© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 1
One WORLD One Brand One Strategy One Focus One Team One KEMET
Benets
• -55°C to +200°C operating temperature range
• Pb-Free and RoHS compliant
• EIA 0603, 0805, 1206, 1210, 1812 & 2220 case sizes
• DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 200V
• Capacitance offerings ranging from 0.5pF up to 0.47μF
• Available capacitance tolerances of ±0.25pF, ±0.5pF, ±1%,
±2%, ±5%, ±10% or ±20%
• No piezoelectric noise
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• Preferred capacitance solution at line frequencies and into the
MHz range
• No capacitance change with respect to applied rated DC voltage
• Negligible capacitance change with respect to temperature from
-55°C to +200°C
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated end metallization allowing for
excellent solderability
Applications
Typical applications include critical timing, tuning, circuits requiring
low loss, circuits with pulse, high current, decoupling, bypass,
ltering, transient voltage suppression, blocking and energy
storage for use in extreme environments such as down-hole
exploration, aerospace engine compartments and geophysical
probes.
Overview
KEMET’s high temperature surface mount C0G Multilayer
Ceramic Capacitors (MLCCs) feature a robust, proprietary base
metal dielectric system that offers industry-leading performance
relative to capacitance and case size combined with capacitance
stability at extreme temperatures up to +200°C. This new platform
promotes downsizing opportunities of existing high temperature
C0G technology, and offers replacement opportunities of existing
X7R/BX/BR technologies.
KEMET’s high temperature C0G dielectric features a 200°C
maximum operating temperature and is considered “stable.” The
Electronics Components, Assemblies & Materials Association
(EIA) characterizes C0G dielectric as a Class I material.
Components of this classication are temperature compensating
and are suited for resonant circuit applications or those where
Q and stability of capacitance characteristics are required.
C0G exhibits no change in capacitance with respect to time
and voltage and boasts a negligible change in capacitance with
reference to ambient temperature. Capacitance change is limited
to ±30ppm/ºC from -55°C to +200°C.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 200°C, C0G Dielectric, 10VDC-200VDC
(Commercial Grade)
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 Additional termination options may be available. Contact KEMET for details.
3 Additional reeling or packaging options may be available. Contact KEMET for details.
Ordering Information
C 1210 H 124 J 5 G A C TU
Ceramic Case Size
(L" x W")
Specication/
Series
Capacitance
Code (pF)
Capacitance
Tolerance1Voltage Dielectric Failure Rate/
Design
End Metallization
(Plated)2
Packaging/Grade
(C-Spec)3
0603
0805
1206
1210
1812
2220
H= High Temp
(200°C)
2 Sig. Digits +
Number of Zeros
Use 9 for
1.0 - 9.9pF
Use 8 for
0.5 - .99pF
ex. 2.2pF = 229
ex. 0.5pF = 508
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10V
4 = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
G = C0G A = N/A C = 100% Matte Sn
L = SnPb (5% min)
Blank = Bulk
TU = 7" Reel
Unmarked
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 2
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
EIA Size
Code
Metric
Size Code L Length W Width B Bandwidth T Thickness Mounting
Technique
0603 1608 1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006)
See Table 2 for
Thickness
Solder Wave or
Solder Reow
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010) Solder Reow
Only
1812 4532 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014)
2220 5650 5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
Dimensions – Millimeters (Inches)
Qualication/Certication
Commercial grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
RoHS PRC ( Peoples Republic of China) compliant
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range: -55°C to +200°C
Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC): ±30PPM/ºC (up to 200ºC)
Aging Rate (Max % Cap Loss/Decade Hour): 0%
Dielectric Withstanding Voltage:
250% of rated voltage (5 ± 1 seconds and charge/discharge not exceeding
50mA)
Dissipation Factor (DF) Maximum Limits @ 25ºC: 0.1%
Insulation Resistance (IR) Limit @ 25°C: 1000 megohm microfarads or 100GΩ
Insulation Resistance (IR) Limit @ 200°C: 10 megohm microfarads or 1GΩ
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
Ceramic Surface Mount
WL
TB
S
100% Tin or SnPb Plate
Nickel Plate
Conductive Metalization
Electrodes
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 3
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Electrical Characteristics
Capacitance vs. Temperature with 25V DC Bias
(Rated Voltage)
BME vs. PME/IR vs. Temperature with 25V DC Bias
(Rated Voltage)IR vs. Temperature with 25V DC Bias (Rated Voltage)
DF vs. Temperature without DC Bias.
