1 Ω Typical On Resistance, ±5 V, +12 V,
+5 V, and +3.3 V Dual SPDT Switches
ADG1636
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2009 Analog Devices, Inc. All rights reserved.
FEATURES
1 Ω typical on resistance
0.2 Ω on resistance flatness
±3.3 V to ±8 V dual supply operation
3.3 V to 16 V single supply operation
No VL supply required
3 V logic-compatible inputs
Rail-to-rail operation
Continuous current per channel
LFCSP package: 385 mA
TSSOP package: 238 mA
16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP
APPLICATIONS
Communication systems
Medical systems
Audio signal routing
Video signal routing
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Relay replacements
FUNCTIONAL BLOCK DIAGRAMS
07983-001
ADG1636
D1
D2
S2B
S2A
IN2
IN1
S1B
S1A
NOTES
1. SWITCHES SHOWN FOR A LOG I C 1 INPUT.
Figure 1. 16-Lead TSSOP
07983-002
ADG1636
IN1 IN2 EN
S1B
D1
S1A
S2B
LOGIC
D2
S2A
NOTES
1. SWI TCHES S HOWN FO R A 1 I NPU T LO GIC.
Figure 2. 16-Lead LFCSP
GENERAL DESCRIPTION
The ADG1636 is a monolithic CMOS device containing two
independently selectable single-pole/double-throw (SPDT)
switches. An EN input is used to enable or disable the device.
When disabled, all channels are switched off. Each switch
conducts equally well in both directions when on and has
an input signal range that extends to the supplies. In the off
condition, signal levels up to the supplies are blocked. Both
switches exhibit break-before-make switching action for use
in multiplexer applications.
The ultralow on resistance of these switches make them ideal
solutions for data acquisition and gain switching applications where
low on resistance and distortion is critical. The on resistance profile
is very flat over the full analog input range, ensuring excellent
linearity and low distortion when switching audio signals.
The CMOS construction ensures ultralow power dissipation,
making the parts ideally suited for portable and battery-
powered instruments.
PRODUCT HIGHLIGHTS
1. 1.6 Ω maximum on resistance over temperature.
2. Minimum distortion: THD + N = 0.007%.
3. 3 V logic-compatible digital inputs: VINH = 2.0 V, VINL = 0.8 V.
4. No VL logic power supply required.
5. Ultralow power dissipation: <16 nW.
6. 16-lead TSSOP and 16-lead 4 mm × 4 mm LFCSP.
ADG1636
Rev. A | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams ............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
±5 V Dual Supply ......................................................................... 3
12 V Single Supply ........................................................................ 4
5 V Single Supply .......................................................................... 5
3.3 V Single Supply ........................................................................6
Continuous Current per Channel, S or D ..................................7
Absolute Maximum Ratings ............................................................8
ESD Caution...................................................................................8
Pin Configurations and Function Descriptions ............................9
Typical Performance Characteristics ........................................... 10
Test Circuits ..................................................................................... 13
Terminology .................................................................................... 15
