
±0.4
53
104
INDEX
0.2
+0.1
–0.05
521
208
157
3.35
±0.1
0.1
3.65
max
0.6
±0.2
0°
10°
0.15
±0.05
0.5
1.6
28
±0.1
31.2
±0.4
28
±0.1
31.2
±0.4
0.3
±0.1
3.35
±0.1
0.35
4
max
0.8
±0.2
0°
10°
0.15
±0.05
0.65
1.6
81120
41
80
INDEX
401
160
121
Plastic HQFP8-160pin-E1
Plastic HQFP8-144pin-E1
28±0.1
31.2±0.4
28±0.1
31.2±0.4
0.3±0.1
3.35±0.1
0.35
4
max
0.8±0.2
0°
10°
0.15±0.05
0.65
1.6
73108
37
72
INDEX
361
144
109
Plastic H2QFP8-256pin-S3
0.5±0.2
1.3
0°
10°
3.35±0.1
0.32
4
max
0.15
0.4 +0.1
–0.05
0.125+0.05
–0.025
28±0.1
30.6±0.4
128
65
193
256
INDEX
192 129
164
28±0.1
30.6±0.4
24
Dimensions
PACKAGE
Unit: mm
Plastic HQFP15-100pin-STD (Under development)
INDEX
14±0.1
16±0.4
5175
14±0.1
16±0.4
26
50
0.18
251
100
76
1.4±0.1
0.1
1.7max
1
0.5±0.2
0°
10°
0.125
0.5 +0.1
–0.05
+0.05
–0.025
Plastic HQFP
Plastic H3QFP15-100pin-STD
14
±0.1
16
±0.4
5175
14
±0.1
16
±0.4
26
50
INDEX
0.18
251
100
76
1.4
±0.1
0.1
1.7
max
1
0.5
±0.2
0°
10°
0.125
0.5
+0.1
–0.05
+0.05
–0.025
Plastic HQFP5-128pin-S2
20
±0.1
23.2
±0.4
65102
14
±0.1
17.2
±0.4
39
64
0.2
±0.05
381
128
103
2.7
±0.1
0.35
3.5max
1.6
0.8
±0.2
0°
10°
0.15
±0.05
0.5
INDEX
Plastic HQFP8-128pin-E1
28
±0.1
31.2
±0.4
28
±0.1
31.2
±0.4
0.35
±0.1
3.35
±0.1
0.35
4
max
0.8
±0.2
0°
10°
0.15
±0.05
0.8
1.6
6596
33
64
321
128
97
INDEX
Plastic H3QFP15-128pin-STD
14±0.1
16±0.4
6596
14±0.1
16±0.4
33
64
INDEX
0.16
321
128
97
1.4±0.1
0.1
1.7
max
1
0.5±0.2
0°
10°
0.125
0.4 +0.1
–0.05
+0.05
–0.025
Plastic H4TQFP15-100pin
14
±0.1
16
±0.4
100
76
26
50
14
±0.1
16
±0.4
5175
0.18
+0.1
–0.05
0.5
251
+0.05
–0.025
0.125
0.5
±0.2
0°
10°
1
1
±0.1
0.1
1.2
max
PACKAGE
Dimensions
PACKAGE
25
Unit: mm
Plastic H3QFP14-80pin-STD
Plastic H3QFP13-64pin-STD
12
±0.1
14
±0.4
4160
12
±0.1
14
±0.4
21
40
INDEX
0.18
201
80
61
1.4
±0.1
0.1
1.7
max
1
0.5
±0.2
0°
10°
0.125
0.5
+0.1
–0.05
+0.05
–0.025
10
±0.1
12
±0.4
3348
10
±0.1
12
±0.4
17
32
INDEX
0.18
161
64
49
1.4
±0.1
0.1
1.7
max
1
0.5
±0.2
0°
10°
0.125
+0.1
–0.05
+0.05
–0.025
0.5
Plastic H2QFP5-100pin-S2
Plastic HQFP
Plastic HQFP12-48pin
Plastic H4TQFP13-64pin
Plastic H3QFP12-48pin-STD
7
±0.1
9
±0.4
2536
7
±0.1
9
±0.4
13
24
INDEX
0.18
121
48
37
1.4
±0.1
0.1
1.7
max
1
0.5
±0.2
0°
10°
0.125
0.5
+0.1
–0.05
+0.05
–0.025
20±0.1
23.2±0.4
5180
14±0.1
17.2±0.4
31
50
100
81
0.3±0.1
301
0.65
0.35
3.5max
1.6
0°
10°
0.8±0.2
0.15±0.05
2.7
±0.1
10
±0.1
12
±0.4
3348
161
10
±0.1
12
±0.4
17
32
64
49
0.18
+0.1
–0.05
0.5
1
±0.1
0.1
1.2
max
0.5
±0.2
0.18
±0.1
0°
10°
1
7
±0.1
9
±0.4
2536
121
7
±0.1
9
±0.4
13
24
48
37
0.180.5
+0.1
–0.05
0°
10°
1
0.5
±0.2
0.125
+0.05
–0.025
1.4
±0.1
0.1
1.7
max
26
Dimensions
PACKAGE
Unit: mm
9.7
max
(
0.381
max
)
8 5
14
INDEX
9.1
±0.2
(
0.358
)
+0.008
–0.007
6.4
±0.2
(
0.252
±0.007
)
1.5
(
0.059
)
0.4
min
(
0.016
min
)
3.75
(
0.148
)
4.6
max
(
0.181
max
)
3.1
min
(
0.123
min
)
0.46
±0.1
(
0.018
)
+0.004
–0.003
2.54
(
0.1
)
0°
15°
7.62
(
0.3
)
0.25
(
0.01
)
+0.001
–0
+0.03
–0.01
Plastic DIP-8pin (300mil)
24 13
112
32max
(1.259max)
1.5
(0.059)
0.46±0.05
(0.018 )
+0.002
–0.001
2.54
(0.1)0°
15°
15.24
(0.6)
31.6±0.1
(1.244 )
+0.004
–0.003
13.6±0.1
(0.535 )
+0.004
–0.003
4.4±0.1
(0.173 )
+0.004
–0.003
3min
(0.119min)
0.8±0.1
(0.031 )
+0.004
–0.003
0.25
(
0.01
)
+0.001
–0
+0.03
–0.01
28 15
114
37.4
max
(
1.472
max
)
1.5
(
0.059
)
0.46
±0.1
(
0.018
)
2.54
(
0.1
)
0°
15°
15.24
(
0.6
)
36.7
±0.1
(
1.445
)
+0.003
–0.004
13.4
±0.1
(
0.528
)
+0.003
–0.004
4.6
±0.1
(
0.181
)
+0.004
–0.003
3
min
(
0.119
min
)
0.6
±0.1
(
0.024
)
+0.003
–0.004
0.25
±0.05
(
0.01
)
+0.001
–0.002
4
±0.1
(
0.157
)
+0.004
–0.003
+0.004
–0.003
32 17
116
42.5
max
(1.673
max
)
1.524
(0.06)
2.54
(0.1)0°
15°
15.24
(0.6)
41.9
(1.65)
2.7
min
(0.107
min
)
0.25
±0.05
(
0.01
)
+0.001
–0.002
13.4
(0.528)
0.51
min
(0.021
min
)
4±0.1
(0.157 )
+0.004
–0.003
5.08
max
(0.2
max
)
0.457
(0.018)
Plastic DIP-18pin (300mil)
18 10
19
23.2
max
(
0.913
max
)
6.3±0.1
(
0.248±0.003
)
1.5
(
0.059
)
0.46±0.01
(
0.018
)
2.54
(
0.1
)
0°
15°
7.62
(
0.3
)
0.25
(
0.01
)
+0.001
–0
+0.03
–0.01
0.8±0.1
(
0.031
)
+0.004
–0.003
22.6±0.1
(
0.89
)
+0.003
–0.004
3
min
(
0.119
min
)
3.9±0.1
(
0.154
)
+0.003
–0.004
Plastic DIP
Plastic DIP-32pin (600mil)
Plastic DIP-28pin (600mil)
Plastic DIP-24pin(600mil)
PACKAGE
Dimensions
PACKAGE
27
Unit: mm
Unit: mmUnit: mm
Plastic SOP Plastic SSOP
Plastic SOP2-28pin (450mil)
1528
141
1.27
(
0.05
)
17.8
±0.1
(
0.701
)
8.4
±0.1
(
0.331
)
+0.003
–0.004
0.4
±0.1
(
0.016
)
+0.003
–0.004
2.9
max
(
0.114
max
)
+0.003
–0.004
0.2
(
0.008
)
1.7
(
0.067
)
0°
10°
0.15
±0.05
(
0.006
)
+0.001
–0.002
18.1
max
(
0.712
max
)
11.8
±0.3
(
0.465
)
+0.011
–0.012
2.5
±0.15
(
0.098
)
+0.006
–0.005
1
±0.3
(
0.039
)
+0.012
–0.011
Plastic SOP3A-8pin (225mil)
58
41
INDEX
1.27
(0.05)
5.2
±0.2
(0.205 )
6.2
±0.3
(0.244
±0.011
)
4.4
±0.2
(0.173 )
+0.008
–0.007
0.4
±0.1
(0.016 )
+0.003
–0.004
1.5
±0.1
(0.059
±0.003
)
0.05
(0.002)
0.15
(0.006 )
+0.003
–0.002
0.9
(0.035)
+0.007
–0.008
1.7
max
(0.066
max
)
+0.1
–0.05
0.4
±0.2
(0.016 )
+0.007
–0.008
Plastic SOP3A-16pin (225mil)
916
81
INDEX
1.27
(
0.05
)
10.2
±0.2
(
0.402
)
4.4
±0.2
(
0.173
)
+0.008
–0.007
0.4
±0.1
(
0.016
)
+0.003
–0.004
1.7
max
(
0.066
max
)
0.15
(
0.006
)
+0.007
–0.008
1.5
(
0.059
)
0.9
(
0.035
)
6.2
±0.3
(
0.244
±0.011
)
0°
10°
0.05
(
0.002
)
0.5
±0.2
(
0.02
)
+0.007
–0.008
1120
101
INDEX
0.65
(
0.026
)
6.5
±0.1
(
0.256
)
4.4
±0.1
(
0.173
)
+0.004
–0.003
1.2
max
(
0.047
max
)
+0.003
–0.004
0.1
(
0.004
)
1
(
0.039
)
0°
10°
0.15
(
0.006
)
6.4
±0.3
(
0.252
±0.011
)
0.5
±0.2
(
0.02
)
+0.007
–0.008
0.22
±0.1
(
0.009
)
+0.003
–0.004
1.05
(
0.041
)
916
81
INDEX
0.8
(
0.031
)
0.36
±0.1
(
0.014
)
4.4
±0.2
(
0.173
)
+0.008
–0.007
1.7max
(
0.066max
)
+0.004
–0.003
0.05
(
0.002
)
0.9
(
0.035
)
0°
10°
0.15
±0.05
(
0.006
)
+0.003
–0.002
6.6
±0.2
(
0.26
)
+0.007
–0.008
7max
(
0.275max
)
6.2
±0.3
(
0.244
±0.011)
1.5
±0.1
(
0.059
±0.003)
0.5
±0.2
(
0.02
)
+0.007
–0.008
Plastic SSOP1-20pin
Plastic SSOP2-16pin
28
Dimensions
PACKAGE
Unit: mmUnit: mmUnit: mm SOT89
1.6
±0.2
4.5
±0.1
2.5
±0.1
4
±0.25
1.5
±0.1
0.42
±0.06
12 3
1.5
±0.1
0.41.1
0.42
±0.06
0.47
±0.06
1.5
±0.1
0.4
±0.03
0.4
±0.03
1.6
4.5
±0.1
2.5
±0.1
4.5
1.5
0.49
max
12 3
1.5
0.4
0.95
±0.3
0.49
max
0.54
max
1.5
±0.1
0.44
max
+0.5
–0.3
0.95
±0.3
0.44
max
0.49
max
54
Plastic TSOP
0.05
(
0.002
)
18.41±0.1
(
0.725±0.003
)
0.1±0.1
(
0.039±0.003
)
0.3±0.1
(
0.012±0.003
)
0.8
(
0.031
)
0°
10°
10.16±0.1
(
0.4±0.003
)
0.5±0.2
(
0.020±0.007
)
0.8
(
0.031
)
0.125
±0.05
(
0.005
±0.001
)
12.76±0.3
(
0.502±0.011
)
INDEX
18.81
max
(
0.740
max)
1.15
max
(
0.045
max)
2444
231
Plastic TSOP(I)-28pin
22
87
INDEX
28
1
21
11.8
±0.2
(
0.465
)
+0.007
–0.008
0°
10°
8
±0.2
(
0.315
±0.007
)
13.4
±0.3
(
0.528
)
+0.011
–0.012
0.8
(
0.031
)
0.5
±0.1
(
0.02
)
+0.003
–0.004
0.15
±0.1
(
0.006
)
+0.003
–0.004
0.55
(
0.022
)
1.27
max
(
0.05
max
)
0.2
±0.1
(
0.008
)
+0.003
–0.004
0
(
0
)
Plastic TSOP(II)-44pin SOT89-5pin
SOT89-3pin
PACKAGE
Dimensions
PACKAGE
29
Unit: mm
Plastic BGA PBGA-388pin
30°
123456789
10
11
12
13
14
15
16
17
18 21
22
19
20 23
24
25
26
AF
AD
AB
Y
V
T
P
M
K
H
F
D
B
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
35
35
0.6
±0.1
30
±0.2
0.76
+0.14
–0.16
2.33
1.73
±0.2
30
±0.2
1.27
1.27
INDEX
PBGA-225pin
INDEX
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
27
27
0.6
±0.1
24
+0.7
–0.5
0.76
30°
+0.14
–0.16
2.13
1.53
±0.05
24
+0.7
–0.5
1 3 5 7 9 11 13 15 17 19
2 4 6 8 10 12 14 16 18 20
1.27
1.27
PBGA-256pin PFBGA-220pin
14
1.0
0.40.8
0.4 0.81.0
1.2max
12345678910111213141516
S
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
INDEX
+0.3
–0.15
14
+0.3
–0.15
0.35
+0.1
–0.05
INDEX
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
27
27
0.6
±0.1
24
±0.1
0.75
±0.15
25°
21.3
1.53
±0.1
24
+0.7
–0.5
1 2 3 4 5 6 7 8 9 101112131415
1.5
1.5
Plastic Fine
Pitch BGA
Unit: mm
30
Dimensions
PACKAGE
Unit: mm
Unit: mm
Plastic Fine
Pitch BGA PFBGA-180pin
PFBGA-121pin
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1234567891011121314
0.8
0.40.8
0.4 0.80.8
INDEX
12
1.2max
+0.3
–0.15
12
+0.3
–0.15
0.35
+0.1
–0.05
L
K
J
H
G
F
E
D
C
B
A
1234567891011
1.0
0.80.8
0.8 0.81.0
INDEX
10
1.2max
+0.3
–0.15
10
+0.3
–0.15
0.35
+0.1
–0.05
PFBGA-81pin
0.80.8 0.8
123456789
J
H
G
F
E
D
C
B
A
0.8 0.80.8
INDEX
8
1.2max
+0.3
–0.15
8
+0.3
–0.15
0.35
+0.1
–0.05
PACKAGE
Dimensions
PACKAGE
31
Unit: mm
Ceramic Fine
Pitch LGA CFLGA-239pin
CFLGA-307pin
0.80
0.5
0.5
16
16
17
17
0.05
1.0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
15
±0.2
0.05
15
±0.2
1.0max
0.70.40.8
12.8
12.8
0.7 0.8 0.4
12345678910 11 12 13 14 15 16 17 18
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
13
±0.2
0.05
11.2
1.0max
0.50.40.8
11.2
13
±0.2
0.5 0.8 0.4
12345678910111213141516
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
CFLGA-424pin
CFLGA-152pin
11
±0.2
0.05
11
±0.2
1.0max
0.50.80.8
9.2
0.5 0.8 0.8
1 2 3 4 5 6 7 8 9 10 11 12 13
N
M
L
K
J
H
G
F
E
D
C
B
A
9.2
32
Dimensions
PACKAGE
Unit: mm
Ceramic Fine
Pitch LGA CFLGA-104pin
9
±0.2
0.05
9
±0.2
1.0max
0.50.80.8
7.2
0.5 0.8 0.8
7.2
1234567891011
L
K
J
H
G
F
E
D
C
B
A
TBGA-480pin (Under development)
35
±0.1
35
±0.1
33.6
0.635
33.6
1.625 1.27
0.6
1.7max
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1.6250.6351.27
TBGA-420pin (Under development)
TBGA-352pin (Under development)
35
±0.1
35
±0.1
33.6
33.6
1.625 1.27 0.635
0.6
1.7max
12345678910
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1.6250.6351.27
35
±0.1
35
±0.1
33.6
0.6351.271.625
33.6
0.6
1.7max
12345678910
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1.6250.6351.27
T-BGA Unit: mm
Section 1
ASICs
Gate arrays
S1L60000 series
S1L50000 series
S1L35000 series
S1L30000 series
S1L9000F series
Page
34
34
35
35
36
S1X60000 series
S1X50000 series
S1X35000 series
S1K70000 series＊
S1K60000 series
* : Under development
Em bedded arrays
Standard cel l s
37
37
37
38
38
38
38
S1K50000 series
S1K2500 series
34
ASICs
-1 Gate Arrays
High-speed, high-density lineup
S1L60000 Series
Series S1L60000 Series (S LA60000 series)
Features
z Ultra-high density (0.25µm silicon gate CMOS with triple/quadruple layer metal)
Raw gates: 99,220~2,519,604 gates
z Ultra-high speed operation (Propagation delay: 107 ps/2.5V, 2-input NAND, typical)
z Selectable supply vol tage (Internal gate: 2.5V, 2.0V I/O Cell: 3.3V, 2.5V/2.0V) (built-in level shifter)
z Low power consumption (0.18µW/MHz/BC at 2.5V of the internal cell)
z Driving capacity (IOL=0.1, 1, 3, 6, 12, 24mA, PCI/at 5.0V, IOL=0.1, 1, 2, 6, 9, 12mA, PCI/at 2.5V, IOL=0.05, 0.3, 1, 2, 3, 6mA/at 2.0V)
z On-chip RAM, PLL* and various other functions.
z Low noise output cell, PCI I/F, fail safe I/O, gated I/O, JTAG
S1L60093 S1L60173 S1L60283 S1L60403 S1L60593 S1L60833 S1L61233 S1L61583 S1L61903 S1L62513
Triple layer (SLA6009) (SLA6017) (SLA6028) (SLA6040) (SLA6059) (SLA6083) (SLA6123) (SLA6158) (SLA6190) (SLA6251)
S1L60094 S1L60174 S1L60284 S1L60404 S1L60594 S1L60834 S1L61234 S1L61584 S1L61904 S1L62514
Model Quadruple
layer (SLA600Q) (SLA601Q) (SLA602Q) (SLA604Q) (SLA605Q) (SLA608Q) (SLA612Q) (SLA615Q) (SLA619Q) (SLA625Q)
Raw gates 99,220 171,720 284,394 400,290 595,362 831,572 1,234,820 1,587,754 1,902,960 2,519,604
Triple
layer 79,376 137,376 199,076 280,203 416,753 540,522 802,633 1,032,040 1,141,776 1,511,762
Usable gates Quadruple
layer 89,298 154,548 241,735 340,247 506,058 665,258 987,856 1,270,203 1,427,220 1,889,703
Pads 104*/112 132*/148 168*/188 200*/224 240*/272 284/320* 334/388* 388/440* 424/480* 488/552*
Internal gates tpd=107ps (at 2.5V, typi cal), 140ps (at 2.0V, 2-input NAND, typical)
Input buffer tpd=260ps (at 5.0V, typi cal) level shifter, 270ps (at 2.5V, typical), 360ps (at 2.0V, typical)
Propagation
delay Output buffer tpd=1.5ns (at 5.0V, typi cal) level shifter, 1.6ns (at 2.5V, typical), 2.3ns (at 2.0V, typical), CL=15pF
I/O level CMOS, LVTTL, PCI
Input mode Normal, pull-up/pull-down, schmitt, level shifter, fail safe, Gated
Output mode Normal, open-drain, 3-state, level shifter, fail safe, Gated * : Under development
S1L50000 Series
Series S1L50000 Series (S LA50000H series)
Features
z Ultra-high density (0.35µm silicon gate CMOS with double/triple/quadrupl e layer metal)
Raw gates: 28,710~815,486 gates
z Ultra-high speed operation (Propagation delay: 0.14ns/3.3V, 2-input Power-NAND, typical)
z Selectable supply vol tage (Internal gate: 3.3V, 2.0V I/O Cell: 5.0V, 3.3V/2.0V) (built-in level shifter)
z Low power consumption (0.70µW/MHz/BC at 3.3V of the internal cell)
z Driving capacity (IOL=0.1, 1, 3, 8, 12, 24mA, PCI/at 5.0V, IOL=0.1, 1, 2, 6, 12mA, PCI/at 3.3V, IOL=0.05, 0.3, 0.6, 2, 4mA/at 2.0V)
z On-chip RAM, PLL and various other functions.
z Low noise output cell, PCI I/F, USB I/F, fail safe output, JTAG
S1L50282 S1L50752 S1L50992 S1L51252 S1L51772 S1L52502 S1L53352 S1L54422 S1L55062 S1L56682 S1L58152
Double layer (SLA5028H) (SLA5075H) (SLA5099H) (SLA5125H) (SLA5177H) (SLA5250H) (SLA5335H) (SLA5442H) (SLA5506H) (SLA5668H) (SLA5815H)
S1L50283 S1L50753 S1L50993 S1L51253 S1L51773 S1L52503 S1L53353 S1L54423 S1L55063 S1L56683 S1L58153
Triple layer (SLA502TH) (SLA507TH) (SLA509TH) (SLA512TH) (SLA517TH) (SLA525TH) (SLA533TH) (SLA544TH) (SLA550TH) (SLA566TH) (SLA581TH)
S1L50284 S1L50754 S1L50994 S1L51254 S1L51774 S1L52504 S1L53354 S1L54424 S1L55064 S1L56684 S1L58154
Model
Quadruple
layer (SLA502QH) (SLA507QH) (SLA509QH) (SLA512QH) (SLA517QH) (SLA525QH) (SLA533QH) (SLA544QH) (SLA550QH) (SLA566QH) (SLA581QH)
Raw gates 28,710 75,774 99,198 125,772 177,062 250,160 335,858 442,112 506,688 668,552 815,468
Double
layer 14,355 35,614 46,623 56,597 79,678 112,572 144,419 176,845 202,675 267,421 326,187
Triple
layer 25,265 64,408 84,318 100,618 132,797 187,620 251,894 309,478 354,682 467,986 570,828
Usable gates
Quadruple
layer 27,275 71,985 94,238 119,483 168,209 237,652 319,065 397,901 456,019 601,697 733,921
Pads 88/104 144/168 168/192 188/216 224/256 264/304* 308/352* 352/404* 376/432* 432/496* 480/548*
Internal gates tpd=0.14ns (at 3.3V, typi cal), 0.21ns (at 2.0V, typical)
Input buffer tpd=0.38ns (at 5.0V, typical) le vel shifter, 0.4ns (at 3.3V, typical), 1.3ns (at 2.0V, typical)
Propagation
delay Output buffer tpd=2.12ns (at 5.0V, typical) level shifter, 2.02ns (at 3.3V, typical), 3.9ns (at 2.0V, typical), CL=15pF
I/O level CMOS, LVTTL, PCI, USB
Input mode Normal, pull-up/pull-down, schmitt, level shifter, fail safe, Gated
Output mode Normal, open-drain, 3-state, level shifter, fail safe, Gated * : Under development
Usable gates: Differ depending on the circuit and the listing is for your reference.
