Features
•Single 2.5V - 3.6V or 2.7V - 3.6V Supply
•RapidS™ Serial Interface: 66MHz Maximum Clock Frequency
– SPI Compatible Modes 0 and 3
•User Configurable Page Size
– 512-Bytes per Page
– 528-Bytes per Page
– Page Size Can Be Factory Pre-configured for 512-Bytes
•Page Program Operation
– Intelligent Programming Operation
– 4,096 Pages (512-/528-Bytes/Page) Main Memory
•Flexible Erase Options
– Page Erase (512-Bytes)
– Block Erase (4-Kbytes)
– Sector Erase (128-Kbytes)
– Chip Erase (16-Mbits)
•Two SRAM Data Buffers (512-/528-Bytes)
– Allows Receiving of Data while Reprogramming the Flash Array
•Continuous Read Capability through Entire Array
– Ideal for Code Shadowing Applications
•Low-power Dissipation
– 7mA Active Read Current Typical
– 25µA Standby Current Typical
– 15µA Deep Power Down Typical
•Hardware and Software Data Protection Features
– Individual Sector
•Sector Lockdown for Secure Code and Data Storage
– Individual Sector
•Security: 128-byte Security Register
– 64-byte User Programmable Space
– Unique 64-byte Device Identifier
•JEDEC Standard Manufacturer and Device ID Read
•100,000 Program/Erase Cycles Per Page Minimum
•Data Retention – 20 Years
•Industrial Temperature Range
•Green (Pb/Halide-free/RoHS Compliant) Packaging Options
1. Description
The AT45DB161D is a 2.5V or 2.7V, serial-interface sequential access Flash memory
ideally suited for a wide variety of digital voice-, image-, program code- and data-stor-
age applications. The AT45DB161D supports RapidS serial interface for applications
requiring very high speed operations. RapidS serial interface is SPI compatible for
frequencies up to 66MHz. Its 17,301,504-bits of memory are organized as 4,096
pages of 512-bytes or 528-bytes each. In addition to the main memory, the
AT45DB161D also contains two SRAM buffers of 512-/528-bytes each. The buffers
allow the receiving of data while a page in the main Memory is being reprogrammed,
as well as writing a continuous data stream. EEPROM emulation (bit or byte alterabil-
ity) is easily handled with a self-contained three step read-modify-write
16-megabit
2.5V or 2.7V
DataFlash
AT45DB161D
(Not Recommended
for New Designs)
3500Q–DFLASH–11/2017
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AT45DB161D
operation. Unlike conventional Flash memories that are accessed randomly with multiple address lines and a
parallel interface, the Adesto DataFlash® uses a RapidS serial interface to sequentially access its data. The simple
sequential access dramatically reduces active pin count, facilitates hardware layout, increases system reliability,
minimizes switching noise, and reduces package size. The device is optimized for use in many commercial and
industrial applications where high-density, low-pin count, low-voltage and low-power are essential.
To allow for simple in-system reprogrammability, the AT45DB161D does not require high input voltages for
programming. The device operates from a single power supply, 2.5V to 3.6V or 2.7V to 3.6V, for both the program
and read operations. The AT45DB161D is enabled through the chip select pin (CS) and accessed via a three-wire
interface consisting of the Serial Input (SI), Serial Output (SO), and the Serial Clock (SCK).
All programming and erase cycles are self-timed.
2. Pin Configurations and Pinouts
Note: 1. The metal pad on the bottom of the MLF package is floating. This pad can be a “No Connect” or connected to GND
Figure 2-1. TSOP Top View: Type 1 Figure 2-2. BGA Package Ball-out
(Top View)
Figure 2-3. MLF (VDFN) Top View Figure 2-4. SOIC Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
RDY/BUSY
RESET
WP
NC
NC
VCC
GND
NC
NC
NC
CS
SCK
SI
SO
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
A
B
C
D
E
54321
NC NC NC NC
NCNC
NC
NC
NC
NC NC NC
NC
NC
NCVCCGNDSCK
CS RDY/BSY WP
SISO RESET
SI
SCK
RESET
CS
SO
GND
VCC
WP
8
7
6
5
1
2
3
4
1
2
3
4
8
7
6
5
SI
SCK
RESET
CS
SO
GND
VCC
WP
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AT45DB161D
Table 2-1. Pin Configurations
Symbol Name and Function
Asserte
d State Type
CS
Chip Select: Asserting the CS pin selects the device. When the CS pin is deasserted, the
device will be deselected and normally be placed in the standby mode (not Deep Power-Down
mode), and the output pin (SO) will be in a high-impedance state. When the device is
deselected, data will not be accepted on the input pin (SI).
A high-to-low transition on the CS pin is required to start an operation, and a low-to-high
transition is required to end an operation. When ending an internally self-timed operation such
as a program or erase cycle, the device will not enter the standby mode until the completion of
the operation.
Low Input
SCK
Serial Clock: This pin is used to provide a clock to the device and is used to control the flow of
data to and from the device. Command, address, and input data present on the SI pin is always
latched on the rising edge of SCK, while output data on the SO pin is always clocked out on the
falling edge of SCK.
– Input
SI
Serial Input: The SI pin is used to shift data into the device. The SI pin is used for all data input
including command and address sequences. Data on the SI pin is always latched on the rising
edge of SCK.
– Input
SO Serial Output: The SO pin is used to shift data out from the device. Data on the SO pin is
always clocked out on the falling edge of SCK. –Outpu
t
WP
Write Protect: When the WP pin is asserted, all sectors specified for protection by the Sector
Protection Register will be protected against program and erase operations regardless of
whether the Enable Sector Protection command has been issued or not. The WP pin functions
independently of the software controlled protection method. After the WP pin goes low, the
content of the Sector Protection Register cannot be modified.
If a program or erase command is issued to the device while the WP pin is asserted, the device
will simply ignore the command and perform no operation. The device will return to the idle state
once the CS pin has been deasserted. The Enable Sector Protection command and Sector
Lockdown command, however, will be recognized by the device when the WP pin is asserted.
The WP pin is internally pulled-high and may be left floating if hardware controlled protection will
not be used. However, it is recommended that the WP pin also be externally connected to VCC
whenever possible.
Low Input
RESET
Reset: A low state on the reset pin (RESET) will terminate the operation in progress and reset
the internal state machine to an idle state. The device will remain in the reset condition as long
as a low level is present on the RESET pin. Normal operation can resume once the RESET pin
is brought back to a high level.
The device incorporates an internal power-on reset circuit, so there are no restrictions on the
RESET pin during power-on sequences. If this pin and feature are not utilized it is recommended
that the RESET pin be driven high externally.
Low Input
RDY/BUSY
Ready/Busy: This open drain output pin will be driven low when the device is busy in an
internally self-timed operation. This pin, which is normally in a high state (through an external
pull-up resistor), will be pulled low during programming/erase operations, compare operations,
and page-to-buffer transfers.
The busy status indicates that the Flash memory array and one of the buffers cannot be
accessed; read and write operations to the other buffer can still be performed.
–Outpu
t
VCC
Device Power Supply: The VCC pin is used to supply the source voltage to the device.
Operations at invalid VCC voltages may produce spurious results and should not be attempted. –Power
GND Ground: The ground reference for the power supply. GND should be connected to the system
ground. –Groun
d
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AT45DB161D
3. Block Diagram
4. Memory Array
To provide optimal flexibility, the memory array of the AT45DB161D is divided into three levels of granularity
comprising of sectors, blocks, and pages. The “Memory Architecture Diagram” illustrates the breakdown of each
level and details the number of pages per sector and block. All program operations to the DataFlash occur on a
page by page basis. The erase operations can be performed at the chip, sector, block or page level.
Figure 4-1. Memory Architecture Diagram
FLASH MEMORY ARRAY
PAGE (512-/528-BYTES)
BUFFER 2 (512-/528-BYTES)BUFFER 1 (512-/528-BYTES)
I/O INTERFACE
SCK
CS
RESET
VCC
GND
RDY/BUSY
WP
SO SI
SECTOR 0a = 8 Pages
4,096-/4,224-bytes
SECTOR 0b = 248 Pages
126,976-/130,944-bytes
Block = 4,096-/4,224-bytes
8 Pages
SECTOR 0
SECTOR 1
Page = 512-/528-bytes
PAGE 0
PAGE 1
PAGE 6
PAGE 7
PAGE 8
PAGE 9
PAGE 4,094
PAGE 4,095
BLOCK 0
PAGE 14
PAGE 15
PAGE 16
PAGE 17
PAGE 18
BLOCK 1
SECTOR ARCHITECTURE BLOCK ARCHITECTURE PAGE ARCHITECTURE
BLOCK 0
BLOCK 1
BLOCK 30
BLOCK 31
BLOCK 32
BLOCK 33
BLOCK 510
BLOCK 511
BLOCK 62
BLOCK 63
BLOCK 64
BLOCK 65
SECTOR 2
SECTOR 15 = 256 Pages
131,072-/135,168-bytes
BLOCK 2
SECTOR 1 = 256 Pages
131,072-/135,168-bytes
SECTOR 14 = 256 Pages
131,072-/135,168-bytes
SECTOR 2 = 256 Pages
131,072-/135,168-bytes
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AT45DB161D
5. Device Operation
The device operation is controlled by instructions from the host processor. The list of instructions and their
associated opcodes are contained in Table 15-1 on page 27 through Table 15-7 on page 30. A valid instruction
starts with the falling edge of CS followed by the appropriate 8-bit opcode and the desired buffer or main memory
address location. While the CS pin is low, toggling the SCK pin controls the loading of the opcode and the desired
buffer or main memory address location through the SI (serial input) pin. All instructions, addresses, and data are
transferred with the most significant bit (MSB) first.
Buffer addressing for standard DataFlash page size (528-bytes) is referenced in the datasheet using the
terminology BFA9 - BFA0 to denote the 10 address bits required to designate a byte address within a buffer. Main
memory addressing is referenced using the terminology PA11 - PA0 and BA9 - BA0, where PA11 - PA0 denotes
the 12 address bits required to designate a page address and BA9 - BA0 denotes the 10 address bits required to
designate a byte address within the page.
For “Power of 2” binary page size (512-bytes) the Buffer addressing is referenced in the datasheet using the
conventional terminology BFA8 - BFA0 to denote the nine address bits required to designate a byte address within
a buffer. Main memory addressing is referenced using the terminology A20 - A0, where A20 - A9 denotes the 12
address bits required to designate a page address and A8 - A0 denotes the nine address bits required to designate
a byte address within a page.
6. Read Commands
By specifying the appropriate opcode, data can be read from the main memory or from either one of the two SRAM
data buffers. The DataFlash supports RapidS protocols for Mode 0 and Mode 3. Please refer to the “Detailed Bit-
level Read Timing” diagrams in this datasheet for details on the clock cycle sequences for each mode.
6.1 Continuous Array Read (Legacy Command: E8H): Up to 66MHz
By supplying an initial starting address for the main memory array, the Continuous Array Read command can be
utilized to sequentially read a continuous stream of data from the device by simply providing a clock signal; no
additional addressing information or control signals need to be provided. The DataFlash incorporates an internal
address counter that will automatically increment on every clock cycle, allowing one continuous read operation
without the need of additional address sequences. To perform a continuous read from the standard DataFlash
page size (528-bytes), an opcode of E8H must be clocked into the device followed by three address bytes (which
comprise the 24-bit page and byte address sequence) and four don’t care bytes. The first 12 bits (PA11 - PA0) of
the 22-bit address sequence specify which page of the main memory array to read, and the last 10 bits (BA9 -
BA0) of the 22-bit address sequence specify the starting byte address within the page. To perform a continuous
read from the binary page size (512-bytes), the opcode (E8H) must be clocked into the device followed by three
address bytes and four don’t care bytes. The first 12 bits (A20 - A9) of the 21-bits sequence specify which page of
the main memory array to read, and the last nine bits (A8 - A0) of the 21-bits address sequence specify the starting
byte address within the page. The don’t care bytes that follow the address bytes are needed to initialize the read
operation. Following the don’t care bytes, additional clock pulses on the SCK pin will result in data being output on
the SO (serial output) pin.
The CS pin must remain low during the loading of the opcode, the address bytes, the don’t care bytes, and the
reading of data. When the end of a page in main memory is reached during a Continuous Array Read, the device
will continue reading at the beginning of the next page with no delays incurred during the page boundary crossover
(the crossover from the end of one page to the beginning of the next page). When the last bit in the main memory
array has been read, the device will continue reading back at the beginning of the first page of memory. As with
crossing over page boundaries, no delays will be incurred when wrapping around from the end of the array to the
beginning of the array.
