935054410112 - NXP SEMICONDUCTORS

DATA SH EET

Product specification

Supersedes data of August 1991 July 1994

INTEGRATED CIRCUITS

TDA7052A/AT

1 W BTL mono audio amplifier with

DC volume control

July 1994 2

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

FEATURES

•DC volume control

•Few external components

•Mute mode

•Thermal protectio n

•Short-circuit proof

•No switch-on and off clicks

•Good overall stab ility

•Low power cons umption

•Low HF radiation

•ESD protected on all pins

GENERAL DESCRIPTION

The TDA7052A/AT are mono BTL output amplifiers w i th

DC volume control. They are designed for use in TV and

monitors, but also suitable for battery-fed portable

recorders and radios.

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is

activated when the differ ence in current be tween the

output terminal of ea ch amplifier exceed s 100 mA (ty pical

300 mA). This level of 100 mA allows for headphone

applications (single-ended).

QUICK REFERENCE DATA

ORDERING INFORMATION

Notes

1. SOT97-1.

2. SOT96-1.

SYMBOL PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT

VPpositive supply voltage range 4.5 −18 V

POoutput power

TDA7052A RL = 8 Ω; VP = 6 V 1.0 1.1 −W

TDA7052AT RL = 16 Ω; VP = 6 V 0.5 0.55 −W

Gvmaximum total voltage gain 34.5 35.5 36.5 dB

φgain control range 75 80 −dB

IPtotal quiescent current VP = 6 V; RL = ∞−712mA

THD total harmonic distortion

TDA7052A PO = 0.5 W −0.3 1 %

TDA7052AT PO = 0.25 W −0.3 1 %

EXTENDED TYPE

NUMBER PACKAGE

PINS PIN POSITION MATERIAL CODE

TDA7052A 8 DIL plastic SOT97(1)

TDA7052AT 8 mini-pack plastic SOT96A(2)

July 1994 3

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

handbook, full pagewidth

positive input

6MCD385 - 1

TDA7052A

TDA7052AT

I + i

8I – i

TEMPERATURE

PROTECTION

signal

ground

DC volume

control

n.c.

positive output

negative output

power

ground

Vref STABILIZER

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

VP1 positive supply voltage

IN+ 2 positive input

GND1 3 signal ground

VC 4 DC volume control

OUT+ 5 po sitive output

GND2 6 po wer ground

n.c 7 not connected

OUT−8 negative output

handbook, halfpage 1

MCD384

VPOUT –

GND2

OUT +

GND1

IN +

n.c.

TDA7052A

TDA7052AT

Fig.2 Pin configuration.

July 1994 4

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

FUNCTIONAL DESCRIPTION

The TDA7052A/AT are mono BTL output amplifiers with

DC volume control, design ed for us e in TV and monitors

but also suitable for b attery fed portable re corders and

radios.

In conventional DC volume circuits the control or input

stage is AC coupled to the output stage via external

capacitors to keep the offset voltage low.

In the TDA7052A/AT the DC volume control stage is

integrated into the inp ut stage so that no coupling

capacitors are requ ired and yet a low offset voltage is

maintained. At the same time the minimum supply remains

low.

The BTL principle offer s the follo wing advantages:

•Lower peak value of the supply current

•The frequency of the ripple on the supply voltage is twice

the signal frequency.

Thus a reduced power supply with smaller capacitors can

be used which results in cost savings.

For portable applications there is a trend to decrease the

supply voltage, resulting in a reduction of output power at

conventional output stages. Using the BTL princip le

increases the output power.

The maximum gain of the amplifier is fixed at 35.5 dB. The

DC volume control stage has a logarithmic con trol

characteristic.

The total gain can be controlled from 35.5 dB to −44 dB. If

the DC volume control voltage is below 0.3 V, the device

switches to the mute mode.

The amplifier is short-circuit proof to ground, VP and

across the load. Also a thermal protection circuit is

implemented. If the crystal temper ature rises above

+150 °C the gain will be reduced, so the output power is

reduced.

Special attention is given to switch on and off clicks, low

HF radiation and a good overall stability.