1
35
ASICs
S1L35000 Series
Series S1L35000 Series (S LA35000 series)
Features
z High density (0.6µm silicon gate CMOS with triple layer metal)
z High speed operation (Propagation delay: 0.4ns at 3.3V, 2-input Power - NAND, typical)
z Selectable supply vol tage (5.0V, 3.3V, 3.0V)
z Low power consumption (0.77µW/MHz/BC at 3.0V of the internal cell)
z Driving capacity (IOL=1, 4, 8, 12mA at 5.0V) (IOL=0.5A, 2, 4, 6mA at 3.3V)
z On-chip RAM
S1L35043 S1L35063 S1L35093 S1L35163
Model (SLA3504) (SLA3506) (SLA3509) (SLA3516)
Raw gates 41,417 64,320 95,760 161,841
Usable gates 26,921 38,592 52,668 80,920
Pads 110 130 162 210
Internal gates tpd=0.3ns (at 5.0V, typical), 0.4ns (at 3.3V, typical)
Input buffer tpd=0.48ns (at 5.0V, typical), 0.63ns (at 3.3V, typical)
Propagation
delay Output buffer tpd=2.08ns (at 5.0V, typical), 2.86ns (at 3.3V, typical), CL=50pF
I/O level CMOS, TTL
Input mode Normal, pull-up/pull-down, schmitt
Output mode Normal, open-drain, 3-state
S1L30000 Series
Series S1L30000 Series (SLA30000 series)
Features
z High density (0.6µm silicon gate CMOS with double-layer/triple-l ayer metal)
z Ultra high speed operation (Propagation delay: 0.25ns at 5V 2-input Power-NAND, typical)
z Selectable supply voltage (5V, 3.3V, 3V) (built-i n level shifter)
z High driving capaci ty (I OL=0.1A, 1, 4, 8, 12 or 24mA at 5V, IOL=0.05A, 0.5A, 2, 4, 6 or 12mA, PCI at 3.3V)
z On-chip RAM
z Low Noise Out Put Cell, PCI I/F
S1L30182 S1L30302 S1L30422 S1L30552 S1L30752 S1L31092 S1L31252 S1L32162
Double layer (SLA3018) (SLA3030) (SLA3042) (SLA3055) (SLA3075) (SLA3109) (SLA3125) (SLA3216)
S1L30183 S1L30303 S1L30423 S1L30553 S1L30753 S1L31093 S1L31253 S1L32163
Model
Triple layer (SLA301T) (SLA303T) (SLA304T) (SLA305T) (SLA307T) (SLA310T) (SLA312T) (SLA321T)
Raw gates Twin-power 18,544 30,846 42,262 55,341 75,450 109,080 125,836 216,216
Single-power 23,572 37,232 49,680 63,784 85,251 120,802 138,400 232,582
Double layer 9,272 15,423 19,863 26,010 33,952 49,086 54,109 86,486
Usable gates
(Dual-power) Triple layer 16,318 26,219 35,077 44,272 58,851 81,810 94,377 151,351
Double layer 11,786 18,616 23,349 29,978 38,362 54,360 59,512 93,032
Usable gates
(Single-power) Triple layer 20,743 31,647 41,234 51,027 66,495 90,601 103,800 162,807
Pads 128 160 184 208 240 256 304 376
Internal gate tpd=0.25ns (at 5.0V, typical), 0.33ns (at 3.3V, typical)
Input buffer tpd=0.48ns (at 5.0V, typical), 0.63ns (at 3.3V, typical)
Propagation
delay Output buffer tpd=2.08ns (at 5.0V, typical), 2.86ns (at 3.3V, typical), CL=50pF
I/O level CMOS, TTL, PCI
Input mode Normal, pull-up/pull-down, schmitt, level interface
Output mode Normal, open-drain, 3-state, level shifter
Usable gates: Differ depending on the circuit and the listing is for your reference.
36
ASICs
-1 Gate Arrays
S1L9000F Series
Series S1L9000F Series (SLA9000F series)
Features
z 1.0µm silicon gate CMOS with double l ayer metal.
z High speed operation (Internal gate delay tpd = 0.3ns at 5.0V, 2-input Power- NAND, typical).
z Usable with simplified level shifter.
z High drive output (IOL = 0.1A, 2, 6, 12 or 24mA/at 5.0V, IOL = 0.1, 1, 3, 6, 12mA/at 3.3V)
z On-chip RAM
z Low noise output cell
S1L902F2 S1L904F2 S1L907F2 S1L909F2 S1L913F2 S1L919F2 S1L927F2 S1L944F2
Model (SLA902F) (SLA904F) (SLA907F) (SLA909F) (SLA913F) (SLA919F) (SLA927F) (SLA944F)
Raw gates 2,784 4,392 7,872 9,540 13,144 19,350 27,234 44,070
Usable gates 1,809 2,854 4,723 5,724 7,229 10,642 13,617 22,035
Pads 80 100 128 144 160 184 208 256
Internal gate tpd=0.30ns (at 5.0V, typical), 0.43ns (at 3.3V, typical)
Input buffer tpd=0.91ns (at 5.0V, typical), 1.08ns (at 3.3V, typical)
Propagation
delay Output buffer tpd=3.5ns (at 5.0V, typical), 4.2ns (at 3.3V, typical), CL=50pF
I/O level CMOS, TTL
Input mode Normal, pull-up/pull-down, schmitt
Output mode Normal, open-drain, 3-state
Usable gates: Differ depending on the circuit and the listing is for your reference.
1
37
ASICs
-2 Embedded Arrays
An embedded array is an ASIC under a new method featuring consolidation of "Sea of gates" of a gate array and hard-macro
cells for specific applications. With this product, the concept of system-on-chip has been realized by use of hard-macro cells
with high functions and quicker delivery leadtime has become available when modifying the circuit, thanks to adoption of the
"Sea of Gates" for the logic portion.
Designing the embedded arrays
When designing embedded arrays, execute system design first and determine the number of gates for the logic section and
select the macro-cell to be used before starting manufacture of base bulks.
The base bulks, placing necessary hard-macro cells and the Sea of Gates for the logic portion, are manufactured up to just
before the routing process.
In parallel with this manufacturing processes, processes from the circuit designing of the logic portion through post-simulation fix
should be executed, similar to the cases of ordinary gate arrays, to go into sample production process after sign-off.
After the sign-off, samples can be shipped with the same delivery leadtime as that of the gate arrays.
Also, when making logic circuit modifications or ROM data changes, NRE charge and developing leadtime can be reduced to a
level similar to that of the gate arrays.
●Products
●Macro-cell list
y 1port RAM (Synchronous) y DMAC (F37) y IrDA Controller y PLL
y 2port RAM (Synchronous) y RTC (F42) y USB Function Controller y ADC
y FIFO y USRAT (F51) y PCMCIA Controller y DAC
y ROM y PIT (F54) y USB2.0 Tranceiver*
y Flash y PPI (F5 5) y IEEE1394 LINK*
y OTPROM* y PIC (F59) y IEEE1394 PHY*
y 8bit CPU (F80) y URAT (F65) y LVDS Receiver
y 32bit RISC (S1C33) y LVDS Transmitter*
y ARM7TDMI y TMDS Receiver*
y LCD Controller
* : Under development
1
Series S1X60000 Series
(SSL60000 Series) S1X50000 Series
(SSL50000 Series) S1X35000 Series
(SSL35000 Series)
Process 0.25µm, 3/4/5 layer metal 0.35µm, 2/3/4 layer metal 0.6µm, 3 layer metal
Raw gates ~2.5M ~1.4M ~500K
Internal cell delay 107ps / 2NAND, 2.5V 140ps / 2NAND, 3.3V 300ps / 2NAND, 5.0V
Power
consumption 0.17µW/MHz/gate,
2.5V 0.39µW/MHz/gate,
3.3V 2.4µW/MHz/gate,
5.0V
Supply voltage
(Internal) 1.8~2.7V 1.8~3.6V 2.7~5.0V
Supply voltage
(I/O) 1.8~3.6V 1.8~5.5V 2.7~5.5V
38
ASICs
-3 Standard Cells
Standard Cells
The standard cells are semi-custom ICs that incorporates a well-designed internal logic cell and ROM/RAM, CPU peripheral
circuits or analog circuits into a single chip. Compared to the gate arrays, they boast higher design flexibility, functionality and
integration capabilities, providing system LSI chips optimized to the customer needs. These features greatly help electronic
device manufacturers design products with a compact body, lower power consumption, and a lower price.
Gate array Embedded array Standard cell
S1L50000 Series S1X50000 Series S1K50000 Series
(SLA50000H Series) (SSL50000 series) (SCB50000 series)
Integration (%) 100 73 40
Power consumption
(µW /MHz/FF) 7.65 4.51 2.22
S1K70000 Series*
Series S1K70000 S eries (SCB70000 series)
Features
z High integrated (Use of 0.25µm silicon-gate with 3/4/5-layer wiring process)
z High-speed operation (Internal gate delay:TBD)
z Selective supply voltage For a single power supply (1.8V, 1.5V, 1.1V)
For dual power supplies (IO / Internal = 3.3V / 2.5V, 2.5V / 1.5V)
z Low power consumption (TBD)
z Output Current(TBD)
Macro cell z Same as the embedded-array-mountable macrocells.
Package z PKG lineup QFP48-304 pins, PBGA, TBGA, PFBGA, CF LGA *: Under development
S1K60000 Series
Series S1K60000 S eries (SCB60000 series)
Features
z High integrated (Use of 0.25µm silicon-gate with 3/4/5-layer wiring process)
z High-speed operation (Internal gate delay: 107ps/2.5V, 2-input NAND, typical load)
z Selective supply voltage For a single power supply (2.5V, 2.0V)
For dual power supplies (3.3V I/O / 2.5V Internal, 3.3V I/O / 2.0V Internal)
z Low power consumption (2.5V/MHz/gale, Internal cell at 2.5V)
z Output Current (IOL=0.1, 1, 3, 6, 12, 24mA/at 3.3V, IOL=0.1, 1, 3, 6, 9, 18mA/2.5V internal, IOL=0.05, 0.3, 1, 2, 3, 6mA/at 2.0V)
Macro cell z Same as the embedded-array-mountable macrocells.
Package z PKG lineup QFP48-304 pins, PBGA, TBGA, PFBGA, CF LGA
S1K50000 Series
Series S1K50000 S eries (SCB50000 series)
Features
z High integrated (Use of 0.35µm silicon-gate with 2/3/4-layer wiring process)
z High-speed operation (Internal gate delay: 0.14ns/3.3V, 2-input power NAND, typical load)
z Selective supply voltage For a single power supply (2.0V, 2.5V, 3.3V)
For dual power supplies (5.0V I/O / 3.3V Internal, 3.3V I/O / 2.5V Internal, 3.3V I/O / 2.0V Internal)
z Low power consumption (0.25µm/MHz/gate, Internal cell at 3.3V)
z Output Current (IOL=0.1, 1, 3, 8, 12, 24mA/at 5.0V, IOL=0.1, 1, 2, 6, 12mA/at 3.3V, IOL=0.05, 0.3, 0.6, 2, 4mA/at 2.0V)
Macro cell z Same as the embedded-array-mountable macro cells.
Package z PKG lineup QFP48-304 pins, PBGA, TBGA, PFBGA, CF LGA
Ultra Low Voltage Standard Cell
S1K2500 Series
Series S1K2500 S eri es (SSC2500 series)
Features
z Silicon gate CMOS, two layers (1.6 µm)
z Ultra low operating voltage (VDD = 0.9 to 5.5 V)
z 300 to 16,000 gates available
z Very low power consumption (1.0 µW/MHz/gate, 3.0V; 0.25 µW/MHz/gate, 1.5V)
z The internal power supplies (with built-in internal level shifter and I/O level shifter)
z Full built-in oscillating circuits (INV, RF, RD, CG, CD)
z Analog cells can be incorporated.
Package z PKG lineup QFP48~144 pins, SOP
Usable gates: Differ depending on the circuit and the listing is for your reference.
1
●The standard cells offer 2/5 the degree o
f
integration and 1/3 the power consumption o
f
our S1L50000 series gate arrays.
39
ASICs
-4 Dev elopment of Gate Arrays
Gate Arrays are developed you to coraborate with Seiko Epson. We are preparing design libraries for various ASIC
development tools
1. RTL Interface
After taking development as far as the function simulation stage, customers can send their Verilog-HDL or VHDL source files
and test patterns to EPSON via an HDL interface, so that EPSON can perform logic synthesis.
2. Netlist Interface
Customers can use the netlist interface to send EPSON gate-level netlists and test patterns for Verilog-HDL or VHDL code
that has completed the logic synthesis stage, and EPSON will then implement the logic simulation stage.
3. Simulation Interface
Customers can use this interface to send EPSON gate-level netlists and test patterns for Verilog-HDL or VHDL code that has
completed the logic simulation stage.
EPSON will then perform the subsequent tasks beginning with interconnect layout.
●Supporting libraries for ASIC design Tools Available as of January, 2001
ASIC Design Tools S1L60000
(SLA60000) S1L50000
(SLA50000H) S1L35000
(SLA35000) S1L30000
(SLA30000) S1L9000F
(SLA9000F)
Auklet ○ ○ ○ ○ ○
Verilog-XL ○ ○ ○ ○ ○
Design Compiler ○ ○ ○ ○ ○
Design Power ○ ○ ○ ○ ○
Prime Time ○ ○ --- --- ---
TestGen ○ ○ --- ○ ○
ModelSim ○ ○ ○ ○ ○
Leonardo ○ ○ ○ ○ ○
○: Supported, ---: Not Supported
1
40
ASICs
-4 Dev elopment of Gate Arrays
Customer SEIKO EPSON
Function Design
Language Design
Test Pattern Generation
Logic Synthesis
Logic Simulation
Logic Synthesis
Logic Simulation
Layout
Post-layout Simulation
Sign-off
Preparation of Samples
Post-layout Simulation
1. RTL Interface
2. Netlist Interface
3. Simulation Interface
3. Simulation Interface
Sample
1
Section 2
MCUs
Page
42
43
43
43
44
44
45
45
45
45
4-bit
microcomputers
S1C60 series
Micro Mini
S1C60 Family
S1C62100 series
LCD drivers
Inf r ared remote carrier
modul ation ourput
S1C6S200 series
LCD drivers
Stepping motor dr iver
For low-power application
S1C62N30/6S300 series
LCD drivers for
For low-power application
S1C62400/6S400 series
LCD drivers for
Dot-matrix display
S1C62N50/62900 series
LCD drivers
On-chip R-F converter
S1C62600 series
Multiple I /O ports
S1C62700 series
LCD drivers
On-chip dual slope
A/D converter
S1C62N80 series
LCD drivers
Melody funct ion
For low-power application
S1C62M00 series
LCD drivers
On-chip A-D converter
and serial I/O ports
S1C63100 series
A/D converter
S1C63200 series
Wide operation voltage
High Speed
S1C63300 series
7 Seg LCD drivers
S1C63400 series
LCD drivers for
Dot-matrix displays
S1C63500 series
DTMF/DP
generator
ドイバ
S1C63600 series
LCD drivers
On-chip R-F converter
ドイバ
S1C63A/B00 series
LCD drivers
Built-in gate array
S1C05250 series
FSK+CAS
S1C88100 series
Serial I/O
S1C88300 series
LCD drivers for
Dot-matrix displays
Serial I/O ports
S1C88400 series
LCD controlle r
S1C88800 series
LCD driver
internal bus only
S1C33200 series
Basic model
S1C33L00 series
LCD controlle r
S1C33S00 series
The diet functional
version
S1C33T00 series
Many pins (I/O ports)
S1C33210
For specific uses
46
46
46
47
47
47
48
50
50
51
51
49
52
52
53
52
53
S1C62 Family
Peripheral
S1C63 Family
High performance
4-bit microcomputers
S1C52 Family
S1C88 Family
8-bit
microcomputers
S1C33 Family
32-bit
microcomputers
42
MCUs
-1 4-bit Microcomputers
4-bit single-chip application-
oriented microcomputers
S1C60/62(E0C60/62)Family：
Application-oriented
microcomputer
S1C60(E0C60) series
Using the same core CPU as of the S1C62(E0C62) Family, the S1C60(E0C60) series devices are optimized for specification upto 4Kword of
ROM capaciti es. They are sui table for appli cations to small si zed equi pment such as clocks, timers and thermomet e rs.
Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C60N01
(E0C6001) 1.8~3.6
S1C60L01
(E0C60L01) 1.2~2.0
4 2 4 --- --- --- --- { --- --- --- --- --- --- --- 1 QFP12-48
Chip
S1C60N02
(E0C6002) 1.8~3.5
S1C60L02
(E0C60L02) 1.2~2.0
1,024 80
4 4 4 --- --- --- ― { ― --- --- --- 1 ― ―
1
2
20×4
QFP6-60
Chip
S1C60N03
(E0C6003) 1.8~3.6
S1C60L03
(E0C60L03) 1.2~2.0
1.0/2.5 32.768K
768 64 4 4 0 --- ― --- --- { --- --- --- --- --- --- --- 1 1 15×4 Chip
S1C60N04 2.7~3.6
(E0C6004) 4.5~5.5 330/450
(3V) 2M 1,536 144 4 4 4 --- --- --- --- { --- --- --- --- --- --- --- 1 1 26×4 QFP12-48
Chip
S1C60N05
(E0C6005) 1.8~3.5
S1C60L05
(E0C60L05) 1.2~2.0
8/15 32.768K 1,536 80 4 4 4 --- --- --- --- { --- --- --- --- 2 --- --- 1 2 QFP6-60
Chip
S1C60N06
(E0C6006) 2.2~3.5 2/9(32K)
/130(455K) 32.768K/
455K 2,048 128 8 4 4 --- --- --- { { --- --- --- --- --- 1 --- 2 4
20×4
QFP6-60
QFP13-64
Chip
S1C60N07
(E0C6007) 2.2~5.5 2.5/6.5(32K)
/1m(2M) 32.768K/
2M 4,096 512 4 6 4 1 ---
{ { { --- --- --- --- --- --- --- 1 3 40×8/16 QFP15-100
Chip
S1C60N08
(E0C6008) 1.8~3.5
S1C60L08
(E0C60L08) 0.9~1.7
1.0/2.2 32.768K
S1C60A08
(E0C60A08) 2.2~3.5 1.1/3.0(32K)
50(500K) 32.768K/
500K
4,096 832 9 8 8 --- 2
{ { { --- 1 ---
{ --- --- { 3 3 48×4 QFP5-100
QFP15-100
Chip
S1C60N09
(E0C6009) 2.6~3.6
S1C60L09
(E0C60L09) 1.2~1.8
1.0/3.0 32.768K 1,536 144 4 4 8 --- ---
{ --- { --- --- --- --- --- --- --- 1 2 38×4 Chip
S1C60N11
(E0C6011) 1.2~1.8 4.0/8.0
Ú2 65～260K 1,536 144 4 4 8 --- --- --- --- { --- --- --- --- --- --- --- 1 1 38×4 QFP5-80
QFP14-80
Chip
S1C60N13* 2.2~3.6
S1C60L13* 1.2~1.8 TBD 32.768K
S1C60A13* 2.2~3.6 TBD 32.768K/
1M
4,096 256 5 9 8 --- 2 ---
{ { --- 1 --- --- --- --- { 2 3 38×4 QFP14-80
QFP5-80
Chip
S1C60140* 2.2~3.6 TBD 32.768K/
455K 4,096 208 8 10 4 --- --- --- { --- --- --- --- --- --- 1 { 2 3 32×4 QFP5-80
Chip
S1C60N15* 1.8~3.6
S1C60L15* 1.2~1.7 TBD 32.768K
S1C60A15* 2.2~3.6 TBD 32.768K/
500K
4,096 832 9 8 8 --- 2
{ { --- --- --- { --- --- { 3 2 48×4 QFP5-100
QFP15-100
Chip
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: At the time of Sleep is 0.3µA.
* : Under development
2 S1C62/60(E0C62/60) family microcomputers are truly application-oriented,
because they offer the features you need to get the job done -- flexible, modula
r
architectures, a range of performance levels, and a wide selection of powe
r
supply voltages and package configurations. Built around the
S1C6200(E0C6200) or S1C6200A(E0C6200A), SEIKO EPSON's powerful 4-bi
t
core CPUs, the S1C62(E0C62) family lineup provides a wide choice of ROM
and RAM capacities, I/O ports, on-chip LCD drivers, supply voltage detectors,
and high-performance peripheral circuits. All devices are fabricated using
power-saving, low-voltage (1.5, 3.0 or 5.0V) technology.
