VIN L1
VIN
VINA
EN
PS/SYNC
GND
L2
VOUT
FB
PGND
L1
1µH
C2
C3
2.5 V to 5.5V
VOUT
3.3V/1.5A
TPS63020
PG
Power Good
Output
C1
2X10µF
0.1µF
2X22µF
1MΩ
180kΩ
R1
R2
1MΩ
R3
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
HIGH EFFICIENCY SINGLE INDUCTOR BUCK-BOOST CONVERTER WITH 4-A SWITCHES
Check for Samples: TPS63020,TPS63021
1FEATURES • Smart Power Good Output
• Load Disconnect During Shutdown
2• Up to 96% Efficiency • Overtemperature Protection
• 3A Output Current at 3.3V in Step Down Mode
(VIN = 3.6V to 5.5V) • Overvoltage Protection
• More than 2A Output Current at 3.3V in Boost • Available in a 3 × 4-mm, QFN-14 Package
Mode (VIN > 2.5V) APPLICATIONS
• Automatic Transition Between Step Down and
Boost Mode • All Two-Cell and Three-Cell Alkaline, NiCd or
• Dynamic Input Current Limit NiMH or Single-Cell Li Battery Powered
Products
• Device Quiescent Current less than 50μA• Ultra Mobile PC's and Mobile Internet Devices
• Input Voltage Range: 1.8V to 5.5V • Digital Media Players
• Fixed and Adjustable Output Voltage Options
from 1.2V to 5.5V • DSC's and Camcorders
• Power Save Mode for Improved Efficiency at • Cellular Phones and Smartphones
Low Output Power • Personal Medical Products
• Forced Fixed Frequency Operation at 2.4MHz • Industrial Metering Equipment
and Synchronization Possible • High Power LED's
DESCRIPTION
The TPS6302x devices provide a power supply solution for products powered by either a two-cell or three-cell
alkaline, NiCd or NiMH battery, or a one-cell Li-Ion or Li-polymer battery. Output currents can go as high as 3A
while using a single-cell Li-Ion or Li-Polymer Battery, and discharge it down to 2.5V or lower. The buck-boost
converter is based on a fixed frequency, pulse-width-modulation (PWM) controller using synchronous rectification
to obtain maximum efficiency. At low load currents, the converter enters Power Save mode to maintain high
efficiency over a wide load current range. The Power Save mode can be disabled, forcing the converter to
operate at a fixed switching frequency. The maximum average current in the switches is limited to a typical value
of 4A. The output voltage is programmable using an external resistor divider, or is fixed internally on the chip.
The converter can be disabled to minimize battery drain. During shutdown, the load is disconnected from the
battery. The device is packaged in a 14-pin QFN PowerPAD™ package measuring 3 × 4 mm (DSJ).
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2010–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE DEVICE OPTIONS(1)
OUTPUT VOLTAGE
TAPACKAGE MARKING PACKAGE PART NUMBER(2)
DC/DC
Adjustable PS63020 TPS63020DSJ
–40°C to 85°C 14-Pin QFN
3.3 V PS63021 TPS63021DSJ
(1) Contact the factory to check availability of other fixed output voltage versions.
(2) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage range(2) VIN, VINA, L1, L2, VOUT, PS/SYNC, EN, FB, PG –0.3 7 V
Operating junction, TJ–40 150 °C
Temperature range Storage, Tstg –65 150 °C
Human Body Model - (HBM) 3 kV
ESD rating(3) Machine Model - (MM) 200 V
Charge Device Model - (CDM) 1.5 kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION TPS63020,
TPS63021
THERMAL METRIC(1) UNITS
DSJ
14 PINS
θJA Junction-to-ambient thermal resistance 41.8
θJC(TOP) Junction-to-case(top) thermal resistance 47
θJB Junction-to-board thermal resistance 17 °C/W
ψJT Junction-to-top characterization parameter 0.9
ψJB Junction-to-board characterization parameter 16.8
θJC(BOTTOM) Junction-to-case(bottom) thermal resistance 3.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT
Supply voltage at VIN, VINA 1.8 5.5 V
Operating free air temperature range, TA–40 85 °C
Operating junction temperature range, TJ–40 125 °C
ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
DC/DC STAGE
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage range 1.8 5.5 V
VIN Minimum input voltage for startup 0°C ≤TA≤85°C 1.5 1.8 1.9 V
Minimum input voltage for startup 1.5 1.8 2.0 V
VOUT TPS63020 output voltage range 1.2 5.5 V