Delta Cap vs. Temperature (Typical) C1210H104J1GAC - Life Test IR Distribution (Lognormal)
0
50
100
150
200
-60
-40
-20
0
20
40
60
80
100
120
140
160
180
200
Capacitance (nF)
Temperature (°C)
200ºC C0G 100nF no DC
200ºC C0G 100nF 25V DC
-1.00
-0.50
0.00
0.50
1.00
-60
-40
-20
0
20
40
60
80
100
120
140
160
180
200
DF (%)
Temperature (°C)
200ºC C0G MLCC 100nF
-20
-15
-10
-5
0
5
10
15
20
-60
-40
-20
0
20
40
60
80
100
120
140
160
180
200
Delta Cap (%)
Temperature (ºC)
0 Vr
100% Vr
100.010.01.00.1
99
95
90
80
70
60
50
40
30
20
10
5
1
25°C IR (GOhms)
P e rc e n t
0 hrs
2000 hrs
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
1.E+08
-60
-40
-20
0
20
40
60
80
100
120
140
160
180
200
IR (MOhms)
Temperature (°C)
PME C0G MLCC 1206/10nF
BME C0G MLCC 1206/10nF
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
1.E+08
-60
-40
-20
0
20
40
60
80
100
120
140
160
180
200
IR (MOhms)
Temperature (°C)
200ºC C0G MLCC 100nF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 4
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Cap Cap
Code
Series C0603 C0805 C1206 C1210
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Voltage VDC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Cap Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
0.5-0.75 pF 508-759 C D CB CB CB CB CB CB DC DC DC DC DC DC
1.0-2.4 pF 109-249 C D CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
2.7-5.1 pF 279-519 C D K M CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
5.6-9.1 pF 569-919 C D J K M CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
10-13 pF 100-130 C D J K M CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
15-24 pF 150-240 C D G J K M CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
27-36 pF 270-360 D G J K M CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
39-51 pF 390-510 D F G J K M CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
56-91 pF 560-910 F G J K M CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
100-180 pF 101-181 F G J K M CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
200 pF 201 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
220 pF 221 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
240 pF 241 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
270 pF 271 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
300 pF 301 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
330 pF 331 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
360 pF 361 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
390 pF 391 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
430 pF 431 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
470 pF 471 F G J K M CB CB CB CB CB DC DC DC DC DC DD EB EB EB EB EB EB FB FB FB FB FB FB
510 pF 511 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
560 pF 561 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
620 pF 621 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EC FB FB FB FB FB FB
680 pF 681 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EC FB FB FB FB FB FB