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage range −18 V

IORM repetitive peak output current −1.25 A

IOSM non-repetitiv e peak output current −1.5 A

Ptot total power dissip ation Tamb ≤ 25%

TDA7052A −1.25 W

TDA7052AT −0.8 W

Tamb operating ambient temperature range −40 +85 °C

Tstg storage temperature range −55 +150 °C

Tvj virtual junction temperature −+150 °C

Tsc short-circuit time −1hr

V2input voltage pin 2 −8V

V4input voltage pin 4 −8V

July 1994 5

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

THERMAL RESIST ANCE

Notes to the thermal re sistance

TDA7052A: VP = 6 V; RL = 8 Ω. The maximu m sine-wave dissipation is 0.9 W.

Therefore T amb(max) = 150 − 100 × 0.9 = 60 °C.

TDA7052AT: VP = 6 V; RL = 16 Ω. The maximum sine-wave dissipation is 0.46 W.

Therefore T amb(max) = 150 − 155 × 0.46 = 78 °C.

SYMBOL PARAMETER THERMAL RESISTANCE

Rth j-a from junction to ambient in free air

TDA7052A 100 K/W

TDA7052AT 155 K/W

July 1994 6

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

CHARACTERISTICS

VP = 6 V; Tamb = 25 °C; f = 1 kHz; TDA7052A: RL = 8 Ω; TDA7052AT: RL = 16 Ω; unless otherwise specified (see Fig.6).

Notes to the characteristics

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being

equal to the DC output offset voltage dividend by RL.

2. The noise output voltage (R MS value) at f = 500 kHz is measured with RS = 0 Ω an d bandwidth = 5 kHz.

3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value)

is applied to the positive su pply rail.

4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPpositive supply voltage rang e 4.5 −18 V

IPtotal quiescent current VP = 6 V; RL = ∞

note 1 −712mA

Maximum gain; V4 = 1.4 V

POoutput power THD = 10%

TDA7052A 1.0 1.1 −W

TDA7052AT 0.5 0.55 −W

THD total harmonic distortion

TDA7052A PO = 0.5 W −0.3 1 %

TDA7052AT PO = 0.25 W −0.3 1 %

Gvvoltage gain 34.5 35.5 36.5 dB

VIinput signal handling V4 = 0.8 V; THD < 1% 0.5 0.65 −V

Vno(rms) noise output voltage (RMS value) f = 500 kHz; note 2 −210 −μV

B bandwidth −1 dB −20 Hz to

300 kHz −

SVRR supply voltage ripple rejection note 3 38 46 −dB

|Voff|DC output offset voltage −0150mV

ZIinput impedanc e (p in 2) 15 20 25 kΩ

Minimum gain; V4 = 0.5 V

Gvvoltage gain −−44 −dB

Vno(rms) noise output voltage (RMS value) note 4 −20 30 μV

Mute position

VOoutput voltage in mute position V4 ≤ 0.3 V; VI = 600 mV −− 30 μV

DC volume control

φgain control range 75 80 −dB

I4control current V4 = 0.4 V 60 70 80 μA

July 1994 7

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

handbook, halfpage

MCD388

– 80

– 20

– 40

0 1.2 2.00.4 1.60.8 V (V)

gain

(dB)

– 60

Fig.3 Gain control as a functio n of DC volume control.

handbook, halfpage

1000

800

400

200

600

0 1.2 2.0

MCD389 - 1

0.4 1.60.8

V (V)

Vnoise

(μV)

Fig.4 Noise output voltage as a fu nction of DC

volume control.

handbook, halfpage

0 1.2 2.0

100

– 20

MCD390 - 1

– 60

– 100 0.4 1.60.8 V (V)

(μA)

Fig.5 Control current as a function of DC volume

control.

July 1994 8

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

APPLICATION INFORMATION

handbook, full pagewidth

positive

input

5 kΩ

0.47 μF

MCD386 - 1

100 nF 220 μF

2R = 8 Ω

TDA7052A

TDA7052AT

R = 16 Ω

V = 6 V

(1)

I + i

8I – i

Vref STABILIZER TEMPERATURE

PROTECTION

ground

(TDA7052A)

(TDA7052A/AT)

volume

control

n.c.

