MMA3204KEG - NXP SEMICONDUCTORS - Datasheet.Directory

Freescale Semiconductor Inc

PART INFORMATION

Mfg Item Number MMA3204D

Mfg Item Name SENSOR 20SOICW ACCEL

SUPPLIER

Company Name Freescale Semiconductor Inc

Company Unique ID 14-141-7928

Response Date 2014-10-10

Response Document ID 0271K50010S111A1.22

Contact Name Freescale Semiconductor Inc

Contact Title Product Technical Support

Contact Phone 1-800-521-6274

Contact Email support@freescale.com

Authorized Representative Daniel Binyon

Representative Title EPP Customer Response

Representative Phone 512-895-3406

Representative Email eppanlst@freescale.com

URL for Additional Information www.freescale.com

DECLARATION

EU RoHS No

Pb Free No

HalogenFree No

Plating Indicator e0

EU RoHS Exemption(s) 7c-I

MANUFACTURING

Mfg Item Number MMA3204D

Mfg Item Name SENSOR 20SOICW ACCEL

Version ALL

Weight 0.761400

UoM g

Unit Volume EACH

J-STD-020 MSL Rating 3

Peak Processing Temperature 245 C

Max Time at Peak Temperature 30 seconds

Number of Processing Cycles 3

RoHS

RoHS Directive 2011/65/EU

RoHS Definition RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),

Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium

RoHS Legal Definition Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states)

of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS

restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess

of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the

declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy

and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company

will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company

acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such

information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have

provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company

and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or

remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding

information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of

Sale applicable to such part(s) shall apply.

RoHS Declaration 3 - Item(s) does not contain RoHS restricted substances per the definition above except for lead in solders and selected exemptions, if any

Supplier Acceptance Accepted

Signature Daniel Binyon

Exemption List Version 2012/51/EU

7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or

ceramic matrix compound

List of Freescale Accepted

Exemptions 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight

6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight

6(c) : Copper alloy containing up to 4% lead by weight

7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)

7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for

telecommunications

7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or

ceramic matrix compound

7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher

7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC

7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors

15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

MATERIAL COMPOSITION

Homogeneous Material Weight SubstanceClass Substance CAS Exemption SubstanceWeight UoM SubPart

PPM SubPart% ARTICLEPPM ARTICLE%

Die Overcoat 0.0064 g

Die Overcoat Solvents, additives, and other materials Other organic Silicon Compounds - 0.00060178 g 94028 9.4028 790 0.079

Die Overcoat Plastics/polymers Plastic: SI - Silicone Rubber - 0.00417866 g 652916 65.2916 5488 0.5488

Die Overcoat Glass Silica, vitreous 60676-86-0 0.00161956 g 253056 25.3056 2127 0.2127

Epoxy Die Attach 0.0022 g

Epoxy Die Attach Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000001 g 3 0.0003 0 0

Epoxy Die Attach Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00030303 g 137740 13.774 397 0.0397

Epoxy Die Attach Lead/Lead Compounds Lead 7439-92-1 0.00000002 g 7 0.0007 0 0

Epoxy Die Attach Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00006667 g 30303 3.0303 87 0.0087

Epoxy Die Attach Metals Silver, metal 7440-22-4 0.00183027 g 831947 83.1947 2403 0.2403

Non-Conductive Epoxy/Adhesive 0.002 g

Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Silicone gum 67762-94-1 0.00002065 g 10324 1.0324 27 0.0027

Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Siloxanes and Silicones, di-Me, Me vinyl, vinyl group-

terminated 68083-18-1 0.00024582 g 122911 12.2911 322 0.0322

Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Siloxanes and silicones, di-Me, vinyl group-terminated 68083-19-2 0.00078662 g 393313 39.3313 1033 0.1033

Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Proprietary Material-Other siloxanes and silicones - 0.00044248 g 221239 22.1239 581 0.0581

