INA170EA/2K5 - Texas Instruments - Datasheet.Directory

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PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

FEATURES

●COMPLETE BIDIRECTIONAL CURRENT

MEASUREMENT CIRCUIT

●WIDE SUPPLY RANGE: 2.7V to 40V

●SUPPLY-INDEPENDENT COMMON-MODE

VOLTAGE: 2.7V TO 60V

●RESISTOR PROGRAMMABLE GAIN SET

●LOW QUIESCENT CURRENT: 75µA (typ)

●MSOP-8 PACKAGE

High-Side, Bidirectional

CURRENT SHUNT MONITOR

DESCRIPTION

The INA170 is a high-side, bidirectional current shunt moni-

tor featuring a wide input common-mode voltage range, low

quiescent current, and a tiny MSOP-8 package.

Bidirectional current measurement is accomplished by out-

put offsetting. The offset voltage level is set with an external

resistor and voltage reference. This permits measurement of

a bidirectional shunt current while using a single supply for

the INA170.

Input common-mode and power-supply voltages are inde-

pendent. Input voltage can range from +2.7V to +60V on any

supply voltage from +2.7V to +40V. Low 10µA input bias

current adds minimal error to the shunt current.

The INA170 converts a differential input voltage to a current

output. This current develops a voltage across an external

load resistor, setting any gain from 1 to over 100.

The INA170 is available in an MSOP-8 package, and is

specified over the extended industrial temperature range,

–40°C to +85°C with operation from –55°C to +125°C.

APPLICATIONS

●CURRENT SHUNT MEASUREMENT:

Automotive, Telephone, Computers, Power

Systems, Test, General Instrumentation

●PORTABLE AND BATTERY-BACKUP

SYSTEMS

●BATTERY CHARGERS

●POWER MANAGEMENT

●CELL PHONES

INA170

SBOS193D – MARCH 2001 – REVISED JANUARY 2006

OUT

GND

INA170

A2 Q2

REF

V+

SUPPLY

Load R

1kΩ

–

All trademarks are the property of their respective owners.

INA170

2SBOS193D

www.ti.com

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

Supply Voltage, V+ to GND ................................................. –0.3V to 40V

Analog Inputs, Common Mode(2) ......................................... –0.3V to 75V

Differential (VIN

+) – (VIN

–) .................................. –40V to 2V

Analog Output, Out(2) ........................................................... –0.3V to 40V

Input Current Into Any Pin ............................................................... 10mA

Operating Temperature ..................................................–55°C to +125°C

Storage Temperature .....................................................–65°C to +150°C

Junction Temperature.................................................................... +150°C

NOTE: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those specified is not implied.

(2) The input voltage at any pin may exceed the voltage shown if the current

at that pin is limited to 10mA.

ABSOLUTE MAXIMUM RATINGS(1)

PIN DESIGNATOR DESCRIPTION

–Inverting Input

+Noninverting Input

REF Reference Voltage Input

4 GND Ground

OS Offset Resistor

6 OUT Output

7 NC No Connection

8 V+ Supply Voltage

PIN CONFIGURATION

TOP VIEW MSOP

PIN DESCRIPTION

REF

GND

V+

OUT

–

PACKAGE/ORDERING INFORMATION(1)

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at

www.ti.com.

SPECIFIED

PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT

PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY

INA170EA MSOP-8 DGK –40°C to +85°C INA170EA INA170EA/250 Tape and Reel, 250

"" " ""INA170EA/2K5 Tape and Reel, 2500

INA170 3

SBOS193D www.ti.com

ELECTRICAL CHARACTERISTICS

At TA = –40°C to +85°C, VS = 5V, VIN

+ = 12V, ROUT = 25kΩ, unless otherwise noted.

