micro
Power, Rail-to-Rail
Operational Amplifiers
FEATURES
● LOW IQ: 20µA
●
micro
SIZE PACKAGES: WCSP-8, SC70-5
SOT23-5, SOT23-8, and TSSOP-14
● HIGH SPEED/POWER RATIO WITH
BANDWIDTH: 350kHz
● RAIL-TO-RAIL INPUT AND OUTPUT
● SINGLE SUPPLY: 2.3V to 5.5V
APPLICATIONS
● PORTABLE EQUIPMENT
● BATTERY-POWERED EQUIPMENT
● 2-WIRE TRANSMITTERS
● SMOKE DETECTORS
● CO DETECTORS
DESCRIPTION
The OPA347 is a
micro
Power, low-cost operational amplifier
available in
micro
packages. The OPA347 (single version) is
available in the SC-70 and SOT23-5 packages. The OPA2347
(dual version) is available in the SOT23-8 and WCSP-8
packages. Both are also available in the SO-8. The OPA347
is also available in the DIP-8. The OPA4347 (quad) is
available in the SO-14 and the TSSOP-14.
The small size and low power consumption (34µA per chan-
nel maximum) of the OPA347 make it ideal for portable and
battery-powered applications. The input range of the OPA347
extends 200mV beyond the rails, and the output range is
within 5mV of the rails. The OPA347 also features an
excellent speed/power ratio with a bandwidth of 350kHz.
The OPA347 can be operated with a single or dual power
supply from 2.3V to 5.5V. All models are specified for
operation from –55°C to +125°C.
®
OPA347
OPA347
OPA2347
OPA4347
OPA347
1
2
3
5
4
V+
–In
Out
V–
+In
OPA347
SOT23-5
1
2
3
4
8
7
6
5
NC
V+
Out
NC
NC
–In
+In
V–
OPA347
SO-8, DIP-8
1
2
3
4
8
7
6
5
V+
Out B
–In B
+In B
Out A
–In A
+In A
V–
OPA2347
SOT23-8, SO-8
A
B
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Out D
–In D
+In D
V–
+In C
–In C
Out C
Out A
–In A
+In A
V+
+In B
–In B
Out B
OPA4347
TSSOP-14, SO-14
AD
BC
OPA347
OPA2347
OPA4347
SBOS167D – NOVEMBER 2000– REVISED JULY 2007
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2000-2007, Texas Instruments Incorporated
1
2
3
5
4
V+
Out
+In
V–
–In
OPA347
SC70-5
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
1
2
3
4
1
8
7
6
5
V+
Out B
–In B
+In B
Out A
–In A
+In A
V–
OPA2347
(bump side down)
Not to Scale
WCSP-8
(top view)
OPA347, 2347, 4347
2SBOS167D
www.ti.com
PACKAGE PACKAGE
PRODUCT PACKAGE/LEAD DESIGNATOR MARKING
OPA347NA SOT23-5 DBV A47
""""
OPA347PA DIP-8 P OPA347PA
OPA347UA SO-8 D OPA347UA
""""
OPA347SA SC-70 DCK S47
""""
OPA2347EA SOT23-8 DCN B47
""""
OPA2347UA SO-8 D OPA2347UA
""""
OPA2347YED WCSP-8 YED YMD CCS
""""
OPA2347YZDR Lead-Free WCSP-8 YZD A9
OPA4347EA TSSOP-14 PW OPA4347EA
""""
OPA4347UA SO-14 D OPA4347UA
""""
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com.
PACKAGE/ORDERING INFORMATION(1)
Supply Voltage, V+ to V–................................................................... 7.5V
Signal Input Terminals, Voltage(2) .................. (V–) – 0.5V to (V+) + 0.5V
Current(2) .................................................... 10mA
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................–65°C to +150°C
Storage Temperature .....................................................–65°C to +150°C
Junction Temperature...................................................................... 150°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only. Functional opera-
tion of the device at these conditions, or beyond the specified operating
conditions, is not implied. (2) Input terminals are diode-clamped to the
power-supply rails. Input signals that can swing more than 0.5V beyond the
supply rails should be current-limited to 10mA or less. (3) Short-circuit to
ground, one amplifier per package.
ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper
handling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
OPA347, 2347, 4347 3
SBOS167D www.ti.com
OPA347NA, UA, PA, SA
OPA2347EA, UA, YED
OPA4347EA, UA
ELECTRICAL CHARACTERISTICS: VS = 2.5V to 5.5V
Boldface limits apply over the specified temperature range, TA = –55°C to +125°C.
At TA = +25°C, RL = 100kΩ connected to VS/2 and VOUT = VS/2, unless otherwise noted.
NOTE: (1) Input bias current for the OPA2347YED package is specified in the absence of light. See the Photosensitivity section for further detail.
PARAMETER CONDITION MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage VOS VS = 5.5V, VCM = (V–) + 0.8V 2 6 mV
over Temperature 27 mV
Drift dVOS/dT 3 µV/°C
vs Power Supply PSRR VS = 2.5V to 5.5V, VCM < (V+) – 1.7V 60 175 µV/V
over Temperature VS = 2.5V to 5.5V, VCM < (V+) – 1.7V 300 µV/V
Channel Separation, DC 0.3 µV/V
f = 1kHz 128 dB
INPUT VOLTAGE RANGE
Common-Mode Voltage Range VCM (V–) – 0.2 (V+) + 0.2 V
Common-Mode Rejection Ratio CMRR
VS = 5.5V, (V–) – 0.2V < VCM < (V+) – 1.7V
70 80 dB
over Temperature VS = 5.5V, V– < VCM < (V+) – 1.7V 66 dB
Vs = 5.5V, (V–) – 0.2V < VCM < (V+) + 0.2V
54 70 dB
over Temperature Vs = 5.5V, V– < VCM < V+ 48 dB
INPUT BIAS CURRENT(1)
Input Bias Current Ib±0.5 ±10 pA
Input Offset Current IOS ±0.5 ±10 pA
INPUT IMPEDANCE
Differential 1013 || 3 Ω || pF
Common-Mode 1013 || 6 Ω || pF
NOISE VCM < (V+) – 1.7V
Input Voltage Noise, f = 0.1Hz to 10Hz 12 µVPP
Input Voltage Noise Density, f = 1kHz en60 nV/√Hz
Input Current Noise Density, f = 1kHz in0.7 fA/√Hz
OPEN-LOOP GAIN
Open-Loop Voltage Gain AOL
VS = 5.5V, RL = 100kΩ, 0.015V < VO < 5.485V
100 115 dB
over Temperature
VS = 5.5V, RL = 100k
Ω
, 0.015V < VO < 5.485V
88 dB
VS = 5.5V, RL = 5kΩ, 0.125V < VO < 5.375V
100 115 dB
over Temperature
VS = 5.5V, RL = 5k
Ω
, 0.125V < VO < 5.375V
88 dB
AOL (SC-70 only)
VS = 5.5V, RL = 5kΩ 0.125V < VO < 5.375V
96 115 dB
OUTPUT
Voltage Output Swing from Rail RL = 100kΩ, AOL > 100dB 5 15 mV
over Temperature RL = 100kΩ, AOL > 88dB 15 mV
RL = 5kΩ, AOL > 100dB 90 125 mV
over Temperature RL = 5kΩ, AOL > 88dB 125 mV
Short-Circuit Current ISC ±17 mA
Capacitive Load Drive CLOAD See Typical Characteristics
FREQUENCY RESPONSE CL = 100pF
Gain-Bandwidth Product GBW 350 kHz
Slew Rate SR G = +1 0.17 V/µs
Settling Time, 0.1% tSVS = 5V, 2V Step, G = +1 21 µs
0.01% VS = 5V, 2V Step, G = +1 27 µs
Overload Recovery Time VIN × Gain = VS23 µs
POWER SUPPLY
Specified Voltage Range VS2.5 5.5 V
Minimum Operating Voltage 2.3 V
Minimum Operating Voltage (OPA347SA) 2.4 V
Quiescent Current (per amplifier) IQIO = 0 20 34 µA
over Temperature 38 µA
TEMPERATURE RANGE
Specified Range –55 125 °C
Operating Range –65 150 °C
Storage Range –65 150 °C
Thermal Resistance
θ
JA
SOT23-5 Surface-Mount 200 °C/W
SOT23-8 Surface-Mount 150 °C/W
SO-8 Surface-Mount 150 °C/W
SO-14 Surface-Mount 100 °C/W
TSSOP-14 Surface-Mount 100 °C/W
DIP-8 100 °C/W
SC70-5 Surface-Mount 250 °C/W
WCSP 250 °C/W
OPA347, 2347, 4347
4SBOS167D
