RoHS Recast Compliant Industrial Micro SD 3.0 Specifications March 5th, 2013 Version 1.1 Apacer Technology Inc. th 4 Fl., 75 Hsin Tai Wu Rd., Sec.1, Xizhi, New Taipei City, Taiwan 221 Tel: +886-2-2698-2888 www.apacer.com Fax: +886-2-2689-2889 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM FEATURES: Fully compatible with SD Card Association specifications - Operating frequency: up to 100 MHz Intelligent endurance design - Part 1, Physical Layer Specification, Version 3.1 Final Part 3, Security Specification, Version 3.0 Final Capacity range - - Performance* - Sustained Read: Up to 19 MB/sec Sustained Write: Up to 12 MB/sec SD-protocol compatible Supports SD SPI mode Backward compatible with 2.0 NAND Flash Type: MLC Wear-leveling Flash bad-block management Built in write protect Temperature ranges 4, 8, 16, 32 GB Built-in advanced ECC algorithm Operating temperature: -25 ~ +85C Storage temperature: -40C ~ +85C Operating voltage: 2.7V ~ 3.6V Power consumption* - Operating: 47 mA Standby: 150 uA Physical dimension : 15mm(L) x 11mm(W) x 1mm(H) RoHS Recast Compliant (2011/65/EU) *Vary from capacities. Performance values presented here are typical and may vary depending on settings and platforms. 1 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM TABLE OF CONTENTS 1. General Description ....................................................................................................... 3 1.1 PRODUCT FUNCTION BLOCK .................................................................................................................. 3 1.2 FUNCTIONAL DESCRIPTION ..................................................................................................................... 3 1.2.1 Flash Management ....................................................................................................................... 4 1.2.2 Powerful ECC Algorithms ............................................................................................................. 4 1.2.3 Power Management...................................................................................................................... 4 2. Electrical characteristics............................................................................................. 5 2.1 CARD ARCHITECTURE ............................................................................................................................ 5 2.2 PIN ASSIGNMENT ................................................................................................................................... 5 2.3 CAPACITY SPECIFICATION ...................................................................................................................... 6 2.4 PERFORMANCE ...................................................................................................................................... 6 2.5 ELECTRICAL .......................................................................................................................................... 6 3. Physical Characteristics............................................................................................... 7 3.1 PHYSICAL DIMENSION ............................................................................................................................ 7 3.2 ENVIRONMENTAL SPECIFICATIONS.......................................................................................................... 9 4. AC Characteristics ........................................................................................................11 4.1MICRO SD INTERFACE TIMING (DEFAULT) ............................................................................................. 11 4.2 MICRO SD INTERFACE TIMING (HIGH SPEED MODE).............................................................................. 12 4.3 SD INTERFACE TIMING (SDR12, SDR25 AND SDR50 MODES) INPUT ................................................... 13 4.3.1 SDR50 Input Timing ................................................................................................................... 13 4.3.2 Output ......................................................................................................................................... 14 4.3.3 SD Interface Timing (DDR50 Mode)........................................................................................... 14 4.3.4 Bus Timings - Parameters Values (DDR50 Mode) .................................................................... 15 5. Product Ordering Information ...................................................................................16 5.1 PRODUCT CODE DESIGNATIONS ........................................................................................................... 16 5.2 VALID COMBINATIONS ......................................................................................................................... 