PARAMETER CONDITION MIN TYP MAX UNITS

INPUT

Full-Scale Sense (Input) Voltage VSENSE = VIN

+ – VIN

–100 500 mV

Common-Mode Input Range +2.7 +60 V

Common-Mode Rejection VIN

+ = +2.7V to +60V, VSENSE = 50mV 100 120 dB

Offset Voltage(1) RTI ±0.2 ±1mV

vs Temperature TMIN to TMAX 1µV/°C

vs Power Supply V+ = +2.7V to +60V, VSENSE = 50mV 0.1 10 µV/V

Input Bias Current VIN

+, VIN

–10 uA

OFFSETTING AMPLIFIER

Offsetting Equation VOS = (RL/ROS) VREF

Input Voltage 1V

S – 1V

Input Offset Voltage ±0.2 ±1mV

vs Temperature TMIN to TMAX 10 µV/°C

Programming Current through ROS 01mA

Input Impedance 1010 || 4 Ω || pF

Input Bias Current VIN

+, VIN

–+10 nA

OUTPUT

Transconductance VSENSE = 10mV to 150mV 0.990 1 1.01 mA/V

vs Temperature VSENSE = 100mV 50 nA/°C

Nonlinearity Error VSENSE = 10mV to 150mV ±0.01 ±0.1 %

Total Output Error VSENSE = 100mV ±0.5 ±2%

Output Impedance 1 || 5 GΩ || pF

Voltage Output

Swing to Power Supply, V+ (V+) – 0.9 (V+) – 1.2 V

Swing to Common Mode, VCM VCM – 0.6 VCM – 1.0 V

FREQUENCY RESPONSE

Bandwidth ROUT = 10kΩ400 kHz

Settling Time (0.1%) 5V Step, ROUT = 10kΩ3µs

NOISE

Output-Current Noise Density 20 pA/√Hz

Total Output-Current Noise BW = 100kHz 7 nA RMS

POWER SUPPLY

Operating Range V+ +2.7 +40 V

Quiescent Current VSENSE = 0, IO = 0 75 125 µA

TEMPERATURE RANGE

Specification, TMIN to TMAX –40 +85 °C

Operating –55 +125 °C

Storage –65 +150 °C

Thermal Resistance,

JA 150 °C/W

NOTE: (1) Defined as the amount of input voltage, VSENSE, to drive the output to zero.

INA170EA

INA170

4SBOS193D

www.ti.com

TYPICAL CHARACTERISTICS

At TA = +25°C, V+ = 5V, VIN

+ = 12V, RL = 25kΩ, unless otherwise noted.

–10

–20100 1k 10k 100k 1M 10M

Gain (dB)

Frequency (Hz)

GAIN vs FREQUENCY

= 10kΩ

= 100kΩ

= 1kΩ

120

100

00.1 110 100 1k 10k

Common-Mode Rejection (dB)

Frequency (Hz)

100k

G = 1

G = 10

G = 100

COMMON-MODE REJECTION vs FREQUENCY

140

120

100

20 110 100 1k 10k 100k

Power-Supply Rejection (dB)

Frequency (Hz)

POWER-SUPPLY REJECTION vs FREQUENCY

G = 1

G = 10

G = 100

–5

–10

–15 025 50 75 100 125

Total Output Error (%)

VIN (mV)

TOTAL OUTPUT ERROR vs VIN

150 200

–55°C

+25°C

+150°C

VIN = (VIN – VIN)

+–

–1

–2010 20 30 40

Total Output Error (%)

Power-Supply Voltage (V)

TOTAL OUTPUT ERROR

vs POWER-SUPPLY VOLTAGE

G = 1

G = 10 G = 25

Output error is essentially

independent of both

V+ supply voltage and

input common-mode voltage.

100

0010 20 30 40

Quiescent Current (µA)

Power-Supply Voltage (V)

QUIESCENT CURRENT

vs POWER-SUPPLY VOLTAGE

+150°+125°

+25°

–55°

INA170 5

SBOS193D www.ti.com

TYPICAL CHARACTERISTICS (Cont.)

At TA = +25°C, V+ = 5V, VIN

+ = 12V, RL = 25kΩ, unless otherwise noted.

STEP RESPONSE

20µs/div

1.5V

G = 100

0.5V

G = 100

STEP RESPONSE

10µs/div

G = 50

G = 10

INA170

6SBOS193D

www.ti.com

OPERATION

Figure 1 shows the basic circuit diagram for the INA170.

Load current IS is drawn from supply VS through shunt

resistor RS. The voltage drop in shunt resistor VS is forced

across RG1 by the internal op-amp, causing current to flow

into the collector of Q1. External resistor RL converts the

output current to a voltage, VOUT, at the OUT pin.

Without offset, the transfer function for the INA170 is:

IO = gm (VIN

+ – VIN

– )(1)

where gm = 1000µA/V (2)

In the circuit of Figure 1, the input voltage, (VIN

+ – VIN

– ), is

equal to IS • RS and the output voltage, VOUT, is equal to

IO • RL. The transconductance, gm, of the INA170 is

1000µA/V. The complete transfer function for the current

measurement amplifier in this application is:

VOUT = (IS) (RS) (1000µA/V) (RL)(3)

Applying a positive reference voltage to pin 3 causes a

current to flow through ROS, forcing output current IO to be

offset from zero. The transfer function then becomes:

VVR

RIRR

OUT REF L

SSL

=







±





•••

1Ω

(4)

The maximum differential input voltage for accurate mea-

surements is 0.5V, which produces a 500µA output current.

A differential input voltage of up to 2V will not cause

damage. Differential measurements (pins 1 and 2) can be

bipolar with a more-positive voltage applied to pin 2. If a

more-negative voltage is applied to pin 1, output current IO

will decrease towards zero.