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AT45DB161D
A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The
maximum SCK frequency allowable for the Continuous Array Read is defined by the fCAR1 specification. The
Continuous Array Read bypasses both data buffers and leaves the contents of the buffers unchanged.
6.2 Continuous Array Read (High Frequency Mode: 0BH): Up to 66MHz
This command can be used with the serial interface to read the main memory array sequentially in high speed
mode for any clock frequency up to the maximum specified by fCAR1. To perform a continuous read array with the
page size set to 528-bytes, the CS must first be asserted then an opcode 0BH must be clocked into the device
followed by three address bytes and a dummy byte. The first 12 bits (PA11 - PA0) of the 22-bit address sequence
specify which page of the main memory array to read, and the last 10 bits (BA9 - BA0) of the 22-bit address
sequence specify the starting byte address within the page. To perform a continuous read with the page size set to
512-bytes, the opcode, 0BH, must be clocked into the device followed by three address bytes (A20 - A0) and a
dummy byte. Following the dummy byte, additional clock pulses on the SCK pin will result in data being output on
the SO (serial output) pin.
The CS pin must remain low during the loading of the opcode, the address bytes, and the reading of data. When
the end of a page in the main memory is reached during a Continuous Array Read, the device will continue reading
at the beginning of the next page with no delays incurred during the page boundary crossover (the crossover from
the end of one page to the beginning of the next page). When the last bit in the main memory array has been read,
the device will continue reading back at the beginning of the first page of memory. As with crossing over page
boundaries, no delays will be incurred when wrapping around from the end of the array to the beginning of the
array. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The
maximum SCK frequency allowable for the Continuous Array Read is defined by the fCAR1 specification. The
Continuous Array Read bypasses both data buffers and leaves the contents of the buffers unchanged.
6.3 Continuous Array Read (Low Frequency Mode: 03H): Up to 33MHz
This command can be used with the serial interface to read the main memory array sequentially without a dummy
byte up to maximum frequencies specified by fCAR2. To perform a continuous read array with the page size set to
528-bytes, the CS must first be asserted then an opcode, 03H, must be clocked into the device followed by three
address bytes (which comprise the 24-bit page and byte address sequence). The first 12 bits (PA11 - PA0) of the
22-bit address sequence specify which page of the main memory array to read, and the last 10 bits (BA9 - BA0) of
the 22-bit address sequence specify the starting byte address within the page. To perform a continuous read with
the page size set to 512-bytes, the opcode, 03H, must be clocked into the device followed by three address bytes
(A20 - A0). Following the address bytes, additional clock pulses on the SCK pin will result in data being output on
the SO (serial output) pin.
The CS pin must remain low during the loading of the opcode, the address bytes, and the reading of data. When
the end of a page in the main memory is reached during a Continuous Array Read, the device will continue reading
at the beginning of the next page with no delays incurred during the page boundary crossover (the crossover from
the end of one page to the beginning of the next page). When the last bit in the main memory array has been read,
the device will continue reading back at the beginning of the first page of memory. As with crossing over page
boundaries, no delays will be incurred when wrapping around from the end of the array to the beginning of the
array. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The
Continuous Array Read bypasses both data buffers and leaves the contents of the buffers unchanged.
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AT45DB161D
6.4 Main Memory Page Read
A main memory page read allows the user to read data directly from any one of the 4,096 pages in the main
memory, bypassing both of the data buffers and leaving the contents of the buffers unchanged. To start a page
read from the standard DataFlash page size (528-bytes), an opcode of D2H must be clocked into the device
followed by three address bytes (which comprise the 24-bit page and byte address sequence) and four don’t care
bytes. The first 12 bits (PA11 - PA0) of the 22-bit address sequence specify the page in main memory to be read,
and the last 10 bits (BA9 - BA0) of the 22-bit address sequence specify the starting byte address within that page.
To start a page read from the binary page size (512-bytes), the opcode D2H must be clocked into the device
followed by three address bytes and four don’t care bytes. The first 12 bits (A20 - A9) of the 21-bits sequence
specify which page of the main memory array to read, and the last nine bits (A8 - A0) of the 21-bits address
sequence specify the starting byte address within the page. The don’t care bytes that follow the address bytes are
sent to initialize the read operation. Following the don’t care bytes, additional pulses on SCK result in data being
output on the SO (serial output) pin. The CS pin must remain low during the loading of the opcode, the address
bytes, the don’t care bytes, and the reading of data. When the end of a page in main memory is reached, the
device will continue reading back at the beginning of the same page. A low-to-high transition on the CS pin will
terminate the read operation and tri-state the output pin (SO). The maximum SCK frequency allowable for the Main
Memory Page Read is defined by the fSCK specification. The Main Memory Page Read bypasses both data buffers
and leaves the contents of the buffers unchanged.
6.5 Buffer Read
The SRAM data buffers can be accessed independently from the main memory array, and utilizing the Buffer Read
Command allows data to be sequentially read directly from the buffers. Four opcodes, D4H or D1H for buffer 1 and
D6H or D3H for buffer 2 can be used for the Buffer Read Command. The use of each opcode depends on the
maximum SCK frequency that will be used to read data from the buffer. The D4H and D6H opcode can be used at
any SCK frequency up to the maximum specified by fCAR1. The D1H and D3H opcode can be used for lower
frequency read operations up to the maximum specified by fCAR2.
To perform a buffer read from the standard DataFlash buffer (528-bytes), the opcode must be clocked into the
device followed by three address bytes comprised of 14 don’t care bits and 10 buffer address bits (BFA9 - BFA0).
To perform a buffer read from the binary buffer (512-bytes), the opcode must be clocked into the device followed
by three address bytes comprised of 15 don’t care bits and nine buffer address bits (BFA8 - BFA0). Following the
address bytes, one don’t care byte must be clocked in to initialize the read operation. The CS pin must remain low
during the loading of the opcode, the address bytes, the don’t care bytes, and the reading of data. When the end of
a buffer is reached, the device will continue reading back at the beginning of the buffer. A low-to-high transition on
the CS pin will terminate the read operation and tri-state the output pin (SO).
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AT45DB161D
7. Program and Erase Commands
7.1 Buffer Write
Data can be clocked in from the input pin (SI) into either buffer 1 or buffer 2. To load data into the standard
DataFlash buffer (528-bytes), a 1-byte opcode, 84H for buffer 1 or 87H for buffer 2, must be clocked into the
device, followed by three address bytes comprised of 14 don’t care bits and 10 buffer address bits (BFA9 - BFA0).
The 10 buffer address bits specify the first byte in the buffer to be written. To load data into the binary buffers (512-
bytes each), a 1-byte opcode 84H for buffer 1 or 87H for buffer 2, must be clocked into the device, followed by
three address bytes comprised of 15 don’t care bits and nine buffer address bits (BFA8 - BFA0). The nine buffer
address bits specify the first byte in the buffer to be written. After the last address byte has been clocked into the
device, data can then be clocked in on subsequent clock cycles. If the end of the data buffer is reached, the device
will wrap around back to the beginning of the buffer. Data will continue to be loaded into the buffer until a low-to-
high transition is detected on the CS pin.
7.2 Buffer to Main Memory Page Program with Built-in Erase
Data written into either buffer 1 or buffer 2 can be programmed into the main memory. A 1-byte opcode, 83H for
buffer 1 or 86H for buffer 2, must be clocked into the device. For the standard DataFlash page size (528-bytes), the
opcode must be followed by three address bytes consist of two don’t care bits, 12 page address bits (PA11 - PA0)
that specify the page in the main memory to be written and 10 don’t care bits. To perform a buffer to main memory
page program with built-in erase for the binary page size (512-bytes), the opcode 83H for buffer 1 or 86H for buffer
2, must be clocked into the device followed by three address bytes consisting of three don’t care bits 12 page
address bits (A20 - A9) that specify the page in the main memory to be written and nine don’t care bits. When a
low-to-high transition occurs on the CS pin, the part will first erase the selected page in main memory (the erased
state is a logic 1) and then program the data stored in the buffer into the specified page in main memory. Both the
erase and the programming of the page are internally self-timed and should take place in a maximum time of tEP.
During this time, the status register and the RDY/BUSY pin will indicate that the part is busy.
7.3 Buffer to Main Memory Page Program without Built-in Erase
A previously-erased page within main memory can be programmed with the contents of either buffer 1 or buffer 2.
A 1-byte opcode, 88H for buffer 1 or 89H for buffer 2, must be clocked into the device. For the standard DataFlash
page size (528-bytes), the opcode must be followed by three address bytes consist of two don’t care bits, 12 page
address bits (PA11 - PA0) that specify the page in the main memory to be written and 10 don’t care bits. To
perform a buffer to main memory page program without built-in erase for the binary page size (512-bytes), the
opcode 88H for buffer 1 or 89H for buffer 2, must be clocked into the device followed by three address bytes
consisting of three don’t care bits, 12 page address bits (A20 - A9) that specify the page in the main memory to be
written and nine don’t care bits. When a low-to-high transition occurs on the CS pin, the part will program the data
stored in the buffer into the specified page in the main memory. It is necessary that the page in main memory that
is being programmed has been previously erased using one of the erase commands (Page Erase or Block Erase).
The programming of the page is internally self-timed and should take place in a maximum time of tP. During this
time, the status register and the RDY/BUSY pin will indicate that the part is busy.
7.4 Page Erase
The Page Erase command can be used to individually erase any page in the main memory array allowing the
Buffer to Main Memory Page Program to be utilized at a later time. To perform a page erase in the standard
DataFlash page size (528-bytes), an opcode of 81H must be loaded into the device, followed by three address
bytes comprised of two don’t care bits, 12 page address bits (PA11 - PA0) that specify the page in the main
memory to be erased and 10 don’t care bits. To perform a page erase in the binary page size (512-bytes), the
opcode 81H must be loaded into the device, followed by three address bytes consist of three don’t care bits, 12
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AT45DB161D
page address bits (A20 - A9) that specify the page in the main memory to be erased and nine don’t care bits. When
a low-to-high transition occurs on the CS pin, the part will erase the selected page (the erased state is a logical 1).
The erase operation is internally self-timed and should take place in a maximum time of tPE. During this time, the
status register and the RDY/BUSY pin will indicate that the part is busy.
7.5 Block Erase
A block of eight pages can be erased at one time. This command is useful when large amounts of data has to be
written into the device. This will avoid using multiple Page Erase Commands. To perform a block erase for the
standard DataFlash page size (528-bytes), an opcode of 50H must be loaded into the device, followed by three
address bytes comprised of two don’t care bits, nine page address bits (PA11 -PA3) and 13 don’t care bits. The
nine page address bits are used to specify which block of eight pages is to be erased. To perform a block erase for
the binary page size (512-bytes), the opcode 50H must be loaded into the device, followed by three address bytes
consisting of three don’t care bits, nine page address bits (A20 - A12) and 12 don’t care bits. The nine page
address bits are used to specify which block of eight pages is to be erased. When a low-to-high transition occurs
on the CS pin, the part will erase the selected block of eight pages. The erase operation is internally self-timed and
should take place in a maximum time of tBE. During this time, the status register and the RDY/BUSY pin will
indicate that the part is busy.
Table 7-1. Block Erase Addressing
7.6 Sector Erase
The Sector Erase command can be used to individually erase any sector in the main memory. There are 16
sectors and only one sector can be erased at one time. To perform sector 0a or sector 0b erase for the standard
DataFlash page size (528-bytes), an opcode of 7CH must be loaded into the device, followed by three address
bytes comprised of two don’t care bits, nine page address bits (PA11 - PA3) and 13 don’t care bits. To perform a
sector 1-15 erase, the opcode 7CH must be loaded into the device, followed by three address bytes comprised of
two don’t care bits, four page address bits (PA11 - PA8) and 18 don’t care bits. To perform sector 0a or sector 0b
erase for the binary page size (512-bytes), an opcode of 7CH must be loaded into the device, followed by three
address bytes comprised of three don’t care bit and nine page address bits (A20 - A12) and 12 don’t care bits. To
perform a sector 1-15 erase, the opcode 7CH must be loaded into the device, followed by three address bytes
comprised of 3 don’t care bit and four page address bits (A20 - A17) and 17 don’t care bits. The page address bits
are used to specify any valid address location within the sector which is to be erased. When a low-to-high transition
occurs on the CS pin, the part will erase the selected sector. The erase operation is internally self-timed and should
PA11/
A20
PA10/
A19
PA9/
A18
PA8/
A17
PA7/
A16
PA6/
A15
PA5/
A14
PA4/
A13
PA3/
A12
PA2/
A11
PA1/
A10
PA0/
A9 Block
000000000XXX 0
000000001XXX 1
000000010XXX 2
000000011XXX 3
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
111111100XXX 508
111111101XXX 509
111111110XXX 510
111111111XXX 511
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AT45DB161D
take place in a maximum time of tSE. During this time, the status register and the RDY/BUSY pin will indicate that
the part is busy.
