Water Soluble Solder Paste
Features:
- 48 Hour Stencil Life - Excellent Printing Characteristics - Extended Cleaning Window
- Excellent Activity - Slump Resistant - High-Humidity Resistant
- 24 Hour Tack Time - Good for Batch or Continuous Runs - Will Not Foam During Wash
Description:
WS483 is an organically activated formulation developed to better resist the effects of increased humidity
levels. WS483 offers improved heat and humidity resistance, while maintaining high tack and resistance to
slump. WS483 also provides an exceptional post-process cleaning window and will not foam during the
cleaning process, even in high-pressure wash systems.
Printing:
- Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of
12 to 16 mm (½ to ⅝ inch) is normally sufficient to begin).
- Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry
and workable properties.
- WS483 provides the necessary tack time and force for today’s high speed placement equipment, which
will enhance product performance and reliability.
Reflow Profile:
Either a straight ramp-spike or ramp-soak-spike profile can be used as shown below. Both profiles would
have a similar peak temperature and time above liquidus (TAL). The shaded area defines the process window.
Oven efficiency, board size/mass, component type and density all influence the final profile for a given
assembly. These profiles are starting points, and processing boards with thermal-couples attached is
recommended to optimize the process.
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
PARAMETER
RECOMMENDED INITIAL SETTINGS
PARAMETER
RECOMMENDED INITIAL SETTINGS
Squeegee Pressure
0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade
PCB Separation Distance
0.75-2.0 mm (.030-.080”)
Squeegee Speed
12-150 mm/sec (.5-6”/sec)
PCB Separation Speed
Slow
Snap-off Distance
On Contact 0.00 mm (0.00”)
WS483
Sn62 and Sn63
Compatible Products:
- Electropure Solder Bar
- WS Tacky Flux
- WS715; WS375 Spray Flux
- WS482 Cored Wire
- Epoxy 4089 – Chip Bonding Epoxy
- 200AX – Stencil Cleaner
Cleaning:
WS483 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A
temperature of 38°C (100°F) - 66°C (150°F) is sufficient for removing residues. An in-line or other
pressurized spray cleaning system is suggested, but is not required.
Handling and Storage:
- WS483 has a refrigerated shelf life of 6 months at 4°C (40°F).
- Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
- Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated
material.
- Do not store new and used paste in the same container, and reseal any opened containers while not in use.
- Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.
Safety:
- Use with adequate ventilation and proper personal protective equipment.
- Refer to the accompanying Material Safety Data Sheet for any specific emergency information.
- Do not dispose of any lead-containing materials in non-approved containers.
Physical Properties:
RATE OF
RISE
1.5-2 °C / SEC
MAX
RAMP TO
150 °C
( 300°F)
PROGRESS
THROUGH
150°C-170°C
(300°F-340°F)
TO PEAK TEMP
210 °C-220°C
(410°F-430°F)
TIME ABOVE
183 °C (380°F)
COOLDOWN ≤
4°C / SEC
PROFILE
LENGTH
AMBIENT TO
COOL DOWN
Standard
Profile
≤ 75 Sec
30-60 Sec
45-75 Sec
30-60 Sec
45± 15 Sec
2.75-3.5 Min
ITEM
SPECIFICATION
Appearance
Gray, Smooth, Creamy
Alloy
Sn63 and Sn62
Melting Point
183°C
Particle Size
T3, T4, T5
General Metal Loading
90% (T3)
Viscosity
Print/Dispense
Packaging
Available in all industry standard packaging.
THE RECOMMENDED REFLOW PROFILE FOR WS483 IS PROVIDED AS A GUIDELINE. OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY
LAYOUT, OR OTHER PROCESS VARIABLES. CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE.
THE REFLOW PROFILE FOR THE Sn/Pb PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE I S 230°C – 245°C.
Test Data Summary:
Canada +1-514-494-2000 · USA +1-401-463-5605 · Mexico +52-656-630-0032 · Europe +44-1737-222-258
Asia-Pacific +86-755-2993-6487 · India +91-80-41554753 · info@aimsolder.com · www.aimsolder.com
AIM IS ISO9001:2008 CERTIFIED
The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of
proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability is expressly
disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to
http://www.aimsolder.com/Home/TermsConditions.aspx to review AIM's terms and conditions. 03/12
Document Rev # 3
CLASSIFICATION
Product
Name
IPC Classification to J-STD-004
Copper Mirror to J-STD-004
Silver Chromate to J-STD-004
WS483
ORM0
Low
Pass
POWDER TESTING
No.
Item
Results
Test Method
1
Powder Size
Type 3 – 45-25 micron
Type 4 – 38-20 micron
J-STD-004 IPC TM 650 2.2.14
2
Powder Shape
Spherical
Microscope
FLUX MEDIUM TESTING
No.
Item
Results
Test Method
1
Acid Value
150.02 mg KOH/g Flux
J-STD-004 IPC TM 650 2.3.13
2
Fluorides Spot Test
No Fluoride
J-STD-004 IPC TM 650 2.3.35.1
3
Corrosivity Test/ Copper Mirror
Low
J-STD-004 IPC TM 650 2.3.32
4
Halide-Free/Silver Chromate Paper Test
Pass
J-STD-004 IPC TM 650 2.3.33
7
Surface Insulation Resistance
Control Coupons > 1E at 96 & 168 h. - Pass
Sample Coupons > 1E at 96 & 168 h. - Pass
> No dendrite growth or corrosion, after a
visual inspection - pass
J-STD-004 IPC TM 650 2.6.3.3
8
Compatibility Test
See list of recommended products above
GR-78-CORE
VISCOSITY TESTING
No.
Item
Results
Test Method
1
T-Bar Spindle Test Method
900 ± 10% kcps
J-STD-005 IPC TM 650 2.4.34
SOLDER PASTE TESTING
No.
Item
Results
Test Method
1
Tack Test
30.5 gf
J-STD-005 IPC TM 650 2.4.44
2
Tack Test
82.8 gf
JIS Z 3284 Annez 9
3
Solder Ball Test
Pass
J-STD-005 IPC TM 650 2.4.43
4
Wetting Test
Pass
J-STD-005 IPC TM 650 2.4.45
5
Paste Shelf Life
4°C (39°F) = 6 months
AIM TM 125-11
6
Solder Paste Slump Test
Pass
J-STD-005 IPC TM 650 2.4.35