Duty cycle in step down conversion 20%
VFB TPS63020 feedback voltage 495 500 505 mV
PS/SYNC = VIN
TPS63021 output voltage 3.267 3.3 3.333 V
VFB TPS63020 feedback voltage PS/SYNC = GND referenced to 500mV 0.6% 5%
TPS63021 output voltage regulation PS/SYNC = GND referenced to 3.3V 0.6% 5%
Maximum line regulation 0.5%
Maximum load regulation 0.5%
f Oscillator frequency 2200 2400 2600 kHz
Frequency range for synchronization 2200 2400 2600 kHz
ISW Average switch current limit VIN = VINA = 3.6 V, TA= 25°C 3500 4000 4500 mA
High side switch on resistance VIN = VINA = 3.6 V 50 mΩ
Low side switch on resistance VIN = VINA = 3.6 V 50 mΩ
VIN and VINA 25 50 μA
Quiescent IO= 0 mA, VEN = VIN = VINA = 3.6 V,
Iqcurrent VOUT = 3.3 V
VOUT 5 10 μA
TPS63021 FB input impedance VEN = HIGH 1 MΩ
ISShutdown current VEN = 0 V, VIN = VINA = 3.6 V 0.1 1 μA
CONTROL STAGE
Under voltage lockout threshold VINA voltage decreasing 1.4 1.5 1.6 V
UVLO Under voltage lockout hysteresis 200 mV
VIL EN, PS/SYNC input low voltage 0.4 V
VIH EN, PS/SYNC input high voltage 1.2 V
EN, PS/SYNC input current Clamped to GND or VINA 0.01 0.1 μA
PG output low voltage VOUT = 3.3 V, IPGL = 10 μA 0.04 0.4 V
PG output leakage current 0.01 0.1 μA
Output overvoltage protection 5.5 7 V
Overtemperature protection 140 °C
Overtemperature hysteresis 20 °C
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: TPS63020 TPS63021
VOUT
L1
EN
GND
L2
PS/SYNC
VINA
FB
PowerPad
L2
PGND
VIN
L1
PG
VIN
VOUT
PGND
PGND
PGND
PGND
PGND
PGND
PGND
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
PIN ASSIGNMENTS
DSJ PACKAGE
(TOP VIEW)
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
EN 12 I Enable input (1 enabled, 0 disabled) , must not be left open
FB 3 I Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage
versions
GND 2 Control / logic ground
L1 8, 9 I Connection for Inductor
L2 6, 7 I Connection for Inductor
PS/SYNC 13 I Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization), must
not be left open
PG 14 O Output power good (1 good, 0 failure; open drain)
PGND PowerPAD™ Power ground
VIN 10, 11 I Supply voltage for power stage
VOUT 4, 5 O Buck-boost converter output
VINA 1 I Supply voltage for control stage
PowerPAD™ Must be connected to PGND. Must be soldered to achieve appropriate power dissipation.
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Product Folder Links: TPS63020 TPS63021
_
+
PGND PGND
VIN
VOUT
+
-
VREF
PGND
PGND
FB
VOUT
L2L1
VIN
VINA
PS/SYNC
EN
GND
VINA
Current
Sensor
Gate
Control
Modulator
Oscillator
Device
Control
PG
Temperature
Control
_
+
_
+
PGND PGND
VIN
VOUT
+
-
VREF
PGND
PGND
FB
VOUT
L2L1
VIN
VINA
PS/SYNC
EN
GND
VINA
Current
Sensor
Gate
Control
Modulator
Oscillator
Device
Control
PG
Temperature
Control
_
+
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
FUNCTIONAL BLOCK DIAGRAM (TPS63020)
FUNCTIONAL BLOCK DIAGRAM (TPS63021)
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: TPS63020 TPS63021
Input Voltage (V)
Maximum Output Current (A)
1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 5 5.4
0
0.5
1
1.5
2
2.5
3
3.5
4
TPS63020
VOUT = 2.5V
VOUT = 4.5V
Input Voltage (V)
Maximum Output Current (A)
1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 5 5.4
0
0.5
1
1.5
2
2.5
3
3.5
4
TPS63021
VOUT = 3.3V
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
DESCRIPTION FIGURE
vs Input voltage (TPS63020, VOUT = 2.5 V / VOUT = 4.5 V) 1
Maximum output current vs Input voltage (TPS63021, VOUT = 3.3V) 2
vs Output current (TPS63020, Power Save Enabled, VOUT = 2.5 V / VOUT = 4.5 V) 3
vs Output current (TPS63020, Power Save Disabled, VOUT = 2.5V / VOUT = 4.5V) 4
vs Output current (TPS63021, Power Save Enabled, VOUT = 3.3V) 5
vs Output current (TPS63021, Power Save Disabled, VOUT = 3.3V) 6
vs Input voltage (TPS63020, Power Save Enabled, VOUT = 2.5V, IOUT = {10; 500; 1000; 7
2000 mA})
vs Input voltage (TPS63020, Power Save Enabled, VOUT = 4.5V, IOUT = {10; 500; 1000; 8
2000 mA})
Efficiency vs Input voltage (TPS63020, Power Save Disabled, VOUT = 2.5V, IOUT = {10; 500; 1000; 9