43
MCUs
S1C62100(E0C6210) series
The mic rocomputer of t his series int egrates ROM, RA M, LCD dri ve r, BLD (SVD) circ uit, com parator (1/2 ch), and c lock function provided with remote
control carrier output circuit. This series can also be applied to handy equipment, including simplified electronic notes, from infrared remote controller.
Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C621A0
(E0C621A) 2.2~3.5 2/9(32K)
/130(455K) 32.768K/
455K 208 9 4 --- 1 --- 1
{ 2 4 32×4 QFP5-80
QFP14-80
Chip
S1C621C0
(E0C621C) 2.2~5.5 3/7(32K)
170(455K) 32.768K/
455K or 1M
4,096
208
8
4 4
--- --- ---
{
{ --- --- ---
--- 2 1 { 2 3 34×4 QFP5-80
Chip
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
S1C6S200(E0C6S20) series
The microcomputer of this series integrates ROM, RAM, LCD driver, stepping motor drive 1 ch, timer and stopwatch function. This series best fit
for combinati on watc hes, timers , and counters. Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C6S2N7
(E0C6S27) 2.2~3.6 0.7/1.9
S1C6S2L7
(E0C6SL27) 0.9~1.8 0.6/1.7
S1C6S2B7
(E0C6SB27) 0.9~3.6 0.7/1.9
32.768K 1,536 80 4 4 4 --- ---
{ --- { --- --- --- --- --- --- { 1 3 26×4 QFP6-60
Chip
S1C6S2A7
(E0C6SA27) 2.2~3.6 60/70 200K
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
S1C62N30/6S300(E0C6230/6S30) series
The microcomputer of this series integrates ROM, RAM, LCD driver , timer and stopwatch function. This series is best fit for clocks, timers, and counters.
Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C6S3N7
(EOC6S37) 1.8~3.6
S1C6S3L7
(E0C6SL37) 0.9~2.0
S1C6S3B7
(E0C6SB37) 0.9~3.6
1.0/2.5 32.768K 1,024 80 4 4 4 --- ---
{ --- { --- --- --- --- --- --- { 1 2 26×4 QFP6-60
Chip
S1C6S3N2
(E0C6S32) 1.8~3.6
S1C6S3L2
(E0C6SL32) 0.9~1.8
S1C6S3B2
(E0C6SB32) 0.9~3.6
0.65/2.0 32.768K
S1C6S3A2
(E0C6SA32) 1.8~3.6 1.5/4.0
/150(1M) 32.768K/
1M
2,048 144 --- 2 2 38×4 QFP5-80
QFP14-80
Chip
S1C62N33
(E0C6233) 1.8~3.5 1.5/6.0
S1C62L33
(E0C62L33) 0.9~1.7 1.0/3.0
32.768K
E0C62A33
(E0C62A33) 2.2~3.5 2.0/8.0(32K)
135(500K) 32.768K/
500K
3,072 256
5 8 8 --- 1
{ { { ---
1
--- { --- --- {
2 3 40×4 QFP5-100
Chip
S1C6N3B0
(E0C623B) 0.8~3.6 2.5/3.0 32.768K
S1C6A3B0
(E0C62A3B) 1.7~3.6 80/100(1M)
Ú2 1M
1,536 96 4 4 4 --- ---
{ --- { --- 1 --- --- --- --- --- 2 3 26×4 QFP12-48
QFP5-60
Chip
{ : Available
Ú1 : SVD is an abbreviation for Supply Voltage Detector.
Ú2: At the time of Sleep is 1µA.
44
MCUs
-1 4-bit Microcomputers
S1C62400/6S400(E0C6240/6S40) series
The microcomputer of these series integrates ROM, RAM, dot matrix LCD driver, timer and stopwatch function. These series feature many
input/out put ports and built-in clock synchronous serial ports that provide control of external memory. The m icrocomputer of these series is best
fit f or such equipment t hat requires dot matrix displ ay, including high perf ormance el ectronic memorandum equi pment and di ctionary.
Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
2.2~5.5 2.5/6.5(32K)
400(1M) 32.768K/
1M
S1C62440
(E0C6244) 3.5~5.5 2.5/6.5(32K)
1000(2M) 32.768K/
2M
4,096 384 12 12
2.2~5.5 2.5/6.5(32K)
400(1M) 32.768K/
1M
S1C624A0
(E0C624A) 3.5~5.5 2.5/6.5(32K)
1000(2M) 32.768K/
2M
S1C6S460
Ú2
(E0C6S46) 2.2~5.5 2.5/6.5(32K)
1000(2M) 32.768K/
2M
6,144 640
40×8/16 QFP5-128
Chip
2.2~5.5 2.5/6.5(32K)
400(1M) 32.768K/
1M
S1C62480
(E0C6248) 3.5~5.5 2.5/6.5(32K)
1000(2M) 32.768K/
2M
2.2~5.5 2.5/6.5(32K)
400(1M) 32.768K/
1M
S1C6S480
Ú2
(E0C6S48) 3.5~5.5 2.5/6.5(32K)
1000(2M) 32.768K/
2M
8,192 768
2.2~5.5 2.5/6.5(32K)
400(1M) 32.768K/
1M
S1C624C0
(E0C624C) 3.5~5.5 2.5/6.5(32K)
1000(2M) 32.768K/
2M
5,120 1152
8
20
16
1 ---
{ { { --- 1 --- --- --- --- { 2 4
51×8/16 QFP8-144
Chip
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: No external memory accessing function.
S1C62N50(E0C6250)/S1C62900(E0C6290) series
The microcomputer of these series integrates ROM, RAM, R/F comparator for measuring temperature, LCD driver, and timer. An external
thermistor and built-in R/F comparators provide the function of a thermometer. The S1C62900(E0C6290) series also contains clock
synchronous serial ports that provide control of external memory.
Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C62N51
(E0C6251) 1.8~3.5
S1C62L51
(E0C62L51) 0.9~2.0
1.0/2.5 32.768K 1,024 80 4 4 4 --- --- --- --- --- 1 1 2 26×4 QFP6-64
Chip
0.9~3.6
S1C62560
(E0C6256) 2.2~3.6
0.65/
2.0(32K)
170(1M)
32.768K/
1M 6,144 640 8 8 1
{ { 2 2 5 60×5 QFP5-100
QFP5-128
Chip
S1C62920
(E0C6292) 2.2~5.5 2.0/5.0(32K)
270(1M) 32.768K/
1M 2,048 128 4 4
8
--- --- ---
{
{ ---
1
--- ---
3
--- {
1 3 22×4 QFP6-64
QFP13-64
Chip
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
2
45
MCUs
S1C62600(E0C6260) series
The microcomputer of this series integrates ROM, RAM, high current output port, event counter, interval timer, synchronous/start/stop system
serial port , comparator, and cl ock function. Thi s series i s best f i t for application t o t he area of telemeter.
Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C62660
(E0C6266) 2.2~5.5 1.3/9.0(38.4K)
110(500K) 38.4K/
500K 6,144 1024 12 16 12 1 1 --- { { 1 1
※2 --- 2 --- --- { 3 9 --- QFP6-60
Chip
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: The start/stop system can be chosen on a mask option.
S1C62700(E0C6270) series
The microcomputer of this series integrates ROM, RAM, double integral type A/D converter, LCD driver, timer and serial I/O port. T his seri es is
best f i t for a syst em that performs analog input control of measuring instruments, et c. and provides LCD di splay.
Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C62740
(E0C6274) 2.2~5.5 2.0/6.0(32K)
200(1M)
Ú3
32.768K/
1M 4,096 512 5 4 12 1
{ { { { --- 1 5
※2 { --- --- { 2 5 32×4 QFP5-100
QFP15-100
Chip
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Dual slope type.
Ú3: At the time of Sleep is 0.7µA.
S1C62N80(E0C6280) series
The microcomputer of this s eries integrates ROM, RAM, melody generator, LCD driver, c lock, and stopwatch function. This series is best fit for
clocks, watches and timers using melody.
Notes: For customers who will use the S1C62N80(E0C6280) series, they should make applications to our company regardless of the use or
non-use of melody ROM, before working on software development.
As regards the copyright in Japan, we will file an application for the number to Japanese Society of Rights of Authors and Composer
(JASRAC) and deal with the number involving t he copyright.
Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C62N81
(E0C6281) 1.8~3.5
S1C62L81
(E0C62L81) 0.9~3.5
1.0/3.0 32.768K 1,024 96 5 7 4 26×4 QF P6-64
Chip
S1C62N82
(E0C6282) 2.2~5.5
S1C62L82
(E0C62L82) 0.9~3.5
1.5/4.0 32.768K
S1C62A82
(E0C62A82) 2.2~5.5 1.7/4.0(32K)
150(1M) 32.768K/
1M
2,048 224 5 8 4
--- ---
{ --- { --- --- --- 1 --- --- { 2 3
42×4
38×8 QFP5-80
QFP14-80
Chip
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
S1C62M00(E0C62M2) series
The microcomputer of this seri es integrates ROM, RAM, double integral type A/D c onverter, LCD driver, tim er, and serial I/O port. This series is
best f i t for portable measuring i nstruments. Port Timer SIO Interru p ts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×12bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Event
Stopwatch
WDT
Clock
Asynchronous
Clock
synchronous
A/D
Comparator
RF Converter
Infrared output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C62M20
(E0C62M2) 2.15~3.5 3.0/900
Ú2 32.768K 1,536 128 8 4 4 --- --- --- { { --- 1 3
Ú3 --- --- --- { 2 3 16×4 QFP5-80
QFP14-80
Chip
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Consumption current at the time of measuring A/D.
Ú3: Dual slope type.
46
MCUs
-2 High Performance 4-bit Microcomputers
High performance 4-bit single-
chip microcomputers
S1C63(E0C63)Family：
Application-oriented
microcomputer
S1C63100(E0C63100) series
A microcomput er being equipped with ROM, RA M, seri al I/F, A/D converter, various t imer f unctions, etc. I t features buil t-i n A/D converter, wide
operating voltage range and l ow power consumption and is suit abl e for portable equipment.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×13bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
Buzzer
SVD
*1
DTMF output
DP output
FSK
demodulation circuit
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
0.9~3.6 32.768K
S1C63158
Ú4
(E0C63158) 2.2~3.6 2.0/4.0(32K)
900(4M) 32.768K/4M 8,192 512 9 12 20
2
Ú2 --- { { --- 1 4
Ú3 { { --- --- --- 3 8 --- Chip
QFP12-48
QFP13-64
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: 8 bits successive-approximation type and serves as general-purpose I/O.
Ú4: The S1C63P366 also serves as flash microcomputer for evaluating S1C63158.
S1C63200(E0C63200) series
A microcomputer being equipped with ROM, RAM, A/D converter, various timer functions, etc. It features wide operating voltage range and
wide working frequency range (0.5~4.5 MHz), suitable for application to the control units of household electric products and portable products
which require A/D conversion and LCD indi catinos. Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×13bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
Buzzer
SVD
*1
DTMF output
DP output
FSK
demodulation circuit
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C63256
(E0C63256) 2.7~5.5 740(3V,2M)/
1200(3V,2M)
Ú4 500K~4.5M 6,144 256 4 4 8 4
Ú2 --- { { --- --- 4
Ú3 { --- --- --- --- 1 5 20×4 Chip
QFP13-64
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: 8 bits successive-approximation type and serves as general-purpose I/O.
Ú4: At the time of Sleep is 0.3µA.
S1C63300(E0C63300) series
A microcomputer being equipped with ROM, RAM, LCD driver, A/D converter, various timer functions, etc. It features built-in A/D converter,
wide operating voltage range and low power consumption, suitabl e f or appl i cation t o portable product s which require LCD indic ations.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×13bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
Buzzer
SVD
*1
DTMF output
DP output
FSK
demodulation circuit
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
0.9~3.6 32.768K
S1C63358
(E0C63358) 2.3~3.6 2.0/6.0(32K)
900(4M) 32.768K/4M 8,192 512 8
S1C6P366Ú4
(E0C63P366) 2.7~5.5 2.5/120(32K)
800(4M) 32.768K/4M 16,384
(Flash) 2,560
9 12 20 2
Ú2 --- { { --- 1 4
Ú3 { { --- --- --- 3
4
32×4 Chip
QFP15-100
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: 8 bits successive-approximation type and serves as general-purpose I/O.
Ú4: This series also serves as flash microcomputer for evaluating S1C63158.
2 S1C63(E0C63)Family microcomputers integrate a wide variety of peripheral
circuits including ROM, RAM, I/O port, LCD driver into a single chip design with
CMOS 4-bit core CPU at their center. High speed operation has been realized
owing to a wide range of instructions and the high speed instruction cycle (2-6
CPI). Low voltage and low supply current are, same as S1C62(E0C62)
Family, additional features of this CMOS 4-bit microcomputer.
47
MCUs
S1C63400(E0C63400) series
A microcomput er being equipped with ROM, RAM, dot-m atri x LCD driver, various t imer f unctions, etc. It feat ures wide operating volt age range
and low power consumpti on and i s suit abl e f o r port abl e equi pment such as data banks which requi re dot-matrix indicati ons.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×13bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
Buzzer
SVD
Ú1
DTMF output
DP output
FSK
demodulation circuit
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
1.8~6.4 32.768K
S1C63454
(E0C63454) 2.2~6.4 1.0/10(32K)
1000(4M) 32.768K/4M 40×8/16/17 Chip
QFP15-100
1.8~6.4 32.768K S1C63455
(E0C63455) 2.2~6.4 1.0/10(32K)
1000(4M) 32.768K/4M
4,096 1,024 4 4 8 --- 1 9
60×8 Chip
QFP5-128
QFP8-128
1.8~6.4 32.768K S1C63458
(E0C63458) 2.2~6.4 1.0/10(32K)
1000(4M) 32.768K/4M 8,192 5,120
1.8~6.4 32.768K S1C63466
(E0C63466) 2.2~6.4 1.0/10(32K)
1200(4M) 32.768K/4M 16,384 1,792
8 12 12
2
Ú2 { { { --- 1 --- {
{
--- --- ---
2 9 60×8/16/17 Chip
QFP5-128
QFP8-144
QFP17-144
S1C6P466
(E0C63P466) 2.7~5.5 2.5/90(32K)
1000(4M) 32.768K/4M 16,384
(Flash) 5,120 8 12 12
2
Ú2 { { { --- 1 --- { { --- --- --- 2 4 60×8/16/17 Chip
QFP8-144
QFP17-144
1.2~3.6 32.768K
S1C63467 2.2~3.6
1.5/14(45K)
610(1.8M)
Ú3 32.768K/1.8M 16,384 2,304 8 14 16 --- ---
{ { --- 1 --- { { --- --- --- 2 5 60×8/9 Chip
QFP5-128
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: At the time of Sleep is 0.5µA.
S1C63500(E0C63500) series
A microcomputer being equipped with ROM, RAM, dot-matrix LCD driver, DTMF/DP generator, FSK demodulator, various timer functions, etc.
It features wide operating volt age rane and low power cons um ption and is sui table for communication-equipment and portable-equipment such
as data bank s and Caller-ID which requi re dot-mat ri x indic ations.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×13bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
Buzzer
SVD
Ú1
DTMF output
DP output
FSK
demodulation circuit
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C63557
(E0C63557) 1.5/10(32K)
1000(3.58M) 1 --- 2 10
S1C63558
(E0C63558) 1.5/10(32K)
600(3.58M)
8,192
2 {
Ú4 2 17
40×8/16/17 Chip
QFP15-128
S1C63567
(E0C63567)
2.2~5.5
1.5/10(32K)
1000(3.58M)
32.768K/
3.58M
16,384
5,120 8 12 16
2
Ú2 { { {
1
←
Ú3 --- { { { {
--- 2 12 60×8/16/17 Chip
QFP8-144
S1C6F567* 2.7~5.5 1.5/10(32K)
1000(3.58M) 32.768K/
3.58M 16,384
(Flash) 5,120 8 12 16
2
Ú2 { { { 1 ←
Ú3 --- { { { { --- 2 12 60×8/16/17 Chip
QFP8-144
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: Either start/stop system or clock synchronous system can be selected, depending on software.
Ú4: It conforms to the ITU-T V.23/Bell 202.
*: Under development
S1C63600(E0C63600) series
The microcomputer of this series integrates ROM, RAM, multiplication and division circuits, LCD driver, R/F converter, and a variety of timer
functions. Since this series features a wide range of operating voltage and low power consumption, it is best fit for portable equipment with
temperature measuring facilit y t hat requires battery-powered operation.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply current
HALT/
operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×13bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
Buzzer
SVD
Ú1
DTMF output
DP output
FSK
demodulation circuit
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
1.8~3.6 TBD 32.768K/2M
2.4~3.6 TBD 32.768K/4M
S1C63666*
2.4~3.6 TBD 32.768K
16,384 5,120 8 8 8 3
Ú2 { { { --- 1 2
Ú3 { { --- --- --- 1 5 64×8
1.8~3.6 TBD 32.768K/2M
2.4~3.6 TBD 32.768K/4M
S1C63658*
2.4~3.6 TBD 32.768K
8,192 1,028 8 8 8 3
Ú2 { { { --- 1 2
Ú3 { { --- --- --- 2 5 56×8
Chip
QFP20-144
TBD
TBD
S1C63F666* 2.7~3.6
TBD
32.768K/4M 16,384 5,120 8 8 8 3
Ú2 { { { --- 1 2
Ú3 { { --- --- --- 2 5 64×8 Chip
QFP20-144
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: R/F converter
*: Under development
48
MCUs
-2 High Performance 4-bit Microcomputers
S1C63A/B00(E0C63A/B0) series
A microcomputer being equipped with ROM, RAM, LCD driver, various timer functions, etc. Moreover, it carries built-in gate array for your
optional circ uit conf igurations. It features wide operating voltage range and high speed operation and is suitable for portable equipment such
as data bank s and pagers. Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
(V)
Supply
current
HALT/
operating
µA (Typ.)
Clock
frequency
Low/high
Hz (Typ.)
ROM
×13bit RAM
×4bit
Input
Output
Input / Output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
Buzzer
SVD
Ú1
DTMF output
DP output
FSK
demodulation circuit
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
0.9~3.6 32.768K
S1C63A08
(E0C63A08) 2.2~3.6 1.5/10(32K)
300(1M) 32.768K/1M 2,048 20 20 72×8/16/17 Chip
QFP8-208
S1C63B07
(E0C63B07) 1.2/6.0(32K)
85(400K)
14
60×4 Chip
QFP8-160
S1C63B08
(E0C63B08)
0.9~3.6 1.2/5.3(32K)
87.5(400K)
8,192
1,024
8
8 12
2
Ú2 { { { --- 1 --- { { --- --- --- 2
13 32×4 Chip
QFP15-100
S1C63B58*
Ú3 0.9~3.6 1.2/5.3(32K)
87.5(400K)
32.768K,
76.8K
153.6K/400K
8,192 1,024 8 8 12
2
Ú2 { { { --- 1 --- { { --- --- --- 2 5 32×4 Chip
QFP15-100
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: It incorporates POCSAG decoder and Use is possible also as logic area of 5K.
Notes: For customers who will use the S1C 63A08 and/or S1C63B0 7, they should m ake applications to our comp any regardless of t he use or non -use of melo dy
ROM, before working on software development.
As r egards t he cop yright i n Japan, we will file an ap plication for th e numb er to J apanese Societ y of Rig hts of A utho rs and C omposer (JAS RAC) an d take
care of the number involving the copyright.
*: Under development
2
49
MCUs
-3 Peripheral
FSK receiver
S1C05250(E0C5250) series
Includi ng FS K receiver & CAS tone det ector, E special l y s ui table for Call er-ID application with S1C063557(E0C63557).
Products
(Prev ious number)
Feature Package
S1C05250
(E0C5250)
y ITU V.23 & Bell 202 FSK receiver
y Bellcore "CPE Alerting Signal" (CAS) detection
y BT "Idle Tone Alert signal" detection. SOP-24pin
S1C05251
(E0C5251)
y ITU V.23 & Bell 202 FSK receiver
y Bellcore "CPE Alerting Signal" (CAS) detection
y BT "Idle Tone Alert signal" detection.
y FSK Energy detect mode
SOP2-28pin
2
50
MCUs
-4 8-bit Microcomputers
8-bit single-chip application-
oriented microcomputers
S1C88(E0C88)Family：
Application-oriented
microcomputer
S1C88100(E0C88100) series
S1C88100 series microcomputers equipped with a ROM, a RAM, serial I/Os, timers, external bus-line and analog comparators. Easy
connection to external ROM, RAM, peripherals and LCD drivers such as S1D15600(SED1560) series. Especially suitable for portable
equipments such as high-perf ormance data banks. Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operation
mode
(V)
Supply
current
Sleep/Halt/
operating
µA (Typ.)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
×8bit RAM
×8bit
External expansion
Max. (Byte)
Input
Output
Input/output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
D/A
Comparator
Buzzer output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C88104
(E0C88104) 4K
S1C88112
(E0C88112)
1.8~3.5/
Low speed
powers
2.4~5.5/
Normal
3.5~5.5/
High speed
0.3/
2.0/14(32K)
2000(4.2M)
32K/
Low powers
4.2M/ Normal
8.2M/
High speed 12K 256 2M 10
34
Ú2 16
Ú2 2
Ú4 1 { 1 1
←
Ú3 --- --- 2 { { 3 12 --- Chip
QFP14-80
QFP15-100
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: It doubles as external bus terminal.
Ú3: Either start/stop system or clock synchronous system can be selected, depending on software.
Ú4: Two 8 bits serve as a 16-bit timer.
