This product complies with the RoHS Directive (EU 2002/95/EC). Luminance Sensor PNA4K01F Bipolar Integrated Circuit with Photodetection Function For brightness control systems Features M Di ain sc te on na tin nc ue e/ d Peak sensitivity wavelength: 560 nm Output ratio of incandescent light and fluorescent light: 1.1 (typ.) Small, thin type package: 1.55 mm 1.5 mm 0.53 mm Surface-mouting type for reflow soldering Absolute Maximum Ratings Ta = 25 C Operating supply voltage Symbol Rating Unit VCC - 0.5 to +7.0 V Power dissipation PD Operating ambient temperature Topr Storage temperature Tstg di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. Parameter 35 mW -30 to +85 C -40 to +100 C Electro-Optical Characteristics Ta = 25 C 3 C, VCC = 3 V Parameter Symbol Operating supply voltage VCC Saturation voltage *3 Conditions VO(sat) EV = 100 lx, RL = 100 k ICC EV = 1 000 lx, RL = 1 k Output current 1 *1, *3 IO1 Output current 2 *2, *3 IO2 Output current 3 *2, *3 IO3 isc ce /D Rise time *4 an Fall time *4 Ma int en Delay time *4 PD tr tf td ts Max Unit 5.5 V 2.94 3.00 V 480 920 A EV = 100 lx 29 48 90 A EV = 10 lx 2.5 4.3 7.9 A EV = 100 lx 25 43 79 A 1.10 1.65 10 100 ue on tin ID Peak sensitivity wavelength Storage time *4 2.60 IO1 / IO3 Drain current Typ 1.4 Supply current *1 Output current ratio Min EV = 0 lx RL = 5.1 k Note) *1: Light source is CIE standard A light source. (Incandescent lamp) *2: Light source is fluorescence light. *3: Output current measurement circuit 560 nA nm 30 1 000 s 230 1 000 s 110 s 8 s VCC Light source IOUT PNA4K01F A *4: Switching time measurement method LED pulse VCC White LED PNA4K01F IOUT 90% 10% RL td Publication date: October 2008 SHE00061BEK tr tf ts 1 2 an en ue on tin isc ce /D di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. int Ma M Di ain sc te on na tin nc ue e/ d This product complies with the RoHS Directive (EU 2002/95/EC). PNA4K01F Block Diagram VCC 1 Current Amp SHE00061BEK 6 IOUT GND 2, 3, 4, 5 Pin name 1: VCC 2: GND 3: GND 4: GND 5: GND 6: IOUT int an en ue on tin isc ce /D di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. Ma M Di ain sc te on na tin nc ue e/ d This product complies with the RoHS Directive (EU 2002/95/EC). PNA4K01F Package (Unit: mm) KPTFTN6K0001 SHE00061BEK 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. - Any applications other than the standard applications intended. d pla inc ne lud se pla m d m es ne ain ain foll htt visit d d te te ow p:/ fo d /w llo is isc nan nan ing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i / on . (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. Pl ea Ma int en an ce /D isc on tin ue 20080805