Outline Dimensions ....................................................................... 16
Ordering Guide .......................................................................... 16
REVISION HISTORY
9/09—Rev. 0 to Rev. A
Changes to Table 4 ............................................................................ 6
1/09—Revision 0: Initial Version
ADG1636
Rev. A | Page 3 of 16
SPECIFICATIONS
±5 V DUAL SUPPLY
VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
Parameter 25°C
−40°C to
+85°C
−40°C to
+125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VDD to VSS V
On Resistance (RON) 1 Ω typ VS = ±4.5 V, IS = −10 mA; see Figure 23
1.2 1.4 1.6 Ω max VDD = ±4.5 V, VSS = ±4.5 V
On Resistance Match Between Channels (∆RON) 0.04 Ω typ VS = ±4.5 V, IS = −10 mA
0.08 0.09 0.1 Ω max
On Resistance Flatness (RFLAT(ON)) 0.2 Ω typ VS = ±4.5 V, IS = −10 mA
0.25 0.29 0.34 Ω max
LEAKAGE CURRENTS VDD = +5.5 V, VSS = −5.5 V
Source Off Leakage, IS (Off) ±0.1 nA typ VS = ±4.5 V, VD = 4.5 V; see Figure 24
±0.25 ±1 ±4 nA max
Drain Off Leakage, ID (Off) ±0.1 nA typ VS = ±4.5V, VD = 4.5 V; see Figure 24
±0.25 ±2 ±10 nA max
Channel On Leakage, ID, IS (On) ±0.3 nA typ VS = VD = ±4.5 V; see Figure 25
±0.6 ±2 ±12 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.0 V min
Input Low Voltage, VINL 0.8 V max
Input Current, IINL or IINH 0.005 μA typ VIN = VGND or VDD
±0.1 μA max
Digital Input Capacitance, CIN 5 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION 130 ns typ RL = 300 Ω, CL = 35 pF
209 245 273 ns max VS = 2.5 V; see Figure 30
tON (EN) 119 ns typ RL = 300 Ω, CL = 35 pF
148 166 176 ns max VS = 2.5 V; see Figure 30
tOFF (EN) 182 ns typ RL = 300 Ω, CL = 35 pF
228 259 281 ns max VS = 2.5 V; see Figure 30
Break-Before-Make Time Delay, tD 30 ns typ RL = 300 Ω, CL = 35 pF
17 ns min VS1 = VS2 = 2.5 V; see Figure 31
Charge Injection 130 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 32
Off Isolation 70 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 26
Channel-to-Channel Crosstalk 90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28
Total Harmonic Distortion + Noise (THD + N) 0.007 % typ RL = 110 Ω, 5 V p-p, f = 20 Hz to 20 kHz;
see Figure 29
−3 dB Bandwidth 25 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 27
CS (Off) 68 pF typ VS = 0 V, f = 1 MHz
CD (Off) 127 pF typ VS = 0 V, f = 1 MHz
CD, CS (On) 220 pF typ VS = 0 V, f = 1 MHz
POWER REQUIREMENTS VDD = +5.5 V, VSS = −5.5 V
IDD 0.001 μA typ Digital inputs = 0 V or VDD
1.0 μA max
VDD/VSS ±3.3/±8 V min/max
1 Guaranteed by design, not subject to production test.
ADG1636
Rev. A | Page 4 of 16
12 V SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 2.
Parameter 25°C
−40°C to
+85°C
−40°C to
+125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V
On Resistance (RON) 0.95 Ω typ VS = 0 V to 10 V, IS = −10 mA; see Figure 23
1.1 1.25 1.45 Ω max VDD = 10.8 V, VSS = 0 V
On Resistance Match Between Channels (∆RON) 0.03 Ω typ VS = 10 V, IS = −10 mA
0.06 0.07 0.08 Ω max
On Resistance Flatness (RFLAT(ON)) 0.2 Ω typ VS = 0 V to 10 V, IS = −10 mA
0.23 0.27 0.32 Ω max
LEAKAGE CURRENTS VDD = 13.2 V, VSS = 0 V
Source Off Leakage, IS (Off) ±0.1 nA typ VS = 1 V/10 V, VS = 10 V/1 V; see Figure 24
±0.25 ±1 ±4 nA max
Drain Off Leakage, ID (Off) ±0.1 nA typ VS = 1 V/10 V, VS = 10 V/1 V; see Figure 24