17 2 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 1. General Description As the demand of reliable and high-performance data storage in a small form factor increases, Apacer's Micro SD card 3.0 is designed specifically for multiple applications by offering high endurance, reliability, and agility, where extreme flexibility, endurance, data integrity, and exceptionally transmission are required. The Micro SD 3.0 card fully complies with SD Card Association standard. The Command List is compatible with [Part 1 Physical Layer Specification Ver3.1 Final] definitions, while the Card Capacity of Non-secure Area, Secure Area supports [Part 3 Security Specification Ver3.0 Final] Specifications. The card allows selection of either SD or SPI mode for compatibility in data communication. To provide higher transfer rate, the card can extend to 100MHz clock frequency. The card also comes with endurance features for data error detection and correction, write protection, and password protection. 1.1 Product Function Block The Micro SD contains a card controller and a memory core for the SD standard interface. 1.2 Functional description The Micro SD device contains a high level, intelligent flash management that provides many capabilities including: High performance flash memory control ECC algorithms Wear leveling Power management 3 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 1.2.1 Flash Management The SD controller contains logic/physical flash block mapping and bad block management system. It will manage all flash block including user data space and spare block. The Micro SD also contains a sophisticated defect and error management system. It does a read after write under margin conditions to verify that the data is written correctly (except in the case of write preerased sectors). In case that a bit is found to be defective, the SD will replace this bad bit with a spare bit within the sector header. If necessary, the Micro SD will even replace the entire sector with a spare sector. This is completely transparent to the master (host device) and does not consume any user data space. 1.2.2 Powerful ECC Algorithms The powerful ECC algorithms will enhance flash block use rate and whole device life. The SD controller supports up to 68bits ECC circuits to protect data transfer. 1.2.3 Power Management A power saving feature of the Micro SD is automatic entrance and exit from sleep mode. Upon completion of an operation, the SD will enter the sleep mode to conserve power if no further commands are received within X seconds, where X is programmable by software. The master does not have to take any action for this to occur. The SD is in sleep mode except when the host is accessing it, thus conserving power. Any command issued by the master to the Micro SD will cause it to exit sleep mode and response to the master. 4 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 2. Electrical characteristics 2.1 Card Architecture 2.2 Pin Assignment SD Mode Pin Name 1 2 DAT2 CD/DAT3 2 SPI Mode Description Name Description Data line[bit 2] Reserved Card Detect/Data line [bit 3] CS Chip select 3 CMD Command/Response DI Data in 4 VDD Supply voltage VDD Supply voltage 5 CLK Clock SCLK Clock 6 VSS Supply voltage ground VSS Supply voltage ground 7 DAT0 Data line[bit 0] DO Data out 8 DAT1 Data line[bit 1] Reserved 5 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 2.3 Capacity Specification The following table shows the specific capacity for the SD 3.0 card. Capacity Total Bytes 4 GB 3,972,005,888 8 GB 7,960,788,992 16 GB 15,997,075,456 32 GB 32,078,036,992 Note: total bytes are viewed under Windows operating system and were measured by SD format too. 2.4 Performance Performances of the SD 3.0 card are shown in the table below. Capacity 4 GB 8 GB 16 GB 32 GB Read (MB/s) 19 19 19 19 Write (MB/s) 12 12 12 12 Modes Note: results may vary depending on settings and platforms. 2.5 Electrical Operating Voltages Symbol Parameter Min. Max. Unit VDD Power Supply Voltage 2.7 3.6 V Power consumption Capacity 4 GB 8 GB 16 GB 32 GB Operating (mA) 40 42 45 47 Standby (uA) 100 100 100 150 Modes Note: results may vary depending on settings and platforms. 6 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 3. Physical Characteristics 3.1 Physical Dimension 7 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 8 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 3.2 Environmental Specifications Climatic Testing Test Item Test Condition (Gold Series) DUT State Temperature Duration Storage 85 500 Hours Operation 85 168 Hours Storage - 40 300 Hours Operation - 25 168 Hours High Temperature Low Temperature High Temperature & High Humidity Storage 40 95% 500 Hours Operation 40 95% 4 Hour Thermal Cycling Storage* - 40 ~ 85 30min hold each 20 Cycles Durability Testing Test Item Descriptions Insertion/Removal 10,000 cycles 9 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM Bending 10nt/Stimes for 6 faces and 4 corners (each drop was performed 3 times, total of 30 drops) Contact discharge: HCP & VCP Air discharge: ALL - VSS (), Electrostatic Discharge ALL - VCC () VCC - VSS (), ALL - ALL () Units are non-operating. UVB bandwidth 313nm. Test irradiation 0.63 w/m/nm. Radiation cycle Radiation on for 4 hours at Ultraviolet Radiation temperature 60C, then radiation off for 4 hours at temperature 50C. Number of cycle 6 cycles. Duration of test 48 hours Drop Salt Water Spray Torque 1.Sm free fall, 10times 3+/-1%NaCl; 35 ; 24hrs 0.SN-m or 0.2Sdegree S time; 30sec/direction 10 