750 pF 751 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EC FB FB FB FB FB FB
820 pF 821 F G J K M CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EC FB FB FB FB FB FB
910 pF 911 F G J K M CB CB CB CB CB DC DC DC DC DD DD EB EB EB EB EB ED FB FB FB FB FB FB
1,000 pF 102 F G J K M CB CB CB CB CB DC DC DC DC DD DD EB EB EB EB EB EE FB FB FB FB FB FB
1,100 pF 112 F G J K M CB CB CB CB CB DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
1,200 pF 122 F G J K M CB CB CB CB CB DC DC DC DC DC EB EB EB EB EB EB FB FB FB FB FB FB
1,300 pF 132 F G J K M CB CB CB CB CB DD DD DD DD DD EB EB EB EB EC EC FB FB FB FB FB FC
1,500 pF 152 F G J K M CB CB CB CB CB DD DD DD DD DD EB EB EB EB ED EC FB FB FB FB FB FE
1,600 pF 162 F G J K M CB CB CB CB CB DD DD DD DD DD EB EB EB EB ED ED FB FB FB FB FB FE
1,800 pF 182 F G J K M CB CB CB CB CB DD DD DD DD DD EB EB EB EB ED ED FB FB FB FB FB FE
2,000 pF 202 F G J K M CB CB CB CB CB DC DC DC DC DC EB EB EB EB ED ED FB FB FB FB FC FE
2,200 pF 222 F G J K M CB CB CB CB CB DC DC DC DC DC EB EB EB EB EE EE FB FB FB FB FC FG
2,400 pF 242 F G J K M CB CB CB CB CB DC DC DC DC DC EB EB EB EB EC EC FB FB FB FB FC FC
2,700 pF 272 F G J K M CB CB CB CB CB DC DC DC DC DC EB EB EB EB EC EC FB FB FB FB FC FC
3,000 pF 302 F G J K M CB CB CB CB CB DD DD DD DD DC EC EC EC EC EC FB FB FB FB FC FF
3,300 pF 332 F G J K M CB CB CB CB CB DD DD DD DD DC EC EC EC EC EE FB FB FB FB FF FF
3,600 pF 362 F G J K M CB CB CB CB CB DD DD DD DD DC EC EC EC EC EE FB FB FB FB FF FF
3,900 pF 392 F G J K M CB CB CB CB CB DE DE DE DE DC EC EC EC EC EF FB FB FB FB FF FF
4,300 pF 432 F G J K M CB CB CB CB CB DE DE DE DE DC EC EC EC EC EC FB FB FB FB FF FF
4,700 pF 472 F G J K M CB CB CB CB CB DE DE DE DE DC EC EC EC EC EC FF FF FF FF FG FG
5,100 pF 512 F G J K M CB CB CB CB DE DE DE DE DC ED ED ED ED ED FB FB FB FB FG FG
5,600 pF 562 F G J K M CB CB CB CB DC DC DC DC DC ED ED ED ED ED FB FB FB FB FG FG
6,200 pF 622 F G J K M CB CB CB CB DC DC DC DC DC EB EB EB EB EB FB FB FB FB FG
6,800 pF 682 F G J K M CB CB CB CB DC DC DC DC DC EB EB EB EB EB FB FB FB FB FG
7,500 pF 752 F G J K M CB CB CB DC DC DC DC DC EB EB EB EB EB FC FC FC FC FC
8,200 pF 822 F G J K M CB CB CB DC DC DC DC DC EC EC EC EC EB FC FC FC FC FC
9,100 pF 912 F G J K M CB CB CB DC DC DC DC DC EC EC EC EC EB FE FE FE FE FE
10,000 pF 103 F G J K M CB CB CB DC DC DC DC DD ED ED ED ED EB FF FF FF FF FF
12,000 pF 123 F G J K M DC DC DC DC DE EB EB EB EB EB FG FG FG FG FB
15,000 pF 153 F G J K M DC DC DC DD DG EB EB EB EB EB FG FG FG FG FB
18,000 pF 183 F G J K M DC DC DC DD EB EB EB EB EB FB FB FB FB FB
22,000 pF 223 F G J K M DD DD DD DF EB EB EB EB EC FB FB FB FB FB
27,000 pF 273 F G J K M DF DF DF EB EB EB EB EE FB FB FB FB FB
Cap Cap
Code
Voltage VDC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Series C0603 C0805 C1206 C1210
Table 1A – (0603 - 1210 Case Sizes)
UD = Under Developement
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 5