±0.25 ±2 ±10 nA max
Channel On Leakage, ID, IS (On) ±0.3 nA typ VS = VD = 1 V or 10 V; see Figure 25
±0.6 ±2 ±12 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.0 V min
Input Low Voltage, VINL 0.8 V max
Input Current, IINL or IINH 0.001 μA typ VIN = VGND or VDD
±0.1 μA max
Digital Input Capacitance, CIN 5 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION 100 ns typ RL = 300 Ω, CL = 35 pF
153 183 206 ns max VS = 8 V; see Figure 30
tON (EN) 80 ns typ RL = 300 Ω, CL = 35 pF
95 103 110 ns max VS = 8 V; see Figure 30
tOFF (EN) 133 ns typ RL = 300 Ω, CL = 35 pF
161 187 210 ns max VS = 8 V; see Figure 30
Break-Before-Make Time Delay, tD 25 ns typ RL = 300 Ω, CL = 35 pF
17 ns min VS1 = VS2 = 8 V; see Figure 31
Charge Injection 150 pC typ VS = 6 V, RS = 0 Ω, CL = 1 nF; see Figure 32
Off Isolation 70 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 26
Channel-to-Channel Crosstalk 90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28
Total Harmonic Distortion + Noise (THD + N) 0.013 % typ RL = 110 Ω, 5 V p-p, f = 20 Hz to 20 kHz;
see Figure 29
−3 dB Bandwidth 27 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 27
CS (Off) 65 pF typ VS = 6 V, f = 1 MHz
CD (Off) 120 pF typ VS = 6 V, f = 1 MHz
CD, CS (On) 216 pF typ VS = 6 V, f = 1 MHz
POWER REQUIREMENTS VDD = 12 V
IDD 0.001 μA typ Digital inputs = 0 V or VDD
1 μA max
IDD 230 μA typ Digital inputs = 5 V
360 μA max
VDD 3.3/16 V min/max
1 Guaranteed by design, not subject to production test.
ADG1636
Rev. A | Page 5 of 16
5 V SINGLE SUPPLY
VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 3.
Parameter 25°C
−40°C to
+85°C
−40°C to
125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V
On Resistance (RON) 1.7 Ω typ VS = 0 V to 4.5 V, IS = −10 mA; see Figure 23
2.15 2.4 2.7 Ω max VDD = 4.5 V, VSS = 0 V
On Resistance Match Between Channels (∆RON) 0.05 Ω typ VS = 0 V to 4.5 V, IS = −10 mA
0.09 0.12 0.15 Ω max
On Resistance Flatness (RFLAT(ON)) 0.4 Ω typ VS = 0 V to 4.5 V, IS = −10 mA
0.53 0.55 0.6 Ω max
LEAKAGE CURRENTS VDD = 5.5 V, VSS = 0 V
Source Off Leakage, IS (Off) ±0.05 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 24
±0.25 ±1 ±4 nA max
Drain Off Leakage, ID (Off) ±0.05 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 24
±0.25 ±2 ±10 nA max
Channel On Leakage, ID, IS (On) ±0.1 nA typ VS = VD = 1 V or 4.5 V; see Figure 25
±0.6 ±2 ±12 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.0 V min
Input Low Voltage, VINL 0.8 V max
Input Current, IINL or IINH 0.001 μA typ VIN = VGND or VDD
±0.1 μA max
Digital Input Capacitance, CIN 5 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION 160 ns typ RL = 300 Ω, CL = 35 pF
271 319 355 ns max VS = 2.5 V; see Figure 30
tON (EN) 132 ns typ RL = 300 Ω, CL = 35 pF
172 185 201 ns max VS = 2.5 V; see Figure 30
tOFF (EN) 210 ns typ RL = 300 Ω, CL = 35 pF
268 313 345 ns max VS = 2.5 V; see Figure 30
Break-Before-Make Time Delay, tD 30 ns typ RL = 300 Ω, CL = 35 pF
17 ns min VS1 = VS2 = 2.5 V; see Figure 31
Charge Injection 70 pC typ VS = 2.5 V, RS = 0 Ω, CL = 1 nF; see Figure 32
Off Isolation 70 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;
see Figure 26
Channel-to-Channel Crosstalk 90 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;
see Figure 28
Total Harmonic Distortion + Noise (THD + N) 0.09 % typ RL = 110 Ω, f = 20 Hz to 20 kHz, VS = 3.5 V p-p;
