LTC3109
1
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TYPICAL APPLICATION
FEATURES DESCRIPTION
Auto-Polarity, Ultralow
Voltage Step-Up Converter
and Power Manager
The LTC
®
3109 is a highly integrated DC/DC converter ideal
for harvesting surplus energy from extremely low input
voltage sources such as TEGs (thermoelectric genera-
tors) and thermopiles. Its unique, proprietary autopolarity
topology* allows it to operate from input voltages as low
as 30mV, regardless of polarity.
Using two compact step-up transformers and external
energy storage elements, the LTC3109 provides a com-
plete power management solution for wireless sensing
and data acquisition. The 2.2V LDO can power an external
microprocessor, while the main output can be programmed
to one of four fi xed voltages. The power good indicator
signals that the main output is within regulation. A second
output can be enabled by the host. A storage capacitor (or
battery) can also be charged to provide power when the
input voltage source is unavailable. Extremely low quies-
cent current and high effi ciency maximizes the harvested
energy available for the application.
The LTC3109 is available in a small, thermally enhanced
20-lead (4mm × 4mm) QFN package and a 20-lead SSOP
package.
VOUT Current vs TEG Voltage
APPLICATIONS
n Operates from Inputs as Low as ±30mV
n Less Than ±1°C Needed Across TEG to Harvest
Energy
n Proprietary Auto-Polarity Architecture
n Complete Energy Harvesting Power Management
System
– Selectable VOUT of 2.35V, 3.3V, 4.1V or 5V
– 2.2V, 5mA LDO
– Logic-Controlled Output
– Energy Storage Capability for Operation During
Power Interruption
n Power Good Indicator
n Uses Compact Step-up Transformers
n Small, 20-lead (4mm × 4mm) QFN Package or
20-Lead SSOP
n Remote Sensor and Radio Power
n HVAC Systems
n Automatic Metering
n Building Automation
n Predictive Maintenance
n Industrial Wireless Sensing
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
*Patent pending.
GND 1μF
5.25V
2.2V
LTC3109
3.3V
CSTORE
3109 TA01a
C1A
1nF
2.2μF
470pF
47μF
1nF
470pF
1:100
TEG
(THERMOELECTRIC GENERATOR)
±30mV TO ±500mV
••
1:100
••
VOUT2
C2A
C1B
C2B
SWB
VINB
VS1
VS2
SWA
VINA
VOUT
VLDO
PG00D
VOUT2_EN
VSTOREVAUX
VAUX +
470μF
OPTIONAL SWITCHED OUTPUT FOR SENSORS
+
μP
LOW POWER
RADIO
SENSOR(S)
VTEG (mV)
–300
0
IVOUT (μA)
100
300
400
500
100
900
3109 TA01b
200
–100
–200 200
0300
600
700
800
1:100 TRANSFORMERS
C1A = C1B = 1nF
VOUT = 3.3V
LTC3109
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ABSOLUTE MAXIMUM RATINGS
SWA, SWB, VINA, VINB Voltage .................... 0.3V to 2V
C1A, C1B Voltage ......................................... 0.3V to 6V
C2A, C2B Voltage (Note 6) .............................. 8V to 8V
VOUT2, VOUT2_EN .......................................... 0.3V to 6V
VS1, VS2, VOUT, PGOOD .............................. 0.3V to 6V
(Note 1)
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3109EUF#PBF LTC3109EUF#TRPBF 3109 20-Lead (4mm × 4mm) Plastic QFN –40°C to 125°C
LTC3109IUF#PBF LTC3109IUF#TRPBF 3109 20-Lead (4mm × 4mm) Plastic QFN –40°C to 125°C
LTC3109EGN#PBF LTC3109EGN#TRPBF LTC3109GN 20-Lead Plastic SSOP –40°C to 125°C
LTC3109IGN#PBF LTC3109IGN#TRPBF LTC3109GN 20-Lead Plastic SSOP –40°C to 125°C
Consult LTC Marketing for parts specifi ed with wider operating temperature ranges. *The temperature grade is identifi ed by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based fi nish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifi cations, go to: http://www.linear.com/tapeandreel/
20 19 18 17 16
678
TOP VIEW
21
GND
UF PACKAGE
20-LEAD (4mm s 4mm) PLASTIC QFN
9 10
5
4
3
2
1
11
12
13
14
15
VSTORE
VAUX
VOUT
VOUT2
VOUT2_EN
SWA
VINA
VINB
SWB
GND
VS2
VS1
C1A
C2A
GND
PGOOD
VLDO
GND
C1B
C2B
TJMAX = 125°C, θJA = 37°C/W
EXPOSED PAD (PIN 21) IS GND (Note 5)
GN PACKAGE
20-LEAD PLASTIC SSOP
1
2
3
4
5
6
7
8
9
10
TOP VIEW
20
19
18
17
16
15
14
13
12
11
VS1
VS2
VSTORE
VAUX
VOUT
VOUT2
VOUT2_EN
PGOOD
VLDO
GND
C1A
C2A
GND
SWA
VINA
VINB
SWB
GND
C2B
C1B
TJMAX = 125°C, θJA = 90°C/W
PIN CONFIGURATION
VLDO, VSTORE ............................................ 0.3V to 6V
VAUX ...................................................... 15mA Into VAUX
Operating Junction Temperature Range
(Note 2) .................................................. 40°C to 125°C
Storage Temperature Range .................. 65°C to 125°C
LTC3109
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ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3109 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3109E is guaranteed to meet specifi cations from
The l denotes the specifi cations which apply over the full operating
junction temperature range, otherwise specifi cations are for TA = 25°C (Note 2). VAUX = 5V unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Start-Up Voltage Using 1:100 Transformer Turns Ratio, VAUX = 0V ±30 ±50 mV
No-Load Input Current Using 1:100 Transformer Turns Ratios,
VIN = 30mV, VOUT2_EN = 0V, All Outputs Charged
and in Regulation
6mA
Input Voltage Range Using 1:100 Transformer Turns Ratios lVSTARTUP ±500 mV
Output Voltage VS1 = VS2 = GND
VS1 = VAUX, VS2 = GND
VS1 = GND, VS2 = VAUX
VS1 = VS2 = VAUX
l
l
l
l
2.30
3.234
4.018
4.875
2.350
3.300
4.100
5.000
2.40
3.366
4.182
5.10
V
V
V
V
VAUX Quiescent Current No Load, All Outputs Charged 7 10 μA
VAUX Clamp Voltage Current Into VAUX = 5mA l5.0 5.25 5.55 V
VOUT Quiescent Current VOUT = 3.3V, VOUT2_EN = 0V 0.2 μA
VOUT Current Limit VOUT = 0V l61526 mA
N-Channel MOSFET On-Resistance C2B = C2A = 5V (Note 3) Measured from VINA or
SWA, VINB or SWB to GND
0.35 Ω
LDO Output Voltage 0.5mA Load On VLDO l2.134 2.2 2.30 V
LDO Load Regulation For 0mA to 2mA Load 0.5 1 %
LDO Line Regulation For VAUX from 2.5V to 5V 0.05 0.2 %
LDO Dropout Voltage ILDO = 2mA l100 200 mV
LDO Current Limit VLDO = 0V l512 mA
VSTORE Leakage Current VSTORE = 5V 0.1 0.3 μA
VSTORE Current Limit VSTORE = 0V l61526 mA
VOUT2 Leakage Current VOUT2 = 0V, VOUT2_EN = 0V 50 nA
VS1, VS2 Threshold Voltage l0.4 0.85 1.2 V
VS1, VS2 Input Current VS1 = VS2 = 5V 1 50 nA
PGOOD Threshold (Rising) Measured Relative to the VOUT Voltage –7.5 %
PGOOD Threshold (Falling) Measured Relative to the VOUT Voltage –9 %
PGOOD VOL Sink Current = 100μA 0.12 0.3 V
PGOOD VOH Source Current = 0 2.1 2.2 2.3 V
PGOOD Pull-Up Resistance 1MΩ
VOUT2_EN Threshold Voltage VOUT2_EN Rising l0.4 1.0 1.3 V
VOUT2_EN Threshold Hysteresis 100 mV
VOUT2_EN Pull-Down Resistance 5MΩ
VOUT2 Turn-On Time 0.5 μs
VOUT2 Turn-Off Time (Note 3) 0.15 μs
VOUT2 Current Limit VOUT = 3.3V l0.2 0.3 0.5 A
VOUT2 Current Limit Response Time (Note 3) 350 ns
VOUT2 P-Channel MOSFET On-Resistance VOUT = 5V (Note 3) 1.0 Ω
0°C to 85°C junction temperature. Specifi cations over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3109I is guaranteed over the full –40°C to 125°C operating junction
temperature range. Note that the maximum ambient temperature
is determined by specifi c operating conditions in conjunction with
LTC3109
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TYPICAL PERFORMANCE CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
board layout, the rated thermal package thermal resistance and other
environmental factors. The junction temperature (TJ) is calculated from
the ambient temperature (TA) and power dissipation (PD) according to
the formula: TJ = TA + (PDθJA°C/W), where θJA is the package thermal
impedance.