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 1A con't – (0603 - 1210 Case Sizes)
Table 1B – (1812 - 2220 Case Sizes)
Cap Cap
Code
Series C1812 C2220
Voltage Code
1
2
5
1
Voltage VDC
100
200
50
100
Cap Tolerance
See Table 2 for Chip Thickness Dimensions
15,000 pF 153 F G J K M GB GB
18,000 pF 183 F G J K M GB GB
22,000 pF 223 F G J K M GB GB
27,000 pF 273 F G J K M GB GB
33,000 pF 333 F G J K M GB GB
47,000 pF 473 F G J K M GB GB
56,000 pF 563 F G J K M GB GB
68,000 pF 683 F G J K M GB GB
82,000 pF 823 F G J K M GB GB
0.10 uF 104 F G J K M GB GD
0.12 uF 124 F G J K M GB GH
0.15 uF 154 F G J K M GD GN
0.18 uF 184 F G J K M GH
0.22 uF 224 F G J K M GK
0.27 uF 274 F G J K M
0.33 uF 334 F G J K M
0.47 uF 474 F G J K M JG
0.56 uF 564 F G J K M
0.68 uF 684 F G J K M
0.82 uF 824 F G J K M
Cap Cap
Code
Voltage VDC
100
200
50
100
Voltage Code
1
2
5
1
Series C1812 C2220
Cap Cap
Code
Series C0603 C0805 C1206 C1210
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Voltage VDC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Cap Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
33,000 pF 333 F G J K M DG DG DG EB EB EB EB EE FB FB FB FB FB
47,000 pF 473 F G J K M UD UD UD EC EC EC EE EH FB FB FB FB FE
56,000 pF 563 F G J K M ED ED ED EF FB FB FB FB FF
68,000 pF 683 F G J K M EF EF EF EH FB FB FB FC FG
82,000 pF 823 F G J K M EH EH EH EH FC FC FC FF FH
0.10 uF 104 F G J K M EH EH EH FE FE FE FG FM
0.12 uF 124 F G J K M FG FG FG FH
0.15 uF 154 F G J K M FH FH FH FM
0.18 uF 184 F G J K M UD UD UD
0.22 uF 224 F G J K M UD UD UD
Cap Cap
Code
Voltage VDC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Series C0603 C0805 C1206 C1210
UD = Under Developement
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 6
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 2 – Chip Thickness / Packaging Quantities
Thickness
Code
Chip
Size
Thickness ±
Range (mm)
Qty per Reel
7" Plastic
Qty per Reel
13" Plastic
Qty per Reel
7" Paper
Qty per Reel
13" Paper
Qty per Bulk
Cassette
AA 01005 0.20 ± 0.02 15000
AB 0201 0.30 ± 0.03 15000
BB 0402 0.50 ± 0.05 10000 50000 50000
CB 0603 0.80 ± 0.07 4000 10000 15000
CC 0603 0.80 ± 0.10 4000 10000
CD 0603 0.80 ± 0.15 4000 10000
DC 0805 0.78 ± 0.10 4000 10000
DD 0805 0.90 ± 0.10 4000 10000
DL 0805 0.95 ± 0.10 4000 10000
DE 0805 1.00 ± 0.10 2500 10000
DF 0805 1.10 ± 0.10 2500 10000
DG 0805 1.25 ± 0.15 2500 10000
DH 0805 1.25 ± 0.20 2500 10000
EB 1206 0.78 ± 0.10 4000 10000 4000 10000
EK 1206 0.80 ± 0.10 2000 8000
EC 1206 0.90 ± 0.10 4000 10000
EN 1206 0.95 ± 0.10 4000 10000
ED 1206 1.00 ± 0.10 2500 10000
EE 1206 1.10 ± 0.10 2500 10000
EF 1206 1.20 ± 0.15 2500 10000
EM 1206 1.25 ± 0.15 2500 10000
EG 1206 1.60 ± 0.15 2000 8000
EH 1206 1.60 ± 0.20 2000 8000
EJ 1206 1.70 ± 0.20 2000 8000
FB 1210 0.78 ± 0.10 4000 10000
FC 1210 0.90 ± 0.10 4000 10000
FD 1210 0.95 ± 0.10 4000 10000
FE 1210 1.00 ± 0.10 2500 10000
FF 1210 1.10 ± 0.10 2500 10000
FG 1210 1.25 ± 0.15 2500 10000
FL 1210 1.40 ± 0.15 2000 8000
FO 1210 1.50 ± 0.20 2000 8000
FH 1210 1.55 ± 0.15 2000 8000
FP 1210 1.60 ± 0.20 2000 8000