see Figure 29
−3 dB Bandwidth 26 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 27
CS (Off) 76 pF typ VS = 2.5 V, f = 1 MHz
CD (Off) 145 pF typ VS = 2.5 V, f = 1 MHz
CD, CS (On) 237 pF typ VS = 2.5 V, f = 1 MHz
POWER REQUIREMENTS VDD = 5.5 V
IDD 0.001 μA typ Digital inputs = 0 V or VDD
1.0 1.0 μA max
VDD 3.3/16 V min/max
1 Guaranteed by design, not subject to production test.
ADG1636
Rev. A | Page 6 of 16
3.3 V SINGLE SUPPLY
VDD = 3.3 V, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 4.
Parameter 25°C
−40°C to
+85°C
−40°C to
+125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V
On Resistance (RON) 3.2 3.4 3.6 Ω typ VS = 0 V to VDD, IS = −10 mA; see Figure 23
V
DD = 3.3 V, VSS = 0 V
On Resistance Match Between Channels (∆RON) 0.06 0.07 0.08 Ω typ VS = 0 V to VDD, IS = −10 mA
On Resistance Flatness (RFLAT(ON)) 1.2 1.3 1.4 Ω typ VS = 0 V to VDD, IS = −10 mA
LEAKAGE CURRENTS VDD = 3.6 V, VSS = 0 V
Source Off Leakage, IS (Off) ±0.02 nA typ VS = 0.6 V/3 V, VD = 3 V/0.6 V; see Figure 24
±0.25 ±1 ±4 nA max
Drain Off Leakage, ID (Off) ±0.02 nA typ VS = 0.6 V/3 V, VD = 3 V/0.6 V; see Figure 24
±0.25 ±2 ±10 nA max
Channel On Leakage, ID, IS (On) ±0.05 nA typ VS = VD = 0.6 V or 3 V; see Figure 25
±0.6 ±2 ±12 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.0 V min
Input Low Voltage, VINL 0.8 V max
Input Current, IINL or IINH 0.001 μA typ VIN = VGND or VDD
±0.1 μA max
Digital Input Capacitance, CIN 5 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION 275 ns typ RL = 300 Ω, CL = 35 pF
449 506 550 ns max VS = 1.5 V; see Figure 30
tON (EN) 225 ns typ RL = 300 Ω, CL = 35 pF
306 327 338 ns max VS = 1.5 V; see Figure 30
tOFF (EN) 340 ns typ RL = 300 Ω, CL = 35 pF
454 512 553 ns max VS = 1.5 V; see Figure 30
Break-Before-Make Time Delay, tD 50 ns typ RL = 300 Ω, CL = 35 pF
28 ns min VS1 = VS2 = 1.5 V; see Figure 31
Charge Injection 50 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 32
Off Isolation 70 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz; see Figure 26
Channel-to-Channel Crosstalk 90 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;
see Figure 28
Total Harmonic Distortion + Noise (THD + N) 0.19 % typ RL = 33 Ω, f = 20 Hz to 20 kHz, VS = 2 V p-p;
see Figure 29
−3 dB Bandwidth 26 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 27
CS (Off) 80 pF typ VS = 1.5 V, f = 1 MHz
CD (Off) 153 pF typ VS = 1.5 V, f = 1 MHz
CD, CS (On) 243 pF typ VS = 1.5 V, f = 1 MHz
POWER REQUIREMENTS VDD = 3.6 V
IDD 0.001 μA typ Digital inputs = 0 V or VDD
1.0 1.0 μA max
VDD 3.3/16 V min/max
1 Guaranteed by design, not subject to production test.
ADG1636
Rev. A | Page 7 of 16
CONTINUOUS CURRENT PER CHANNEL, S OR D
Table 5.