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN/PHASE vs FREQUENCY
10
Open-Loop Gain (dB)
0
–30
–60
–90
–120
–150
–180
Phase (°)
Frequency (Hz)
100 1k 10k 100k 1M
100
80
60
40
20
0
–20
POWER-SUPPLY AND COMMON-MODE
REJECTION vs FREQUENCY
10
PSRR, CMRR (dB)
Frequency (Hz)
100 1k 10k 100k 1M
100
80
60
40
20
0
CMRR
PSRR
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
Output Voltage (Vp-p)
Frequency (Hz)
1k 10k 100k 1M
6
5
4
3
2
1
0
VS = 5.5V
VS = 5.0V
VS = 2.5V
CHANNEL SEPARATION vs FREQUENCY
10
Channel Separation (dB)
Frequency (Hz)
100 1k 10k 100k 1M
140
120
100
80
60
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
0
Output Voltage (V)
Output Current (±mA)
510152025
V+
(V+) – 1
(V+) – 2
2
1
0
Sourcing
Sinking
125°C25°C
–55°C
–55°C
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
2.0
Quiescent Current (µA)
25
20
15
10
5
Short-Circuit Current (mA)
Supply Voltage (V)
2.5 3.0 3.5 4.0 4.5 5.0 5.5
30
25
20
15
10
I
Q
I
SC
OPA347, 2347, 4347 5
SBOS167D www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN AND POWER-SUPPLY
REJECTION vs TEMPERATURE
–75
A
OL
, PSRR (dB)
Temperature (°C)
–50 –25 0 25 50 75 100 125 150
130
120
110
100
90
80
70
A
OL
PSRR
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs TEMPERATURE
–75
Quiescent Current (µA)
25
20
15
10
5
Short-Circuit Current (mA)
Temperature (°C)
–50 –25 025 50 75 100 125 150
30
25
20
15
10
I
SC
I
Q
INPUT BIAS CURRENT vs TEMPERATURE
–75
Input Bias Current (pA)
Temperature (°C)
–50 –25 0 25 50 75 100 125 150
10k
1k
100
10
1
0.1
–6–5–4–3–2–10123456
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage (mV)
18
16
14
12
10
8
6
4
2
0
Percent of Amplifiers (%)
Typical production
distribution of
packaged units.
COMMON-MODE REJECTION vs TEMPERATURE
–75
Common-Mode Rejection (dB)
Temperature (°C)
–50 –25 0 25 50 75 100 125 150
100
90
80
70
60
50
40
V– < V
CM
< (V+) – 1.7V
V– < V
CM
< V+
OFFSET VOLTAGE DRIFT MAGNITUDE
PRODUCTION DISTRIBUTION
Percentage of Amplifiers (%)
Offset Voltage Drift (µV/°C)
1 2 3 4 5 6 7 8 9 101112
25
20
15
10
5
0
OPA347, 2347, 4347
6SBOS167D
www.ti.com
SMALL-SIGNAL STEP RESPONSE
G = +1V/V, RL = 100kΩ, CL = 100pF
20mV/div
10µs/div
SMALL-SIGNAL STEP RESPONSE
G = +1V/V, RL = 5kΩ, CL = 100pF
20mV/div
10µs/div
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
1
Voltage Noise (nV/√Hz)
Current Noise (fA√Hz)
Frequency (Hz)
10 100 1k 10k 100k
10k
1k
100
10
100
10
1.0
0.1
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
10
Small-Signal Overshoot (%)
Load Capacitance (pF)
100 1k 10k
60
50
40
30
20
10
0
G = +1V/V
RL = 100kΩ
G = –1V/V
RFB = 5kΩ
G = –1V/V
RFB = 100kΩ
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
10
Small-Signal Overshoot (%)
Load Capacitance (pF)
100 1k 10k
50
40
30
20
10
0
G = ±5V/V
RFB = 100kΩ
LARGE-SIGNAL STEP RESPONSE
G = +1V/V, RL = 100kΩ, CL = 100pF
500mV/div
20µs/div
OPA347, 2347, 4347 7
SBOS167D www.ti.com
APPLICATIONS INFORMATION
The OPA347 series op amps are unity-gain stable and can
operate on a single supply, making them highly versatile and
easy to use.