FM 1210 1.70 ± 0.20 2000 8000
FJ 1210 1.85 ± 0.20 2000 8000
FN 1210 1.85 ± 0.20 2000 8000
FT 1210 1.90 ± 0.20 1500 4000
FK 1210 2.10 ± 0.20 2000 8000
FR 1210 2.25 ± 0.20 2000 8000
FS 1210 2.50 ± 0.20 1000 4000
PA 1220 0.80 ± 0.10 4000 10000
MA 1632 0.80 ± 0.10 4000 10000
NA 1706 0.90 ± 0.10 4000 10000
NA 1706 0.90 ± 0.10 4000 10000
LD 1808 0.90 ± 0.10 2500 10000
LA 1808 1.40 ± 0.15 1000 4000
LB 1808 1.60 ± 0.15 1000 4000
LC 1808 2.00 ± 0.15 1000 4000
GB 1812 1.00 ± 0.10 1000 4000
GC 1812 1.10 ± 0.10 1000 4000
GD 1812 1.25 ± 0.15 1000 4000
GE 1812 1.30 ± 0.10 1000 4000
GH 1812 1.40 ± 0.15 1000 4000
GF 1812 1.50 ± 0.10 1000 4000
GG 1812 1.55 ± 0.10 1000 4000
GK 1812 1.60 ± 0.20 1000 4000
GJ 1812 1.70 ± 0.15 1000 4000
GN 1812 1.70 ± 0.20 1000 4000
GL 1812 1.90 ± 0.20 1000 4000
GM 1812 2.00 ± 0.20 1000 4000
GO 1812 2.50 ± 0.20 500 2000
HB 1825 1.10 ± 0.15 1000 4000
HC 1825 1.15 ± 0.15 1000 4000
HD 1825 1.30 ± 0.15 1000 4000
HE 1825 1.40 ± 0.15 1000 4000
HF 1825 1.50 ± 0.15 1000 4000
HG 1825 1.60 ± 0.20 1000 4000
JB 2220 1.00 ± 0.15 1000 4000
JC 2220 1.10 ± 0.15 1000 4000
JD 2220 1.30 ± 0.15 1000 4000
JE 2220 1.40 ± 0.15 1000 4000
JF 2220 1.50 ± 0.15 1000 4000
JP 2220 1.60 ± 0.20 1000 4000
JG 2220 1.70 ± 0.15 1000 4000
JH 2220 1.80 ± 0.15 1000 4000
JO 2220 2.40 ± 0.15 500 2000
KB 2225 1.00 ± 0.15 1000 4000
KC 2225 1.10 ± 0.15 1000 4000
KD 2225 1.30 ± 0.15 1000 4000
KE 2225 1.40 ± 0.15 1000 4000
KF 2225 1.60 ± 0.20 1000 4000
Package Quantity
Based on Finished Chip
Thickness Specications
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 7
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reow only
Recommended Soldering Prole
• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 8
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Product Qualication Test Plan
Reliability/Environmental Tests per MIL-STD-202//JESD22
High Temperature Life 200°C, Rated Voltage, 2000 Hours
Load Humidity 85°C /85%RH, Rated Voltage, 1000 Hours
Low Voltage Humidity 85°C /85%RH, 1.5V, 1000 Hours
Temperature Cycling -55°C to +200°C, 50 Cycles
Thermal Shock -55°C to +150°C, 20s transfer, 15 min dwell, 300 Cycles
Moisture Resistance Cycled Temp/RH. 0V, 10 cycles @ 24 Hours each
Physical, Mechanical & Process Tests per MIL-STD 202/JIS-C-6429
Resistance to Solvents Include Aqueous wash chemical - OKEM Clean or equivalent
Mechanical Shock and Vibration Method 213: Figure 1, Condition F Method 204: 5gs for 20min, 12 cycles
Resistance to Soldering Heat Condition B, no per-heat of samples, Single Wave Solder
Terminal Strength Force of 1.8 kg for 60 seconds
Board Flex 3mm minimum
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 9
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in
8mm, 12mm and 16mm tape on 7" and 13" reels in accordance
with EIA standard 481. This packaging system is compatible with
all tape fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Table 5 – Carrier Tape Conguration (mm)
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 6 for tolerance specications.
