WT11u DATA SHEET Tuesday, 29 January 2019 Version 1.2 VERSION HISTORY Version Comment 0.8 Initial versions 0.81 Ordering information updated 0.9 Reformatted tables, many WT11i->WT11u updates 0.9.1 Rest of tables reformatted 0.9.2 Updated dimension drawings 0.9.3 Certification information, RF parameters 0.9.4 Added sensitivity and current consumption measurements 0.9.5 Changed Transmit power variation over supply voltage range to 0.5 and typical transmit power to 16.5dBm 0.9.6 Small edits to specifications 0.9.7 OPN descriptions updated 1.0 Full production 1.1 Package Marking updated 1.2 Updated some module graphics Silicon Labs TABLE OF CONTENTS 1 Ordering Information......................................................................................................................................6 2 Pinout and Terminal Description ...................................................................................................................7 3 Electrical Characteristics ............................................................................................................................ 10 4 3.1 Absolute Maximum Ratings ................................................................................................................ 10 3.2 Recommended Operating Conditions ................................................................................................. 10 3.3 Input / Output Terminal Characteristics .............................................................................................. 11 3.3.1 Input/Output Terminal Characteristics (Digital) ............................................................................ 11 3.3.2 Input/Output Terminal Characteristics (USB) .............................................................................. 12 3.4 PIO Current Sink and Source Capability ............................................................................................. 13 3.5 Transmitter Performance For BDR ..................................................................................................... 13 3.6 Receiver Performance ........................................................................................................................ 14 3.7 Current Consumption .......................................................................................................................... 14 3.8 WT11u-A Antenna Specification ......................................................................................................... 15 Physical Dimensions .................................................................................................................................. 18 4.1 Package Drawings .............................................................................................................................. 20 5 Layout Guidelines ....................................................................................................................................... 22 6 UART Interface ........................................................................................................................................... 25 7 6.1 UART Bypass ...................................................................................................................................... 27 6.2 UART Configuration While Reset is Active ......................................................................................... 27 6.3 UART Bypass Mode ............................................................................................................................ 27 USB Interface ............................................................................................................................................. 28 7.1 USB Data Connections ....................................................................................................................... 28 7.2 USB Pull-Up resistor ........................................................................................................................... 28 7.3 USB Power Supply .............................................................................................................................. 28 7.4 Self-Powered Mode ............................................................................................................................. 28 7.5 Bus-Powered Mode ............................................................................................................................. 29 7.6 USB Suspend Current ......................................................................................................................... 30 7.7 USB Detach and Wake-Up Signaling.................................................................................................. 30 7.8 USB Driver .......................................................................................................................................... 31 7.9 USB v2.0 Compliance and Compatibility ............................................................................................ 31 8 Serial Peripheral Interface (SPI) ................................................................................................................. 32 9 PCM Codec Interface ................................................................................................................................. 33 9.1 PCM Interface Master/Slave ............................................................................................................... 33 9.2 Long Frame Sync ................................................................................................................................ 34 9.3 Short Frame Sync ............................................................................................................................... 34 9.4 Multi-slot Operation ............................................................................................................................. 35 9.5 GCI Interface ....................................................................................................................................... 35 Silicon Labs 9.6 Slots and Sample Formats .................................................................................................................. 36 9.7 Additional Features ............................................................................................................................. 