Fig.6 Test and application diagram.

This capacitor can be omitt ed if the 220 μF electrolytic capacitor is connect ed close to pin 1.

handbook, halfpage

MCD387

volume

control

1 MΩ1 μF

Fig.7 Application with potentiometer as volume

control; maximum gain = 30 dB.

July 1994 9

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

PACKAGE OUTLINES

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT97-1 99-12-27

03-02-13

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.1 0.3 0.32

0.31 0.39

0.33 0.0450.17 0.02 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

IP8: plastic dual in-line package; 8 leads (300 mil) SOT97

-1

July 1994 10

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

July 1994 11

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “IC Package Databook” (order cod e 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperatur e of the s old er is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic bod y mus t not ex ceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature with in the permissible limit.

REPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds . If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-s yringe dispensin g before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depend ing on heating

method. Typical reflow temperatures range from

215to250°C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating dura tio n: 45 minutes at

45 °C.

WAVE SOLDERING

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

techniqu e sh ould be used.

•The longitudinal ax is of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adh esive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temp erature is 260 °C, and

maximum duration of pack age immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 s econds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

REPAIRING SOLDERED JOINTS

Fix the component by first so ldering two diagonally-

opposite end leads. Use only a low voltage solder ing iron

(less than 24 V) applied to th e flat part of the lead. Con tact

time must be limit ed to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operatio n wi th in 2 to 5 seconds between

270 and 320 °C.

July 1994 12

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have ch anged since this docu ment was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective s pe cification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This document contains the pr oduct specification.

DISCLAIMERS

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliab le.

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or conseq uential

damages (including - without limitation - lost profits, lost

savings, busin es s interru ption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cu mulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconduct ors pr oduc ts are

not designed, au thorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reason ably be

expected to result in pe rs onal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductor s pr oducts in such equi pme nt or

application s and therefor e such inclusion and/or use is at

the customer’s own risk.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors pro du ct is su itable and fit for the

customer’s applications and products planned, as well as

for the planned a pplication and use of customer’s third

party customer(s). Customers should provide appropriate

design and opera t ing saf eg ua rd s to minimize the risks

associated with their applications and pr oducts.

NXP Semiconduc tors does n ot a ccept any liabil ity rela ted

to any default, damage, costs or problem which is based

on any weakne ss or default in t he customer’s applic ations

or products, or the application or use by customer’s third

party customer( s) . C us to m er is responsible for doin g all

necessary testing for the customer’s applications and

products using NXP Semiconductors products in order to

avoid a default of the applic ations and the products or of

the application or use by customer’s third p arty

customer(s). NXP does not accept any liability in this

respect.

July 1994 13

NXP Semiconductors Product specification

1 W BTL mono audio amplifier with DC

volume control TDA7052A/AT

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratin gs only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the qua l ity and

reliability of the device.

Terms and conditions of commercial sale ⎯ NXP

Semiconductors products are sold subje ct to the general

terms and conditio ns of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written ind i vidual agreement. In case an

individual agreeme nt is co nc luded only the terms and

conditions of the resp ective agreement shall apply. NXP

Semiconductors hereby expressly objects to apply ing the

customer’s general terms and conditions with regard to the

purchase of NXP Semicon ductors products by customer.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control ⎯ This document as well as the item(s)

described he re in may be subject to export control

regulations. Export might require a prior authorization from

national auth or itie s.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, an d as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor te sted in accordanc e with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive eq uip m en t or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such au t omo tive application s, use and

specifications, and (b) whenever customer uses the

product for automotive applications be yond NXP

Semiconductors’ specifications such use sha ll be solely at

customer’s own ris k, and (c) customer fully inde m nifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warranty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e- mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this documen t d oes not form par t o f an y q uotation or contra ct, is believed to be accur ate a nd re li a ble and may be chan ged

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other indus trial or intellectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the tech nical content, except for package outline

drawings which were updated to the latest version.

Printed in The Netherlands RM5/02/pp14 Date of release: July 1994