ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
High Brightness SMT Round LED Lamps
Amber, Red, Green and Blue Tinted LEDs
Data Sheet
CAUTION: InGaN devices are Class 1C HBM ESD sensitive; AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard.
Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Features
x Compact form factor
x High brightness material
x Available in Red, Amber, Green and Blue color
x Red AlInGaP 626nm
x Amber AlInGaP 590nm
x Green InGaN 525nm
x Blue InGaN 470nm
x Jedec MSL 2A
x Compatible with industrial reflow soldering process
x Typical Viewing angle: 30°
x Tinted, non-diffused
Applications
x Variable Message Signs
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.20 mm unless other specified.
AA
CC
A: Anode
C: Cathode
4.20 ±0.20
4.20 ±0.20
4.75 ±0.50
6.50 ±0.50
2.50 ±0.20
3.40 ±0.50
AC
1.4 (4x) 1.0
Description
The new Avago ALMD-xx3D LED series has the same or
just slightly less luminous intensity than conventional
high brightness, through-hole LEDs.
The new LED lamps can be assembled using common
SMT assembly processes and are compatible with indus-
trial reflow soldering processes.
The LEDs are made with an advanced optical grade epoxy
for superior performance in outdoor sign applications.
For easy pick and place assembly, the LEDs are shipped
in EIA-compliant tape and reel. Every reel is shipped from
a single intensity and color bin– except the red color–for
better uniformity.
Package Dimensions
2
Device Selection Guide
Part Number Color and Dominant Wavelength
Od (nm) Typ [3]
Luminous Intensity Iv (mcd) [1,2,5] Viewing Angle
Typ (°) [4]
Min Max
ALMD-EG3D-VX002 Red 626 4200 9300 30°
ALMD-EL3D-VX002 Amber 590 4200 9300
ALMD-CM3D-WY002 Green 525 5500 12000
ALMD-CB3D-RT002 Blue 470 1500 3200
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. T½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
Part Numbering System
Packaging Option
02: tested 20mA, 13 inch carrier tape, 8mm pitch, 16mm carrier width
Color Bin Selection
0: Full Distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Untinted/Tinted Lens
D: Tinted
Viewing Angle
3: 30°
Color
B: Blue
G: Red
L: Amber
M: Green
Package
C: SMT Round Lamp InGaN
E: SMT Round Lamp AlInGaP
SMT Lamps
ALMD – X X 3D – x x x xx
3
Absolute Maximum Rating, TJ = 25°C
Parameter Red and Amber Blue and Green Unit
DC Forward Current [1] 50 30 mA
Peak Forward Current 100 [2] 100 [3] mA
Power Dissipation 120 114 mW
Reverse Voltage 5 (IR = 100 PA) 5 (IR = 10 PA) V
LED Junction Temperature 130 110 °C
Operating Temperature Range -40 to +85 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 4 and Figure 9
2. Duty Factor 30%, frequency 1KHz.
3. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics, TJ = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Red
Amber
Green
Blue
VF
1.8
1.8
2.8
2.8
2.1
2.1
3.2
3.2
2.4
2.4
3.8
3.8
VI
F = 20 mA
Reverse Voltage
Red & Amber
Green & blue
VR
5
5
VI
F = 100 PA
IF = 10 PA
Dominant Wavelength [1]
Red
Amber
Green
Blue
Od
618.0
584.5
519.0
460.0
626.0
590.0
525.0
470.0
630.0
594.5
539.0
480.0
IF = 20 mA
Peak Wavelength
Red
Amber
Green
Blue
OPEAK 634
594
516
464
nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance RTJ-PIN 130 °C/W LED Junction-to-Pin
Luminous Efficacy [2]
Red
Amber
Green
Blue
KV200
520
530
65
lm/W Emitted Luminous Power/Emitted
Radiant Power
Thermal coefficient of Od
Red
Amber
Green
Blue
0.059
0.103
0.028
0.024
nm/°C IF = 20 mA ; +25°C ≤ TJ ≤ +100°C
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV is
the luminous efficacy in lumens/watt.