2000 mA})
vs Input voltage (TPS63020, Power Save Disabled, VOUT = 4.5V, IOUT = {10; 500; 1000; 10
2000 mA})
vs Input voltage (TPS63021, Power Save Enabled, VOUT = 3.3V, IOUT = {10; 500; 1000; 11
2000 mA})
vs Input voltage (TPS63021, Power Save Disabled, VOUT = 3.3V, IOUT = {10; 500; 1000; 12
2000 mA})
vs Output current (TPS63020, VOUT = 2.5 V) 13
Output voltage vs Output current (TPS63020, VOUT = 4.5 V) 14
vs Output current (TPS63021, VOUT = 3.3V) 15
Load transient response (TPS63021, VIN< VOUT, Load change from 500 mA to 1500 16
mA)
Load transient response (TPS63021, VIN > VOUT, Load change from 500 mA to 1500 17
Waveforms mA)
Line transient response (TPS63021, VOUT = 3.3V, IOUT = 1500 mA) 18
Startup after enable (TPS63021, VOUT = 3.3V, VIN = 2.4V, IOUT = 1500mA) 19
Startup after enable (TPS63021, VOUT = 3.3V, VIN = 4.2V, IOUT = 1500mA) 20
MAXIMUM OUTPUT CURRENT MAXIMUM OUTPUT CURRENT
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 1. Figure 2.
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Product Folder Links: TPS63020 TPS63021
Output Current (A)
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
100µ1m 10m 100m 1 4
TPS63021, Power Save Enabled
VIN = 2.4V
VIN = 3.6V
Output Current (A)
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
100µ1m 10m 100m 1 4
TPS63021, Power Save Disabled
VIN = 2.4V
VIN = 3.6V
Output Current (A)
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
100µ1m 10m 100m 1 4
TPS63020, Power Save Enabled
VIN = 1.8V, VOUT = 2.5V
VIN = 3.6V, VOUT = 2.5V
VIN = 2.4V, VOUT = 4.5V
VIN = 3.6V, VOUT = 4.5V
Output Current (A)
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
100µ1m 10m 100m 1 4
TPS63020, Power Save Disabled
VIN = 1.8V, VOUT = 2.5V
VIN = 3.6V, VOUT = 2.5V
VIN = 2.4V, VOUT = 4.5V
VIN = 3.6V, VOUT = 4.5V
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
EFFICIENCY EFFICIENCY
vs vs
OUTPUT CURRENT OUTPUT CURRENT
Figure 3. Figure 4.
EFFICIENCY EFFICIENCY
vs vs
OUTPUT CURRENT OUTPUT CURRENT
Figure 5. Figure 6.
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: TPS63020 TPS63021
Input Voltage (V)
Efficiency (%)
1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 5 5.4
0
10
20
30
40
50
60
70
80
90
100
TPS63020, VOUT = 2.5V, Power Save Disabled
IOUT = 10mA
IOUT = 500mA
IOUT = 1A
IOUT = 2A
Input Voltage (V)
Efficiency (%)
1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 5 5.4
0
10
20
30
40
50
60
70
80
90
100
TPS63020, VOUT = 4.5V, Power Save Disabled
IOUT = 10mA
IOUT = 500mA
IOUT = 1A
IOUT = 2A
Input Voltage (V)
Efficiency (%)
1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 5 5.4
0
10
20
30
40
50
60
70
80
90
100
TPS63020, VOUT = 2.5V, Power Save Enabled
IOUT = 10mA
IOUT = 500mA
IOUT = 1A
IOUT = 2A
Input Voltage (V)
Efficiency (%)
1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 5 5.4
0
10
20
30
40
50
60
70
80
90
100
TPS63020, VOUT = 4.5V, Power Save Enabled
IOUT = 10mA
IOUT = 500mA
IOUT = 1A
IOUT = 2A
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
EFFICIENCY EFFICIENCY
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 7. Figure 8.
EFFICIENCY EFFICIENCY
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 9. Figure 10.
8Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
Output Current (A)
Output Voltage (V)
2.4
2.45
2.5
2.55
2.6
100µ1m 10m 100m 1 5
TPS63020, Power Save Disabled
VIN = 3.6V
Output Current (A)
Output Voltage (V)
4.4
4.45
4.5
4.55
4.6
100µ1m 10m 100m 1 5
TPS63020, Power Save Disabled
VIN = 3.6V
Input Voltage (V)
Efficiency (%)
1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 5 5.4
0
10
20
30
40
50
60
70
80
90
100
TPS63021, Power Save Enabled
IOUT = 10mA
IOUT = 500mA
IOUT = 1A
IOUT = 2A
Input Voltage (V)
Efficiency (%)
1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 5 5.4
0
10
20
30
40
50
60
70
80
90
100
TPS63021, Power Save Disabled
IOUT = 10mA
IOUT = 500mA
IOUT = 1A
IOUT = 2A
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
EFFICIENCY EFFICIENCY
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 11. Figure 12.