Rail-to-rail input and output swing significantly increases dy-
namic range, especially in low supply applications. Figure 1
shows the input and output waveforms for the OPA347 in
unity-gain configuration. Operation is from VS = +5V with a
100kΩ load connected to VS/2. The input is a 5VPP sinusoid.
Output voltage is approximately 4.995VPP.
Power-supply pins should be bypassed with 0.01µF ceramic
capacitors.
OPERATING VOLTAGE
The OPA347 series op amps are fully specified and en-
sured from 2.5V to 5.5V. In addition, many specifications
apply from –55°C to +125°C. Parameters that vary signifi-
cantly with operating voltages or temperature are shown in
the Typical Characteristics.
RAIL-TO-RAIL INPUT
The input common-mode voltage range of the OPA347
series extends 200mV beyond the supply rails. This is
achieved with a complementary input stage—an N-channel
input differential pair in parallel with a P-channel differential
pair, as shown in Figure 2. The N-channel pair is active for
input voltages close to the positive rail, typically (V+) – 1.3V
to 200mV above the positive supply, while the P-channel pair
is on for inputs from 200mV below the negative supply to
approximately (V+) – 1.3V. There is a small transition region,
typically (V+) – 1.5V to (V+) – 1.1V, in which both pairs are
on. This 400mV transition region can vary 300mV with
process variation. Thus, the transition region (both stages
on) can range from (V+) – 1.65V to (V+) – 1.25V on the low
end, up to (V+) – 1.35V to (V+) – 0.95V on the high end.
Within the 400mV transition region PSRR, CMRR, offset
voltage, and offset drift may be degraded compared to
operation outside this region. For more information on de-
signing with rail-to-rail input op amps, see Figure 3,
Design
Optimization with Rail-to-Rail Input Op Amps
.
FIGURE 2. Simplified Schematic.
FIGURE 1. Rail-to-Rail Input and Output.
VBIAS1
VBIAS2
VIN+VIN–
Class AB
Control
Circuitry VO
V–
(Ground)
V+
Reference
Current
Input
Output (inverted on scope)
5V
1V/div
0V
G = +1, V
S
= +5V
20µs/div
OPA347, 2347, 4347
8SBOS167D
www.ti.com
COMMON-MODE REJECTION
The CMRR for the OPA347 is specified in several ways so
the best match for a given application may be used. First, the
CMRR of the device in the common-mode range below the
transition region (VCM < (V+) – 1.7V) is given. This specifica-
tion is the best indicator of the capability of the device when
the application requires use of one of the differential input
pairs. Second, the CMRR at VS = 5.5V over the entire
common-mode range is specified.
INPUT VOLTAGE
The input common-mode range extends from (V–) – 0.2V to
(V+) + 0.2V. For normal operation, inputs should be limited
to this range. The absolute maximum input voltage is 500mV
beyond the supplies. Inputs greater than the input
common-mode range but less than the maximum input
voltage, while not valid, will not cause any damage to the op
amp. Furthermore, if input current is limited the inputs may go
beyond the power supplies without phase inversion, as
shown in Figure 4, unlike some other op amps.
Normally, input currents are 0.4pA. However, large inputs
(greater than 500mV beyond the supply rails) can cause
excessive current to flow in or out of the input pins. There-
fore, as well as keeping the input voltage below the maxi-
mum rating, it is also important to limit the input current to
less than 10mA. This is easily accomplished with an input
resistor, as shown in Figure 5.
FIGURE 3. Design Optimization with Rail-to-Rail Input Op Amps.
Rail-to-rail op amps can be used in virtually any op amp
configuration. To achieve optimum performance, how-
ever, applications using these special double-input-stage
op amps may benefit from consideration of their special
behavior.
In many applications, operation remains within the com-
mon-mode range of only one differential input pair. How-
ever, some applications exercise the amplifier through the
transition region of both differential input stages. A small
discontinuity may occur in this transition. Careful selection
of the circuit configuration, signal levels, and biasing can
often avoid this transition region.
DESIGN OPTIMIZATION WITH RAIL-TO-RAIL INPUT OP AMPS
With a unity-gain buffer, for example, signals will traverse
this transition at approximately 1.3V below the V+ supply
and may exhibit a small discontinuity at this point.