4
AlInGaP
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
Figure 5. Relative Dominant Wavelength Shift vs Forward Current
0
0.2
0.4
0.6
0.8
1
500 550 600 650
WAVELENGTH - nm
RELATIVE INTENSITY
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5 3
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 20 40 60 80 100
FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
Red
0
10
20
30
40
50
60
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE (°C)
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 20406080100
FORWARD CURRENT - mA
RELATIVE DOMINANT WAVELENGTH
SHIFT(NORMALIZED AT 20mA) - nm
Red
Amber
MAXIMUM FORWARD CURRENT - mA
Red
Amber
Amber
5
InGaN
Figure 6. Relative Intensity vs Wavelength Figure 7. Forward Current vs Forward Voltage
Figure 8. Relative Intensity vs Forward Current Figure 9. Maximum Forward Current vs Ambient Temperature
Figure 10. Dominant Wavelength Shift vs Forward Current
0
20
40
60
80
100
012345
FORWARD VOLTAGE-V
FORWARD CURRENT-mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 20 40 60 80 100 120
DC FORWARD CURRENT-mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
Green
Blue
-10
-5
0
5
10
0 20406080100
FORWARD CURRENT-mA
RELATIVE DOMINANT
WAVELENGTH SHIFT -nm
Green
Blue
0
5
10
15
20
25
30
35
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - °C
IFmax - MAXIMUM FORWARD
CURRENT - mA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630
WAVELENGTH - nm
RELATIVE INTENSITY
GREEN
BLUE
6
Figure 11a. Radiation Pattern for X axis Figure 11b. Component Axis for Radiation Pattern
Figure 12. Relative Intensity Shift vs Junction Temperature Figure 13. Forward Voltage Shift vs Junction Temperature
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
0.1
1
10
-40 -15 10 35 60 85
NORMALZIED INTENSITY (PHOTO)
Red
Amber
Blue
Green
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
-40 -15 10 35 60 85
TJ - JUNCTION TEMPERATURETJ - JUNCTION TEMPERATURE
FORWARD VOLTAGE SHIFT-V
Red
Amber
Green
Blue
XX
A
CC
A
7
Figure 14. Recommended Soldering Land Pattern
Note: Recommended stencil thickness
is 0.1524mm (6 mils) minimum and
above
5.2
2.1
4.0
0.7
Figure 15. Recommended Pick and Place Nozzle Tip (Urethane PAD Tip)
ID = 3.2mm
OD ≤ 5.0 mm
Figure 16. Recommended Leaded Reflow Soldering Profile Figure 17. Recommended Pb- Free Reflow Soldering Profile
Note: For detail information on reflow soldering of Avago Surface Mount LED, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
-6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX. 217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
ID
OD
8
Figure 18. Carrier Tape Dimension
4.50±0.10
2.20±0.20
2.00±0.10
4.00±0.10
8.00±0.10
16.00±0.30
7.50±0.10
1.75±0.10
7.10±0.10
5.30±0.10
0.40±0.05
1.80±0.20
5.20±0.10
1.55±0.10
1.60±0.10
Figure 19. Reel Dimension
Figure 20. Unit Orientation from reel
LABEL
+0.20
-0.00
1.5 MIN
Ø 330 MAX
Ø 100±0.50
16.4
13.00±0.20
Anode
9
Red Color Range
Min Dom Max Dom X min Y Min X max Y max
618.0 630.0 0.6872 0.3126 0.6890 0.2943
0.6690 0.3149 0.7080 0.2920
Tolerance for each bin limit is ± 0.5nm
Amber Color Range
Bin Min Dom Max Dom Xmin Ymin Xmax Ymax
1 584.5 587.0 0.5420 0.4580 0.5530 0.4400
0.5370 0.4550 0.5570 0.4420
2 587.0 589.5 0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
4 589.5 592.0 0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
6 592.0 594.5 0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
Tolerance for each bin limit is ± 0.5nm
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Bin
Intensity (mcd) at 20mA
Min Max
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
Tolerance for each bin limit is ± 15%
VF Bin Table (V at 20mA) for Red&Amber
Bin ID Min Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Tolerance for each bin limit is ± 0.05V
10
Green Color Range
Bin Min Dom Max Dom Xmin Ymin Xmax Ymax
1 519.0 523.0 0.0667 0.8323 0.1450 0.7319
0.1200 0.7375 0.0979 0.8316
2 523.0 527.0 0.0979 0.8316 0.1711 0.7218
0.1450 0.7319 0.1305 0.8189
3 527.0 531.0 0.1305 0.8189 0.1967 0.7077
0.1711 0.7218 0.1625 0.8012
4 531.0 535.0 0.1625 0.8012 0.2210 0.6920
0.1967 0.7077 0.1929 0.7816
5 535.0 539.0 0.1929 0.7816 0.2445 0.6747
0.2210 0.6920 0.2233 0.7600
Tolerance for each bin limit is ± 0.5nm
Blue Color Range
Bin Min Dom Max Dom Xmin Ymin Xmax Ymax
1 460.0 464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
2 464.0 468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
3 468.0 472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
4 472.0 476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
5 476.0 480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is ± 0.5nm
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2372EN - March 9, 2010
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
Moisture Sensitivity and Handling
The ALMD-xx3D series oval package has a Moisture
Sensitive Level 2a rating per JEDEC J-STD-020. Refer to
Avago Application Note AN5305, Handling of Moisture
Sensitive Surface Mount Devices, for additional details
and a review of proper handling procedures.
A. Storage before use
x An unopened moisture barrier bag (MBB) can be
stored at < 40° C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required then it is safe to reflow solder the LEDs per
the original MSL rating.
x It is recommended that the MBB not be opened
prior to assembly (e.g. for IQC).
B. Control after opening the MBB
x The humidity indicator card (HIC) shall be read
immediately upon opening of the MBB.
x The LEDs must be kept at < 30° C/60% RH at all
times, and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.
C. Control for unfinished tape and reel parts
x Unused LEDs must be stored in a sealed MBB with a
desiccant or desiccator at < 5% RH.
D. Control of assembled boards
x If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB needs
to be stored in a sealed MBB with desiccant or
desiccator at < 5% RH to ensure that all LEDs have
not exceeded their floor life of 672 hours
E. Baking is required if:
x The HIC indicator is not BROWN at 10% and is AZURE
at 5%
x The LEDs are exposed to a condition of > 30° C/60%
RH at any time.
x The LED floor life exceeded 672 hours.
The recommended baking condition is: 60 ± 5° C for 20
hours.