S1C88300(E0C88300) series
S1C88300 series microcomputers are equipped with ROM, RAM, LCD driver, serial I/O, timers and external bus line. Easy connection to
external ROM, RAM, peripherals and LCD drivers. Especially suitable for portable equipments such as high-performance data banks and
pager. Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operation
mode
(V)
Supply
current
Sleep/Halt/
operating
µA (Typ.)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
×8bit RAM
×8bit
External expansion
Max. (Byte)
Input
Output
Input/output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
D/A
Comparator
Buzzer output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C88308
(E0C88308) 8K 256 9
30
Ú2
41×32
57×8/16
Expand-
able Ú5
Chip
QFP8-160
S1C88317
(E0C88317) 16K
S1C88348
(E0C88348)
0.3/
2.0/14(32K)
2000(4.9M) --- Chip
QFP8-160
QFP17-160
S1C88349*
1.8~3.5/
Low speed
powers
2.4~5.5/
Normal
3.5~5.5/
High speed TBD
32K/
Low powers
4.2M/
Normal
8.2M/
High speed 48K 2K 34
Ú2 4
Ú4
51×32
67×8/16
Expand-
able Ú5 Chip
QFP18-176
QFP21-176
S1C88365
(E0C88365) 2.2~5.5 0.3/
2.0/14(32K)
1500(2.5M) 32K/2.5M 64K 3K
2M
10
42
Ú2
16
Ú2 2
Ú6 1 { 1 1 ←
Ú3
---
--- 2 { { 3 12
80×18
Expand-
able Ú5 Chip
S1C8F360
(E0C88F360)
2.0~3.5/
Low speed
powers
2.4~5.5/
Normal
3.5~5.5/
High speed
0.3/
2.0/12(32K)
1500(4M)
32K/
Low powers
4.2M/
Normal
8.2M/
High speed
60K 2K 2M 10
34
Ú2 16
Ú2 2
Ú6 1 { 1 1 ←
Ú3 4
Ú4 --- 2 { { 3 12
51×32
67×8/16
Expand-
able Ú5
Chip
QFP18-176
QFP21-176
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: It doubles as external bus terminal.
Ú3: Either start/stop system or clock synchronous system can be selected, depending on software.
Ú4: 10 bits is used also I/O / general-purpose / a compared type and ] one by one. Since S1C88349 differs from A/D accuracy of S1C8F360, it should be careful.
Ú5: LCD extension is possible using a segment driver.
Ú6: Two 8 bits serve as a 16-bit timer.
* : Under development
2 Built around the S1C88000(E0C88000), SEIKO EPSON's powerful 8-bit core
CPU, the S1C88(E0C88) Family lineup integrates a wide choice of ROM and
RAM sizes, LCD drivers, serial ports and other high-performace peripheral
circuits into a single chip design. All devices are fabricated using
power-saving, low voltage (1.5, 3.0 or 5.0V) technology.
51
MCUs
S1C88400(E0C88400) series
S1C88400 Series microcomputers are being equipped with ROM, RAM, LCD controller, serial I/C, timer, etc. Featuring external buses, for
easy connection of ROM, RAM and peripherals with outstanding extendibility. As they carry a built-in LCD controller, they are most suitable
for applic ations t o panel systems of intermediate capacit y l evel s. Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operation
mode
(V)
Supply
current
Sleep/Halt/
operating
µA (Typ.)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
×8bit RAM
×8bit
External expansion
Max. (Byte)
Input
Output
Input/output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
D/A
Comparator
Buzzer output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
1.8~5.5 1.1M
2.6~5.5 4.4M
S1C88408
(E0C88408) 3.5~5.5
0.6/
3.0/15(32K)
2000(4M) 8.2M
--- --- 5 15
1.8~5.5 1.1M
2.6~5.5 4.4M
3.5~5.5 6.6M
S1C88409
(E0C88409)
4.5~5.5
0.6/
3.0/15(32K)
2000(4M)
/9000(8M) 8.8M
8K 3.75K
Ú7 12M 12
30
Ú2 28
Ú2 3
Ú3 --- { 1 1
←
Ú4 8
Ú5 2
Ú6
--- { {
5 18
---
(LCDC
included)
Chip
QFP15-100
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: It doubles as external bus terminal.
Ú3: Two 8 bits serve as a 16-bit timer.
Ú4: Either start/stop system or clock synchronous system can be selected, depending on software.
Ú5: It is a 10-bit successive approximation type and doubles as general-purpose I/O.
Ú6: It doubles as general-purpose I/O.
Ú7: It doubles as RAM for display (set by mask option.)
S1C88800(E0C88800) series
S1C88800 Series mic rocom put ers are equipped with ROM, RAM, LCD Dri ver, serial I/O and timers. Cannot acc ess external m emory.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operation
mode
(V)
Supply
current
Sleep/Halt/
operating
µA (Typ.)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
×8bit RAM
×8bit
External expansion
Max. (Byte)
Input
Output
Input/output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
D/A
Comparator
Buzzer output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C88832
(E0C88832) 32K 5 --- --- --- {
51×32
67×8/16
Non-
expand-
able
S1C88862
(E0C88862)
0.3/1.5/
9(32K)/
1100(4M)
60K
1.5K
4
8
--- --- --- {
3 12 41×32
57×8/16
Non-
expand-
able
QFP8-128
QFP15-128
Chip
S1C88816
(E0C88816)
1.8~3.5/
Low power
2.4~5.5/
Normal
3.5~5.5/
High speed
0.45/1.5/
7.0(32K)
900(4M)
80K/
Low power
4.2M/ Normal
8.2M/ High
speed
116K 8K
--- 9
7 16
2
Ú2 1 { 1 1
←
Ú3
4
Ú4 --- --- {
Ú5
{
3 14
72×32
88×8/16
Non-
expand-
able
Chip
QFP18-176
QFP21-176
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: Either start/stop system or clock synchronous system can be selected, depending on software.
Ú4: It is a 10-bit successive approximation type and doubles as general-purpose I/O.
Ú5: A melody generator is included.
S1C88A00(E0C88A00) series
The microcomputer of this series integrat es ROM, RAM, LCD driver, and vari ous kinds of timer functi ons. In addition, it incorpo rat es a gate array,
which enables users to freely form circuits. Since this series provides a wide range of operating voltage and fast operation, it is best fit for
electroni c memorandum equi pment and pager. Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operation
mode
(V)
Supply
current
Sleep/Halt/
operating
µA (Typ.)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
×8bit RAM
×8bit
External expansion
Max. (Byte)
Input
Output
Input/output
Programmable
8bit
Stopwatch
WDT
Clock
Asynchronous
Clock synchr onous
A/D
D/A
Comparator
Buzzer output
SVD
Ú1
External
Internal
LCD
Driver
seg×com
Package
(Form of
delivery)
S1C88A32*
(E0C88A32)
Ú4
1.8~3.6/
Low speed
2.4~3.6/
Normal
TBD 160K/ Low
speed
6.0M/ Normal 32K 512 2M 8 29 16
2
Ú2 1 { 1 1
←
Ú3 --- --- --- { { 2 16
57×32
73×8/16
Expand-
able
Chip
QFP18-176
QFP21-176
{ : Available
Ú1: SVD is an abbreviation for Supply Voltage Detector.
Ú2: Two 8 bits serve as a 16-bit timer.
Ú3: Either start/stop system or clock synchronous system can be selected, depending on software.
Ú4: Use is possible also as logic area of POCSAG decoder built-in and user gate 5K.
* : Under development
52
MCUs
-5 32-bit Microcomputers
32 bit RISC
Microcomputers
S1C33200 series
With S1C33209(E0C33209) as the dominant constituent, this is a general-purpose series equipped with MaskROM and flash memory. It
features a rich lode of peripheral equipment and low current consumpti on. Its application has been widespread, including port able terminals and
TOY. Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operating
section
(V)
Supply
current
Sleep (Typ.)
/operationg
(50MHz,
3.3V)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
(Byte) RAM
(Byte)
Input
Input/output
8bit 16
bit PWM WDT
Asynchronous
Clock
synchronous
ADC
10bit DMA
External
Internal
Package
(Form of
delivery) Remarks
2.7~3.6/
Inside
2.7~5.5/I/O
S1C33209
(E0C33209) 1.8~2.7/
Inside
1.8~3.6/I/O
4µW
/215mW
60M/High
speed
32.768K/Low
speed
--- 8K 13 29 6 6 { 1 4
Ú1 8ch 4ch
128ch 10 29
Chip
QFP5-128
QFP15-128
32 bit RISC
ROMLess
model
S1C33222*
(E0C33264)
2.7~3.6/
Inside
2.7~5.5/I/O 64K Chip
QFP5/15-128
S1C33221
(E0C332129)
1.8~2.7/
Inside
1.8~3.6/I/O
4µW
/215mW
50M/High
speed
32.768K/Low
speed 128K
8K 13 29 6 6 { 1 4
Ú1 8ch 4ch
128ch 10 29
QFP5/15-128
S1C33209
MaskROM
model
S1C33240*
(E0C332F128)
2.7~3.6/
Inside
2.7~5.5/I/O
50µW
/280mW
(40MHz,3.3V)
40M/High
speed
32.768K/Low
speed
128K
Flash 8K 13 29 6 6 { 1 4
Ú1 8ch 4ch
128ch 10 29 QFP5-128
QFP15-128
S1C33209
FlashROM
model
{ : Available
Ú1 : Software setting
* : Under development
S1C33L00 series
Incorporation of a LCD controller in a 32-bit RISC microcomputer significantly contributes to a decrease in mounting area and a reduction in
power consumption in dis pl ay-centered applications such as port abl e termi nal .
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operating
section
(V)
Supply
current
Sleep (Typ.)
/operating
(50MHz,
3.3V)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
(Byte) RAM
(Byte)
Input
Input/output
8bit 16
bit PWM WDT
Asynchronous
Clock
synchronous
ADC
10bit DMA
External
Internal
Package
(Form of
delivery) Remarks
2.7~3.6/
Inside
2.7~5.5/I/O
S1C33L01
(E0C332L01) 1.8~2.7/
Inside
1.8~3.6/I/O
4µW
/ 230mW
50M/High
speed
32.768K/Low
speed
128K 8K
VRAM:
40K 13 29 4 6 { 1 2
Ú1 8ch 4ch
128ch 10 29 QFP18-176
LCDC-
integrated
model
(Monochrome
and color)
2.7~3.6/
Inside
2.7~5.5/I/O
S1C33L02*
(E0C332L02) 1.8~2.7/
Inside
1.8~3.6/I/O
T.B.D
50M/High
speed
32.768K/Low
speed
--- 8K 13 29 4 6 { 1 2
Ú1 8ch 4ch
128ch 10 29 Chip
QFP20-144
LCDC-
integrated
model
(Monochrome)
{ : Available
Ú1 : Software setting
*: Under development
S1C33T00 series
This seri es feature f urther enhanced peripheral functi ons, inc l udi ng I /O ports, built-i n t i mer, 1 2C bus , and the number of interruptions.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operating
section
(V)
Supply
current
Sleep (Typ.)
/operating
(50MHz,
3.3V)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
(Byte) RAM
(Byte)
Input
Input/output
8bit 16
bit PWM WDT
Asynchronous
Clock
synchronous
ADC
10bit DMA
External
Internal
Package
(Form of
delivery) Remarks
2.7~3.6/
Inside
2.7~5.5/I/O
S1C33T01
(E0C332T01) 1.8~2.7/
Inside
1.8~3.6/I/O
4µW
/ 215mW
60M/High
speed
32.768K/Low
speed
--- 8K 13 69 6 10 { 1 4
Ú1 8ch 4ch
128ch 18 51 QFP18-176
A 12C-bus
compatible,
enhanced
peripheral
functions
Ú2
{ : Available
Ú1 : Software setting
Ú2 : I2C-bus correspondence is option specification.
2 S1C33(E0C33) family is SEIKO EPSON’s original 32-bit RISC CPU. The
product incorporates peripheral functions in abundance, including rapid DMA,
multi-channel SIO, programmable timer, PLL, and pre-scaler. Features of fas
t
operation and extremely low power consumption qualify this family fo
r
application to OA equipment such as printer and portable equipment, including
PDA and TOY. In addition, as this family incorporates A/D converter and PWM
timer, its combination with middleware provides digital signal processing such
as voice
p
rocessin
g
.
53
MCUs
S1C33S00 series
Downsizing of a package and low power consumpt i on has been achieved by narrowing down functi ons on S1C33200 seri es to specific ones.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operating
section
(V)
Supply
current
Sleep (Typ.)
/operating
(50MHz,
3.3V)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
(Byte) RAM
(Byte)
Input
Input/output
8bit 16
bit PWM WDT
Asynchronous
Clock
synchronous
ADC
10bit DMA
External
Internal
Package
(Form of
delivery) Remarks
S1C33S01
(E0C332S08) 1.8~3.6 4µW/195mW
50M/High
speed
32.768K/Low
speed
--- 8K --- 29 4 6
{ 1 2
Ú1 --- --- 10 23 Chip
QFP15-100 S1C33209
Diet model
{ : Available
Ú1 : Software setting
S1C33 Special-purpose line-up
As I/F circuit linking to PHS, PDC, and CdmaOne is incorporated i nto this product line-up, It c an be used f or data communications e tc . bet wee n
com munic ation terminals by combi ni ng with software m odem module.
Port Timer SIO Interrupts
Products
(Prev ious number)
Supply
voltage
range
operating
section
(V)
Supply
current
Sleep (Typ.)
/operating
(50MHz,
3.3V)
Clock
frequency/
operation
mode
Hz (Max.)
ROM
(Byte) RAM
(Byte)
Input
Input/output
8bit 16
bit PWM WDT
Asynchronous
Clock
synchronous
ADC
10bit DMA
External
Internal
Package
(Form of
delivery) Remarks
S1C33210
(E0C33210) 2.7~3.6 T.B.D
60M/High
speed
32.768K/Low
speed
--- 8K 7 25 6 6
{ 1 3
Ú1 8ch 4ch
128ch 10 29 QFP15-128 Bridge IC for
communication
terminal
{ : Available
Ú1 : Software setting
S1C33104(E0C33A104) and S 1C33208/204/202(E0C33208/ 204/202) are not listed because they are old t ypes .
For new development, we recomm end you t o use a suc cessor to the old vers i on, S1C33209(E0C33209).
54
MCUs
-6 Microcomputer Development
Program development process (S1C62/60 Family)
The relationship between the S1C62(E0C62) Family program development procedure and development tools is illustrated
below.
[Operation] [Development procedure] [Development tools] [Documentations]
Selecting the most suitable
microcomputer for the product
specifications, system designs to
meet the product specifications
are started. Then, outline flows
of the hardware specifications
and application softwares are
determined.
Data Sheet
(Technical Manual)
Technical Manual
The outline flow of the application
programs are converted into
detail flows to finalize the
program flow. Completed detail
flow is then converted into
instructions to microcomputers.
S1C6200/S1C6200A
Core CPU Manual
Coded application of programs
are input into the host system
through the editor to use as the
source programs.
Object programs are made out
from the source programs by
cross assemblers
S5U1C62000A (AS M62) Development Tool Manual#
Ass embler Package Manual#
The system operations are
checked using the object
programs and evaluation tools. S5U1C62∗∗∗E, (EVA62∗∗)
S5U1C62000A (AS M62)
S5U1C62000H2 (ICE62R)
S5U1C62000H Manual#
Ass embler Package Manual#
S5U1C62∗∗∗E Manual#
Development tool Manual#
After making sure the system is
operating properly by use of the
program evaluation tools, data
are produced to make into mask
ROM.
S5U1C62∗∗∗E, (EVA62∗∗)
S5U1C62000A (AS M62)
S5U1C62000H2 (ICE62R)
Ass embler Package Manual#
S5U1C62000H Manual#
S5U1C62∗∗∗E Manual#
Development tool Manual#
Comment: Development tools and documentations for S1C60(E0C60) Family are common to those for S1C62(E0C62) Family
depending on models.
# : Included in respective development tool set.
2
1. Determining on the
product s pecifications
2. Syst em desi gns
Determ i ni ng on the
microcom
p
uter choice
3. Settin
g
out the fl ow chart
4. Codin
g
5. Assembl
y
6. Pro
g
ram evaluation
7. Making into the mask ROM
Preparing for submission data
8. Orderin
g
for sam
p
lin
g
55
MCUs
Program development process (S1C63 Family)
The relationship between the S1C63(E0C63) Family program development procedure and development tools is illustrated
below.
[Operation] [Development procedure] [Development tools] [Documentations]
Select the most suitable
microcomputer for your product
specifications, then design the
system required by the
specifications. Based on the
system specifications, determine
the hardware specifications and
the general flow chart of the
application software.
Data Sheet
(Technical Manual)
Technical Manual
Revise the general flow chart of
the application software into a
detailed flow chart so as to
determine the program flow.
Convert the detailed flow chart
into instructions for the
microcomputer.
S1C63000
Core CPU Manual
Load the coded application
program into the host system
using the editor, thereby making
it the source program.
Generate the object program
from the source program using
the cross assembler.
S5U1C63000A (AS M63) A ssembler Pac kage Manual#
Confirm the proper operation of
the system using the object
program and evaluation tools. S5U1C63000H2, (I CE63)
S5U1C63∗∗∗P (P RC63∗∗∗)
S5U1C63000A (AS M63)
(S5U1C88000Q1 *1)
S5U1C63000H2 Manual#
S5U1C63∗∗∗P Manual#
Ass embler Packege Manual
Development tool Manual#
After confirming that the proper
operation of the system using the
evaluation tools, generate the
data necessary to mask the
ROM.
S5U1C63000H2, (ICE63)
S5U1C63∗∗∗P (P RC63∗∗∗)
S5U1C63000A (AS M63)
(S5U1C88000Q1 *1)
S5U1C63000H2 Manual#
S5U1C63∗∗∗P Manual#
Ass embler Packege Manual
Development tool Manual#
# : Included in respective development tool set
*1: S1C63/88(E0C63/88) Family embedded system simulator
1. General s
p
ecifications
2. Syst em desi gns and
microcomputer
model select i on
3. Draw flow charts
4. Codin
g
5. Assembl
y
6. Pro
g
ram evaluation
7. Generate mask
producing data
8. Sam
p
le order
p
lacemen
t
56
MCUs
-6 Microcomputer Development
Program development process (S1C88 Family)
The relationship between the S1C88(E0C88) Family program development procedure and development tools is illustrated
below.
[Operation] [Development procedure] [Development tools] [Documentations]
Select the most suitable
microcomputer for your product
specifications, then design the
system required by the
specifications. Based on the
system specifications, determine
the hardware specifications and
the general flow chart of the
application software.
Data Sheet
(Technical Manual)
Technical Manual
Revise the general flow chart of
the application software into a
detailed flow chart so as to
determine the program flow.
Convert the detailed flow chart
into instructions for the
microcomputer. #1
S1C88 Fami l y
Core CPU Manual
Load the coded application
program into the host system
using the editor, thereby making
it the source program.
Generate the object program
from the source program using
the cross assembler.
S5U1C88000C1
(Software tool *1) S5U1C88000C1 Manual#
Confirm the proper operation of
the system using the object
program and evaluation tools.
S5U1C88000H5 (ICE88UR)
S5U1C88∗∗∗P (P RC88∗∗∗)
S5U1C88000C1
(Software tool *1)
(S5U1C88000Q1 *2)
S5U1C88000C1 Manual#
S5U1C88000H5 Manual#
S5U1C88∗∗∗P Manual#
Development tool Manual#
After confirming that the proper
operation of the system using the
evaluation tools, generate the
data necessary to mask the
ROM.
S5U1C88000H5 (ICE88UR)
S5U1C88∗∗∗P (P RC88∗∗∗)
S5U1C88000C1
(Software tool *1)
(S5U1C88000Q1 *2)
S5U1C88000C1 Manual#
Development tool Manual#
# : Included in respective development tool set
*1 : C compiler assembler package for S1C88(E0C88)
*2 : S1C63/88(E0C63/88) Family embedded system simulator
2
1. General s
p
ecifications
2. Syst em desi gn and
microcomputer
model select i on
3. Draw flow charts
4. Codin
g
5. Assembl
y
6. Pro
g
ram evaluation
7. Generate mask
producing data
8. Sam
p
le order
p
lacemen
t
57
MCUs
Program development process (S1C33 Family)
The relationship between the S1C33(E0C33) Family program development procedure and development tools is illustrated
below.
[Operation] [Development procedure] [Development tools] [Documentations]
Select the most suitable
microcomputer for your product
specifications, then design the
system required by the
specifications. Based on the
system specifications, determine
the hardware specifications and
the general flow chart of the
application software.
Data Sheet
(Technical Manual)
Technical Manual
Revise the general flow chart of
the application software into a
detailed flow chart so as to
determine the program flow.
Convert the detailed flow chart
into instructions for the
microcomputer. #1
S1C33 Fami l y
Core CPU Manual
Load the coded application
program into the host system
using the editor, thereby making
it the source program.
Generate the object program
from the source program using
the c-compiler and cross
assembler.
S5U1C33000C (CC33) S 1C33C-Compiler Package
Manual#
Confirm the proper operation of
the system using the object
program and evaluation tools.
S5U1C33000H (ICD33)
S5U1C33000C (CC33) S 1C33C-Compiler Package
Manual#
S5U1C33000H Manual#
After confirming that the proper
operation of the system using the
evaluation tools, generate the
data necessary to mask the
ROM.