The common-mode voltage of the noninverting amplifier
is equal to the input voltage. If the input signal always
remains less than the transition voltage, no discontinuity
will be created. The closed-loop gain of this configuration
can still produce a rail-to-rail output.
Inverting amplifiers have a constant common-mode volt-
age equal to VB. If this bias voltage is constant, no
discontinuity will be created. The bias voltage can gener-
ally be chosen to avoid the transition region.
FIGURE 4. OPA347—No Phase Inversion with Inputs Greater
than the Power-Supply Voltage.
V
O
V
IN
V
B
V+
Noninverting Amplifier
V
CM
= V
IN
V
O
V
B
V
IN
V+
Inverting Amplifier
V
CM
= V
B
V
O
V
IN
V+
Unity-Gain Buffer
V
CM
= V
IN
= V
O
FIGURE 5. Input Current Protection for Voltages Exceeding
the Supply Voltage.
5kΩ
OPA347
10mA max
+5V
V
IN
V
OUT
I
OVERLOAD
5.5V
0V
–0.5V
200µs/div
OPA347, 2347, 4347 9
SBOS167D www.ti.com
RAIL-TO-RAIL OUTPUT
A class AB output stage with common-source transistors is
used to achieve rail-to-rail output. This output stage is ca-
pable of driving 5kΩ loads connected to any potential be-
tween V+ and ground. For light resistive loads (> 100kΩ), the
output voltage can typically swing to within 5mV from supply
rail. With moderate resistive loads (10kΩ to 50kΩ), the output
can swing to within a few tens of millivolts from the supply
rails while maintaining high open-loop gain (see the typical
characteristic Output Voltage Swing vs Output Current).
CAPACITIVE LOAD AND STABILITY
The OPA347 in a unity-gain configuration can directly drive
up to 250pF pure capacitive load. Increasing the gain en-
hances the amplifier’s ability to drive greater capacitive loads
(see the characteristic curve Small-Signal Overshoot vs
Capacitive Load). In unity-gain configurations, capacitive
load drive can be improved by inserting a small (10Ω to 20Ω)
resistor, RS, in series with the output, as shown in Figure 6.
This significantly reduces ringing while maintaining Direct
Current (DC) performance for purely capacitive loads. How-
ever, if there is a resistive load in parallel with the capacitive
load, a voltage divider is created, introducing a DC error at
the output and slightly reducing the output swing. The error
introduced is proportional to the ratio RS/RL, and is generally
negligible.
load, reducing the resistor values from 100kΩ to 5kΩ de-
creases overshoot from 40% to 8% (see the characteristic
curve Small-Signal Overshoot vs Load Capacitance). How-
ever, when large-valued resistors can not be avoided, a
small (4pF to 6pF) capacitor, CFB, can be inserted in the
feedback, as shown in Figure 7. This significantly reduces
overshoot by compensating the effect of capacitance, CIN,
which includes the amplifier input capacitance and PC board
parasitic capacitance.
FIGURE 6. Series Resistor in Unity-Gain Buffer Configura-
tion Improves Capacitive Load Drive.
10Ω to
20Ω
OPA347
V+
V
IN
V
OUT
R
S
R
L
C
L
FIGURE 7. Adding a Feedback Capacitor In the Unity-Gain
Inverter Configuration Improves Capacitative
Load.
RI
OPA347
VIN
VOUT
RF
CFB
CIN CL
DRIVING ADCs
The OPA347 series op amps are optimized for driving
medium-speed sampling Analog-to-Digital Converters (ADCs).
The OPA347 op amps buffer the ADC’s input capacitance
and resulting charge injection while providing signal gain.
See Figure 8 for the OPA347 in a basic noninverting configu-
ration driving the ADS7822. The ADS7822 is a 12-bit,
micro
Power sampling converter in the MSOP-8 package.
When used with the low-power, miniature packages of the
OPA347, the combination is ideal for space-limited, low-
power applications. In this configuration, an RC network at
the ADC input can be used to provide for anti-aliasing filter
and charge injection current.
See Figure 9 for the OPA2347 driving an ADS7822 in a
speech bandpass filtered data acquisition system. This small,
low-cost solution provides the necessary amplification and
signal conditioning to interface directly with an electret micro-
phone. This circuit will operate with VS = 2.7V to 5V with less
than 250µA typical quiescent current.
