Product Specification - Feb. 13, 2003 V.04 Supersedes Date of Dec. 02, 2002 DATA SHEET CHIP RESISTORS RC2010 5%; 1% 2 Chip Resistor Surface Mount RC SERIES 7 2010 SCOPE This specification describes RC 2010 series chip resistors made by thick film process. ORDERING INFORMATION Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and resistance value. RC2010 X X X XX XXXX (1) (2) (3) (4) (5) MARKING RC2010 (1) TOLERANCE F = 1% J = 5% (2) PACKAGING TYPE E-24 series: 3 digits ynsc001 Fig. 1 Value=10K First two digits for significant figure and 3rd digit for number of zeros R = Embossed taping reel (3) TEMPERATURE CHARACTERISTIC OF RESISTANCE Both E-24 and E-96 series: 4 digits ynsc001 F = 100ppm/C G = 200ppm/C Fig. 2 Value=10K First three digits for significant figure and 4th digit for number of zeros I = 300ppm/C - = Base on spec (4) SPECIAL TYPE 07 = 7 inch dia. Reel (5) RESISTANCE VALUE: R056, R56, 5R6, 56R, 560R, 5K6, 56K, 56M. CONSTRUCTION The resistors are constructed out of a high-grade ceramic body. Internal metal electrodes are added at each end and connected by a resistive paste. The composition of the paste is adjusted to give the approximate required resistance and laser cutting of this resistive layer that achieves tolerance trims the value. The resistive layer is covered with a protective coat and printed with the resistance value. Finally, the two external terminations are added. See fig. 3 protective coat book, 4 columns resistor layer inner electrode H end termination I2 ceramic substrate MBE940_a Fig. 3 Chip resistor construction www.yageo.com Feb. 13, 2003 V.04 3 Chip Resistor Surface Mount RC 7 2010 SERIES DIMENSION Table 1 For dimension see Table 1 TYPE RC2010 L (mm) 5.000.10 W (mm) 2.500.15 H (mm) 0.550.10 I1 (mm) 0.450.15 I2 (mm) 0.500.20 protective coat I1 W MBE940_a L Fig. 4 Chip resistor dimension POWER RATING ELECTRICAL CHARACTERISTICS Table 2 RATED POWER AT 70C, RC2010 3/4W CHARACTERISTICS Operating Temperature Range MRA632 lumns Pmax (%Prated ) 100 50 55 0 50 70 100 o Tamb ( C) 200V Maximum Overload Voltage 400V Dielectric Withstanding Voltage 500V 155 Fig. 5 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb) -55C to +155C Maximum Working Voltage Resistance Range 0 RC2010 3/4 W Temperature Coefficient 1 to 22M (E24) 1 to 4.7M (E96) Zero Ohm Jumper<0.05 100ppm/C (10<R10M) 200ppm/C (1R<10, R>10M) RATED VOLTAGE: The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V=(P X R) Where V=Continuous rated DC or AC (rms) working voltage (V) P=Rated power (W) R=Resistance value (X) www.yageo.com Feb. 13, 2003 V.04 4 Chip Resistor Surface Mount RC SERIES 7 2010 TAPING REEL Table 3 DIMENSION For dimension see Table 3 RC2010 Tape Width T idth 12mm OA (mm) 180+0/-3 OB (mm) 60+1/-0 OC (mm) 13.00.2 W (mm) 13.00.3 Tmax (mm) 21 0.8 15.41 Fig. 6 Reel dimension C W B A MSA284_a EMBOSSED TAPE SPECIFICATION Table 4 DIMENSION RC2010 A (mm) 2.800.2 B (mm) 5.40.2 W (mm) 120.2 E (mm) 1.750.1 F (mm) 5.50.05 P0 (mm) 4.00.1 P1 (mm) 4.00.1 P2 (mm) 2.00.05 P0 P2 D0 E F W B T A MBD123_a P1 1.5+0.1/-0 OD0 (mm) OD1 (mm) Tmax (mm) 1.5+0.25/-0 Fig. 7 Embossed tape dimension 4.5 For dimension see Table 4 PACKING METHOD LEADER/TRAILER TAPE SPECIFICATION leader end empty compartments with cover tape (min. 240 mm) trailer end cover tape only leader 400 mm trailer (max. 260 mm) CCB325 Fig. 8 Leader and trailer tape dimension Table 5 Packing style and packaging quantity PACKING STYLE Embossed Taping Reel (R) REEL DIMENSION RC2010 7" (178 mm) 4,000 www.yageo.com Feb. 13, 2003 V.04 5 Chip Resistor Surface Mount TYPE RC SERIES 7 2010 TEST METHOD Temperature Coefficient of Resistance (T.C.R.) Measure resistance at +25C or specified room temperature as R1, then measure at -55C or +125C respectively as R2. Determine