Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
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- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
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Team Nexperia
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74F367
Hex buffer/driver
Product data
Replaces Product specification 74F365/74F367 of 2000 Jun 30 2004 Jan 30
INTEGRATED CIRCUITS
Philips Semiconductors Product data
74F367Hex buffer/driver
2
2004 Jan 30
FEATURES
High-impedance NPN base inputs for reduced loading
(20 µA in HIGH and LOW states)
High-speed
Bus oriented
3-State buf fer outputs sink 64 mA
TYPE TYPICAL
PROPAGATION DELAY
TYPICAL
SUPPLY CURRENT
(TOTAL)
74F367 5.0 ns 36 mA
ORDERING INFORMATION
COMMERCIAL RANGE: V
CC
= 5 V
±
10%; T
amb
= 0
°
C to +70
°
C
Type number Package
Name Description Version
N74F367N DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
N74F367D SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINS DESCRIPTION 74F(U.L.)
HIGH / LOW LOAD VALUE
HIGH / LOW
I0 - I5 Inputs 1.0 / 0.033 20 µA / 20 µA
OE0, OE1Output enable inputs (active-LOW) 1.0 / 0.033 20 µA / 20 µA
Y0 - Y5 Data Outputs 750 / 106.7 15 mA / 64 mA
NOTE: One (1.0) FAST Unit Load (U.L.) is defined as: 20 µA in the HIGH state and 0.6 mA in the LOW state.
PIN CONFIGURATION
16
15
14
13
12
11
10
98
7
6
5
4
3
2
1
OE1
I0
Y0
I1
Y1
I2
Y2
GND
I5
Y5
I4
Y4
I3
Y3
VCC
OE0
74F367
SF00905
Philips Semiconductors Product data
74F367
Hex buffer/driver
2004 Jan 30 3
LOGIC SYMBOL
1064
VCC = Pin 16
GND = Pin 8
SF00906
53
1 OE0
15
2 1412
OE1
Y0 Y1
I0 I1 I2 I3 I4 I5
Y2 Y3 Y4 Y5
97 1311
74F367
LOGIC SYMBOL (IEEE/IEC)
SF00907
2
4
14
6
EN1
10
12
1
15
3
5
13
7
9
11
74F367
1
2
EN2
LOGIC DIAGRAM
OE0
Y0
Y1
Y2
Y3
Y4
Y5
I0
I1
I2
I3
I4
I5
OE1
3
5
7
9
11
13
1
2
4
6
10
15
12
14
74F367
VCC = Pin 16
GND = Pin 8
SF01442
FUNCTION TABLE
INPUTS OUTPUTS
OEn In Yn
L L L
L H H
H X Z
H = HIGH voltage level
L = LOW voltage level
X = Don’t care
Z = High impedance “of f” state
Philips Semiconductors Product data
74F367
Hex buffer/driver
2004 Jan 30 4
ABSOLUTE MAXIMUM RATINGS
Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.
SYMBOL PARAMETER RATING UNIT
VCC Supply voltage range –0.5 to +7.0 V
VIN Input voltage range –0.5 to +7.0 V
IIN Input current range –30 to +5 mA
VOUT Voltage applied to output in HIGH output state range –0.5 to 5.5 V
IOUT Current applied to output in LOW output state 128 mA
Tamb Operating free-air temperature range 0 to +70 °C
Tstg Storage temperature range –65 to +150 °C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS UNIT
SYMBOL
PARAMETER
MIN TYP MAX
VCC Supply voltage 4.5 5.0 5.5 V
VIH HIGH-level input voltage 2.0 V
VIL LOW-level input voltage 0.8 V
IIK Input clamp current –18 mA
IOH HIGH-level output current –15 mA
IOL LOW-level output current 64 mA
Tamb Operating free-air temperature range 0 70 °C
Philips Semiconductors Product data
74F367
Hex buffer/driver
2004 Jan 30 5
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
SYMBOL
PARAMETER
TEST CONDITIONS1
LIMITS UNIT
SYMBOL
PARAMETER
TEST
CONDITIONS1
MIN TYP2MAX
V
CC
= MIN; VIL = MAX; ± 10% VCC 2.4 V
VO
HIGH level out
p
ut voltage
CC IL
VIH = MIN; IOH = –3 mA ± 5% VCC 2.7 3.3 V
V
OH
HIGH
-
le
v
el
o
u
tp
u
t
v
oltage
V
CC
= MIN; VIL = MAX; ± 10% VCC 2.0 V
CC IL
VIH = MIN; IOH = –15 mA ± 5% VCC 2.0 V
VO
Low level out
p
ut voltage
V
CC
= MIN; VIL = MAX; ± 10% VCC 0.55 V
V
OL
Lo
w-
le
v
el
o
u
tp
u
t
v
oltage
CC IL
VIH = MIN; IOL = MAX ± 5% VCC 0.42 0.55 V
VIK Input clamp voltage VCC = MIN; II = IIK –0.73 –1.2 V
IIInput current at maximum input voltage VCC = 0 V; VI = 7.0 V 100 µA
IIH HIGH-level input current VCC = MAX; VI = 2.7 V 20 µA
IIL LOW-level input current VCC = MAX; VI = 0.5 V –20 µA
IOZH Off-state output current,
HIGH-level voltage applied VCC = MAX; VO = 2.7 V 50 µA
IOZL Off-state output current,
LOW-level voltage applied VCC = MAX; VO = 0.5 V –50 µA
IOS Short-circuit output current3VCC = MAX –100 –225 mA
ICCH 25 35 mA
ICC Supply current (total) ICCL VCC = MAX 47 62 mA
ICCZ 35 48 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5 V, Tamb = 25 °C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a HIGH output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests.