Note 3: Specifi cation is guaranteed by design and not 100% tested in
production.
Note 4: Current measurements are made when the output is not switching.
Note 5: Failure to solder the exposed backside of the QFN package to the
PC board ground plane will result in a thermal resistance much higher
than 37°C/W.
Note 6: The Absolute Maximum Rating is a DC rating. Under certain
conditions in the applications shown, the peak AC voltage on the C2A and
C2B pins may exceed ±8V. This behavior is normal and acceptable because
the current into the pin is limited by the impedance of the coupling
capacitor.
Input Resistance vs VIN Effi ciency vs VIN
Open-Circuit Start-Up Voltage
vs Source Resistance
IIN vs VIN IVOUT vs VIN
VIN (mV)
10
1
IIN (mA)
10
100
1000
100 1000
3109 G01
1:100 RATIO, C1 = 1nF
1:50 RATIO, C1 = 4.7nF
1:20 RATIO, C1 = 10nF
VOUT = 0V
VIN (mV)
10
10
IVOUT (μA)
100
1000
10000
100 1000
3109 G02
1:100 RATIO, C1 = 1nF
1:50 RATIO, C1 = 4.7nF
1:20 RATIO, C1 = 10nF
VOUT = 3.3V
NO LOAD ON VLDO
VIN (mV)
10
2.0
RIN (Ω)
3.0
4.0
5.0
6.0
100 1000
3109 G03
7.0
2.5
3.5
4.5
5.5
6.5
1:100 RATIO, C1 = 1nF
1:50 RATIO, C1 = 4.7nF
1:20 RATIO, C1 = 10nF
VOUT = 0V
SOURCE RESISTANCE (Ω)
0
0
VSTARTUP (OPEN CIRCUIT) (mV)
10
30
40
50
6789
90
3109 G05
20
12345 10
60
70
80
VIN (mV)
10
0
EFFICIENCY (%)
10
20
30
40
100 1000
3109 G04
50
5
15
25
35
45 1:100 RATIO, C1 = 1nF
1:50 RATIO, C1 = 4.7nF
1:20 RATIO, C1 = 10nF
VOUT = 0V
TA = 25°C, unless otherwise noted.
VIN (mV)
10
0.1
PVOUT (mW)
1
10
100
100 1000
3109 G18
1:50 RATIO
C1 = 4.7nF
VOUT = 5V
VOUT = 3.3V
PVOUT vs VIN
LTC3109
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TYPICAL PERFORMANCE CHARACTERISTICS
Resonant Switching Waveforms LDO Load Regulation LDO Dropout Voltage
Start-Up Voltage Sequencing
VOUT and PGOOD Response
During a Step Load VOUT Ripple
VOUT and VLDO vs Temperature
VAUX Clamp Voltage
vs Shunt Current
PVOUT vs dT and TEG Size,
1:100 Ratio, VOUT = 5V
TA = 25°C, unless otherwise noted.
TEMPERATURE (°C)
–50
CHANGE (%) (RELATIVE TO 25°C)
0.75
25
3109 G06
0
–0.50
–25 0 50
–0.75
–1.00
1.00
0.50
0.25
–0.25
75 100 125
VLDO
VOUT
VAUX SHUNT CURRENT (mA)
0
VAUX (V)
5.3
5.4
5.5
12
3109 G07
5.2
5.1
5.0 36915
dT (°K)
0
PVOUT (mW)
1.0
2.0
3.0
0.5
1.5
2.5
2468
3109 G08
10103579
FERROTEC 9500/127/100B
40mm
FERROTEC 9501/071/040B
22mm
20μs/DIV
C1 A OR B
2V/DIV
C2 A OR B
2V/DIV
3109 G9
LDO LOAD (mA)
0
–1.00
DROP IN VLDO (%)
–0.75
–0.50
0.5 11.5 2 32.5 3.5
–0.25
0.00
4
3109 G10 LDO LOAD (mA)
0
0.00
DROPOUT VOLTAGE (V)
0.04
0.08
0.12
0.5 11.5 2 32.5 3.5
0.16
0.20
0.02
0.06
0.10
0.14
0.18
4
3109 G11
10SEC/DIV 3109 G12
CH1
VSTORE
1V/DIV
CH2, VOUT
1V/DIV
CH3, VLDO
1V/DIV
VIN = 50mV
1:100 RATIO TRANSFORMER
COUT = 220μF
CSTORE = 470μF
CLDO = 2.2μF
5ms/DIV 3109 G13
CH2
VOUT
1V/DIV
CH1
PGD
1V/DIV
50mA LOAD STEP
COUT = 220μF
100ms/DIV 3109 G14
20mV/
DIV
30μA LOAD
COUT = 220μF
LTC3109
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LDO Step Load Response Enable Input and VOUT2 Running on Storage Capacitor
PIN FUNCTIONS
(QFN/SSOP)
VSTORE (Pin 1/Pin 3): Output for the Storage Capacitor or
Battery. A large storage capacitor may be connected from
this pin to GND for powering the system in the event the
input voltage is lost. It will be charged up to the maximum
VAUX clamp voltage. If not used, this pin should be left
open or tied to VAUX.
VAUX (Pin 2/Pin 4): Output of the Internal Rectifi er Cir-
cuit and VCC for the IC. Bypass VAUX with at least 1μF of
capacitance to ground. An active shunt regulator clamps
VAUX to 5.25V (typical).