Table 7-2. Sector Erase Addressing
7.7 Chip Erase(1)
The entire main memory can be erased at one time by using the Chip Erase command.
To execute the Chip Erase command, a 4-byte command sequence C7H, 94H, 80H and 9AH must be clocked into
the device. Since the entire memory array is to be erased, no address bytes need to be clocked into the device,
and any data clocked in after the opcode will be ignored. After the last bit of the opcode sequence has been
clocked in, the CS pin can be deasserted to start the erase process. The erase operation is internally self-timed
and should take place in a time of tCE. During this time, the Status Register will indicate that the device is busy.
The Chip Erase command will not affect sectors that are protected or locked down; the contents of those sectors
will remain unchanged. Only those sectors that are not protected or locked down will be erased.
Note: 1. Refer to the errata regarding Chip Erase on page 51.
The WP pin can be asserted while the device is erasing, but protection will not be activated until the internal erase
cycle completes.
Table 7-3. Chip Erase Command
Figure 7-1. Chip Erase
Note: 1. Refer to the errata regarding Chip Erase on page 51
PA11/
A20
PA10/
A19
PA9/
A18
PA8/
A17
PA7/
A16
PA6/
A15
PA5/
A14
PA4/
A13
PA3/
A12
PA2/
A11
PA1/
A10
PA0/
A9 Sector
000000000XXX 0a
000000001XXX 0b
0001XXXXXXXX 1
0010XXXXXXXX 2
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1100XXXXXXXX 12
1101XXXXXXXX 13
1110XXXXXXXX 14
1111XXXXXXXX 15
Command Byte 1 Byte 2 Byte 3 Byte 4
Chip Erase C7H 94H 80H 9AH
Opcode
Byte 1
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
CS
Each transition
represents eight bits
SI
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7.8 Main Memory Page Program Through Buffer
This operation is a combination of the Buffer Write and Buffer to Main Memory Page Program with Built-in Erase
operations. Data is first clocked into buffer 1 or buffer 2 from the input pin (SI) and then programmed into a
specified page in the main memory. To perform a main memory page program through buffer for the standard
DataFlash page size (528-bytes), a 1-byte opcode, 82H for buffer 1 or 85H for buffer 2, must first be clocked into
the device, followed by three address bytes. The address bytes are comprised of two don’t care bits, 12 page
address bits, (PA11 - PA0) that select the page in the main memory where data is to be written, and 10 buffer
address bits (BFA9 - BFA0) that select the first byte in the buffer to be written. To perform a main memory page
program through buffer for the binary page size (512-bytes), the opcode 82H for buffer 1 or 85H for buffer 2, must
be clocked into the device followed by three address bytes consisting of three don’t care bits, 12 page address bits
(A20 - A9) that specify the page in the main memory to be written, and 9 buffer address bits (BFA8 - BFA0) that
selects the first byte in the buffer to be written. After all address bytes are clocked in, the part will take data from the
input pins and store it in the specified data buffer. If the end of the buffer is reached, the device will wrap around
back to the beginning of the buffer. When there is a low-to-high transition on the CS pin, the part will first erase the
selected page in main memory to all 1s and then program the data stored in the buffer into that memory page. Both
the erase and the programming of the page are internally self-timed and should take place in a maximum time of
tEP. During this time, the status register and the RDY/BUSY pin will indicate that the part is busy.
8. Sector Protection
Two protection methods, hardware and software controlled, are provided for protection against inadvertent or
erroneous program and erase cycles. The software controlled method relies on the use of software commands to
enable and disable sector protection while the hardware controlled method employs the use of the Write Protect
(WP) pin. The selection of which sectors that are to be protected or unprotected against program and erase
operations is specified in the nonvolatile Sector Protection Register. The status of whether or not sector protection
has been enabled or disabled by either the software or the hardware controlled methods can be determined by
checking the Status Register.
8.1 Software Sector Protection
8.1.1 Enable Sector Protection Command
Sectors specified for protection in the Sector Protection Register can be protected from program and erase
operations by issuing the Enable Sector Protection command. To enable the sector protection using the software
controlled method, the CS pin must first be asserted as it would be with any other command. Once the CS pin has
been asserted, the appropriate 4-byte command sequence must be clocked in via the input pin (SI). After the last
bit of the command sequence has been clocked in, the CS pin must be deasserted after which the sector
protection will be enabled.
Table 8-1. Enable Sector Protection Command
Figure 8-1. Enable Sector Protection
Command Byte 1 Byte 2 Byte 3 Byte 4
Enable Sector Protection 3DH 2AH 7FH A9H
Opcode
Byte 1
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
CS
Each transition
represents eight bits
SI
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8.1.2 Disable Sector Protection Command
To disable the sector protection using the software controlled method, the CS pin must first be asserted as it would
be with any other command. Once the CS pin has been asserted, the appropriate 4-byte sequence for the Disable
Sector Protection command must be clocked in via the input pin (SI). After the last bit of the command sequence
has been clocked in, the CS pin must be deasserted after which the sector protection will be disabled. The WP pin
must be in the deasserted state; otherwise, the Disable Sector Protection command will be ignored.
Table 8-2. Disenable Sector Protection Command
Figure 8-2. Disable Sector Protection
8.1.3 Various Aspects About Software Controlled Protection
Software controlled protection is useful in applications in which the WP pin is not or cannot be controlled by a host
processor. In such instances, the WP pin may be left floating (the WP pin is internally pulled high) and sector
protection can be controlled using the Enable Sector Protection and Disable Sector Protection commands.
If the device is power cycled, then the software controlled protection will be disabled. Once the device is powered
up, the Enable Sector Protection command should be reissued if sector protection is desired and if the WP pin is
not used.
9. Hardware Controlled Protection
Sectors specified for protection in the Sector Protection Register and the Sector Protection Register itself can be
protected from program and erase operations by asserting the WP pin and keeping the pin in its asserted state.
The Sector Protection Register and any sector specified for protection cannot be erased or reprogrammed as long
as the WP pin is asserted. In order to modify the Sector Protection Register, the WP pin must be deasserted. If the
WP pin is permanently connected to GND, then the content of the Sector Protection Register cannot be changed.
If the WP pin is deasserted, or permanently connected to VCC, then the content of the Sector Protection Register
can be modified.
The WP pin will override the software controlled protection method but only for protecting the sectors. For example,
if the sectors were not previously protected by the Enable Sector Protection command, then simply asserting the
WP pin would enable the sector protection within the maximum specified tWPE time. When the WP pin is
deasserted; however, the sector protection would no longer be enabled (after the maximum specified tWPD time) as
long as the Enable Sector Protection command was not issued while the WP pin was asserted. If the Enable
Sector Protection command was issued before or while the WP pin was asserted, then simply deasserting the WP
pin would not disable the sector protection. In this case, the Disable Sector Protection command would need to be
issued while the WP pin is deasserted to disable the sector protection. The Disable Sector Protection command is
also ignored whenever the WP pin is asserted.
A noise filter is incorporated to help protect against spurious noise that may inadvertently assert or deassert the
WP pin.
Command Byte 1 Byte 2 Byte 3 Byte 4
Disable Sector Protection 3DH 2AH 7FH 9AH
Opcode
Byte 1
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
CS
Each transition
represents eight bits
SI
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The table below details the sector protection status for various scenarios of the WP pin, the Enable Sector
Protection command, and the Disable Sector Protection command.
Figure 9-1. WP Pin and Protection Status
Table 9-1. WP Pin and Protection Status
9.1 Sector Protection Register
The nonvolatile Sector Protection Register specifies which sectors are to be protected or unprotected with either
the software or hardware controlled protection methods. The Sector Protection Register contains 16-bytes of data,
of which byte locations 0 through 15 contain values that specify whether sectors 0 through 15 will be protected or
unprotected. The Sector Protection Register is user modifiable and must first be erased before it can be
reprogrammed. Table 9-3 illustrates the format of the Sector Protection Register.:
Table 9-2. Sector Protection Register
Table 9-3. Sector 0 (0a, 0b)
Note: 1. The default value for bytes 0 through 15 when shipped from Adesto is 00H
x = don’t care
Time
Period WP Pin Enable Sector Protection Command
Disable Sector
Protection Command
Sector
Protection
Status
Sector
Protection
Register
1High
Command Not Issued Previously
–
Issue Command
X
Issue Command
–
Disabled
Disabled
Enabled
Read/Write
Read/Write
Read/Write
2 Low X X Enabled Read Only
3High
Command Issued During Period 1 or 2
–
Issue Command
Not Issued Yet
Issue Command
–
Enabled
Disabled
Enabled
Read/Write
Read/Write
Read/Write
WP
12
3
Sector Number 0 (0a, 0b) 1 to 15
Protected
See Table 9-3
FFH
Unprotected 00H
0a 0b
Bit 3, 2
Data
Value
(Page 0-7) (Page 8-255)
Bit 7, 6 Bit 5, 4 Bit 1, 0
Sectors 0a, 0b Unprotected 00 00 xx xx 0xH
Protect Sector 0a 11 00 xx xx CxH
Protect Sector 0b (Page 8-255) 00 11 xx xx 3xH
Protect Sectors 0a (Page 0-7), 0b (Page 8-255)(1) 11 11 xx xx FxH
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9.1.1 Erase Sector Protection Register Command
In order to modify and change the values of the Sector Protection Register, it must first be erased using the Erase
Sector Protection Register command.
To erase the Sector Protection Register, the CS pin must first be asserted as it would be with any other command.
Once the CS pin has been asserted, the appropriate 4-byte opcode sequence must be clocked into the device via
the SI pin. The 4-byte opcode sequence must start with 3DH and be followed by 2AH, 7FH, and CFH. After the last
bit of the opcode sequence has been clocked in, the CS pin must be deasserted to initiate the internally self-timed
erase cycle. The erasing of the Sector Protection Register should take place in a time of tPE, during which time the
Status Register will indicate that the device is busy. If the device is powered-down before the completion of the
erase cycle, then the contents of the Sector Protection Register cannot be guaranteed.
The Sector Protection Register can be erased with the sector protection enabled or disabled. Since the erased
state (FFH) of each byte in the Sector Protection Register is used to indicate that a sector is specified for
protection, leaving the sector protection enabled during the erasing of the register allows the protection scheme to
be more effective in the prevention of accidental programming or erasing of the device. If for some reason an
erroneous program or erase command is sent to the device immediately after erasing the Sector Protection
Register and before the register can be reprogrammed, then the erroneous program or erase command will not be
processed because all sectors would be protected.
Table 9-4. Erase Sector Protection Register Command
Figure 9-2. Erase Sector Protection Register
9.1.2 Program Sector Protection Register Command
Once the Sector Protection Register has been erased, it can be reprogrammed using the Program Sector
Protection Register command.
To program the Sector Protection Register, the CS pin must first be asserted and the appropriate 4-byte opcode
sequence must be clocked into the device via the SI pin. The 4-byte opcode sequence must start with 3DH and be
followed by 2AH, 7FH, and FCH. After the last bit of the opcode sequence has been clocked into the device, the
data for the contents of the Sector Protection Register must be clocked in. As described in Section 9.1, the Sector
Protection Register contains 16-bytes of data, so 16-bytes must be clocked into the device. The first byte of data
corresponds to sector 0, the second byte corresponds to sector 1, and so on with the last byte of data
corresponding to sector 15.
After the last data byte has been clocked in, the CS pin must be deasserted to initiate the internally self-timed
program cycle. The programming of the Sector Protection Register should take place in a time of tP, during which
time the Status Register will indicate that the device is busy. If the device is powered-down during the program
cycle, then the contents of the Sector Protection Register cannot be guaranteed.
If the proper number of data bytes is not clocked in before the CS pin is deasserted, then the protection status of
the sectors corresponding to the bytes not clocked in can not be guaranteed. For example, if only the first two bytes
are clocked in instead of the complete 16-bytes, then the protection status of the last 14 sectors cannot be
Command Byte 1 Byte 2 Byte 3 Byte 4
Erase Sector Protection Register 3DH 2AH 7FH CFH
Opcode
Byte 1
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
CS
Each transition represents eight bits
SI
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guaranteed. Furthermore, if more than 16-bytes of data is clocked into the device, then the data will wrap back
around to the beginning of the register. For instance, if 17-bytes of data are clocked in, then the 17th byte will be
stored at byte location 0 of the Sector Protection Register.