37 9.8 PCM_CLK and PCM_SYNC Generation ............................................................................................ 37 9.9 PCM Configuration .............................................................................................................................. 38 10 I/O Parallel Ports ..................................................................................................................................... 41 10.1 11 PIO Defaults ................................................................................................................................. 41 Reset ....................................................................................................................................................... 42 11.1 Pin States on Reset ..................................................................................................................... 43 12 Package Marking .................................................................................................................................... 44 13 Certifications ........................................................................................................................................... 46 13.1 Bluetooth ...................................................................................................................................... 46 13.2 FCC .............................................................................................................................................. 46 13.3 ISEDC .......................................................................................................................................... 47 13.3.1 ISEDC (Francais) ......................................................................................................................... 47 13.4 CE ................................................................................................................................................ 49 13.5 MIC Japan .................................................................................................................................... 49 13.6 Qualified Antenna Types for WT11u-E ........................................................................................ 50 13.7 Moisture Sensitivity Level (MSL).................................................................................................. 50 Silicon Labs WT11u Bluetooth(R) Module DESCRIPTION WT11u is a fully integrated Bluetooth 2.1 + EDR, class 1 module combining antenna, Bluetooth radio and an on-board iWRAP Bluetooth stack. Silicon Labs WT11u provides an ideal solution for developers that want to quickly integrate long range and high performance Bluetooth wireless technology to their design without investing several months into Bluetooth radio and stack development. WT11u provides a 100dB link budget ensuring long rage and robust Bluetooth connectivity. WT11u uses Silicon Labs' iWRAP Bluetooth stack, which is an embedded Bluetooth stack implementing 13 different Bluetooth profiles and Apple iAP connectivity. By using WT11u combined with iWRAP Bluetooth stack and Silicon Labs' excellent technical support designers ensure quick time to market, low development costs and risk. KEY FEATURES: Radio features: Industrial and M2M * Point-of-Sale devices * Computer Accessories Bluetooth v.2.1 + EDR * Bluetooth class 1 radio * Transmit power: +17 dBm * Receiver sensitivity: -84 dBm (DH5) * Range: 350 meters line-of-sight * Integrated connector chip antenna or U.FL Hardware features: APPLICATIONS: * * * UART and USB host interfaces * 802.11 co-existence interface * 6 software programmable IO pins * Operating voltage: 2.7V to 3.6V * Temperature range: -40C to +85C * Dimensions: 35.75 x 14.50 x 2.6 mm Qualifications: * Bluetooth * CE * FCC * IC * Japan PHYSICAL OUTLOOK Silicon Labs 1 Ordering Information Firmware U.FL Connector Internal chip antenna iWRAP 5.6 firmware WT11u-E-AI56 WT11u-A-AI56 iWRAP 5.5 firmware WT11u-E-AI55 WT11u-A-AI55 iWRAP 5.0.2 firmware WT11u-E-AI5 WT11u-A-AI5 HCI firmware, BT2.1 + EDR WT11u-E-HCI21 WT11u-A-HCI21 Table 1: Ordering information Silicon Labs Page 6 of 51 Pinout and Terminal Description 2 Figure 1: WT11u connection diagram Pad name Pad number Pad type Description RESET 17 Input Reset input, active high, internal 220kohm pull-down. Keep high for >5ms for reset GND 1, 14, 15, 28 GND Ground connection, connect all to a ground plane with minimal trace lengths VDD_PA 2 Supply voltage Supply voltage for RF power amplifier VDD 16 Supply voltage Chipset supply voltage Table 2: Supply and RF Terminal Descriptions Silicon Labs Page 7 of 51 PIO signal Pad number Description PIO[2] 3 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[3] 4 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[4] 20 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[5] 25 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[6] 18 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[7] 19 Bi-directional digital in/out with programmable strength and pull-up/pulldown AIO[1] 27 Bi-directional analog in/out Table 3: GPIO Terminal Descriptions PCM signal Pad number Pad type Description PCM_OUT 7 Output, weak internal pull-down PCM_IN 11 Input, weak internal pull-down Synchronous data input PCM_SYNC 13 Bi-directional, weak internal pull-down Synchronous data sync PCM_CLK 12 Bi-directional, weak internal pull-down Synchronous data clock Synchronous data output Table 4: PCM Terminal Descriptions Silicon Labs Page 8 of 51 UART signal Pad number Pad type Description UART_TX 26 Output, pull-up weak internal UART data output, active high UART_RTS# 5 Output, pull-up weak internal UART request to send, active low UART_RX 6 Input, weak internal pulldown UART data input, active high UART_CTS# 10 Input, weak internal pulldown UART clear to send, active low Table 5: UART Terminal Descriptions USB signal Pad number Pad type Description USB+ 8 Bidirectional USB data line with internal 1.5kohm pull-up USB- 9 Bidirectional USB data line Table 6: USB Terminal Descriptions SPI signal Pad number Pad type SPI_MOSI 24 Input, weak internal pull-down SPI_CS# 21 Input, weak internal pull-up SPI_CLK 22 Input, weak internal pull-down SPI_MISO 23 Output, weak internal pull-down Description SPI data input Chip select, active low SPI clock SPI data output Table 7: Terminal Descriptions Silicon Labs Page 9 of 