VOUT (Pin 3/Pin 5): Main Output of the Converter. The
voltage at this pin is regulated to the voltage selected by
VS1 and VS2 (see Table 1). Connect this pin to a reservoir
capacitor or to a rechargeable battery. Any high current
pulse loads must be fed by the reservoir capacitor on
this pin.
VOUT2 (Pin 4/ Pin 6): Switched Output of the Converter.
Connect this pin to a switched load. This output is open
until VOUT_EN is driven high, then it is connected to VOUT
through a 1Ω PMOS switch. If not used, this pin should
be left open or tied to VOUT
.
VOUT2_EN (Pin 5/Pin 7): Enable Input for VOUT2. VOUT2
will be enabled when this pin is driven high. There is an
internal 5M pull-down resistor on this pin. If not used,
this pin can be left open or grounded.
PGOOD (Pin 6/Pin 8): Power Good Output. When VOUT
is within 7.5% of its programmed value, this pin will be
pulled up to the LDO voltage through a 1M resistor. If
VOUT drops 9% below its programmed value PGOOD will
go low. This pin can sink up to 100μA.
VLDO (Pin 7/Pin 9): Output of the 2.2V LDO. Connect a
2.2μF or larger ceramic capacitor from this pin to GND.
If not used, this pin should be tied to VAUX.
GND (Pins 8, 11, 16, Exposed Pad Pin 21/Pins 10, 13,
18): Ground Pins. Connect these pins directly to the ground
plane. The exposed pad serves as a ground connection and
as a means of conducting heat away from the die.
VS2 (Pin 20/Pin 2): V
OUT Select Pin 2. Connect this
pin to ground or VAUX to program the output voltage
(see Table 1).
VS1 (Pin 19/Pin 1): V
OUT Select Pin 1. Connect this
pin to ground or VAUX to program the output voltage
(see Table 1).
Table 1. Regulated Output Voltage Using Pins VS1 and VS2
VS2 VS1 VOUT
GND GND 2.35V
GND VAUX 3.3V
VAUX GND 4.1V
VAUX VAUX 5.0V
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, unless otherwise noted.
VLDO
20mV/DIV
ILDO
5mA/DIV
200μs/DIV 3109 G15
0mA TO 3mA LOAD STEP
CLDO = 2.2μF
1ms/DIV 3109 G16
CH2
VOUT2
1V/DIV
CH1
VOUT2_EN
1V/DIV
10mA LOAD ON VOUT2
COUT = 220μF
5SEC/DIV 3109 G17
CH2, VOUT
1V/DIV
CH1, VIN
50mV/DIV
CH3
VSTORE
1V/DIV
CH4, VLDO
1V/DIV
CSTORE = 470μF
VOUT LOAD = 100μA
LTC3109
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PIN FUNCTIONS
(DFN/SSOP)
C1B (Pin 9/Pin 11): Input to the Charge Pump and Rectifi er
Circuit for Channel B. Connect a capacitor from this pin
to the secondary winding of the “B” step-up transformer.
See the Applications Information section for recommended
capacitor values.
C1A (Pin 18/Pin 20): Input to the Charge Pump and Recti-
er Circuit for Channel A. Connect a capacitor from this pin
to the secondary winding of the “A” step-up transformer.
See the Applications Information section for recommended
capacitor values.
C2B (Pin 10/Pin 12): Input to the Gate Drive Circuit for
SWB. Connect a capacitor from this pin to the secondary
winding of the “B” step-up transformer. See the Applications
Information section for recommended capacitor values.
C2A (Pin 17/Pin 19): Input to the Gate Drive Circuit for
SWA. Connect a capacitor from this pin to the secondary
winding of the “A” step-up transformer. See the Applications
Information section for recommended capacitor values.
SWA (Pin 15/Pin 17): Connection to the Internal N-Chan-
nel Switch for Channel A. Connect this pin to the primary
winding of the “A” transformer.
SWB (Pin 12/Pin 14): Connection to the Internal N-Chan-
nel Switch for Channel B. Connect this pin to the primary
winding of the “B” transformer.
VINA (Pin 14/Pin 16): Connection to the Internal N-Channel
Switch for Channel A. Connect this pin to one side of the
input voltage source (see Typical Applications).
VINB (Pin 13/Pin 15): Connection to the Internal N-Channel
Switch for Channel B. Connect this pin to the other side of
the input voltage source (see Typical Applications).
LTC3109
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BLOCK DIAGRAM
VS1
VOUT
VOUT2_EN
VOUT2
VOUT
COUT
VOUT2
VOUT
PROGRAM
VS2
VSTORE
VLDO
PG00D PG00D
1M
VREF
1.2V
+
+
VREF
VSTORE
VOUT
VREF
VAUX
CAUX
F CLDO
2.2μF
VLDO
2.2V
VOUT
5.25V
C1A
CHARGE
CONTROL
POWER
SWITCHES
LDO
SYNC
RECTIFY
SYNC
RECTIFY
REFERENCE
C2A
C1B
C2B
SWA
VINA
VINB
SWB
VIN
GND
+
CSTORE
3109 BD
+
LTC3109
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OPERATION
(Refer to the Block Diagram)
The LTC3109 is designed to use two small external
step-up transformers to create an ultralow input voltage
step-up DC/DC converter and power manager that can
operate from input voltages of either polarity. This unique
capability enables energy harvesting from thermoelectric
generators (TEGs) in applications where the temperature
differential across the TEG may be of either (or unknown)
polarity. It can also operate from low level AC sources. It
is ideally suited for low power wireless sensors and other
applications in which surplus energy harvesting is used to
generate system power because traditional battery power
is inconvenient or impractical.
The LTC3109 is designed to manage the charging and
regulation of multiple outputs in a system in which the
average power draw is very low, but where periodic pulses
of higher load current may be required. This is typical of
wireless sensor applications, where the quiescent power
draw is extremely low most of the time, except for transmit
pulses when circuitry is powered up to make measure-
ments and transmit data.
The LTC3109 can also be used to trickle charge a standard
capacitor, super capacitor or rechargeable battery, using
energy harvested from a TEG or low level AC source.
Resonant Oscillator
The LTC3109 utilizes MOSFET switches to form a reso-
nant step-up oscillator that can operate from an input of
either polarity using external step-up transformers and
small coupling capacitors. This allows it to boost input
voltages as low as 30mV high enough to provide multiple
regulated output voltages for powering other circuits. The
frequency of oscillation is determined by the inductance
of the transformer secondary winding, and is typically
in the range of 10kHz to 100kHz. For input voltages as
low as 30mV, transformers with a turns ratio of about
1:100 is recommended. For operation from higher input
voltages, this ratio can be lower. See the Applications
Information section for more information on selecting
the transformers.
Charge Pump and Rectifi er
The AC voltage produced on the secondary winding of
the transformer is boosted and rectifi ed using an external
charge pump capacitor (from the secondary winding to
pin C1A or C1B) and the rectifi ers internal to the LTC3109.
The rectifi er circuit feeds current into the VAUX pin, provid-
ing charge to the external VAUX capacitor and the other
outputs.
