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Multilayer Chip Varistor
MCVZ0402 Green Material Series
Description:
Multilayer Chip Varistor is a family of Transient Voltage Surge Suppression products. Today,
electronic circuits are becoming smaller and more sensitive to external interference.
Multilayer Chip Varistor is designed to protect components from destruction of transients
and ESD(Electronic Static Discharge). The wide operating voltage and energy rage
make Multilayer Chip Varistor suitable for numerous applications on I/O protection , Vcc
protection , Keyboard protection , LCD protection , Sensor protection etc. The Chip Varistor
is manufactured by Multilayer fabrication technology providing excellent voltage clamping
ability and is supplied in lead less , surface mount form , compatible with modern reow and
wave soldering procedures.
Features:
Multilayer fabrication technology
-55°C to +125°C operating temperature Range
Operating voltage range Vm(dc) at 5.5V to 18V
Able to withstand ESD test of IEC-61000-4-2
Bi-directional clamping characteristic
Applications:
Protection of cellular phones, PDA, High Speed Data Line etc.
ESD Protection for components sensitive to IEC 61000-4-2, provides circuit board transient voltage protection for transistors.
Protection of Video & Audio Ports.
Part Number
Maximum Ratings Specications
Max.
Continuous
Working
Voltage
Max.
Non-Repetitive
Surge Current
(8/20μs)
Max.
Non- Repetitive
Surge Energy
(10/1000μs)
Max.
Claiming
Voltage at
Specied
Current
(8/20μs)
Nominal
Voltage
At 1mA (DC)
Current
Typical
Capacitance
@1KHz
VM(DC) VM(AC) ITM WTM Vc VN(DC)
Min.
VN(DC)
Max. C
(V) (V) (A) (J) (V) (V) (V) (pF)
MCVZ0402M050AGT 5.5 420 0.05 20 at 1A 8.0 11.0 295
MCVZ0402M090AGT 9620 0.05 23 at 1A 10.2 13.8 190
MCVZ0402M110AGT 11 820 0.05 25 at 1A 12.75 17.25 160
MCVZ0402M140AGT 14 11 20 0.05 30 at 1A 15.3 20.7 135
MCVZ0402M180AGT 18 14 20 0.05 40 at 1A 21.6 26.4 93
Device Rating And Specications:
The capacitance value and energy only for reference. It is not formal specication.
Standard Testing Condition
Unless otherwise specied
Temperature : +15°C to 35°C
Humidity : 25%RH to 85%RH
Atmospheric pressure : 86kPa to 106kPa
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Multilayer Chip Varistor
MCVZ0402 Green Material Series
Specications:
Dimensions:
Electrical Reliability
Mechanical Reliability
Test Item Test condition / Test method Specication
High temperature storage +125±3°C for 1,000 hours
Measurement to be made after keeping at room temp. for 24 ±2hr ΔV at 1mA < 10%
Low temperature storage -40±3°C for 1,000 hours
Measurement to be made after keeping at room temp. for 24 ±2hr ΔV at 1mA < 10%
Humidity storage 40±2°C , 90 to 95%RH for 500 hours
Measurement to be made after keeping at room temp. for 24 ±2hr ΔV at 1mA < 10%
Temperature cycles
Times : 5 cycles
Step Temp.(°C) Time(min.)
1 -55±3 30±3
2 Room temp. 2~3
3 +125 ±3°C 30±2
4 Room temp. 2~3
Measurement to be made after keeping at room temp. for 24 ±2hr
ΔV at 1mA < 10%
Test Item Test condition / Test method Specication
Solderability
Solder temp. : 230±5°C
Immersion time : 2±0.5 sec
Immersion and emersion rates : 25mm/s
Min 90% electrode
shall be covered with
solder.
Resistance to Soldering
Heat
Pre-heating : 120°C to 150°C, 60sec
Solder temp. : 260 ±5°C
Immersion time : 10 ±1sec
Measurement to be made after keeping at room temp. for 24 ±2h
ΔV at 1mA < 10%
Disappearance of
electrode due to
immersion into solder
shall not exceed 25%
of edges of each
electrode.
Symbol MCVZ0402 Series
L 1 ±0.1mm
W 0.5 ± 0.1mm
T 0.6mm (max.)
Ts 0.25 ±0.15mm
Terminal electrode : Ni / Sn electrode
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Page <3> V1.015/10/14
Multilayer Chip Varistor
MCVZ0402 Green Material Series
Test Item Test condition / Test method Specication
Adhesive Strength of
Termination
Solder chip on PCB and applied
0805/1206 Series: 10N(1Kgf) for 10 sec
0402/0603 Series: 5N(0.5Kgf) for 10 sec
No visible damage
Vibration
Solder chip on PCB.
Frequency : 10Hz ~ 55Hz ~ 10 Hz (1min)
Oscillation amplitude : 1.5mm
Times : 2hrs in each of three perpendicular direction
No visible damage
Bending Test
The middle part of substrate shall be pressurized by means of the
pressurizing rod at a rate of 1mm per second until the deection
becomes 1mm and then the pressure shall be maintained for 5 sec.
No visible damage
ΔV at 1mA < 10%
Soldering Condition:
Typical examples of soldering processes that provide reliable joints without any damage are given in gure below:
Infrared soldering prole
Mechanical Reliability
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Page <4> V1.015/10/14
Multilayer Chip Varistor
MCVZ0402 Green Material Series
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
Packaging:
Paper Tape specications and Packaging quantity
Series A B E F ØD
MCVZ0402 Series 1.12 ±0.03 0.62 ±0.03 1.75 ±0.05 3.5 ±0.05 1.55 ±0.05
Series P0 P1 T W Quantity/Reel
MCVZ0402 Series 4 ±0.1 2 ±0.1 0.6 ±0.03 8 ±0.2 10Kpcs
Tape Material : Paper tape Dimensions : Millimetres
Reel Dimensions:
Index A B C
Dimension (mm) 178 60 13.5