51 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Specification Min Max Unit Storage temperature -40 85 C VDD_PA, VDD -0.4 3.6 V VSS-0.4 VDD+0.4 V Specification Min Max Unit Operating temperature -40 85 C VDD_PA*, VDD 3.0 3.6 V Other terminal voltages Table 8: Absolute Maximum Ratings 3.2 Recommended Operating Conditions *) VDD_PA has an effect on the RF output power. Table 9: Recommended Operating Conditions Silicon Labs Page 10 of 51 3.3 Input / Output Terminal Characteristics 3.3.1 Input/Output Terminal Characteristics (Digital) Digital Terminals Min Typ Max Unit 2.7 V VDD 3.0 V -0.4 - 0.8 V 1.7 V VDD 1.9 V -0.4 - 0.4 V 0.7 VDD - VDD + 0.4 V - - 0.2 V - - 0.4 V VOL output logic level high (IO = 4.0 mA) 2.7V VDD 3.0 VDD - 0.2 - V VOL output logic level high (IO = 4.0 mA) 1.7V VDD 1.9 VDD - 0.4 - V -100 -40 -10 A 10 40 100 A Weak pull-up -5.0 -1.0 -0.2 A Weak pull-down 0.2 1.0 5.0 A I/O pad leakage current -1 0 1 A CI input capacitance 1.0 - 5.0 pF Input Voltage Levels VIL input logic level low VIH input logic level high Output Voltage Levels VOL output logic level low (IO = 4.0 mA) 2.7V VDD 3.0 V VOL output logic level low (IO = 4.0 mA) 1.7V VDD 1.9 Input and Tristate Current with Strong pull-up Strong pull-down Silicon Labs Page 11 of 51 3.3.2 Input/Output Terminal Characteristics (USB) USB Terminals Min VDD_USB for correct USB operation 3.1 Typ Max Unit 3.6 V Input Threshold VIL input logic level log VIH input logic level high - - 0.3VDD_USB V 0.7VDD_USB - - V Silicon Labs Page 12 of 51 3.4 PIO Current Sink and Source Capability Figure 2: WT11u PIO Current Drive Capability 3.5 Transmitter Performance For BDR RF characteristic Min Max transmit power Typ Max 16.5 Bluetooth specification Unit <20 dBm Transmit power variation over temperature range -2 2 dB Transmit power variation over supply voltage range -0.5 0.5 dB Transmit power variation over frequency range -0.5 0.5 dB Transmit power control range -15 15 dB 20dB bandwidth for modulated carrier Avg drift F1avg 950 -10 3 166 <1000 kHz 40 kHz 140 to 175 kHz Table 10: Transmitter performance for BDR (room temperature, VDD=3.3V) Silicon Labs Page 13 of 51 3.6 Receiver Performance Antenna gain not taken into account Characteristic, VDD=3.3V, room temperature Packet type Typ Bluetooth specification Unit DH1 -86 -70 dBm DH5 -83.5 dBm 2-DH1 -88 dBm 2-DH5 -86.5 dBm 3-DH1 -81.5 dBm 3-DH5 -79.5 dBm +/- 2 dB Sensitivity for 0.1% BER Sensitivity variation over temperature range 3.7 Current Consumption Operating mode Peak Stand-by, page mode 0 2000 1 Average Unit 1.7 mA TX 3-DH5, max duty cycle 111 88 mA TX 2-DH5, max duty cycle 110 88 mA TX DH5, max duty cycle 176 138 mA RX 43 36 mA 51 A 58 mA Deep sleep, page mode 0 2000 1 Inquiry 117 Table 11: WT11u Current Consumption Silicon Labs Page 14 of 51 3.8 WT11u-A Antenna Specification WT11u-A uses a monopole type on a chip antenna with maximum gain of 0.5 dBi. The radiation pattern and the total radiated efficiency are dependent on the layout and any metal around the antenna has an effect on the radiation characteristics. Typically the efficiency is 30 ... 50%. Figure 3: Antenna radiation pattern in a USB dongle layout Figure 4: Antenna radiation pattern in a USB dongle layout Silicon Labs Page 15 of 51 Figure 5: Antenna radiation pattern in a USB dongle layout Figure 6: Antenna radiation pattern in the WT11 evaluation kit Figure 7: Antenna radiation pattern in the WT11 evaluation kit Silicon Labs Page 16 of 51 Figure 8: Antenna radiation pattern in the WT11 evaluation kit Silicon Labs Page 17 of 51 4 Physical Dimensions Figure 9: Physical dimensions (top view) Figure 10: Dimensions of WT11u-A Silicon Labs Page 18 of 51 Figure 11: Dimensions of WT11u-E Silicon Labs Page 19 of 51 4.1 Package Drawings Figure 12: WT11u taping Silicon Labs Page 20 of 51 Figure 13: WT11u orientation in the reel Silicon Labs Page 21 of 51 5 Layout Guidelines WT11u is pin compatible with WT11i and WT11, despite slightly different external dimensions compared to WT11. For a new design it recommended to follow the land pattern shown in the figure below. Figure 14: Recommended PCB land pattern for WT11u Do not place any copper under the antenna. The minimum recommended keep out area is shown in the Figure 15. Any dielectric material in close proximity to the antenna will effect on the impedance matching of the antenna by lowering the resonance frequency. Figure 16 shows how different FR4 thickness under the antenna effect on the resonance frequency. Recommended PCB thickness for the PCB is 1.6 mm - 2.8 mm. Avoid placing plastic cover closer than 3 mm from the antenna as this will also tune the resonance frequency downwards. Silicon Labs Page 22 of 51 Edge of the PCB Do not place copper or any metal within the area marked with cross lines GND area with stitching vias Figure 15: Recommended metal keep put area for WT11u Effect of PCB thickness to the antenna impedance matching 0 -5 S11 (dB) -10 1 mm 2 mm 3 mm BT Band -15 -20 -25 -30 -35 -40 2300 2350 2400 2450 2500 2550 2600 Freq (MHz) Figure 16: Effect of FR4 under the antenna to the resonant frequency Use good layout practices to avoid excessive noise coupling to supply voltage traces or sensitive analog signal traces, such as analog audio signals. If using overlapping ground planes use stitching vias separated by max 3 mm to avoid emission from the edges of the PCB. Connect all the GND pins directly to a solid GND plane and make sure that there is a low impedance path for the return current following the signal and supply traces all the way from start to the end. Silicon Labs Page 23 of 51 - Make sure that the bias trace does not cross separated GND regions (D AGND) so that the path for the return current is cut. If this is not possibl not separate GND regions but keep one solid GND plane. - Keep the trace as short as possible A good practice is to dedicate one of the inner layers to a solid GND plane and one of the inner layers to supply voltage planes and traces and route all the signals on top and bottom layers of the PCB. This arrangement will make sure that any return current follows the forward current as close as possible and any loops are minimized. Recommended PCB layer configuration Signals GND Power Signals Figure 17: Typical 4-layer PCB construction Overlapping GND layers without GND stitching vias Overlapping GND layers with GND stitching vias shielding the RF energy Figure 18: Use of stitching