VAUX
The active circuits within the LTC3109 are powered from
VAUX, which should be bypassed with a 1μF minimum
capacitor. Once VAUX exceeds 2.5V, the main VOUT is al-
lowed to start charging.
An internal shunt regulator limits the maximum voltage
on VAUX to 5.25V typical. It shunts to ground any excess
current into VAUX when there is no load on the converter
or the input source is generating more power than is
required by the load. This current should be limited to
15mA max.
Voltage Reference
The LTC3109 includes a precision, micropower reference,
for accurate regulated output voltages. This reference
becomes active as soon as VAUX exceeds 2V.
Synchronous Rectifi ers
Once VAUX exceeds 2V, synchronous rectifi ers in paral-
lel with each of the internal rectifi er diodes take over the
job of rectifying the input voltage at pins C1A and C1B,
improving effi ciency.
Low Dropout Linear Regulator (LDO)
The LTC3109 includes a low current LDO to provide a
regulated 2.2V output for powering low power proces-
sors or other low power ICs. The LDO is powered by
the higher of VAUX or VOUT
. This enables it to become
active as soon as VAUX has charged to 2.3V, while the
LTC3109
10
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VOUT storage capacitor is still charging. In the event of a
step load on the LDO output, current can come from the
main VOUT reservoir capacitor. The LDO requires a 2.2μF
ceramic capacitor for stability. Larger capacitor values
can be used without limitation, but will increase the time
it takes for all the outputs to charge up. The LDO output
is current limited to 5mA minimum.
VOUT
The main output voltage on VOUT is charged from the VAUX
supply, and is user-programmed to one of four regulated
voltages using the voltage select pins VS1 and VS2, ac-
cording to Table 2. Although the logic-threshold voltage
for VS1 and VS2 is 0.85V typical, it is recommended that
they be tied to ground or VAUX.
Table 2
VS2 VS1 VOUT
GND GND 2.35V
GND VAUX 3.3V
VAUX GND 4.1V
VAUX VAUX 5V
When the output voltage drops slightly below the regulated
value, the charging current will be enabled as long as VAUX
is greater than 2.5V. Once VOUT has reached the proper
value, the charging current is turned off. The resulting
ripple on VOUT is typically less than 20mV peak to peak
.
The internal programmable resistor divider, controlled by
VS1 and VS2, sets VOUT
, eliminating the need for very
high value external resistors that are susceptible to noise
pickup and board leakages.
In a typical application, a reservoir capacitor (typically a
few hundred microfarads) is connected to VOUT
. As soon
as VAUX exceeds 2.5V, the VOUT capacitor will begin to
charge up to its regulated voltage. The current available
to charge the capacitor will depend on the input voltage
and transformer turns ratio, but is limited to about 15mA
typical. Note that for very low input voltages, this current
may be in the range of 1μA to 1000μA.
PGOOD
A power good comparator monitors the VOUT voltage.
The PGOOD pin is an open-drain output with a weak pull-
up (1MΩ) to the LDO voltage. Once VOUT has charged
to within 7.5% of its programmed voltage, the PGOOD
output will go high. If VOUT drops more than 9% from its
programmed voltage, PGOOD will go low. The PGOOD
output is designed to drive a microprocessor or other
chip I/O and is not intended to drive a higher current load
such as an LED. The PGOOD pin can also be pulled low in
a wire-OR confi guration with other circuitry.
VOUT2
VOUT2 is an output that can be turned on and off by the
host using the VOUT2_EN pin. When enabled, VOUT2 is con-
nected to VOUT through a 1Ω P-channel MOSFET switch.
This output, controlled by a host processor, can be used
to power external circuits such as sensors and amplifi ers,
that don’t have a low power “sleep” or shutdown capabil-
ity. VOUT2 can be used to power these circuits only when
they are needed.
Minimizing the amount of decoupling capacitance on
VOUT2 enables it to be switched on and off faster, allow-
ing shorter pulse times and therefore smaller duty cycles
in applications such as a wireless sensor/transmitter. A
small VOUT2 capacitor will also minimize the energy that
will be wasted in charging the capacitor every time VOUT2
is enabled.
VOUT2 has a current limiting circuit that limits the peak
current to 0.3A typical.
The VOUT2 enable input has a typical threshold of 1V
with 100mV of hysteresis, making it logic compatible. If
VOUT2_EN (which has an internal 5M pull-down resistor)
is low, VOUT2 will be off. Driving VOUT2_EN high will turn
on the VOUT2 output.
Note that while VOUT2_EN is high, the current limiting cir-
cuitry for VOUT2 draws an extra 8μA of quiescent current
from VOUT
. This added current draw has a negligible effect
OPERATION
(Refer to the Block Diagram)
LTC3109
11
3109fa
on the application and capacitor sizing, since the load on
the VOUT2 output, when enabled, is likely to be orders of
magnitude higher than 8μA.
VSTORE
The VSTORE output can be used to charge a large storage
capacitor or rechargeable battery. Once VOUT has reached
regulation, the VSTORE output will be allowed to charge
up to the clamped VAUX voltage (5.25V typical). The
storage element on VSTORE can then be used to power
the system in the event that the input source is lost, or
is unable to provide the current demanded by the VOUT
,
VOUT2 and LDO outputs.
If VAUX drops below VSTORE, the LTC3109 will automati-
cally draw current from the storage element. Note that it
may take a long time to charge a large storage capacitor,
depending on the input energy available and the loading
on VOUT and VLDO.
Since the maximum charging current available at the
VSTORE output is limited to about 15mA, it can safely be
used to trickle charge NiCd or NiMH batteries for energy
storage when the input voltage is lost.
Note that VSTORE is not intended to supply high pulse
load currents to VOUT
. Any pulse load on VOUT must be
handled by the VOUT reservoir capacitor.
Short-Circuit Protection
All outputs of the LTC3109 are current limited to protect
against short circuits to ground.
Output Voltage Sequencing
A timing diagram showing the typical charging and voltage
sequencing of the outputs is shown in Figure 1. Note that
the horizontal (time) axis is not to scale, and is used for
illustration purposes to show the relative order in which
the output voltages come up.
OPERATION
(Refer to the Block Diagram)
5.0 VSTORE
PGOOD
VOUT
VLDO
3.0
2.0
1.0
0
3.0
2.0
1.0
0
2.5
0
5.0
2.5
0010203040
TIME (ms) 3109 F01
50 60 70 80
5.0
2.5
VOLTAGE (V)
0
VAUX
Figure 1. Output Voltage Sequencing
(with VOUT Programmed for 3.3V). Time Not to Scale
LTC3109
12
3109fa
APPLICATIONS INFORMATION
INTRODUCTION
The LTC3109 is designed to gather energy from very low
input voltage sources and convert it to usable output
voltages to power microprocessors, wireless transmit-
ters and analog sensors. Its architecture is specifi cally
tailored to applications where the input voltage polarity is
unknown, or can change. This “auto-polarity” capability
makes it ideally suited to energy harvesting applications
using a TEG whose temperature differential may be of
either polarity.
Applications such as wireless sensors typically require
much more peak power, and at higher voltages, than
the input voltage source can produce. The LTC3109 is
designed to accumulate and manage energy over a long
period of time to enable short power pulses for acquiring
and transmitting data. The pulses must occur at a low
enough duty cycle that the total output energy during the
pulse does not exceed the average source power integrated
over the accumulation time between pulses. For many
applications, this time between pulses could be seconds,
minutes or hours.