In any sequence of parameter tests, IOS tests should be performed last.
AC ELECTRICAL CHARACTERISTICS
LIMITS
Tamb = +25 °C Tamb = –55 °C to +125 °C
SYMBOL PARAMETER TEST CONDITIONS VCC = +5.0 V VCC = +5.0 V ± 10% UNIT
CL = 50 pF; RL = 500 CL = 50 pF; RL = 500
MIN TYP MAX MIN MAX
tPLH
tPHL Propagation delay
In to YnW aveform 1 2.5
2.5 4.5
5.5 6.5
7.0 2.0
2.0 7.0
7.5 ns
ns
tPZH
tPZL Output Enable time
to HIGH or LOW level Waveform 2
W aveform 3 3.0
3.0 5.5
6.5 7.5
8.5 3.0
3.0 8.5
9.0 ns
ns
tPHZ
tPLZ Output Disable time
from HIGH to LOW level W aveform 2
W aveform 3 2.0
2.0 4.5
4.0 6.5
6.5 2.0
2.0 7.0
7.0 ns
ns
Philips Semiconductors Product data
74F367
Hex buffer/driver
2004 Jan 30 6
AC WAVEFORMS
For all waveforms, VM = 1.5 V
VM
VMVM
VM
tPHL
tPLH
In
Yn
SF00914
W aveform 1. For non-inverting outputs
VM
VM
VM
tPHZ
tPZH
OE
Yn
VOH – 0.3 V
0 V
SF00913
W aveform 2. 3-State Output Enable time to HIGH level and
Output Disable time from HIGH level
VM
VM
VM
tPLZ
tPZL
VOL + 0.3 V
OE
3.5 V
Yn
SF00915
W aveform 3. 3-State Output Enable time to LOW level
and Output Disable time from LOW level
TEST CIRCUIT AND WAVEFORM
tw90%
VM
10%
90%
VM10%
90%
VM10%
90%
VM
10%
NEGATIVE
PULSE
POSITIVE
PULSE
tw
AMP (V)
0 V
0 V
tTHL (tf )
INPUT PULSE REQUIREMENTS
rep. rate twtTLH tTHL
1 MHz 500 ns 2.5 ns 2.5 ns
Input Pulse Definition
VCC
family
74F
D.U.T.
PULSE
GENERATOR
RL
CL
RT
VIN VOUT
Test Circuit for 3-State Outputs
DEFINITIONS:
RL= Load resistor;
see AC electrical characteristics for value.
CL= Load capacitance includes jig and probe capacitance;
see AC electrical characteristics for value.
RT= Termination resistance should be equal to ZOUT of
pulse generators.
tTHL (tf )
tTLH (tr )
tTLH (tr )AMP (V)
amplitude
3.0 V 1.5 V
VM
RL
7.0 V
SF00777
TEST SWITCH
tPLZ closed
tPZL closed
All other open
SWITCH POSITION
Philips Semiconductors Product data
74F367
Hex buffer/driver
2004 Jan 30 7
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
Philips Semiconductors Product data
74F367
Hex buffer/driver
2004 Jan 30 8
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
Philips Semiconductors Product data
74F367
Hex buffer/driver
2004 Jan 30 9
REVISION HISTORY
Rev Date Description
_4 20040130 Product data (9397 750 12742). 853-0042 ECN 01-A15335 of 21 January 2004.
Replaces 74F365_74F367_3 dated 2000 Jun 30 (9397 750 07283).
Modifications:
Delete all references to 74F365 (product discontinued).
_3 20000630 Product specification (9397 750 07283). ECN 853-0042 24024 of 30 June 2000.
Supersedes data of 1999 Jan 08.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Koninklijke Philips Electronics N.V. 2004
All rights reserved. Printed in U.S.A.
Date of release: 01-04
Document order number: 9397 750 12742
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Data sheet status[1]
Objective data
Preliminary data
Product data
Product
status[2] [3]
Development
Qualification
Production
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Level
I
II
III