S5U1C33000H (ICD33)
S5U1C33000C (CC33) S 1C33C-Compiler Package
Manual#
S5U1C33000H Manual#
# : Included in respective development tool set
1. General s
p
ecifications
2. Syst em desi gn and
microcomputer
model select i on
3. Draw flow charts
4. Codin
g
5. Com
p
iler
6. Pro
g
ram evaluation
7. Generate mask
producing Data
8. Sam
p
le order
p
lacement
58
MCUs
-6 Microcomputer Development
Development tools
S1C62 Family/S1C60 Family development tools
Hardware
S5U1C62000H2
(ICE62R) S1C60,62 Family Common
In-circuit emulator
S5U1C62∗∗∗E
(EVA62∗∗) Evaluation board
S5U1C60∗∗∗K
(KIT60∗∗) S1C60∗∗ Individual ROM
Software package
S5U1C62000A
(ASM62) E0C60, 62 Family Common Tool
(including model-by-model software tool)
S1C63 Family development tools
Hardware
S5U1C63000H2
(ICE63) S1C63 Fa mily Common
In-circuit emulator
S5U1C63∗∗∗P
(PRC63∗∗∗) Peripheral circuit board
Software package
S5U1C63000A
(ASM63) S1C63 Family Common tool
(including model-by-model software tool)
S1C33 Family development tools
Hardware
S5U1C33000H
(ICD33) S1C33 Fa mily Common
Omitted pin type On-chip ICE
S5U1C33∗∗∗E
(EPOD33∗∗∗) ROM Emulation board
S5U1C33∗∗∗D
(DMT33∗∗∗) Demonstration board
S5U1C33∗∗∗M
(MEM33∗∗∗) Emulation memory board
Software package
S5U1C33000C
(CC33) S1C33 Family Common
C Compiler package
Middleware package
S5U1C330V1S
(VOX33) Voice compression and
decompression middleware
S5U1C330J1S
(JPEG33) JPEG decompression middleware
S5U1C330R1S
(ROS33) Realtime OS
S5U1C330M2S
(MON33) Debug monitor
S5U1C330M1S
(MELODY33) Melody
S5U1C330V2S
(VRE33) Voice recognition
S5U1C330S1S
(SOUND33) Sound playback
S5U1C330T1S
(TS33) Text to Speach
S5U1C330C1S
(CF33) CompactFlash Interface
S5U1C330G1S
(GRAPHIC33) Graphic Library
S5U1C330H1S* Voice recognition, a version with more functionality
S5U1C330P1S* Handwritten character recognition
S5U1C330S2S* Smart media card Interface
* : Under development
S1C88 Family development tools
Hardware
S5U1C88000H5
(ICE88UR)
S1C88 Fa mily Common
In-circuit emulator
(USB interface)
S5U1C88∗∗∗P
(PRC88∗∗∗) Peripheral circuit board
S5U1C88348T
(DMT88348-DB) Demonstration board
Software package
S5U1C88000C1 S1C88 Family Common
(C compiler assembler package for S1C88)
Flash writing tool
Hardware
S5U1C88000W1
(URM00002) ROM Writer
S5U1C88∗∗∗X1
(ADP88∗∗∗) Socket for parallel writing (S1C88∗∗∗)
S5U1C63∗∗∗X1
(ADP63∗∗∗) Socket for parallel writing (S1C63∗∗∗)
S5U1C88000X1
(ADS00002) Socket for serial writing
S5U1C88000W2
(GWH00002) Gang writer
S1C63/S1C88 Option Soft tool
S5U1C88000Q1 S1C63/S1C88 Family embedded system
simulator
2
Section 3
ASSPs
LCD controllers S1D13000 series
Page
60~61
62
63~66
67
66~68
68
68
LCD drivers
MPU
interface
LCD controller
interface
LCD drivers for small
and medium displays
LCD drivers for
large displays
Drivers Thermal-head
drivers
LED printer-head
drivers
S1D12000 series
Interface ICs
IEEE1394
controller
USB2.0
device controller
S1R72800/72900
series
Power supply ICs
Melody ICs
Melody ICs
Music generators
ICs
Multi music type
S1V75700 series
S1V71000 series
S1V75600 series
S1D15000 series
S1D16000 series
S1D17000 series
S1D18000 series
S1D19000 series
S1D50000 series
S1D40000 series
69
69
S1R72000 series
70
70
70
S1F70000 series 71~73
74~76
74~75
SCSI con troller S1R72100 series
60
ASSPs
-1 LCD Controllers
LCD Cont rollers
● For small- and medium-sized displays
S1D13305 series
These controllers are used for displaying characters and graphics on small-to-medium- sized LCD panels. A character generator built in this
series enabl es to overlap c haracter and graphic screens .
Products
(Previous number) Maximum display area CPU interface Target LCD panels Display memory Package
S1D13305F00A
(SED1335F0A) 640×256×3 68-series, 80-series STN Maximum 64KB QFP5-60pin
S1D13305F00B
(SED1335F0B) (Composition of 3
screens) (8bit) SRAM QFP6-60pin
S1D13503/13700 series
This series features low power consumption and space-s aving with a video random access memory (VRAM) incorporated in the cont roller. This
series provi des displ ay from monochrome to a maximum of 64K colors.
Maximum display area CPU interface Target LCD panels Target LCD panels Package Evaluation board
Chip
QFP5-100pin
640×200
(256 color)
68-series, 80-series
(8/16 bit)
ISA bus
STN (4/8/16 bits)
Maximum 128KB
SRAM
QFP15-100pin
S5U13503P00C
(SDU1353#0C)
240×160
(256 color)
SH3/4, Mips-type
68-series, 80-series,
ISA bus
STN
TFT, D -TFD 40KB
Built-in SRAM QFP14-80pin S5U13704P00C
(SDU1374#0C)
320×240
(256 color)
SH3/4, Mips-type
68-series, 80-series,
ISA bus
STN
TFT, D -TFD 80KB
Built-in SRAM QFP14-80pin S5U13705P00C
(SDU1375#0C)
TQFP15-100pin
CFLGA-104pin
160×240
(64K color)
SH3/4, Mips-type
68-series, 80-series
No WAIT CPU
STN
TFT, D -TFD
80KB
Built-in SRAM
Chip
S5U13706P00C
(SDU1376#0C)
TQFP15-100pin
PFBGA-121pin
160×240
(64K color)
SH3/4, Mips-type
68-series, 80-series
No WAIT CPU
STN
TFT, D -TFD
80KB
Built-in SRAM
Chip
S5U13708P00C*
(SDU1378#0C*)
* : Under development
S1D13A00 series
This series not only offer display memory (VRAM), but also more functionality by incorporating USB client and 2D accelerator. In addition, it
provides low power consum ption and saves space.
Products
(Previous number) Maximum display area CPU interface Target LCD panels Target LCD panels Package Evaluation board
S1D13A03F00A*
(SED13A3F0A*) TQFP15-100pin
S1D13A03B00B*
(SED13A3B0B*)
320×160
(64K color)
SH3/4, Mips-type
68-series, 80-series
No WAIT CPU
STN
TFT, D -TFD 112KB
Built-in SRAM PFBGA-121pin
S5U13A03P00C*
（SDU13A3#0C*）
S1D13A04B00B*
(SED13A4B0B*)
320×240
(64K color)
SH3/4, Mips-type
68-series, 80-series
No WAIT CPU
STN
TFT, D -TFD 160KB
Built-in SRAM PFBGA-121pin S5U13A04P00C*
（SDU13A4#0C*）
S1D13A05B00B*
(SED13A5B0B*) 320×320
(64K color)
SH3/4, Mips-type
68-series, 80-series
No WAIT CPU
STN
TFT, D -TFD 200KB
Built-in SRAM PFBGA-121pin S5U13A05P00C*
（SDU13A5#0C*）
* : Under development
3 Our LCD controllers feature high performance, low power consumption which
was achieved by applying an original architecture based on our own "saving
technology". These LCD controllers can be used on a variety of CPUs. Since
the product line-up listed below allows to support a wide range of LCD panels,
including those from small to large scale and those from monochrome to color,
these controllers are best suited to office automation equipment and Windows
CE installed equipment.
Products
(Previous number)
S1D13503D00A
(SED1353D0A)
S1D13503F00A
(SED1353F0A)
S1D13503F01A
(SED1353F1A)
S1D13704F00A
(SED1374F0A)
S1D13705F00A
(SED1375F0A)
S1D13706F00A
(SED1376F0A)
S1D13706B00A
(SED1376B0A)
S1D13706D00A*
(SED1376D0A*)
S1D13708F00A*
(SED1378F0A*)
S1D13708B00B*
(SED1378B0B*)
S1D13708D00A*
(SED1378D0A*)
61
ASSPs
● For large-sized displays
S1D13500/13800 series
This series consists of LCD and CRT control lers that c an be widely used on various types of CPU and LCD panels. Full evaluati on environm ent
of this series al l ows t o easily evaluate the control l er.
Products
(Previous number) Maximum display area CPU interface Target LCD panels Display memory Package Evaluation board
QFP15-128pin
TQFP15-128pin
800×600
(64K color)
SH3, Mips-type
68-series, 80-series,
ISA bus
STN (4/8/16 bits)
TFP (16 bits)
CRT
Maximum 2MB
DRAM (FPM/EDO)
QFP20-144pin
S5U13504P00C
(SDU1354#0C)
800×600
(64K color)
SH3, Mips-type
68-series, 80-series,
ARM-type, ISA bus
STN (4/8/16 bits)
TFT (16 bits)
CRT
Maximum 2MB
DRAM (FPM/EDO) QFP15-128pin S5U13505P00C
(SDU1355#0C)
800×600
(64K color)
SH3/4, Mips-type
68-series, 80-series,
ARM-type, ISA bus
STN, TFT
CRT
TV (NTSC, PAL)
Maximum 2MB
DRAM (FPM/EDO) QFP15-128pin S5U13506P00C
(SDU1356#0C)
800×600 (64K color)
1024×768 (256 color)
SH3/4, Mips-type
68-series, 80-series,
ARM-type, ISA bus
STN, TFT
CRT
TV (NTSC, PAL)
10Mbit
Built-in SDRAM QFP20-144pin S5U13806P00C
(SDU1386#0C)
* : Under development
S1D13504F00A
(SED1354F0A)
S1D13504F01A
(SED1354F1A)
S1D13504F02A
(SED1354F2A)
S1D13505F00A
(SED1355F0A)
S1D13506F00A
(SED1356F0A)
S1D13806F00A
(SED1386F0A)
62
ASSPs
-2 LCD Controller-drivers and Drivers
LCD controller-drivers for
small-sized displays
S1D12000 series
Products
(Previous number)
Supply
voltage range
(V)
LCD
voltage range
(V) Duty Segment Common
Display
RAM
(characters)
Micropro-
cessor
interface Package Comment
S1D12200D
(SED1220D) Au bump chip
S1D12200T
(SED1220T)
2.4~3.6 4.0~7.0 1/26 64 26 40 4 or 8-bit
serial TCP
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12201D
(SED1221D) Au bump chip
S1D12201T
(SED1221T)
2.4~3.6 4.0~7.0 1/18 64 18 40
4 or 8-bit
serial TCP
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12210D∗∗
(SED122AD) 2.4~3.6 4.0~7.0 1/18 64 18 40
4 or 8-bit
serial Au bump chip
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12202D
(SED1222D) 2.4~3.6 4.0~7.0 1/18 60 18 40
4 or 8-bit
serial Al pad chip
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12205D
(SED1225D) Au bump chip
S1D12205T
(SED1225T)
1.8~3.6 4.0~6.0 1/18,1/26 60 26 40 4 or 8-bit
serial TCP
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12300D
(SED1230D) Au bump chip
S1D12300T
(SED1230T)
2.4~3.6 4.0~12.0 1/30 65 30 48 4 or 8-bit
serial TCP
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12301D
(SED1231D) Au bump chip
S1D12301T
(SED1231T)
2.4~3.6 4.0~12.0 1/23 65 23 48 4 or 8-bit
serial TCP
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12302D
(SED1232D) Au bump chip
S1D12302T
(SED1232T)
2.4~3.6 4.0~12.0 1/16 65 16 48 4 or 8-bit
serial TCP
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12303D
(SED1233D) Au bump chip
S1D12303T
(SED1233T)
2.4~3.6 4.0~12.0 1/16 80 16 48 4 or 8-bit
serial TCP
Built-in power circuit for LCD
Three standard characters
(JIS,ASCII)
LCD static drive allowed
S1D12304D
(SED1234D) 2.4~3.6 4.0~12.0 1/30 62 30 48 4 or 8-bit
serial Al pad chip
Built-in power circuit for LCD
Three standard characters
（JIS,ASCII）
LCD dynamic drive only.
S1D12305D
(SED1235D) 2.4~3.6 4.0~12.0 1/16 62 16 48 4 or 8-bit
serial Al pad chip
Built-in power circuit for LCD
Three standard characters
（JIS,ASCII）
LCD dynamic drive only.
S1D12400D
(SED1240D) Au bump chip
S1D12400T
(SED1240T)
1.8~3.6 4.0~10.0 1/18,1/34 80 34 80 4 or 8-bit
serial TCP Line Blink, Vertical Scroll
3 Built-in character generators together with segement and common drivers
simplify the task of displaying microprocessor messages on small LCDs.
63
ASSPs
LCD drivers with RAM for small
and medium-sized displays
S1D15000 series
Products
(Previous number)
Supply
voltage
range (V)
LCD
voltage
range
(V) Duty
Segment Common
Display
RAM
(bits)
Micropro-
cessor
interface Frequency
(kHz) Package Comment
S1D15100D00C∗
(SED1510D0C) Al pad chip
S1D15100F00C∗
(SED1510F0C) 0.9~6.0 1.8~6.0 1/4 32 4 128 bits Serial 18
(internal) QFP12-48pin Small segment-type LCD
display.
S1D15206D∗∗A∗
(SED1526D∗A) Al pad chip
S1D15206D∗∗B∗
(SED1526D∗B) Au bump chip
S1D15206F∗∗A∗
(SED1526F∗A) QFP5-128pin
S1D15206T∗∗A∗
(SED1526T∗A)
2.4~6.0 3.5～
Supply
voltage×3 1/8,1/9,
1/16,1/17 80 17 80×33
bits 8-bit parallel
or serial 20
TCP
(DC/DC×3)
(
S1D15206
*
00
**
, VREG)
(
S1D15206
*
14
**
, no VREG)
S1D15208D∗∗A∗
(SED1528D∗A) Al pad chip
S1D15208D∗∗B∗
(SED1528D∗B) Au bump chip
S1D15208F∗∗A∗
(SED1528F∗A) QFP5-128pin
S1D15208T∗∗A∗
(SED1528T∗A)
2.4~6.0 3.5~
Supply
voltage×3 1/32,1/33 64 33 80×33
bits 8-bit parallel
or serial 20
TCP
(DC/DC×3)
(
S1D15208*00**
*,VREG)
(
S1D15208*14**
, no VREG)
S1D15300D00A∗
(SED1530D0A) Al pad chip
S1D15300D10A∗
(SED1530DAA) Al pad chip
S1D15300D00B∗
(SED1530D0B) Au bump chip
S1D15300D10B∗
(SED1530DAB) Au bump chip
S1D15300T10A∗
(SED1530TAA)
2.4~6.0 4.5~16 1/32,1/33 100 33 132×65
bits 8-bit parallel
or serial ---
TCP
Built-in power circuit for
LCD
(DC/DC×4)
(S1D15300*00**,
Common: Right side)
(S1D15300*10**,
Common: Both side)
(S1D15300*10**,
Common: Left side)
S1D15301D00A∗
(SED1531D0A) Al pad chip
S1D15301D00B∗
(SED1531D0B) Au bump chip
S1D15301T00A∗
(SED1531T0A)
2.4~6.0 4.5~16 1/64,1/65 132 --- 132×65
bits 8-bit parallel
or serial ---
TCP
Built-in power circuit for
LCD
(DC/DC×4)
(S1D15301*00**,
Common: Right side)
S1D15302D00A∗
(SED1532D0A) Al pad chip
S1D15302D11A∗
(SED1532DBA) Al pad chip
S1D15302D00B∗
(SED1532D0B) Au bump chip
S1D15302D11B∗
(SED1532DBB) Au bump chip
S1D15302T00A∗
(SED1532T0A) TCP
S1D15302T11A∗
(SED1532TBA)
2.4~6.0 4.5~16 1/64,1/65 100 33 132×65
bits 8-bit parallel
or serial ---
TCP
Built-in power circuit for
LCD
(DC/DC×4)
(S1D15302*00**,
Common: Right side)
(S1D15302*10**,
Common: Both side)
(S1D15302***10**,
Common: Left side)
S1D15303D15B∗
(SED1533DFB) 2.4~6.0 4.5~16 1/17 116 17 132×65
bits 8-bit parallel
or serial --- Au bump chip Built-in power circuit for
LCD
(DC/DC×4)
(
S1D15303*15**
, no VREG)
S1D15400D00A∗
(SED1540D0A) Al pad chip
S1D15400D00B∗
(SED1540D0B) Au bump chip
S1D15400F00A∗
(SED1540F0A)
2.4~7.0 3.5~11 1/3,1/4 73 3,4 2,560
bits 8-bit parallel 18 (internal)
4 (external) QFP5-100pin
Small segment-type LCD
display.
S1D15600D00A∗
(SED1560D0A) Al pad chip
S1D15600D10A∗
(SED1560DAA) Al pad chip
S1D15600D00B∗
(SED1560D0B) Au bump chip
S1D15600D10B∗
(SED1560DAB) Au bump chip
S1D15600T00B∗
(SED1560T0B) TCP
S1D15600T26A∗
(SED1560TQA)
2.4~6.0 6.0~16
1/48,1/49,
1/64,1/65 102 65 166×65
bits 8-bit parallel
or serial 18
QTCP
Built-in power circuit for
LCD
(DC/DC×3)
(
S1D15600*00B*
, 1/9 bias)
(
S1D15600*10B*
, 1/7 bias)
Ultra-low power consumption and on-chip RAM make this series ideal fo
r
compact LCD-based equipment.
64
ASSPs
-2 LCD Controller-drivers and Drivers
Products
(Previous number)
Supply
voltage
range (V)
LCD
voltage
range
(V) Duty
Segment Common
Display
RAM Micropro-
cessor
interface Frequency
(kHz) Package Comment
S1D15601D00A∗
(SED1561D0A) Al pad chip
S1D15601D00B∗
(SED1561D0B) Au bump chip
S1D15601D10B∗
(SED1561DAB) Au bump chip
S1D15601T00B∗
(SED1561T0B) TCP
S1D15601T10B∗
(SED1561TAB) TCP
S1D15601T26A∗
(SED1561TQA)
2.4~6.0 6.0~16
1/24,1/25,
1/32,1/33 134 33 166×65
bits 8-bit parallel
or serial 18
QTCP
Built-in power circuit for
LCD
(DC/DC×3)
(
S1D15601*00B*
, 1/9 bias)
(
S1D15601*10B*
, 1/7 bias)
S1D15602D00A∗
(SED1562D0A) Al pad chip
S1D15602D00B∗
(SED1562D0B) Au bump chip
S1D15602T00B∗
(SED1562T0B) TCP
S1D15602T26A∗
(SED1562TQA)
2.4~6.0 6.0~16
1/16,1/17
(1/5 bias) 150 17 166×65
bits 8-bit parallel
or serial 18
QTCP
Built-in power circuit for
LCD
(DC/DC×3)
S1D10605D00B∗
(SED1065D0B) Au bump chip
S1D10605T00A∗
(SED1065T0A) 1.8~3.6 4.5~14 1/65
(1/7,1/9
bias) 132 65 132×65
bits 8-bit parallel
or serial 33 TCP
Built-in power circuit for
LCD
(DC/DC×4)
S1D10606D00A∗
(SED1066D0A) 1.8~3.6 4.5~14 1/49
(1/6,1/8
bias) 132 49 132×65
bits 8-bit parallel
or serial 33 Au bump chip Built-in power circuit for
LCD
(DC/DC×4)
S1D10607D00B
(SED1067D0B) 1.8~3.6 4.5~14 1/33
(1/5,1/6
bias) 132 33 132×65
bits 8-bit parallel
or serial 33 Au bump chip Built-in power circuit for
LCD
(DC/DC×4)
S1D10608D00B∗
(SED1068D0B) 1.8~3.6 4.5~14 1/55
(1/6,1/8
bias) 132 55 132×65
bits 8-bit parallel
or serial 33 Au bump chip Built-in power circuit for
LCD
(DC/DC×4)
S1D10609D00B∗
(SED1069D0B) 1.8~3.6 4.5~14 1/53
(1/6,1/8
bias) 132 53 132×65
bits 8-bit parallel
or serial 33 Au bump chip Built-in power circuit for
LCD
(DC/DC×4)
S1D15B10D0B∗
(Under
development) 1.7~3.6 5~16 1/65
(1/7,1/9
bias) 132 53 132×65
bits 8-bit parallel
or serial TBD Au bump chip Built-in power circuit for
LCD
(DC/DC×5)
S1D15605D11B∗
(SED1565DBB) Au bump chip
S1D15605D00B∗
(SED1565D0B) Au bump chip
S1D15605D01B∗
(SED1565D1B) Au bump chip
S1D15605D02B∗
(SED1565D2B) Au bump chip
S1D15605T00A∗
(SED1565T0A) TCP
S1D15605T00B∗
(SED1565T0B) TCP
S1D15605T00C∗
(SED1565T0C)
1.8~5.5 4.5~16 1/65
(1/7,1/9
bias) 132 65 132×65
bits 8-bit parallel
or serial 33
TCP
Built-in power circuit for
LCD
(DC/DC×4)
S1D15606D11B∗
(SED1566DBB) Au bump chip
S1D15606D00B∗
(SED1566D0B) Au bump chip
S1D15606D01B∗
(SED1566D1B) Au bump chip
S1D15606D02B∗
(SED1566D2B) Au bump chip
S1D15606T00A∗
(SED1566T0A)
1.8~5.5 4.5~16 1/49
(1/6,1/8
bias) 132 49 132×65
bits 8-bit parallel
or serial 33
TCP
Built-in power circuit for
LCD
(DC/DC×4)
S1D15607D11B∗
(SED1567DBB) Au bump chip
S1D15607D00B∗
(SED1567D0B) Au bump chip
S1D15607D01B∗
(SED1567D1B) Au bump chip
S1D15607D02B∗
(SED1567D2B) Au bump chip
S1D15607T00B∗
(SED1567T0B) TCP
S1D15607T00C∗
(SED1567T0C)
1.8~5.5 4.5~16 1/33
(1/5,1/6
bias) 132 33 132×65
bits 8-bit parallel
or serial 33
TCP
Built-in power circuit for
LCD
(DC/DC×4)
S1D15608D11B∗
(SED1568DBB) Au bump chip
S1D15608D00B∗
(SED1568D0B) 1.8~5.5 4.5~16 1/55
(1/6,1/8
bias) 132 55 132×65
bits 8-bit parallel
or serial 33 Au bump chip
Built-in power circuit for
LCD
(DC/DC×4)
S1D15609D11B∗
(SED1569DBB) Au bump chip
S1D15609D00B∗
(SED1569D0B) Au bump chip
S1D15609T∗∗∗∗
(SED1569T∗∗∗)
1.8~5.5 4.5~16 1/53
(1/6,1/8
bias) 132 53 132×65
bits 8-bit parallel
or serial 33
TCP
Built-in power circuit for
LCD
(DC/DC×4)
3
65
ASSPs
Products
(Previous number)
Supply
voltage
range (V)
LCD
voltage
range
(V) Duty
Segment
Common
Display
RAM Micropro-
cessor
interface Frequency
(kHz) Package Comment
S1D15A06D00B∗
(SED15A6D0B) 1.8~5.5 4.5~16 1/55 102 55 102×65
bits 8-bit parallel
or serial 33 Au bump chip Reduced ext. parts
S1D15B01D00B∗
(SED15B1D0B) Au bump chip
S1D15B01T00A∗
(SED15B1T0A) 1.8~5.5 4.5~16 1/65 132 65 132×65
bits 8-bit parallel
or serial 33 TCP Built-in self-refreshing
function
S1D15E00D00B∗
(SED15E0D0B) Au bump chip
S1D15E00T00A∗
(SED15E0T0A) 1.8~3.6 3.2~10 1/100 132 100
132×100
bits serial TBD TCP 4-line MLS X-driver
S1D15705D00B∗
(SED1575D0B) 3.6~5.5
S1D15705D03B∗
(SED1575D3B) 2.4~3.6 4.5~16 1/65 168 65
200×65
bits 8-bit parallel
or serial 22 Au bump chip Built-in power circuit for
LCD
(DC/DC×4)
S1D15705T00A∗
(SED1575T0A) 3.6~5.5
S1D15705T03A∗
(SED1575T3A) 2.4~3.6 4.5~16 1/65 168 65
200×65
bits 8-bit parallel
or serial 22 TCP
Built-in power circuit for
LCD
(DC/DC×4)
S1D15707D00B∗
(SED1577D0B) 3.6~5.5
S1D15707D03B∗
(SED1577D3B) 2.4~3.6 4.5~16 1/33 200 33
200×65
bits 8-bit parallel
or serial 22 Au bump chip Built-in power circuit for
LCD
(DC/DC×4)
S1D15707T00A∗
(SED1577T0A) 3.6~5.5
S1D15707T03A∗
(SED1577T3A) 2.4~3.6 4.5~16 1/33 200 33
200×65
bits 8-bit parallel
or serial 22 TCP
Built-in power circuit for
LCD
(DC/DC×4)
S1D15710D00B∗
(SED157AD0B) Au bump chip
S1D15710T00A∗
(SED157AT0A) 1.8~5.5 4.5~18 1/65 224 65 224×65
bits 8-bit parallel
or serial 22 TCP Built-in power circuit for
LCD
66
ASSPs
-2 LCD Controller-drivers and Drivers
MLS drivers for medium
sized displays
MLS driver lineup
Products
(Previous number)
Supply
voltage
range (V)
LCD
voltage
range (V) Segment Common Display RAM MPU interface Package Remarks
S1D15800D00B∗
(SED1580D0B) Au bump chip
S1D15800T00A∗
(SED1580T0A) 3.0~3.6 6.0~7.2 160 --- 160×240 bits 4 bits / 8 bits TCP 4-line MLS X-driver (segment)
S1D15900D00B∗
(SED1590D0B) Au bump chip
S1D15900T00A∗
(SED1590T0A) 2.7~3.6 5.4~7.2 160 --- 160×240 bits 8 bits TCP Built-in control function
4-line MLS X-driver (segment)
S1D15904D00B∗
(SED1594D0B) Au bump chip
S1D15904T00A∗
(SED1594T0A) 2.4~3.6 4.8~7.2 160 --- 160×120×2
(4 colors tone) 8 bits TCP 4-line MLS X-driver (segment)
S1D17501D00B∗
(SED1751D0B) Au bump chip
S1D17501T00A∗
(SED1751T0A) 2.7~5.5 14~42 --- 120 --- --- TCP 4-line MLS X-driver (common)
S1D17500D00B∗
(SED1750D0B) Au bump chip
S1D17500T00A∗
(SED1750T0A) 2.7~5.5 14~42 --- 160 --- --- TCP 4-line MLS X-driver (common)
S1D17C00D00B∗
(SED17C0D0B) Au bump chip
S1D17C00T00A∗
(SED17C0T0A) 1.7~3.7 16(Max.) --- 120 --- --- TCP 4-line MLS X-driver (common)
3 MLS driving method means simultaneous and selective driving of multiple
common lines and, with the MLS driving method, the response speed, contras
t
rat io and power c onsum ptio n can be d rastic ally im pro ved. Fo r MLS dr ivin g, use
combinations of a segment driver and a common driver among what are listed
below.