The PGOOD signal can be used to enable a sleeping
microprocessor or other circuitry when VOUT reaches
regulation, indicating that enough energy is available for
a transmit pulse.
INPUT VOLTAGE SOURCES
The LTC3109 can operate from a number of low input
voltage sources, such as Peltier cells (thermoelectric
generators), or low level AC sources. The minimum input
voltage required for a given application will depend on the
transformer turns ratios, the load power required, and the
internal DC resistance (ESR) of the voltage source. Lower
ESR sources will allow operation from lower input voltages,
and provide higher output power capability.
For a given transformer turns ratio, there is a maximum
recommended input voltage to avoid excessively high
secondary voltages and power dissipation in the shunt
regulator. It is recommended that the maximum input
voltage times the turns ratio be less than 50.
Note that a low ESR decoupling capacitor may be required
across a DC input source to prevent large voltage droop and
ripple caused by the source’s ESR and the peak primary
switching current (which can reach hundreds of milliamps).
Since the input voltage may be of either polarity, a ceramic
capacitor is recommended.
PELTIER CELL (THERMOELECTRIC GENERATOR)
A Peltier cell is made up of a large number of series-con-
nected P-N junctions, sandwiched between two parallel
ceramic plates. Although Peltier cells are often used as
coolers by applying a DC voltage to their inputs, they will
also generate a DC output voltage, using the Seebeck effect,
when the two plates are at different temperatures.
When used in this manner, they are referred to as thermo-
electric generators (TEGs). The polarity of the output voltage
will depend on the polarity of the temperature differential
between the TEG plates. The magnitude of the output volt-
age is proportional to the magnitude of the temperature
differential between the plates.
The low voltage capability of the LTC3109 design allows it
to operate from a typical TEG with temperature differentials
as low as 1°C of either polarity, making it ideal for harvest-
ing energy in applications where a temperature difference
exists between two surfaces or between a surface and
the ambient temperature. The internal resistance (ESR)
of most TEGs is in the range of 1Ω to 5Ω, allowing for
reasonable power transfer. The curves in Figure 2 show the
open-circuit output voltage and maximum power transfer
for a typical TEG with an ESR of 2Ω, over a 20°C range of
temperature differential (of either polarity).
dT (°C)
1
1
TEG VOPEN-CIRCUIT (mV)
TEG MAXIMUM POUT – IDEAL (mW)
10
100
1000
0.1
1
10
100
10 100
3109 F02
TEG: 30mm SQUARE
127 COUPLES
R = 2Ω
VOC MAX POUT
(IDEAL)
Figure 2. Typical Performance of a Peltier Cell
Acting as a Power Generator (TEG)
LTC3109
13
3109fa
APPLICATIONS INFORMATION
TEG LOAD MATCHING
The LTC3109 was designed to present an input resistance
(load) in the range of 2Ω to 10Ω, depending on input volt-
age, transformer turns ratio and the C1A and C2A capacitor
values (as shown in the Typical Performance curves). For
a given turns ratio, as the input voltage drops, the input
resistance increases. This feature allows the LTC3109 to
optimize power transfer from sources with a few Ohms
of source resistance, such as a typical TEG. Note that a
lower source resistance will always provide more output
current capability by providing a higher input voltage
under load.
UNIPOLAR APPLICATIONS
The LTC3109 can also be confi gured to operate from two
independent unipolar voltage sources, such as two TEGs
in different locations. In this confi guration, energy can be
harvested from either or both sources simultaneously. See
the Typical Applications for an example.
The LTC3109 can also be confi gured to operate from a
single unipolar source, using a single step-up transformer,
by ganging its VIN and SW pins together. In this manner,
it can extract the most energy from very low resistance
sources. See Figure 3 for an example of this confi guration,
along with the performance curves.
PELTIER CELL (TEG) SUPPLIERS
Peltier cells are available in a wide range of sizes and power
capabilities, from less than 10mm square to over 50mm
square. They are typically 2mm to 5mm in height. A list
of some Peltier cell manufacturers is given in Table 3 and
some recommended part numbers in Table 4.
COMPONENT SELECTION
Step-Up Transformer
The turns ratio of the step-up transformers will determine
how low the input voltage can be for the converter to start.
Due to the auto-polarity architecture, two identical step-up
transformers should be used, unless the temperature drop
across the TEG is signifi cantly different in one polarity, in
which case the ratios may be different.
Table 3. Peltier Cell Manufacturers
CUI Inc
www.cui.com
Ferrotec
www.ferrotec.com/products/thermal/modules/
Fujitaka
www.fujitaka.com/pub/peltier/english/thermoelectric_power.html
Hi-Z Technology
www.hi-z.com
Kryotherm
www.kryotherm
Laird Technologies
www.lairdtech.com
Micropelt
www.micropelt.com
Nextreme
www.nextreme.com
TE Technology
www.tetech.com/Peltier-Thermoelectric-Cooler-Modules.html
Tellurex
www.tellurex.com/
Table 4. Recommended TEG Part Numbers by Size
MANUFACTURER 15mm 20mm 30mm 40mm
CUI Inc. (Distributor) CP60133 CP60233 CP60333 CP85438
Ferrotec 9501/031/030 B 9501/071/040 B 9500/097/090 B 9500/127/100 B
Fujitaka FPH13106NC FPH17106NC FPH17108AC FPH112708AC
Kryotherm TGM-127-1.0-0.8 LCB-127-1.4-1.15
Laird Technology PT6.7.F2.3030.W6 PT8.12.F2.4040.TA.W6
Marlow Industries RC3-8-01 RC6-6-01 RC12-8-01LS
Tellurex C2-15-0405 C2-20-0409 C2-30-1505 C2-40-1509
TE Technology TE-31-1.0-1.3 TE-31-1.4-1.15 TE-71-1.4-1.15 TE-127-1.4-1.05
LTC3109
14
3109fa
APPLICATIONS INFORMATION
GND 10μF
LTC3109
3109 F03a
C1A
C1
1nF
330k
T1
•• VOUT2 VOUT2
C2A
C1B
C2B
SWB
VINB
VS1
VOUT
SET VS2
SWA
VINA
VOUT
VLDO VLDO
VOUT
2.2μF
CIN
VIN
PG00D
VOUT2_EN
PG00D
VOUT2_ENABLE
NOTE: VALUES FOR CIN, T1, C1 AND COUT
ARE DETERMINED BY THE APPLICATION
VSTORE
VAUX
+
COUT
+
Figure 3. Unipolar Application
Typical IVOUT vs VIN for Unipolar
Confi guration
Typical Effi ciency vs VIN for
Unipolar Confi guration
VIN (mV)
10
10
IVOUT (μA)
100
1000
10000
100 1000
3109 F03b
1:100, C1 = 6.8nF
1:50, C1 = 33nF
1:20, C1 = 68nF
VOUT = 3.3V
VIN (mV)
10
20
EFFICIENCY (%)
30
40
100 1000
3109 F03c
10
0
60
50
15
25
35
5
55
45
1:100, C1 = 6.8nF
1:50, C1 = 33nF
1:20, C1 = 68nF
Typical Input Current vs VIN for
Unipolar Confi guration
Typical RIN vs VIN for Unipolar
Confi guration
VIN (mV)
10
200
INPUT CURRENT (mA)
300
400
100 1000
3109 F03d
100
0
600
500
150
250
350
50
550
450
1:100, C1 = 6.8nF
1:50, C1 = 33nF
1:20, C1 = 68nF
VIN (mV)
10
INPUT RESISTANCE (Ω)
1.0
2.0
100 1000
3109 F03e
0
4.0
3.0
1.5
0.5
3.5
2.5
1:100, C1 = 6.8nF
1:50, C1 = 33nF
1:20, C1 = 68nF
dT (°K)
100
0.1
POUT (mW)
1
10
10
3109 F03f
VOUT = 5V
VOUT = 3.3V
FERROTEC 9500/127/100B, 40mm TEG
C1 = 33nF,
T1 = COILCRAFT LPR6235-123QML
1:50 RATIO
Typical PVOUT vs dT for Unipolar
Confi guration
LTC3109
15
3109fa
APPLICATIONS INFORMATION
Using a 1:100 primary-secondary ratio yields start-up
voltages as low as 30mV. Other factors that affect per-
formance are the resistance of the transformer windings
and the inductance of the windings. Higher DC resistance
will result in lower effi ciency and higher start-up volt-
ages. The secondary winding inductance will determine
the resonant frequency of the oscillator, according to the
formula below.
