www.ti.com SN74ALVCH162721 3.3-V 20-BIT FLIP-FLOP WITH 3-STATE OUTPUTS SCES055G - DECEMBER 1995 - REVISED SEPTEMBER 2004 FEATURES * * * * * * * Member of the Texas Instruments WidebusTM Family EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process Output Ports Have Equivalent 26- Series Resistors, So No External Resistors Are Required ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JESD 17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages NOTE: For tape-and-reel order entry, the DGGR package is abbreviated to GR. DESCRIPTION This 20-bit flip-flop is designed for low-voltage 1.65-V to 3.6-V VCC operation. The 20 flip-flops of the SN74ALVCH162721 are edge-triggered D-type flip-flops with qualified clock storage. On the positive transition of the clock (CLK) input, the device provides true data at the Q outputs if the clock-enable (CLKEN) input is low. If CLKEN is high, no data is stored. DGG OR DL PACKAGE (TOP VIEW) OE Q1 Q2 GND Q3 Q4 VCC Q5 Q6 Q7 GND Q8 Q9 Q10 Q11 Q12 Q13 GND Q14 Q15 Q16 VCC Q17 Q18 GND Q19 Q20 NC 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 CLK D1 D2 GND D3 D4 VCC D5 D6 D7 GND D8 D9 D10 D11 D12 D13 GND D14 D15 D16 VCC D17 D18 GND D19 D20 CLKEN A buffered output-enable (OE) input places the 20 NC - No internal connection outputs in either a normal logic state (high or low level) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The outputs, which are designed to sink up to 12 mA, include equivalent 26- resistors to reduce overshoot and undershoot. The SN74ALVCH162721 is characterized for operation from -40C to 85C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, EPIC are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1995-2004, Texas Instruments Incorporated SN74ALVCH162721 3.3-V 20-BIT FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES055G - DECEMBER 1995 - REVISED SEPTEMBER 2004 FUNCTION TABLE (each flip-flop) INPUTS D OUTPUT Q X X Q0 H H L L L L L L or H X Q0 H X X X Z OE CLKEN CLK L H L L L LOGIC DIAGRAM (POSITIVE LOGIC) 1 OE 56 CLK 29 CLKEN CE C1 D1 55 1D To 19 Other Channels 2 2 Q1 SN74ALVCH162721 3.3-V 20-BIT FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES055G - DECEMBER 1995 - REVISED SEPTEMBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Output voltage range (2) (3) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current Continuous current through each VCC or GND JA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) V -50 mA -50 mA 50 mA 100 mA DGG package 81 C/W DL package 74 C/W 150 C -65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V, maximum. The package thermal impedance is calculated in accordance with JESD 51. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage V 0.65 x VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 x VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V IOH High-level output current VCC = 1.65 V -2 VCC = 2.3 V -6 VCC = 2.7 V -8 VCC = 3 V IOL Low-level output current -12 VCC = 1.65 V 2 VCC = 2.3 V 6 VCC = 2.7 V 8 VCC = 3 V (1) Operating free-air temperature mA 12 t/v Input transition rise or fall rate TA mA -40 10 ns/V 85 C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74ALVCH162721 3.3-V 20-BIT FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES055G - DECEMBER 1995 - REVISED SEPTEMBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 A VOH 1.65 V to 3.6 V 1.65 V 1.2 IOH = -4 mA 2.3 V 1.9 2.3 V 1.7 3V 2.4 IOH = -8 mA 2.7 V 2 IOH = -12 mA 3V 2 IOL = 100 A II II(hold) V 1.65 V to 3.6 V 0.2 IOL = 2 mA 1.65 V 0.45 IOL = 4 mA 2.3 V 0.4 2.3 V 0.55 3V 0.55 IOL = 8 mA 2.7 V 0.6 IOL = 12 mA 3V 0.8 IOL = 6 mA 5 VI = VCC or GND 3.6 V VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 3V -75 VI = 2 V UNIT VCC - 0.2 IOH = -2 mA IOH = -6 mA VOL MIN TYP (1) MAX VCC V A A VI = 0 to 3.6 V (2) 3.6 V 500 IOZ VO = VCC or GND 3.6 V 10 A ICC VI = VCC or GND, IO = 0 3.6 V 40 A ICC One input at VCC - 0.6 V, Other inputs at VCC or GND 750 A Ci VI = VCC or GND 3.3 V 3.5 pF Co VO = VCC or GND 3.3 V 7 pF (1) (2) 3 V to 3.6 V All typical values are at VCC = 3.3 V, TA = 25C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3) VCC = 1.8 V MIN fclock tw th Hold time (1) 4 MAX VCC = 2.7 V MIN 150 MAX VCC = 3.3 V 0.3 V MIN 150 3.3 3.3 3.3 Data before CLK (1) 4 3.6 3.1 CLKEN before CLK (1) 3.4 3.1 2.7 Data after CLK (1) 0 0 0 CLKEN after CLK (1) 0 0 0 This information was not available at the time of publication. UNIT MAX 150 (1) Pulse duration, CLK high or low Setup time MIN (1) Clock frequency tsu MAX VCC = 2.5 V 0.2 V MHz ns ns ns SN74ALVCH162721 3.3-V 20-BIT FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES055G - DECEMBER 1995 - REVISED SEPTEMBER 2004 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3) PARAMETER FROM (INPUT) TO (OUTPUT) (1) MIN TYP (1) fmax tpd VCC = 2.5 V 0.2 V VCC = 1.8 V CLK MIN MAX MIN 150 (1) 1 6.7 1 1 ten OE Q tdis OE Q (1) MAX 150 Q (1) VCC = 3.3 V 0.3 V VCC = 2.7 V MIN UNIT MAX 150 MHz 6.2 1 5.3 ns 7.2 7 1 5.8 ns 6.3 5.4 1 5 ns This information was not available at the time of publication. OPERATING CHARACTERISTICS TA = 25C PARAMETER Cpd (1) Power dissipation capacitance TEST CONDITIONS Outputs enabled Outputs disabled CL = 50 pF, f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 55 59 (1) 46 49 UNIT pF This information was not available at the time of publication. 5 SN74ALVCH162721 3.3-V 20-BIT FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES055G - DECEMBER 1995 - REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 1.8 V 2 x VCC S1 1 k From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 1 k S1 Open 2 x VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 x VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH - 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2 ns, tf 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 SN74ALVCH162721 3.3-V 20-BIT FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES055G - DECEMBER 1995 - REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V 0.2 V 2 x VCC S1 500 From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 500 S1 Open 2 x VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 x VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH - 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2 ns, tf 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 2. Load Circuit and Voltage Waveforms 7 SN74ALVCH162721 3.3-V 20-BIT FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES055G - DECEMBER 1995 - REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 V AND 3.3 V 0.3 V 6V S1 500 From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 50 pF (see Note A) 500 S1 Open 6V GND LOAD CIRCUIT tw 2.7 V 2.7 V Timing Input 1.5 V 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 1.5 V 1.5 V 0V tPLH 1.5 V 1.5 V 0V tPLZ 3V 1.5 V VOL + 0.3 V tPZH 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 2.7 V 1.5 V Output Waveform 1 S1 at 6 V (see Note B) tPHL VOH Output Output Control (low-level enabling) tPZL 2.7 V Input VOLTAGE WAVEFORMS PULSE DURATION th 2.7 V Data Input 1.5 V 0V 0V tsu 1.5 V Input Output Waveform 2 S1 at GND (see Note B) VOL tPHZ VOH 1.5 V VOH - 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms 8 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ALVCH162721DLG4 ACTIVE SSOP DL 56 74ALVCH162721DLRG4 ACTIVE SSOP DL 74ALVCH162721GRE4 ACTIVE TSSOP 74ALVCH162721GRG4 ACTIVE SN74ALVCH162721DGGR 20 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OBSOLETE TSSOP DGG 56 SN74ALVCH162721DL ACTIVE SSOP DL 56 SN74ALVCH162721DLR ACTIVE SSOP DL SN74ALVCH162721GR ACTIVE TSSOP DGG TBD Call TI Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ALVCH162721DLR SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 SN74ALVCH162721GR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVCH162721DLR SSOP DL 56 1000 346.0 346.0 49.0 SN74ALVCH162721GR TSSOP DGG 56 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). 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