Parameter 25°C 85°C 125°C Unit
CONTINUOUS CURRENT, S OR D
VDD = +5 V, VSS = −5 V
TSSOP (θJA = 150.4°C/W) 238 151 88 mA maximum
LFCSP (θJA = 48.7°C/W) 385 220 105 mA maximum
VDD = 12 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) 280 175 98 mA maximum
LFCSP (θJA = 48.7°C/W) 469 259 119 mA maximum
VDD = 5 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) 189 126 77 mA maximum
LFCSP (θJA = 48.7°C/W) 301 182 98 mA maximum
VDD = 3.3 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) 189 130 84 mA maximum
LFCSP (θJA = 48.7°C/W) 305 189 105 mA maximum
ADG1636
Rev. A | Page 8 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 6.
Parameter Rating
VDD to VSS 18 V
VDD to GND −0.3 V to +18 V
VSS to GND +0.3 V to −18 V
Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Digital Inputs1 GND − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D 850 mA (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current, S or D2 Data + 15%
Operating Temperature Range
Industrial (Y Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
16-Lead TSSOP, θJA Thermal
Impedance (2-Layer Board)
150.4°C/W
16-Lead LFCSP, θJA Thermal
Impedance (4-Layer Board)
48.7°C/W
Reflow Soldering Peak
Temperature, Pb free
260°C
ESD CAUTION
1 Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
2 See Table 5.
ADG1636
Rev. A | Page 9 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
NC = NO CONNECT
1
2
3
4
5
6
7
8
S1A
D1
S1B
NC
GND
V
SS
IN1
NC
16
15
14
13
12
11
10
9
NC
EN
V
DD
S2A
IN2
D2
S2B
NC
ADG1636
TOP VIEW
(Not to Scale)
0
7983-003
Figure 3. 16-Lead TSSOP Pin Configuration
07983-004
PIN 1
INDICATOR
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD TIED TO SUBSTRATE, V
SS
.
1D1
2S1B
3V
SS
4GND
11 V
DD
12 EN
10 S2B
9D2
5
NC
6
IN2
7
NC
8
S2A
15 IN1
16 S1
A
14 NC
13 NC
TOP VIEW
(Not to Scale)
ADG1636
Figure 4. 16-Lead LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
Mnemonic Description
TSSOP LFCSP
1 15 IN1 Logic Control Input.
2 16 S1A Source Terminal. This pin can be an input or output.
3 1 D1 Drain Terminal. This pin can be an input or output.
4 2 S1B Source Terminal. This pin can be an input or output.
5 3 VSS Most Negative Power Supply Potential.
6 4 GND Ground (0 V) Reference.
7, 8, 15, 16 5, 7, 13, 14 NC No Connection.
9 6 IN2 Logic Control Input.
10 8 S2A Source Terminal. This pin can be an input or output.
11 9 D2 Drain Terminal. This pin can be an input or output.
12 10 S2B Source Terminal. This pin can be an input or output.
13 11 VDD Most Positive Power Supply Potential.
14 12 EN
Active High Digital Input. When this pin is low, the device is disabled and all switches are
off. When this pin is high, the Ax logic inputs determine the on switches.
N/A 17 (EPAD) EP (EPAD) Exposed Pad. Tied to substrate, VSS.