Freq =1
2•π•L
SEC •C Hz
where LSEC is the inductance of one of the secondary
windings and C is the load capacitance on the second-
ary winding. This is comprised of the input capacitance
at pin C2A or C2B, typically 70pF each, in parallel with
the transformer secondary winding’s shunt capacitance.
The recommended resonant frequency is in the range of
10kHz to 100kHz. Note that loading will also affect the
resonant frequency. See Table 5 for some recommended
transformers.
Table 5. Recommended Transformers
VENDOR
TYPICAL START-
UP VOLTAGE PART NUMBER
Coilcraft
www.coilcraft.com
25mV
35mV
85mV
LPR6235-752SML (1:100 ratio)
LPR6235-123QML (1:50 ratio)
LPR6235-253PML (1:20 ratio)
Würth
www.we-online
25mV
35mV
85mV
S11100034 (1:100 Ratio)
S11100033 (1:50 Ratio)
S11100032 (1:20 Ratio)
USING EXTERNAL CHARGE PUMP RECTIFIERS
The synchronous rectifi ers in the LTC3109 have been
optimized for low frequency, low current operation, typical
of low input voltage applications. For applications where
the resonant oscillator frequency exceeds 100kHz, or a
transformer turns ratio of less than 1:20 is used, or the
C1A and C1B capacitor values are greater than 68nF, the
use of external charge pump rectifi ers (1N4148 or 1N914
or equivalent) is recommended. See the Typical Application
circuits for an example. Avoid the use of Schottky recti-
ers, as their low forward voltage increases the minimum
start-up voltage.
C1 CAPACITOR
The charge pump capacitor that is connected from each
transformers secondary winding to the corresponding
C1A and C1B pins has an effect on converter input resis-
tance and maximum output current capability. Generally
a minimum value of 1nF is recommended when operating
from very low input voltages using a transformer with
a ratio of 1:100. Capacitor values of 2.2nF to 10nF will
provide higher output current at higher input voltages,
however larger capacitor values can compromise perfor-
mance when operating at low input voltage or with high
resistance sources. For higher input voltages and lower
turns ratios, the value of the C1 capacitor can be increased
for higher output current capability. Refer to the Typical
Applications examples for the recommended value for a
given turns ratio.
C2 CAPACITOR
The C2 capacitors connect pins C2A and C2B to their
respective transformer secondary windings. For most
applications a capacitor value of 470pF is recommended.
Smaller capacitor values tend to raise the minimum
start-up voltage, and larger capacitor values can lower
effi ciency.
Note that the C1 and C2 capacitors must have a voltage
rating greater than the maximum input voltage times the
transformer turns ratio.
VOUT AND VSTORE CAPACITOR
For pulsed load applications, the VOUT capacitor should
be sized to provide the necessary current when the load
is pulsed on. The capacitor value required will be dictated
by the load current (ILOAD), the duration of the load pulse
(tPULSE), and the amount of VOUT voltage droop the ap-
plication can tolerate (ΔVOUT). The capacitor must be
rated for whatever voltage has been selected for VOUT by
VS1 and VS2:
COUTF) ILOAD(mA)•t
PULSE(ms)
ΔVOUT (V)
LTC3109
16
3109fa
APPLICATIONS INFORMATION
Note that there must be enough energy available from the
input voltage source for VOUT to recharge the capacitor
during the interval between load pulses (as discussed in
Design Example 1). Reducing the duty cycle of the load
pulse will allow operation with less input energy.
The VSTORE capacitor may be of very large value (thou-
sands of microfarads or even Farads), to provide energy
storage at times when the input voltage is lost. Note that
this capacitor can charge all the way to the VAUX clamp
voltage of 5.25V typical (regardless of the settings for
VOUT), so be sure that the holdup capacitor has a work-
ing voltage rating of at least 5.5V at the temperature that
it will be used.
The VSTORE input is not designed to provide high pulse
load currents to VOUT
. The current path from VSTORE to
VOUT is limited to about 26mA max.
The VSTORE capacitor can be sized using the following
formula:
CSTORE A +IQ+ILDO +IPULSE •t
PULSE •f
()
()
•t
STORE
5.25 V
OUT
where 7μA is the quiescent current of the LTC3109, IQ is
the load on VOUT in between pulses, ILDO is the load on
the LDO between pulses, IPULSE is the total load during the
pulse, tPULSE is the duration of the pulse, f is the frequency
of the pulses, tSTORE is the total storage time required
and VOUT is the output voltage required. Note that for a
programmed output voltage of 5V, the VSTORE capacitor
cannot provide any benefi cial storage time to VOUT
.
To minimize losses and capacitor charge time, all capaci-
tors used for VOUT and VSTORE should be low leakage.
See Table 6 for recommended storage capacitors.
Table 6. Recommended Storage Capacitors
VENDOR PART NUMBER/SERIES
AVX
www.avx.com
BestCap Series
TAJ and TPS Series Tantalum
Cap-XX
www.cap-xx.com
GZ Series
Cooper/Bussman
www.bussmann.com/3/PowerStor.html
KR Series
P Series
Vishay/Sprague
www.vishay.com/capacitors
Tantamount 592D
595D Tantalum
Note that storage capacitors requiring voltage balancing
resistors are not recommended due to the steady-state
current draw of the resistors.
PCB LAYOUT GUIDELINES
Due to the rather low switching frequency of the resonant
converter and the low power levels involved, PCB layout
is not as critical as with many other DC/DC converters.
There are however, a number of things to consider.
Due to the very low input voltages the circuit operates from,
the connections to VIN, the primary of the transformers
and the SW, VIN and GND pins of the LTC3109 should be
designed to minimize voltage drop from stray resistance,
and able to carry currents as high as 500mA. Any small
voltage drop in the primary winding conduction path will
lower effi ciency and increase start-up voltage and capaci-
tor charge time.