OUTPUT VOLTAGE OUTPUT VOLTAGE
vs vs
OUTPUT CURRENT OUTPUT CURRENT
Figure 13. Figure 14.
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: TPS63020 TPS63021
V = 4.2 V, I = 500 mA to 1500 mA
IN OUT
Time 2 ms/div
TPS63021
Output Voltage
50 mV/div, AC
Output Current
500 mA/div, DC
Output Current (A)
Output Voltage (V)
3.2
3.25
3.3
3.35
3.4
100µ1m 10m 100m 1 5
TPS63021, Power Save Disabled
VIN = 3.6V
V = 2.4 V, I = 500 mA to 1500 mA
IN OUT
Time 2 ms/div
TPS63021
Output Voltage
50 mV/div, AC
Output Current
500 mA/div, DC
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
OUTPUT VOLTAGE
vs
OUTPUT CURRENT LOAD TRANSIENT RESPONSE
Figure 15. Figure 16.
LOAD TRANSIENT RESPONSE LINE TRANSIENT RESPONSE
Figure 17. Figure 18.
10 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
V = 4.2 V, R = 2.2
IN L W
Time 40 s/divm
TPS63021
Enable
2 V/div, DC
Output Voltage
1 V/div, DC
Inductor Current
500 mA/div, DC
Voltage at L2
5 V/div, DC
V = 2.4 V, R = 2.2
IN L W
Time 100 s/divm
TPS63021
Enable
2 V/div, DC
Output Voltage
1 V/div, DC
Inductor Current
1 A/div, DC
Voltage at L1
5 V/div, DC
TPS63020
TPS63021
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SLVS916B –JULY 2010–REVISED AUGUST 2012
STARTUP AFTER ENABLE STARTUP AFTER ENABLE
Figure 19. Figure 20.
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: TPS63020 TPS63021
VIN L1
VIN
VINA
EN
PS/SYNC
GND
L2
VOUT
FB
PGND
L1
1µH
C2
C3
2.5 V to 5.5V
VOUT
3.3V/1.5A
TPS63020
PG
Power Good
Output
C1
2X10µF
0.1µF
2X22µF
1MΩ
180kΩ
R1
R2
1MΩ
R3
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Table 1. List of Components
REFERENCE DESCRIPTION MANUFACTURER
TPS63020 or TPS63021 Texas Instruments
L1 1 μH, 4 mm x 4 mm x 2 mm XFL4020-152ML, Coilcraft
C1 2 × 10 μF 6.3V, 0603, X5R ceramic GRM188R60J106ME84D, Murata
C2 3 × 22 μF 6.3V, 0603, X5R ceramic GRM188R60J106ME84D, Murata
C3 0.1 μF, X5R or X7R ceramic
R1 Depending on the output voltage at TPS63020, 0 Ωat TPS63021
R2 Depending on the output voltage at TPS63020, not used at TPS63021
R3 1 MΩ
12 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
DETAILED DESCRIPTION
The controller circuit of the device is based on an average current mode topology. The controller also uses input
and output voltage feedforward. Changes of input and output voltage are monitored and immediately can change
the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier gets its
feedback input from the FB pin. At adjustable output voltages, a resistive voltage divider must be connected to
that pin. At fixed output voltages, FB must be connected to the output voltage to directly sense the voltage. Fixed
output voltage versions use a trimmed internal resistive divider. The feedback voltage will be compared with the
internal reference voltage to generate a stable and accurate output voltage.
The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range. To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND
and PGND are used. The reference for all control functions is the GND pin. The power switches are connected to
PGND. Both grounds must be connected on the PCB at only one point, ideally, close to the GND pin. Due to the
4-switch topology, the load is always disconnected from the input during shutdown of the converter. To protect
the device from overheating an internal temperature sensor is implemented.
Buck-Boost Operation
To regulate the output voltage at all possible input voltage conditions, the device automatically switches from
step down operation to boost operation and back as required by the configuration. It always uses one active
switch, one rectifying switch, one switch permanently on, and one switch permanently off. Therefore, it operates
as a step down converter (buck) when the input voltage is higher than the output voltage, and as a boost
converter when the input voltage is lower than the output voltage. There is no mode of operation in which all 4
switches are permanently switching. Controlling the switches this way allows the converter to maintain high
efficiency at the most important point of operation, when input voltage is close to the output voltage. The RMS
current through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses.
For the remaining 2 switches, one is kept permanently on and the other is kept permanently off, thus causing no
switching losses.
Control loop description
The average inductor current is regulated by a fast current regulator loop which is controlled by a voltage control
loop. Figure 21 shows the control loop.
