CICType (H=2.4mm) 1.0mm Spacing (SMT)
■PC Board Dimension ■Applicable FPC Dimension
No. of Pins
A B C D
No. of Pins
A B C D
403.0 05.1 09.7 04.5 17 16.0 18.1 22.7 17.5
504.0 06.1 10.7 05.5 18 17.0 19.1 23.7 18.5
605.0 07.1 11.7 06.5 19 18.0 20.1 24.7 19.5
706.0 08.1 12.7 07.5 20 19.0 21.1 25.7 20.5
807.0 09.1 13.7 08.5 21 20.0 22.1 26.7 21.5
908.0 10.1 14.7 09.5 22 21.0 23.1 27.7 22.5
10 09.0 11.1 15.7 10.5 24 23.0 25.1 29.7 24.5
11 10.0 12.1 16.7 11.5 26 25.0 27.1 31.7 26.5
12 11.0 13.1 17.7 12.5 28 27.0 29.1 33.7 28.5
13 12.0 14.1 18.7 13.5
14 13.0 15.1 19.7 14.5
15 14.0 16.1 20.7 15.5 29 28.0 30.1 34.7 29.5
16 15.0 17.1 21.7 16.5
30 29.0 31.1 35.7 30.5
●Upper Contact Type CFP24 -01
No. of Pins
Hold Down
Packing Style
01 With
Embossed Taping
02 Without
Embossed Taping
11 With Vinyl Bag
12 Without Vinyl Bag
■Features
1. 1.0mm-pitch SMT-ready FPC connector usable
with CIC printing.
2. Either upper or lower contact location available.
3. Of the ZIF structure.
4.Supplied in emboss-tape packaging for
automatic mounting.
■Specifications
1. Rating : 0.5A 100V AC/DC
2. Contact Resistance : 30mΩmax.
3. Insulation Resistance : 500MΩmin. at 500V DC
4. Withstanding Voltage : 500V AC for one minute
5. Operating Temperature Range : –25˚C to +70˚C
■Material and Plating
●Housing : Polyphenylene Sulfide
(Natural Color) 94V-0
●Cover : Polyphenylene Sulfide
(Natural Color) 94V-0
●Contact : Phosphor Bronze Tin-lead Plating
●Frame : Phosphor Bronze Tin-lead Plating
1.0(Spacing)
5.2
(2.0)
1.7
0.3
2.4 2.4
D1.0
B
C
A
1.5
3.4
0.5
2.4
3.0
0.25
2.0
2.6
A ± 0.05
1.0 ± 0.05
0.2
(D 0.6) + 0.1
0
0.5 + 0.1
0
4.0min.
Silver ink/carbon paste : 10µmin.
R0.4
(A 2) ± 0.1
A ± 0.05
1.0 ± 0.05 0.7 ± 0.08
1.0 ± 0.15
●Lower Contact Type CFP25 -01
No. of Pins
1.0(Spacing)
5.2
(2.0)
1.7
0.3
2.4 D 1.0
B
C
A
1.5
3.4
2.4
Hold Down
Packing Style
01 With
Embossed Taping
02 Without
Embossed Taping
11 With Vinyl Bag
12 Without Vinyl Bag
FPC Connector