If a value other than 00H or FFH is clocked into a byte location of the Sector Protection Register, then the
protection status of the sector corresponding to that byte location cannot be guaranteed. For example, if a value of
17H is clocked into byte location 2 of the Sector Protection Register, then the protection status of sector 2 cannot
be guaranteed.
The Sector Protection Register can be reprogrammed while the sector protection enabled or disabled. Being able
to reprogram the Sector Protection Register with the sector protection enabled allows the user to temporarily
disable the sector protection to an individual sector rather than disabling sector protection completely.
The Program Sector Protection Register command utilizes the internal SRAM buffer 1 for processing. Therefore,
the contents of the buffer 1 will be altered from its previous state when this command is issued.
Table 9-5. Program Sector Protection Register Command
Figure 9-3. Program Sector Protection Register
9.1.3 Read Sector Protection Register Command
To read the Sector Protection Register, the CS pin must first be asserted. Once the CS pin has been asserted, an
opcode of 32H and three dummy bytes must be clocked in via the SI pin. After the last bit of the opcode and
dummy bytes have been clocked in, any additional clock pulses on the SCK pins will result in data for the content
of the Sector Protection Register being output on the SO pin. The first byte corresponds to sector 0 (0a, 0b), the
second byte corresponds to sector 1 and the last byte (byte 16) corresponds to sector 15. Once the last byte of the
Sector Protection Register has been clocked out, any additional clock pulses will result in undefined data being
output on the SO pin. The CS must be deasserted to terminate the Read Sector Protection Register operation and
put the output into a high-impedance state.
Table 9-6. Read Sector Protection Register Command
Note: xx = Dummy Byte
Figure 9-4. Read Sector Protection Register
Command Byte 1 Byte 2 Byte 3 Byte 4
Program Sector Protection Register 3DH 2AH 7FH FCH
Data Byte
n
Opcode
Byte 1
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
Data Byte
n + 1
Data Byte
n + 15
CS
Each transition
represents eight bits
SI
Command Byte 1 Byte 2 Byte 3 Byte 4
Read Sector Protection Register 32H xxH xxH xxH
Opcode X X X
Data Byte
n
Data Byte
n + 1
CS
Data Byte
n + 15
SI
SO
Each transition
represents eight bits
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9.1.4 Various Aspects About the Sector Protection Register
The Sector Protection Register is subject to a limit of 10,000 erase/program cycles. Users are encouraged to
carefully evaluate the number of times the Sector Protection Register will be modified during the course of the
applications’ life cycle. If the application requires that the Sector Protection Register be modified more than the
specified limit of 10,000 cycles because the application needs to temporarily unprotect individual sectors (sector
protection remains enabled while the Sector Protection Register is reprogrammed), then the application will need
to limit this practice. Instead, a combination of temporarily unprotecting individual sectors along with disabling
sector protection completely will need to be implemented by the application to ensure that the limit of 10,000 cycles
is not exceeded.
10. Security Features
10.1 Sector Lockdown
The device incorporates a Sector Lockdown mechanism that allows each individual sector to be permanently
locked so that it becomes read only. This is useful for applications that require the ability to permanently protect a
number of sectors against malicious attempts at altering program code or security information. Once a sector is
locked down, it can never be erased or programmed, and it can never be unlocked.
To issue the Sector Lockdown command, the CS pin must first be asserted as it would be for any other command.
Once the CS pin has been asserted, the appropriate 4-byte opcode sequence must be clocked into the device in
the correct order. The 4-byte opcode sequence must start with 3DH and be followed by 2AH, 7FH, and 30H. After
the last byte of the command sequence has been clocked in, then three address bytes specifying any address
within the sector to be locked down must be clocked into the device. After the last address bit has been clocked in,
the CS pin must then be deasserted to initiate the internally self-timed lockdown sequence.
The lockdown sequence should take place in a maximum time of tP, during which time the Status Register will
indicate that the device is busy. If the device is powered-down before the completion of the lockdown sequence,
then the lockdown status of the sector cannot be guaranteed. In this case, it is recommended that the user read the
Sector Lockdown Register to determine the status of the appropriate sector lockdown bits or bytes and reissue the
Sector Lockdown command if necessary.
Table 10-1. Sector Lockdown
Figure 10-1. Sector Lockdown
Command Byte 1 Byte 2 Byte 3 Byte 4
Sector Lockdown 3DH 2AH 7FH 30H
Opcode
Byte 1
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
CS
Address
Bytes
Address
Bytes
Address
Bytes
Each transition
represents eight bits
SI
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10.1.1 Sector Lockdown Register
Sector Lockdown Register is a nonvolatile register that contains 16-bytes of data, as shown below:
Table 10-2. Sector Lockdown Register
Table 10-3. Sector 0 (0a, 0b)
10.1.2 Reading the Sector Lockdown Register
The Sector Lockdown Register can be read to determine which sectors in the memory array are permanently
locked down. To read the Sector Lockdown Register, the CS pin must first be asserted. Once the CS pin has been
asserted, an opcode of 35H and three dummy bytes must be clocked into the device via the SI pin. After the last bit
of the opcode and dummy bytes have been clocked in, the data for the contents of the Sector Lockdown Register
will be clocked out on the SO pin. The first byte corresponds to sector 0 (0a, 0b) the second byte corresponds to
sector 1 and the las byte (byte 16) corresponds to sector 15. After the last byte of the Sector Lockdown Register
has been read, additional pulses on the SCK pin will simply result in undefined data being output on the SO pin.
Deasserting the CS pin will terminate the Read Sector Lockdown Register operation and put the SO pin into a
high-impedance state.
Table 10-4 details the values read from the Sector Lockdown Register.
Table 10-4. Sector Lockdown Register
Figure 10-2. Read Sector Lockdown Register
Sector Number 0 (0a, 0b) 1 to 15
Locked
See Below
FFH
Unlocked 00H
0a 0b
Bit 3, 2
Data
Value
(Page 0-7) (Page 8-255)
Bit 7, 6 Bit 5, 4 Bit 1, 0
Sectors 0a, 0b Unlocked 00 00 00 00 00H
Sector 0a Locked (Page 0-7) 11 00 00 00 C0H
Sector 0b Locked (Page 8-255) 00 11 00 00 30H
Sectors 0a, 0b Locked (Page 0-255) 11 11 00 00 F0H
Command Byte 1 Byte 2 Byte 3 Byte 4
Read Sector Lockdown Register 35H xxH xxH xxH
Note: xx = Dummy Byte
Opcode X X X
Data Byte
n
Data Byte
n + 1
CS
Data Byte
n + 15
SI
SO
Each transition
represents eight bits
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10.2 Security Register
The device contains a specialized Security Register that can be used for purposes such as unique device
serialization or locked key storage. The register is comprised of a total of 128-bytes that is divided into two
portions. The first 64-bytes (byte locations 0 through 63) of the Security Register are allocated as a one-time user
programmable space. Once these 64-bytes have been programmed, they cannot be reprogrammed. The
remaining 64-bytes of the register (byte locations 64 through 127) are factory programmed by Adesto and will
contain a unique value for each device. The factory programmed data is fixed and cannot be changed.
Table 10-5. Security Register
10.2.1 Programming the Security Register
The user programmable portion of the Security Register does not need to be erased before it is programmed.
To program the Security Register, the CS pin must first be asserted and the appropriate 4-byte opcode sequence
must be clocked into the device in the correct order. The 4-byte opcode sequence must start with 9BH and be
followed by 00H, 00H, and 00H. After the last bit of the opcode sequence has been clocked into the device, the
data for the contents of the 64-byte user programmable portion of the Security Register must be clocked in.
After the last data byte has been clocked in, the CS pin must be deasserted to initiate the internally self-timed
program cycle. The programming of the Security Register should take place in a time of tP, during which time the
Status Register will indicate that the device is busy. If the device is powered-down during the program cycle, then
the contents of the 64-byte user programmable portion of the Security Register cannot be guaranteed.
If the full 64-bytes of data is not clocked in before the CS pin is deasserted, then the values of the byte locations
not clocked in cannot be guaranteed. For example, if only the first two bytes are clocked in instead of the complete
64-bytes, then the remaining 62-bytes of the user programmable portion of the Security Register cannot be
guaranteed. Furthermore, if more than 64-bytes of data is clocked into the device, then the data will wrap back
around to the beginning of the register. For instance, if 65-bytes of data are clocked in, then the 65th byte will be
stored at byte location 0 of the Security Register.
The user programmable portion of the Security Register can only be programmed one time. Therefore, it is
not possible to only program the first two bytes of the register and then program the remaining 62-bytes at a later
time.
The Program Security Register command utilizes the internal SRAM buffer 1 for processing. Therefore, the
contents of the buffer 1 will be altered from its previous state when this command is issued.
Figure 10-3. Program Security Register
Security Register Byte Number
0 1· · ·62636465· · ·126127
Data Type One-time User Programmable Factory Programmed By Adesto
Data Byte
n
Opcode
Byte 1
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
Data Byte
n + 1
Data Byte
n + x
CS
Each transition
represents eight bits
SI
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10.2.2 Reading the Security Register
The Security Register can be read by first asserting the CS pin and then clocking in an opcode of 77H followed by
three dummy bytes. After the last don't care bit has been clocked in, the content of the Security Register can be
clocked out on the SO pins. After the last byte of the Security Register has been read, additional pulses on the
SCK pin will simply result in undefined data being output on the SO pins.
Deasserting the CS pin will terminate the Read Security Register operation and put the SO pins into a high-
impedance state.
Figure 10-4. Read Security Register
11. Additional Commands
11.1 Main Memory Page to Buffer Transfer
A page of data can be transferred from the main memory to either buffer 1 or buffer 2. To start the operation for the
standard DataFlash page size (528-bytes), a 1-byte opcode, 53H for buffer 1 and 55H for buffer 2, must be clocked
into the device, followed by three address bytes comprised of two don’t care bits, 12 page address bits (PA11 -
PA0), which specify the page in main memory that is to be transferred, and 10 don’t care bits. To perform a main
memory page to buffer transfer for the binary page size (512-bytes), the opcode 53H for buffer 1 or 55H for buffer
2, must be clocked into the device followed by three address bytes consisting of three don’t care bits, 12 page
address bits (A20 - A9) which specify the page in the main memory that is to be transferred, and nine don’t care
bits. The CS pin must be low while toggling the SCK pin to load the opcode and the address bytes from the input
pin (SI). The transfer of the page of data from the main memory to the buffer will begin when the CS pin transitions
from a low to a high state. During the transfer of a page of data (tXFR), the status register can be read or the
RDY/BUSY can be monitored to determine whether the transfer has been completed.
11.2 Main Memory Page to Buffer Compare
A page of data in main memory can be compared to the data in buffer 1 or buffer 2. To initiate the operation for
standard DataFlash page size, a 1-byte opcode, 60H for buffer 1 and 61H for buffer 2, must be clocked into the
device, followed by three address bytes consisting of two don’t care bits, 12 page address bits (PA11 - PA0) that
specify the page in the main memory that is to be compared to the buffer, and 10 don’t care bits. To start a main
memory page to buffer compare for a binary page size, the opcode 60H for buffer 1 or 61H for buffer 2, must be
clocked into the device followed by three address bytes consisting of three don’t care bits, 12 page address bits
(A20 - A9) that specify the page in the main memory that is to be compared to the buffer, and nine don’t care bits.
The CS pin must be low while toggling the SCK pin to load the opcode and the address bytes from the input pin
(SI). On the low-to-high transition of the CS pin, the data bytes in the selected main memory page will be compared
with the data bytes in buffer 1 or buffer 2. During this time (tCOMP), the status register and the RDY/BUSY pin will
indicate that the part is busy. On completion of the compare operation, bit six of the status register is updated with
the result of the compare.
Opcode X X X
Data Byte
n
Data Byte
n + 1
CS
Data Byte
n + x
Each transition
represents eight bits
SI
SO
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11.3 Auto Page Rewrite
This mode is only needed if multiple bytes within a page or multiple pages of data are modified in a random fashion
within a sector. This mode is a combination of two operations: Main Memory Page to Buffer Transfer and Buffer to
Main Memory Page Program with Built-in Erase. A page of data is first transferred from the main memory to buffer
1 or buffer 2, and then the same data (from buffer 1 or buffer 2) is programmed back into its original page of main
memory. To start the rewrite operation for standard DataFlash page size (528-bytes), a 1-byte opcode, 58H for
buffer 1 or 59H for buffer 2, must be clocked into the device, followed by three address bytes comprised of two
don’t care bits, 12 page address bits (PA11-PA0) that specify the page in main memory to be rewritten and 10 don’t
care bits. To initiate an auto page rewrite for a binary page size (512-bytes), the opcode 58H for buffer 1 or 59H for
buffer 2, must be clocked into the device followed by three address bytes consisting of three don’t care bits, 12
page address bits (A20 - A9) that specify the page in the main memory that is to be written and nine don’t care bits.