Non-Conductive Epoxy/Adhesive Glass D4 and HMDZ treated Silicon Dioxide 68937-51-9 0.00029499 g 147493 14.7493 387 0.0387

Non-Conductive Epoxy/Adhesive Glass Silica, crystalline - quartz (SiO2) 14808-60-7 0.00018682 g 93412 9.3412 245 0.0245

Non-Conductive Epoxy/Adhesive Metals Titanium (IV) Oxide 13463-67-7 0.00002262 g 11308 1.1308 29 0.0029

Copper Lead Frame 0.2007 g

Copper Lead Frame Metals Copper, metal 7440-50-8 0.19346576 g 963955 96.3955 254092 25.4092

Copper Lead Frame Solvents, additives, and other materials Phosphorus 7723-14-0 0.00016558 g 825 0.0825 217 0.0217

Copper Lead Frame Metals Iron, metal 7439-89-6 0.00471645 g 23500 2.35 6194 0.6194

Copper Lead Frame Lead/Lead Compounds Lead 7439-92-1 0.00003412 g 170 0.017 44 0.0044

Copper Lead Frame Metals Silver, metal 7440-22-4 0.002007 g 10000 1 2635 0.2635

Copper Lead Frame Metals Tin, metal 7440-31-5 0.00006021 g 300 0.03 79 0.0079

Copper Lead Frame Metals Zinc, metal 7440-66-6 0.00025088 g 1250 0.125 329 0.0329

Bonding Wire 0.0025 g

Bonding Wire Metals Gold, metal 7440-57-5 0.0025 g 1000000 100 3283 0.3283

Bonding Wire 0.0025 g

Bonding Wire Metals Gold, metal 7440-57-5 0.0025 g 1000000 100 3283 0.3283

Lead Frame Plating 0.0099 g

Lead Frame Plating Lead/Lead Compounds Lead 7439-92-1 0.000495 g 50000 5 650 0.065

Lead Frame Plating Metals Tin, metal 7440-31-5 0.009405 g 950000 95 12352 1.2352

Pb Glass Frit Semiconductor Di 0.012 7c-I g

Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00012457 g 10381 1.0381 163 0.0163

Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.00011932 g 9943 0.9943 156 0.0156

Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.00011932 g 9943 0.9943 156 0.0156

Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.01163679 g 969733 96.9733 15283 1.5283

Silicon Semiconductor Die 0.0132 g

Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000264 g 20000 2 346 0.0346

Silicon Semiconductor Die Glass Silicon, doped - 0.012936 g 980000 98 16989 1.6989

Die Encapsulant 0.51 g

Die Encapsulant Antimony/Antimony Compounds Antimony trioxide 1309-64-4 0.0152694 g 29940 2.994 20054 2.0054

Die Encapsulant Flame Retardants Bromophenol, formaldehyde, epichlorohydrin polymer 68541-56-0 0.0152694 g 29940 2.994 20054 2.0054

Die Encapsulant Plastics/polymers Other Epoxy resins - 0.0381735 g 74850 7.485 50135 5.0135

Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.0025449 g 4990 0.499 3342 0.3342

Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.0152694 g 29940 2.994 20054 2.0054

Die Encapsulant Glass Silica, vitreous 60676-86-0 0.4234734 g 830340 83.034 556194 55.6194

LINKS

MCD LINK

Freescale website http://www.freescale.com

GENERAL ENVIRONMENTAL

COMPLIANCE LINKS

RoHS signed letter http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf

China RoHS http://www.freescale.com/chinarohs

REACH signed letter http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf

ELV signed letter http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf

Conflict Minerals statement http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf

FREESCALE ENVIRONMENTAL

INFORMATION

EPP website http://www.freescale.com/epp

FAQ http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ

Technical Service Request https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod

LINKS TO BLANK IPC1752

FORMS

Blank IPC1752 v1.1 Form http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf

IPC1752 XML LINKS

http://www.freescale.com/mcds/MMA3204D_IPC1752_v11.xml

http://www.freescale.com/mcds/MMA3204D_IPC1752A.xml