67
ASSPs
LCD drivers for
large-sized displays
S1D16000 series
● Segment drivers
Products
(Previous number) Supply voltage
range (V) LCD voltage
range (V) Duty Outputs Data bus Package
S1D16006D00A∗
(SED1606D0A) Al pad chip (for COB)
S1D16006D00B∗
(SED1606D0B) Au bump chip
S1D16006F00A∗
(SED1606F0A) QFP5-100pin
S1D16006D01A∗
(SED1606D1A) AI pad chip (DOFF type)
S1D16006D01B∗
(SED1606D1B) Au bump chip (DOFF type)
S1D16400D00B∗
(SED1640D0B)
2.7~5.5 8~28 1/100~1/300 80 4-bit parallel
Au bump chip (slim TCP)
● Common drivers
Products
(Previous number) Supply voltage
Range (V) LCD voltage
range (V) Duty Outputs Package
S1D16501D00A∗
(SED1651D0A) 2.7~5.5 8~28 1/64~1/300 100 Al pad chip (zigzag positioning)
S1D16700D00A∗
(SED1670D0A) Al pad chip (INH type)
S1D16700D01A∗
(SED1670D1A) Al pad chip (DOFF type)
S1D16700D00B∗
(SED1670D0B) Au bump chip (INH type)
S1D16700D01B∗
(SED1670D1B)
2.7~5.5 8~28 1/64~1/300 100
Au bump chip (DOFF type)
S1D16702D00A∗
(SED1672D0A) Al pad chip (INH type)
S1D16702D01A∗
(SED1672D1A) Al pad chip (DOFF type)
S1D16702D00B∗
(SED1672D0B) Au bump chip (INH type)
S1D16702D01B∗
(SED1672D1B) Au bump chip (DOFF type)
S1D16702F00A∗
(SED1672F0A)*
2.7~5.5 8~28 1/64~1/300 68
QFP5-80pin (INH type)
S1D17000 series
● Segment drivers
Products
(Previous number) Supply voltage
range (V) LCD voltage
range (V) Duty Outputs Data bus Package Application
S1D17508D00B∗
(SED1758D0B) Au bump chip
S1D17508T00A∗
(SED1758T0A) Slim TCP (Outer lead
pitch 0.092 mm)
S1D17508T00B∗
(SED1758T0B) Flex TCP (Outer lead
pitch 0.092 mm)
S1D17508T00G∗
(SED1758T0G)
2.7~5.5 14~42 1/100~1/500 160 8-bit parallel
Slim TCP (Outer lead
pitch 0.080 mm)
Used with the
S1D17403 or
S1D17503
S1D17502T00A∗
(SED1752T0A) Ultra slim TCP (Outer
lead pitch 0.070 mm)
S1D17502T00B∗
(SED1752T0B) 2.7~5.5 14~42 1/100~1/500 240 8-bit parallel
Flex TCP (Outer lead
pitch 0.070 mm)
Used with the
S1D17403 or
S1D17503
S1D17A02T00A∗
(SED17A2T0A) Ultra slim TCP (Outer
lead pitch 0.070 mm)
S1D17A02T00B∗
(SED17A2T0B) Bent ultra-slim TCP (OLB
pitch 0.070 mm)
S1D17A02T00E∗
(SED17A2T0E)
2.7~5.5 14~42 1/100~1/500 240 8-bit parallel
Ultra-slim TCP (OLB pitch
0.074 mm)
Used with the
S1D17403 or
S1D17503
● Common drivers
Products
(Previous number) Supply voltage
range (V) LCD voltage
range (V) Duty Outputs Package Application
S1D17403D01B∗
(SED1743D1B) 2.7~5.5 14~40 1/100~1/500 160 Au bump chip
S1D17503D00B∗
(SED1753D0B) Au bump chip
S1D17503T00A∗
(SED1753T0A) 2.7~5.5 14~42 1/100~1/500 120 TCP (OLB pitch 0.19 mm)
High-speed drivers for large-sized dot-matrix displays that complement SEIKO
EPSON’s dedicated LCD controllers.
68
ASSPs
-2 LCD Controller-drivers and Drivers
LCD drivers for
grayscale displays
● S1D18000 series
Products
(Previous number) Supply volgage
range (V) LCD voltage
range (V) Duty Segment Common Package Application
S1D18000D00B∗
(SED1800D0B) 2.7~5.5 4.0~6.0 --- 160 --- Au bump chip
PWM technology
64-level gray (6 bit×1)
S1D18001D00B∗
(SED1801D0B) 2.7~5.5 4.0~6.0 --- 162 --- Au bump chip
PWM technology
64-level gray (6 bit×3)
S1D18A01D00B∗
(SED18A1D0B) 2.7~5.5 4.0~6.0 --- 240 --- Au bump chip
PWM technology
64-level gray (6 bit×3)
● TFT LCD Drivers
S1D17900 series
Products
(Previous number) Supply voltage
range (V) LCD voltage
range (V) Source Gate Package Application
S1D17909T00A∗
(SED1790T0A) 2.7~5.5 10.0~40.0 --- 120 (two value) TCP
S1D17903T00B∗
(SED1793T0B) 2.7~5.5 10.0~40.0 --- 120 (two value) Bend TCP
S1D17904T00A∗
(SED1794T0A) 2.7~5.5 10.0~40.0 --- 190/200
(two value) TCP
S1D17906D00B∗
(SED1796D0B) 1.8~5.5 15.0~40.0 --- 150/154
(four value) Au bump chip for COG
S1D17907D00B∗
(SED1797D0B) 1.8~5.5 15.0~40.0 --- 240 (two value) Au bump chip for COG
S1D17909T00A∗
(SED1799T0A) 1.8~5.5 15.0~40.0 --- 256 (two value) TCP
S1D19000 series
Products
(Previous number) Supply voltage
range (V) LCD voltage
range (V) Range
Source Data inputs Package Application
S1D19006T00A∗
(SED1906T0A) 3.0~3.6 6.0~9.0 312 6 bit digital TCP For driving of a dot reversed
3 Controlling the lighting time, they avail gray-scale displays in 16 or 64 levels on
the LCD panel. The applicable type of panel differs depending on the speed,
withstanding voltage and driving method.
69
ASSPs
-3 Other Drivers
Thermal-head drivers
Products
(Previous number)
Logic supply
voltage range
V
Output withstand
voltage
V (Max.) Output current
mA (Max.) Clock frequency
MHz (Max.) [#] Number of
driver outputs Description Package
S1D50350D0A0
(SED5035D0A) 150 16
S1D50360D0A0
(SED5036D0A)
Chip
S1D50360F0A0
(SED5036F0A)
70 7 [5] 32 Both sides outputs
QFP12-48pin
S1D50680D0A0
(SED5068D0A) 60 10 [8]
S1D53000D0A0
(SED5300D0A) 22 7 [5] Both sides outputs
S1D53010D0A0
(SED5301D0A) 10 [8]
64
Both sides outputs 600dpi
S1D53100D0A0
(SED5310D0A)
12 8 [8]
S1D53160D0A0
(SED5316D0A) 15 16 [16]
128 One side output 400dpi
S1D56150D0A0
(SED5615D0A) 20 7 [5] One side output 200dpi
S1D56200D0A0
(SED5620D0A)
5±10% 32
70 7 [6] One side output
S1D56240D0A0
(SED5624D0A) 2.7~5.5 10 60 10 [8] /5V One side output 200dpi low
voltage
S1D56250D0A0
(SED5625D0A) 35
S1D56260D0A0
(SED5626D0A)
5±10% 32 50 10 [8]
S1D56280D0A0
(SED5628D0A) 2.7~5.5 10 100 7 [6] /5V
S1D56680D0A0
(SED5668D0A) 60
One side output 200dpi
S1D56800D0A0
(SED5680D0A) 30
64
One side output 300dpi
(for 12 dot)
S1D56820D0A0
(SED5682D0A) 20
7 [5]
S1D56840D0A0
(SED5684D0A) 50
S1D56850D0A0
(SED5685D0A) 20 10 [8]
S1D56860D0A0
(SED5686D0A) 10 7 [5]
96 One side output 300dpi
S1D56880D1A0
(SED5688D1A)
5±10% 32
60 10 [10] 64 One side output 300dpi
(for 12 dot)
Chip
# : In case of cascade connection
LED Printer-head drivers
Products
(Previous number) Supply voltage
V Output current
mA (Max.) Clock frequency
MHz (Max.) [#] Number of
driver outputs Features Package
S1D41000
(SED4100) 7 8 Provided with constant current
regulation terminal,
both sides output
S1D41010
(SED4101) 4.5 10 64 Provided with constant current
regulation terminal,
both sides output 300dpi
S1D41800
(SED4180)
5±5%
4 20 128 One side output 600dpi
Chip
# : In case of cascade c onnection
3
70
ASSPs
-4 Interface ICs
IEEE1394 controller
Products
(Previous number) Supply voltage
(V) Additional features Package
S1R72801F00A
(SPC7281F0A) 5.0/3.3
zConformity to the IEEE1394-1995, 1394a Draft 2
zLINK controller
zSBP-2 protocol support
zBuilt-in CPU flash
zIDE interface (Ultra ATA/33)
QFP20-184
S1R72803F00A *
(SPC7283F0A) 5.0/3.3
zConformity to the IEEE1394-1995, 1394a Draft 2
zLINK controller
zSBP-2 protocol support
zBuilt-in CPU flash
zIDE interface (Ultra ATA/66)
QFP20-184
S1R72900F00A *
(SPC7290F0A) 3.3
zConformity to the IEEE1394a-2000
zPhysical layer (PHY) IC
zTwo 1394 ports
zCompatibility with transfer rates of 400/200/100 Mbits QFP13-64
S1R72901F00A *
(SPC7291F0A) 3.3
zConformity to the IEEE1394a-2000
zIntegration of LINK, PHY, CPU and Flash
zAchievement of rapid transfer at 1394 via one chip
zTwo at 1394 port
zUltra ATA/66-compatible IDE interface
QFP15-100
*: Under development
USB2.0 device controller
Products
(Previous number) Supply voltage
(V) Additional features Package
S1R72003F00A * 3.3
zConformity to the USB2.0
zHigh-speed, full-speed mode-ready
zCompatibility with control, bulk, and interrupt transmission mode
z4 end points QFP15-100
*: Under development
SCSI controller
Products
(Previous number) Supply voltage
(V) Additional features Package
S1R72103F00A
(SPC7213F0A) 5.0/3.3
zCompatibility with SCS1-2
zTransfer rate: 10 Mbyte/second (at synchronization), 5 Mbyte/second (at asynchronization)
zSCS1-3 Fast20-ready
zTransfer rate: 20 Mbyte/second (at synchronization)
zBuilt-in IDE interface (Ultra ATA/33)
QFP15-128
S1R72104F00B
(SPC7214F0B) 5.0/3.3
zCompatibility with SCS1-2
zTransfer rate: 10 Mbyte/second (at synchronization), 5 Mbyte/second (at asynchronization)
zSCS1-3 Fast20-ready
zTransfer rate: 20 Mbyte/second (at synchronization)
zBuilt-in port interface
QFP15-100
S1R72105F00A
(SPC7215F0A) 5.0/3.3
zCompatibility with SCS1-2
zSCS1-3 Fast20-ready
zBuilt-in DMA interface
zBuilt-in USB1.1 in terface
zUSB full speed mode-ready
QFP15-100
3 The IEEE1394/USB2.0 controller is SEIKO EPSON’s proprietary technique tha
t
serves as IC for high-speed serial interface.
This product is best suited to rapid transmission linking PC to peripheral
equipment such as storage drive.
For those customers who desire to make the most of the past technological
assets
,
the line-u
p
of SCSI controller is also available.
71
ASSPs
-5 Power Supply ICs
Power supply ICs for logic
Products
(Previous number) Supply voltage
(V) Output voltage Consumption current Power-off current Package
S1F785200*
(SCI7852) 2.8~5.5 3.3V series/1.8V series 80µA 1.0µA SSOP3-24pin
S1F76650*
(SCI7665) 1.6~5.5 3.3V/3.0V/2.5V T.B.D 1.0µA SSOP3-24pin
S1F71100M0A0
(SCI7110M0A) 3.3~12 3.3V 800µA 1.0µA SOP4-8pin
S1F71200M0A0
(SCI7120M0A) 2.5~12 5.0V
S1F71200M0B0
(SCI7120M0B) 2.5~12 3.3V
150 µA (at pressure rise)
15 µA (at pressure fall) 1.0µA SSOP2-16pin
*: Under development
Power supply ICs for liquid crystal
Products
(Previous number) Supply voltage
(V) Output voltage Consumption current Features Package
S1F75510*
(SCI7551) ~3.6 Double/triple in the
positive direction
Triple in the negative
direction 300µA
・Conversion efficiency
90%
・Built-in stabilization
circuit SSOP3-24pin
S1F75300M0A0*
(SCI7530M0A) 2.7~5.5 - 30V (Possible to set
freely) 200µA (no-load) ・Built-in voltage follower
・Built-in electronic volume SSOP1-20pin
*: Under development
DC to DC converters Products
(Previous number) Features Package
S1F76600D0B0
(SCI7660D0B) z Power supply voltage conversion IC Chip
S1F76600C0B0
(SCI7660C0B)
z Easy voltage conversions from input voltage to positive/
negative potential (two conversion types; one-fold for reverse
polarity and two-fold for the same polarity) DIP-8pin
S1F76600M0B0
(SCI7660M0B) z Power conversion efficiency: 95% typical SOP4-8pin
S1F76620M0A0
(SCI7662M0A) z Possible to double pressure rise to positive potential SOP4-8pin
S1F76620D0A0
(SCI7662D0A) z Power conversion efficiency: 95% typical Chip
DC to DC converters and voltage regulators
Products
(Previous number) Features Package
S1F76610D0B0
(SCI7661D0B) Chip
S1F76610C0B0
(SCI7661C0B) DIP-14pin
S1F76610M0B0
(SCI7661M0B) SOP5-14pin
S1F76610M2B0
(SCI7661MBB)
z Power supply voltage conversion IC
z Easy voltage conversions from input voltage to positive negative
potential (two conversion types; one- and two-fold for reverse
polarity and two- and three-fold for the same polarity)
z Power conversion efficiency: 95% typical
z Built-in circuit for voltage stabilization
z Four temperature coefficients suitable for LCD power supplies SSOP2-16pin
S1F76540C0A0
(SCI7654C0A) DIP-16pin
S1F76540M0A0
(SCI7654M0A)
z Power supply voltage conversion IC
z Generation of 4/3/2 times output voltage in the negative direction
z Power conversion efficiency: 95% (Max.)
z Built-in voltage stabilization circuit
z Possible to select temperature gradient for LCD power supply SSOP2-16pin
S1F76640M0A0
(SCI7664M0A) SSOP2-16pin
S1F76640D0A0
(SCI7664D0A)
z Power supply voltage conversion IC
z Possible to 2/3/4 times pressure rise output to the positive
potential
z Built-in stabilization circuit Chip
Switching regulators
Supply
voltage
range (V)
Output
voltage
(V) Oscillator Voltage
detection Power-on
clear Battery backup Ripple noise
suppression
input
Output voltage
temperature
(mV/°C) Package
2.4
3.0
3.5
5.0
Built-in CR Provided Provided Provided Provided
3.0 Crystal Not Provided Not Provided Not Provided
---
2.2 -4.5
1.5
（Min. : 0.9）
2.4 Built-in CR Provided Provided Not Provided Provided -4
SOP3-8pin
3
Products
(Previous number)
S1F76310M1L0
(SCI7631MLA)
S1F76310M1B0
(SCI7631MBA)
S1F76310M1K0
(SCI7631MKA)
S1F76310M1A0
(SCI7631MAA)
S1F76330M1B0
(SCI7633MBA)
S1F76380M1H0
(SCI7638MHA)
S1F76380M1L0
(SCI7638MLA)
72
ASSPs
-5 Power Supply ICs
High precision voltage regulators
Input voltage (V-max.) Output voltage (V) Output current (mA-Typ.) Current consumption
(µA-typ.) Package
1.5
1.8
2.2
2.6
2.8
10 (VI=3V)
3.0
3.2
3.3
3.5
3.9
30 (VI=5V)
4.0
4.5 40 (VI=6V)
5.0 50 (VI=7V)
15
6.0 50 (VI=8V)
1.5
-1.5
-1.8
-3.0
-4.0
-5V
-5.0
100 4.0
SOT89-3pin
Note) Temperatures during reflow soldering must remain within the limits set out under LSI Device Precautions i n this catalog. Do not immerse QFP and SOT89 packages during soldering, as
the rapid temperature gradient during dipping can cause damage.