Also, due to the low charge currents available at the out-
puts of the LTC3109, any sources of leakage current on
the output voltage pins must be minimized. An example
board layout is shown in Figure 4.
Figure 4. Example Component Placement for 2-Layer PC Board
(QFN Package). Note That VSTORE and VOUT Capacitor Sizes
are Application Dependent
LTC3109
17
3109fa
APPLICATIONS INFORMATION
DESIGN EXAMPLE 1
This design example will explain how to calculate the
necessary reservoir capacitor value for VOUT in pulsed-
load applications, such as a wireless sensor/transmitter.
In these types of applications, the load is very small for a
majority of the time (while the circuitry is in a low power
sleep state), with pulses of load current occurring periodi-
cally during a transmit burst.
The reservoir capacitor on VOUT supports the load during
the transmit pulse; the long sleep time between pulses
allows the LTC3109 to accumulate energy and recharge
the capacitor (either from the input voltage source or the
storage capacitor). A method for calculating the maximum
rate at which the load pulses can occur for a given output
current from the LTC3109 will also be shown.
In this example, VOUT is set to 3.3V, and the maximum
allowed voltage droop during a transmit pulse is 10%, or
0.33V. The duration of a transmit pulse is 5ms, with a total
average current requirement of 20mA during the pulse.
Given these factors, the minimum required capacitance
on VOUT is:
COUT μF
()
20mA 5ms
0.33V =303μF
Note that this equation neglects the effect of capacitor ESR
on output voltage droop. For ceramic capacitors and low
ESR tantalum capacitors, the ESR will have a negligible
effect at these load currents. However, beware of the voltage
coeffi cient of ceramic capacitors, especially those in small
case sizes. This greatly reduces the effective capacitance
when a DC bias is applied.
A standard value of 330μF could be used for COUT in
this case. Note that the load current is the total current
draw on VOUT
, VOUT2 and VLDO, since the current for all
of these outputs must come from VOUT during a pulse.
Current contribution from the capacitor on VSTORE is not
considered, since it may not be able to recharge between
pulses. Also, it is assumed that the harvested charge
current from the LTC3109 is negligible compared to the
magnitude of the load current during the pulse.
To calculate the maximum rate at which load pulses can
occur, you must know how much charge current is avail-
able from the LTC3109 VOUT pin given the input voltage
source being used. This number is best found empirically,
since there are many factors affecting the effi ciency of the
converter. You must also know what the total load cur-
rent is on VOUT during the sleep state (between pulses).
Note that this must include any losses, such as storage
capacitor leakage.
Let’s assume that the charge current available from the
LTC3109 is 150μA and the total current draw on VOUT and
VLDO in the sleep state is 17μA, including capacitor leakage.
We’ll also use the value of 330μF for the VOUT capacitor.
The maximum transmit rate (neglecting the duration of
the transmit pulse, which is very short compared to the
period) is then given by:
T=330μF 0.33V
150μA 17μA =0.82sec or fMAX =1.2Hz
Therefore, in this application example, the circuit can sup-
port a 5ms transmit pulse of 20mA every 0.82 seconds.
It can be seen that for systems that only need to transmit
every few seconds (or minutes or hours), the average
charge current required is extremely small, as long as
the sleep or standby current is low. Even if the available
charge current in the example above was only 21μA, if the
sleep current was only 5μA, it could still transmit a pulse
every seven seconds.
The following formula will allow you to calculate the time
it will take to charge the LDO output capacitor and the
VOUT capacitor the fi rst time, from zero volts. Here again,
the charge current available from the LTC3109 must be
known. For this calculation, it is assumed that the LDO
output capacitor is 2.2μF:
tLDO =2.2V 2.2μF
ICHG –I
LDO
If there was 150μA of charge current available and a 5μA
load on the LDO (when the processor is sleeping), the time
for the LDO to reach regulation would be only 33ms.
LTC3109
18
3109fa
APPLICATIONS INFORMATION
The time for VOUT to charge and reach regulation can be
calculated by the formula below, which assumes VOUT is
programmed to 3.3V and COUT is 330μF:
tVOUT =3.3V 330μF
ICHG –I
VOUT –I
LDO
+tLDO
With 150μA of charge current available and 5μA of load on
both VOUT
and VLDO, the time for VOUT to reach regula-
tion after the initial application of power would be 7.81
seconds.
DESIGN EXAMPLE 2
In most pulsed-load applications, the duration, magnitude
and frequency of the load current pulses are known and
xed. In these cases, the average charge current required
from the LTC3109 to support the average load must be
calculated, which can be easily done by the following:
ICHG IQ+IPULSE •t
PULSE
T
where IQ is the sleep current supplied by VOUT and VLDO
to the external circuitry in-between load pulses, including
output capacitor leakage, IPULSE is the total load current
during the pulse, tPULSE is the duration of the load pulse
and T is the pulse period (essentially the time between
load pulses).
In this example, IQ is 5μA, IPULSE is 100mA, tPULSE is 5ms
and T is one hour. The average charge current required
from the LTC3109 would be:
ICHG A +100mA 0.005sec
3600sec =5.14μA
Therefore, if the LTC3109 has an input voltage that allows
it to supply a charge current greater than just 5.14μA, the
application can support 100mA pulses lasting 5ms every
hour. It can be seen that the sleep current of 5μA is the
dominant factor in this example, because the transmit
duty cycle is so small (0.00014%). Note that for a VOUT
of 3.3V, the average power required by this application is
only 17μW (not including converter losses).
Keep in mind that the charge current available from the
LTC3109 has no effect on the sizing of the VOUT capacitor,
and the VOUT capacitor has no effect on the maximum
allowed pulse rate.
