8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
1
Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
BLOCK DIAGRAM PIN ASSIGNMENT
ICS8523I-03
20-Lead TSSOP
6.5mm x 4.4mm x 0.92mm body package
G Package
Top View
GND
CLK_EN
CLK_SEL
CLK0
nCLK0
CLK1
nCLK1
nc
nc
VDD
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Q0
nQ0
VDDO
Q1
nQ1
Q2
nQ2
VDDO
Q3
nQ3
GENERAL DESCRIPTION
The ICS8523I-03 is a low skew, high perfor-
mance 1-to-4 Differential-to-LVHSTL fanout buffer
and a member of the HiPerClockS family of High
Performance Clock Solutions from ICS. The
ICS8523I-03 has two selectable clock inputs.
The input pairs can accept most standard differential input
levels. The clock enable is internally synchronized to
eliminate runt pulses on the outputs during asynchronous
assertion/deassertion of the clock enable pin.
Guaranteed output and part-to-part skew characteristics
make the ICS8523I-03 ideal for those applications demand-
ing well defined performance and repeatability.
FEATURES
4 differential LVHSTL compatible outputs
Selectable differential CLK0, nCLK0 and CLK1, nCLK1
clock inputs
Clock input pairs can accept the following differential
input levels: LVDS, LVPECL, LVHSTL, SSTL, HCSL
Maximum output frequency: 650MHz
Translates any single-ended input signal to LVHSTL
levels with resistor bias on nCLK input
Output skew: 50ps (maximum)
Part-to-part skew: 400ps (maximum)
Propagation delay: 1.2ns (typical)
VOH = 1V (maximum)
3.3V core, 1.8V output operating supply
Lead-Free package available
-40°C to 85°C ambient operating temperature
HiPerClockS
ICS
CLK0
nCLK0
CLK1
nCLK1
Q0
nQ0
Q1
nQ1
Q2
nQ2
Q3
nQ3
0
1
CLK_EN
CLK_SEL
D
Q
LE
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
2
Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
TABLE 2. PIN CHARACTERISTICS
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8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
3
Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 3A. CONTROL INPUT FUNCTION TABLE
TABLE 3B. CLOCK INPUT FUNCTION TABLE
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FIGURE 1. CLK_EN TIMING DIAGRAM
Enabled
Disabled
nCLK0, nCLK1
CLK0, CLK1
CLK_EN
nQ0:nQ3
Q0:Q3
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01 1KLCn,1KLCWOL;delbasiDH
GIH;delbasiD
10 0KLCn,0KLCdelbanEdelbanE
11 1KLCn,1KLCdelbanEdelbanE
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.B3elbaTni
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
4
Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
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I
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I
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NI
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DD
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HI
.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V
CC 4.6V
Inputs, VI-0.5V to VCC + 0.5V
Outputs, IO
Continuous Current 50mA
Surge Current 100mA
Package Thermal Impedance, θ
JA 73.2°C/W (0 lfpm)
Storage Temperature, T
STG -65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions be-
yond those listed in the
DC Characteristics
or
AC Character-
istics
is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
5
Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 5. AC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
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TABLE 4D. LVHSTL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
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8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
6
Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
PART-TO-PART SKEW
PROPAGATION DELAY OUTPUT RISE/FALL TIME
Clock
Outputs 20%
80%
80%
20%
t
R
t
F
V
OD
t
sk(o)
nQx
Qx
nQy
Qy
DIFFERENTIAL INPUT LEVEL
OUTPUT SKEW
3.3V CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT
SCOPE
LVHSTL
Qx
nQx
V
CMR
Cross Points
V
PP
GND
CLK0,
CLK1
nCLK0,
nCLK1
VDD
t
sk(pp)
nQx
Qx
nQy
Qy
PART 1
PART 2
nCLK0,
nCLK1
CLK0,
CLK1
nQ0:nQ3
Q0:Q3
tPD
VDD
GND = 0V
3.3V ± 5%
VDDO
1.8V ± 0.2V
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
Pulse Width
tPERIOD
tPW
tPERIOD
odc =
nQ0:nQ3
Q0:Q3
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
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Integrated
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ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
APPLICATION INFORMATION
Figure 2
shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VDD/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio
FIGURE 2. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
of R1 and R2 might need to be adjusted to position the V_REF in
the center of the input voltage swing. For example, if the input
clock swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V
and R2/R1 = 0.609.
V_REF
R1
1K
C1
0.1u R2
1K
Single Ended Clock Input
CLKx
nCLKx
VDD
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
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Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
FIGURE 3C. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY
3.3V LVPECL DRIVER
FIGURE 3B. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY
3.3V LVPECL DRIVER
FIGURE 3D. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY
3.3V LVDS DRIVER
3.3V
R1
50
R3
50
Zo = 50 Ohm
LVPECL
Zo = 50 Ohm
HiPerClockS
CLK
nCLK
3.3V
Input
R2
50
Zo = 50 Ohm
Input
HiPerClockS
CLK
nCLK
3.3V
R3
125
R2
84
Zo = 50 Ohm
3.3V
R4
125
LVPECL
R1
84
3.3V
DIFFERENTIAL CLOCK INPUT INTERFACE
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL
and other differential signals. Both VSWING and VOH must meet the
VPP and VCMR input requirements. Figures 3A to 3E show inter-
face examples for the HiPerClockS CLK/nCLK input driven by
the most common driver types. The input interfaces suggested
FIGURE 3A. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY
ICS HIPERCLOCKS LVHSTL DRIVER
here are examples only. Please consult with the vendor of the
driver component to confirm the driver termination requirements.