When a low-to-high transition occurs on the CS pin, the part will first transfer data from the page in main memory to
a buffer and then program the data from the buffer back into same page of main memory. The operation is
internally self-timed and should take place in a maximum time of tEP. During this time, the status register and the
RDY/BUSY pin will indicate that the part is busy.
If a sector is programmed or reprogrammed sequentially page by page, then the programming algorithm shown in
Figure 25-1 (page 42) is recommended. Otherwise, if multiple bytes in a page or several pages are programmed
randomly in a sector, then the programming algorithm shown in Figure 25-2 (page 43) is recommended. Each
page within a sector must be updated/rewritten at least once within every 20,000 cumulative page erase/program
operations in that sector. Please contact Adesto for availability of devices that are specified to exceed the 20K
cycle cumulative limit.
11.4 Status Register Read
The status register can be used to determine the device’s ready/busy status, page size, a Main Memory Page to
Buffer Compare operation result, the Sector Protection status or the device density. The Status Register can be
read at any time, including during an internally self-timed program or erase operation. To read the status register,
the CS pin must be asserted and the opcode of D7H must be loaded into the device. After the opcode is clocked in,
the 1-byte status register will be clocked out on the output pin (SO), starting with the next clock cycle. The data in
the status register, starting with the MSB (bit seven), will be clocked out on the SO pin during the next eight clock
cycles. After the one byte of the status register has been clocked out, the sequence will repeat itself (as long as CS
remains low and SCK is being toggled). The data in the status register is constantly updated, so each repeating
sequence will output new data.
Ready/busy status is indicated using bit seven of the status register. If bit seven is a one, then the device is not
busy and is ready to accept the next command. If bit seven is a zero, then the device is in a busy state. Since the
data in the status register is constantly updated, the user must toggle SCK pin to check the ready/busy status.
There are several operations that can cause the device to be in a busy state: Main Memory Page to Buffer
Transfer, Main Memory Page to Buffer Compare, Buffer to Main Memory Page Program, Main Memory Page
Program through Buffer, Page Erase, Block Erase, Sector Erase, Chip Erase and Auto Page Rewrite.
The result of the most recent Main Memory Page to Buffer Compare operation is indicated using bit 6 of the status
register. If bit six is a zero, then the data in the main memory page matches the data in the buffer. If bit six is a one,
then at least one bit of the data in the main memory page does not match the data in the buffer.
Bit one in the Status Register is used to provide information to the user whether or not the sector protection has
been enabled or disabled, either by software-controlled method or hardware-controlled method. A logic 1 indicates
that sector protection has been enabled and logic 0 indicates that sector protection has been disabled.
Bit zero in the Status Register indicates whether the page size of the main memory array is configured for “power
of 2” binary page size (512-bytes) or standard DataFlash page size (528-bytes). If bit zero is a one, then the page
size is set to 512-bytes. If bit zero is a zero, then the page size is set to 528-bytes.
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The device density is indicated using bits five, four, three, and two of the status register. For the AT45DB161D, the
four bits are 1011 The decimal value of these four binary bits does not equate to the device density; the four bits
represent a combinational code relating to differing densities of DataFlash devices. The device density is not the
same as the density code indicated in the JEDEC device ID information. The device density is provided only for
backward compatibility.
Table 11-1. Status Register Format
12. Deep Power-down
After initial power-up, the device will default in standby mode. The Deep Power-down command allows the device
to enter into the lowest power consumption mode. To enter the Deep Power-down mode, the CS pin must first be
asserted. Once the CS pin has been asserted, an opcode of B9H command must be clocked in via input pin (SI).
After the last bit of the command has been clocked in, the CS pin must be de-asserted to initiate the Deep Power-
down operation. After the CS pin is de-asserted, the will device enter the Deep Power-down mode within the
maximum tEDPD time. Once the device has entered the Deep Power-down mode, all instructions are ignored except
for the Resume from Deep Power-down command.
Table 12-1. Deep Power-down
Figure 12-1. Deep Power-down
12.1 Resume from Deep Power-down
The Resume from Deep Power-down command takes the device out of the Deep Power-down mode and returns it
to the normal standby mode. To Resume from Deep Power-down mode, the CS pin must first be asserted and an
opcode of ABH command must be clocked in via input pin (SI). After the last bit of the command has been clocked
in, the CS pin must be de-asserted to terminate the Deep Power-down mode. After the CS pin is de-asserted, the
device will return to the normal standby mode within the maximum tRDPD time. The CS pin must remain high during
the tRDPD time before the device can receive any commands. After resuming form Deep Power-down, the device
will return to the normal standby mode.
Table 12-2. Resume from Deep Power-down
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
RDY/BUSY COMP 1 0 1 1 PROTECT PAGE SIZE
Command Opcode
Deep Power-down B9H
Opcode
CS
Each transition
represents eight bits
SI
Command Opcode
Resume from Deep Power-down ABH
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Figure 12-2. Resume from Deep Power-Down
13. “Power of 2” Binary Page Size Option
“Power of 2” binary page size Configuration Register is a user-programmable nonvolatile register that allows the
page size of the main memory to be configured for binary page size (512-bytes) or standard DataFlash page size
(528-bytes). The “power of 2” page size is a one-time programmable configuration register and once the
device is configured for “power of 2” page size, it cannot be reconfigured again. The devices are initially
shipped with the page size set to 528-bytes. The user has the option of ordering binary page size (512
bytes) devices from the factory. For details, please refer to Section 26. “Ordering Information” on page 44.
For the binary “power of 2” page size to become effective, the following steps must be followed:
1. Program the one-time programmable configuration resister using opcode sequence 3DH, 2AH, 80H and
A6H (please see Section 13.1).
2. Power cycle the device (i.e. power down and power up again).
3. User can now program the page for the binary page size.
If the above steps are not followed in setting the the page size prior to page programming, user may expect
incorrect data during a read operation.
13.1 Programming the Configuration Register
To program the Configuration Register for “power of 2” binary page size, the CS pin must first be asserted as it
would be with any other command. Once the CS pin has been asserted, the appropriate 4-byte opcode sequence
must be clocked into the device in the correct order. The 4-byte opcode sequence must start with 3DH and be
followed by 2AH, 80H, and A6H. After the last bit of the opcode sequence has been clocked in, the CS pin must be
deasserted to initiate the internally self-timed program cycle. The programming of the Configuration Register
should take place in a time of tP, during which time the Status Register will indicate that the device is busy. The
device must be power cycled after the completion of the program cycle to set the “power of 2” page size. If the
device is powered-down before the completion of the program cycle, then setting the Configuration Register
cannot be guaranteed. However, the user should check bit zero of the status register to see whether the page size
was configured for binary page size. If not, the command can be re-issued again.
Table 13-1. Programming the Configuration Register
Figure 13-1. Erase Sector Protection Register
Opcode
CS
Each transition
represents eight bits
SI
Command Byte 1 Byte 2 Byte 3 Byte 4
Power of Two Page Size 3DH 2AH 80H A6H
Opcode
Byte 1
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
CS
Each transition represents eight bits
SI
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14. Manufacturer and Device ID Read
Identification information can be read from the device to enable systems to electronically query and identify the
device while it is in system. The identification method and the command opcode comply with the JEDEC standard
for “Manufacturer and Device ID Read Methodology for SPI Compatible Serial Interface Memory Devices”. The
type of information that can be read from the device includes the JEDEC defined Manufacturer ID, the vendor
specific Device ID, and the vendor specific Extended Device Information.
To read the identification information, the CS pin must first be asserted and the opcode of 9FH must be clocked
into the device. After the opcode has been clocked in, the device will begin outputting the identification data on the
SO pin during the subsequent clock cycles. The first byte that will be output will be the Manufacturer ID followed by
two bytes of Device ID information. The fourth byte output will be the Extended Device Information String Length,
which will be 00H indicating that no Extended Device Information follows. As indicated in the JEDEC standard,
reading the Extended Device Information String Length and any subsequent data is optional.
Deasserting the CS pin will terminate the Manufacturer and Device ID Read operation and put the SO pin into a
high-impedance state. The CS pin can be deasserted at any time and does not require that a full byte of data be
read.
14.1 Manufacturer and Device ID Information
Note: Based on JEDEC publication 106 (JEP106), Manufacturer ID data can be comprised of any number of bytes. Some manufacturers
may have Manufacturer ID codes that are two, three or even four bytes long with the first byte(s) in the sequence being 7FH. A sys-
tem should detect code 7FH as a “Continuation Code” and continue to read Manufacturer ID bytes. The first non-7FH byte would
signify the last byte of Manufacturer ID data. For Adesto (and some other manufacturers), the Manufacturer ID data is comprised of
only one byte.
Hex
Value
JEDEC Assigned Code
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
1FH 0 0 0 1 1 1 1 1 Manufacturer ID 1FH = Adesto
Hex
Value
Family Code Density Code
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Family Code 001 = DataFlash
26H 0 0 1 0 0 1 1 0 Density Code 00110 = 16-Mbit
Hex
Value
MLC Code Product Version Code
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 MLC Code 000 = 1-bit/Cell Technology
00H 0 0 0 0 0 0 0 0 Product Version 00000 = Initial Version
Hex
Value
Byte Count
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
00H 0 0 0 0 0 0 0 0 Byte Count 00H = 0 Bytes of Information
9FH
Manufacturer ID
Byte 1
Device ID
Byte 2
Device ID
Byte 3
This information would only be output
if the Extended Device Information String Length
value was something other than 00H.
Extended
Device
Information
String Length
Extended
Device
Information
Byte x
Extended
Device
Information
Byte x + 1
CS
1FH 26H 00H 00H Data Data
SI
SO
Opcode
Each transition
represents 8 bits
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14.2 Operation Mode Summary
The commands described previously can be grouped into four different categories to better describe which
commands can be executed at what times.
Group A commands consist of:
1. Main Memory Page Read
2. Continuous Array Read
3. Read Sector Protection Register
4. Read Sector Lockdown Register
5. Read Security Register
Group B commands consist of:
1. Page Erase
2. Block Erase
3. Sector Erase
4. Chip Erase
5. Main Memory Page to Buffer 1 (or 2) Transfer
6. Main Memory Page to Buffer 1 (or 2) Compare
7. Buffer 1 (or 2) to Main Memory Page Program with Built-in Erase
8. Buffer 1 (or 2) to Main Memory Page Program without Built-in Erase
9. Main Memory Page Program through Buffer 1 (or 2)
10. Auto Page Rewrite
Group C commands consist of:
1. Buffer 1 (or 2) Read
2. Buffer 1 (or 2) Write
3. Status Register Read
4. Manufacturer and Device ID Read
Group D commands consist of:
1. Erase Sector Protection Register
2. Program Sector Protection Register
3. Sector Lockdown
4. Program Security Register
If a Group A command is in progress (not fully completed), then another command in Group A, B, C, or D should
not be started. However, during the internally self-timed portion of Group B commands, any command in Group C
can be executed. The Group B commands using buffer 1 should use Group C commands using buffer 2 and vice
versa. Finally, during the internally self-timed portion of a Group D command, only the Status Register Read
command should be executed.