LTC3109
19
3109fa
TYPICAL APPLICATIONS
Energy Harvester Operates from Small Temperature Differentials of Either Polarity
GND F
5.25V
2.2V
LTC3109
3.3V
CSTORE
3109 TA02
C1A
1nF
2.2μF
470pF
1nF
470pF
T1
1:100
TEG
(THERMOELECTRIC GENERATOR)
±30mV TO ±500mV
••
T2
1:100
••
VOUT2
C2A
C1B
C2B
SWB
VINB
VS1
VS2
T1, T2: COILCRAFT LPR6235-752SML
SWA
VINA
VOUT
VLDO
PG00D
VOUT2_EN
VSTORE
VAUX +
470μF
OPTIONAL SWITCHED OUTPUT FOR SENSORS
+
μP
LOW POWER
RADIO
SENSOR(S)
Li-Ion Battery Charger and LDO Operates from a Low Level AC Input
GND F
2.2V
LTC3109
3109 TA03
C1A
1nF
Li-Ion
BATTERY
*THE LTC4070 IS A PRECISION BATTERY
CHARGER OFFERING UNDERVOLTAGE
PROTECTION, WITH A TYPICAL SUPPLY
CURRENT OF ONLY 0.45μA
FAIRCHILD
FDG328P
470pF
60Hz
1nF
470pF
T1
1:100
50mV TO
300mV RMS
T2
1:100
••
••
VOUT2
C2A
C1B
C2B
SWB
VINB
T1, T2: COILCRAFT
LPR6235-752SML
VS1
VS2
SWA
VINA
VOUT
VLDO VLDO
TO LOAD
4.1V
NC
2.2μF
PG00D
VOUT2_EN
VSTORE
VAUX
+
AC
LBO
NTC
VCC
ADJ
NC
NC
NC
HBO
DRV
NTCBIAS
LTC4070*
GND
LTC3109
20
3109fa
TYPICAL APPLICATIONS
Dual-Input Energy Harvester Generates 5V and 2.2V from Either or Both TEGs,
Operating at Different Temperatures of Fixed Polarity
GND F
2.2V
LTC3109
5V VOUT
VLDO
3109 TA04
C1A
1nF
+
+
2.2μF
470pF
THERMOELECTRIC
GENERATOR
25mV TO 500mV
THERMOELECTRIC
GENERATOR OR
THERMOPILE
35mV TO 1000mV
4.7nF
470pF
COILCRAFT
LPR6235-752SML
1:100
••
COILCRAFT
LPR6235-123QML
1:50
••
VOUT2
C2A
C1B
C2B
SWB
VINB
VS1
VS2
SWA
VINA
VOUT
VLDO
PG00D PG00D
*THE VALUE OF THE COUT CAPACITOR IS
DETEMINED BY THE LOAD CHARACTERISTICS
VOUT2_EN
VSTORE
VAUX
COUT*
+
Unipolar Energy Harvester Charges Battery Backup
GND F
LTC3109
3109 TA06a
C1A
33nF
Li-Ion
BATTERY
FAIRCHILD
FDG328P
1nF
330k
T1
1:50
+
•• VOUT2
C2A
C1B
C2B
SWB
VINB
T1: COILCRAFT
LPR6235-123QML
VS1
VS2
SWA
VINA
VOUT
VLDO VLDO
PGOOD
VOUT
3.3V
4.1V
NC
2.2μF
47μF
THERMOELECTIC
GENERATOR
FERROTEC 9500/127/100B
330μF
4V
2.2V
PG00D
VOUT2_EN
VSTORE
VAUX
+
LBO
NTC
VCC
ADJ
NC
NC
NC
HBO
DRV
NTCBIAS
LTC4070
GND
+
dT (°K)
0
POUT (mW)
3.0
4.0
5.0
8
3109 TA06b
2.0
1.0
2.5
3.5
4.5
1.5
0.5
021 43 67 9
510
FERROTEC 9500/127/100B
C1 = 33nF
T1 = COILCRAFT LPR6235-123QML
1:50 RATIO
VOUT = 3.3V
Typical PVOUT vs dT for Unipolar
Confi guration
LTC3109
21
3109fa
PACKAGE DESCRIPTION
4.00 ±0.10
4.00 ±0.10
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-1)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
2019
1
2
BOTTOM VIEW—EXPOSED PAD
2.00 REF
2.45 ±0.10
0.75 ±0.05 R = 0.115
TYP
R = 0.05
TYP
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF20) QFN 01-07 REV A
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.00 REF 2.45 ±0.05
3.10 ±0.05
4.50 ±0.05
PACKAGE OUTLINE
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 w 45°
CHAMFER
2.45 ±0.10
2.45 ±0.05
UF Package
20-Lead Plastic QFN (4mm w 4mm)
(Reference LTC DWG # 05-08-1710 Rev A)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC3109
22
3109fa
PACKAGE DESCRIPTION
.337 – .344*
(8.560 – 8.738)
GN20 REV B 0212
12
345678910
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
1617181920 15 14 13 12 11
.016 – .050
(0.406 – 1.270)
.015 ±.004
(0.38 ±0.10) w 45s
0° – 8° TYP
.0075 – .0098
(0.19 – 0.25)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.058
(1.473)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165 ±.0015
.045 ±.005
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE
GN Package
20-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641 Rev B)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC3109
23
3109fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 06/12 Added vendor Information to Table 5 15
LTC3109
24
3109fa
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2010
LT 0612 REV A • PRINTED IN USA
RELATED PARTS
TYPICAL APPLICATION
Unipolar TEG Energy Harvester for Low Resistance/High Current Inputs,
Using External Charge Pump Rectifi ers
GND 10μF
2.2V
LTC3109
3.3V VOUT
VOUT2
SWITCHED VOUT GOES HIGH
WHEN PGOOD IS HIGH
VLDO
3109 TA05
C1A
VAUX
BAS31
1.0μF
1nF
2.2μF
0.1μF
+
70mV TO 1V
COILCRAFT
LPR6235-253PML
1:20
•• VOUT2
C2A
C1B
C2B
SWB
VINB
VS1
VS2
SWA
VINA
VOUT
VLDO
PG00D PG00D
VOUT2_EN
VSTOREVAUX
VAUX
COUT
+
CSTORE
+
PART NUMBER DESCRIPTION COMMENTS
LTC3108/
LTC3108-1
Ultralow Voltage Step-Up Converter and
Power Manager
VIN: 0.02V to 1V, VOUT = 2.2V, 2.35V, 3.3V, 4.1V, 5V, IQ = 6μA,
4mm × 3mm DFN-12, SSOP-16; LTC3108-1 VOUT = 2.2V, 2.5V, 3V, 3.7V, 4.5V
LTC4070 Micropower Shunt Battery Charger 1% Float Voltage Accuracy, 50mA Max Shunt Current, VOUT = 4.0V, 4.1V, 4.2V,
IQ = 450nA, 2mm × 3mm DFN-8, MSOP-8
LTC1041 Bang-Bang Controller VIN: 2.8V to 16V; VOUT(MIN) = Adj; IQ = 1.2mA; ISD < 1μA; SO-8 Package
LTC1389 Nanopower Precision Shunt Voltage Reference VOUT(MIN) = 1.25V; IQ = 0.8μA; SO-8 Package
LT1672/LT1673/
LT1674
Single-/Dual-/Quad-Precision 2μA Rail-to-Rail
Op Amps
SO-8, SO-14 and MSOP-8 Packages
LT3009 3μA IQ, 20mA Linear Regulator VIN: 1.6V to 20V; VOUT(MIN): 0.6V to Adj, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V,
5V to Fixed; IQ = 3μA; ISD < 1μA; 2mm × 2mm DFN-8 and SC70 Packages
LTC3588-1 Piezoelectric Energy Generator with Integrated
High Effi ciency Buck Converter
VIN: 2.7V to 20V; VOUT(MIN): Fixed to 1.8V, 2.5V, 3.3V, 3.6V; IQ = 0.95μA;
3mm × 3mm DFN-10 and MSOP-10E Packages
LT8410/LT8410-1 Micropower 25mA/8mA Low Noise Boost Converter
with Integrated Schottky Diode and Output
Disconnect
VIN: 2.6V to 16V; VOUT(MIN) = 40VMAX; IQ = 8.5μA; ISD < 1μA;
2mm × 2mm DFN-8 Package
IVOUT vs VIN
VIN (mV)
0
IVOUT (mA)
8
12
800
3109 TA05b
4
0200 400 600
100 300 500 700
16
6
10
2
14
1:20 RATIO
C1 = 1μF
EXTERNAL DIODES
TYPICAL
VIN (mV)
10
0
EFFICIENCY (%)
10
20
30
40
100 1000
3109 TA05c
50
5
15
25
35
45
Effi ciency vs VIN