vias to avoid emissions from the edges of the PCB Silicon Labs Page 24 of 51 6 UART Interface This is a standard UART interface for communicating with other serial devices.WT11u UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. Four signals are used to implement the UART function. When WT11u is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. All UART connections are implemented using CMOS technology and have signalling levels of 0V and VDD. UART configuration parameters, such as data rate and packet format, are set using WT11u software. Note: In order to communicate with the UART at its maximum data rate using a standard PC, an accelerated serial port adapter card is required for the PC. Parameter Possible values Data rate Minimum 1200bps (2% error) 9600bps (1% error) Maximum 3Mbps (1% error) Flow control RTS/CTS or None Parity None, Odd or Even Number of stop bits 1 or 2 Bits per channel 8 Table 12: Possible UART Settings The UART interface is capable of resetting WT11u upon reception of a break signal. A break is identified by a continuous logic low (0V) on the UART_RX terminal, as shown in Figure 19. If tBRK is longer than the value (in microseconds), defined by PSKEY_HOST_IO_UART_RESET_TIMEOUT, (0x1a4), a reset will occur. Values below 1000 are treated as zero and values above 255000 are truncated to 255000. This feature allows a host to initialise the system to a known state. Also, WT11u can emit a break character that may be used to wake the host. Figure 19: Break Signal Table 13 shows a list of commonly used data rates and their associated values for PSKEY_UART_BAUD_RATE (0x204). There is no requirement to use these standard values. Any data rate within the supported range can be set in the PS Key according to the formula in Equation 1 Silicon Labs Page 25 of 51 Equation 1: Data Rate Data rate [bits/s] Persistent store value (Hex) Error [bits/s] Error [%] 1200 0x0005 5 1.73 2400 0x000A 10 1.73 4800 0x0014 20 1.73 9600 0x0027 39 -0.82 19200 0x004F 79 0.45 38400 0x009D 157 -0.18 57600 0x00EC 236 0.03 76800 0x013B 315 0.14 115200 0x01D8 472 0.03 230400 0x03B0 944 0.03 460800 0x075F 1887 -0.02 921600 0x0EBF 3775 0 1382400 0x161E 5662 -0.01 1843200 0x1D7E 7550 0 2764800 0x2C3D 11325 0 Table 13: Standard Data Rates Silicon Labs Page 26 of 51 6.1 UART Bypass Figure 20: UART Bypass Architecture 6.2 UART Configuration While Reset is Active The UART interface for WT11u while the chip is being held in reset is tristate. This will allow the user to daisy chain devices onto the physical UART bus. The constraint on this method is that any devices connected to this bus must tristate when WT11u reset is de-asserted and the firmware begins to run. 6.3 UART Bypass Mode Alternatively, for devices that do not tristate the UART bus, the UART bypass mode on the chipset can be used. The default state of the chipset after reset is de-asserted; this is for the host UART bus to be connected to the chipset UART, thereby allowing communication to the chipset via the UART. All UART bypass mode connections are implemented using CMOS technology and have signalling levels of 0V and VDD. In order to apply the UART bypass mode, a BCCMD command will be issued the chipset. Upon this issue, it will switch the bypass to PIO[7:4] as Figure 20 indicates. Once the bypass mode has been invoked, WT11u will enter the Deep Sleep state indefinitely. In order to re-establish communication with WT11u, the chip must be reset so that the default configuration takes effect. It is important for the host to ensure a clean Bluetooth disconnection of any active links before the bypass mode is invoked. Therefore, it is not possible to have active Bluetooth links while operating the bypass mode. The current consumption for a device in UART bypass mode is equal to the values quoted for a device in standby mode. Silicon Labs Page 27 of 51 7 USB Interface This is a full speed (12Mbits/s) USB interface for communicating with other compatible digital devices. WT11u acts as a USB peripheral, responding to requests from a master host controller such as a PC. The USB interface is capable of driving a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented can behave as specified in the USB section of the Bluetooth v2.1 + EDR specification or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers. As USB is a master/slave oriented system (in common with other USB peripherals), WT11u only supports USB Slave operation. 7.1 USB Data Connections The USB data lines emerge as pins USB_DP and USB_DN. These terminals are connected to the internal USB I/O buffers of the chipset, therefore, have a low output impedance. To match the connection to the characteristic impedance of the USB cable, resistors must be placed in series with USB_DP/USB_DN and the cable. 7.2 USB Pull-Up resistor WT11u features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when WT11u is ready to enumerate. It signals to the PC that it is a full speed (12Mbits/s) USB device. The USB internal pull-up is implemented as a current source, and is compliant with section 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15k 5% pulldown resistor (in the hub/host) when VDD_PADS = 3.1V. This presents a Thevenin resistance to the host of at least 900. Alternatively, an external 1.5k pull-up resistor can be placed between a PIO line and D+ on the USB cable. The firmware must be alerted to which mode is used by setting PSKEY_USB_PIO_PULLUP appropriately. The default setting uses the internal pull-up resistor. 7.3 USB Power Supply The USB specification dictates that the minimum output high voltage for USB data lines is 2.8V. To safely meet the USB specification, the voltage on the VDD supply terminal must be an absolute minimum of 3.1V. Silicon Labs recommends 3.3V for optimal USB signal quality. 