MPXHZ6250A
Rev 0, 09/2005
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2005. All rights reserved.
Media Resistant and
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The Freescale MPXHZ6250A series sensor integrates on-chip, bipolar op
amp circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-chip
integration make the Freescale sensor a logical and economical choice for
automotive system designers.
The MPXHZ6250A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a
pressure sensor chip.
Features
• Improved Accuracy at High Temperature
• Available in Small and Super Small Outline Packages
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from –40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
Typical Applications
• Industrial Controls
• Engine Control/Liquified Petroleum Gas (LPG)
ORDERING INFORMATION
Device
Type Options Case
No.
MPX Series
Order No.
Packing
Options
Device
Marking
Ported
Element
Absolute, Axial
Port
1317A MPXHZ6250AC6T1 Tape & Reel MPXHZ6250A
MPXHZ6250A
INTEGRATED
PRESSURE SENSOR
20 to 250 kPa (3.0 to 36 psi)
0.3 to 4.9 V OUTPUT
MPXHZ6250AC6T1
CASE 1317A-03
PIN NUMBERS(1)
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
1 N/C 5 N/C
2 VS6 N/C
3GND 7 N/C
4 VOUT 8 N/C
SUPER SMALL OUTLINE PACKAGE
MPXHZ6250A
Sensors
2Freescale Semiconductor
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Unit
Maximum Pressure PMAX 1000 kPa
Storage Temperature TSTG –40 to +125 °C
Operating Temperature TA–40 to +125 °C
Output Source Current @ Full Scale Output(2)
2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit.
Io+0.5mAdc
Output Sink Current @ Minimum Pressure Offset2Io–-0.5mAdc
VS
Vout
GND
Sensing
Element
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
MPXHZ6250A
Sensors
Freescale Semiconductor 3
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C.)
Characteristic Symbol Min Typ Max Unit
Pressure Range POP 20 — 250 kPa
Supply Voltage(1)
1. Device is ratiometric within this specified excitation range.
VS4.75 5.0 5.25 Vdc
Supply Current Io— 6.0 10 mAdc
Minimum Pressure Offset (0 to 85°C)
@ VS = 5.0 Volts(2)
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Voff 0.131 0.2 0.269 Vdc
Full Scale Output (0 to 85°C)
@ VS = 5.0 Volts(3)
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
VFSO 4.731 4.8 4.869 Vdc
Full Scale Span (0 to 85°C)
@ VS = 5.0 Volts(4)
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
VFSS 4.462 4.6 4.738 Vdc
Accuracy(5) (0 to 85°C)
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
———±1.5 %VFSS
Sensitivity V/P — 20 — mV/kPa
Response Time(6)
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
tR—1.0—ms
Warm-Up Time(7)
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
——20—ms
Offset Stability(8)
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
——±0.25 — %VFSS
MPXHZ6250A
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4Freescale Semiconductor
Figure 2 illustrates a typical application circuit (output
source current operation).
Figure 3 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85
°
C temperature range.
The output will saturate outside of the rated pressure range.
A gel die coat isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. The MPXHZ6250A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Figure 2. Typical Application Circuit
(Output Source Current Operation)
Figure 3. Output versus Absolute Pressure
VS Pin 2
+5.0 V
GND Pin 3
VOUT Pin 4
MPXHZ6250A
To ADC
100 nF
51 K
47 pF
Output (Volts)
Pressure (Reference to Sealed Vacuum) in kPa
20
31
43
54
66
77
89
100
112
123
135
146
158
169
181
192
204
215
227
238
4.5
0
4.0
5.0
1.0
1.5
2.0
2.5
3.0
3.5
0.5
250
Transfer Function:
Vout = Vs*(0.0040*P-0.040) ± Error
VS = 5.0 Vdc
Temperature = 0 to 85°C
MIN
MAX TYP
MPXHZ6250A
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Freescale Semiconductor 5
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Super Small Outline Packages
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 4. SSOP Footprint (Case 1317A)
Nominal Transfer Value: Vout = VS x (0.004 x P - 0.040)
± (Pressure Error x Temp Factor x 0.004 x VS)
VS = 5.0 ± 0.36 Vdc
Transfer Function (MPXHZ6250A)
Temp Multiplier
-40 3
0 to 85 1
125 1.75
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60 14012010080
Temperature
Error
Factor
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.
Temperature Error Band
Pressure Error (Max)
Pressure Error Band
20 to 250 (kPa) ±3.45 (kPa)
MPXHZ6250A
Pressure (in kPa)
Error Limits for Pressure
Break Points
3.0
2.0
1.0
-1.0
-2.0
-4.0
0.0
4.0
-3.0
20
Pressure Error (kPa)
60 100 140 180 220 260 300
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
MPXHZ6250A
Sensors
6Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1317A-03
ISSUE C
SUPER SMALL OUTLINE PACKAGE
PAGE 1 OF 2
MPXHZ6250A
Sensors
Freescale Semiconductor 7
PACKAGE DIMENSIONS
CASE 1317A-03
ISSUE C
SUPER SMALL OUTLINE PACKAGE
PAGE 2 OF 2
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MPXHZ6250A
Rev. 0
09/2005
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© Freescale Semiconductor, Inc. 2005. All rights reserved.