The non inverting input of the transconductance amplifier Gmv can be assumed to be constant. The output of
Gmv defines the average inductor current. The current through resistor RS, which represents the actual inductor
current, is compared to the desired value and the difference, or current error, is amplified and compared to the
sawtooth ramp of either the Buck or the Boost.
The Buck-Boost Overlap ControlTM makes sure that the classical buck-boost function, which would cause two
switches to be on every half a cycle, is avoided. Thanks to this block whenever all switches becomes active
during one clock cycle, the two ramps are shifted away from each other, on the other hand when there is no
switching activities because there is a gap between the ramps, the ramps are moved closer together. As a result
the number of classical buck-boost cycles or no switching is reduced to a minimum and high efficiency values
has been achieved.
Slope compensation is not required to avoid subharmonic oscillation which are otherwise observed when working
with peak current mode control with D>0.5.
Nevertheless the amplified inductor current downslope at one input of the PWM comparator must not exceed the
oscillator ramp slope at the other comparator input. This purpose is reached limiting the gain of the current
amplifier.
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: TPS63020 TPS63021
TM
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
Figure 21. Average Current mode control
Power-save mode and synchronization
The PS/SYNC pin can be used to select different operation modes. Power Save Mode is used to improve
efficiency at light load. To enable power-save, PS/SYNC must be set low. If PS/SYNC is set low then Power
save mode is entered when the average inductor current gets lower then about 100mA. At this point the
converter operates with reduced switching frequency and with a minimum quiescent current to maintain high
efficiency.
During the Power Save Mode, the output voltage is monitored with a comparator by the threshold comp low and
comp high. When the device enters Power Save Mode, the converter stops operating and the output voltage
drops. The slope of the output voltage depends on the load and the value of output capacitance. As the output
voltage falls below the comp low threshold set to 2.5% typical above Vout, the device ramps up the output
voltage again, by starting operation using a programmed average inductor current higher than required by the
current load condition. Operation can last one or several pulses. The converter continues these pulses until the
comp high threshold, set to typically 3.5% above Vout nominal, is reached and the average inductance current
gets lower than about 100mA. When the load increases above the minimum forced inductor current of about
100mA, the device will automatically switch to PWM mode.
The Power Save Mode can be disabled by programming high at the PS/SYNC. Connecting a clock signal at
PS/SYNC forces the device to synchronize to the connected clock frequency.
Synchronization is done by a PLL, so synchronizing to lower and higher frequencies compared to the internal
clock works without any issues. The PLL can also tolerate missing clock pulses without the converter
malfunctioning. The PS/SYNC input supports standard logic thresholds.
14 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
Heavy Load transient step
Vo
PFM mode at light load
current
PWM mode
Comparator High
Comparator low
Absolute Voltage drop
with positioning
3.5%
3%
2.5%
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
Figure 22. Power-Save Mode Thresholds and Dynamic Voltage Positioning
Dynamic voltage positioning
As detailed in Figure 22, the output voltage is typically 3% above the nominal output voltage at light load
currents, as the device is in Power Save Mode. This gives additional headroom for the voltage drop during a load
transient from light load to full load. This allows the converter to operate with a small output capacitor and still
have a low absolute voltage drop during heavy load transient changes. See Figure 22 for detailed operation of
the power save mode
Dynamic Current Limit
To protect the device and the application, the average inductor current is limited internally on the IC. At nominal
operating conditions, this current limit is constant. The current limit value can be found in the electrical
characteristics table. If the supply voltage at VIN drops below 2.3V, the current limit is reduced. This can happen
when the input power source becomes weak. Increasing output impedance, when the batteries are almost
discharged, or an additional heavy pulse load is connected to the battery can cause the VIN voltage to drop. The
dynamic current limit has its lowest value when reaching the minimum recommended supply voltage at VIN. At
this voltage, the device is forced into burst mode operation trying to stay active as long as possible even with a
weak input power source.
If the die temperature increases above the recommended maximum temperature, the dynamic current limit
becomes active. Similar to the behavior when the input voltage at VIN drops, the current limit is reduced with
temperature increasing.
Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This means that the output voltage can drop below the input voltage during
shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high
peak currents flowing from the input.
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: TPS63020 TPS63021
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
Power Good
The device has a built in power good function to indicate whether the output voltage is regulated properly. As
soon as the average inductor current gets limited to a value below the current the voltage regulator demands for
maintaining the output voltage the power good output gets low impedance. The output is open drain, so its logic
function can be adjusted to any voltage level the connected logic is using, by connecting a pull up resistor to the
supply voltage of the logic. By monitoring the status of the current control loop, the power good output provides
the earliest indication possible for an output voltage break down and leaves the connected application a
maximum time to safely react.