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15. Command Tables
Table 15-1. Read Commands
Table 15-2. Program and Erase Commands
Table 15-3. Protection and Security Commands
Command Opcode
Main Memory Page Read D2H
Continuous Array Read (Legacy Command) E8H
Continuous Array Read (Low Frequency) 03H
Continuous Array Read (High Frequency) 0BH
Buffer 1 Read (Low Frequency) D1H
Buffer 2 Read (Low Frequency) D3H
Buffer 1 Read D4H
Buffer 2 Read D6H
Command Opcode
Buffer 1 Write 84H
Buffer 2 Write 87H
Buffer 1 to Main Memory Page Program with Built-in Erase 83H
Buffer 2 to Main Memory Page Program with Built-in Erase 86H
Buffer 1 to Main Memory Page Program without Built-in Erase 88H
Buffer 2 to Main Memory Page Program without Built-in Erase 89H
Page Erase 81H
Block Erase 50H
Sector Erase 7CH
Chip Erase C7H, 94H, 80H, 9AH
Main Memory Page Program Through Buffer 1 82H
Main Memory Page Program Through Buffer 2 85H
Command Opcode
Enable Sector Protection 3DH + 2AH + 7FH + A9H
Disable Sector Protection 3DH + 2AH + 7FH + 9AH
Erase Sector Protection Register 3DH + 2AH + 7FH + CFH
Program Sector Protection Register 3DH + 2AH + 7FH + FCH
Read Sector Protection Register 32H
Sector Lockdown 3DH + 2AH + 7FH + 30H
Read Sector Lockdown Register 35H
Program Security Register 9BH + 00H + 00H + 00H
Read Security Register 77H
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Table 15-4. Additional Commands
Table 15-5. Legacy Commands(1)
Notes: 1. These legacy commands are not recommended for new designs
2. Refer to the Revision History table on page 49
Command Opcode
Main Memory Page to Buffer 1 Transfer 53H
Main Memory Page to Buffer 2 Transfer 55H
Main Memory Page to Buffer 1 Compare 60H
Main Memory Page to Buffer 2 Compare 61H
Auto Page Rewrite through Buffer 1 58H
Auto Page Rewrite through Buffer 2 59H
Deep Power-down B9H
Resume from Deep Power-down ABH
Status Register Read D7H
Manufacturer and Device ID Read 9FH
Command Opcode
Buffer 1 Read 54H
Buffer 2 Read 56H
Main Memory Page Read 52H
Continuous Array Read 68H
Status Register Read(2) 57H
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Table 15-6. Detailed Bit-level Addressing Sequence for Binary Page Size (512-Bytes)
Notes: x = Don’t Care
Page Size = 512-bytes Address Byte Address Byte Address Byte
Additional
Don’t Care
Bytes
Opco
de Opcode
Reserved
Reserved
Reserved
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
03h 00000011 xxxAAAAA AAAAAAAA AAAAAAAA N/A
0Bh 00001011 xxxAAAAA AAAAAAAA AAAAAAAA 1
50h 01010000 xxxAAAAA AAAAxxxx xxxxxxxx N/A
53h 01010011 xxxAAAAA AAAAAAAx x x x xxxxx N/A
55h 01010101 xxxAAAAA AAAAAAAx x x x xxxxx N/A
58h 01011000 xxxAAAAA AAAAAAAx x x x xxxxx N/A
59h 01011001 xxxAAAAA AAAAAAAx x x x xxxxx N/A
60h 01100000 xxxAAAAA AAAAAAAx x x x xxxxx N/A
61h 01100001 xxxAAAAA AAAAAAAx x x x xxxxx N/A
77h 01110111 xxxxxxxx xxxxxxxx xxxxxxxx N/A
7Ch 01111100 xxxAAAAx xxxxxxxx xxxxxxxx N/A
81h 10000001 xxxAAAAA AAAAAAAX x x x xxxx x N/A
82h 10000010 xxxAAAAA AAAAAAAA AAAAAAAA N/A
83h 10000011 xxxAAAAA AAAAAAAX x x x xxxx x N/A
84h 10000100 xxxxxxxx xxxxxxxAAAAAAAAA N/A
85h 10000101 xxxAAAAA AAAAAAAA AAAAAAAA N/A
86h 10000110 xxxAAAAA AAAAAAAx x x x xxxxx N/A
87h 10000111 xxxxxxxx xxxxxxxAAAAAAAAA N/A
88h 10001000 xxxAAAAA AAAAAAAx x x x xxxxx N/A
89h 10001001 xxxAAAAA AAAAAAAx x x x xxxxx N/A
9Fh 10011111 N/A N/A N/A N/A
B9h 10111001 N/A N/A N/A N/A
ABh 10101011 N/A N/A N/A N/A
D1h 11010001 xxxxxxxx xxxxxxxAAAAAAAAA N/A
D2h 11010010 xxxAAAAA AAAAAAAA AAAAAAAA 4
D3h 11010011 xxxxxxxx xxxxxxxAAAAAAAAA N/A
D4h 11010100 xxxxxxxx xxxxxxxAAAAAAAAA 1
D6h 11010110 xxxxxxxx xxxxxxxAAAAAAAAA 1
D7h 11010111 N/A N/A N/A N/A
E8h 11101000 xxxAAAAA AAAAAAAA AAAAAAAA 4
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Table 15-7. Detailed Bit-level Addressing Sequence for Standard DataFlash Page Size (528-Bytes)
Notes: P = Page Address Bit B = Byte/Buffer Address Bit x = Don’t Care
Page Size = 528-bytes Address Byte Address Byte Address Byte
Additional
Don’t Care
BytesOpcode Opcode
Reserved
Reserved
PA11
PA10
PA9
PA8
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
BA9
BA8
BA7
BA6
BA5
BA4
BA3
BA2
BA1
BA0
03h 0 0 0 0 0 0 1 1 x x PPPPPP PPPPPPBB BBBBBBBB N/A
0Bh 0 0 0 0 1 0 1 1 x x PPPPPP PPPPPPBB BBBBBBBB 1
50h 01010000 xxPPPPPP PPPxxxxx xxxxxxx x N/A
53h 0 10 10 01 1 x x PPPPPP PPPPPPx x x x x x x x x x N/A
55h 0 10 10 10 1 x x PPPPPP PPPPPPx x x x x x x x x x N/A
58h 0 10 11 00 0 x x PPPPPP PPPPPPx x x x x x x x x x N/A
59h 0 10 11 00 1 x x PPPPPP PPPPPPx x x x x x x x x x N/A
60h 0 11 00 00 0 x x PPPPPP PPPPPPx x x x x x x x x x N/A
61h 0 11 00 00 1 x x PPPPPP PPPPPPx x x x x x x x x x N/A
77h 01110111 xxxxxxxx xxxxxxxx xxxxxxxx N/A
7Ch 01111100 xxPPPPxx xxxxxxxx xxxxxxxx N/A
81h 1 00 00 00 1 x x PPPPPP PPPPPPx x x x x x x x x x N/A
82h 1 0 0 0 0 0 1 0 x x PPPPPP PPPPPPBB BBBBBBBB N/A
83h 1 00 00 01 1 x x PPPPPP PPPPPPx x x x x x x x x x N/A
84h 10000100 xxxxxxxx xxxxxxBBBBBBBBBB N/A
85h 1 0 0 0 0 1 0 1 x x PPPPPP PPPPPPBB BBBBBBBB N/A
86h 1 00 00 11 0 x x PPPPPP PPPPPPx x x x x x x x x x N/A
87h 10000111 xxxxxxxx xxxxxxBBBBBBBBBB N/A
88h 1 00 01 00 0 x x PPPPPP PPPPPPx x x x x x x x x x N/A
89h 1 00 01 00 1 x x PPPPPP PPPPPPx x x x x x x x x x N/A
9Fh 10011111 N/A N/A N/A N/A
B9h 10111001 N/A N/A N/A N/A
ABh 10101011 N/A N/A N/A N/A
D1h 11010001 xxxxxxxx xxxxxxBBBBBBBBBB N/A
D2h 1 1 0 1 0 0 10 x x PPPPPP PPPPPPBB BBBBBBBB 4
D3h 11010001 xxxxxxxx xxxxxxBBBBBBBBBB N/A
D4h 11010100 xxxxxxxx xxxxxxBBBBBBBBBB 1
D6h 11010110 xxxxxxxx xxxxxxBBBBBBBBBB 1
D7h 11010111 N/A N/A N/A N/A
E8h 1 1 1 0 1 0 0 0 x x PPPPPP PPPPPPBB BBBBBBBB 4
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16. Power-on/Reset State
When power is first applied to the device, or when recovering from a reset condition, the device will default to Mode
3. In addition, the output pin (SO) will be in a high impedance state, and a high-to-low transition on the CS pin will
be required to start a valid instruction. The mode (Mode 3 or Mode 0) will be automatically selected on every falling
edge of CS by sampling the inactive clock state.
16.1 Initial Power-up/Reset Timing Restrictions
At power up, the device must not be selected until the supply voltage reaches the VCC (min.) and further delay of
tVCSL. During power-up, the internal Power-on Reset circuitry keeps the device in reset mode until the VCC rises
above the Power-on Reset threshold value (VPOR). At this time, all operations are disabled and the device does not
respond to any commands. After power up is applied and the VCC is at the minimum operating voltage VCC (min.),
the tVCSL delay is required before the device can be selected in order to perform a read operation.
Similarly, the tPUW delay is required after the VCC rises above the Power-on Reset threshold value (VPOR) before the
device can perform a write (Program or Erase) operation. After initial power-up, the device will default in Standby
mode.
Table 16-1. Initial Power-up/Reset Timing Restrictions
17. System Considerations
The RapidS serial interface is controlled by the clock SCK, serial input SI and chip select CS pins. These signals
must rise and fall monotonically and be free from noise. Excessive noise or ringing on these pins can be
misinterpreted as multiple edges and cause improper operation of the device. The PC board traces must be kept to
a minimum distance or appropriately terminated to ensure proper operation. If necessary, decoupling capacitors
can be added on these pins to provide filtering against noise glitches.
As system complexity continues to increase, voltage regulation is becoming more important. A key element of any
voltage regulation scheme is its current sourcing capability. Like all Flash memories, the peak current for
DataFlash occur during the programming and erase operation. The regulator needs to supply this peak current
requirement. An under specified regulator can cause current starvation. Besides increasing system noise, current
starvation during programming or erase can lead to improper operation and possible data corruption.
Symbol Parameter Min Typ Max Units
tVCSL VCC (min.) to Chip Select low 70 µs
tPUW Power-Up Device Delay before Write Allowed 20 ms
VPOR Power-ON Reset Voltage 1.5 2.5 V
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18. Electrical Specifications
Table 18-1. Absolute Maximum Ratings*
Table 18-2. DC and AC Operating Range
Table 18-3. DC Characteristics
Notes: 1. ICC1 during a buffer read is 20mA maximum @ 20MHz
2. All inputs (SI, SCK, CS#, WP#, and RESET#) are guaranteed by design to be 5V tolerant
Temperature under Bias ..................-55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
The "Absolute Maximum Ratings" are stress ratings only
and functional operation of the device at these or any
other conditions beyond those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods
may affect device reliability. Voltage Extremes referenced
in the "Absolute Maximum Ratings" are intended to
accommodate short duration undershoot/overshoot condi-
tions and does not imply or guarantee functional device
operation at these levels for any extended period of time
Storage Temperature .......................-65°C to +150°C
All Input Voltages (except VCC but including NC pins)
with Respect to Ground ....................-0.6V to +6.25V
All Output Voltages
with Respect to Ground ..............-0.6V to VCC + 0.6V
AT45DB161D (2.5V Version) AT45DB161D
Operating Temperature (Case) Ind. -40C to 85C-40C to 85C
VCC Power Supply 2.5V to 3.6V 2.7V to 3.6V
Symbol Parameter Condition Min Typ Max Units
IDP Deep Power-down Current CS, RESET, WP = VIH, all
inputs at CMOS levels 15 25 µA
ISB Standby Current CS, RESET, WP = VIH, all
inputs at CMOS levels 25 50 µA
ICC1(1) Active Current, Read
Operation
f = 20MHz; IOUT = 0mA;
VCC = 3.6V 710mA
f = 33MHz; IOUT = 0mA;
VCC = 3.6V 812mA
f = 50MHz; IOUT = 0mA;
VCC = 3.6V 10 14 mA
f = 66MHz; IOUT = 0mA;
VCC = 3.6V 11 15 mA
ICC2
Active Current, Program/Erase
Operation VCC = 3.6V 12 17 mA
ILI Input Load Current VIN = CMOS levels 1 µA
ILO Output Leakage Current VI/O = CMOS levels 1 µA
VIL Input Low Voltage VCC x 0.3 V
VIH Input High Voltage VCC x 0.7 V
VOL Output Low Voltage IOL = 1.6mA; VCC = 2.7V 0.4 V
VOH Output High Voltage IOH = -100µA VCC - 0.2V V
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Table 18-4. AC Characteristics – RapidS/Serial Interface
Note: 1. Values are based on device characterization, not 100% tested in production
Symbol Parameter
AT45DB161D
(2.5V Version) AT45DB161D
Min Typ Max Min Typ Max Units
fSCK SCK Frequency 50 66 MHz
fCAR1 SCK Frequency for Continuous Array Read 50 66 MHz
fCAR2
SCK Frequency for Continuous Array Read
(Low Frequency) 33 33 MHz
tWH SCK High Time 6.8 6.8 ns
tWL SCK Low Time 6.8 6.8 ns
tSCKR(1) SCK Rise Time, Peak-to-Peak (Slew Rate) 0.1 0.1 V/ns
tSCKF(1) SCK Fall Time, Peak-to-Peak (Slew Rate) 0.1 0.1 V/ns
tCS Minimum CS High Time 50 50 ns
tCSS CS Setup Time 5 5 ns
tCSH CS Hold Time 5 5 ns
tCSB CS High to RDY/BUSY Low 100 100 ns
tSU Data In Setup Time 2 2 ns
tHData In Hold Time 3 3 ns
tHO Output Hold Time 0 0 ns
tDIS Output Disable Time 27 35 27 35 ns
tVOutput Valid 8 6 ns
tWPE WP Low to Protection Enabled 1 1 µs
tWPD WP High to Protection Disabled 1 1 µs
tEDPD CS High to Deep Power-down Mode 3 3 µs
tRDPD CS High to Standby Mode 35 35 µs
tXFR Page to Buffer Transfer Time 200 200 µs
tCOMP Page to Buffer Compare Time 200 200 µs
tEP
Page Erase and Programming Time
(512-/528-bytes) 17 40 17 40 ms
tPPage Programming Time (512-/528-bytes) 3 6 3 6 ms
tPE Page Erase Time (512-/528-bytes) 15 35 15 35 ms
tBE Block Erase Time (4096-/4224-bytes) 45 100 45 100 ms
tSE Sector Erase Time (131,072/135,168-bytes) 0.7 1.3 0.7 1.3 s
tCE Chip Erase Time 12 25 12 25 s
tRST RESET Pulse Width 10 10 µs
tREC RESET Recovery Time 1 1 µs
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19. Input Test Waveforms and Measurement Levels
tR, tF < 2ns (10% to 90%)
20. Output Test Load
21. AC Waveforms
Six different timing waveforms are shown on page 32. Waveform 1 shows the SCK signal being low when CS
makes a high-to-low transition, and waveform 2 shows the SCK signal being high when CS makes a high-to-low
transition. In both cases, output SO becomes valid while the SCK signal is still low (SCK low time is specified as
tWL). Timing waveforms 1 and 2 conform to RapidS serial interface but for frequencies up to 66MHz. Waveforms 1
and 2 are compatible with SPI Mode 0 and SPI Mode 3, respectively.