7.4 Self-Powered Mode In self-powered mode, the circuit is powered from its own power supply and not from the VBUS (5V) line of the USB cable. It draws only a small leakage current (below 0.5mA) from VBUS on the USB cable. This is the easier mode for which to design, as the design is not limited by the power that can be drawn from the USB hub or root port. However, it requires that VBUS be connected to WT11u via a resistor network (Rvb1 and Rvb2), so WT11u can detect when VBUS is powered up. The chipset will not pull USB_DP high when VBUS is off. Self-powered USB designs (powered from a battery or PSU) must ensure that a PIO line is allocated for USB pullup purposes. A 1.5k 5% pull-up resistor between USB_DP and the selected PIO line should be fitted to the design. Failure to fit this resistor may result in the design failing to be USB compliant in self-powered mode. The internal pull-up in the chipset is only suitable for bus-powered USB devices, e.g., dongles. Silicon Labs Page 28 of 51 Figure 21: USB Connections for Self-Powered Mode The terminal marked USB_ON can be any free PIO pin. The PIO pin selected must be registered by setting PSKEY_USB_PIO_VBUS to the corresponding pin number. Identifier Value Function Rs 0-10 as needed by the design ** Impedance matching to USB cable Rvb1 22k 5% VBUS ON sense divider Rvb2 47k 5% VBUS ON sense divider Figure 22: USB Interface Component Values **) WT11u has internal 22 ohm series resistors at the USB lines. 7.5 Bus-Powered Mode In bus-powered mode, the application circuit draws its current from the 5V VBUS supply on the USB cable. WT11u negotiates with the PC during the USB enumeration stage about how much current it is allowed to consume. On power-up the device must not draw more than 100 mA but after being configured it can draw up to 500 mA. For WT11u, the USB power descriptor should be altered to reflect the amount of power required. This is accomplished by setting PSKEY_USB_MAX_POWER (0x2c6). This is higher than for a Class 2 application due to the extra current drawn by the Transmit RF PA. By default for WT11u the setting is 300 mA. When selecting a regulator, be aware that VBUS may go as low as 4.4V. The inrush current (when charging reservoir and supply decoupling capacitors) is limited by the USB specification. See the USB Specification. Some applications may require soft start circuitry to limit inrush current if more than 10uF is present between VBUS and GND. The 5V VBUS line emerging from a PC is often electrically noisy. As well as regulation down to 3.3V and 1.8V, applications should include careful filtering of the 5V line to attenuate noise that is above the voltage regulator bandwidth. Excessive noise on WT11u supply pins will result in reduced receiver sensitivity and a distorted RF transmit signal. Silicon Labs Page 29 of 51 Figure 23: USB Connections for Bus-Powered Mode 7.6 USB Suspend Current All USB devices must permit the USB controller to place them in a USB suspend mode. While in USB Suspend, bus-powered devices must not draw more than 2.5mA from USB VBUS (self-powered devices may draw more than 2.5mA from their own supply). This current draw requirement prevents operation of the radio by buspowered devices during USB Suspend. When computing suspend current, the current from VBUS through the bus pull-up and pull-down resistors must be included. The pull-up resistor at the device is 1.5k. (nominal). The pull-down resistor at the hub is 14.25k. to 24.80k. The pull-up voltage is nominally 3.3V, which means that holding one of the signal lines high takes approximately 200uA, leaving only 2.3mA available from a 2.5mA budget. Ensure that external LEDs and/or amplifiers can be turned off by the chipset. The entire circuit must be able to enter the suspend mode. 7.7 USB Detach and Wake-Up Signaling WT11u can provide out-of-band signaling to a host controller by using the control lines called USB_DETACH and USB_WAKE_UP. These are outside the USB specification (no wires exist for them inside the USB cable), but can be useful when embedding WT11u into a circuit where no external USB is visible to the user. Both control lines are shared with PIO pins and can be assigned to any PIO pin by setting PSKEY_USB_PIO_DETACH and PSKEY_USB_PIO_WAKEUP to the selected PIO number. USB_DETACH is an input which, when asserted high, causes WT11u to put USB_DN and USB_DP in high impedance state and turns off the pull-up resistor on DP. This detaches the device from the bus and is logically equivalent to unplugging the device. When USB_DETACH is taken low, WT11u will connect back to USB and await enumeration by the USB host. USB_WAKE_UP is an active high output (used only when USB_DETACH is active) to wake up the host and allow USB communication to recommence. It replaces the function of the software USB WAKE_UP message (which runs over the USB cable) and cannot be sent while chipset is effectively disconnected from the bus. Silicon Labs Page 30 of 51 Figure 24: USB_Detach and USB_Wake_Up Signals 7.8 USB Driver A USB Bluetooth device driver is required to provide a software interface between the chipset and the Bluetooth software running on the host computer. 7.9 USB v2.0 Compliance and Compatibility Although WT11u meets the USB specification, Silicon Labs cannot guarantee that an application circuit designed around the module is USB compliant. The choice of application circuit, component choice and PCB layout all affect USB signal quality and electrical characteristics. The information in this document is intended as a guide and should be read in association with the USB specification, with particular attention being given to Chapter 7. Independent USB qualification must be sought before an application is deemed USB compliant and can bear the USB logo. Such qualification can be obtained from a USB plugfest or from an independent USB test house. Terminals USB_DP and USB_DN adhere to the USB Specification v2.0 (Chapter 7) electrical requirements. The chipset is compatible with USB v2.0 host controllers; under these circumstances the two ends agree the mutually acceptable rate of 12Mbits/s according to the USB v2.0 specification. Silicon Labs Page 31 of 51 8 Serial Peripheral Interface (SPI) The SPI port can be used for system debugging. It can also be used for programming the Flash memory and setting the PSKEY configurations. WT11u uses 16-bit data and 16-bit address serial peripheral interface, where transactions may occur when the internal processor is running or is stopped. SPI interface is connected using the MOSI, MISO, CSB and CLK pins. SPI interface cannot be used for application purposes. Silicon Labs Page 32 of 51 9 PCM Codec Interface PCM is a standard method used to digitize audio (particularly voice) for transmission over digital communication channels. Through its PCM interface, WT11u has hardware support for continual transmission and reception of PCM data, thus reducing processor overhead for wireless headset applications. WT11u offers a bidirectional digital audio interface that routes directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on WT11u allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any one time. WT11u can operate as the PCM interface master generating an output clock of 128, 256 or 512kHz. When configured as PCM interface slave, it can operate with an input clock up to 2048kHz. WT11u is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. It supports 13-bit or 16-bit linear, 8-bit -law or A-law companded sample formats at 8ksamples/s and can receive and transmit on any selection of three of the first four slots following PCM_SYNC. The PCM configuration options are enabled by setting PSKEY_PCM_CONFIG32. WT11u interfaces directly to PCM audio devices. NOTE: Analog audio lines are very sensitive to RF disturbance. Use good layout practices to ensure noise less audio. Make sure that the return path for the audio signals follows the forward current all the way as close as possible and use fully differential signals when possible. Do not compromise audio routing. 9.1 PCM Interface Master/Slave When configured as the master of the PCM interface, WT11u generates PCM_CLK and PCM_SYNC. Figure 25: PCM Interface Master When configured as the Slave of the PCM interface, WT11u accepts PCM_CLK rates up to 2048kHz. Silicon Labs Page 33 of 51 Figure 26: PCM Interface Slave 9.2 Long Frame Sync Long Frame Sync is the name given to a clocking format that controls the transfer of PCM data words or samples. In Long Frame Sync, the rising edge of PCM_SYNC indicates the start of the PCM word. When WT11u is configured as PCM master, generating PCM_SYNC and PCM_CLK, then PCM_SYNC is 8-bits long. When WT11u is configured as PCM Slave, PCM_SYNC may be from two consecutive falling edges of PCM_CLK to half the PCM_SYNC rate, i.e., 62.5s long. Figure 27: Long Frame Sync (Shown with 8-bit Companded Sample) WT11u samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT may be configured to be high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge. 9.3 Short Frame Sync In Short Frame Sync, the falling edge of PCM_SYNC indicates the start of the PCM word. PCM_SYNC is always one clock cycle long. Silicon Labs Page 34 of 51 Figure 28: Short Frame Sync (Shown with 16-bit Sample) As with Long Frame Sync, WT11u samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT may be configured to be high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge. 9.4 Multi-slot Operation More than one SCO connection over the PCM interface is supported using multiple slots. Up to three SCO connections can be carried over any of the first four slots. Figure 29: Multi-slot Operation with Two Slots and 8-bit Companded Samples 9.5 GCI Interface WT11u is compatible with the GCI, a standard synchronous 2B+D ISDN timing interface. The two 64kbits/s B channels can be accessed when this mode is configured. Silicon Labs Page 35 of 51 Figure 30: GCI Interface The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8kHz. With WT11u in Slave mode, the frequency of PCM_CLK can be up to 4.096MHz. 9.6 Slots and Sample Formats WT11u can receive and transmit on any selection of the first four slots following each sync pulse. Slot durations can be either 8 or 16 clock cycles. Durations of 8 clock cycles may only be used with 8-bit sample formats. Durations of 16 clocks may be used with 8-bit, 13-bit or 16-bit sample formats. WT11u supports 13-bit linear, 16-bit linear and 8-bit -law or A-law sample formats. The sample rate is 8ksamples/s. The bit order may be little or big endian. When 16-bit slots are used, the 3 or 8 unused bits in each slot may be filled with sign extension, padded with zeros or a programmable 3-bit audio attenuation compatible with some Motorola codecs. Silicon Labs Page 36 of 51 Figure 31: 16-bit Slot Length and Sample Formats 9.7 Additional Features WT11u has a mute facility that forces PCM_OUT to be 0. In master mode, PCM_SYNC may also be forced to 0 while keeping PCM_CLK running which some codecs use to control power down. 9.8 PCM_CLK and PCM_SYNC Generation WT11u has two methods of generating PCM_CLK and PCM_SYNC in master mode. The first is generating these signals by DDS from the chipset internal 4MHz clock. Using this mode limits PCM_CLK to 128, 256 or 512kHz and PCM_SYNC to 8kHz. The second is generating PCM_CLK and PCM_SYNC by DDS from an internal 48MHz clock (which allows a greater range of frequencies to be generated with low jitter but consumes more power). This second method is selected by setting bit 48M_PCM_CLK_GEN_EN in PSKEY_PCM_CONFIG32. When in this mode and with long frame sync, the length of PCM_SYNC can be either 8 or 16 cycles of PCM_CLK, determined by LONG_LENGTH_SYNC_EN in PSKEY_PCM_CONFIG32. The Equation XXX describes PCM_CLK frequency when being generated using the internal 48MHz clock: Silicon Labs Page 37 of 51 Equation 2: PCM_CLK Frequency When Being Generated Using the Internal 48MHz Clock The frequency of PCM_SYNC relative to PCM_CLK can be set using Equation XXX: Equation 3: PCM_SYNC Frequency Relative to PCM_CLK CNT_RATE, CNT_LIMIT and SYNC_LIMIT are set using PSKEY_PCM_LOW_JITTER_CONFIG. As an example, to generate PCM_CLK at 512kHz with PCM_SYNC at 8kHz, set PSKEY_PCM_LOW_JITTER_CONFIG to 0x08080177. 9.9 PCM Configuration The PCM configuration is set using two PS Keys, PSKEY_PCM_CONFIG32 detailed in Error! Reference s ource not found. and PSKEY_PCM_LOW_JITTER_CONFIG in Error! Reference source not found.. The default for PSKEY_PCM_CONFIG32 is 0x00800000, i.e., first slot following sync is active, 13-bit linear voice format, long frame sync and interface master generating 256kHz PCM_CLK from 4MHz internal clock with no tri-state of PCM_OUT. Silicon Labs Page 38 of 51 Name Bit position Description - 0 Set to 0 SLAVE MODE EN 1 0 selects Master mode with internal generation of PCM_CLK and PCM_SYNC. 1 selects Slave mode requiring externally generated PCM_CLK and PCM_SYNC. This should be set to 1 if 48M_PCM_CLK_GEN_EN (bit 11) is set. SHORT SYNC EN 2 0 selects long frame sync (rising edge indicates start of frame), - 3 Set to 0 SIGN EXTENDED EN 4 0 selects long frame sync (rising edge indicates start of frame), 1 selects short frame sync (falling edge indicates start of frame). LSB FIRST EN 5 0 transmits and receives voice samples MSB first, 1 uses LSB TX TRISTATE EN 6 0 transmits and receives voice samples MSB first, 1 uses LSB TX TRISTATE RISING EDGE EN 7 0 tristates PCM_OUT immediately after the falling edge of PCM_CLK in the last bit of an active slot, assuming the next slot is also not active. 