Softstart and Short Circuit Protection
After being enabled, the device starts operating. The average current limit ramps up from an initial 400mA
following the output voltage increasing. At an output voltage of about 1.2V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented.
Thus, the output voltage overshoot at startup, as well as the inrush current, is kept at a minimum. The device
ramps up the output voltage in a controlled manner even if a large capacitor is connected at the output. When
the output voltage does not increase above 1.2V, the device assumes a short circuit at the output, and keeps the
current limit low to protect itself and the application. At a short on the output during operation, the current limit
also is decreased accordingly.
Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the
output voltage will not work anymore. Therefore overvoltage protection is implemented to avoid the output
voltage exceeding critical values for the device and possibly for the system it is supplying. The implemented
overvoltage protection circuit monitors the output voltage internally as well. In case it reaches the overvoltage
threshold the voltage amplifier regulates the output voltage to this value.
Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage on VINA is lower than
approximately its threshold (see electrical characteristics table). When in operation, the device automatically
enters the shutdown mode if the voltage on VINA drops below the undervoltage lockout threshold. The device
automatically restarts if the input voltage recovers to the minimum operating input voltage.
Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (see electrical characteristics table) the device stops operating. As soon as
the IC temperature has decreased below the programmed threshold, it starts operating again. There is a built-in
hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.
16 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
RHPZ
2
(1 D) Vout
=2 Iout L
- ´
´ ´
f
p
PEAK
Iout Vin D
I = +
η (1 D) 2 L
´
´ - ´ ´f
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
APPLICATION INFORMATION
DESIGN PROCEDURE
The TPS6302X series of buck-boost converter has internal loop compensation. Therefore, the external L-C filter
has to be selected to work with the internal compensation. As a general rule of thumb, the product L×C should
not move over a wide range when selecting a different output filter. However, when selecting the output filter a
low limit for the inductor value exists to avoid subharmonic oscillation which could be caused by a far too fast
ramp up of the amplified inductor current. For the TPS6302X series the minimum inductor value should be kept
at 470nH. Selecting a larger output capacitor value is less critical because the corner frequency moves to lower
frequencies causing fewer stability problems. To simplify this process Table 1outlines possible inductor and
capacitor value combinations.
Inductor Selection
For high efficiencies, the inductor should have a low dc resistance to minimize conduction losses. Especially at
high-switching frequencies the core material has a higher impact on efficiency. When using small chip inductors,
the efficiency is reduced mainly due to higher inductor core losses. This needs to be considered when selecting
the appropriate inductor. The inductor value determines the inductor ripple current. The larger the inductor value,
the smaller the inductor ripple current and the lower the conduction losses of the converter. Conversely, larger
inductor values cause a slower load transient response. To avoid saturation of the inductor, with the chosen
inductance value, the peak current for the inductor in steady state operation can be calculated. Equation (1) and
(5) show how to calculate the peak current IPEAK. Only the equation which defines the switch current in boost
mode is reported because this is providing the highest value of current and represents the critical current value
for selecting the right inductor.
(1)
With,
D =Duty Cycle in Boost mode
f = Converter switching frequency (typical 2.4 MHz)
L = Selected inductor value
η= Estimated converter efficiency (use the number from the efficiency curves or 0.80 as an assumption)
Note: The calculation must be done for the maximum input voltage which is possible to have in boost mode
Consideration must be given to the load transients and error conditions that can cause higher inductor currents.
This must be taken into consideration when selecting an appropriate inductor. Please refer to Table 3 for typical
inductors.
The size of the inductor can also affect the stability of the feedback loop. In particular the boost transfer function
exhibits a right half-plane zero, whose frequency is inverse proportional to the inductor value and the load
current. This means higher is the value of inductance and load current more possibilities has the right plane zero
to be moved at lower frequency which could degrade the phase margin of the feedback loop. It is recommended
to choose the inductor's value in order to have the frequency of the right half plane zero >400KHz. The frequency
of the RHPZ can be calculated using equation (6)
(2)
With,
D =Duty Cycle in Boost mode
Note: The calculation must be done for the maximum input voltage which is possible to have in boost mode
Table 2. Inductor Selection
VENDOR INDUCTOR SERIES
Coilcraft XFL4020
Toko FDV0530S
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: TPS63020 TPS63021
OUT
FB
V
R1 = R2 × - 1
V
æ ö
ç ÷
è ø
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
Capacitor selection
Input Capacitor
At least a 10μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior
of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND pins of
the IC is recommended.
Output Capacitor
For the output capacitor, use of a small ceramic capacitors placed as close as possible to the VOUT and PGND
pins of the IC is recommended. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, use a smaller ceramic capacitor in parallel to the large capacitor. The small
capacitor should be placed as close as possible to the VOUT and PGND pins of the IC. The recommended
typical output capacitor value is 30µF with a variance that depends on the specific application requirements.