Table 8. ADG1636 TSSOP Truth Table
EN INx SxA SxB
0 X Off Off
1 0 Off On
1 1 On Off
Table 9. ADG1636 LFCSP Truth Table
EN INx SxA SxB
0 X Off Off
1 0 Off On
1 1 On Off
ADG1636
Rev. A | Page 10 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
0.4
0.6
0.8
1.0
1.2
1.4
–8 –6 –4 –2 0 2 4 6 8
ON RESISTANCE ()
V
S
OR V
D
VOLTAGE (V)
T
A
= 25°C
V
DD
= +3.3V
V
SS
= –3.3V
V
DD
= +5V
V
SS
= –5V
V
DD
= +8V
V
SS
= –8V
07983-014
Figure 5. On Resistance as a Function of VD (VS) for Dual Supply
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 2 4 6 8 10 12 14 16
ON RESISTANCE ()
VS OR VD VOLTAGE (V)
VDD = 3.3V
VSS = 0V
VDD = 12V
VSS = 0V
VDD = 5V
VSS = 0V
VDD = 16V
VSS = 0V
TA = 25°C
07983-015
Figure 6. On Resistance as a Function of VD (VS) for Single Supply
0.4
0.6
0.8
1.0
1.2
1.4
6420246
ON RESISTANCE ()
V
S
OR V
D
VOLTAGE (V)
T
A
= +125°C
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
T
A
= +125°C
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
V
DD
= +5V
V
SS
= –5V
07983-012
Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures,
±5 V Dual Supply
0.4
0.6
0.8
1.0
1.2
1.4
024681012
ON RESISTANCE ()
V
S
OR V
D
VOLTAGE (V)
V
DD
= 12V
V
SS
= 0V
07983-011
T
A
= +125°C
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
Figure 8. On Resistance as a Function of VD (VS) for Different Temperatures,
12 V Single Supply
1.0
1.5
2.0
2.5
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
ON RESISTANCE ()
V
S
OR V
D
VOLTAGE (V)
T
A
= +125°C
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
T
A
= +125°C
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
V
DD
= 5V
V
SS
= 0V
07983-013
Figure 9. On Resistance as a Function of VD (VS) for Different Temperatures,
5 V Single Supply
1.5
2.0
2.5
3.0
3.5
4.0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
ON RESISTANCE ()
V
S
OR V
D
VOLTAGE (V)
V
DD
= 3.3V
V
SS
= 0V
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
T
A
= +125°C
07983-007
Figure 10. On Resistance as a Function of VD (VS) for Different Temperatures,
3.3 V Single Supply
ADG1636
Rev. A | Page 11 of 16
TEMPERATURE (°C)
–15
–10
–5
0
5
10
15
LEAKAGE CURRENT (nA)
0 20406080100120
I
D
(OFF) +, –
I
D
, I
S
(ON) +, +
I
D
(OFF) –, +
I
S
(OFF) +, –
I
S
(OFF) –, +
I
D
, I
S
(ON) –, –
07983-033
Figure 11. Leakage Currents as a Function of Temperature, ±5 V Dual Supply
07983-032
TEMPERATURE (°C)
LEAKAGE CURRENT (nA)
0 20406080100120
I
D
(OFF) +, –
I
D
, I
S
(ON) +, +
I
D
(OFF) –, +
I
S
(OFF) +, –
I
S
(OFF) –, +
I
D
, I
S
(ON) –, –
–15
–10
–5
0
5
10
15
20
Figure 12. Leakage Currents as a Function of Temperature,
12 V Single Supply
–5
0
5
10
15
20
0 20406080100120
LEAKAGE CURRENT (nA)
TEMPERATURE (°C)
I
D
, I
S
(OFF) +, +
I
D
, I
S
(OFF) –, –
I
D
(OFF) –, +
I
S
(OFF) +, –
I
D
(OFF) +, –
I
S
(OFF) –, +
07983-030
Figure 13. Leakage Currents as a Function of Temperature,
5 V Single Supply
0 20 40 60 80 100 120
TEMPERATURE (°C)
I
D
, I
S
(OFF) +, +
I
D
, I
S
(OFF) –, –
I
D
(OFF) –, +
I
S
(OFF) +, –
I
D
(OFF) +, –
I
S
(OFF) –, +
–4
–2
0
2
4
6
8
10
12
14
16
18
LEAKAGE CURRENT (nA)
07983-031
Figure 14. Leakage Currents as a Function of Temperature,
3.3 V Single Supply
–100
0
100
200
300
400
500
600
IDD
(
µA)
