Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 10
1Publication Order Number:
MMSD914T1/D
MMSD914T1G,
SMMSD914T1G,
MMSD914T3G
Switching Diode
Features
SOD−123 Surface Mount Package
High Breakdown Voltage
Fast Speed Switching Time
AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating Symbol Value Unit
Continuous Reverse Voltage VR100 Vdc
Peak Forward Current IF200 mAdc
Peak Forward Surge Current IFM(surge) 500 mAdc
Non−repetitive Peak
Forward Surge Current
Pulse Width =1 second
Pulse Width =1 micro second
IFSM
1.0
2.0
A
A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board
(Note 1)
TA = 25C
Derate above 25C
PD425
3.4
mW
mW/C
Thermal Resistance,
Junction−to−Ambient
RqJA
290
C/W
Junction and Storage Temperature Range TJ, Tstg −55 to
+150
C
1. FR−5 = 1.0oz Cu, 1.0inz pad
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
http://onsemi.com
SOD−123
CASE 425
PLASTIC
1
CATHODE
2
ANODE
Device Package Shipping†
ORDERING INFORMATION
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MMSD914T1G SOD−123
(Pb−Free)
3,000 / Tape & Reel
MMSD914T3G SOD−123
(Pb−Free)
10,000 / Tape & Reel
MARKING DIAGRAM
5D M G
G
5D = Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
12
SMMSD914T1G SOD−123
(Pb−Free)
3,000 / Tape & Reel
MMSD914T1G, SMMSD914T1G, MMSD914T3G
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 mAdc) V(BR) 100 −Vdc
Reverse Voltage Leakage Current
(VR = 20 Vdc)
(VR = 75 Vdc)
IR
−
−
25
5.0
nAdc
mAdc
Forward Voltage (IF = 10 mAdc) VF−1000 mVdc
Diode Capacitance (VR = 0 Vdc, f = 1.0 MHz) CD−4.0 pF
Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1) trr −4.0 ns
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
+10 V 2 k
820W
0.1 mF
DUT
VR
100 mH
0.1 mF
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
trtpt
10%
90%
IF
IR
trr t
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
IF
INPUT SIGNAL
Figure 1. Recovery Time Equivalent Test Circuit
MMSD914T1G, SMMSD914T1G, MMSD914T3G
http://onsemi.com
3
IR, REVERSE CURRENT (A)
100
0.2 0.4
VF, FORWARD VOLTAGE (VOLTS)
0.6 0.8 1.0 1.2
10
1.0
0.1
TA = 85C
10
0
VR, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001 10 20 30 40 50
0.68
0
VR, REVERSE VOLTAGE (VOLTS)
0.64
0.60
0.56
0.52
CD, DIODE CAPACITANCE (pF)
246 8
IF, FORWARD CURRENT (mA)
TA = 25C
TA = -40C
TA = 150C
TA = 125C
TA = 85C
TA = 55C
TA = 25C
Figure 2. Forward Voltage Figure 3. Leakage Current
Figure 4. Capacitance
MMSD914T1G, SMMSD914T1G, MMSD914T3G
http://onsemi.com
4
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
ÂÂÂÂ
ÂÂÂÂ
ÂÂÂÂ
E
b
DA
L
C
1
2
A1
DIM MIN NOM MAX
MILLIMETERS INCHES
A0.94 1.17 1.35 0.037
A1 0.00 0.05 0.10 0.000
b0.51 0.61 0.71 0.020
c
1.60
0.15
0.055D1.40 1.80
E2.54 2.69 2.84 0.100
---
3.68 0.140
L0.25
3.86
0.010
HE
0.046
0.002
0.024
0.063
0.106
0.145
0.053
0.004
0.028
0.071
0.112
0.152
MIN NOM MAX
3.56
HE
---
--- ---
0.006
--- ---
--- ---
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.22
0.048
ÉÉ
ÉÉ
ÉÉ
ÉÉ
0.91
0.036
2.36
0.093
4.19
0.165
ǒmm
inchesǓ
SCALE 10:1
ÉÉ
ÉÉ
ÉÉ
ÉÉ
q
--- ---
q00
10 10
STYLE 1:
PIN 1. CATHODE
2. ANODE
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MMSD914T1/D
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