8mm, 12mm
or 16mm Carrier Tape
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
EIA Case Size Tape size (W)* Pitch (P1)*
01005 - 0402 8 2
0603 - 1210 8 4
1805 - 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 10
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity dened by A0, B0 and K0 shall surround the component with sufcient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).
(e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
Constant Dimensions — Millimeters (Inches)
Tape Size D0
1
E1P0 P2
R Ref.
Note 2
S
1
Min.
Note 3
T Max. T1 Max.
8mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
(0.039)
1.75 ± 0.10
(0.069 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12mm 1.5
(0.059)
30
(1.181)
16mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
1
E2 Min. F P1 T2 Max W Max A0,B0 & K0
8mm Single (4mm)
(0.171)
6.25
(0.246)
3.5 ± 0.05
(0.138 ± 0.002)
4.0 ± 0.10
(0.157 ± 0.004)
2.5
(0.098)
8.3
(0.327)
Note 512mm
Single (4mm) &
Double (8mm)
10.25
(0.404)
5.5 ± 0.05
(0.217 ± 0.002)
8.0 ± 0.10
(0.315 ± 0.004)
4.6
(0.181)
12.3
(0.484)
16mm Triple (12mm)
14.25
(0.561)
5.5 ± 0.05
(0.217 ± 0.002)
8.0 ± 0.10
(0.315 ± 0.004)
4.6
(0.181)
16.3
(0.642)
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 6
[10 pitches cumulative
tolerance on tape ±0.2 mm]
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 11
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
1. The cavity dened by A0, B0 and T shall surround the component with sufcient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 5).
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1Max G Min
R Ref.
Note 2
8mm 1.5 +0.10-0.0
(0.059 +0.004, -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(.004) Max.
0.75
(.030)
25
(.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Min F P1 T Max W Max A0 B0
8mm Half (2mm) 6.25
(0.246)
3.5 ± 0.05
(0.138 ± 0.002)
2.0 ± 0.05
(0.079 ± 0.002)
1.1
(0.098)
8.3
(0.327)
Note 5
8mm Single (4mm)
4.0 ± 0.10
(0.157 ± 0.004)
8.3
(0.327)
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ±0.2 mm]
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 12
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the
carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.
Figure 3 – Maximum Component Rotation
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
0.5 mm maximum
0.5 mm maximum
8mm & 12mm Tape
1.0 mm maximum
1.0 mm maximum
16mm Tape
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
Tape Width Peel Strength
8mm 0.1 Newton to 1.0 Newton (10g to 100g)
12mm & 16mm 0.1 Newton to 1.3 Newton (10g to 130g)
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation ( °
T)
8,12 20
16-200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16-56 10
72-200 5
Typical Pocket Centerline
Typical Component Centerline
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 13
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Figure 6 – Reel Dimensions
Table 8 – Reel Dimensions
Metric Dimensions Will Govern
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm min.)
If present,
tape slot in core
for tape start:
2.5 mm min. width x
10.0 mm min. depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Constant Dimensions — Millimeters (Inches)
Tape Size A B Min C D Min
8mm
178 ± 0.20
(7.008 ± 0.008)
or
330 ± 0.20
(13.000 ± 0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12mm
16mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Min W1 W2 Max W3
8mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12mm
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16mm
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 14
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Figure 8 – Maximum Camber
Trailer
160 mm minimum,
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm Min.