For example in
Figure 4A,
the input termination applies for ICS
HiPerClockS LVHSTL drivers. If you are using an LVHSTL driver
from another vendor, use their termination recommendation.
1.8V
R2
50
Input
LVHSTL Driver
ICS
HiPerClockS
R1
50
LVHSTL
3.3V
Zo = 50 Ohm
Zo = 50 Ohm
HiPerClockS
CLK
nCLK
FIGURE 3E. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY
3.3V LVPECL DRIVER WITH AC COUPLE
Zo = 50 Ohm
R3
125
HiPerClockS
CLK
nCLK
3.3V
R5
100 - 200
3.3V
R2
84
3.3V
R6
100 - 200
Input
R5,R6 locate near the driver pin.
Zo = 50 Ohm
R1
84
R4
125
C2
LVPECL C1
Zo = 50 Ohm
R1
100
3.3V
LVDS_Driv er
Zo = 50 Ohm
Receiv er
CLK
nCLK
3.3V
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
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Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
Zo = 50
+
-
C2
0.1u
Zo = 50
C1
0.1u
Zo = 50
R5
50
R2
50
R8
50
+
-
R1
50
R3
50
R12
1K
+
-
R4
50
R9
50
Zo = 50 Ohm
3.3V
Zo = 50 Ohm
R7
50
R10
50
Zo = 50
R6
50
3.3V
+
-
1.8V
Zo = 50
LVHSTL Driver
C3
0.1u
1.8V
1.8V
Zo = 50
Zo = 50
U1
ICS8523-03
1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
20
19
18
17
GND
CLK_EN
CLK_SEL
CLK0
nCLK0
CLK1
nCLK1
NC
NC
VDD nQ3
Q3
VDDO
nQ2
Q2
nQ1
Q0
nQ0
VDDO
Q1
1.8V
Zo = 50
R11
1K
SCHEMATIC EXAMPLE
This application note provides general design guide using
ICS8523I-03 LVHSTL buffer. Figure 3 shows a schematic ex-
ample of the ICS8523I-03 LVHSTL Clock buffer. In this example,
FIGURE 4. EXAMPLE ICS8523I-03 LVHSTL CLOCK OUTPUT BUFFER SCHEMATIC
the input is driven by an LVHSTL driver. CLK_EN is set at logic
low to select CLK0/nCLK0 input.
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
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Integrated
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Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8523I-03.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8523I-03 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VDD_MAX * IDD_MAX = 3.465V * 55mA = 190mW
Power (outputs)MAX = 32.8mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 32.8mW = 131mW
Total Power_MAX (3.465V, with all outputs switching) = 190mW + 131mW = 321mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA
must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.321W * 66.6°C/W = 106.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθ
θθ
θJA by Velocity (Linear Feet per Minute)
0 200 500
Single-Layer PCB, JEDEC Standard Test Boards 114.5°C/W 98.0°C/W 88.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 73.2°C/W 66.6°C/W 63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE θθ
θθ
θJA FOR 20-PIN TSSOP, FORCED CONVECTION
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
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ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVHSTL output driver circuit and termination are shown in
Figure 5.
To calculate worst case power dissipation into the load, use the following equations which assume a 50 load.
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = (V
OH_MAX
/R
L
) * (V
DDO_MAX
- V
OH_MAX
)
Pd_L = (V
OL_MAX
/R
L
) * (V
DDO_MAX
- V
OL_MAX
)
Pd_H = (1V/50) * (2V - 1V) = 20mW
Pd_L = (0.4V/50) * (2V - 0.4V) = 12.8mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 32.8mW
FIGURE 5. LVHSTL DRIVER CIRCUIT AND TERMINATION
VDDO
VOUT
RL
50
Q1
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
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ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
RELIABILITY INFORMATION
TRANSISTOR COUNT
The transistor count for ICS8523I-03 is: 472
TABLE 7. θJAVS. AIR FLOW TABLE FOR 20 LEAD TSSOP
θθ
θθ
θJA by Velocity (Linear Feet per Minute)
0 200 500
Single-Layer PCB, JEDEC Standard Test Boards 114.5°C/W 98.0°C/W 88.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 73.2°C/W 66.6°C/W 63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
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ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
PACKAGE OUTLINE - G SUFFIX FOR 20 LEAD TSSOP
TABLE 8. PACKAGE DIMENSIONS
Reference Document: JEDEC Publication 95, MS-153
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2A08.050.1
b91.003.0
c90.002.0
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8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
14
Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 9. ORDERING INFORMATION
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use or for infringement
of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional
processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices
or critical medical instruments.
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The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
8523AGI-03 www.icst.com/products/hiperclocks.html REV. A OCTOBER 5, 2004
15
Integrated
Circuit
Systems, Inc.
ICS8523I-03
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
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