There is also no upper limit for the output capacitance value. Larger capacitors will cause lower output voltage
ripple as well as lower output voltage drop during load transients.
When choosing input and output capacitors, it needs to be kept in mind, that the value of capacitance
experiences significant losses from their rated value depending on the operating temperature and the operating
DC voltage. It's not uncommon for a small surface mount ceramic capacitor to lose 50% and more of it's rated
capacitance. For this reason could be important to use a larger value of capacitance or a capacitor with higher
voltage rating in order to ensure the required capacitance at the full operating voltage.
Bypass Capacitor
To make sure that the internal control circuits are supplied with a stable low noise supply voltage, a capacitor can
be connected between VINA and GND. Using a ceramic capacitor with a value of 0.1μF is recommended. The
value of this capacitor should not be higher than 0.22μF.
Setting the Output Voltage
When the adjustable output voltage version TPS63020 is used, the output voltage is set by the external resistor
divider. The resistor divider must be connected between VOUT, FB and GND. When the output voltage is
regulated properly, the typical value of the voltage at the FB pin is 500mV. The maximum recommended value
for the output voltage is 8V. The current through the resistive divider should be about 100 times greater than the
current into the FB pin. The typical current into the FB pin is 0.01μA, and the voltage across the resistor between
FB and GND, R2, is typically 500 mV. Based on these two values, the recommended value for R2 should be
lower than 500kΩ, in order to set the divider current at 1μA or higher. It is recommended to keep the value for
this resistor in the range of 200kΩ. From that, the value of the resistor connected between VOUT and FB, R1,
depending on the needed output voltage (VOUT), can be calculated using Equation 3:
(3)
A small capacitor C2=10pF, in parallel with R2 needs to be placed when using the Power save mode and the
adjustable version, to provide filtering and improve the considerably the efficiency.
18 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
OUT
μs
L2 = V × 0.5 × A
( )
IN1 OUT
μs
L1 = V V × 0.5 × A
-
L1
VIN
VINA
EN
PS/SYNC
GND
L2
VOUT
FB
PGND
L1
C2C1
VIN VOUT
TPS6302x
PG
Power Good
Output
C3
PS/SYNC
R1
R2
R3
OUT
FB
V
R1 = R2 × - 1
V
æ ö
ç ÷
è ø
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
APPLICATION INFORMATION
DESIGN PROCEDURE
The TPS6302x dc/dc converters are intended for systems powered by one-cell Li-Ion or Li-Polymer battery with a
typical voltage between 2.3 V and 4.5 V. They can also be used in systems powered by a double or triple cell
Alkaline, NiCd, or NiMH battery with a typical terminal voltage between 1.8V and 5.5V . Additionally, any other
voltage source with a typical output voltage between 1.8V and 5.5V can power systems where the TPS6302x is
used.
PROGRAMMING THE OUTPUT VOLTAGE
Within the TPS6302x family there are fixed and adjustable output voltage versions available. To properly
configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it
must be connected directly to VOUT. For the adjustable output voltage versions, an external resistor divider is
used to adjust the output voltage. The resistor divider must be connected between VOUT, FB and GND. When
the output voltage is regulated properly, the typical value of the voltage at the FB pin is 500mV. The maximum
recommended value for the output voltage is 5.5V. The current through the resistor divider should be about 100
times greater than the current into the FB pin. The typical current into the FB pin is 0.01μA, and the voltage
across the resistor between FB and GND, R2, is typically 500 mV. Based on these two values, the recommended
value for R2 should be lower than 500kΩ, in order to set the divider current at 1μA or higher. It is recommended
to keep the value for this resistor in the range of 200kΩ. From that, the value of the resistor connected between
VOUT and FB, R1, depending on the needed output voltage (VOUT), can be calculated using Equation 3:
(4)
Figure 23. Typical Application Circuit for Adjustable Output Voltage Option
INDUCTOR SELECTION
To properly configure the TPS6302x devices, an inductor must be connected between pin L1 and pin L2. To
estimate the inductance value, Equation 5 and Equation 6 can be used.
(5)
(6)
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: TPS63020 TPS63021
Hμ
Fμ
×L×10=COUT
OUT OUT IN2 x OUT IN2
IN2 OUT
V x I V (V - V )
I2 = +
0.8 x V 2 x V x f x L
OUT OUT IN1 OUT
IN1
I V (V - V )
I1 = +
0.8 2 x V x f x L
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
In Equation 5 the minimum inductance value, L1 for step down mode operation is calculated. VIN1 is the
maximum input voltage. In Equation 6 the minimum inductance, L2, for boost mode operation is calculated. The
recommended minimum inductor value is either L1 or L2, whichever is higher. As an example, a suitable inductor
for generating 3.3V from a Li-Ion battery with a battery voltage range from 2.5V up to 4.2V is 1.5μH. The
recommended inductor value range is between 1.5μH and 4.7μH. This means that at high voltage conversion
rates, higher inductor values offer better performance.