Waveform 3 and waveform 4 illustrate general timing diagram for RapidS serial interface. These are similar to
waveform 1 and waveform 2, except that output SO is not restricted to become valid during the tWL period. These
timing waveforms are valid over the full frequency range (maximum frequency = 66MHz) of the RapidS serial case.
21.1 Waveform 1 – SPI Mode 0 Compatible (for frequencies up to 66MHz)
AC
DRIVING
LEVELS
AC
MEASUREMENT
LEVEL
0.45V
1.5V
2.4V
DEVICE
UNDER
TEST
30pF
CS
SCK
SI
SO
t
CSS
VALID IN
t
H
t
SU
t
WH
t
WL
t
CSH
t
CS
t
V
HIGH IMPEDANCE VALID OUT
t
HO
t
DIS
HIGH IMPEDANCE
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21.2 Waveform 2 – SPI Mode 3 Compatible (for frequencies up to 66MHz)
21.3 Waveform 3 – RapidS Mode 0 (FMAX = 66MHz)
21.4 Waveform 4 – RapidS Mode 3 (FMAX = 66MHz)
21.5 Utilizing the RapidS Function
To take advantage of the RapidS function's ability to operate at higher clock frequencies, a full clock cycle must be
used to transmit data back and forth across the serial bus. The DataFlash is designed to always clock its data out
on the falling edge of the SCK signal and clock data in on the rising edge of SCK.
For full clock cycle operation to be achieved, when the DataFlash is clocking data out on the falling edge of SCK,
the host controller should wait until the next falling edge of SCK to latch the data in. Similarly, the host controller
should clock its data out on the rising edge of SCK in order to give the DataFlash a full clock cycle to latch the
incoming data in on the next rising edge of SCK.
CS
SCK
SO
t
CSS
VALID IN
t
H
t
SU
t
WL
t
WH
t
CSH
t
CS
t
V
HIGH Z VALID OUT
t
HO
t
DIS
HIGH IMPEDANCE
SI
CS
SCK
SI
SO
tCSS
VALID IN
tH
tSU
tWH tWL tCSH
tCS
tV
HIGH IMPEDANCE VALID OUT
tHO tDIS
HIGH IMPEDANCE
CS
SCK
SO
t
CSS
VALID IN
t
H
t
SU
t
WL
t
WH
t
CSH
t
CS
t
V
HIGH Z VALID OUT
t
HO
t
DIS
HIGH IMPEDANCE
SI
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Figure 21-1. RapidS Mode
21.6 Reset Timing
Note: The CS signal should be in the high state before the RESET signal is deasserted
SCK
MOSI
MISO
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
MOSI = Master Out, Slave In
MISO = Master In, Slave Out
The Master is the host controller and the Slave is the DataFlash
The Master always clocks data out on the rising edge of SCK and always clocks data in on the falling edge of SCK.
The Slave always clocks data out on the falling edge of SCK and always clocks data in on the rising edge of SCK.
A. Master clocks out first bit of BYTE-MOSI on the rising edge of SCK
B. Slave clocks in first bit of BYTE-MOSI on the next rising edge of SCK
C. Master clocks out second bit of BYTE-MOSI on the same rising edge of SCK
D. Last bit of BYTE-MOSI is clocked out from the Master
E. Last bit of BYTE-MOSI is clocked into the slave
F. Slave clocks out first bit of BYTE-SO
G. Master clocks in first bit of BYTE-SO
H. Slave clocks out second bit of BYTE-SO
I. Master clocks in last bit of BYTE-SO
A B C D E
F G
1
H
BYTE-MOSI
MSB LSB
BYTE-SO
MSB LSB
Slave CS
I
CS
SCK
RESET
SO (OUTPUT) HIGH IMPEDANCE HIGH IMPEDANCE
SI (INPUT)
tRST
tREC tCSS
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21.7 Command Sequence for Read/Write Operations for Page Size 512-Bytes (Except Status
Register Read, Manufacturer and Device ID Read)
21.8 Command Sequence for Read/Write Operations for Page Size 528-Bytes (Except Status
Register Read, Manufacturer and Device ID Read)
22. Write Operations
The following block diagram and waveforms illustrate the various write sequences available.
SI (INPUT) CMD 8-bits 8-bits 8-bits
Page Address
(A20 - A9)
X X X X X X X X X X X X X X X X LSB
X X X X X X X X
Byte/Buffer Address
(A8 - A0/BFA8 - BFA0)
MSB
Don’t Care
Bits
Page Address
(PA11 - PA0)
Byte/Buffer Address
(BA9 - BA0/BFA9 - BFA0)
SI (INPUT) CMD 8-bits 8-bits 8-bits
X X X X X X X X X X X X LSB
X X X X X X X X
MSB
2 Don’t Care
Bits
X X X X
FLASH MEMORY ARRAY
PAGE (512-/528-BYTES)
BUFFER 2 (512-/528-BYTES)BUFFER 1 (512-/528-BYTES)
I/O INTERFACE
SI
BUFFER 1 TO
MAIN MEMORY
PAGE PROGRAM
BUFFER 2 TO
MAIN MEMORY
PAGE PROGRAM
BUFFER 1
WRITE
BUFFER 2
WRITE
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22.1 Buffer Write
22.2 Buffer to Main Memory Page Program (Data from Buffer Programmed into Flash Page)
23. Read Operations
The following block diagram and waveforms illustrate the various read sequences available.
SI (INPUT) CMD
Completes writing into selected buffer
CS
X
X···X, BFA9-8
BFA7-0
nn+1 Last Byte
BINARY PAGE SIZE
15 DON'T CARE + BFA8-BFA0
SI (INPUT) CMD
PA11-6 PA5-0, XX
CS
Starts self-timed erase/program operation
XXXX XX
Each transition
represents eight bits
n = 1st byte read
n+1 = 2nd byte read
BINARY PAGE SIZE
A20-A9 + 9 DON'T CARE BITS
FLASH MEMORY ARRAY
PAGE (512-/528-BYTES)
BUFFER 2 (512-/528-BYTES)BUFFER 1 (512-/528-BYTES)
I/O INTERFACE
MAIN MEMORY
PAGE TO
BUFFER 1
MAIN MEMORY
PAGE TO
BUFFER 2
MAIN MEMORY
PAGE READ
BUFFER 1
READ
BUFFER 2
READ
SO
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23.1 Main Memory Page Read
23.2 Main Memory Page to Buffer Transfer (Data from Flash Page Read into Buffer)
23.3 Buffer Read
SI (INPUT)
CMD PA11-6 , PA5-0, BA9-8
X
CS
n n+1
SO (OUTPUT)
BA7-0
4 Dummy Bytes
X
ADDRESS FOR BINARY PAGE SIZE
A20-A16 A15-A8 A7-A0
Starts reading page data into buffer
SI (INPUT)
CMD PA11-6 PA5-0, XX
CS
SO (OUTPUT)
XXXX XXXX
BINARY PAGE SIZE
A20-A9 + 9 DON'T CARE BITS
CMD
CS
n n+1
X
X X..X, BFA9-8 BFA7- 0
BINARY PAGE SIZE
15 DON'T CARE + BFA8-BFA0
Each transition
represents eights bits
SI (INPUT)
SO (OUTPUT)
No Dummy Byte (opcodes D1H and D3H)
1 Dummy Byte (opcodes D4H and D6H)
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24. Detailed Bit-level Read Waveform –
RapidS Serial Interface Mode 0/Mode 3
24.1 Continuous Array Read (Legacy Opcode E8H)
24.2 Continuous Array Read (Opcode 0BH)
24.3 Continuous Array Read (Low Frequency: Opcode 03H)
SCK
CS
SI
SO
MSB MSB
2310
11101000
675410119812 63666765646233 3431 3229 30 68 71 727069
OPCODE
AAAA AAAAA
MSB
XXXX XX
MSB MSB
DDDDDDDDDD
ADDRESS BITS 32 DON'T CARE BITS
DATA BYTE 1
HIGH-IMPEDANCE
BIT 4095/4223
OF PAGE n
BIT 0 OF
PAGE n+1
SCK
CS
SI
SO
MSB MSB
2310
00001011
675410119812 39424341403833 3431 3229 30 44 47 484645
OPCODE
AAAA AAAAA
MSB
XXXX XX
MSB MSB
DDDDDDDDDD
ADDRESS BITS A20 - A0 DON'T CARE
DATA BYTE 1
HIGH-IMPEDANCE
36 3735
XX
SCK
CS
SI
SO
MSB MSB
2310
00000011
675410119812 373833 36353431 3229 30 39 40
OPCODE
AAAA AAAAA
MSB MSB
DDDDDDDDDD
ADDRESS BITS A20-A0
DATA BYTE 1
HIGH-IMPEDANCE
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24.4 Main Memory Page Read (Opcode: D2H)
24.5 Buffer Read (Opcode D4H or D6H)
24.6 Buffer Read (Low Frequency: Opcode D1H or D3H)
SCK
CS
SI
SO
MSB MSB
2310
11010010
675410119812 63666765646233 3431 3229 30 68 71 727069
OPCODE
AAAA AAAAA
MSB
XXXX XX
MSB MSB
DDDDDDDDDD
ADDRESS BITS 32 DON'T CARE BITS
DATA BYTE 1
HIGH-IMPEDANCE
SCK
CS
SI
SO
MSB MSB
2 3 1 0
1 1 0 1 0 1 0 0
6 7 5 4 10 11 9 8 12 39 42 43 41 40 37 38 33 36 35 34 31 32 29 30 44 47 48 46 45
OPCODE
X X X X A A A X X
MSB
X X X X X X X X
MSB MSB
D D D D D D D D D D
ADDRESS BITS
BINARY PAGE SIZE = 15 DON'T CARE + BFA8-BFA0
STANDARD DATAFLASH PAGE SIZE =
14 DON'T CARE + BFA9-BFA0 DON'T CARE
DATA BYTE 1
HIGH-IMPEDANCE
SCK
CS
SI
SO
MSB MSB
2 3 1 0
1 1 0 1 0 0 0 1
6 7 5 4 10 11 9 8 12 37 38 33 36 35 34 31 32 29 30 39 40
OPCODE
X X X X A A A X X
MSB MSB
D D D D D D D D D D
DATA BYTE 1
HIGH-IMPEDANCE
ADDRESS BITS
BINARY PAGE SIZE = 15 DON'T CARE + BFA8-BFA0
STANDARD DATAFLASH PAGE SIZE =
14 DON'T CARE + BFA9-BFA0
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24.7 Read Sector Protection Register (Opcode 32H)
24.8 Read Sector Lockdown Register (Opcode 35H)
24.9 Read Security Register (Opcode 77H)
SCK
CS
SI
SO
MSB MSB
2310
00110010
675410119812 373833 36353431 3229 30 39 40
OPCODE
XXXX XXXXX
MSB MSB
DDDDDDDDD
DON'T CARE
DATA BYTE 1
HIGH-IMPEDANCE
SCK
CS
SI
SO
MSB MSB
2310
00110101
675410119812 373833 36353431 3229 30 39 40
OPCODE
XXXX XXXXX
MSB MSB
DDDDDDDDD
DON'T CARE
DATA BYTE 1
HIGH-IMPEDANCE
SCK
CS
SI
SO
MSB MSB
2310
01110111
675410119812 373833 36353431 3229 30 39 40
OPCODE
XXXX XXXXX
MSB MSB
DDDDDDDDD
DON'T CARE
DATA BYTE 1
HIGH-IMPEDANCE
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24.10 Status Register Read (Opcode D7H)
24.11 Manufacturer and Device Read (Opcode 9FH)
SCK
CS
SI
SO
MSB
2310
11010111
675410119812 212217 20191815 1613 14 23 24
OPCODE
MSB MSB
DDDDDD DDDD
MSB
DDDDDDDD
STATUS REGISTER DATA STATUS REGISTER DATA
HIGH-IMPEDANCE
SCK
CS
SI
SO
6 0
9FH
8 7 38
OPCODE
1FH DEVICE ID BYTE 1 DEVICE ID BYTE 2 00H
HIGH-IMPEDANCE
14 16 15 22 24 23 30 32 31
Note: Each transition shown for SI and SO represents one byte (8-bits)
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25. Auto Page Rewrite Flowchart
Figure 25-1. Algorithm for Programming or Reprogramming of the Entire Array Sequentially
Notes: 1. This type of algorithm is used for applications in which the entire array is programmed sequentially, filling the array
page-by-page
2. A page can be written using either a Main Memory Page Program operation or a Buffer Write operation followed by
a Buffer to Main Memory Page Program operation