3
Products
(Previous number)
S1F78100Y2H0
(SCI7810YHB)
S1F78100Y2G0
(SCI7810YGB)
S1F78100Y2F0
(SCI7810YFB)
S1F78100Y2L0
(SCI7810YLB)
S1F78100Y2R0
(SCI7810YRB)
S1F78100Y2D0
(SCI7810YDB)
S1F78100Y2C0
(SCI7810YCB)
S1F78100Y2T0
(SCI7810YTB)
S1F78100Y2N0
(SCI7810YNB)
S1F78100Y2K0
(SCI7810YKB)
S1F78100Y2P0
(SCI7810YPB)
S1F78100Y2M0
(SCI7810YMB)
S1F78100Y2B0
(SCI7810YBB)
S1F78100Y2A0
(SCI7810YAB)
S1F79100Y2H0
(SCI7910YHA)
S1F79100Y2G0
(SCI7910YGA)
S1F79100Y2D0
(SCI7910YDA)
S1F79100Y2P0
(SCI7910YPA)
S1F79100Y2B0
(SCI7910YBA)
73
ASSPs
High precision voltage detectors
Detection voltage level (V)
Products
(Previous number) Output level (V) Min. Typ. Max. Operating voltage
range (V) Operating current
（µA-Typ.） Package
S1F77200Y1V0
(SCI7720YVA) 0.9 0.95 1
S1F77200Y1A0
(SCI7720YAA) 1 1.05 1.1
S1F77200Y1Y0
(SCI7720YYA) 1.05 1.1 1.15
S1F77200Y1B0
(SCI7720YBA) 1.1 1.15 1.2
1.5 (VDD=1.5V)
S1F77200Y1N0
(SCI7720YNA) 1.85 1.9 1.95
S1F77200Y1C0
(SCI7720YCA) 2.1 2.15 2.2
0.8~10.0
2.0 (VDD=3.0V)
S1F77200Y1F0
(SCI7720YFA) 2.6 2.65 2.7 2.0 (VDD=3.0V)
S1F77200Y1T0
(SCI7720YTA)
N-channel open drain
3.9 4 4.1 2.0 (VDD=5.0V)
S1F77210Y1C0
(SCI7721YCA) 2.1 2.15 2.2
S1F77210Y2C0
(SCI7721YCB#) 2.1 2.15 2.2
S1F77210Y1P0
(SCI7721YPA) 2.2 2.25 2.3
S1F77210Y1S0
(SCI7721YSA) 2.3 2.35 2.4
S1F77210Y1E0
(SCI7721YEA) 2.5 2.55 2.5
S1F77210Y1F0
(SCI7721YFA) 2.6 2.65 2.7
S1F77210Y2F0
(SCI7721YFB#) 2.6 2.65 2.7
S1F77210Y1R0
(SCI7721YRA) 2.73 2.8 2.87
2.0 (VDD=3.0V)
S1F77210Y1G0
(SCI7721YGA) 2.93 3 3.07
S1F77210Y1H0
(SCI7721YHA) 3.13 3.2 3.27
S1F77210Y130
(SCI7721Y3A) 3.43 3.5 3.57
2.0 (VDD=4.0V)
S1F77210Y1T0
(SCI7721YTA) 3.9 4 4.1
S1F77210Y1M0
(SCI7721YMA) 4.1 4.2 4.3
S1F77210Y1J0
(SCI7721YJA) 4.3 4.4 4.5
S1F77210Y120
(SCI7721Y2A) 4.5 4.6 4.7
S1F77210Y1K0
(SCI7721YKA) 4.7 4.8 4.9
2.0 (VDD=5.0V)
S1F77210Y1L0
(SCI7721YLA)
CMOS
4.9 5 5.1 2.0 (VDD=6.0V)
S1F77220Y1D0
(SCI7722YDA) P-channel open drain 1.2 1.25 1.3
1.5~15.0
1.5 (VDD=1.5V)
SOT89-3pin
#: Output Polarity reversed version
Note) Temperatures during reflow soldering must remain within the limits set out under LSI Device Precautions i n this catalog. Do not immerse QFP and SOT89 packages during soldering, as
the rapid temperature gradient during dipping can cause damage.
74
ASSPs
-6 Melody ICs
Melody ICs
Transducer Melody
selection Oscillator Play mode Power supply
voltage (V-typ.)
Products
(Previous number)
2(128) { --- { --- { { { --- { --- --- {
2(128) { --- { --- { { { --- ---
(One-
shot
C) --- {
2(128) { --- { --- { { { --- ---
{
(One-
shot
A)
--- {
16(512) { --- --- ○ { { { --- { --- --- {
16(512) { --- --- ○ { { { --- ---
(One-
shot
A) --- {
M** :
SOP3A-8pin
C** :
DIP-8pin
D** : chip
16(495) --- { { --- --- --- { { ☆ --- { --- SSOP-20pin
:
Selectable
by the
terminal
Music generators
Transducer Melody
selection Oscillator Play mode Power supply
voltage (V-typ.)
Products
(Previous number)
15(620) { --- { --- 4 { --- { { { --- --- { SOP1-24pin
15(620) { --- { --- 4 {
(possible) { --- { { --- --- { DIP-16pin*
Mode play:
Level Hold
＋
One Shot
B and C
*: Selectable 8 melodies (Max.) in DIP-16pin
3 SEIKO EPSON's melody ICs offers wide range of features and melodies to sui
t
all applications. Custom melodies are easily implemented with the buil-in
p
ro
g
rammable mask ROMs.
Music generators are high-quality custom melody ICs capable or reproducing
preprogrammed music by synthesizing the sounds of several musical and
percussion instruments, as well as alarm signals.
Melodies
(notes)
Dynamic
speaker
Piezo-
buzzer Binary
code
Serial
trigger
Accom
pani-
ment Envelope
CR
oscillation
(Both C
and
Roscillators
are bui lt in. )
External
clock
Level
hold One-
shot
Abort
play 1.5V 3V 5V Package Additional
features
S1V75600M00A
(SVM7560M0A)
S1V75600M00B/C00B
(SVM7560M0B/C0B)
S1V75600D00K
(SVM7560D0K)
S1V75600M00M/C00M/
D00M
(SVM7560M0M/C0M/D0M)
S1V75600M00V
(SVM7560M0V)
S1V75601M00B/C00B/
D00B
(SVM7561M0B/C0B/D0B)
S1V75601M00C /C00C/
D00C
(SVM7561M0C/C0C/D0C)
S1V71000M00J
(SVM7100M0J)
Melodies
(notes)
Dynamic
speaker
Piezo-
buzzer Binary
code
Serial
trigger
Accom
pani-
ment Envelope
CR
oscillation
(Both C
and
Roscillators
are bui lt in. )
External
clock
Level
hold One-
shot
Abort
play 1.5V 3V 5V Package Additional
features
S1V75700M05P
(SVM7570M5P)
S1V75700M06F
(SVM7570M6F)
S1V75701C05N
(SVM7571C5N)
S1V75701C06G
(SVM7571C6G)
S1V75701C06H
(SVM7571C6H)
S1V75701C06J
(SVM7571C6J)
S1V75701C06K
(SVM7571C6K)
S1V75701C06N
(SVM7571C6N)
S1V75701C06P
(SVM7571C6P)
75
ASSPs
Standard melodies
Products
(Previous number) Melody Composer
All the part numbers without voltage indication are for 1.5V.
Products
(Previous number) Melody Composer
S1V75701C06P
(SVM7571C6P)
(5.0V spec.)
1 She wore a yellow ribbon
2 My darling Clementine
3 The yellow rose of Texas
4 Yankee Doodle
5 When the saints go marchin' in
6 Londonderry air
7 Havah Nagilah
8 Jamaica farewell
American Folk Song
American Folk Song
American Folk Song
American Folk Song
American Folk Song
Old Irish Melody
Judaic Folk Song
Jamaican Folk Song
S1V75700M06F
(SVM7570M6F)
(5.0V spec.)
1 Yellow Submarine
2 Yesterday
3 Penny Lane
4 Let It Be
5 Ob-La-Di, Ob-La-Da
6 Hey Jude
7 All My Loving
8 Here Comes the Sun
J. Lennon
J. Lennon
J. Lennon
J. Lennon & P. McCartney
J. Lennon
J. Lennon
J. Lennon
George Harrison
S1V71000M00J
(SVM7100M0J) 1 It's a small world
2 Love me tender
3 Old macdonald hada farm
4 March of the Toy Soldiers
5 Yankee doodle dandy
6 Rudolph the Red-Nosed Reindeer /
Santa Claus is Coming to Tow n
7 Wedding March
8 The Entertainer
9 Two Minutes
10 Landler Tanz
11 CHIME
12 Mickey Mouse club march
Richard M. Sherman
Elvis Presley
American Folk Song
Leon Jessel
American Folk Song
Johnny Marks
J. Fred Coots
R. Wagner
American Folk Song
J. S. Bach
W. A. Mozart
---
Jimmie Dodd
S1V75600M00A
(SVM7560M0A) 1 Je Te Veux
2 Minuet E. Statie
L. Boccherini
S1V75600M00B/
C00B
(SVM7560M0B/C0B) 1 Beauty and the beast
2 A whole new world A. Menken
A. Menken
S1V75600D00K
(SVM7560D0K) 1 Happy Birthday To You M. J. Hill
S1V75600M00M/
C00M/D00M
(SVM7560M0M/C0M/
D0M)
1 CHIME
2 BUZZER ---
---
S1V75600M00V
(SVM7560M0V) 1 Calling sound (upper line)
2 Calling sound (lower line) ---
---
S1V75601M00B/
C00B/D00B
(SVM7561M0B/C0B/
D0B)
S1V75601M00C
000/C00C/D00C
(SVM7561M0C/C0C/
D0C)
1 Aria
2 Jimnopedi No.1
3 Spring song
4 Green Sleeves
5 Home on the Range
6 Minuet
7 The Entertainer
8 Jingle bells
9 Magnificent Waltz
10 Heaven and Hell
11 Bright Spring Flower
12 Westminster
13 CHIME
14 BUZZER
15 Calling sound(upper line)
16 Calling sound(lower line)
Pasel
E. Statie
F. Mendelson
English folk Song
American Folk Song
J. S. Bach
American Folk Song
J. Pierpont
F. Chopin
Offenbach
M. Lock
J. E. Zartor
---
---
---
1 Goodbye Song
2 Minuet
3 Symphony No. 40
4 Fur Elise
5 The Entertainer
6 Mary Had a Little Lamb
7 CHIME
8 ALARM
F. Chopin
J. S. Bach
W. A. Mozart
L. v. Beethoven
American Folk Song
American Folk Song
---
---
1 Runner
2 I Want to Take Care of You
3 Oribia wo Kikinagara
4 September
5 Saturday Lovers
6 Autumn
7 Surf heaven, Ski Heavey
8 Color/White Blend
New Funky Suekichi
Yumi Matsutohya
Ami Ozaki
Mariya Takeuchi
Tatsuroh Yamashita
Kazumasa Oda
Yumi Matsutohya
Mariya Takeuchi
1 Happy Birthday
2 Mickey Mouse club march
3 It's a small world
4 Forest Bear
5 Cha Cha Cha Toy
6 Who Needs a Kid Like This?
7 Lullaby
8 Rudolph the Red-Nosed Reindeer
M. J. Hill
Jimmie Dodd
Richard M. Sherman
American Folk Song
Nobuyoshi Koshibe
Takeshi Shibuya
F. Schubert
Johnny Marks
1 Twinkle Twinkle Little Star
2 Old Macdonald had a Farm
3 One sunny day
4 London bridge is falling down
5 Mary Had a Little Lamb
6 Rock-A-Bye Baby
7 Lullaby
8 We Wish You a Me rry Christmas
French Folk Song
American Folk Song
American Folk Song
English Folk Song
American Folk Song
American Folk Song
J. Brahms
English Folk Song
1 Ampanman Theme
2 Electric Parade
3 New Year's Day
4 Ureshii Hinamatsuri
5 Carp Run
6 Lonesome Journey
7 Snow
8 Jingle bells
Takashi Miki
J. Perr ey & G. Kingsley
Sanetsura Ue
Kohyoh Kawamura
Unknown
Ordway J. P.
Unknown
J. Pierpont
1 Rocky (theme)
2 Star Wars (theme)
3 James Bond (theme)
4 Axel Foley (theme)
5 Batman (theme)
6 Indiana Jones (theme)
7 Superman (theme)
8 Popeye (theme)
Bill Conti
John Williams
Manty Norman
Harold Fa ltermeier
Prince R. Nelso
J. Williams
J. Williams
Lean Flatow
S1V75701C05N
(SVM7571C5N)
(5.0V spec.)
S1V75701C06G
(SVM7571C6G)
(5.0V spec.)
S1V75701C06H
(SVM7571C6H)
(5.0V spec.)
S1V75700M05P/
S1V75701C06J
(SVM7570M5P/
SVM7571C6J)
(5.0V spec.)
S1V75701C06K
(SVM7571C6K)
(5.0V spec.)
S1V75701C06N
(SVM7571C6N)
(5.0V spec.)
76
ASSPs
-7 Melody ICs/Music Generator Development
Melody ICs development
Melody ICs are customized by programming the ROM data with the customer's melody.
● Custom IC ordering information
Minimum order 30,000 ICs over six months
Medium Music score or magnetic tape
Simulation tape Ten days after receipt of the medium
Test samples
(5 units of
ceramic
packages) Six weeks after approval of the simulation tape
Delivery
schedule
(standard)
Volume
production Ten weeks after receipt of the order
Simulation tape ¥60,000 for the S1V75600 series (SVM7560 series), ¥120,000 for the S1V75601(SVM7560)/S1V71000(SVM7100) series
Mask charge ¥500,000 standard; Test samples are included.
Period Six months from the start of volume delivery, or three months after the delivery of test samples, if no order is placed.
Exclusiveness Applica
bility A melody IC is an object of exclusiveness in its original form as defined in the customer's original specification.
A melody IC with any amendments in form or function is not considered to be an object of exclusiveness.
Other
• Copyr ighting will be handled by SEIKO EPSON
• When selling our melody ICs or products using them to countries other than your own, dealing again with copyright matters
may exceptionally become necessary depending on the regulations of the country to sell to.
• Special options are not included in the mask charge.
• Since the delivery schedule is based on that of a standard product, actual delivery dates may vary.
Music generator ICs development
Music generators are customized by programming the ROM data with the customer's music arrangement.
● Custom IC ordering information
Minimum order 10,000 ICs over six months
Medium Music score or magnetic tape
Simulation tape Fourteen days after receipt of the medium, plus two days per extra tune for more than five tunes
Test samples
(5 units of
ceramic
packages) Six weeks after approval of the simulation tape
Delivery
schedule
(standard)
Volume
production Ten weeks after receipt of the order
Simulation tape ¥120,000 plus ¥5,000 per extra tune for more than five tunes
Mask charge ¥500,000, including test samples
Period Six months from the start of volume delivery, or three months after the delivery of the test samples, if no order is placed.
Exclusiveness Applica
bility A music generator is an object of exclusiveness in its original form as defined in the customer's original specification.
A music generator with any amendments in form or function is not considered to be an object of exclusiveness.
Other
• Copyr ighting will be handled by SEIKO EPSON.
• When selling our melody ICs or products using them to countries other than your own, dealing again with copyright matters
may exceptionally become necessary depending on the regulations of the country to sell to.
• Special options are not included in the mask charge.
• Since the delivery schedule is based on that of a standard product, actual delivery dates may vary.
3
77
ASSPs
● Development flow
Customer
Product
planning
Musical
score
/music
tape or CD
Request f or
simulations
(in 3 copies )
Simulation
(arrangement)
work
Appro-
val
Tape and
score attached
with the
acknowledging
document
Coding
of ROM
Creation of
simulation
cass ette tape
or EPPROM
Advise of
approval
Mask
production
TS
(Test sam ple)
ES
(Engineering
sample)*1
TS/(ES)
Advise of
approval
Delivery
Sample
production
Volume
production
*2
Interface
SEIKO EPSON
Sample
evalua
-tion
Sample
approval
*1 : Engineering sampl es are provided for t he S1V75700(SVM7570).
*2 : Shipping spec if ications will be issued, if required.
(• Musical scores)
(• Recorded tapes)
Section 4
Memories
Page
Capacity (bi ts) Organization
(bits) Products Access time (ns)
2M
Static RAM 4M
6M
128K×16
256K×16
512K×8
384K×16
S1M0V023B0J
S1M0W026B0J 100/70
85
S1M0W046B0J
S1M0V043B0J
S1M1W043B0J*
S1M0V040B0J*
100/70
85
85
S1M0V063B0J* 85
70
80
80
80
80
80
80
80
80
8M 512K×16 S1M1V083B0J 100/70
* : Under development
80
Memories
-1 Static RAMs
Power dissipation
Products
(Previous number) Density
(bits)
Bit
organization
(bits)
Supply
voltage
（V） Operating
mA (Max.) Standby
µA (Max.)
Operating
temperature
(°C)
Access
time
ns (Max.) Package
S1M0W026B0J1
(SRM2AW216LLBT1) 128K×16 1.8~2.2 30 15 -40~85 100 CSP-48 pin
S1M0W026B0J7
(SRM2AW216LLBT7) 128K×16 2.2~3.0 35 20 -40~85 70 CSP-48 pin
S1M0V023B0J8
(SRM2AV213LLBT8)
2M
128K×16 2.4~3.3 35 15 -40~85 85 CSP-48 pin
S1M0W046B0J1
(SRM2AW416LLBT1) 256K×16 1.8~2.2 30 15 -40~85 100 CSP-48 pin
S1M0W046B0J7
(SRM2AW416LLBT7) 256K×16 2.2~3.0 35 20 -40~85 70 CSP-48 pin
S1M0V043B0J8
(SRM2AV413LLBT8) 256K×16 2.4~3.3 35 15 -40~85 85 CSP-48 pin
S1M0V040B0J8*
(SRM2AV400LLBT8) 512K×8 2.4~3.3 35 15 -40~85 85 CSP-48 pin
S1M1W043B0J7*
(SRM2BW413LLBT7)
4M
256K×16 1.65~2.2 25 10 -40~85 70 PCSP-48 pin
S1M0V063B0J8*
(SRM2AV613LLBT8) 6M 384K×16 2.4~3.3 35 30 -40~85 85 PCSP-72 pin
S1M1V083B0J7
(SRM2BV813LLBT7) 8M 512K×16 2.4~3.0 35 15 -40~85 70 CSP-48 pin
* : Under development
4
Section 5
Custom
IC
82
Custom IC
-1 Development of Custom IC
SEIKO EPSON always
places itself in
customers’ shoes to
offer ideal products.
5
Customers also get involved in processes from examination of specifications at the
stage of development, design to mass production. Custom ICs are developed b
y
SEIKO EPSON jointly with the customers. All steps from examination o
f
specifications including functions and features, review of the results of evaluation
to mass production, including contracts, are taken in collaboration with ou
r
customers. For information on integration of your circuit with the existing
products, contact SEIKO EPSON.
Customer
Interface
SEIKO EPSON
Approval
for specifi-
cations for
develop-
ment
Examination
of
plan FIX
Merchan-
dising
Examination of
specifications for
development Review of
design
Prepa-
ration of
summary
of
specifi-
cations
Preparation
of specifi-
cations for
develop-
ment
Circuit
design
Circuit
design
Low voltage,
low power
consumption
High withstand
voltage technology
Analog
technology
Meeting needs for
features
・Crystal, CR oscillation
・Analog switc h
・A/D, D/A conversion
・PLL VCO
・Op-Amp
・Comparator
・Filter
・Power control
・0.9V operati on
Mixing wi th 1 chip
Seiko E pson’s advanced t echnology
S
y
stem technol o
gy
Review of
merchan-
dizing
Presen-
tation of
summary
of
specifi-
cations
Formula-
tion of
plan
Preview
of
merchan-
dizing
83
Custom IC
Applications
Elect roni c notebook, handy terminal,
pager, clock, melody et c.
Floppy disk controller, sensor
applicat i on products,
AV products , mobi l e phone, etc.
Thermal head dri ver,
LCD driver, Driver for ink-jet printer,
VFD driver, etc.
TS/ES
Evalua-
tion
NO
TS/ES
A
pproval
for
prepara-
tion
TS/ES
Report of the
results of
evaluation
NO
NO
NO
Approval
for specifi-
cations for
delivery
TS/ES
Fabri-
cation
Approval
for starting
mass pro-
duction
Prepara-
tion of
specifi-
cations
for
delivery
Mass
production
Starting delivery
of mass
produced goods
1.5V logic
Detector,
regulator
ROM
Oscillation circuit
Control ci rcuit
User logic
Inter-
face
RAM
TS/ES
Evalua-
tion
Approval
for mass
production
Eval-
uation of
mass
produc-
tion
Approved
products
for delivery
Section 6
Sub-system
Assembly
Technology
Chip-on-FPC
Chip-on-board
Tape automated bonding
Hybrid modules
86
Sub-system Assembly Technology
-1 Application Products of Sub-system Assembly Technology
SEIKO EPSON supports customer products creation of miniaturization
using super-low power CMOS LSI that is a key device and high density
assembly that is a key technology.
Today, miniaturization of electronics products continues to evolve as well as higher values are increasingly added to
products such as the advent of products with enhanced performance and varied functions. Meanwhile, environ-
ment-friendly products have been given priority. In implementing miniaturized, high value-added, improved quality
products, the high-density packaging technology plays an important role.
SEIKO EPSON pursues assembly technology originally by fusion of super-fine technology and low-power consumption
technologies such as CMOS LSI technology, that are cultivated with watch manufacturing. SEIKO EPSON meets every
possible need of customers by using advanced assembly technologies such as COB to realize a super-small-sized as-
sembly, COF to realize a super-light and thin assembly, and SMT to be a base of high density assembly, etc.
●Example of Applied Products
LCD Module (COF)
(Display module for the handheld products) CARD-PCI/GX
(CARD size PC) Interface Module
(IDE-IEEE1394 data ex change module)
L54120010010000
(SEK2001B0A) S4E28720C series
(SCE8720C series) S4E106600010000
(SEK0660B0A)
6
■Application Products
Ass embly technology Appli cation produc t s
Chip-on-Flexible
printed ci rcuit (COF) LCD modules, microcomputer-applied
products , mult i -chip m odul es
Chip-on-board
(COB) assembly LCD modules, microcomputer-applied
products , mult i -chip m odul es
Tape automated bonding
(TAB) assembly LCD modules, tape carrier packages
(TCP)
Surface-mount
technology (SMT) assembly Microcomputer-applied products, Inter-
face module
Complet e OE M CARD-PC, remote control unit, custom
PC card, GPS card
■Applications
Cellular phone
Pager
Portable LCD game
Databank, electronic calculator
Personal digital assistant (PDA), handy terminal
Remote control unit for portable audio system
Remote control unit for air conditioner
87
Sub-system Assembly Technology
●Sub-system Assembly Technologies
■Chip-on -FPC (COF)
Flip chips are assembled on a flexible printed circuit (FPC) with their face down.
Since the board is made of film, its shape is flexible, and it can be easily folded.
Three-dimensional module is also possible, depending on the shape. The COF
technology provides not only very thin board configurations, but also light, highly
free, small, and high-density board configurations.
Possible to assemble ICs with pad pitches up to 50µm (40µm:under develop-
ment)
Thickness of base film : 40µm (25µm:Under development)
Possible to mount SMT devices on FPC and to shape key pad
■Chip-on-board (COB)
Bare chips are directly mounted on the board to reduce assembled area. The
COB technology provides thin, high-density board configurations, and realizes
miniaturization of customer products.