With the chosen inductance value, the peak current for the inductor in steady state operation can be calculated.
Equation 7 shows how to calculate the peak current I1 in step down mode operation and Equation 8 shows how
to calculate the peak current I2 in boost mode operation.
(7)
(8)
In both equations, fis the minimum switching frequency. VIN2 is the minimum input voltage. The critical current
value for selecting the right inductor is the higher value of I1 and I2 . Consideration must be given to the load
transients and error conditions that can cause higher inductor currents. This must be taken into account when
selecting an appropriate inductor. The following inductor series from different suppliers have been used with
TPS6302x converters:
Table 3. List of Inductors
VENDOR INDUCTOR SERIES
Coilcraft XFL4020
Toko FDV0530S
CAPACITOR SELECTION
Input Capacitor
At least a 10μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior
of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND pins of
the IC is recommended.
Bypass Capacitor
To make sure that the internal control circuits are supplied with a stable low noise supply voltage, a capacitor can
be connected between VINA and GND. Using a ceramic capacitor with a value of 0.1μF is recommended. The
value of this capacitor should not be higher than 0.22μF. If no capacitor is used at VINA, VINA should be
connected directly to VIN.
Output Capacitor
For the output capacitor, use of small ceramic capacitors placed as close as possible to the VOUT and PGND
pins of the IC is recommended. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, use a smaller ceramic capacitor in parallel to the large capacitor. The small
capacitor should be placed as close as possible to the VOUT and PGND pins of the IC.
To get an estimate of the recommended minimum output capacitance, Equation 9 can be used.
(9)
A capacitor with a value in the range of the calculated minimum should be used. This is required to maintain
control loop stability. There are no additional requirements regarding minimum ESR. There is also no upper limit
for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output
voltage drop during load transients.
20 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
EN
PS/SYNC
PG
L1
U1
VIN
GND
VOUT
GND
C1 C2
R1
R2
C3
GND
TPS63020
TPS63021
www.ti.com
SLVS916B –JULY 2010–REVISED AUGUST 2012
LAYOUT CONSIDERATIONS
For all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, short traces are recommended as well, separation from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground cur
• rent.
Figure 24. PCB Layout Suggestion
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the PowerPAD™
• Introducing airflow in the system
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics
Application Note (SZZA017), and IC Package Thermal Metrics Application Note (SPRA953).
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: TPS63020 TPS63021
VIN L1
VIN
VINA
EN
PS/SYNC
GND
L2
VOUT
FB
PGND
L1
1µH
C2
C3
2.5 V to 5.5V
VOUT
3.3V/1.5A
TPS63020
PG
Power Good
Output
C1
2X10µF
0.1µF
2X22µF
1MΩ
180kΩ 10pF
R1
R2C4
1MΩ
R3
VIN L1
VIN
VINA
EN
PS/SYNC
GND
L2
VOUT
FB
PGND
L1
1.5µH
C2
C3
2.5 V to 5.5V
VOUT
3.3V/500mA
TPS63020
PG
Power Good
Output
C1
2X10µF
0.1µF
3X10µF
1MΩ
180kΩ 10pF
R1
R2C4
1MΩ
R3
TPS63020
TPS63021
SLVS916B –JULY 2010–REVISED AUGUST 2012
www.ti.com
TYPICAL APPLICATION
Spacer
Changes from Original (April 2010) to Revision A Page
• Changed the List Of Components Table 1. Changed C1 and C2 manufacturer number From:
GRM188R60J106KME84D To: GRM188R60J106ME84D ................................................................................................. 12
• Updated Figure 24 - PCB Layout Suggestion .................................................................................................................... 21
Changes from Revision A (December 2011) to Revision B Page
• Changed the Duty cycle in step down conversion values, added MIN = 20%, deleted TYP = 30% and MAX = 40% ........ 3
22 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS63020 TPS63021
PACKAGE OPTION ADDENDUM
www.ti.com 18-Jun-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS63020DSJR ACTIVE VSON DSJ 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS63020DSJT ACTIVE VSON DSJ 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS63021DSJR ACTIVE VSON DSJ 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS63021DSJT ACTIVE VSON DSJ 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS63020DSJR VSON DSJ 14 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q1
TPS63020DSJT VSON DSJ 14 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q1
TPS63021DSJR VSON DSJ 14 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q1
TPS63021DSJT VSON DSJ 14 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS63020DSJR VSON DSJ 14 3000 367.0 367.0 35.0
TPS63020DSJT VSON DSJ 14 250 210.0 185.0 35.0
TPS63021DSJR VSON DSJ 14 3000 367.0 367.0 35.0
TPS63021DSJT VSON DSJ 14 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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