the temperature coefficient of resistance from the following formula: Thermal Shock ACCEPTANCE STANDARD Formula Refer to table 2 R2-R1 T.C.R. = ------------------------- x106 (ppm/C) R1(t2-t1) Where t1=+25C or specified room temperature t2=-55C or +125C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms At -553C for 2 minutes and at +1252C for 2 minutes as one cycle. After 5 cycles, the specimen shall be stabilized at room temp. (0.5%+0.05) for 1% tol. (1%+0.05) for 5% tol. Measure the resistance to determine R/R(%) after one more hour. Low Temperature Operation Place the specimen in a test chamber maintained at -65 (+0/-5)C. After one hour stabilization at this temperature, full rated working voltage shall be applied for 45 (+5/-0) minutes. Have15 (+5/-0 ) minutes after remove the voltage, the specimen shall be removed from the chamber and stabilized at room temperature for 24 hrs. (0.5%+0.05) for 1% tol . (1.0%+0.05) for 5% tol. No visible damage Measure the resistance to determine R/R(%). Short Time Overload Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. Measure the resistance to determine R/R(%). Insulation Resistance Place the specimen in the jig and apply a rated continues overload voltage (R.C.O.V) for one minute as shown. Type Voltage RC2010 (1.0%+0.05) for 1% tol. (2.0%+0.05) for 5% tol. No visible damage 10,000M 400V Measure the insulation resistance. Dielectric Withstand Voltage Resistance To Soldering Heat Place the specimen in the jig and apply a specified value continuous overload voltage as shown for one minute. Type Voltage RC2010 500V Breakdown voltage> specification and without open/short (0.5%+0.05) for 1% tol. Immerse the specimen in the solder pot at 2605C. for 101 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. (1.0%+0.05) for 5% tol. Measure the resistance to determine R/R(%). No visible damage www.yageo.com Feb. 13, 2003 V.04 6 Chip Resistor Surface Mount TYPE Moisture Resistance RC SERIES 7 2010 TEST METHOD ACCEPTANCE STANDARD Place the specimen in the test chamber and subject to 42 damp heat cycles. Each one of which consists of the steps 1 to 7 as figure 10. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for 24 hours after testing. (2.0%+0.05) for 5% tol. (0.5%+0.05) for 1% tol. No visible damage Measure the resistance to determine R/R(%). Life Place the specimen in the oven at 702C. Apply the rated voltage to the specimen at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for one hour minimum after testing. (1%+0.05) for 1% tol. (3%+0.05) for 5% tol. No visible damage Measure the R/R(%). Solderability Bending Strength Immerse the specimen in the solder pot at 2305C for 2 sec. Mount the specimen on a test board as shown in the figure 9. Slowly apply the force till the board is bent for 51 sec. Type At least 95% solder coverage on the termination RC2010 Bent Distance (d) 2mm Measure the R/R(%) at this position. Fig. 9 (1.0%+0.05) for 1% tol. (1.0%+0.05) for 5% tol. No visible damage Principle of the bending test www.yageo.com Feb. 13, 2003 V.04 7 Chip Resistor Surface Mount 75 RC 80 - 98% RH 90 - 98% RH temperature [C] SERIES 7 2010 90 - 98% RH 80 - 98% RH 90 - 98% RH initial drying 24 hours rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes 50 end of final cycle; measurements as specified in 2.7 +10 C (+18 F) -2 C (-3.6 F) 25 initial measurements as specified in 2.2 0 temperature tolerance 2 C (3.6 F) unless otherwise specified voltage applied as specified in 2.4 STEP1 STEP2 prior to first cycle only HBK073 optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber STEP3 STEP4 STEP5 STEP6 STEP7 one cycle 24 hours; repeat as specified in 2.5 0 5 10 15 20 25 time [h] Fig. 10 Conditions by change of temperature www.yageo.com Feb. 13, 2003 V.04