02468101214
LOGIC (V)
IDD PER CHANNEL
TA = 25°C
IDD = +12V
ISS = 0V
IDD = +5V
ISS = –5V
IDD = +5V
ISS = 0V
IDD = +3.3V
ISS = 0V
07983-006
Figure 15. IDD vs. Logic Level
0
50
100
150
200
250
300
–6 –4 –2 0 2 4 6 8 10 12 14
CHARGE INJECTION (pC)
V
S
(V)
V
DD
= +12V
V
SS
= 0V
V
DD
= +5V
V
SS
= 0V
V
DD
= +3.3V
V
SS
= 0V
V
DD
= +5V
V
SS
= –5V
07983-010
Figure 16. Charge Injection vs. Source Voltage
ADG1636
Rev. A | Page 12 of 16
50
100
150
200
250
300
350
400
450
–40 –20 0 20 40 60 80 100 120
TIME (ns)
TEMPERATURE (°C)
0
7983-019
V
DD
= +3.3V, V
SS
= 0V
V
DD
= +5V, V
SS
= 0V
V
DD
= +5V, V
SS
= –5V
V
DD
= +12V, V
SS
= 0V
Figure 17. tON/tOFF Times vs. Temperature
07983-008
–110
–105
–100
–95
–90
–85
–80
–75
–70
–65
–60
–55
–50
–45
–40
–35
–30
–25
–20
–15
10
OFF ISOL
A
TION (dB)
FREQUENCY (Hz)
100k 1M 10M 100M 1G10k1k
TA = 25°C
VDD = +5V
VSS = –5V
Figure 18. Off Isolation vs. Frequency
–140
–120
–100
–80
–60
–40
–20
0
CROSSTALK (dB)
FREQUENCY (Hz)
100k 1M 10M 100M 1G10k1k
07983-018
TA = 25°C
VDD = +5V
VSS = –5V
ADJACENT
NON-ADJACENT
Figure 19. Crosstalk vs. Frequency
INSERTION LOSS (dB)
FREQUENCY (Hz)
100k 1M 10M 100M 1G10k1k
–15
–13
–11
–9
–7
–5
–3
–1 TA = 25°C
VDD = +5V
VSS = –5V
07983-005
Figure 20. On Response vs. Frequency
–120
–100
–80
–60
–40
–20
0
FREQUENCY (Hz)
100k 1M 10M10k1k
TA = 25°C
VDD = +5V
VSS = –5V
ACPSRR (dB)
07983-009
NO DECOUPLING
CAPACITORS
DECOUPLING
CAPACITORS
Figure 21. ACPSRR vs. Frequency
0
0
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
THD + N (%)
FREQUENCY (Hz)
15k 20k10k5k 25k
V
DD
= +3.3V
V
S
= 2V p-p
V
DD
= +5V
V
S
= 3.5V p-p
V
DD
= +5V
V
SS
= –5V
V
S
= 5V p-p
V
DD
= +12V
V
S
= 5V p-p
07983-017
R
L
= 110
T
A
= 25°C
Figure 22. THD + N vs. Frequency
ADG1636
Rev. A | Page 13 of 16
TEST CIRCUITS
I
DS
SxA/SxB Dx
V
S
V
07983-020
Figure 23. On Resistance
SxA/SxB Dx
V
S
A A
V
D
I
S
(OFF) I
D
(OFF)
07983-021
Figure 24. Off Leakage
SxA/SxB Dx A
VD
ID (ON)
NC
NC = NO CONNECT
07983-022
Figure 25. On Leakage
V
OUT
50
NETWORK
ANALYZER
R
L
50
INx
V
IN
SxA
Dx
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
50
NC
SxB
OFF ISOLATION = 20 log
V
OUT
V
S
07983-027
Figure 26. Off Isolation
V
OUT
50
NETWORK
ANALYZER
R
L
50
INx
IN
SxA
Dx
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
50
NC
SxB
INSERTION LOSS = 20 log
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
07983-028
Figure 27. Bandwidth
CHANNEL-TO-CHANNEL CROSSTALK = 20 log V
OUT
GND
SxA
Dx
SxB
V
OUT
NETWORK
ANALYZER
R
L
50
R
L
50
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
INx
0
7983-029
Figure 28. Channel-to-Channel Crosstalk
ADG1636
Rev. A | Page 14 of 16
VOUT
RS
AUDIO PRECISION
RL
110
INx
V
IN
SxA/SxB
Dx
VS
V p-p
VDD VSS
0.1µF
V
DD
0.1µF
V
SS
GND
0
7983-034
Figure 29. THD + Noise
INx
V
OUT
Dx
SxA
V
DD
V
SS
V
DD
V
SS
GND
C
L
35pF
SxB
V
IN
V
S
0.1µF0.1µF
R
L
300
50%
50%
90%
50%
50%
90%
t
ON
t
OFF
V
IN
V
OUT
V
IN
07983-023
Figure 30. Switching Times
INx
V
OUT
Dx
SxA
V
DD
V
SS
V
DD
V
SS
GND
C
L
35pF
SxB
V
IN
V
S
0.1µF0.1µF
R
L
300
80%
t
BBM
t
BBM
V
OUT
V
IN
07983-024
Figure 31. Break-Before-Make Time Delay
V
IN
(NORMALLY
CLOSED SWITCH)
V
OUT
V
IN
(NORMALLY
OPEN SWITCH)
OFF
ΔV
OUT
ON
Q
INJ
= C
L
× ΔV
OUT
INx
V
OUT
Dx
SxA