1 tristates PCM_OUT after the rising edge of PCM_CLK. SYNC SUPPRESS EN 8 0 enables PCM_SYNC output when master, 1 suppresses PCM_SYNC whilst keeping PCM_CLK running. Some CODECS utilize this to enter a low power state GCI MODE EN 9 1 enables GCI mode. MUTE EN 10 1 forces PCM_OUT to 0. 48M PCM CLK GEN EN 11 0 sets PCM_CLK and PCM_SYNC generation via DDS from internal 4 MHz clock. 1 sets PCM_CLK and PCM_SYNC generation via DDS from internal 48 MHz clock. LONG LENGTH SYNC EN 12 0 sets PCM_SYNC length to 8 PCM_CLK cycles and 1 sets length to 16 PCM_CLK cycles. Only applies for long frame sync and with 48M_PCM_CLK_GEN_EN set to 1. - [20:16] Set to 0b00000. MASTER CLK RATE [22:21] Selects 128 (0b01), 256 (0b00), 512 (0b10) kHz PCM_CLK frequency when master and 48M_PCM_CLK_GEN_EN (bit 11) is low. ACTIVE SLOT [26:23] Default is 0001. Ignored by firmaware SAMPLE FORMAT [28:27] Selects between 13 (0b00), 16 (0b01), 8 (0b10) bit sample with 16 cycle slot duration 8 (0b11) bit sample 8 cycle slot duration. Table 14: PSKEY_PCM_CONFIG32 description Silicon Labs Page 39 of 51 Name Bit position Description CNT LIMIT [12:0] Sets PCM_CLK counter limit CNT RATE [23:16] Sets PCM_CLK count rate SYNC LIMIT [31:24] Sets PCM_SYNC division relative to PCM_CLK Table 15: PSKEY_PCM_LOW_JITTER_CONFIG Description Silicon Labs Page 40 of 51 10 I/O Parallel Ports Six lines of programmable bidirectional input/outputs (I/O) are provided. All the PIO lines are power from VDD. PIO lines can be configured through software to have either weak or strong pull-ups or pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. WT11u has a general purpose analogue interface pin AIO[1]. This is used to access internal circuitry and control signals. It may be configured to provide additional functionality. Auxiliary functions available via AIO[1] include an 8-bit ADC and an 8-bit DAC. Typically the ADC is used for battery voltage measurement. Signals selectable at this pin include the band gap reference voltage and a variety of clock signals: 48, 24, 16, 8MHz and the XTAL clock frequency. When used with analogue signals, the voltage range is constrained by the analogue supply voltage internally to the module (1.8V). When configured to drive out digital level signals (e.g., clocks), the output voltage level is determined by VDD. 10.1 PIO Defaults Silicon Labs cannot guarantee that these terminal functions remain the same. Refer to the software release note for the implementation of these PIO lines, as they are firmware build-specific. Silicon Labs Page 41 of 51 11 Reset WT11u may be reset from several sources: RESET pin, power on reset, a UART break character or via software configured watchdog timer. The RESET pin is an active high reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESET be applied for a period greater than 5ms. The power on reset occurs when the VDD_CORE supply internally to the module falls below typically 1.5V and is released when VDD_CORE rises above typically 1.6V. At reset the digital I/O pins are set to inputs for bidirectional pins and outputs are tri-state. WT11u has an internal power on reset circuit which holds the module in reset until all the supply voltages have stabilized. The reset pin must be either floating or connected to high impedance during power on in order for the power on reset circuit to work properly. If the reset pin is not connected to high impedance during power on, then one must ensure that the reset is kept active until all the supply voltages have stabilized to prevent the flash memory getting corrupted. Silicon Labs Page 42 of 51 11.1 Pin States on Reset Pad name State PIO[7:2] Input, weak pull-down PCM_OUT 3-state, weak pull-down PCM_IN Input, weak pull-down PCM_SYNC Input, weak pull-down PCM_CLK Input, weak pull-down UART_TX 3-state, weak pull-up UART_RX Input, weak pull-down UART_RTS 3-state, weak pull-up UART_CTS Input, weak pull-down USB+ Input, weak pull-down USB- Input, weak pull-down SPI_CSB Input, weak pull-down SPI_CLK Input, weak pull-down SPI_MOSI Input, weak pull-down SPI_MISO 3-state, weak pull-down AIO[1] Output, driving low Table 16: Pin States on Reset Silicon Labs Page 43 of 51 12 Package Marking Figure 32: WT11u-A package marking Line 1 Marking: Line 2 Marking: WT11u-A Model: WT11u-A Line 3 Marking: FCC ID: QOQWT11U Line 4 Marking: IC ID: 5123A-WT11U Line 5 Marking: Japan ID: 209 - J00232 YY Last digit of Year (e.g.: 16 for 2016) WW Work Week (01-53) R Major Revision (fixed character 1-9, A-Z, assigned by Silicon Labs) M Contract Manufacturer Site assigned by Silicon Labs TT Unique Batch ID assigned by CM (2 characters A-Z) Line 6 Marking: Line 7 Marking: Module Name YYWWRMTT website www.silabs.com Silicon Labs Page 44 of 51 Figure 33: WT11u-E package marking Line 1 Marking: Line 2 Marking: WT11u-A Model: WT11u-A Line 3 Marking: FCC ID: QOQWT11U Line 4 Marking: IC ID : 5123A-WT11U Line 5 Marking: Japan ID: 209 - J00232 YY Last digit of Year (e.g.: 16 for 2016) WW Work Week (01-53) R Major Revision (fixed character 1-9, A-Z, assigned by Silicon Labs) M Contract Manufacturer Site assigned by Silicon Labs TT Unique Batch ID assigned by CM (2 characters A-Z) Line 6 Marking: Line 7 Marking: Module Name YYWWRMTT website www.silabs.com Silicon Labs Page 45 of 51 13 Certifications 13.1 Bluetooth The WT11u is Bluetooth qualified and the declaration ID is B016141 (QDID 22298) 13.2 FCC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the user's authority to operate the equipment. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). OEM Responsibilities to comply with FCC Regulations The WT11u Module has been certified for integration into products only by OEM integrators under the following condition: * The antenna(s) must be installed such that a minimum separation distance of 42 mm is maintained between the radiator (antenna) and all persons at all times. * The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Note: In the event that this condition cannot be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The WT11u Module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: "Contains Transmitter Module FCC ID: QOQWT11u" or "Contains FCC ID: QOQWT11u" The OEM integrator must not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. Silicon Labs Page 46 of 51 13.3 ISEDC This radio transmitter (IC: 5123A-WT11U) has been approved by Industry Canada to operate with the embedded chip antenna. Other antenna types are strictly prohibited for use with this device. This device complies with Industry Canada's license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. WT11u meets the given requirements when the minimum separation distance to human body 40 mm. RF exposure or SAR evaluation is not required when the separation distance is 40 mm or more. If the separation distance is less than 40 mm the OEM integrator is responsible for evaluating the SAR. OEM Responsibilities to comply with IC Regulations The WT11u Module has been certified for integration into products only by OEM integrators under the following conditions: * The antenna(s) must be installed such that a minimum separation distance of 40 mm is maintained between the radiator (antenna) and all persons at all times. * The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Note: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the IC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC authorization. End Product Labeling The WT11u module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: "Contains Transmitter Module IC: 5123A-WT11u" or "Contains IC: 5123A-WT11u" The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 13.3.1 ISEDC (Francais) Cet emetteur radio (IC : 5123A-WT11u) a recu l'approbation d'Industrie Canada pour une exploitation avec l'antenne puce incorporee. Il est strictement interdit d'utiliser d'autres types d'antenne avec cet appareil. Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes: 1. L'appareil ne doit pas produire de brouillage; et Silicon Labs Page 47 of 51 2. L'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible de provoquer un fonctionnement non desire de l'appareil. Declaration relative a l'exposition aux radiofrequences (RF) Les limites applicables a l'exemption de l'evaluation courante du DAS sont enoncees dans le CNR 102, 5e edition. Le module Bluetooth WT11u repond aux exigences donnees quand la distance de separation minimum par rapport au corps humain est de 40 mm. L'evaluation de l'exposition aux RF ou du DAS n'est pas requise quand la distance de separation est de 40 mm ou plus. Si la distance de separation est inferieure a 40 mm, il incombe a l'integrateur FEO d'evaluer le DAS. Responsabilites du FEO ayant trait a la conformite avec les reglements IC Le Module Bluetooth WT11u a ete certifie pour une integration dans des produits uniquement par les integrateurs FEO dans les conditions suivantes: * La ou les antennes doivent etre installees de telle facon qu'une distance de separation minimum de 40 mm soit maintenue entre le radiateur (antenne) et toute personne a tout moment. * Le module emetteur ne doit pas etre installe au meme endroit ou fonctionner conjointement avec toute autre antenne ou emetteur. Des lors que les deux conditions ci-dessus sont respectees, aucun test supplementaire de l'emetteur n'est obligatoire. Cependant, il incombe toujours a l'integrateur FEO de tester la conformite de son produit final visa-vis de toute exigence supplementaire requise avec ce module installe (par exemple, emissions de dispositifs numeriques, exigences relatives aux materiels peripheriques PC, etc). Note: S'il s'avere que ces conditions ne peuvent etre respectees (pour certaines configurations ou la colocation avec un autre emetteur), alors l'autorisation IC n'est plus consideree comme valide et l'identifiant IC ne peut plus etre employe sur le produit final. Dans ces circonstances, l'integrateur FEO aura la responsabilite de reevaluer le produit final (y compris l'emetteur) et d'obtenir une autorisation IC distincte. Etiquetage du produit final L'etiquette du Module WT11u porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module est installe a l'interieur d'un autre appareil, alors l'exterieur de l'appareil dans lequel le module est installe doit aussi porter une etiquette faisant reference au module qu'il contient. Dans ce cas, une etiquette comportant les informations suivantes doit etre apposee sur une partie visible du produit final. "Contient le module emetteur IC: 5123A-WT11U" ou "Contient IC : 5123A-WT11U" L'integrateur FEO doit etre conscient de ne pas fournir d'informations a l'utilisateur final permettant d'installer ou de retirer ce module RF ou de changer les parametres lies aux RF dans le mode d'emploi du produit final. Silicon Labs Page 48 of 51 13.4 CE The Declaration of Compliance and the test documentation can be consulted in www.silabs.com. Please note that every application using the WT11U will need to perform the radio EMC tests on the end product according to EN 301 489-17. RF exposure requirements must be verified in an end product assembly. Test documentation and software for the EN 300 328 radiated spurious emissions testing can be requested from the Silicon Labs support. 13.5 MIC Japan The WT11u module in certified for Japan. Certification number: 209-J00232 Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Translation: "This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law." Silicon Labs Page 49 of 51 13.6 Qualified Antenna Types for WT11u-E This device has been designed to operate with a standard 2.14 dBi dipole antenna. Any antenna of a different type or with a gain higher than 2.14 dBi is strictly prohibited for use with this device. Using an antenna of a different type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. The required antenna impedance is 50 . Antenna type Maximum gain Dipole 2.14 dBi Table 17: Qualified Antenna Types for WT11u-E To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (EIRP) is not more than that permitted for successful communication. Any standard 2.14 dBi dipole antenna can be used without an additional application to FCC. 13.7 Moisture Sensitivity Level (MSL) Moisture sensitivity level (MSL) of this product is 3. For the handling instructions please refer to JEDEC J-STD020 and JEDEC J-STD-033. If baking is required, devices may be baked for 12 hours at 125C +/-5C for high temperature device containers. Silicon Labs Page 50 of 51 Simplicity Studio One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! IoT Portfolio www.silabs.com/IoT SW/HW Quality Support and Community www.silabs.com/simplicity www.silabs.com/quality community.silabs.com Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. 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