In unity-gain inverter configuration, phase margin can be
reduced by the reaction between the capacitance at the op
amp input, and the gain setting resistors, thus degrading
capacitive load drive. Best performance is achieved by using
small valued resistors. For example, when driving a 500pF
OPA347, 2347, 4347
10 SBOS167D
www.ti.com
FIGURE 8. OPA347 in Noninverting Configuration Driving ADS7822.
FIGURE 9. Speech Bandpass Filtered Data Acquisition System.
ADS7822
12-Bit ADC
DCLOCK
D
OUT
CS/SHDN
OPA347
+5V
V
IN
V+
2
+In
3
–In
V
REF
8
4GND
Serial
Interface
1
0.1µF 0.1µF
7
6
5
NOTE: ADC Input = 0V to V
REF
V
IN
= 0V to 5V for
0V to 5V output.
RC network filters high-frequency noise.
500Ω
3300pF
C
3
33pF
V+
GND
3
18
4
5
6
7
–IN
+IN
2
DCLOCK
Serial
Interface
C
2
1000pF
R
1
1.5kΩR
4
20kΩ
R
5
20kΩ
R
6
100kΩ
R
8
150kΩ
R
9
510kΩ
R
7
51kΩ
D
OUT
V
REF
V+ = +2.7V to 5V
CS/SHDN
C
1
1000pF
Electret
Microphone
(1)
G = 100
Passband 300Hz to 3kHz
R
3
1MΩ
R
2
1MΩ
NOTE: (1) Electret microphone
powered by R
1
.
ADS7822
12-Bit A/D
1/2
OPA2347 1/2
OPA2347
OPA347, 2347, 4347 11
SBOS167D www.ti.com
OPA2347 WCSP PACKAGE
The OPA2347YED and OPA2347YZDR are die-level pack-
ages using bump-on-pad technology. The OPA2347YED de-
vice has tin-lead balls; the OPA2347YZDR has lead-free
balls. Unlike devices that are in plastic packages, these
devices have no molding compound, lead frame, wire bonds,
or leads. Using standard surface-mount assembly procedures,
the WCSP can be mounted to a printed circuit board without
additional under fill. Figures 10 and 11 detail pinout and
package marking.
FIGURE 10. Pin Description.
FIGURE 11. Top View Package Marking.
1
2
3
4
1
8
7
6
5
V+
Out B
–In B
+In B
Out A
–In A
+In A
V–
OPA2347
(bump side down)
Not to Scale
WCSP-8
(top view)
TEST CONDITION ACCEPT CRITERIA (ACTUAL) SAMPLE SIZE
Temperature Cycle –40°C to 125°C, 1 Cycle/hr, 15 Minute Ramp(1)
10 Minute Dwell 500 (1600) Cycles, R < 1.2X from R036
Drop 50cm 10 (129) Drops, R < 1.2X from R08
Key Push 100 Cycles/min, 5K (6.23K) Cycles, R < 1.2X from R08
1300 µε, Displacement = 2.7mm Max
3 Point Bend Strain Rate 5 mm/min, 85 mm Span R < 1.2X from R08
NOTE: (1) Per IPC9701.
TABLE I. Reliability Test Results.
1
OPA2347YED
Top View
YMDCCS
(bump side down)
Actual Size: Package Marking Code:
YMD = year/month/day
CC = indicates OPA2347YED
A9 = indicates OPA2347YZD
S = for engineering purposes only
Exact Size:
1.008mm x 2.100mm
PHOTOSENSITIVITY
Although the OPA2347YED/YZD package has a protective
backside coating that reduces the amount of light exposure
on the die, unless fully shielded, ambient light will still reach
the active region of the device. Input bias current for the
OPA2347YED/YZD package is specified in the absence of
light. Depending on the amount of light exposure in a given
application, an increase in bias current, and possible in-
creases in offset voltage should be expected. In circuit board
tests under ambient light conditions, a typical increase in bias
current reached 100pA. Flourescent lighting may introduce
noise or hum due to their time varying light output. Best
practice should include end-product packaging that provides
shielding from possible light souces during operation.
RELIABILITY TESTING
To ensure reliability, the OPA2347YED and OPA2347YZDR
devices have been verified to successfully pass a series of
reliability stress tests. A summary of JEDEC standard reli-
ability tests is shown in Table I.