V
DD
V
SS
V
DD
V
SS
GND
C
L
1nF
NC
SxB
V
IN
V
S
0.1µF0.1µF
0
7983-026
Figure 32. Charge Injection
ADG1636
Rev. A | Page 15 of 16
TERMINOLOGY
IDD
The positive supply current.
ISS
The negative supply current.
VD (VS)
The analog voltage on Terminal D and Terminal S.
RON
The ohmic resistance between Terminal D and Terminal S.
RFLAT(ON)
Flatness that is defined as the difference between the maximum
and minimum value of on resistance measured over the specified
analog signal range.
IS (Off)
The source leakage current with the switch off.
ID (Off)
The drain leakage current with the switch off.
ID, IS (On)
The channel leakage current with the switch on.
VINL
The maximum input voltage for Logic 0.
VINH
The minimum input voltage for Logic 1.
IINL (IINH)
The input current of the digital input.
CS (Off)
The off switch source capacitance, which is measured with
reference to ground.
CD (Off)
The off switch drain capacitance, which is measured with
reference to ground.
CD, CS (On)
The on switch capacitance, which is measured with reference to
ground.
CIN
The digital input capacitance.
tTRANSITION
The delay time between the 50% and 90% points of the digital
input and switch on condition when switching from one address
state to another.
tON (EN)
The delay between applying the digital control input and the
output switching on. See Figure 30.
tOFF (EN)
The delay between applying the digital control input and the
output switching off. See Figure 30.
Charge Injection
A measure of the glitch impulse transferred from the digital input
to the analog output during switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch.
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental.
AC Power Supply Rejection Ratio (ACPSRR)
The ratio of the amplitude of signal on the output to the amplitude
of the modulation. This is a measure of the ability of the part to
avoid coupling noise and spurious signals that appear on the supply
voltage pin to the output of the switch. The dc voltage on the device
is modulated by a sine wave of 0.62 V p-p.
ADG1636
Rev. A | Page 16 of 16
OUTLINE DIMENSIONS
16 9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09 0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 33. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT
TO
JEDEC STANDARDS MO-220-VGGC.
1
0.65
BSC
0.60 MAX
PIN 1
INDICATOR
1.95 BCS
0.50
0.40
0.30
0.25 MIN
3.75
BSC SQ
TOP VIEW
12° MAX 0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDI
C
ATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.00
BSC SQ
2.65
2.50 SQ
2.35
16
5
13
8
9
12
4
EXPOSED
PAD
BOTTOM VIEW
031006-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-16-13)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG1636BRUZ1 −40°C to +125°C 16- Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1636BRUZ-REEL1 −40°C to +125°C 16- Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1636BRUZ-REEL71 −40°C to +125°C 16- Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1636BCPZ- REEL1 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1636BCPZ-REEL71 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
1 Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07983-0-9/09(A)