Leader
400 mm Minimum,
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 15
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC-286 and EIAJ 7201
Unit mm *Reference
Table 9 – Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters
Table 10 – Capacitor Marking
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to
identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any
Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)
Example shown is 1,000 pF capacitor
EIA Size
Code
Metric Size
Code
L Length W Width B Bandwidth
S Separation
minimum
T Thickness
Number of
Pcs/Cassette
0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.2 to 0.4 0.3 0.5 ± .05 50,000
0603 1608 1.6 ± 0.07 0.8 ± 0.07 0.2 to 0.5 0.7 0.8 ± .07 15,000
110 ± 0.7
31.5 ± 0
0.2
36 ± 0
0.2
19.0*
5 0*
10*
53 3*
6 8 ± 0.1
8 8 ± 0.1
12.0 ± 0.1
3.0 ± 0
0.2
2.0 ± 0.1
0
1.5 ± 0
0.1
Numeral
Alpha
Character
Capacitance (pF) For Various Numeral Identiers
9
0
1
2
3
4
5
6
7
A
0.1
1
10
100
1000
10000
100000
1000000
10000000
B
0.11
1.1
11
110
1100
11000
110000
1100000
11000000
C
0.12
1.2
12
120
1200
12000
120000
1200000
12000000
D
0.13
1.3
13
130
1300
13000
130000
1300000
13000000
E
0.15
1.5
15
150
1500
15000
150000
1500000
15000000
F
0.16
1.6
16
160
1600
16000
160000
1600000
16000000
G
0.18
1.8
18
180
1800
18000
180000
1800000
18000000
H
0.2
2
20
200
2000
20000
200000
2000000
20000000
J
0.22
2.2
22
220
2200
22000
220000
2200000
22000000
K
0.24
2.4
24
240
2400
24000
240000
2400000
24000000
L
0.27
2.7
27
270
2700
27000
270000
2700000
27000000
M
0.3
3
30
300
3000
30000
300000
3000000
30000000
N
0.33
3.3
33
330
3300
33000
330000
3300000
33000000
P
0.36
3.6
36
360
3600
36000
360000
3600000
36000000
Q
0.39
3.9
39
390
3900
39000
390000
3900000
39000000
R
0.43
4.3
43
430
4300
43000
430000
4300000
43000000
S
0.47
4.7
47
470
4700
47000
470000
4700000
47000000
T
0.51
5.1
51
510
5100
51000
510000
5100000
51000000
U
0.56
5.6
56
560
5600
56000
560000
5600000
56000000
V
0.62
6.2
62
620
6200
62000
620000
6200000
62000000
W
0.68
6.8
68
680
6800
68000
680000
6800000
68000000
X
0.75
7.5
75
750
7500
75000
750000
7500000
75000000
Y
0.82
8.2
82
820
8200
82000
820000
8200000
82000000
Z
0.91
9.1
91
910
9100
91000
910000
9100000
91000000
a
0.25
2.5
25
250
2500
25000
250000
2500000
25000000
b
0.35
3.5
35
350
3500
35000
350000
3500000
35000000
d
0.4
4
40
400
4000
40000
400000
4000000
40000000
e
0.45
4.5
45
450
4500
45000
450000
4500000
45000000
f
0.5
5
50
500
5000
50000
500000
5000000
50000000
m
0.6
6
60
600
6000
60000
600000
6000000
60000000
n
0.7
7
70
700
7000
70000
700000
7000000
70000000
t
0.8
8
80
800
8000
80000
800000
8000000
80000000
y
0.9
9
90
900
9000
90000
900000
9000000
90000000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 16
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Other KEMET Resources
Disclaimer
All product speci cations, statements, information and data (collectively, the “Information”) are subject to change without notice.
All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we
speci cally disclaim – any warranty concerning suitability for a speci c customer application or use. This Information is intended for use only by customers who have the requisite
experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the
use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.
Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or
redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not
be required.