OPA347, 2347, 4347
12 SBOS167D
www.ti.com
SOLDER PAD SOLDER MASK COPPER
DEFINITION COPPER PAD OPENING THICKNESS STENCIL OPENING STENCIL THICKNESS
Non-Solder Mask 275µm 375µm 1 oz max 275µm X 275µm, sq 125µm Thick
Defined (NSMD) (+0.0, –25µm) (+0.0, –25µm)
NOTES: (1) Circuit traces from NSMD-defined PWB lands should be less tham 100µm (preferrably = 75µm) wide in the exposed area inside the solder mask
opening. Wider trace widths will reduce device stand off and impact reliability. (2) Recommended solder paste is type 3 or type 4. (3) Best reliability results are
achieved when the PWB laminate glass transistion temperature is above the operating range of the intended application. (4) For PWB using an Ni/Au surface
finish, the gold thickness should be less than 0.5um to avoid solder embrittlement and a reduction in thermal fatigue performance. (5) Solder mask thickness
should be less than 20um on top of the copper circuit pattern. (6) Best solder stencil performance will be achieved using laser-cut stencils with electro polishing.
Use of chemically etched stencils results in inferior solder paste volume control. (7) Trace routing away from the WLCSP device should be balanced in X and
Y directions to avoid unintentional component movement due to solder wetting forces.
TABLE II. Recommended Land Pattern.
FIGURE 12. Recommended Land Area.
LAND PATTERNS AND ASSEMBLY
The recommended land pattern for the OPA2347YED pack-
age is detailed in Figure 12 with specifications listed in Table
II. The maximum amount of force during assembly should be
limited to 30 grams of force per bump.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Apr-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA2347EA/250 ACTIVE SOT-23 DCN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA2347EA/250G4 ACTIVE SOT-23 DCN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA2347EA/3K ACTIVE SOT-23 DCN 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA2347EA/3KG4 ACTIVE SOT-23 DCN 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA2347UA ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2347UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2347UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2347UA/2K5Q1 OBSOLETE SOIC D 8 TBD Call TI Call TI
OPA2347UAG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2347YEDR OBSOLETE DSBGA YED 8 TBD Call TI Call TI
OPA2347YEDT OBSOLETE DSBGA YED 8 TBD Call TI Call TI
OPA2347YZDR ACTIVE DSBGA YZD 8 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
OPA2347YZDT ACTIVE DSBGA YZD 8 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
OPA347NA/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA347NA/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA347NA/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA347NA/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA347PA ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 2-Apr-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA347PAG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
OPA347SA/250 ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA347SA/250G4 ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA347SA/3K ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA347SA/3KG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA347UA ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA347UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA347UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA347UAG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4347EA/250 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4347EA/250G4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4347EA/2K5 ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4347EA/2K5G4 ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4347UA ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4347UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4347UA/2K5G4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4347UAG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 2-Apr-2012
Addendum-Page 3
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA2347EA/250 SOT-23 DCN 8 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA2347EA/3K SOT-23 DCN 8 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA2347UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA347SA/250 SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
OPA347SA/3K SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
OPA347UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA4347EA/250 TSSOP PW 14 250 180.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
OPA4347EA/2K5 TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
OPA4347UA/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2347EA/250 SOT-23 DCN 8 250 203.0 203.0 35.0
OPA2347EA/3K SOT-23 DCN 8 3000 203.0 203.0 35.0
OPA2347UA/2K5 SOIC D 8 2500 367.0 367.0 35.0
OPA347SA/250 SC70 DCK 5 250 203.0 203.0 35.0
OPA347SA/3K SC70 DCK 5 3000 203.0 203.0 35.0
OPA347UA/2K5 SOIC D 8 2500 367.0 367.0 35.0
OPA4347EA/250 TSSOP PW 14 250 210.0 185.0 35.0
OPA4347EA/2K5 TSSOP PW 14 2500 367.0 367.0 35.0
OPA4347UA/2K5 SOIC D 14 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
D: Max =
E: Max =
2.092 mm, Min =
0.999 mm, Min =
2.031 mm
0.938 mm
D: Max =
E: Max =
2.092 mm, Min =
0.999 mm, Min =
2.031 mm
0.938 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