3. The algorithm above shows the programming of a single page. The algorithm will be repeated sequentially for each
page within the entire array
START
MAIN MEMORY PAGE PROGRAM
THROUGH BUFFER
(82H, 85H)
END
provide address
and data
BUFFER WRITE
(84H, 87H)
BUFFER TO MAIN
MEMORY PAGE PROGRAM
(83H, 86H)
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Figure 25-2. Algorithm for Randomly Modifying Data
Notes: 1. To preserve data integrity, each page of an DataFlash sector must be updated/rewritten at least once within every
10,000 cumulative page erase and program operations
2. A Page Address Pointer must be maintained to indicate which page is to be rewritten. The Auto Page Rewrite com-
mand must use the address specified by the Page Address Pointer
3. Other algorithms can be used to rewrite portions of the Flash array. Low-power applications may choose to wait
until 10,000 cumulative page erase and program operations have accumulated before rewriting all pages of the
sector. See application note AN-4 (“Using Adesto’s Serial DataFlash”) for more details
START
MAIN MEMORY PAGE
TO BUFFER TRANSFER
(53H, 55H)
INCREMENT PAGE
ADDRESS POINTER(2)
AUTO PAGE REWRITE(2)
(58H, 59H)
END
provide address of
page to modify
If planning to modify multiple
bytes currently stored within
a page of the Flash array
MAIN MEMORY PAGE PROGRAM
THROUGH BUFFER
(82H, 85H)
BUFFER WRITE
(84H, 87H)
BUFFER TO MAIN
MEMORY PAGE PROGRAM
(83H, 86H)
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26. Ordering Information
26.1 Ordering Code Detail
26.2 Green Package Options (Pb/Halide-free/RoHS Compliant)
Notes: 1. The shipping carrier option is not marked on the devices
2. Standard parts are shipped with the page size set to 528-bytes. The user is able to configure these parts to a 512-
byte page size if desired
3. Parts ordered with suffix SL954 are shipped in bulk with the page size set to 512-bytes. Parts will have a 954 or
SL954 marked on them
4. Parts ordered with suffix SL955 are shipped in tape and reel with the page size set to 512-bytes. Parts will have a
954 or SL954 marked on them
AT4 5D 16 SSU1D–B
Designator
Product Family
Device Density
16 = 16-megabit
Interface
1 = Serial
Package Option
M = 8-lead, 6 x 5 x 1mm MLF (VDFN)
S = 8-lead, 0.209" wide SOIC
T = 28-lead, TSOP
Device Grade
U = Matte Sn lead finish, industrial
temperature range (-40°C to +85°C)
Device Revision
C = 24 Ball BGA
Ordering Code(1)(2) Package Lead Finish Operating Voltage fSCK (MHz) Operation Range
AT45DB161D-MU
AT45DB161D-MU-SL954(3)
AT45DB161D-MU-SL955(4)
8M1-A
Matte Sn 2.7V to 3.6V 66
Industrial
(-40C to 85C)
2.7V to 3.6V
AT45DB161D-SU
AT45DB161D-SU-SL954(3)
AT45DB161D-SU-SL955(4)
8S2
AT45DB161D-TU 28T
AT45DB161D-MU-2.5 8M1-A
Matte Sn 2.5V to 3.6V 50AT45DB161D-SU-2.5 8S2
AT45DB161D-TU-2.5 28T
AT45DB161D-CU 24C1 Matte Sn 2.7V to 3.6V 66
Package Type
8M1-A 8-pad, 6 x 5 x 1.00mm Body, Very Thin Dual Flat Package No Lead MLF™ (VDFN)
8S2 8-lead, 0.209” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
28T 28-lead, 8mm x 13.4mm, Plastic Thin Small Outline Package, Type I (TSOP)
24C1 24-Ball, 6mm x 8mm x 1,4mm Ball Grid Array with a 1mm pitch 5 x 5 Ball Matrix
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27. Packaging Information
27.1 8M1-A – MLF (VDFN)
TITLE DRAWING NO. GPC REV.
Package Drawing Contact:
contact@adestotech.com
8M1-A, 8-pad, 6 x 5 x 1.00mm Body, Thermally
Enhanced Plastic Very Thin Dual Flat No
Lead Package (VDFN)
D
8M1-AYBR
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A – 0.85 1.00
A1 – – 0.05
A2 0.65 TYP
A3 0.20 TYP
b 0.35 0.40 0.48
D 5.90 6.00 6.10
D1 5.70 5.75 5.80
D2 3.20 3.40 3.60
E 4.90 5.00 5.10
E1 4.70 4.75 4.80
E2 3.80 4.00 4.20
e 1.27
L 0.50 0.60 0.75
– – 12o
K 0.25 – –
Pin 1 ID
TOP VIEW
Pin #1 Notch
(0.20 R)
BOTTOM VIEW
D2
E2
L
b
D1
D
E1
E
e
A3
A2
A1
A
0.08 C
0
SIDE VIEW
0
K
0.45
8/28/08
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27.2 8S2 – EIAJ SOIC
TITLE DRAWING NO. GPC REV.
Package Drawing Contact:
contact@adestotech.com
8S2 STN F
8S2, 8-lead, 0.208” Body, Plastic Small
Outline Package (EIAJ)
4/15/08
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs aren't included.
3. Determines the true geometric position.
4. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.
A 1.70 2.16
A1 0.05 0.25
b 0.35 0.48 4
C 0.15 0.35 4
D 5.13 5.35
E1 5.18 5.40 2
E 7.70 8.26
L 0.51 0.85
q 0° 8°
e 1.27 BSC 3
qq
1 1
N N
E E
TOP VIEW TOP VIEW
C C
E1 E1
END VIEW END VIEW
A A
b b
L L
A1 A1
e e
D D
SIDE VIEW SIDE VIEW
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27.3 28T – TSOP, Type 1
TITLE DRAWING NO. REV.
Package Drawing Contact:
contact@adestotech.com 28T, 28-lead (8 x 13.4mm) Plastic Thin Small Outline
Package, Type I (TSOP) C
28T
12/06/02
PIN 1 0º ~ 5º
D1 D
Pin 1 Identifier Area
b
e
EA
A1
A2
c
L
GAGE PLANE
SEATING PLANE
L1
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
Notes: 1. This package conforms to JEDEC reference MO-183.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15mm per side and on D1 is 0.25mm per side.
3. Lead coplanarity is 0.10mm maximum.
A – – 1.20
A1 0.05 – 0.15
A2 0.90 1.00 1.05
D 13.20 13.40 13.60
D1 11.70 11.80 11.90 Note 2
E 7.90 8.00 8.10 Note 2
L 0.50 0.60 0.70
L1 0.25 BASIC
b 0.17 0.22 0.27
c 0.10 – 0.21
e 0.55 BASIC
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27.4 24C1 - Ball Grid Array
TITLE DRAWING NO. REV.
Package Drawing Contact:
contact@adestotech.com
24C1, 24-ball (5 x 5 Array), 6 x 8 x 1.4 mm Body, 1.0mm
Ball Pitch Chip-scale Ball Grid Array Package (CBGA) A
24C1
04/11/01
Dimensions in Millimeters and (Inches).
Controlling dimension: Millimeters.
A
B
C
D
E
54 3 21
4.0 (0.157)
1.00 (0.039) REF
0.46 (0.018)
DIA BALL TYP
2.00 (0.079) REF
4.0 (0.157)
8.10(0.319)
7.90(0.311)
1.40 (0.055) MAX
0.30 (0.012)MIN
6.10(0.240)
5.90(0.232)
1.00 (0.0394) BSC
NON-ACCUMULATIVE
A1 ID
1.00 (0.0394) BSC
NON-ACCUMULATIVE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
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28. Revision History
Doc. Rev. Date Comments
3500Q 11/2017 Added patent information. Updated company address.
3500P 5/2013 Added “Not Recommended for New Designs. Updated registered trademark logo, copyright
dates, document file dates and file name.
3500O 11/2012 Update to Adesto Technologies.
3500N 05/2010
Changed tSE (Typ) 1.6 to 0.7 and (Max) 5 to 1.3
Changed tCE (Typ) TBD to 12 and (Max) TBD to 25
Changed from 10,000 to 20,000 cumulative page erase/program operations and added the
please contact Adesto statement in section 11.3
3500M 04/2009
Updated Absolute Maximum Ratings
Added 24C1 24 Ball BGA package Option
Deleted DataFlash Card Package Option
Removed Chip Erase Errata
3500L 03/2009
Changed Deep Power-Down Current values
- Increased typical value from 5µA to 15µA
- Increased maximum value from 15µA to 25µA
3500K 02/2009 Changed tDIS (Typ and Max) to 27ns and 35ns, respectively
3500J 04/2008 Added part number ordering code details for suffixes SL954/955
Added ordering code details
3500I 08/2007
Added additional text to “power of 2” binary page size option
Removed SER/BYTE statement from SI and SO pin descriptions in Table 2-1
Changed tVSCL from 50µs to 70µs
Changed tXFR and tCOMP values from 400µs to 200µs
Changed tRDPD from 30µs to 35µs
3500H 08/2006 Added tSCKR and tSCKF parameters to Table 18-4
3500G 08/2006 Added errata regarding Chip Erase
3500F 07/2006 Corrected typographical errors
3500E 05/2006 Added Legacy Status Register Read opcode 57H. This opcode is supported on devices with date
code 0636 and later
3500D 02/2006 Changed part 2 of the device ID to 00H
3500C 01/2006
Added text, in “Programming the Configuration Register”, to indicate that power cycling is
required to switch to “power of 2” page size after the opcode enable has been executed
Added “Legacy Commands” table
3500B 11/2005
Added 2.5V - 3.6V operating range
Changed tVCSL from 30µs to 50µs min
Changed tPUW from 10ms to 20ms max
Changed tDIS from 8ns to 6ns max (2.7V device)
Changed tV from 8ns to 6ns max (2.7V device)
3500A 09/2005 Initial Document Release
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29. Errata
29.1 No Errata Conditions
Corporate Office
California | USA
Adesto Headquarters
3600 Peterson Way
Santa Clara, CA 95054
Phone: (+1) 408.400.0578
Email: contact@adestotech.com
© 2017 Adesto Technologies. All rights reserved. / Rev.: 3500Q–DFLASH–11/2017
Disclaimer: Adesto Technologies Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Adesto's Terms
and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications
detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Adesto are granted by the
Company in connection with the sale of Adesto products, expressly or by implication. Adesto's products are not authorized for use as critical components in life support devices or systems.
Adesto®, the Adesto logo, CBRAM®, and DataFlash® are registered trademarks or trademarks of Adesto Technologies. All other marks are the property of their respective
owners. Adesto products in this datasheet are covered by certain Adesto patents registered in the United States and potentially other countries. Please refer to
http://www.adestotech.com/patents for details.