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 4. AC Characteristics 4.1 Micro SD Interface Timing (Default) SYMBOL PARAMETER MIN MAX UNIT Note Clock CLK (All values are referred to min(VIH) and max(VIL) Ccard10 pF fPP Clock frequency Data Transfer Mode 0 25 MHz fOD Clock frequency Identification Mode 0(1)/100 400 kHz tWL Clock low time 10 - ns tWH Clock high time 10 - ns tTLH Clock rise time - 10 ns tTHL Clock fall time - 10 ns tISU Input setup time 5 - ns tIH Input hold time 5 - ns (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) 11 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM CL40 pF tODLY Output delay time 0 14 ns tODLY Output Delay time during Identification Mode 0 50 ns (1 card) CL40 pF (1 card) (1)0Hz means to stop the clock. The given minimum frequency range is for cases that requires the clock to be continued. 4.2 Micro SD Interface Timing (High Speed Mode) SYMBOL PARAMETER MIN MAX UNIT fPP Clock frequency data transfer mode 0 50 MHz tWL Clock low time 7 - ns tWH Clock high time 7 - ns tTLH Clock rise time - 3 ns tTHL Clock fall time - 3 ns tISU Input setup time 6 - ns tIH Input hold time 2 - ns tODLY Output delay time 14 ns tOH Output hold time 50 ns CL System capacitance of each line* 40 pF 2.5 Note Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) Ccard10 pF (1 card) CL40 pF (1 card) CL15 pF (1 card) CL15 pF (1 card) *In order to satisfy severe timing, host shall run on only one card 12 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 4.3 SD Interface Timing (SDR12, SDR25 and SDR50 Modes) Input Symbol Min Max Unit tCLK 4.80 - ns tCR, tCF - 0.2* tCLK ns Clock Duty 30 70 % Remark 208MHz (Max.), Between rising edge, VCT= 0.975V tCR, tCF < 2.00ns (max.) at 100MHz, CCARD=10pF 4.3.1 SDR50 Input Timing 13 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM Symbol Min Max Unit SDR50 Mode tIs tIH 3.00 0.80 - ns ns CCARD =10pF, VCT= 0.975V CCARD =5pF, VCT= 0.975V 4.3.2 Output Symbol Min Max Unit tODLY - 7.5 ns tODLY - 14 ns TOH 1.5 - ns Remark tCLK>=10.0ns, CL=30pF, using driver Type B, for SDR50 tCLK>=20.0ns, CL=40pF, using driver Type B, for SDR25 and SDR12, Hold time at the tODLY (min.), CL=15pF 4.3.3 SD Interface Timing (DDR50 Mode) Symbol Min Max Unit Remark tCLK 20 - ns tCR, tCF - 0.2* tCLK ns 50MHz (Max.), Between rising edge tCR, tCF < 4.00ns (max.) at 50MHz, CCARD=10pF Clock Duty 45 55 % 14 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 4.3.4 Bus Timings - Parameters Values (DDR50 Mode) Symbol tISU tIH tODLY TOH tISU2x tIH2x tODLY2x TOH2x Parameters Min Max Unit Input CMD (referenced to CLK rising edge) Input set-up time 6 ns Input hold time 0.8 - ns Output CMD (referenced to CLK rising edge) Output Delay time during 13.7 ns Data Transfer Mode Output Hold time 1.5 ns Remark Ccard10 pF (1 card) Ccard10 pF (1 card) CL30 pF (1 card) CL15 pF (1 card) Inputs DAT (referenced to CLK rising and falling edges) Input set-up time Ccard10 pF 3 ns (1 card) Input hold time Ccard10 pF 0.8 ns (1 card) Outputs DAT (referenced to CLK rising and falling edges) Output Delay time during CL25 pF 7.0 ns Data Transfer Mode (1 card) Output Hold time CL15 pF 1.5 ns (1 card) 15 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 5. Product Ordering Information 5.1 Product Code Designations A P - MSD x x x C X 4 X - 1 TM Flash Type: T: Toshiba MLC F/W CTL Solution 4: SDHC Configuration S one chip D two chip H four chip Temperature: C: Commercial Temperature I: Extended Temperature Capacities: 04G: 08G 16G 32G 4GB 8GB 16GB 32GB Model Name Apacer Product Code 16 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM 5.2 Valid Combinations 5.2.1 Commercial Temperature Capacity AP/N 4GB AP-MSD04GCS4P-1TM 8GB AP-MSD08GCS4P-1TM 16GB AP-MSD16GCD4P-1TM 32GB AP-MSD32GCH4P-1TM Note: Please consult with Apacer sales representatives for availabilities. 17 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM Revision History Revision Description Date 1.0 Official release 03/01/2013 1.1 Revised operating temperature 03/05/2013 18 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Industrial Micro SD 3.0 AP-MSDxxxCX4P-1TM Global Presence Taiwan (Headquarters) U.S.A. Japan Europe China India Apacer Technology Inc. th 4 Fl., 75 Hsin Tai Wu Rd., Sec.1 Hsichih, New Taipei City Taiwan 221 R.O.C. Tel: +886-2-2698-2888 Fax: +886-2-2698-2889 amtsales@apacer.com Apacer Memory America, Inc. 386 Fairview Way, Suite102, Milpitas, CA 95035 Tel: 1-408-518-8699 Fax: 1-408-935-9611 sa@apacerus.com Apacer Technology Corp. 5F, Matsura Bldg., Shiba, Minato-Ku Tokyo, 105-0014, Japan Tel: 81-3-5419-2668 Fax: 81-3-5419-0018 jpservices@apacer.com Apacer Technology B.V. Science Park Eindhoven 5051 5692 EB Son, The Netherlands Tel: 31-40-267-0000 Fax: 31-40-267-0000#6199 sales@apacer.nl Apacer Electronic (Shanghai) Co., Ltd 1301, No.251,Xiaomuqiao Road, Shanghai, 200032, China Tel: 86-21-5529-0222 Fax: 86-21-5206-6939 sales@apacer.com.cn Apacer Technologies Pvt Ltd, # 535, 1st Floor, 8th cross, JP Nagar 3rd Phase, Bangalore - 560078, India Tel: 91-80-4152-9061 sales_india@apacer.com 19 (c) 2013 Apacer Technology, Inc. Rev. 1.1 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Apacer: AP-MSD04GCS4P-1TM AP-MSD08GCS4P-1TM AP-MSD16GCD4P-1TM