5082-0012 PIN Diode Chip for Hybrid MIC Switches/Attenuators Data Sheet Description Features This PIN diode chip is silicon dioxide or nitride passivated. The 5082-0012 has a planar construction. The fabrication processes are optimized for long term reliability and tightly controlled for uniformity in electrical performance. * Low Series Resistance: 1.0 Typical Outline Applications This general purpose PIN diode is intended for low power switching applications such as duplexers, antenna switching matrices, digital phase shifters, time multiplex filters, TR switches, pulse and amplitude modulators, limiters, leveling circuits, and attenuators. DIMENSIONS D X X Y D 0.03 (1) 0.10 (4) X 0.05 (2) 0.38 (15) Y 0.03 (1) 0.23 (9.0) Maximum Ratings Top Contact Au. Cathode Bottom Contact Au. Anode Junction Operating and Storage Temperature Range ............................. -65C to +150C Soldering Temperature .......... +425C for 1 min. max. Dimensions in millimeters (1/1000 inch) Electrical Specifications at TA = 25C Chip Part Number 5082- Nearest Equivalent Packaged Part No. 5082- 0012 3001 Test Conditions Typical Parameters Minimum Breakdown Voltage VBR (V) Maximum Junction Capacitance Cj (pF) Typical Series Resistance ) RS ( Typical Lifetime (ns) 150 VR = VBR Measure IR 10 mA 0.12 VR = 50 V f = 1 MHz 1.0 IF = 100 mA f = 100 MHz 400 IF = 50 mA IR = 250 mA Typical Reverse Recovery Time trr (ns) 100 IF = 20 mA VR = 10 V 90% Recovery Assembly and Handling Procedures for PIN Chips 1. Storage Devices should be stored in a dry nitrogen purged dessicator or equivalent. 2. Cleaning If required, surface contamination may be removed with electronic grade solvents. Typical solvents, such as freon (T.F. or T.M.C.), acetone, deionized water, and methanol, or their locally approved equivalents, can be used singularly or in combinations. Typical cleaning times per solvent are one to three minutes. DI water and methanol should be used (in that order) in the final cleans. Final drying can be accomplished by placing the cleaned dice on clean filter paper and drying with an infrared lamp for 5-10 minutes. Acids such as hydrofluoric (HF), nitric (HNO3) and hydrochloric (HCl) should not be used. 3. Die Attach a. Eutectic AuSn preform with stage temperature of 310C for one minute max. AuGe preform with stage temperature of 390C for one minute max. b. Epoxy For epoxy die-attach, conductive silver-filled or goldfilled epoxies are recommended. This method can be used for all Avago PIN chips. 4. Wire Bonding Either ultrasonic or thermocompression bonding techniques can be employed. Suggested wire is pure gold, 0.7 to 1.5 mil diameter. The effects of cleaning methods/solutions should be verified on small samples prior to submitting the entire lot. Following cleaning, dice should be either used in assembly (typically within a few hours) or stored in clean containers in a reducing atmosphere or a vacuum chamber. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5965-8880E 5989-4778EN February 23, 2006