BASIC CONNECTION

Figure 1 shows the basic connection of the INA170. The

input pins, VIN

+ and VIN

– , should be connected as closely as

possible to the shunt resistor to minimize any resistance in

series with the shunt resistance. The output resistor, RL, is

shown connected between pin 6 and ground. Best accuracy

is achieved with the output voltage measured directly across

RL. This is especially important in high-current systems

where load current could flow in the ground connections,

affecting the measurement accuracy.

No power-supply bypass capacitors are required for stability

of the INA170. However, applications with noisy or high

impedance power supplies may require de-coupling capaci-

tors to reject power-supply noise. Connect bypass capacitors

close to the device pins.

POWER SUPPLIES

The input circuitry of the INA170 can accurately measure

beyond its power-supply voltage, V+. For example, the V+

power supply can be 5V, while the load power-supply

voltage (INA170 input voltage) is up to +60V. However, the

output-voltage range of the OUT terminal (pin 6) is limited

by the supply.

SELECTING RS AND RL

The value chosen for the shunt resistor, RS, depends on the

application and is a compromise between small-signal accu-

racy and maximum permissible voltage loss in the measure-

ment line. High values of RS provide better accuracy at lower

FIGURE 1. Basic Circuit Connections.

Shunt

INA170

OUT

–

Load

1kΩR

1kΩ

V+

REF

V+ power can be

common or

independent of

load supply.

2.7 ≤ (V+) ≤ 40V

Load Power Supply

+2.7 to 60V

+–

VOLTAGE GAIN EXACT RL (Ω) NEAREST 1% RL (Ω)

11k 1k

22k 2k

5 5k 4.99k

10 10k 10k

20 20k 20k

50 50k 49k

100 100k 100k

INA170 7

SBOS193D www.ti.com

currents by minimizing the effects of offset, while low values

of RS minimize voltage loss in the supply line. For most

applications, best performance is attained with an RS value

that provides a full-scale shunt voltage of 50mV to 100mV.

Maximum input voltage for accurate measurements is 500mV.

RL is chosen to provide the desired full-scale output voltage.

The output impedance of the INA170 Out terminal is very

high which permits using values of RL up to 100kΩ with

excellent accuracy. The input impedance of any additional

circuitry at the output should be much higher than the value

of RL to avoid degrading accuracy.

Some Analog-to-Digital (A/D) converters have input imped-

ances that will significantly affect measurement gain. The

input impedance of the A/D converter can be included as

part of the effective RL if its input can be modeled as a

resistor to ground. Alternatively, an op-amp can be used to

buffer the A/D converter input, as shown in Figure 2. See

Figure 1 for recommended values of RL.

OUTPUT VOLTAGE RANGE

The output of the INA170 is a current, which is converted to

a voltage by the load resistor, RL. The output current remains

accurate within the compliance voltage range of the output

circuitry. The shunt voltage and the input common-mode

and power supply voltages limit the maximum possible

output swing. The maximum output voltage compliance is

limited by the lower of the two equations below:

Vout max = (V+) – 0.7V – (VIN

+ – VIN

–)(5)

Vout max = VIN

–

– 0.5V (6)

(whichever is lower)

BANDWIDTH

Measurement bandwidth is affected by the value of the load

resistor, RL. High gain produced by high values of RL will

yield a narrower measurement bandwidth (see Typical Char-

acteristic Curves). For widest possible bandwidth, keep the

capacitive load on the output to a minimum.

If bandwidth limiting (filtering) is desired, a capacitor can be

added to the output, as shown in Figure 3. This will not

cause instability.

APPLICATIONS

The INA170 is designed for current shunt measurement

circuits as shown in Figure 1, but its basic function is useful

in a wide range of circuitry. A creative engineer will find

many unforeseen uses in measurement and level shifting

circuits.

FIGURE 4. Offsetting the Output Voltage.

FIGURE 2. Buffering Output to Drive A/D Converter. FIGURE 3. Output Filter.

OPA340

INA170

Buffer of amp drives A/D converter

without affecting gain.

INA170 f

–3dB

= 1

2πR

–3dB

VREF

Gain Set by RL

Output Offset Current = VREF

ROS

Output Offset Voltage = • RL

VREF

ROS

INA170

ROS

INA170

8SBOS193D

www.ti.com

FIGURE 5. Bipolar Current Measurement.

Load

VREF

0.0125Ω

GND

ROS

OUT

V+

INA170

28V

+2.5V

IS = ±10A

IOS = 125µA

IO = 125µA ± 125µA

VOUT = 0 to +2.5V Full-Scale

20kΩ

10kΩ

+5V

0.1µF

∆V =

±125mV

Full-Scale

VIN

–

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

INA170EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

INA170EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

INA170EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

INA170EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

INA170EA/250 VSSOP DGK 8 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

INA170EA/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

INA170EA/250 VSSOP DGK 8 250 366.0 364.0 50.0

INA170EA/2K5 VSSOP DGK 8 2500 366.0 364.0 50.0

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Pack Materials-Page 2

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