Custom configuration is possible.
Multi-chip assembly is possible.
Possible to use on multi-layer wiring board with 4 or more layers
■Tape automated bonding (TAB)
The TAB assembly is a bonding technology used in tape carrier packages (TCP)
for VLSIs containing many pins and LCD driver ICs. This technology is extremely
effective as low impedance bonding without loss of performance of device, and re-
alize thin, high-density assembly.
Thin, small assembly down to approximately 1 mm in thickness is possible.
Easy to adapt to applications with many pins
B-TAB (Bumped-TAB) technology provides TAB production of bump-less ICs
Assembly of surface mount devices (SMD) on a tape is possible.
■Hybrid modules
Combination of SMT, TAB and COB assembly technologies provides very small,
thin modules.
Possible to use optimal assembly technology and configration from wide selec-
tion.
Possible to assemble liquid crystal display
Assembly technology matched with the shape of device and products can be
chosen.
88
Sub-system Assembly Technology
-2 Development of Application Products
SEIKO EPSON for a module product
development with customer, wholly
supplies the most suitable technology
for a product specification. It is pos-
sible to support design of not only cir-
cuit but al so board and pack i ng.
To realize high value-added products
with becoming high-density and thin,
SEIKO EPSON participates from a
specification examination of customer
for high-densi ty assemble technology.
SEIKO EPSON handle from circuit
design to board and packing design
as request of customer.
For mass production, doing the gen-
eral design to be the most s uitable f or
a product specif ication, pass for a trial
production and evaluation. Of course,
all production processes pursue high
quality under cons istent quality control.
Due to short lead times and c ost down,
SEIKO EPSON is provided with the
exclusive manufacturing line for vari-
ous ass emble t echnology.
6
●Development flow
Customer
Interface
SEIKO EPSON
Initial
review
and
appoximate
estimating
Product
planning
Develop-
ment
specifi-
cations
Test and
evaluation
sample
design
Specification
guidelines and
shematic
circuit di agram
Review
and
specification
fixing
Circuit
design
Product
planning General
speci-
fications
Approval
of detailed
speci-
fications
89
Sub-system Assembly Technology
No
No
No
No
Yes
Production
order
Approval
of delivery
specification
Volume
production
plan
Final
authoriza-
tion
Order
components
and special
tooling for
volume
production
Delivery
specifi-
cation
Delivery of
volume
production
and delivery
Test and
evaluate
samples
Test and
evaluation
report
Test and
evaluation
sample
production
Test and
evaluate
samples
Volume
production
Evaluation
Volume
production
start
Shipping
authori-
zation
91
LSI Device Precautions
SEIKO EPSON's plastic-molded LSIs are designed and manufactured for
trouble-free operation when used under normal operating conditions. All
products are subjected to stringent electrical and mechanical testing to en-
sure reliability.
When working with our products, you should take the following precautions.
･Use ICs within the rated operating voltage, operating temperature, operating
input/output voltage and input/output current ranges. If ICs are used outside
the rated ranges, you may experience high failure rates.
･Excessive electrical noise applied to a power or input pin can cause ICs to
latch up, resulting in device malfunction or damage. If this occurs, turn off the
power, isolate the problem, then supply power again.
･Do not expose ICs to excessive mechanical vibration, repetitive shock stress,
or rapid temperature changes. These factors van cause the plastic package
resin to crack and/or the bonding wires to break.
･Although all pins have electrostatic discharge protection circuits, excessive
electrostatic stress can damage ICs. Use anti-static tubes or foam, conductive
containers or aluminum foil for packaging and transportation. Do not use un-
treated plastic containers. Use grounded soldering tools and test equipment.
Also ensure that all personnel which handle ICs wear appropriate anti-static
overalls and grounding wriststraps.
･Electromagnetic interference can cause ICs to operate erratically. Shield all in-
terference sources in equipment that uses ICs.
･Dust, liquids, acidic and other corrosive gases cause oxidation and package
degradation that can result in shorting. Apply a sealing coat to ICs exposed to
hazardous environments.
･Store ICs in a dry environment within the rated storage temperature range.
Large temperature fluctuations can cause corrosion as the result of dewing.
･Do not place heavy objects directly on ICs.
･Handle ICs carefully at all times so as not to deform package leads.
Handling and operating precautions
92
Mounting precautions for surface mount devices
･The resin used in plastic packages absorbs moisture. Consequently, certain storage
conditi ons should be mai ntained prior to reflow s oldering. The table bel ow s hows the al-
lowable storage condi tions f or pl astic packages.
Always st ore pack ages i n an envi ronm ent t hat s atisf i es thes e conditions. The allowable
storage durat i on under sealed m oi sture proof bag i s one year.
Storage conditions and storage time of standard surface mounting type ICs
Package products
For details on storage rank, pl ease contact the nearest Sales Office.
TAB products
Storage condition Allowable storage time
Before opening moisture proof bag 12 months
After opening 25°C, 60%RH 3 weeks
30°C, 80%RH 1 week
Packages which exceed the recommended storage conditions should be baked before re-
flow soldering. This baking process will prevent the resin from cracking or losing
adherence during sol deri ng.
Meanwhile, baking should be done up to 2-times under t he f ol l owing condi tions.
Baking conditions for standard surface mounting type ICs
Baking temperature
Package thickness 125°C
t<2mm 5 hours
t≥2mm 24 hours
･The above conditions are typical specification. So please ask Seiko Epson about the
storage conditions, storage limits and baking condition for each package, because the
humidi ty condit i on depends on the thicknes s of package.
Recommended stora
g
e conditions
＜Standard Surface Mount Device (SMD) ... QFP, SOP, PLCC, etc.＞
Storage condition
Storage rank 25°C 60%RH 30°C 80%RH
S 1.5 months (6 weeks) 12 day s (288 hours)
I-1 10 days (240 hours) 7 days (168 hours)
I-2 7 days (168 hours) 5 days (120 hours)
I-3 5 days (120 hours) 1 day (24 hours)
I-4 1 day (24 hours) 12 hours
B Make sure to assem ble within 48 hours from
the time when the baking has been done af-
ter opening the sealed moisture proof bag.
・Allowable storage duration
before opening the package
(sealed moisture proof bag):
12 months
・When reflow is done twice,
be sure to carry it out within
the storage duratio n of eac h
package rank.
・When the storage time afte
r
opening the package has
been exceeded or it has
become unknown, carry out
mounting after re-baking.
＜Certain Standard Mount Device ... BGA＞
Storage atmosphere 25°C 60%RH
Storage time after opening 3 days (72 hours)
･The allowable storage duration prior to
opening the package (moisture proo
f
bag): 12 months
･When reflow is done twice, be sure to
carry it out within the storage duration o
f
each package rank.
・When the storage duration after opening
the pack age has been e xceeded or it has
become unknown, carry out mounting af-
ter re-baking.
＜Standard THD ... DIP etc.＞
Storage atmosphere 25°C 60%RH
Storage time after opening 1.5 months (6 weeks)
・Allowable storage duration before opening
the package (sealed moisture proof bag):
12 months
Package baking conditions
93
Mounting precautions for surface mount devices
When soldering surface mounting packages (QFP, SOP, PLCC, etc.) under methods wherein the
whole packages get heated such as infrared reflow and vapor phase reflow, observe the following
conditions. Such reflowing may be carried out upto 2-times only. Meanwhile, pay extra attention to
the storage conditions since humid plastic pack ages m ore t end to cause non-c onformities such as
occurence of cracks.
During reflow soldering, plastic packages are exposed to high temperatures. Consequently, the
following precauti ons should be t aken.
・Infrared refl ow solderi ng
The infrared reflow soldering temperatures shown in Fig. A must not be exceeded; and the
maximum allowable package resin temperature, of 235 °C should not be m aintained for more
than ten seconds.
・Vapor-phase reflow soldering
The vapor-phase reflow solderi ng temperatures shown in Fig. B should not be exceeded, and
tem perat ure gradi ent must be held below 1 to 5 °C/sec.
・Wave sol deri ng
Do not use wave soldering f or QFP or SOT89 packages , since t he steep temperat ure gradient
during dipping can cause devic e damage.
With surface mount packages, the patterns of the P.C.B. and the leads of the packages are sol-
dered at direct contacts. Seiko Epson is therefore shipping them out guaranteeing flatness of the
leads good enought for such soldering. Consequently, it is suggested to handle them with suffi-
cient care to keep them f rom stress which may cause deformation of the leads.
Soldering precauti ons
Fig. A I nf rared ref l ow solderi ng
Handling precautions for surface
mount packages
Fig. B Vapor-phase reflow soldering
95
Sales Information
Sales Information
Information about discontinued products
The following products will be discontinued and could you consider the alternative product for the new development. But we can
accept the only repeat purchase order of current mass production.
ASICs SLA40000 series, SSL40000 series
MCUs E0C33A104, E0C33202, E0C33204, E0C33208, E0C6215, E0C623A, E0C62L3A,
E0C623E, E0C62A3E, E0C62L3E, E0C6235, E0C62A35, E0C62L35, E0C6247,
E0C6262, E0C62A62, E0C62L62, E0C62T3, E0C63404
LCD controllers SED13A0∗
LCD drivers SED1765∗, SED1766∗, SED17B0
Plasma display drivers SED2710∗
DVD chip set SPC7451∗, SPC7425*
CD-ROM decoders SPC7221∗, SPC7223*
Information of Contract IC Assembly Business
The Contract IC Assembly Business is also available. Please contact the following department.
IC Business Planning & Sales Department
Semiconductor Operations Division
TEL(+81)48-286-7702 FAX(+81)48-286-7829
EPSON Products Information
Seiko Epson also produces the following electronic devices.
Category Products
System products CARD-PC, GPS card, Interface module
LCDs Passive-matrix LCD module
D-TFD active-matrix LCD module
TFT ultra-compact liquid crystal module
Crystal devices Crystal unit, Crys tal oscillator,
Real time clock module
Temperature sensor, SAW device
W ORKING WITH ENVIRONMENTAL ISSUES
ISO 14001
008
W ORKING FOR HIGH QUALITY
Accredited by the
Dutch Council for
Accreditation
I SO 9001
Our concept of Energy Saving technology conserves
resources by blending the essence of these three efficiency
technologies. The essence of these technologies is repre-
sented in each of the products that we provide to our cus-
tomers.
In the industrial sector, leading priorities include mea-
sures to counter the greenhouse effect by reducing CO2,
measures to preserve the global environ-
ment, and the development of energy-
efficient products. Environmental
problems are of global concern, and
although the contribution of ener-
gy-saving technology developed by
Epson may appear insignificant, we
seek to contribute to the develop-
ment of energy-saving products by our
customers through the utilization of our electronic devices.
Epson is committed to the conservation of energy, both for
the sake of people and of the planet on which we live.
Epson offers effective savings to its customers through a
wide range of electronic devices, such as semiconductors,
liquid crystal display (LCD) modules, and crystal devices.
These savings are achieved through a sophisticated melding
of three different efficiency technologies.
Power saving technology
provides low power con-
sumption at low voltages.
Space saving technology
provides further reductions
in product size and weight
through super-precise pro-
cessing and high-density
assembly technology.
Time saving technology
shortens the time required
for design and development
on the customer side and
shortens delivery times.
ENERGY SAVING EPSON
Resource
Saving
Energy Saving
Power Saving
Space Saving
Time Saving
ISO14000 is an international standard for
environmental management that was
established by the International
Standards Organization in 1996 against
the background of growing concern
regarding global warming, destruction of
the ozone layer, and global deforestation.
Co-existence Mark
The environmental mark symbolizing
Epson’s basic stance of “Co-existence
with Nature”.
The design incorporates a fish, flower,
and water, representing mutually
supportive co-existence.
ISO9000 is an international standard for
a product quality system that prescribes
demands to the manufacturers on a
standpoint of customers.
In 1988, Epson led in working to abolish CFCs, and
perfect abolition of those ozone layer-destroying substances
was achieved in 1992. In 1998, the 10th year of start of the
CFC-free activity, Epson set this year as the "Second
Environmental Benchmark Year" and established a new
corporate General Environmental Policy. Epson is tackling
with environmental issues comprehensively.
At the end of Fiscal 1988, Epson succeeded in abolishing
chloric solvents doubted to be harmful to human body. In
fiscal 1999, Epson started the activity with a goal of
abolishing lead solder pointed out possibility of
environmental pollutant.
Epson quickly began working to acquire company-wide
ISO certification. The Semiconductor Operations Division
has acquired ISO9000 certification with its IC, IC
card/module and their application products.
96
Epson’s LSI lineup
A RICH LINEUP OF LOW-V OLTAGE-OPERATION AND LOW -POWER-CONSUMPTION
CMOS LSIs B ASED UPON “ENERGY SAVING EPSON”
Epson’s CMOS LSIs feature “power saving”, “space
saving” and “time saving” characteristics according to
“Energy Saving Epson”, the electronic devices business
concept.
In power saving, we are seeking after low-voltage-
operation and low-power-consumption technology for
battery driven products. In space saving, we are cultivating
high-integration technology and high-density assembly
technology for portable equipments. In time saving, we
are creating IP (Intellectual Property) and development
environment to achieve shorter development time. As
result of all these pursuits, we are leading the industry in
many application fields.
Incorporated into gate arrays, microcomputers,
controllers, drivers and memories, these frontier
technologies are offered to you as our CMOS LSI
products featuring not only low-voltage-operation and
low-power-consumption but also high performance and
high quality. From a rich lineup of our products, you can
select the product ideal for your application.
Epson’s application-specific LSIs
■Application-Specific integrated circuits (ASICs)
■Application-Specific standard Products (ASSPs)
ASICs
MCUs
ASSPs
Memories
Custom IC
Assembly
technology
Gate arrays
Embedded arrays
Standard cells
4-bit microcomputers
High-performance 4-bit microcomputers
Peripheral
8-bit microcomputers
32-bit microcomputers
LCD controllers
LCD drivers
Drivers
Disk storage management ICs
Power supply ICs
Melody ICs
Static RAMs
CMOS LSIs
Fujimi Plant /
Fujimi-machi, Suwa-gun, Nagano-ken
Epson Hatogaya Corp. /
Hatogaya-shi, Saitama-ken
Sakata Plant & Tohoku Epson Corporation /
Sakata-shi, Yamagata-ken
97
■Information on Changes to Product Codes
The product codes in this document are scheduled for
change as of 1 April, 2001. This catalog will therefore
remain valid until the end of March, 2001. For
purchasing products after this date, please request the
latest version of this document with the new product
codes from your nearest sales office.
98
Seiko Epson Corporation
Korea Office (Seoul)
Epson Taiwan Technology
& Trading Ltd. (Taipei)
Epson Hong Kong Ltd.
(Hong Kong)
Epson Singapore Pte.,Ltd.
(Singapore)
Epson (China) Co.,Ltd.
(Beijing)
Epson Europe
Electronics GmbH (Munich)
Leverkusen
London
Paris
Barcelona
Pinang
Shenzhen
Shanghai
HsinChu
Electronic Devices
Marketing Division
Asia
Epson Singapore Pte.,Ltd. (Shingapore)
Epson Taiwan Technology & Trading Ltd. (Taipei)
Seiko Epson Corporation Korea Office (Seoul)
Epson Hong Kong Ltd. (Hong Kong)
Epson (China) Co.,Ltd. (Beijing)
ED International
Marketing
Department
America
Europe
Epson Electronics America, Inc. (Los Angels)
Epson Europe Electronics GmbH (Munich)
Pinang
HsinChu
Shanghai
Shenzhen
San Jose, Boston
Atlanta, Chicago
Paris, Leverkusen
London, Barcelona
Regional Headquarters Branch Offices
Electronic Devices Marketing Division
(Hino Office) / Hino-shi Tokyo
INTERNATIONAL SALES NETWORK
SALES OFFICE FOR EPSON’S
SEMICONDUCT OR OPERATIONS
99
Epson Electronics
America, Inc. (Los Angels)
Regional Headquarters
Branch Offices
Chicago
Boston
Atlanta
San Jose
Epson (China) Co.,Ltd.
/ Beijing Epson Hong Kong Ltd.
/ Hong Kong Epson Singapore Pte.,Ltd.
/ Shingapore
Epson Taiwan Technology
& Trading Ltd. / Taipei
Seiko Epson Corporation
Korea Office / Seoul
Epson Electronics America, Inc.
/ Los Angels
Epson Europe Electronics GmbH
/ Munich
100
Trademark & Company Name
Design Compiler, Design Power, Test Gen: Synopsys Inc. in U.S.A.
Verilog-XL: Cadence Design Systems Inc. in U.S.A.
Windows : Microsoft Corp. in U.S.A.
Model Sim : Model Technology Inc. in U.S.A.
Leonardo : Exemplar Logic Inc. U.S.A.
I2C Bus : Philips Electronics Corp.
SH3 : HITACHI Limited
ARM7TDMI : ARM Limited in U.K.
All other product names mentioned herein are trademarks and/or registered trademarks of their respective owners.
AMERICA
EPSON ELECTRONICS AMERICA, INC.
HEADQUARTERS
150 River Oaks Parkway
San Jose, CA 95134, U.S.A.
Phone : +1-408-922-0200 Fax : +1-408-922-0238
http://www.eea.epson.com
SALES OFFICES
West
1960 East Grand Avenue
El Segundo, CA 90245, U.S.A.
Phone : +1-310-955-5300 Fax : +1-310-955-5400
Central
101 Virginia Street, Suite 290
Crystal Lake, IL 60014, U.S.A.
Phone : +1-815-455-7630 Fax : +1-815-455-7633
Northeast
301 Edgewater Place, Suite 120
Wakefield, MA 01880, U.S.A.
Phone : +1-781-246-3600 Fax : +1-781-246-5443
Southeast
3010 Royal Blvd. South, Suite 170
Alpharetta, GA 30005, U.S.A.
Phone : +1-877-EEA-0020 Fax : +1-770-777-2637
EUROPE
EPSON EUROPE ELECTRONICS GmbH
HEADQUARTERS
Riesstrasse 15
80992 Munich, GERMANY
Phone : +49- (0) 89-14005-0 Fax : +49- (0) 89-14005-110
http://www.epson-electronics.de
SALES OFFICE
Altstadtstrasse 176
51379 Leverkusen, GERMANY
Phone : +49- (0) 2171-5045-0 Fax : +49- (0) 2171-5045-10
UK BRANCH OFFICE
Unit 2.4, Doncastle House, Doncastle Road
Bracknell, Berkshire RG12 8PE, ENGLAND
Phone : +44- (0) 1344-381700 Fax : +44- (0) 1344-381701
FRENCH BRANCH OFFICE
1 Avenue de l’ Atlantique, LP 915 Les Conquerants
Z.A. de Courtaboeuf 2, F-91976 Les Ulis Cedex, FRANCE
Phone : +33- (0) 1-64862350 Fax : +33- (0) 1-64862355
BARCELONA BRANCH OFFICE
Barcelona Design Center
Edificio Prima Sant Cugat
Avda. Alcalde Barrils num. 64-68
E-08190 Sant Cugat del Vallès. SPAIN
Phone : +34-93-544-2490 Fax : +34-93-544-2491
ASIA
EPSON (CHINA) CO.,LTD.
28F, Beijing Silver Tower 2# North RD DongSanHuan
ChaoYang District, Beijing, CHINA
Phone : 64106655 Fax : 64107319
SHANGHAI BRANCH
4F, Bldg., 27, No. 69, Gui Jing Road
Caohejing, Shanghai, CHINA
Phone : 21-6485-5552 Fax : 21-6485-0775
EPSON ELECTRONIC TECHNOLOGY
DEVELOPMENT (SHENZHEN) CO.,LTD.
16A/F, New Times Plaza, No.1 Taizi Road
Shekou, Shenzhen, CHINA
Phone : 755-6811118 Fax : 755-6677786
EPSON HONG KONG LTD.
20/F., Harbour Centre, 25 Harbour Road
Wanchai, Hong Kong
Phone : +852-2585-4600 Fax : +852-2827-4346
Telex : 65542 EPSCO HX
http://www.epson.com.hk
EPSON TAIWAN TECHNOLOGY & TRADING LTD.
10F, No. 287,Nanking East Road, Sec. 3
Taipei
Phone : 02-2717-7360 Fax : 02-2712-9164
Telex : 24444 EPSONTB
http://www.epson.com.tw
HSINCHU OFFICE
13F-3, No.295, Kuang-Fu Road, Sec. 2
HsinChu 300
Phone : 03-573-9900 Fax : 03-573-9169
EPSON SINGAPORE PTE., LTD.
No. 1 Temasek Avenue, #36-00
Millenia Tower, SINGAPORE 039192
Phone : +65-337-7911 Fax : +65-334-2716
http://www.epson.com.sg
EPSON TRADING (MALAYSIA) SDN. BHD.
ED PINANG OFFICE
8-1-04, Sunny Point Complex, Jalan Batu Uban
11700 Pulau Pinang, MALAYSIA
Phone : +60-(0)4-6589243 Fax : +60-(0)4-6589249
SEIKO EPSON CORPORATION
KOREA OFFICE
50F, KLI 63 Bldg., 60 Yoido-dong
Youngdeungpo-Ku, Seoul, 150-763, KOREA
Phone : 02-784-6027 Fax : 02-767-3677
SEIKO EPSON CORPORATION
ELECTRONIC DEVICES MARKETING DIVISION
Electronic Device Marketing Department
IC Marketing & Engineering Group
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN
Phone: +81-(0)42-587-5816 Fax: +81-(0)42-587-5624
ED International Marketing Department
Europe & U.S.A.
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN
Phone: +81-(0)42-587-5812 Fax: +81-(0)42-587-5564
ED International Marketing Department
Asia
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN
Phone: +81-(0)42-587-5814 Fax: +81-(0)42-587-5110
http://www.epson.co.jp
International Sales Operations
TF019-19
Product Catalog
Product Catalog
ELECTRONIC DEVICES MARKETING DIVISION
Electronic devices information on WWW server
Revised March 2001
Printed in Japan H
CMOS LSIs Product Catalog
2001/2002
2001/2002
2001/2002
http://www.epson.co.jp/device/
This catalog was made with recycle paper,
and printed using soy-based inks