Tools
Resource Location
Con gure A Part: CapEdge http://capacitoredge.kemet.com
SPICE & FIT Software http://www.kemet.com/spice
Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask
Product Information
Resource Location
Products http://www.kemet.com/products
Technical Resources (Including Soldering
Techniques) http://www.kemet.com/technicalpapers
RoHS Statement http://www.kemet.com/rohs
Quality Documents http://www.kemet.com/qualitydocuments
Product Request
Resource Location
Sample Request http://www.kemet.com/sample
Engineering Kit Request http://www.kemet.com/kits
Contact
Resource Location
Website www.kemet.com
Contact Us http://www.kemet.com/contact
Investor Relations http://www.kemet.com/ir
Call Us 1-877-MyKEMET
Twitter http://twitter.com/kemetcapacitors
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001-1 • 9/14/2010 17
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
KEMET Corporation
World Headquarters
P.O. Box 5928
Greenville, SC 29606
2835 KEMET Way
Simpsonville, SC 29681
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
North America
Corporate Of ces
101 NE Third Avenue
Tower 101, Suite 1700
Fort Lauderdale, FL 33301
Tel: 954-766-2800
Fax: 954-766-2805
Southeast
801 International Parkway, Suite 5070
Lake Mary, FL 32746
Tel: 407-855-8886
Northeast
340-X Fordham Road
Wilmington, MA 01887
Tel: 978-658-1663
Fax: 978-658-1790
Central
1900 North Roselle Road, Suite 405
Schaumburg, IL 60195
Tel: 847-882-3590
Fax: 847-882-3046
West
1551 McCarthy Boulevard, Suite 117
Milpitas, CA 95035
Tel: 408-433-9946
Fax: 408-433-9946
Mexico
Tezozomoc No. 47
Col. Ciudad del Sol
Zapopan, Jalisco C.P. 45050
Mexico
Tel: 52-33-3123-2141
Fax: 52-33-3123-2144
Europe
Southern Europe
15bis chemin des Mines, 4th  oor
1202 Geneva
Switzerland
Tel: 41-22-715-0100
Fax: 41-22-715-0170
Zac Paris Rive Gauche
118-122 avenue de France
75013 Paris
France
Tel: 33-1-4646-1009
Fax: 33-1-4646-1599
Via San Lorenzo 19
Sasso Marconi, BO
40037
Italy
Tel: 39-051-939111
Fax: 39-051-840684
Viale Milano ori 1
Palazzo E1
20090 Assago
Milano
Italy
Tel: 39-02-57518176
Fax: 39-02-57512093
Central Europe
Hermann-Koehl-Str. 2
Landsberg am Lech
86899 Germany
Tel: 49-8191-3350800
Fax: 49-8191-3350990
Ruhrallee 9
Dortmund
44139 Germany
Tel: 49-2307-3619672
Fax: 49-2307-961527
Northern Europe
Unit 1, Ducketts Wharf
South Street
Bishops Stortford
Hertfordshire CM23 3AL
United Kingdom
Tel: 44-1279-757201
Fax: 44-1279-465237
20-21 Cumberland Drive
Granby Industrial Estate
Weymouth, Dorset DT4 9TE
United Kingdom
Tel: 44-1305-830747
Fax: 44-1305-760670
Thörnblads Väg 6
Färjestaden 386 90
Sweden
Tel: 46-485-563934
Fax: 46-485-563938
Stella Business Park
Lars Sonckin kaari 16
Espoo 02600
Finland
Tel: 358-9-5406-5000
Fax: 358-9-5406-5010
Asia
Northeast Asia
30 Canton Road, Room 1512
Silvercord Tower II
Tsimshatshui, Kowloon
Hong Kong
Tel: 852-2305-1168
Fax: 852-2759-0345
Room 1411, 14/F New China
Insurance Edi ce
Mintian Road, CBD Futian District
Shenzhen 518001
China
Tel: 1-867-55-25181306
Fax: 1-867-55-25181307
Floor 17, Tower B, Ping An IFC
No.1-3 Xin Yuan South Road
Chao Yang District
Beijing 100027
China
Tel: 86-10-5829-1711
Fax: 86-10-5829-1963
Room 2602, Grand Gateway Tower 1
No.1 Hong Qiao Road
Shanghai 200030
China
Tel: 86-21-6447-0707
Fax: 86-21-6447-0070
Room 305, Floor 3, #142
Sec. 4, Chung Hsiao East Road
Taipei 106
Taiwan ROC
Tel: 886-2-27528585
Fax: 886-2-27213129
Southeast Asia
73 Bukit Timah Road
#05-01 Rex House
229832 Singapore
Tel: 65-6586-1900
Fax: 65-6586-1901
1-5-20 Krystal Point 2
Lebuh Bukit Kecil 6
11900 Bayan Baru
Penang
Malaysia
Tel: 6- 04-6430200
Fax: 6 -04-6444220
Of ce No. 605, 6th Floor
Barton Centre M.G. Road
Bangalore 560 001
India
Tel: 91-80-653-76817
Fax: 91-80-2532-0160
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.